PHILIPS BTA2008W-600D 3q hi-com triac Datasheet

SO
T2
23
BTA2008W-600D
3Q Hi-Com Triac
14 August 2014
Product data sheet
1. General description
Planar passivated high commutation three quadrant triac in a SOT223 surface mountable
plastic package. This "series D" triac balances the requirements of commutation
performance and gate sensitivity and is intended for interfacing with low power drivers
and logic ICs including microcontrollers.
2. Features and benefits
•
•
•
•
•
•
•
•
3Q technology for improved noise immunity
Direct gate triggering from low power drivers and logic ICs
High commutation capability with sensive gate
High voltage capability
Planar passivated for voltage ruggedness and reliability
Surface mountable package
Triggering in three quadrants only
Very sensitive gate for easy logic level triggering
3. Applications
•
•
•
Low power motor controls
Small inductive loads e.g. solenoids, door locks, water valves
Small loads in large white goods
4. Quick reference data
Table 1.
Quick reference data
Symbol
Parameter
VDRM
Conditions
Min
Typ
Max
Unit
repetitive peak offstate voltage
-
-
600
V
ITSM
non-repetitive peak on- full sine wave; Tj(init) = 25 °C;
state current
tp = 20 ms; Fig. 4; Fig. 5
-
-
9
A
IT(RMS)
RMS on-state current
-
-
0.8
A
0.25
-
5
mA
full sine wave; Tsp ≤ 111 °C; Fig. 1;
Fig. 2; Fig. 3
Static characteristics
IGT
gate trigger current
VD = 12 V; IT = 0.1 A; T2+ G+;
Tj = 25 °C; Fig. 9
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3Q Hi-Com Triac
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
VD = 12 V; IT = 0.1 A; T2+ G-;
0.25
-
5
mA
0.25
-
5
mA
Tj = 25 °C; Fig. 9
VD = 12 V; IT = 0.1 A; T2- G-;
Tj = 25 °C; Fig. 9
5. Pinning information
Table 2.
Pinning information
Pin
Symbol Description
Simplified outline
1
T1
main terminal 1
2
T2
main terminal 2
3
G
gate
4
mb
mounting base; connected to
main terminal 2
Graphic symbol
4
T2
sym051
1
2
T1
G
3
SC-73 (SOT223)
6. Ordering information
Table 3.
Ordering information
Type number
BTA2008W-600D
BTA2008W-600D
Product data sheet
Package
Name
Description
Version
SC-73
plastic surface-mounted package with increased heatsink; 4
leads
SOT223
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7. Limiting values
Table 4.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
Conditions
VDRM
repetitive peak off-state voltage
IT(RMS)
RMS on-state current
full sine wave; Tsp ≤ 111 °C; Fig. 1;
Min
Max
Unit
-
600
V
-
0.8
A
-
9
A
-
9.9
A
Fig. 2; Fig. 3
ITSM
non-repetitive peak on-state
current
full sine wave; Tj(init) = 25 °C;
tp = 20 ms; Fig. 4; Fig. 5
full sine wave; Tj(init) = 25 °C;
tp = 16.7 ms
I t
I t for fusing
tp = 10 ms; SIN
-
0.41
A s
dIT/dt
rate of rise of on-state current
IT = 1.5 A; IG = 20 mA; dIG/dt = 0.2 A/µs
-
100
A/µs
IGM
peak gate current
-
2
A
PGM
peak gate power
-
5
W
PG(AV)
average gate power
-
0.1
W
Tstg
storage temperature
-40
150
°C
Tj
junction temperature
-
125
°C
2
2
over any 20ms period
003aag395
6
003aag396
1
IT(RMS)
(A)
0.8
IT(RMS)
(A)
2
111°C
4
0.6
0.4
2
0.2
0
10-2
10-1
0
-50
1
10
surge duration (s)
f = 50 Hz; Tsp = 111 °C
Fig. 1.
Fig. 2.
RMS on-state current as a function of surge
duration; maximum values
BTA2008W-600D
Product data sheet
50
100
Tsp (°C)
150
RMS on-state current as a function of lead
temperature; maximum values
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NXP Semiconductors
3Q Hi-Com Triac
003aac118
1.0
Ptot
(W)
0.8
0.6
conduction
angle
(degrees)
form
factor
a
30
60
90
120
180
4
2.8
2.2
1.9
1.57
α = 180°
120°
90°
α
60°
30°
0.4
0.2
0.0
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
IT(RMS) (A)
α = conduction angle
a = form factor = IT(RMS) / IT(AV)
Fig. 3.
Total power dissipation as a function of RMS on-state current; maximum values
003aag393
12
ITSM
(A)
8
ITSM
IT
4
t
1/f
0
Tj(init) = 25 °C max
1
102
10
number of cycles
103
f = 50 Hz
Fig. 4.
Non-repetitive peak on-state current as a function of the number of sinusoidal current cycles; maximum
values
BTA2008W-600D
Product data sheet
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3Q Hi-Com Triac
003aag394
103
ITSM
IT
ITSM
(A)
t
102
tp
Tj(init) = 25 °C max
(1)
10
1
10-5
10-4
10-3
10-2
tp (s)
10-1
tp ≤ 20 ms; (1) dIT/dt limit
Fig. 5.
Non-repetitive peak on-state current as a function of pulse duration; maximum values
BTA2008W-600D
Product data sheet
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8. Thermal characteristics
Table 5.
Thermal characteristics
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
Rth(j-sp)
thermal resistance
from junction to solder
point
full or half cycle; Fig. 6
-
-
15
K/W
Rth(j-a)
thermal resistance
from junction to
ambient
in free air; printed-circuit board
mounted: minimum footprint; Fig. 7
-
156
-
K/W
in free air; printed-circuit board
mounted: minimum pad area; Fig. 8
-
70
-
K/W
003aac210
102
Z th(j-sp)
(K/W)
10
1
P
10-1
10-2
10-5
Fig. 6.
tp
10-4
10-3
10-2
10-1
1
tp (s)
t
10
Transient thermal impedance from junction to solder point as a function of pulse width
BTA2008W-600D
Product data sheet
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3.8 min
36
1.5
min
18
6.3
1.5
min
(3×)
60
9
4.5
4.6
2.3
10
1.5
min
4.6
001aab508
Fig. 7.
7
All dimensions are in mm
15
Minimum footprint SOT223
50
001aab509
All dimensions are in mm
Printed circuit board:
FR4 epoxy glass (1.6 mm thick), copper laminate
(35 um thick)
Fig. 8.
BTA2008W-600D
Product data sheet
Printed circuit board pad area: SOT223
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9. Characteristics
Table 6.
Characteristics
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
VD = 12 V; IT = 0.1 A; T2+ G+;
0.25
-
5
mA
0.25
-
5
mA
0.25
-
5
mA
-
-
10
mA
-
-
20
mA
-
-
10
mA
Static characteristics
IGT
gate trigger current
Tj = 25 °C; Fig. 9
VD = 12 V; IT = 0.1 A; T2+ G-;
Tj = 25 °C; Fig. 9
VD = 12 V; IT = 0.1 A; T2- G-;
Tj = 25 °C; Fig. 9
IL
latching current
VD = 12 V; IG = 0.1 A; T2+ G+;
Tj = 25 °C; Fig. 10
VD = 12 V; IG = 0.1 A; T2+ G-;
Tj = 25 °C; Fig. 10
VD = 12 V; IG = 0.1 A; T2- G-;
Tj = 25 °C; Fig. 10
IH
holding current
VD = 12 V; Tj = 25 °C; Fig. 11
-
-
10
mA
VT
on-state voltage
IT = 0.85 A; Tj = 25 °C; Fig. 12
-
1.35
1.6
V
VGT
gate trigger voltage
VD = 12 V; IT = 0.1 A; Tj = 25 °C;
-
0.9
1.5
V
0.2
0.3
-
V
VD = 600 V; Tj = 125 °C
-
0.1
0.5
mA
VDM = 402 V; Tj = 125 °C; (VDM = 67%
200
-
-
V/µs
0.5
-
-
A/ms
Fig. 12
VD = 400 V; IT = 0.1 A; Tj = 125 °C;
Fig. 12
ID
off-state current
Dynamic characteristics
dVD/dt
rate of rise of off-state
voltage
of VDRM); exponential waveform; gate
open circuit
dIcom/dt
rate of change of
commutating current
VD = 400 V; Tj = 125 °C;
IT(RMS) = 0.8 A; dVcom/dt = 10 V/µs;
gate open circuit
BTA2008W-600D
Product data sheet
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003aaa959
3
003aak510
3
IGT
IL
IGT(25°C)
IL(25°C)
2
2
(1)
(2)
(3)
1
1
(3)
(2)
(1)
0
- 50
0
50
100
Tj (°C)
0
-50
150
(1) T2- G(2) T2+ G(3) T2+ G+
Fig. 9.
0
50
100
Tj (°C)
150
Fig. 10. Normalized latching current as a function of
junction temperature
Normalized gate trigger current as a function of
junction temperature
003aak511
3
003aac114
1
IT
(A)
IH
IH(25°C)
0.8
2
0.6
(2)
(1)
0.4
(3)
1
0.2
0
-50
0
50
100
Tj (°C)
0
150
0
0.5
1
1.5
VT (V)
2
Vo = 0.835 V; Rs = 0.50 Ω
Fig. 11. Normalized holding current as a function of
junction temperature
(1) Tj = 125 °C; typical values
(2) Tj = 125 °C; maximum values
(3) Tj = 25 °C; maximum values
Fig. 12. On-state current as a function of on-state
voltage
BTA2008W-600D
Product data sheet
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3Q Hi-Com Triac
10. Package outline
Plastic surface-mounted package with increased heatsink; 4 leads
D
SOT223
E
B
A
X
c
y
HE
v M A
b1
4
Q
A
A1
1
2
e1
3
Lp
bp
w M B
detail X
e
0
2
4 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
A1
bp
b1
c
D
E
e
e1
HE
Lp
Q
v
w
y
mm
1.8
1.5
0.10
0.01
0.80
0.60
3.1
2.9
0.32
0.22
6.7
6.3
3.7
3.3
4.6
2.3
7.3
6.7
1.1
0.7
0.95
0.85
0.2
0.1
0.1
OUTLINE
VERSION
REFERENCES
IEC
JEDEC
SOT223
JEITA
SC-73
EUROPEAN
PROJECTION
ISSUE DATE
04-11-10
06-03-16
Fig. 13. Package outline SC-73 (SOT223)
BTA2008W-600D
Product data sheet
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3Q Hi-Com Triac
11. Soldering
7
3.85
3.6
3.5
0.3
1.3 1.2
(4×) (4×)
solder lands
4
solder resist
3.9
6.1 7.65
solder paste
occupied area
1
2
3
Dimensions in mm
2.3
2.3
1.2
(3×)
1.3
(3×)
6.15
sot223_fr
Fig. 14. Reflow soldering footprint for SC-73 (SOT223)
8.9
6.7
1.9
solder lands
4
solder resist
6.2
1
2
8.7
Dimensions in mm
3
1.9
(3×)
2.7
occupied area
preferred transport
direction during soldering
2.7
1.1
1.9
(2×)
sot223_fw
Fig. 15. Wave soldering footprint for SC-73 (SOT223)
BTA2008W-600D
Product data sheet
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NXP Semiconductors
3Q Hi-Com Triac
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punitive, special or consequential damages (including - without limitation lost profits, lost savings, business interruption, costs related to the removal
or replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
12. Legal information
12.1 Data sheet status
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Document
status [1][2]
Product
status [3]
Objective
[short] data
sheet
Development This document contains data from
the objective specification for product
development.
Preliminary
[short] data
sheet
Qualification
This document contains data from the
preliminary specification.
Product
[short] data
sheet
Production
This document contains the product
specification.
[1]
[2]
[3]
Definition
Right to make changes — NXP Semiconductors reserves the right to
make changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Please consult the most recently issued document before initiating or
completing a design.
The term 'short data sheet' is explained in section "Definitions".
The product status of device(s) described in this document may have
changed since this document was published and may differ in case of
multiple devices. The latest product status information is available on
the Internet at URL http://www.nxp.com.
12.2 Definitions
Preview — The document is a preview version only. The document is still
subject to formal approval, which may result in modifications or additions.
NXP Semiconductors does not give any representations or warranties as to
the accuracy or completeness of information included herein and shall have
no liability for the consequences of use of such information.
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representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences
of use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is
intended for quick reference only and should not be relied upon to contain
detailed and full information. For detailed and full information see the
relevant full data sheet, which is available on request via the local NXP
Semiconductors sales office. In case of any inconsistency or conflict with the
short data sheet, the full data sheet shall prevail.
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data sheet shall define the specification of the product as agreed between
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customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product
is deemed to offer functions and qualities beyond those described in the
Product data sheet.
12.3 Disclaimers
Limited warranty and liability — Information in this document is believed
to be accurate and reliable. However, NXP Semiconductors does not give
any representations or warranties, expressed or implied, as to the accuracy
or completeness of such information and shall have no liability for the
consequences of use of such information. NXP Semiconductors takes no
responsibility for the content in this document if provided by an information
source outside of NXP Semiconductors.
BTA2008W-600D
Product data sheet
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors and its suppliers accept no liability for
inclusion and/or use of NXP Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at the customer’s own
risk.
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their
applications and products using NXP Semiconductors products, and NXP
Semiconductors accepts no liability for any assistance with applications or
customer product design. It is customer’s sole responsibility to determine
whether the NXP Semiconductors product is suitable and fit for the
customer’s applications and products planned, as well as for the planned
application and use of customer’s third party customer(s). Customers should
provide appropriate design and operating safeguards to minimize the risks
associated with their applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default
in the customer’s applications or products, or the application or use by
customer’s third party customer(s). Customer is responsible for doing all
necessary testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications
and the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those
given in the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
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grant, conveyance or implication of any license under any copyrights, patents
or other industrial or intellectual property rights.
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
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Non-automotive qualified products — Unless this data sheet expressly
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the product is not suitable for automotive use. It is neither qualified nor
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NXP Semiconductors accepts no liability for inclusion and/or use of nonautomotive qualified products in automotive equipment or applications.
In the event that customer uses the product for design-in and use in
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customer (a) shall use the product without NXP Semiconductors’ warranty
of the product for such automotive applications, use and specifications, and
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standard warranty and NXP Semiconductors’ product specifications.
Translations — A non-English (translated) version of a document is for
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between the translated and English versions.
12.4 Trademarks
Notice: All referenced brands, product names, service names and
trademarks are the property of their respective owners.
Adelante, Bitport, Bitsound, CoolFlux, CoReUse, DESFire, EZ-HV,
FabKey, GreenChip, HiPerSmart, HITAG, I²C-bus logo, ICODE, ICODE, ITEC, Labelution, MIFARE, MIFARE Plus, MIFARE Ultralight,
MoReUse, QLPAK, Silicon Tuner, SiliconMAX, SmartXA, STARplug,
TOPFET, TrenchMOS, TriMedia and UCODE — are trademarks of NXP
Semiconductors N.V.
HD Radio and HD Radio logo — are trademarks of iBiquity Digital
Corporation.
BTA2008W-600D
Product data sheet
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13. Contents
1
General description ............................................... 1
2
Features and benefits ............................................1
3
Applications ........................................................... 1
4
Quick reference data ............................................. 1
5
Pinning information ............................................... 2
6
Ordering information ............................................. 2
7
Limiting values .......................................................3
8
Thermal characteristics .........................................6
9
Characteristics ....................................................... 8
10
Package outline ................................................... 10
11
Soldering .............................................................. 11
12
12.1
12.2
12.3
12.4
Legal information .................................................12
Data sheet status ............................................... 12
Definitions ...........................................................12
Disclaimers .........................................................12
Trademarks ........................................................ 13
© NXP Semiconductors N.V. 2014. All rights reserved
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 14 August 2014
BTA2008W-600D
Product data sheet
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