Vishay BU2510-E3 Thin single in-line package Datasheet

BU2506-E3, BU2508-E3, BU2510-E3
www.vishay.com
Vishay General Semiconductor
Enhanced isoCink+™ Bridge Rectifiers
FEATURES
• UL recognition file number E309391 (QQQX2)
UL 1557 (see *)
• Thin single in-line package
+
~
~
-
~
~
+
• Available for BU-5S lead forming option
(part number with “5S” suffix, e.g. BU25065S)
• Superior thermal conductivity
• Solder dip 275 °C max. 10 s, per JESD 22-B106
isoCink+™
• Material categorization: For definitions of compliance
please see www.vishay.com/doc?99912
Case Style BU
TYPICAL APPLICATIONS
+
~
~
General purpose use in AC/DC bridge full wave rectification
for switching power supply, home appliances and
white-goods applications.
-
* Tested to UL standard for safety electrically isolated
semiconductor devices. UL 1557 4th edition.
Dielectric tested to maximum case, storage and junction
temperature to 150 °C to withstand 1500 V.
Epoxy meets UL 94 V-0 flammability rating.
MECHANICAL DATA
Case: BU
Molding compound meets UL 94 V-0 flammability rating
Base P/N-E3 - RoHS-compliant, commercial grade
Terminals: Matte tin plated leads, solderable
J-STD-002 and JESD 22-B102
E3 suffix meets JESD 201 class 1A whisker test
PRIMARY CHARACTERISTICS
Package
BU
IF(AV)
25 A
VRRM
600 V, 800 V, 1000 V
Mounting Torque: 10 cm-kg (8.8 inches-lbs) max.
IFSM
300 A
IR
5 μA
Recommended Torque: 5.7 cm-kg (5 inches-lbs)

VF at IF = 12.5 A
0.87 V
TJ max.
150 °C
Diode variations
In-Line
per
Polarity: As marked on body
MAXIMUM RATINGS (TA = 25 °C unless otherwise noted)
PARAMETER
Maximum repetitive peak reverse voltage
Average rectified forward current (Fig. 1, 2)
Non-repetitive peak forward surge current
8.3 ms single sine-wave, TJ = 25 °C
Rating for fusing (t < 8.3 ms) TJ = 25 °C
Operating junction and storage temperature range
TC = 60 °C (1)
TA = 25 °C (2)
SYMBOL
BU2506
BU2508
BU2510
UNIT
VRRM
600
800
1000
V
IO
25
3.5
A
IFSM
300
A
I2t
373
A2s
TJ, TSTG
- 55 to + 150
°C
Notes
(1) With 60 W air cooled heatsink
(2) Without heatsink, free air
Revision: 16-Aug-13
Document Number: 84805
1
For technical questions within your region: [email protected], [email protected], [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
BU2506-E3, BU2508-E3, BU2510-E3
www.vishay.com
Vishay General Semiconductor
ELECTRICAL CHARACTERISTICS (TA = 25 °C unless otherwise noted)
PARAMETER
TEST CONDITIONS
SYMBOL
TA = 25 °C
Maximum instantaneous forward
voltage per diode (1)
IF = 12.5 A
Maximum reverse current per diode
rated VR
Typical junction capacitance per diode
4.0 V, 1 MHz
TA = 125 °C
TA = 25 °C
TA = 125 °C
VF
IR
CJ
TYP.
MAX.
0.97
1.05
0.87
0.95
-
5.0
120
350
125
-
UNIT
V
μA
pF
Note
(1) Pulse test: 300 μs pulse width, 1 % duty cycle
THERMAL CHARACTERISTICS (TA = 25 °C unless otherwise noted)
PARAMETER
SYMBOL
Typical thermal resistance
BU2506
BU2508
RJC (1)
2.0
RJA (2)
20
BU2510
UNIT
°C/W
Notes
With 60 W air cooled heatsink
(2) Without heatsink, free air
(1)
ORDERING INFORMATION (Example)
PREFERRED P/N
UNIT WEIGHT (g)
PREFERRED PACKAGE CODE
BASE QUANTITY
DELIVERY MODE
BU2506-E3/45
4.84
45
20
Tube
BU2506-E3/51
4.84
51
250
Paper tray
BU25065S-E3/45
4.84
45
20
Tube

RATINGS AND CHARACTERISTICS CURVES (TA = 25 °C unless otherwise specified)
5
Average Forward Rectified Current (A)
Average Forward Output Current (A)
30
With Heatsink
Sine-Wave, R-Load
25
20
15
TC
TC
10
5
TC Measured at Device Bottom
0
0
20
40
60
80
4
3
2
Without Heatsink
Sine-Wave, R-Load
Free Air, TA
1
0
100
120
140
160
0
25
50
75
100
125
Case Temperature (°C)
Ambient Temperature (°C)
Fig. 1 - Derating Curve Output Rectified Current
Fig. 2 - Forward Current Derating Curve
Revision: 16-Aug-13
150
Document Number: 84805
2
For technical questions within your region: [email protected], [email protected], [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
BU2506-E3, BU2508-E3, BU2510-E3
www.vishay.com
Vishay General Semiconductor
1000
Instantaneous Reverse Current (µA)
Forward Power Dissipation (W)
50
40
30
20
10
0
0
5
10
15
20
25
TJ = 150 °C
100
TJ = 125 °C
10
1
TJ = 25 °C
0.1
30
10
Average Forward Current (A)
30
40
50
60
70
80
90
100
Fig. 5 - Typical Reverse Characteristics Per Diode
Fig. 3 - Forward Power Dissipation
1000
Junction Capacitance (pF)
100
Instantaneous Forward Current ( A )
20
Percent of Rated Peak Reverse Voltage (%)
TJ = 150 °C
10
TJ = 125 °C
1
0.1
TJ = 25 °C
100
10
0.01
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1
1.1
0.1
1
10
100
Instantaneous Forward Voltage ( V )
Reverse Voltage (V)
Fig. 4 - Typical Forward Characteristics Per Diode
Fig. 6 - Typical Junction Capacitance Per Diode
Revision: 16-Aug-13
Document Number: 84805
3
For technical questions within your region: [email protected], [email protected], [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
BU2506-E3, BU2508-E3, BU2510-E3
www.vishay.com
Vishay General Semiconductor
PACKAGE OUTLINE DIMENSIONS in inches (millimeters)
Case Type BU
0.161 (4.10)
0.142 (3.60)
0.880 (22.3)
0.860 (21.8)
View A
0.020R (TYP.)
0.125 (3.2) x 45°
Chamfer
0.080 (2.03)
0.060 (1.52)
0.310 (7.9)
0.290 (7.4)
0.160 (4.1)
0.140 (3.5)
0.740 (18.8)
0.720 (18.3)
0.075
(1.9) R
+
9°
TYP.
~
~
0.085 (2.16)
0.065 (1.65)
-
5°
TYP.
0.048 (1.23)
0.039 (1.00)
0.710 (18.0)
0.690 (17.5)
0.050 (1.27)
0.040 (1.02)
0.100 (2.54)
0.085 (2.16)
0.190 (4.83)
0.210 (5.33)
0.028 (0.72)
0.020 (0.52)
0.080 (2.03)
0.065 (1.65)
Polarity shown on front side of case, positive lead beveled corner
0.055 (1.385) REF.
0.094 (2.39) x 45° REF.
R 0.11
(2.78) REF.
0.64 (16.28) REF.
0.62 (15.78) REF.
R 0.10
(2.60) REF.
0.055 (1.385) REF.
Revision: 16-Aug-13
Document Number: 84805
4
For technical questions within your region: [email protected], [email protected], [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
BU2506-E3, BU2508-E3, BU2510-E3
www.vishay.com
Vishay General Semiconductor
FORMING SPECIFICATION: BU-5S in inches (millimeters)
0.161 (4.10)
0.142 (3.60)
0.880 (22.3)
0.860 (21.8)
0.125 (3.2) x 45°
Chamfer
0.160 (4.1)
0.140 (3.5)
+
0.050 (1.27)
0.040 (1.02)
0.213 (5.40)
0.173 (4.40)
0.417 (10.60)
0.370 (9.40)
0.310 (7.9)
0.290 (7.4)
0.740 (18.8)
0.720 (18.3)
0.075
(1.9) R
0.080 (2.03)
0.060 (1.52)
9°
TYP.
0.020R (TYP.)
~ ~
-
0.085 (2.16)
0.065 (1.65)
0.100 (2.54)
0.085 (2.16)
5°
TYP.
0.219 (5.55)
MAX.
0.315 (8.0)
0.276 (7.0)
0.134 (3.40)
0.087 (2.20)
0.080 (2.03)
0.065 (1.65)
0.319 (8.10)
0.272 (6.90)
0.319 (8.10)
0.272 (6.90)
0.028 (0.72)
0.020 (0.52)
APPLICATION NOTE
(1) Device UL approved for safety use dielectric strength of 1500 V.
(2) If device is mounted in Floating Ground (F. G.) application, insulator is recommended to use to meet safety requirement.
(3) Heat sink shape recommendation:
(3)
2.5 mm MIN.
Heatsink
2.5 mm MIN.
By Safety Requirements
Revision: 16-Aug-13
Document Number: 84805
5
For technical questions within your region: [email protected], [email protected], [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
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
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Revision: 13-Jun-16
1
Document Number: 91000