Datasheet
DC Brushless Fan Motor Drivers
Multifunction Single-phase Full-wave
Fan Motor Driver
BD61243FV
General Description
Key Specifications
BD61243FV is a 1chip driver that is composed of
H-bridge power DMOS FET. Moreover, the circuit
configuration is restructured, and convenience has been
improved by reducing the external parts and simplifying
the setting compared with the conventional driver.
Operating Voltage Range:
Operating Temperature Range:
Output Voltage(total):
Features
Package
5.5V to 16V
–40°C to +105°C
0.2V(Typ) at 0.2A
W (Typ) x D (Typ) x H (Max)
5.00mm x 6.40mm x 1.35mm
SSOP Small Package
Driver Including Power DMOS FET
Speed Controllable by DC / PWM Input
I/O Duty Slope Adjust
PWM Soft Switching
Current Limit
Start Duty Assist
Lock Protection and Automatic Restart
Quick Start
Rotation Speed Pulse Signal (FG) Output
SSOP-B14
Applications
Fan motors for general consumer equipment of desktop PC, Projector, etc.
Typical Application Circuits
SIG
H
PWM
1
FG
GND
14
2
H-
SSW
13
3
H+
ZPER
4
SLOPE
5
SIG
1
FG
GND
14
2
H-
SSW
13
12
3
H+
ZPER
12
MIN
11
4
SLOPE
MIN
11
PWM
REF
10
5
PWM
REF
10
6
OUT2
VCC
9
6
OUT2
VCC
9
7
RNF
OUT1
8
7
RNF
OUT1
8
H
＋
－
M
www.rohm.com
© 2015 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 14 • 001
＋
M
－
Figure 2. Application of DC Voltage Input
Figure 1. Application of Direct PWM Input
〇Product structure : Silicon monolithic integrated circuit
DC
〇This product has no designed protection against radioactive rays
1/27
TSZ02201-0H1H0B101290-1-2
Jun.19.2015 Rev.001
.
BD61243FV
Pin Configuration
Block Diagram
(TOP VIEW)
FG
1
14
GND
H-
2
13
SSW
1
2
H+
3
12
4
11
MIN
PWM
5
10
REF
RNF
6
9
7
8
SIGNAL
OUTPUT
OSC
TSD
H-
GND
SSW
ZPER
SLOPE
OUT2
FG
14
13
3
4
COMP
+
H+
ZPER
CONTROL
LOGIC
SLOPE
MIN
12
11
INSIDE
REG
VCC
5
OUT1
6
7
PWM
OUT2
RNF
FILTER
PREDRIVER
REFERENCE
REF
VCC
OUT1
10
9
8
Pin Description
P/No.
T/Name
1
2
3
4
5
6
FG
H–
H+
SLOPE
PWM
OUT2
7
RNF
8
9
10
11
12
13
14
OUT1
VCC
REF
MIN
ZPER
SSW
GND
Function
Speed pulse signal output terminal
Hall – input terminal
Hall + input terminal
I/O duty slope setting terminal
PWM input duty terminal
Motor output terminal 2
Output current detecting resistor
connecting terminal (motor ground)
Motor output terminal 1
Power supply terminal
Reference voltage output terminal
Minimum output duty setting terminal
Re-circulate period setting terminal
Soft switching setting terminal
Ground terminal (signal ground)
I/O Truth Table
Hall Input
H+
H–
H
L
L
H
OUT1
L
H
Driver Output
OUT2
H
L
FG
Hi-Z
L
H; High, L; Low, Hi-Z; High impedance
FG output is open-drain type.
www.rohm.com
© 2015 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
.
2/27
TSZ02201-0H1H0B101290-1-2
Jun.19.2015 Rev. 001
BD61243FV
Absolute Maximum Ratings
Parameter
Supply Voltage
Power Dissipation
Operating Temperature Range
Storage Temperature Range
Output Voltage
Output Current
Rotation Speed Pulse Signal (FG) Output Voltage
Rotation Speed Pulse Signal (FG) Output Current
Reference Voltage (REF) Output Current
Input Voltage1 (H+, H–,MIN,SSW,ZPER,SLOPE)
Input Voltage2 (PWM)
Junction Temperature
Symbol
Rating
Unit
VCC
Pd
Topr
Tstg
VOMAX
IOMAX
VFG
IFG
IREF
VIN1
VIN2
Tj
18
0.87 (Note 1)
–40 to +105
–55 to +150
18
1.2 (Note 2)
18
10
10
4
6.5
150
V
W
°C
°C
V
A
V
mA
mA
V
V
°C
(Note 1) Derate by 7.0mW/°C when operating over Ta=25°C. (Mounted on 70.0mm×70.0mm×1.6mm glass epoxy board)
(Note 2) Do not exceed Pd and Tj=150°C.
Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated
over the absolute maximum ratings.
Recommended Operating Conditions
Parameter
Operating Supply Voltage Range
Input Voltage Range1
(H+, H–, MIN, SSW, ZPER, SLOPE)
Input Voltage Range2 (PWM)
PWM Input Duty Range
PWM Input Frequency Range
www.rohm.com
© 2015 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
Symbol
Min
Typ
Max
Unit
VCC
5.5
12
16
V
VIN1
0
-
VREF+0.3
V
-0.3
0
15
-
5
100
50
V
%
kHz
VIN2
DPWM
fPWM
.
3/27
TSZ02201-0H1H0B101290-1-2
Jun.19.2015 Rev. 001
BD61243FV
Electrical Characteristics (Unless otherwise specified Ta=25°C, VCC=12V)
Parameter
Circuit Current
Output Voltage
Symbol
ICC
Limit
Min
3.0
Typ
4.5
Max
6.5
Unit
Conditions
mA
IO=±200mA,
High and low side total
VO
-
0.2
0.35
V
Lock Detection ON Time
Lock Detection OFF Time
Lock Detection OFF/ON Ratio
FG Hysteresis Voltage+
FG Hysteresis Voltage-
tON
tOFF
RLCK
VHYS+
VHYS-
0.3
3.0
8.5
7
-5
0.5
5.0
10.0
12
-10
0.7
7.0
11.5
17
-15
s
s
mV
mV
FG Output Low Voltage
VFGL
-
-
0.30
V
IFG=5mA
IFGL
VPWMH
VPWML
IPWMH
IPWML
2.5
0.0
-10
-50
0
-25
10
5.0
1.0
10
-12
μA
V
V
μA
μA
VFG=16V
Reference Voltage
VREF
3.0
3.3
3.6
V
IREF=-1mA
Current Limit Setting Voltage
VCL
235
265
295
mV
FG Output Leak Current
PWM Input High Level Voltage
PWM Input Low Level Voltage
PWM Input Current
RLCK=tOFF / tON
Characteristic
Data
Figure 3
Figure 4 to
Figure 7
Figure 8
Figure 9
Figure 10
Figure 11
VPWM=5V
VPWM=0V
Figure 12 to
Figure 13
Figure 14
Figure 15 to
Figure 16
Figure 17 to
Figure 18
Figure 19
For parameters involving current, positive notation means inflow of current to IC while negative notation means outflow of current from IC.
www.rohm.com
© 2015 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
.
4/27
TSZ02201-0H1H0B101290-1-2
Jun.19.2015 Rev. 001
BD61243FV
Typical Performance Curves (Reference Data)
0.0
Output High Voltage: VOH[V]
Circuit Current: ICC[mA]
8
6
105°C
25°C
–40°C
4
2
-0.3
–40°C
-0.6
25°C
105°C
-0.9
Operating Voltage Range
-1.2
0
0
5
10
15
0.0
20
Supply Voltage: VCC[V]
1.2
Figure 4. Output High Voltage vs Output Source Current
(VCC=12V)
0.0
1.2
-0.3
0.9
Output Low Voltage: VOL[V]
Output High Voltage: VOH[V]
0.8
Output Source Current: IO[A]
Figure 3. Circuit Current vs Supply Voltage
16V
-0.6
0.4
12V
5.5V
-0.9
105°C
0.6
25°C
–40°C
0.3
0.0
-1.2
0.0
0.4
0.8
0.0
1.2
0.8
1.2
Output Sink Current: IO[A]
Output Source Current: IO[V]
Figure 5. Output High Voltage vs Output Source Current
www.rohm.com
© 2015 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
0.4
Figure 6. Output Low Voltage vs Output Sink Current
(VCC=12V)
.
5/27
TSZ02201-0H1H0B101290-1-2
Jun.19.2015 Rev. 001
BD61243FV
Typical Performance Curves (Reference Data) – continued
0.7
Lock Detection ON Time: tON[s]
Output Low Voltage: VOL[V]
1.2
0.9
5.5V
0.6
12V
16V
0.3
0.6
0.5
-40℃
25℃
105℃
0.4
Operating Voltage Range
0.3
0.0
0.0
0.4
0.8
0
1.2
10
15
20
Output Sink Current: Io[A]
Supply Voltage: Vcc[V]
Figure 7. Output Low Voltage vs Output Sink Current
(Ta=25°C)
Figure 8. Lock Detection ON Time vs Supply Voltage
7.0
12.0
Lock Detection OFF/ON Ratio: RLCK[s/s]
Lock Detection OFF Time: tOFF[s]
5
6.0
–40°C
25°C
105°C
5.0
4.0
Operating Voltage Range
3.0
11.0
–40°C
25°C
105°C
10.0
9.0
Operating Voltage Range
8.0
0
5
10
15
20
5
10
15
20
Supply Voltage: Vcc[V]
Supply Voltage: Vcc[V]
Figure 9. Lock Detection OFF Time vs Supply Voltage
www.rohm.com
© 2015 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
0
Figure 10. Lock Detection OFF/ON Ratio vs Supply Voltage
.
6/27
TSZ02201-0H1H0B101290-1-2
Jun.19.2015 Rev. 001
BD61243FV
Typical Performance Curves (Reference Data) – continued
0.8
20
FG Output Low Voltage: VFGL[V]
FG Hysteresis Voltage: VHYS[mV]
40
105°C
25°C
–40°C
0
–40°C
25°C
105°C
-20
Operating Voltage Range
-40
0.6
0.4
105°C
0.2
25°C
–40°C
0.0
0
5
10
15
20
0
4
6
8
10
FG Sink Current: IFG[mA]
Supply Voltage: Vcc[V]
Figure 11. FG Hysteresis Voltage vs Supply Voltage
Figure 12. FG Output Low Voltage vs FG Sink Current
(VCC=12V)
8
FG Output Leak Current: IFGL[uA]
0.8
FG Output Low Voltage: VFGL[V]
2
0.6
0.4
5.5V
0.2
12V
16V
6
4
2
0
Operating Voltage Range
0.0
105°C
25°C
–40°C
-2
0
2
4
6
8
10
5
10
15
20
FG Voltage: VFG[V]
FG Sink Current: IFG[mA]
Figure 13. FG Output Voltage vs FG Sink Current
(Ta=25°C)
www.rohm.com
© 2015 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
0
Figure 14. FG Output Leak Current vs FG Voltage
.
7/27
TSZ02201-0H1H0B101290-1-2
Jun.19.2015 Rev. 001
BD61243FV
Typical Performance Curves (Reference Data) – continued
0
PWM Intput Low Current: IPWML[uA]
PWM Intput Hi Current: I PWMH [uA]
8
6
4
2
105°C
25°C
–40°C
0
Operating Voltage Range
-10
–40°C
-20
25°C
-30
105°C
-40
Operating Voltage Range
-50
-2
0
5
10
15
0
20
5
15
20
Supply Voltage: VCC[V]
Supply Voltage: VCC[V]
Figure 15. PWM Input Hi Current vs Supply Voltage
Figure 16. PWM Input Low Current vs Supply Voltage
4.0
4.0
3.5
Refarence Voltage: VREF[V]
Reference Voltage: VREF[V]
10
–40°C
25°C
105°C
3.0
2.5
3.5
5.5V
12V
3.0
16V
2.5
Operating Voltage Range
2.0
2.0
0
5
10
15
20
Supply Voltage: VCC[V]
2.5
5.0
7.5
10.0
REF Source Current: IREF[mA]
Figure 17. Reference Voltage vs Supply Voltage
(IREF=-1mA)
www.rohm.com
© 2015 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
0.0
Figure 18. Reference Voltage vs REF Source Current
(Ta=25°C)
.
8/27
TSZ02201-0H1H0B101290-1-2
Jun.19.2015 Rev. 001
BD61243FV
Typical Performance Curves (Reference Data) – continued
Current Limit Setting Voltage: VCL[mV]
400
350
300
105°C
25°C
–40°C
250
Operating Voltage Range
200
0
5
10
15
20
Supply Voltage: VCC[V]
Figure 19. Current Limit Setting Voltage vs Supply Voltage
www.rohm.com
© 2015 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
.
9/27
TSZ02201-0H1H0B101290-1-2
Jun.19.2015 Rev. 001
BD61243FV
Application Circuit Examples (Constant Values are for Reference)
1. PWM Input Application
It is an example of the application of the external PWM input, and controlling the rotational speed. In this application,
minimum rotational speed can be set.
Protection of FG open-drain
Soft switching setting
SIG
Hall bias is set according to
the amplitude of hall
element output and hall
input voltage range.
1
FG
SIGNAL
OUTPUT
OSC
TSD
GND
14
to 1kΩ
2
H-
SSW 13
H
Linearization correction
resistance
Re-circulate setting
3
1kΩ
to 100kΩ
Noise measures of substrate
COMP
+
H+
ZPER
CONTROL
LOGIC
SLOPE
4
12
1kΩ
to 100kΩ
MIN 11
Minimum duty setting
INSIDE
REG
PWM
5
I/O duty slope setting
PWM
FILTER
PREDRIVER
REFERENCE
OUT2
6
Low-pass filter for rotation
speed instruction input
REF
10
Stabilization of REF voltage
VCC 9
＋
1μF to
7
To limit motor current, the
current is detected.
Note the power consumption of
sense resistance.
RNF
OUT1
0.22Ω to
M
8
Reverse Polarity
Protection
Measure against back EMF
－
Maximum output voltage and current
are 18V and 1.2A respectively
Connect bypass capacitor near
VCC terminal as much as possible.
Figure 20. PWM Input Application
Application Design Note
(1) The bypass capacitor connected must be more than the recommended constant value because there is a
possibility of the motor start-up failure etc. due to IC malfunction.
Substrate Design Note
(1) IC power(Vcc), motor power(Vm), motor outputs(OUT1, 2), and motor ground(MGND) lines are made as wide as
possible.
(2) IC ground (GND) line is common with the application ground except motor ground (i.e. hall ground etc.), and
arranged near to (–) land.
(3) The bypass capacitor and/or Zenner diode are placed near to VCC pin.
(4) H+ and H– lines are arranged side by side and made from the hall element to IC as short as possible, because it
is easy for the noise to influence the hall lines.
www.rohm.com
© 2015 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
.
10/27
TSZ02201-0H1H0B101290-1-2
Jun.19.2015 Rev. 001
BD61243FV
Application Circuit Examples (Constant Values are for Reference) – continued
2. DC Voltage Input Application
This is an example application circuit for the rotation speed control by DC voltage. In this application, minimum
rotational speed cannot be set.
SIG
1
FG
SIGNAL
OUTPUT
OSC
TSD
GND
14
to 1kΩ
2
H-
SSW
H
13
1kΩ
to 100kΩ
3
1kΩ
to 100kΩ
4
COMP
+
H+
ZPER
CONTROL
LOGIC
SLOPE
MIN
12
DC
11
INSIDE
REG
Pull-down PWM terminal to in
GND
5
0Ω
6
PWM
FILTER
PREDRIVER
OUT2
REFERENCE
REF
VCC
10
9
Zener diode for MIN
withstand voltage protection
＋
1μF to
7
RNF
OUT1
8
0.22Ω to
M
－
Figure 21. DC Voltage Input Application
www.rohm.com
© 2015 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
.
11/27
TSZ02201-0H1H0B101290-1-2
Jun.19.2015 Rev. 001
BD61243FV
Functional Descriptions
1. Variable Speed Operation
The rotational speed of the motor changes by the PWM duty of the motor outputs (OUT1 and OUT2 terminals).
However, it provides for the motor's output not by the rotational speed but by the duty in the BD61243FV, because the
rotational speed is not uniquely decided by the motor output duty.
The changeable speed operation is controlled by these two input terminals.
(1) PWM Operation by Pulse Input in PWM Terminal
(2) PWM Operation by DC Input in MIN Terminal
(Note) PWM frequency of output is 50kHz (Typ). Hence, input PWM frequency is not equal to PWM frequency of output.
HALL
BIAS
(1) PWM Operation by Pulse Input in PWM Terminal
The PWM signal from the controller can be input directly to IC in Figure 22. The output duty is controlled by the
input PWM duty (Figure 23). Refer to recommended operating conditions (P.3) and electrical characteristics (P.4)
for the input condition.
Internal power-supply voltage (INTERNAL REG; typ 5.0V) is impressed when the PWM terminal is open, it
becomes 100% input of the duty and equivalent, and a full torque is driven. There must be a pull- down resistance
outside of IC to make it to torque 0 when the PWM terminal opens (However, only at the controller of the
complimentary output type.). Insert the protective resistance and capacitor for noise removal if necessary.
Controller
Motor Unit
Driver
H–
High
H+
Low
Inside
5.0V
REG
INTERNAL
REG
Protection
Resistor
PWM
PWM
FILTER
2.5V
PWM
GND
1.0V
0.0V
High
OUT1
Low
Complimen
-tary Output
Pull-down
Resistor
Motor output ON
Capacitor for
Noise Removal
: High impedance
High
OUT2
Low
Full
Motor
Torque
Figure 22. PWM Input Application
Zero
Figure 23. PWM Input Operation Timing Chart
Full torque (VPWM>2.5V) and zero torque(<1.0V) can recognize the DC voltage input of the PWM terminal.
However, the variable speed control in the DC voltage between 0V and 5.0V should be not able to be done.
(a) Setting of Minimum Output Duty (MIN)
Minimum rotational speed can be set by MIN terminal in Figure 24. The resolution of the MIN terminal is 128
steps. MIN terminal should be shorted to GND when this function is not used.
OUT1, 2 Outputs
ON Duty [%]
Output Minimum Duty [%]
Minimum Output Duty Setting
(128 Steps)
100
A
0
MIN
Setting
100
PWM Input
ON Duty [%]
100
30
5
0 0.1
1
REF
MIN Input Voltage [V]
Figure 24. Setting of Minimum Output Duty
Setting Voltage Division of
Resistance (MIN enable)
OK
REF
Setting of Resistance
Pull-down (MIN disable)
OK
REF
MIN
MIN
Figure 25. Relation of MIN Input Voltage and Output Duty
Setting of Resistance
Pull-up (Full Torque)
OK
REF
MIN
Open Setting
(Prohibit Input)
NG
REF
MIN
Figure 26. MIN Terminal Setting
www.rohm.com
© 2015 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
.
12/27
TSZ02201-0H1H0B101290-1-2
Jun.19.2015 Rev. 001
BD61243FV
Functional Descriptions – continued
(b) Setting of Slope of I/O Duty (SLOPE)
Slope of output duty and the input duty to PWM terminal can be established by SLOPE setting in Figure 27.
The resolution of MIN is 128 steps. But if the voltage of the SLOPE terminal is 0.4V to 0.825V (Typ),then the
slope of the input and output duty is fixed to 0.5, and if it is less than 0.4V (Typ) the slope is fixed to 1
(Figure 28). SLOPE terminal should be shorted to GND, when this function is not used.
OUT1, 2 Outputs
ON Duty [%]
I/O Duty Slope Setting
(128 Steps)
100
2
SLOPE
SLOPE=0.5
A
1.5
1
0.5
SLOPE=2
0
SLOPE
Setting
100
PWM Input
ON Duty [%]
Figure 27. Adjust of Slope of I/O Duty
Setting Voltage Division of
Resistance (SLOPE enable)
OK
REF
SLOPE
0
0.4
0.825
1.65
2.5
SLOPE Input Voltage [V]
REF
Figure 28. Relation of SLOPE Voltage and Slope of I/O Duty
Setting of Resistance
Pull-down (SLOPE = 1)
OK
REF
Setting of Resistance
Pull-up (SLOPE=2)
OK
SLOPE
REF
SLOPE
Open Setting
(Prohibit Input)
NG
REF
SLOPE
Figure 29. SLOPE Terminal Setting
When you perform the minimum rotation speed setting while making SLOPE setting, please decide MIN voltage
based on a lower expression.
MIN Voltage = 3.3 x {(Target Minimum Duty - 100 + 100 x SLOPE) / ( 100 x SLOPE)}･･･Equation 1
(ex.) In the case of SLOPE=1 and Target minimum duty=20%, calculate the SLOPE and MIN voltage in the
following.
The SLOPE voltage sets with SLOPE=0V from Figure 28.
The MIN voltage from Equation 1;
MIN
= 3.3 x {( 20 – 100 + 100 x 1 ) / ( 100 x 1)}
= 0.66[V]
(ex.) In the case of SLOPE=0.75 and Target minimum duty=40%, calculate the SLOPE and MIN voltage in the
following.
The SLOPE voltage sets with SLOPE=1.24V from Figure 28.
The MIN voltage from Equation 1;
MIN
= 3.3 x {( 40 – 100 + 100 x 0.75 ) / ( 100 x 0.75)}
= 0.66[V]
(ex.) In the case of SLOPE=1.75 and Target minimum duty=30%, calculate the SLOPE and MIN voltage in the
following.
The SLOPE voltage sets with SLOPE=2.9V from Figure 28.
The MIN voltage from Equation 1;
MIN
= 3.3 x {( 30 – 100 + 100 x 1.75 ) / ( 100 x 1.75)}
= 1.98[V]
www.rohm.com
© 2015 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
.
13/27
TSZ02201-0H1H0B101290-1-2
Jun.19.2015 Rev. 001
BD61243FV
(2) PWM Operation by DC Input in MIN Terminal
The output duty can be varied by inputting DC voltage into MIN terminal. PWM terminal should be shorted to GND
when this function is used. Please refer to input voltage range 1(P.3) for the input condition of the MIN terminal.
MIN Terminal voltage becomes unsettled when MIN terminal is in an open state. The voltage of the terminal
becomes irregular if MIN terminal is open. Input voltages to MIN terminals when you turn on IC power supply (VCC)
in Figure 30.
(Note)In the case of DC voltage input, it cannot set the lowest output duty.
INTERNAL
REG
200kΩ(Typ)
PWM
H–
High
H+
Low
REF
3.3V
MIN
FILTER
GND
0.0V
MIN
DC
High
OUT1
Low
Motor Output ON
: High Impedance
100%
OUT2
Duty
Zener diode for MIN
withstand voltage protection
0%
Full
Motor
Torque
Figure 30. DC Input Application
Zero
Figure 31. DC Input Operation Timing Chart
OUT1, 2 Outputs
ON Duty [%]
(a) Setting of Slope of I/O Duty (SLOPE)
Slope of output duty and the input voltage to MIN
terminal can be established by SLOPE setting in
Figure 32. The resolution of SLOPE is 128 steps.
But if the voltage of the SLOPE terminal is 0.4V
to 0.825V (Typ), then the slope of the input and
output duty is fixed to 0.5, and if it is less than
0.4V (Typ) the slope is fixed to 1 (Figure 28).
SLOPE terminal should be shorted to GND, when
this function is not used.
100
SLOPE=0.5
A
SLOPE=2
0
SLOPESetting
3.3
MIN [V]
Figure 32. Relation of MIN Input Voltage and
Slope of I/O Duty
www.rohm.com
© 2015 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
.
14/27
TSZ02201-0H1H0B101290-1-2
Jun.19.2015 Rev. 001
HALL
BIAS
BD61243FV
Functional Descriptions – continued
2. About Setting of Phase Switching of Output
The period of Soft switching and re-circulate can be adjusted by SSW and ZPER setting.
(1) Soft Switching Period Setting (SSW)
The soft switching section in the output can be set by SSW terminal. By adjusting SSW voltage, soft switching
section can be set from 22.5° to 90° as one period of hall signal 360°. The resolution of SSW is 128 steps in
Figure 34. Timing chart is shown in Figure 33.
(Note)A soft switching period is the section where ON duty of the output changes from a target duty into 0% by 16 steps.
Adjust a Soft Switching Period by SSW Setting
Setable Range：Min22.5° to Max90°
H+
H–
Set of Soft Switching Period
(128 Steps)
Angle[°]
One period of hall signal 360°
90
High
OUT1
Low
High
OUT2
Low
Motor
Current
67.5
45
22.5
0A
0
0.825
1.65
2.5
SSW input voltage [V]
Soft Switching Period (Max 90°)
Figure 33. Soft switching Period setting
REF
Figure 34. Relation of SSW Input Voltage
and Soft Switching Period
Setting Voltage Division of
Resistance (SSW enable)
OK
REF
Setting of Resistance
Pull-down (SSW Min 22.5°)
OK
REF
Setting of Resistance
Pull-up (SSW Max 90°)
OK
REF
SSW
SSW
SSW
Open Setting
(Prohibit Input)
NG
REF
SSW
Figure 35. SSW Terminal Setting
www.rohm.com
© 2015 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
.
15/27
TSZ02201-0H1H0B101290-1-2
Jun.19.2015 Rev. 001
BD61243FV
Functional Descriptions – continued
HALL
BIAS
(2) Re-circulate Period Setting (ZPER)
The recirculate period in fall of the output can be set by ZPER terminal. By adjusting ZPER voltage, recirculate
period can be set from 0° to 90° as one period of hall signal 360° in Figure 37. The resolution of ZPER is 128
steps. Timing chart is shown in Figure 36.
About priority of SSW and ZPER setting, the setting priority of the period to regenerate than a soft switching
period is high.
For example, VSSW =1.65V, VZPER = 0.825V
Soft switching period = (1.65 / 3.3) x 90° - (0.825 / 3.3) x 90° = 45° - 22.5° = 22.5°
Re-circulate period = (0.825 / 3.3) x 90° = 22.5°
When you set a period to regenerate for longer than soft switching period, a soft switching section for 5.6° (Typ)
enters.
* A recirculate period is a current recirculate period before phase switching of output.
In the recirculate period, the logic of the output transistor is decided by the hall input logic.
The phase of output Hi becomes the high impedance, and the phase of output Low is Low.
Adjust a Re-Circulate Period by ZPER Setting
Setable Range：Min22.5° to Max90°
H+
Set of Re-circulate Period
(128 Steps)
Angle[°]
H–
One period of hall signal 360°
90
High
OUT1
67.5
Low
High
45
OUT2
Low
Motor
Current
22.5
0A
0
Soft Switching Period
Figure 36. Re-circulate Period Setting
Setting Voltage Division of
Resistance (ZPER enable)
OK
REF
ZPER
0.825
1.65
2.475
ZPER input voltage [V]
Re-circulate Period(Max 90°)
REF
Figure 37. Relation of ZPER Input Voltage
and Re-circulate Period
Setting of Resistance
Pull-down (ZPER Min 0°)
OK
REF
Setting of Resistance
Pull-up (ZPER Max 85°)
OK
REF
ZPER
Open Setting
(Prohibit Input)
NG
ZPER
REF
ZPER
Figure 38. ZPER Terminal Setting
www.rohm.com
© 2015 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
.
16/27
TSZ02201-0H1H0B101290-1-2
Jun.19.2015 Rev. 001
BD61243FV
Functional Descriptions – continued
(3) Kickback Restraint Function (Lead angle correction)
Automatically detects a current phase gap, and an aspect change point is revised to lead angle.
When a current phase is delayed for a hall phase, output phase can be changed up to 22.5° automatically.
Timing chart is shown in Figure 39 and 40.
Set of soft switching period; 40°
Set of soft switching period; 40°
Kickback restraint; None
°
Set of re-circulate period; 0°
Kickback restraint; Available
Set of re-circulate period; 0°
H+
H–
One period of hall signal 360°
One period of hall signal 360°
High
OUT1
Low
High
OUT2
Low
モータ
電流
0A
Lead Angle None
Lead Angle Max 22.5°
Figure 39. Normal Operation
Figure 40. Kickback Restraint Operation
A kickback restraint function is a miscellaneous function to prevent leaping up of the output voltage to occur at
the time of power-on and a torque sudden change. Based on a setting method of SSW and ZPER of figure 41,
prevent this function from working in normal operation.
Operate a motor by maximum power supply voltage thought about
under conditions of SSW=2.7V, ZPER=0V
Timing of the
phase change;
OUT1 and OUT2 = FG?
No
SSW Voltage UP and/or
ZPER Voltage UP
Yes
Silent performance;
Is it enough?
No
SSW Voltage UP and/or
ZPER Voltage DOWN
Yes
Rotation speed;
Is it enough?
No
SSW Voltage DOWN and/or
ZPER Voltage DOWN
Yes
Completion of SSW and ZPER setting
Figure 41. Flow of Setting of SSW and ZPER Terminal
www.rohm.com
© 2015 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
.
17/27
TSZ02201-0H1H0B101290-1-2
Jun.19.2015 Rev. 001
BD61243FV
Functional Descriptions – continued
3. Current Limit
The current limit circuit turns off the output, when the current that flows to the motor coil is detected exceeding a set
value. The current value that current limit operates is determined by internal setting voltage and current sense resistor.
In Figure 42, Io is the current flowed to the motor coil, RNF is the resistance detecting the current, and PRMAX is the
power
IO[A] = VCL[V] / RNF[Ω]
= 265[mV] / 0.33[Ω]
= 0.803[A]
OUT1
M
PRMAX[W] = VCL[V] x IO[A]
= 265[mV] x 0.803[A]
= 0.213[W]
OUT2
RNF
IO
VCL
GND
RNF
CURRENT
LIMIT COMP
IC Signal Ground Line
Motor Ground Line
－
Figure 42. Setting of current limit and grout lines
4. Lock Protection and Automatic Restart
Motor rotation is detected by hall signal, and the IC internal counter set lock detection ON time (tON) and OFF time
(tOFF). Timing chart is shown in Figure 43.
Motor Idling
H–
High
H+
Low
tON (Typ 0.5s)
tOFF (Typ 5.0s)
tOFF
tON
tON
tOFF
High
OUT1
Low
High
OUT2
Low
High
FG
Low
Instruction
Torque
Motor
Output ON
Duty
0%
Motor Lock Lock Detection
Motor Lock Release
: High Impedance
Figure 43. Lock Protection (Incorporated Counter System) Timing Chart
www.rohm.com
© 2015 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
.
18/27
TSZ02201-0H1H0B101290-1-2
Jun.19.2015 Rev. 001
BD61243FV
Functional Descriptions – continued
5. Quick Start
When torque off logic is input by the
control signal over a fixed time, the lock
protection function is disabled. The
motor can restart quickly once the
control signal is applied.
Motor Idling
H–
High
H+
Low
High
PWM
Low
Lock
Protection
Signal
Enable
Disable
Under 5ms(Typ)
Quick start standby mode
Motor
Output
ON Duty
Torque OFF
Motor Stop
PWM or
MIN
torque
0%
Torque ON
Figure 44. Quick Start Timing Chart (PWM Input Application)
6. Start Duty Assist
Start Duty Assist can secure a constant starting torque even at low
duty. The IC is driven by a constant output duty (DOHL; Typ 50%)
within detection of motor rotation. When Output ON duty is less than
50% (Typ), Start Duty Assist function operates under the following
conditions:
(1)
(2)
(3)
(4)
Power ON
Lock Release
Quick Start
Thermal Shut Down(TSD) Release
POH
Motor Output
ON Duty[%]
100
DOHL; Typ 50%
50
0
50
100
PWM
Duty
[%]
Figure 45. I/O Duty Characteristic in Start Duty Assist
ON
Power
Motor
Output ON
Duty
POHL (Typ 50%)
OFF
PWM or MIN
torque
100%
Duty assist
0%
Power ON
Detect of Motor Rotation
tOHL (Typ 0.5s) DOHL (Typ 50%) PWM or MIN
torque
100%
Duty assist
0%
TSD ON
:Start Duty Assist
OFF
:Start Duty Assist
Figure 46. Timing Chart of Power ON
www.rohm.com
© 2015 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
175°C
150°C
Junction
Temperatur
e
Motor
Output ON
Duty
Figure 47. Timing Chart of TSD Release
.
19/27
TSZ02201-0H1H0B101290-1-2
Jun.19.2015 Rev. 001
BD61243FV
Functional Descriptions – continued
7. Hall Input Setting
Hall input voltage range is shown in operating conditions (P.3). Adjust the value of hall element bias resistor R1,R2
in Figure 49 so that the input voltage of a hall amplifier is input in "Input Voltage Range 1"(P.3) including signal
amplitude. R2 is resistance to correct the temperature characteristic of the hall element.
Hall Input Upper Limit
H–
REFE- REF
RENCE
VREF+0.3V
C1
Hall Bias Current;
IH[A] = VREF[V] / (R1+R2//RH)[Ω]
H+
COMP
+
H–
H+
Hall Input Lower Limit
R1
H–
Operating Hall Input
Voltage Range
VH
Figure 48. Hall Input Voltage Range
Hall
RH
H+
C2
0V
IH
R2
Hall Bias Voltage;
VH[V] = VREF[V] x (R2//RH) / (R1+R2//RH)[Ω]
Figure 49. Hall Input Application
(1) Reducing the Noise of Hall Signal
Vcc noise or the like depending on the wiring pattern of board may affect Hall element. In this case, place a
capacitor like C1 in Figure 49. In addition, when wiring from the hall element output to IC hall input is long, noise
may be induced on wiring. In this case, place a capacitor like C2.
8. High-speed detection protection
High-speed detection protection begin lock protection action when it detects that the hall input signal is in an abnormal
state (more than Typ 2.5kHz). Noise may be induced on wiring. In this case, place a capacitor like C2 in Figure 49.
www.rohm.com
© 2015 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
.
20/27
TSZ02201-0H1H0B101290-1-2
Jun.19.2015 Rev. 001
BD61243FV
Safety Measure
1. Reverse Connection Protection Diode
Reverse connection of power results in IC destruction as shown in Figure 50. When reverse connection is possible,
reverse connection protection diode must be added between power supply and V CC.
After reverse connection
In normal energization
Reverse power connection
Vcc
Vcc
I/O
Circuit
Vcc
I/O
Circuit
Block
Circuit
Block
GND
I/O
Block
GND
Internal circuit impedance is high
Amperage small
HALL
BIAS
destruction prevention
GND
Large current flows
Thermal destruction
No destruction
Figure 50. Flow of Current When Power is Connected Reversely
2. Protection against VCC Voltage Rise by Back Electromotive Force
Back electromotive force (Back EMF) generates regenerative current to power supply. However, when reverse
connection protection diode is connected, VCC voltage rises because the diode prevents current flow to power supply.
ON
Phase
Switching
ON
ON
ON
Figure 51. VCC Voltage Rise by Back Electromotive Force
When the absolute maximum rated voltage may be exceeded due to voltage rise by back electromotive force, place
(A) Capacitor or (B) Zener diode between VCC and GND. If necessary, add both (C).
(A) Capacitor
(B) Zenner diode
ON
(C) Capacitor & Zenner diode
ON
ON
ON
ON
ON
Figure 52. Measure against VCC and Motor Driving Outputs Voltage
3. Problem of GND line PWM Switching
Do not perform PWM switching of GND line because GND terminal potential cannot be kept to a minimum.
4. Protection of Rotation Speed Pulse (FG) Open-Drain Output
FG output is an open drain and requires pull-up resistor. Adding resistor can protect the IC. Exceeding the absolute
maximum rating, when FG terminal is directly connected to power supply, could damage the IC.
Motor Unit
VCC
Motor
Controller
Driver
Driver
M
FG
Protection
Resistor
Pull-up
Resistor
SIG
Connector
GND
PWM Input
Prohibit
Figure 53. GND Line PWM Switching Prohibited
www.rohm.com
© 2015 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
Figure 54. Protection of FG Terminal
.
21/27
TSZ02201-0H1H0B101290-1-2
Jun.19.2015 Rev. 001
BD61243FV
Power Consumption
1. Current Pathway
The current pathways that relates to driver IC are the following, and shown in Figure 55.
(1) Circuit Current (ICC)
(2) Motor Current (IM)
(3) Reference Bias Current to the Resistors (IREF)
(4) FG Output Sink Current (IFG)
SIG
IFG
1
FG
SIGNAL
OUTPUT
OSC
TSD
GND
14
to 1kΩ
2
H-
SSW 13
H
3
1kΩ
to 100kΩ
COMP
+
H+
ZPER
CONTROL
LOGIC
SLOPE
4
MIN 11
INSIDE
REG
PWM
5
6
PWM
FILTER
12
IREF
PREDRIVER
REFERENCE
OUT2
REF
10
ICC
VCC 9
1μF to
7
1kΩ
to 100kΩ
RNF
OUT1
＋
IM
8
0.22Ω to
M
－
Figure 55. Current Pathway of IC
2. Calculation of Power Consumption
(1) Circuit Current (ICC)
PW1[W] = VCC[V] x ICC[A] (Icc current doesn’t include IM, IREF)
(ex.) Vcc = 11.3[V], Icc = 4.5[mA]
PW1[W] = 11.3[V] x 4.5[mA] = 50.85 [mW]
(2) Motor Driving Current (IM)
VOH is the output saturation voltage of OUT1 or OUT2 high side, VOL is the other low side voltage,
PW2[W] = (VOH[V] + VOL[V]) x IM[A]
(ex.) VOH = 0.10[V], VOL = 0.10[V], IM = 200[mA]
PW2[W] = (0.10[V] + 0.10[V]) x 200[mA] = 40.0[mW]
(3) Reference Bias Current to the LPF and Resistors (IREF)
PW3[W] = (VCC[V] – VREF[V]) x IREF[A]
(ex.) IREF = 6.0[mA]
PW3[W] = (11.3[V] – 3.3[V]) x 6.0[mA] = 48.0[mW]
(4) FG(AL) Output Sink Current (IFG)
PW4[W] = VFG[V] x IFG[A]
(ex.) VFG = 0.10[V], IFG = 5.0[mA]
PW4[W] = 0.10[V] x 5.0[mA] = 0.5[mW]
Total power consumption of driver IC becomes the following by the above (1) to (4).
PWttl[W] = PW1[W] + PW2[W] + PW3[W] + PW4[W]
(ex.) PWttl[W] = 50.85[mW] + 40.0[mW] + 48.0[mW] + 0.5[mW] = 139.35[mW]
Refer to next page, when you calculate the chip surface temperature (Tj) and the package surface temperature (Tc) by
using the power consumption value.
www.rohm.com
© 2015 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
.
22/27
TSZ02201-0H1H0B101290-1-2
Jun.19.2015 Rev. 001
BD61243FV
Power Dissipation
1. Power Dissipation
Power dissipation (total loss) indicates the power that can be consumed by IC at Ta=25°C (normal temperature). IC is
heated when it consumes power, and the temperature of IC chip becomes higher than ambient temperature. The
temperature that can be accepted by IC chip into the package, that is junction temperature of the absolute maximum
rating, depends on circuit configuration, manufacturing process, etc. Power dissipation is determined by this maximum
joint temperature, the thermal resistance in the state of the substrate mounting, and the ambient temperature.
Therefore, when a power dissipation that provides by the absolute maximum rating is exceeded, the operating
temperature range is not a guarantee. The maximum junction temperature is in general equal to the maximum value in
the storage temperature range.
HALL
BIAS
θja = (Tj – Ta) / P [°C/W]
2. Thermal Resistance
Heat generated by consumed power of IC is radiated from the mold resin or lead frame of package. The parameter
which indicates this heat dissipation capability (hardness of heat release) is called thermal resistance. In the state of
the substrate mounting, thermal resistances from the chip junction to the ambience and to the package surface are
shown respectively with θja[°C/W] and θjc[°C/W]. Thermal resistance is classified into the package part and the
substrate part, and thermal resistance in the package part depends on the composition materials such as the mold
resins and the lead frames. On the other hand, thermal resistance in the substrate part depends on the substrate heat
dissipation capability of the material, the size, and the copper foil area etc. Therefore, thermal resistance can be
decreased by the heat radiation measures like installing a heat sink etc. in the mounting substrate.
The thermal resistance model and calculations are shown in Figure 56.
θjc = 36 [°C/W] (Reference Value)
Pd[W]
θja = (Tj – Ta) / P [°C/W]
θjc = (Tj – Tc) / P [°C/W]
0.87
0.75
Ambient temperature Ta[°C]
Package surface temperature Tc[°C]
θja=142.9 [°C/W]
0.50
0.25
105
0
Chip surface temperature Tj[°C]
Power consumption P[W]
25
50
75
100
125
150
Ta[°C]
(Note)Reduce Reduce by 7.0mW/°C when operating over Ta=25°C
(Mounted on 70.0mm x 70.0mm x 1.6mm glass epoxy board)
Figure 56. Thermal Resistance Model of Surface Mount
Figure 57. Power Dissipation vs Ambient Temperature
(70.0mm x 70.0mm x 1.6mm glass epoxy substrate)
I/O Equivalence Circuit (Resistance Values are Typical)
1. Power supply terminal,
Ground terminal
2. PWM input duty
terminal
3. Hall +/- input
terminal
4. I/O duty slope setting terminal,
Minimum output duty setting
terminal, Recirculate period setting
INSIDE
REG
VCC
terminal and Soft switching
setting terminal
INSIDE
REG
200kΩ
H+
H–
PWM
1kΩ
GND
5. Reference voltage
output terminal
6. Motor output terminal 1/2,
Output current detecting
resistor connecting terminal
VCC
7. Speed pulse signal
output terminal
SLOPE
MIN
ZPER
SSW
VCC
REF
OUT1
OUT2
FG
RNF
www.rohm.com
© 2015 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
.
23/27
TSZ02201-0H1H0B101290-1-2
Jun.19.2015 Rev. 001
BD61243FV
Operational Notes
1.
Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power
supply pins.
2.
Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Furthermore, connect a capacitor to ground at
all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic
capacitors.
3.
Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.
However, pins that drive inductive loads (e.g. motor driver outputs, DC-DC converter outputs) may inevitably go
below ground due to back EMF or electromotive force. In such cases, the user should make sure that such voltages
going below ground will not cause the IC and the system to malfunction by examining carefully all relevant factors
and conditions such as motor characteristics, supply voltage, operating frequency and PCB wiring to name a few.
4.
Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5.
Thermal Consideration
Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in
deterioration of the properties of the chip. In case of exceeding this absolute maximum rating, increase the board size
and copper area to prevent exceeding the Pd rating.
6.
Recommended Operating Conditions
These conditions represent a range within which the expected characteristics of the IC can be approximately
obtained. The electrical characteristics are guaranteed under the conditions of each parameter.
7.
Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may
flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power
supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring,
and routing of connections.
8.
Operation Under Strong Electromagnetic Field
Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.
9.
Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may
subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply
should always be turned off completely before connecting or removing it from the test setup during the inspection
process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during
transport and storage.
www.rohm.com
© 2015 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
.
24/27
TSZ02201-0H1H0B101290-1-2
Jun.19.2015 Rev. 001
BD61243FV
Operational Notes – continued
10. Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment)
and unintentional solder bridge deposited in between pins during assembly to name a few.
11. Unused Input Pins
Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and
extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small
charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and
cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the
power supply or ground line.
12. Regarding the Input Pin of the IC
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them
isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a
parasitic diode or transistor. For example (refer to figure below):
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should
be avoided.
Resistor
Transistor (NPN)
Pin A
Pin B
C
E
Pin A
N
P+
P
N
N
P+
N
Parasitic
Elements
N
P+
N P
N
P+
B
N
C
E
Parasitic
Elements
P Substrate
P Substrate
Parasitic
Elements
Pin B
B
GND
Parasitic
Elements
GND
GND
N Region
close-by
GND
Figure 58. Example of monolithic IC structure
13. Ceramic Capacitor
When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with
temperature and the decrease in nominal capacitance due to DC bias and others.
14. Area of Safe Operation (ASO)
Operate the IC such that the output voltage, output current, and power dissipation are all within the Area of Safe
Operation (ASO).
15. Thermal Shutdown (TSD) Circuit
This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always
be within the IC’s power dissipation rating. If however the rating is exceeded for a continued period, the junction
temperature will rise which will activate the TSD circuit that will turn OFF all output pins. When the junction
temperature falls below the TSD threshold, the circuits are automatically restored to normal operation.
Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no
circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from
heat damage.
www.rohm.com
© 2015 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
.
25/27
TSZ02201-0H1H0B101290-1-2
Jun.19.2015 Rev. 001
BD61243FV
Physical Dimension, Tape and Reel Information
Package Name
www.rohm.com
© 2015 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
SSOP-B14
.
26/27
TSZ02201-0H1H0B101290-1-2
Jun.19.2015 Rev. 001
BD61243FV
Ordering Information
B
D
6
1
2
Part Number
4
3
F
V
-
GE 2
Packaging and forming specification
･G: Halogen free
･E2: Embossed tape and reel
Package
･FV; SSOP-B14
Marking Diagram
SSOP-B14
(TOP VIEW)
6 1 2 4 3
Part Number
LOT Number
1PIN Mark
Revision History
Date
Revision
Jun.19.2015
001
Changes
New Release
www.rohm.com
© 2015 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
.
27/27
TSZ02201-0H1H0B101290-1-2
Jun.19.2015 Rev. 001
Datasheet
Notice
Precaution on using ROHM Products
1.
Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
(Note 1)
, transport
intend to use our Products in devices requiring extremely high reliability (such as medical equipment
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅣ
CLASSⅢ
2.
ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3.
Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4.
The Products are not subject to radiation-proof design.
5.
Please verify and confirm characteristics of the final or mounted products in using the Products.
6.
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7.
De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual
ambient temperature.
8.
Confirm that operation temperature is within the specified range described in the product specification.
9.
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1.
When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2.
In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PGA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.001
Datasheet
Precautions Regarding Application Examples and External Circuits
1.
If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2.
You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1.
Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2.
Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3.
Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4.
Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
QR code printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1.
All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
2.
ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3.
No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1.
This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2.
The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3.
In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4.
The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice-PGA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.001
Datasheet
General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3.
The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or
concerning such information.
Notice – WE
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.001
Datasheet
BD61243FV - Web Page
Buy
Distribution Inventory
Part Number
Package
Unit Quantity
Minimum Package Quantity
Packing Type
Constitution Materials List
RoHS
BD61243FV
SSOP-B14
2500
2500
Taping
inquiry
Yes