TDK B57860S0853J000 Ntc thermistors for temperature measurement Datasheet

NTC thermistors for temperature measurement
NTC chip thermistors, bondable S860 series
Series/Type:
Ordering code:
S860
B57860S
Date:
January 2015
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Identification/Classification 1
Identification/Classification 2
(header 2 + bottom left header bar):
NTC thermistors for temperature measurement
NTC chip thermistors, bondable S860 series
Ordering code:
B57860S
Series/Type: (top right header bar)
S860
Department:
 EPCOS AG 2015. Reproduction, publication and dissemination of this publication, enclosures hereto and the information
contained therein without EPCOS' prior express consent is prohibited.
EPCOS AG is a TDK Group Company.
NTC thermistors for temperature measurement
NTC chip thermistors, bondable S860 series
B57860S
S860
Application
Temperature measurement
Features
- NTC chip with termination on top and bottom side (silver or gold metallization)
- Category temperature up to 150 °C
General technical data
Climatic category (IEC 60068-1)
Max. power (at 25 °C)
Rated temperature
Dissipation factor (in air)
Thermal cooling time constant (in air)
Heat capacity
B-value tolerance
P25
TR
δth
τC
Cth
∆B/B
: 40/150/21
[mW] : Depending on mounting situation
[°C] : 100
[mW/K] : Depending on mounting situation
[s] : Depending on mounting situation
[mJ/K] : Depending on mounting situation
[%] : ± 1
Delivery mode
On carrier tape (plastic foil) on 8-inch frame. For details see page 6.
January 2015
Please read Cautions and warnings and
Important notes at the end of this document.
Page 2 of 10
NTC thermistors for temperature measurement
NTC chip thermistors, bondable S860 series
B57860S
S860
Dimensional drawings
Ordering code
Chip size L [ mm ] Chip size W [ mm ] Chip size H [ mm ]
B57860S0502J000
1.50 … 1.70
1.50 … 1.70
0.35 … 0.55
B57860S0103J000
0.45 … 0.60
0.45 … 0.60
0.25 … 0.45
B57860S0223J000
1.25 … 1.40
1.25 … 1.40
0.55 … 0.75
Upon request
0.80 … 1.10
0.80 … 1.10
0.45 … 0.65
B57860S0853J000
0.45 … 0.65
0.45 … 0.65
0.25 … 0.40
Upon request
0.50 … 0.60
0.50 … 0.60
0.45 … 0.65
Electrical specification and ordering codes
Ordering code
RT curve
B25/100 [ K ]
R25 [ Ω ]
R125 [ Ω ]
∆T125 [ ± K ]
Metallization
B57860S0502J000
8016
3988
5000
170.9
2.2
Ag
B57860S0103J000
7003
3625
10000
464.3
2.4
Au
B57860S0223J000
8018
3964
21511
742.7
2.2
Ag
Upon request
8018
3964
30000
1036
2.2
Ag
B57860S0853J000
8304
4092
85000
2639
2.1
Au
Upon request
8018
3964
100000
3453
2.2
Au
*)
*)
*)
* Further resistance values and tighter tolerances upon request.
January 2015
Please read Cautions and warnings and
Important notes at the end of this document.
Page 3 of 10
NTC thermistors for temperature measurement
NTC chip thermistors, bondable S860 series
B57860S
S860
Reliability Data
Test
Standard
Test conditions
∆R25/R25
Remarks
(typical)
Storage in dry heat
IEC 60068-2-2
Storage at upper category
temperature
Temperature:
150 °C
Duration:
1000 h
< 3%
< 2%
No visible
damage
< 2%
No visible
damage
Storage in damp
heat, steady state
with test voltage
IEC 60068-2-78
Temperature of air:
85 °C
Relative humidity of air: 85%
Duration:
1000 h
Rapid change of
temperature
IEC 60068-2-14
Lower test temperature: -40 °C
Upper test temperature: 150 °C
Number of cycles:
100
No visible
damage
Storage of NTC in original packaging units.
Note: It is strongly recommended to mount the NTC thermistor elements within one week of opening
the package, depending on storage conditions.
January 2015
Please read Cautions and warnings and
Important notes at the end of this document.
Page 4 of 10
NTC thermistors for temperature measurement
NTC chip thermistors, bondable S860 series
B57860S
S860
RT characteristics
January 2015
Please read Cautions and warnings and
Important notes at the end of this document.
Page 5 of 10
NTC thermistors for temperature measurement
NTC chip thermistors, bondable S860 series
B57860S
S860
Frame for delivery: size 8-inch
Frame loaded with 1 to 9 substrates.
In case of less than 9 substrates the positions are filled beginning from position 1 continuously.
Each position can be empty because of removed parts for resistance or optical check.
January 2015
Please read Cautions and warnings and
Important notes at the end of this document.
Page 6 of 10
NTC thermistors for temperature measurement
NTC chip thermistors, bondable S860 series
B57860S
S860
Cautions and warnings
Storage
•
•
•
•
•
•
•
Store thermistors only in original packaging. Do not open the package prior to storage.
Storage conditions in original packaging: storage temperature −25 °C ... +45 °C, relative humidity
≤75% annual mean, <95% maximum 30 days per annum, dew precipitation is inadmissible.
Do not store thermistors where they are exposed to heat or direct sunlight. Otherwise, the packing
material may be deformed or components may stick together, causing problems during mounting.
Avoid contamination of thermistor surface during storage, handling and processing.
Avoid storage of thermistors in harmful environments like corrosive gases (SOx, Cl etc).
Use the components as soon as possible after opening the factory seals, i.e. the polyvinyl-sealed
packages.
Solder thermistors within the time specified after shipment from EPCOS.
For leadless components with Au metallization this is 12 months.
For leadless components with Ag metallization this is 6 months.
Handling
•
•
•
•
NTC thermistors must not be dropped. Chip-offs or any other damage must not be caused during
handling of NTCs.
Do not touch components with bare hands. Gloves are recommended.
Avoid contamination of thermistor surface during handling.
Washing processes may damage the product due to the possible static or cyclic mechanical loads
(e.g. ultrasonic cleaning). They may cause cracks to develop on the product and its parts, which
might lead to reduced reliability or lifetime.
Soldering
•
•
•
•
Use resin-type flux or non-activated flux.
Insufficient preheating may cause ceramic cracks.
Rapid cooling by dipping in solvent is not recommended.
Complete removal of flux is recommended.
January 2015
Please read Cautions and warnings and
Important notes at the end of this document.
Page 7 of 10
NTC thermistors for temperature measurement
NTC chip thermistors, bondable S860 series
B57860S
S860
Mounting
•
•
•
•
•
•
Ensure that no thermo-mechanical stress occurs due to production processes (curing or
overmolding processes) when thermistors are sealed, potted or overmolded or during their
subsequent operation. The maximum temperature of the thermistor must not be exceeded.
Ensure that the materials used (sealing/potting compound and plastic material) are chemically
neutral.
Electrodes/contacts must not be scratched or damaged before/during/after the mounting process.
Contacts and housing used for assembly with the thermistor must be clean before mounting.
Ensure that adjacent materials are designed for operation at temperatures comparable to the
surface temperature of the thermistor. Be sure that surrounding parts and materials can withstand
the temperature.
Avoid contamination of the thermistor surface during processing.
Avoid using chemical substances as mounting aids. It must be ensured that no water or other
liquids enter the NTC thermistors (e.g. through plug terminals). In particular, water based
substances (e.g. soap suds) must not be used as mounting aids for sensors.
Operation
•
•
•
•
•
•
Use thermistors only within the specified operating temperature range.
Use thermistors only within the specified power range.
Environmental conditions must not harm the thermistors. Only use the thermistors under normal
atmospheric conditions or within the specified conditions.
Contact of NTC thermistors with any liquids and solvents shall be prevented. It must be ensured
that no water enters the NTC thermistors (e.g. through plug terminals). For measurement
purposes (checking the specified resistance vs. temperature), the component must not be
immersed in water but in suitable liquids (e.g. Perfluorpolyether such as Galden).
Avoid dewing and condensation unless thermistor is specified for these conditions.
Be sure to provide an appropriate fail-safe function to prevent secondary product damage caused
by malfunction.
This listing does not claim to be complete, but merely reflects the experience of EPCOS AG.
Display of ordering codes for EPCOS products
The ordering code for one and the same EPCOS product can be represented differently in data
sheets, data books, other publications, on the EPCOS website, or in order-related documents such as
shipping notes, order confirmations and product labels. The varying representations of the
ordering codes are due to different processes employed and do not affect the specifications of
the respective products. Detailed information can be found on the Internet under
www.epcos.com/orderingcodes
January 2015
Please read Cautions and warnings and
Important notes at the end of this document.
Page 8 of 10
NTC thermistors for temperature measurement
NTC chip thermistors, bondable S860 series
B57860S
S860
January 2015
Please read Cautions and warnings and
Important notes at the end of this document.
Page 9 of 10
Important notes
The following applies to all products named in this publication:
1. Some parts of this publication contain statements about the suitability of our products for
certain areas of application. These statements are based on our knowledge of typical
requirements that are often placed on our products in the areas of application concerned. We
nevertheless expressly point out that such statements cannot be regarded as binding
statements about the suitability of our products for a particular customer application. As a
rule, EPCOS is either unfamiliar with individual customer applications or less familiar with them
than the customers themselves. For these reasons, it is always ultimately incumbent on the
customer to check and decide whether an EPCOS product with the properties described in the
product specification is suitable for use in a particular customer application.
2. We also point out that in individual cases, a malfunction of electronic components or failure
before the end of their usual service life cannot be completely ruled out in the current state
of the art, even if they are operated as specified. In customer applications requiring a very high
level of operational safety and especially in customer applications in which the malfunction or
failure of an electronic component could endanger human life or health (e.g. in accident
prevention or life-saving systems), it must therefore be ensured by means of suitable design of the
customer application or other action taken by the customer (e.g. installation of protective circuitry
or redundancy) that no injury or damage is sustained by third parties in the event of malfunction or
failure of an electronic component.
3. The warnings, cautions and product-specific notes must be observed.
4. In order to satisfy certain technical requirements, some of the products described in this
publication may contain substances subject to restrictions in certain jurisdictions (e.g.
because they are classed as hazardous). Useful information on this will be found in our Material
Data Sheets on the Internet (www.epcos.com/material). Should you have any more detailed
questions, please contact our sales offices.
5. We constantly strive to improve our products. Consequently, the products described in this
publication may change from time to time. The same is true of the corresponding product
specifications. Please check therefore to what extent product descriptions and specifications
contained in this publication are still applicable before or when you place an order.
We also reserve the right to discontinue production and delivery of products. Consequently,
we cannot guarantee that all products named in this publication will always be available.
The aforementioned does not apply in the case of individual agreements deviating from the
foregoing for customer-specific products.
6. Unless otherwise agreed in individual contracts, all orders are subject to the current version of
the “General Terms of Delivery for Products and Services in the Electrical Industry”
published by the German Electrical and Electronics Industry Association (ZVEI).
7. The trade names EPCOS, Alu-X, CeraDiode, CeraLink, CeraPad, CeraPlas, CSMP, CSSP,
CTVS, DeltaCap, DigiSiMic, DSSP, ExoCore, FilterCap, FormFit, LeaXield, MiniBlue, MiniCell,
MKD, MKK, MotorCap, PCC, PhaseCap, PhaseCube, PhaseMod, PhiCap, PQSine, SIFERRIT,
SIFI, SIKOREL, SilverCap, SIMDAD, SiMic, SIMID, SineFormer, SIOV, SIP5D, SIP5K, TFAP,
ThermoFuse, WindCap are trademarks registered or pending in Europe and in other countries.
Further information will be found on the Internet at www.epcos.com/trademarks.
Page 10 of 10
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