Diodes DMN1025UFDB Dual n-channel enhancement mode mosfet Datasheet

DMN1025UFDB
DUAL N-CHANNEL ENHANCEMENT MODE MOSFET
Product Summary
Features
Device
V(BR)DSS
RDS(ON) max
ID MAX
TA = +25°C
N-Channel
12V
25mΩ @ VGS = 4.5V
30mΩ @ VGS = 2.5V
38mΩ @ VGS = 1.8V
6.9A
6.3A
5.5A







Low On-Resistance
Low Input Capacitance
Low Profile, 0.6mm Max Height
ESD protected gate.
Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
Halogen and Antimony Free. “Green” Device (Note 3)
Qualified to AEC-Q101 Standards for High Reliability
Description
This MOSFET has been designed to minimize the on-state resistance
(RDS(on)) and yet maintain superior switching performance, making it
ideal for high efficiency power management applications.
Applications



Mechanical Data




Load Switch
Power Management Functions
Portable Power Adaptors


Case: U-DFN2020-6 Type B
Case Material: Molded Plastic, “Green” Molding Compound.
UL Flammability Classification Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020
Terminals: Finish NiPdAu over Copper leadframe. Solderable per
MIL-STD-202, Method 208 e4
Terminals Connections: See Diagram Below
Weight: 0.0065 grams (approximate)
D2
D1
U-DFN2020-6
Type B
S2
G2
D2
D1
D1
D2
G1
ESD PROTECTED
G2
G1
Gate Protection
Diode
S1
Gate Protection
Diode
S1
S2
Pin1
N-CHANNEL MOSFET
N-CHANNEL MOSFET
Internal Schematic
Bottom View
Ordering Information (Note 4)
Part Number
DMN1025UFDB-7
DMN1025UFDB-13
Notes:
Case
U-DFN2020-6 Type B
U-DFN2020-6 Type B
Packaging
3000/Tape & Reel
10000/Tape & Reel
1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.
2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green"
and Lead-free.
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and
<1000ppm antimony compounds.
4. For packaging details, go to our website at http://www.diodes.com/quality/product_compliance_definitions/.
Marking Information
Date Code Key
Year
Code
Month
Code
2012
Z
Jan
1
2013
A
Feb
2
DMN1025UFDB
Document number: DS36668 Rev. 2 - 2
Mar
3
NB = Product Type Marking Code
YM = Date Code Marking
Y = Year (ex: A = 2013)
M = Month (ex: 9 = September)
YM
NB
2014
B
Apr
4
May
5
2015
C
Jun
6
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2016
D
Jul
7
Aug
8
2017
E
Sep
9
Oct
O
2018
F
Nov
N
Dec
D
April 2014
© Diodes Incorporated
DMN1025UFDB
Maximum Ratings (@TA = +25°C, unless otherwise specified.)
Characteristic
Symbol
VDSS
VGSS
Drain-Source Voltage
Gate-Source Voltage
Continuous Drain Current (Note 5) VGS = 4.5V
Steady
State
t < 5s
TA = +25°C
TA = +70°C
TA = +25°C
TA = +70°C
Value
12
±10
6.9
5.5
ID
A
8.8
7.0
1
35
9.8
4.8
ID
Maximum Continuous Body Diode Forward Current (Note 5)
Pulsed Drain Current (10μs pulse, duty cycle = 1%)
Avalanche Current (Note 6) L = 0.1mH
Avalanche Energy (Note 6) L = 0.1mH
Units
V
V
IS
IDM
IAS
EAS
A
A
A
A
mJ
Thermal Characteristics
Characteristic
Symbol
Steady State
t < 5s
Steady State
t < 5s
Total Power Dissipation (Note 5)
Thermal Resistance, Junction to Ambient (Note 5)
Thermal Resistance, Junction to Case (Note 5)
Operating and Storage Temperature Range
Value
1.7
2.9
71
43
13
-55 to 150
PD
RθJA
RθJC
TJ, TSTG
Units
W
°C/W
°C
Electrical Characteristics N-CHANNEL (@TA = +25°C, unless otherwise specified.)
Characteristic
OFF CHARACTERISTICS (Note 7)
Drain-Source Breakdown Voltage
Zero Gate Voltage Drain Current TJ = +25°C
Gate-Source Leakage
ON CHARACTERISTICS (Note 7)
Gate Threshold Voltage
Symbol
Min
Typ
Max
Unit
BVDSS
IDSS
IGSS
12
—
—
—
—
—
—
1.0
±10
V
μA
μA
VGS = 0V, ID = 250μA
VDS = 12V, VGS = 0V
VGS = ±8V, VDS = 0V
VGS(th)
RDS (ON)
—
18
20
25
0.7
1
25
30
38
1.2
V
Static Drain-Source On-Resistance
0.4
—
—
—
—
mΩ
VDS = VGS, ID = 250μA
VGS = 4.5V, ID = 5.2A
VGS = 2.5V, ID = 4.8A
VGS = 1.8V, ID = 2.5A
VGS = 0V, IS = 5.4A
—
—
—
—
—
—
—
—
—
—
—
—
—
—
917
120
102
11.4
12.6
23.1
1.3
1.6
3.0
9.3
17.2
2.8
6.8
1.1
—
—
—
—
—
—
—
—
—
—
—
—
—
—
pF
pF
pF
Ω
nC
nC
nC
nC
ns
ns
ns
ns
nS
nC
Diode Forward Voltage
DYNAMIC CHARACTERISTICS (Note 8)
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Gate Resistance
Total Gate Charge (VGS = 4.5V)
Total Gate Charge (VGS = 8V)
Gate-Source Charge
Gate-Drain Charge
Turn-On Delay Time
Turn-On Rise Time
Turn-Off Delay Time
Turn-Off Fall Time
Body Diode Reverse Recovery Time
Body Diode Reverse Recovery Charge
Notes:
VSD
Ciss
Coss
Crss
Rg
Qg
Qgs
Qgd
tD(on)
tr
tD(off)
tf
trr
Qrr
V
Test Condition
VDS = 6V, VGS = 0V,
f = 1.0MHz
VDS = 0V, VGS = 0V, f = 1MHz
VDS = 10V, ID = 6.8A
VDD = 6V, VGS = 4.5V,
RL = 1.1Ω, RG = 1Ω
IS = 5.4A, dI/dt = 100A/μs
IS = 5.4A, dI/dt = 100A/μs
5. Device mounted on FR-4 substrate PC board, 2oz copper, with 1inch square copper plate.
6. IAS and EAS rating are based on low frequency and duty cycles to keep TJ = +25°C
7. Short duration pulse test used to minimize self-heating effect.
8. Guaranteed by design. Not subject to product testing.
DMN1025UFDB
Document number: DS36668 Rev. 2 - 2
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© Diodes Incorporated
DMN1025UFDB
15.0
15
VDS = 5.0V
VGS = 10V
VGS = 4.5V
VGS = 3.0V
12.0
12
ID , DRAIN CURRENT (A)
ID, DRAIN CURRENT (A)
VGS = 2.5V
VGS = 2.0V
9.0
VGS = 1.8V
VGS = 1.2V
6.0
9
TA = 125°C
VGS = 1.0V
3.0
TA = 150°C
6
TA = 85°C
3
TA = 25°C
TA = -55°C
0.0
0
0.5
1
1.5
2
2.5
VDS, DRAIN-SOURCE VOLTAGE (V)
Figure 1 Typical Output Characteristic
0
3
0.3
0.6
0.9
1.2
VGS, GATE-SOURCE VOLTAGE (V)
Figure 2 Typical Transfer Characteristics
1.5
0.025
RDS(ON), DRAIN-SOURCE ON-RESISTANCE ()
0.1
ID = 5.2A
0.08
VGS = 1.8V
0.06
VGS = 2.5V
0.02
VGS = 4.5V
0.04
0.015
0.02
0.01
0
0.03
2
4
6
8
10
12
14
ID, DRAIN-SOURCE CURRENT (A)
Figure 3 Typical On-Resistance vs.
Drain Current and Gate Voltage
16
ID = 2.5A
0
0
2
4
6
8
VGS, GATE-SOURCE VOLTAGE (V)
Figure 4 Typical Transfer Characteristic
TA = 150°C
0.025
TA = 125°C
T A = 85°C
0.02
T A = 25°C
0.015
T A = -55°C
0.01
0
3
6
9
12
ID, DRAIN CURRENT (A)
Figure 5 Typical On-Resistance vs.
Drain Current and Temperature
DMN1025UFDB
Document number: DS36668 Rev. 2 - 2
10
1.8
VGS = 4.5V
RDS(ON), DRAIN-SOURCE
ON-RESISTANCE (NORMALIZED)
RDS(ON), DRAIN-SOURCE ON-RESISTANCE ()
RDS(ON), DRAIN-SOURCE ON-RESISTANCE ()
0.03
0
15
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VGS = 2.5V
ID = 4.8A
1.6
VGS = 1.8 V
ID = 2.5A
1.4
1.2
VGS = 4.5V
ID = 5.2A
1
0.8
0.6
-50
-25
0
25
50
75 100 125 150
TJ, JUNCTION TEMPERATURE (C)
Figure 6 On-Resistance Variation with Temperature
April 2014
© Diodes Incorporated
DMN1025UFDB
1
VGS(th), GATE THRESHOLD VOLTAGE (V)
RDS(ON), DRAIN-SOURCE ON-RESISTANCE ()
0.04
0.035
VGS = 1.8V
ID = 2.5A
0.03
VGS = 2.5V
ID = 4.8A
0.025
VGS = 4.5V
ID = 5A
0.02
0.015
0.8
0.6
ID = 250µA
0.4
0.2
0
-50
0.01
-50
-25
0
25
50
75 100 125 150
TJ, JUNCTION TEMPERATURE (C)
Figure 8 Gate Threshold Variation vs. Ambient Temperature
15
1000
12
100
-ID, DRAIN CURRENT (A)
IS, SOURCE CURRENT (A)
-25
0
25
50
75 100 125 150
TJ, JUNCTION TEMPERATURE (C)
Figure 7 On-Resistance Variation with Temperature
TA = 150°C
9
TA = 125°C
T A = 85°C
6
TA = 25°C
3
0
RDS(on)
Limited
10
DC
1
0.1
T A = -55°C
0
ID = 1mA
PW = 10s
PW = 1s
PW = 100ms
PW = 10ms
PW = 1ms
TJ(max) = 150°C
TA = 25°C
PW = 100µs
VGS = 4.5V
Single Pulse
DUT on 1 * MRP Board
0.01
0.1
0.3
0.6
0.9
1.2
1.5
VSD, SOURCE-DRAIN VOLTAGE (V)
Figure 9 Diode Forward Voltage vs. Current
1
10
-VDS, DRAIN-SOURCE VOLTAGE (V)
Figure 10 SOA, Safe Operation Area
100
r(t), TRANSIENT THERMAL RESISTANCE
1
D = 0.7
D = 0.5
D = 0.3
0.1
D = 0.1
D = 0.9
D = 0.05
D = 0.02
0.01
D = 0.01
D = 0.005
RJA(t) = r(t) * RJA
RJA = 178°C/W
Duty Cycle, D = t1/ t2
Single Pulse
0.001
0.00001
DMN1025UFDB
Document number: DS36668 Rev. 2 - 2
0.0001
0.001
0.01
0.1
1
t1, PULSE DURATION TIMES (sec)
Figure 11 Transient Thermal Resistance
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10
100
1000
April 2014
© Diodes Incorporated
DMN1025UFDB
Package Outline Dimensions
Please see AP02002 at http://www.diodes.com/datasheets/ap02002.pdf for latest version.
A
U-DFN2020-6
Type B
Dim
Min
Max
Typ
A
0.545 0.605 0.575
A1
0
0.05 0.02
A3
0.13


b
0.20 0.30 0.25
D
1.95 2.075 2.00
d
0.45


D2
0.50 0.70 0.60
e
0.65


E
1.95 2.075 2.00
E2
0.90 1.10 1.00
f
0.15


L
0.25 0.35 0.30
z

 0.225
All Dimensions in mm
A3
SEATING PLANE
A1
D
Pin#1 ID
D2
z
d
E
E2
f
f
L
e
b
Suggested Pad Layout
Please see AP02001 at http://www.diodes.com/datasheets/ap02001.pdf for the latest version.
C
Y
G
X2
G1
X1
G
Z
DMN1025UFDB
Document number: DS36668 Rev. 2 - 2
Y1
Dimensions Value (in mm)
Z
1.67
G
0.20
G1
0.40
X1
1.0
X2
0.45
Y
0.37
Y1
0.70
C
0.65
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DMN1025UFDB
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Copyright © 2014, Diodes Incorporated
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DMN1025UFDB
Document number: DS36668 Rev. 2 - 2
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