Spec. No. : C315L3 Issued Date : 2008.03.14 Revised Date :2011.09.06 Page No. : 1/6 CYStech Electronics Corp. Low Vcesat PNP Epitaxial Planar Transistor BTA1664L3 Features • Low VCE(sat), VCE(sat)=-0.24V (typical), at IC / IB =- 500mA /- 20mA • Pb-free lead plating and halogen-free package Symbol Outline BTA1664L3 SOT-223 C E B：Base C：Collector E：Emitter C B Absolute Maximum Ratings (Ta=25°C) Parameter Symbol Collector-Base Voltage Collector-Emitter Voltage Emitter-Base Voltage Collector Current(DC) Peak Collector Current Peak Base Current Power Dissipation @TA=25℃ VCBO VCEO VEBO IC ICM IBM Pd Junction Temperature Storage Temperature Tj Tstg Limits Unit -40 -25 -5 -2 -4 -200 3 (Note) 150 -55~+150 V V V A A mA W °C °C Note : The power which can be dissipated assuming the device is mounted in a typical manner on a P.C.B. with copper equal to 4 square inch minimum. BTA1664L3 CYStek Product Specification CYStech Electronics Corp. Spec. No. : C315L3 Issued Date : 2008.03.14 Revised Date :2011.09.06 Page No. : 2/6 Characteristics (Ta=25°C) Symbol BVCBO BVCEO BVEBO ICBO IEBO *VCE(sat) *VBE(on) *hFE 1 *hFE 2 fT Cob Min. -40 -25 -5 -0.5 120 40 - Typ. -0.24 120 19 Max. -100 -100 -0.4 -0.8 390 - Unit V V V nA nA V V MHz pF Test Conditions IC=-50μA, IE=0 IC=-1mA, IB=0 IE=-50μA, IC=0 VCB=-40V, IE=0 VEB=-5V, IC=0 IC=-500mA, IB=-20mA VCE=-1V, IC=-10mA VCE=-1V, IC=-100mA VCE=-1V, IC=-700mA VCE=-5V, IC=-10mA, f=100MHz VCB=-10V, f=1MHz *Pulse Test : Pulse Width ≤300μs, Duty Cycle≤2% Classification of hFE 1 Rank Q R Range 120~270 180~390 Ordering Information Device BTA1664L3 Package SOT-223 (Pb-free lead plating and halogen-free package) Shipping Marking 2500 pcs / Tape & Reel A1664 Moisture Sensitivity Level : Conform to JEDEC Level 3 Recommended Storage Condition: Temperature : ≤ 30 °C Humidity : ≤ 60% RH BTA1664L3 CYStek Product Specification CYStech Electronics Corp. Spec. No. : C315L3 Issued Date : 2008.03.14 Revised Date :2011.09.06 Page No. : 3/6 Characteristic Curves Current Gain vs Collector Current Saturation Voltage vs Collector Current 1000 1000 VCE(SAT) VCE=3V Saturation Voltage---(mV) Current Gain---HFE HFE 100 VCE=1V 100 IC=25IB IC=10IB 10 10 1 10 100 Collector Current---IC(mA) 1 1000 Saturation Voltage vs Collector Current 100 1000 On Voltage vs Collector Current 10000 1000 On Voltage---(mV) Saturation Voltage---(mV) 10 Collector Current---IC(mA) 1000 VBESAT@IC=10IB VBEON@VCE=1V 100 100 1 10 100 1000 Collector Current---IC(mA) 1 10 100 1000 Collector Current---IC(mA) Power Derating Curve Power Dissipation---PD(W) 3.5 3 2.5 2 1.5 1 0.5 0 0 50 100 150 200 Ambient Temperature---TA(℃) BTA1664L3 CYStek Product Specification CYStech Electronics Corp. Spec. No. : C315L3 Issued Date : 2008.03.14 Revised Date :2011.09.06 Page No. : 4/6 Reel Dimension Carrier Tape Dimension BTA1664L3 CYStek Product Specification CYStech Electronics Corp. Spec. No. : C315L3 Issued Date : 2008.03.14 Revised Date :2011.09.06 Page No. : 5/6 Recommended wave soldering condition Product Pb-free devices Peak Temperature 260 +0/-5 °C Soldering Time 5 +1/-1 seconds Recommended temperature profile for IR reflow Profile feature Average ramp-up rate (Tsmax to Tp) Preheat −Temperature Min(TS min) −Temperature Max(TS max) −Time(ts min to ts max) Time maintained above: −Temperature (TL) − Time (tL) Peak Temperature(TP) Time within 5°C of actual peak temperature(tp) Ramp down rate Time 25 °C to peak temperature Sn-Pb eutectic Assembly Pb-free Assembly 3°C/second max. 3°C/second max. 100°C 150°C 60-120 seconds 150°C 200°C 60-180 seconds 183°C 60-150 seconds 240 +0/-5 °C 217°C 60-150 seconds 260 +0/-5 °C 10-30 seconds 20-40 seconds 6°C/second max. 6 minutes max. 6°C/second max. 8 minutes max. Note : All temperatures refer to topside of the package, measured on the package body surface. BTA1664L3 CYStek Product Specification Spec. No. : C315L3 Issued Date : 2008.03.14 Revised Date :2011.09.06 Page No. : 6/6 CYStech Electronics Corp. SOT-223 Dimension A Marking: Device Name B Date Code C 1 2 A1664 □□ 3 D E Style: Pin 1.Base 2.Collector 3.Emitter F H G a1 I a2 3-Lead SOT-223 Plastic Surface Mounted Package CYStek Package Code: L3 *: Typical Inches Min. Max. 0.1142 0.1220 0.2638 0.2874 0.1299 0.1457 0.0236 0.0315 *0.0906 0.2480 0.2638 DIM A B C D E F Millimeters Min. Max. 2.90 3.10 6.70 7.30 3.30 3.70 0.60 0.80 *2.30 6.30 6.70 DIM G H I a1 a2 Inches Min. Max. 0.0551 0.0709 0.0098 0.0138 0.0008 0.0039 *13o o 0 10 o Millimeters Min. Max. 1.40 1.80 0.25 0.35 0.02 0.10 *13o o 0 10 o Notes: 1.Controlling dimension: millimeters. 2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.If there is any question with packing specification or packing method, please contact your local CYStek sales office. Material: • Lead: Pure tin plated. • Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0. Important Notice: • All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek. • CYStek reserves the right to make changes to its products without notice. • CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. • CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. BTA1664L3 CYStek Product Specification