Diodes DMT10H010LCT 100v n-channel enhancement mode mosfet Datasheet

DMT10H010LCT
Green
100V N-CHANNEL ENHANCEMENT MODE MOSFET
Product Summary
Features
BVDSS
RDS(ON)
Package
100V
9.5mΩ @VGS = 10V
TO220AB
ID
TC = +25°C
98A
Description


Low Input Capacitance
High BVDSS Rating for Power Application




Low Input/Output Leakage
Lead-Free Finish; RoHS Compliant (Notes 1 & 2)
Halogen and Antimony Free. “Green” Device (Note 3)
Qualified to AEC-Q101 Standards for High Reliability
This new generation MOSFET features low on-resistance and fast
switching, making it ideal for high-efficiency power management
applications.
Applications
Mechanical Data






Motor Control
Backlighting
DC-DC Converters
Power Management Functions



Case: TO220AB
Case Material: Molded Plastic, “Green” Molding Compound. UL
Flammability Classification Rating 94V-0
Terminals: Matte Tin Finish Annealed over Copper Leadframe.
Solderable per MIL-STD-202, Method 208
Terminal Connections: See Diagram Below
Weight: TO220AB – 1.85 grams (Approximate)
TO220AB
Top View
Bottom View
Equivalent Circuit
Top View
Pin Out Configuration
Ordering Information (Note 4)
Part Number
DMT10H010LCT
Notes:
Case
TO220AB
Packaging
50 Pieces/Tube
1. EU Directive 2002/95/EC (RoHS), 2011/65/EU (RoHS 2) & 2015/863/EU (RoHS 3) compliant. All applicable RoHS exemptions applied.
2. See https://www.diodes.com/quality/lead-free/ for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green" and
Lead-free.
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and
<1000ppm antimony compounds.
4. For packaging details, go to our website at https://www.diodes.com/design/support/packaging/diodes-packaging/.
Marking Information
10H010L
= Manufacturer’s Marking
10H010L = Product Type Marking Code
YYWW = Date Code Marking
YY or YY = Last Two Digits of Year (ex: 18 = 2018)
WW or WW = Week Code (01 to 53)
YYWW
DMT10H010LCT
Document number: DS37976 Rev. 5 - 2
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February 2018
© Diodes Incorporated
DMT10H010LCT
Maximum Ratings (@TA = +25°C, unless otherwise specified.)
Characteristic
Symbol
VDSS
VGSS
Drain-Source Voltage
Gate-Source Voltage
TC = +25°C
TC = +100°C
TC = +25°C
Continuous Drain Current
Maximum Continuous Body Diode Forward Current
Pulsed Drain Current (10μs Pulse, Duty Cycle = 1%)
Avalanche Current, L = 0.3mH (Note 7)
Avalanche Energy, L = 0.3mH (Note 7)
Unit
V
V
IS
IDM
IAS
EAS
Value
100
±20
98
62
90
92
10
15
Symbol
PD
RθJA
PD
RθJC
TJ, TSTG
Value
2
61
139
0.9
-55 to +150
Unit
W
°C/W
W
°C/W
°C
ID
A
A
A
A
mJ
Thermal Characteristics
Characteristic
Total Power Dissipation (Note 5)
Thermal Resistance, Junction to Ambient (Note 5)
Total Power Dissipation
Thermal Resistance, Junction to Case
Operating and Storage Temperature Range
TA = +25°C
TC = +25°C
Electrical Characteristics (@TA = +25°C, unless otherwise specified.)
Characteristic
OFF CHARACTERISTICS (Note 6)
Drain-Source Breakdown Voltage
Zero Gate Voltage Drain Current
Gate-Source Leakage
ON CHARACTERISTICS (Note 6)
Gate Threshold Voltage
Symbol
Min
Typ
Max
Unit
BVDSS
IDSS
IGSS
100
—
—
—
—
—
—
1
±100
V
µA
nA
VGS = 0V, ID = 1mA
VDS = 80V, VGS = 0V
VGS = ±20V, VDS = 0V
VGS(TH)
RDS(ON)
VSD
1.9
6.9
8
10
0.8
3.0
9.5
12
20
1.3
V
Static Drain-Source On-Resistance
1.4
—
—
—
—
VDS = VGS, ID = 250µA
VGS = 10V, ID = 13A
VGS = 6V, ID = 13A
VGS = 4.5V, ID = 5A
VGS = 0V, IS = 13A
Ciss
Coss
Crss
RG
QG
QGS
QGD
tD(ON)
tR
tD(OFF)
tF
tRR
QRR
—
—
—
—
—
—
—
—
—
—
—
—
—
4166
764
44
2
58.4
11.4
14.2
11.6
14.1
42.9
22
49.8
85.1
—
—
—
—
—
—
—
—
—
—
—
—
—
Diode Forward Voltage
DYNAMIC CHARACTERISTICS (Note 7)
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Gate Resistance
Total Gate Charge
Gate-Source Charge
Gate-Drain Charge
Turn-On Delay Time
Turn-On Rise Time
Turn-Off Delay Time
Turn-Off Fall Time
Reverse Recovery Time
Reverse Recovery Charge
Notes:
mΩ
V
Test Condition
pF
VDS = 50V, VGS = 0V
f = 1MHz
Ω
VDS = 0V, VGS = 0V, f = 1MHz
nC
VDD = 50V, ID = 13A,
VGS = 10V
ns
VDD = 50V, VGS = 10V,
ID = 13A, RG = 6Ω
ns
nC
IF = 13A, di/dt = 100A/µs
5. Device mounted on FR-4 PC board, with minimum recommended pad layout, single sided.
6. Short duration pulse test used to minimize self-heating effect.
7. Guaranteed by design. Not subject to product testing.
DMT10H010LCT
Document number: DS37976 Rev. 5 - 2
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DMT10H010LCT
30
30
VGS = 10.0V
VDS=5V
VGS = 6.0V
25
25
VGS = 5.0V
ID, DRAIN CURRENT (A)
ID, DRAIN CURRENT (A)
VGS = 4.5V
VGS = 4.0V
20
VGS = 3.5V
15
10
5
20
15
10
150oC
5
VGS = 3.0V
25oC
125oC
0
0.5
1
1.5
2
2.5
V DS, DRAIN -SOURCE VOLTAGE (V)
Figure 1 Typical Output Characteristics
0.012
VGS = 10V
0.011
0.01
0.009
VGS = 6V
0.008
VGS = 4.5V
0.007
0.006
0.005
0.004
0
2
4
6
8 10 12 14 16 18
ID , DRAIN-SOURCE CURRENT (A)
Figure 3 Typical On-Resistance vs.
Drain Current and Gate Voltage
1
3
RD S(ON ), DRAIN-SOURCE ON-RESISTANCE ( )
RDS(ON), DRAIN-SOURCE ON-RESISTANCE ( )
-55oC
0
0
2
3
4
5
VGS, Gate-Source Voltage (V)
Figure 2. Typical Transfer Characteristic
6
0.05
I D = 13A
0.04
0.03
0.02
I D = 5A
0.01
0
0
20
2
4
6
8 10 12 14 16 18
VGS, GATE-SOURCE VOLTAGE (V)
Figure 4 Typical Drain-Source On-Resistance
vs. Gate-Source Voltage
20
2.5
0.02
VGS = 10V
0.018
VGS = 10V
0.016
125oC
150oC
0.014
RD S(ON ), DRAIN-SOURCE
ON-RESISTANCE (NO RMALIZED)
RDS(ON), DRAIN-SOURCE ON-RESISTANCE (Ω)
85oC
0.012
0.01
0.008
85oC
0.006
25oC
0.004
-55oC
0.002
0
0
5
10
15
20
25
30
1.5
VGS = 4.5V
VGS = 6V
1
Document number: DS37976 Rev. 5 - 2
I D = 5A
I D = 13A
0.5
0
-50
-25
0
25
50
75 100 125 150
TJ, JUNCTION TEMPERATURE ( C)
Figure 6 On-Resistance Variation with Temperature
ID, DRAIN CURRENT (A)
Figure 5. Typical On-Resistance vs. Drain Current
and Junction Temperature
DMT10H010LCT
ID = 13A
2
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0.02
4
VGS(TH), GATE THRESHOLD VOLTAGE (V)
RDS(ON), DRAI N-SOURCE O N-RESISTANCE ( )
DMT10H010LCT
0.018
VGS = 4.5V
0.016
ID = 5A
0.014
0.012
0.01
VGS = 10V
0.008
I D = 13A
0.006
VGS = 6V
0.004
I D = 13A
0.002
3.5
3
2.5
ID = 1mA
2
1.5
ID = 250µA
1
0.5
0
0
-50
-50
-25
0
25
50
75 100 125 150
TJ, JUNCTION TEMPERATURE (℃)
Figure 8. Gate Threshold Variation vs. Junction
Temperature
-25
0
25
50
75 100 125 150
TJ, JUNCTION TEMPERATURE (C)
Figure 7 On-Resistance Variation with Temperature
30
10000
f = 1MHz
VGS = 0V
CT, JUNCTION CAPACITANCE (pF)
IS, SOURCE CURRENT (A)
25
20
15
10
TJ = 150oC
5
125oC
TJ =
TJ = 85oC
TJ = 25oC
Ciss
1000
Coss
100
Crss
10
TJ = -55oC
1
0
0
0.3
0.6
0.9
1.2
0
1.5
20
40
60
80
VDS, DRAIN-SOURCE VOLTAGE (V)
Figure 10. Typical Junction Capacitance
VSD, SOURCE-DRAIN VOLTAGE (V)
Figure 9. Diode Forward Voltage vs. Current
100
1000
10
RDS(ON)
Limited
PW =100ms
PW =10ms
100
ID, DRAIN CURRENT (A)
8
VGS (V)
6
4
VDS = 50V, ID = 13A
PW =1ms
PW =100µs
10
1
PW =1s
TJ(Max) = 150℃
TC = 25℃
Single Pulse
DUT on Infinite
Heatsink
VGS = 10V
0.1
2
0.01
0
0
10
20
30
40
Qg (nC)
Figure 11. Gate Charge
DMT10H010LCT
Document number: DS37976 Rev. 5 - 2
50
60
0.1
1
PW =10s
DC
10
100
1000
VDS, DRAIN-SOURCE VOLTAGE (V)
Figure 12. SOA, Safe Operation Area
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DMT10H010LCT
r(t), TRANSIENT THERMAL RESISTANCE
1
D = 0.9
D = 0.7
D = 0.5
D = 0.3
0.1
D = 0.1
D = 0.05
D = 0.02
0.01
D = 0.01
D = 0.005
R (t)
r(t)* *R
RθJC
RθJC
= =r(t)
JC (t)
JC
RθJC
=
0.93°
C/W
R JC = 0.93°C/W
Duty
t1/t2
DutyCycle,
Cycle, D
D == t1/
t2
Single Pulse
0.001
0.000001
0.00001
0.0001
0.001
0.01
0.1
1
10
t1,PULSE
PULSEDURATION
DURATION TIMES
TIME (sec)
t1,
(sec)
Figure13
13 Transient
Transient Thermal
Thermal Resistance
Figure
Resistance
DMT10H010LCT
Document number: DS37976 Rev. 5 - 2
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DMT10H010LCT
Package Outline Dimensions
Please see http://www.diodes.com/package-outlines.html for the latest version.
TO220AB
E
A
E/2
A1
Ø P
Q
H1
H1
D2
D
E1
L2
D1
L1
A2
L
b2
b
c
e
TO220AB
Dim Min Max Typ
A 3.56 4.82
A1 0.51 1.39
A2 2.04 2.92
b 0.39 1.01 0.81
b2 1.15 1.77 1.24
c 0.356 0.61
D 14.22 16.51
D1 8.39 9.01
D2 11.45 12.87
e
2.54
e1
5.08
E 9.66 10.66
E1 6.86 8.89
H1 5.85 6.85
L 12.70 14.73
L1
4.42
L2 15.80 17.51 16.00
P 3.54 4.08
Q 2.54 3.42
All Dimensions in mm
e1
DMT10H010LCT
Document number: DS37976 Rev. 5 - 2
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DMT10H010LCT
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Copyright © 2018, Diodes Incorporated
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DMT10H010LCT
Document number: DS37976 Rev. 5 - 2
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