5.0 mm x 7.0 mm Ceramic Package SMD Oscillator ISM81 Series Product Features: Wide Temperature Range (-55º to +125ºC) Frequency Stability option ±50 ppm over the full operating temperature range. Low Phase Noise RoHS Compliant Frequency 1.000 MHz to 125.000 MHz Output Level CMOS Logic ‘0’ = 10% of Vcc max Logic ‘1’ = 90% of Vcc min Duty Cycle Specify 50% ±10% or ±5% See Table in Part Number Guide Rise / Fall Time 5 nS Max. for 10% to 90% of waveform 7.00 IYWW FREQ 5.00 1.70 max 15 pF Output Load Frequency Stability See Frequency Stability Table (Includes room temperature tolerance and stability over operating temperature) 5.08 1 2 4 3 2.60 Aging (Initial First Year) ±3 ppm max Start-up Time 5 mS Max. Supply Voltage See Input Voltage Table, tolerance ±5 % Current 50 mA Max. 1.40 5.08 0.01 uF 1.50 Operating -55 C to +125 C Storage -55 C to +125 C Phase Jitter: (12kHz – 20MHz) 1 pS RMS max Tri-State (Pin 1) Function Enable / Disable Time Current, Standby Mode Standby 100 nS Max. N.C. or ≥ 70% Vcc = Enable. ≤ 30% Vcc = Disable 20 µA 3.70 2.40 Recommended Pad Layout Pin Connections PIN 1 PIN 2 PIN 3 PIN 4 Enable / Disable or NC Ground Output Vcc Dimension Units: mm Part Number Guide Input Package Voltage ISM81 1 = 1 .8 V 2 = 2.7 V 3 = 3.3 V 6 = 2.5 V 7 = 3.0 V Sample Part Number: Operating Temperature Symmetry (Duty Cycle) Output 7 = -55ºC to +125ºC 5 = 45 / 55 max 6 = 40 / 60 max 3 = 15pF 6 = 30pF * ISM81-3756BH-20.000 Stability (in Enable / Frequency ppm) Disable B = ±50 ppm C= ±100 ppm H = Enable O = N/C 20.000 *Oscillator may not meet 5% symmetry over temperature range with 30 pF load. NOTE: A 0.01 µF bypass capacitor is recommended between Vcc (pin 4) and GND (pin 2) to minimize power supply noise. ILSI America Phone: 775-851-8880 • Fax: 775-851-8882• e-mail: [email protected] • www.ilsiamerica.com 07/14/14_A2 Specifications subject to change without notice Page 1 5.0 mm x 7.0 mm Ceramic Package SMD Oscillator Pb Free Solder Reflow Profile: ISM81 Series Typical Application: *Units are backward compatible with 240º C reflow processes Package Information: MSL = N.A. (Package does not contain plastic; storage life is unlimited under normal room conditions.) Termination = e4 (Au over Ni over W base metallization). Tape and Reel Information: Quantity per Reel A B C D E F 1000 16 +/-.3 8 +/-.2 7.5 +/-.2 17.5 +/-1 50 / 60 / 80 180 / 250 Environmental Specifications: Thermal Shock Moisture Resistance Mechanical Shock Mechanical Vibration Resistance to Soldering Heat Hazardous Substance Solderability Terminal Strength Gross Leak Fine Leak Solvent Resistance MIL-STD-883, Method 1011, Condition A MIL-STD-883, Method 1004 MIL-STD-883, Method 2002, Condition B MIL-STD-883, Method 2007, Condition A J-STD-020C, Table 5-2 Pb-free devices (except 2 cycles max) Pb-Free / RoHS / Green Compliant JESD22-B102-D Method 2 (Preconditioning E) MIL-STD-883, Method 2004, Test Condition D MIL-STD-883, Method 1014, Condition C MIL-STD-883, Method 1014, Condition A2, R1=2x10-8 atm cc/s MIL-STD-202, Method 215 Marking: Line 1: ILSI and Date Code (YWW) Line 2: Frequency Proprietary and Confidential This document contains proprietary information, and such information may not be disclosed to others for any purpose nor used for manufacturing purpose without the written permission of ILSI America. ILSI America Phone: 775-851-8880 • Fax: 775-851-8882• e-mail: [email protected] • www.ilsiamerica.com 07/14/14_A2 Specifications subject to change without notice Page 2