ACPL-K44T Automotive Wide Operating Temperature 1 MBd Digital Optocoupler in a Stretched 8-Pin Surface Mount Plastic Package Reliability Data Sheet Description Definition of Failure The reliability data shown includes Avago Technologies reliability test data from the reliability qualification done on this product family. All of these products use the similar IC, and the same packaging materials, processes, stress conditions and testing. The data in Table 1 and Table 2 reflect actual test data for devices on a per channel basis. Before stress, all devices are preconditioned at MSL 1 using a solder reflow process (260 °C peak temp) and 20 temperature cycles (-55 °C to +125 °C, 15 mins dwell, 1 min transfer). These data are taken from testing on Avago Technologies devices using internal Avago Technologies' process, material specifications, design standards, and statistical process controls. THEY ARE NOT TRANSFERABLE TO OTHER MANUFACTURERS’ SIMILAR PART TYPES. Inability to switch, that is, “functional failure”, is the definition of failure in this data sheet. Specifically, failure occurs when the device fails to switch ON with two times the minimum recommended drive current (but not exceeding the max rating) or fails to switch off when there is no input current. Failure Rate Projections The demonstrated point mean time to failure (MTTF) is measured at the absolute maximum stress condition. The failure rate projections in Table 2 uses the Arrhenius acceleration relationship, where a 0.43 eV activation energy is used as in the hybrid section of MIL-HDBK-217. Application Information Operating Life Test For valid system reliability calculations, you must adjust for the time when the system is not in operation. Note: if you are using MIL-HDBK-217 for predicting component reliability, the results may not be comparable to those given in Table 2 due to different conditions and factors that have been accounted for in MIL-HDBK-217. For example, it is unlikely that your application will exercise all available channels at full rated power with the IC always ON as Avago Technologies testing does. Therefore, carefully consider your application total power and duty cycle when you compare Table 2 to predictions using MILHDBK-217. The data of Table 1 and 2 were obtained on devices with high temperature operating life duration. An exponential (random) failure distribution is assumed, expressed in units of FIT (failures per billion device hours) are only defined in the random failure portion of the reliability curve. Table 1. Demonstrated Operating Life Test Performance Stress Test Condition Ta = 150 °C If = 20 mA Vcc = 30 V Iout = 10 mA Total Device Tested Total Device Hours Number of Failed Units Demonstrated MTTF (hr) @ Ta = +125 °C Demonstrated FITs @ Ta = +125 °C 462 346,500 0 > 689,863 < 1,450 Table 2. Reliability Projection for Device Listed in Title Ambient Temperature (°C) Junction Temperature (°C) Typical (60% Confidence) 90% Confidence MTTF (Hr/fail) FITs (Fail/109h) MTTF (Hr/fail) FITs (Fail/109h) 125 120 110 100 90 80 70 60 50 40 30 25 140 135 125 115 105 95 85 75 65 55 45 40 752,887 872,850 1,186,313 1,638,053 2,300,757 3,291,792 4,804,902 7,167,645 10,948,285 17,160,634 27,669,193 35,538,513 1,328 1,146 843 610 435 304 208 140 91 58 36 28 299,604 347,342 472,081 651,847 915,563 1,309,936 1,912,063 2,852,293 4,356,761 6,828,903 11,010,679 14,142,196 3,338 2,879 2,118 1,534 1,092 763 523 351 230 146 91 71 Table 3. Mechanical Tests (Testing done on a constructional basis) Test Name Reference Standard Test Conditions Units Tested Units Failed Temp Cycling JESD-A104 -65 to 150 °C Transfer = 1 min Dwell = 15 mins 500 cycles 507 0 Physical Dimensions JESD-B100 Conformance to datasheet package drawings 50 0 Solderability (RoHS condition) JESD-B102 8 hrs steam aging (93 °C), followed by solder dip (260 °C, 5 sec) 30 0 Preconditioning J-STD-020 JA113 As per reference standard (to conform to MSL 1) 1611 0 Table 4. Environmental Testing Test Name Reference Standard Test Conditions Units Tested Units Failed Highly Accelerated Stress Test (Biased) JESD-A110 Ta = 130 °C, RH=85% Vcc = 5.5 V Vin= 5 V Vout= 5.5V Time = 96 hours 552 0 High Temperature Bake JESD-A103 Ta = 150 °C Unbiased Time = 1000 hours 135 0 Unbiased HAST JESD-A118 Ta = 130 °C, RH = 85% Unbiased Time = 96 hours 231 0 For product information and a complete list of distributors, please go to our web site: www.avagotech.com Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries. Data subject to change. Copyright © 2005-2012 Avago Technologies. All rights reserved. AV02-3186EN - December 31, 2012