MADP-000404-10720T Non Magnetic MELF PIN Diode V1 V2 Features ♦ ♦ ♦ ♦ ♦ ♦ Non– Magnetic MELF Ceramic Package Hermetically Sealed Low Rs for Low Series Loss Low Cj for High Series Isolation High Average Incident Power Handling RoHS Compliant 1072 Description The MADP-000404-10720T is a non-magnetic surface mount PIN diode in a Metal Electrode Leadless Faced (MELF) package. The device incorporates M/A-COM Technology Solutions time proven HIPAX technology to produce a low inductance ceramic package with no ribbons or whisker wires. The diode construction includes a hard glass passivated, CERMACHIP™ that is full face bonded on both the cathode and anode to maximize surface area for the lowest possible electrical and thermal resistance. This device has been comprehensively characterized electrically and mechanically to ensure repeatable and predictable performance. Designed for Automated Assembly MELF PIN diodes are designed for high volume tape and reel assembly. The rectangular package design provides for highly efficient automatic pick and place assembly techniques. The parallel flat surfaces are suitable for key jaw or vacuum pickup. All solderable surfaces are tin plated and compatible with all oven reflow and vapor phase soldering methods. Absolute Maximum Ratings1 @ 25°C Applications The MADP-000404-10720T is well suited for use in low loss, low distortion high power switching circuits in high magnetic field environments from HF through UHF frequencies. The low thermal resistance of this device provides excellent performance at high, incident RF power levels. This device is designed to meet the most rigorous electrical and mechanical requirements of MRI testing environments Parameter Absolute Maximum Operating Temperature -65 °C to +125°C Storage Temperature -65 °C to +150°C Diode Junction Temperature +175 °C Continuous Diode Mounting Temperature +265°C for 10 seconds Forward D.C. Current + 250 mA Reverse D.C. Voltage @ -1µA 250V 1. Exceeding these limits may cause permanent damage. 1 ADVANCED: Data Sheets contain information regarding a product M/A-COM is considering for • North America Tel: 800.366.2266 / Fax: 978.366.2266 development. Performance is based on target specifications, simulated results, and/or prototype • Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 measurements. Commitment to develop is not guaranteed. • Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 PRELIMINARY: Data Sheets contain information regarding a product M/A-COM has under developVisit www.macom.com for additional data sheets and product information. ment. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. Commitment to produce in M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s) or volume is not guaranteed. information contained herein without notice. MADP-000404-10720T Non Magnetic MELF PIN Diode V1 V2 Electrical Specifications @ +25 °C Parameter Symbol Condition Unit Value Forward Voltage (Maximum) VF IF = +100 mA 1.0 VDC Voltage Rating (Minimum) VR Ir = 1 µA 250 VDC Total Capacitance (Maximum) CT -50 V @ 1 MHz 0.6 pF Series Resistance (Maximum) RS +50 mA @ 100 MHz .7 Ohms Carrier Lifetime (Nominal) τL +6 mA / -10 mA @ (50% - 90% Voltage) 1.0 µs I-Region Length (Nominal) μm - 30 µm Thermal Resistance (Maximum) θ - 20°C/W Reverse Recovery Time (Nominal) nS IF = +20mA , IREV = -200mA. 100 Environmental Capability MELF devices are appropriate for use in industrial and military applications and can be screened to meet the environmental requirements of MIL-STD-750, MIL-STD-202 as well as other military standards. The table below lists some of the MIL-STD 750 tests the device is designed to meet. Test Method Description High Temperature Storage 1031 +150°C, for 340 Hours Temperature Shock 1051 -65°C to +150°C, 20 Cycles HTRB 1038 80% of rated VB, +150°C, for 96 Hours Moisture Resistance 1021 No Initial Conditioning, 85% RH, +85°C Gross Leak 1071 Cond. E Dye Penetrant Visual Vibration Fatigue 2046 20,000G’s, 60Hz, x, y, z axis Solderability 2026 Test Temperature = +245°C 1. Exceeding these limits may cause permanent damage. 2 ADVANCED: Data Sheets contain information regarding a product M/A-COM is considering for • North America Tel: 800.366.2266 / Fax: 978.366.2266 development. Performance is based on target specifications, simulated results, and/or prototype • Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 measurements. Commitment to develop is not guaranteed. • Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 PRELIMINARY: Data Sheets contain information regarding a product M/A-COM has under developVisit www.macom.com for additional data sheets and product information. ment. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. Commitment to produce in M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s) or volume is not guaranteed. information contained herein without notice. MADP-000404-10720T Non Magnetic MELF PIN Diode V1 V2 Mechanical Outline Circuit Pad Layout for 1072 MELF 1072 MELF Surface Mount Package Cathode B A Solderable Surfaces A A C C B INCHES MM B Dimension inches mm A 0.093 2.36 B 0.050 1.27 C 0.060 1.52 Dimension MIN. MAX. MIN. MAX. A 0.080 0.095 2.032 2.413 B 0.115 0.135 2.921 3.429 C 0.008 0.030 0.203 0.762 Ordering Information Part Number Package Quantity per Reel MADP-000404-10720T Tape and Reel 1500pcs 3 ADVANCED: Data Sheets contain information regarding a product M/A-COM is considering for • North America Tel: 800.366.2266 / Fax: 978.366.2266 development. Performance is based on target specifications, simulated results, and/or prototype • Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 measurements. Commitment to develop is not guaranteed. • Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 PRELIMINARY: Data Sheets contain information regarding a product M/A-COM has under developVisit www.macom.com for additional data sheets and product information. ment. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. Commitment to produce in M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s) or volume is not guaranteed. information contained herein without notice.