Hi-Flow® 300G September 2008 PRODUCT DESCRIPTION Fiberglass-Reinforced, Phase Change Thermal Interface Material FEATURES AND BENEFITS • Thermal impedance: 0.20°C-in2/W (@25 psi) • Will not drip or run like grease •P hase change compound coated on a fiberglass carrier PROPERTY TYPICAL PROPERTIES OF HI-FLOW 300G IMPERIAL VALUE METRIC VALUE TEST METHOD Green Green Visual Reinforcement Carrier Fiberglass Fiberglass — Thickness (inch) / (mm) 0.005 0.127 ASTM D374 Elongation (%45° to Warp and Fill) 40 40 ASTM D882A Tensile Strength (psi) / (MPa) 400 3 ASTM D882A Continuous Use Temp (°F) / (°C) 212 100 — Phase Change Temp (°F) / (°C) 131 55 ASTM 3418 Dielectric Breakdown Voltage (Vac) 300 300 ASTM D149 Dielectric Constant (1000 Hz) 3.5 3.5 ASTM D150 Volume Resistivity (Ohm-meter) 10 10 ASTM D257 Flame Rating V-O V-O U.L. 94 1.6 1.6 ASTM D5470 Color ELECTRICAL 8 8 THERMAL Thermal Conductivity (W/m-K) (1) THERMAL PERFORMANCE vs PRESSURE Pressure (psi) Hi-Flow 300G consists of a thermally conductive 55°C phase change compound coated on a fiberglass web. Hi-Flow® 300G is designed as a thermal interface material between a computer processor and a heat sink. ® Above the phase change temperature, Hi-Flow® 300G wets-out the thermal interface surfaces and flows to produce low thermal impedance.The material requires pressure of the assembly to cause flow. Hi-Flow® 300G will not drip or run like grease. TYPICAL APPLICATIONS INCLUDE • Computer and peripherals • As a thermal interface where bare die is exposed and needs to be heat sinked CONFIGURATIONS AVAILABLE • Sheet form, die-cut parts and roll form 10 25 50 100 200 TO-220 Thermal Performance (°C/W) 0.96 0.92 0.88 0.85 0.84 Thermal Impedance (°C-in2/W) (2) 0.27 0.20 0.16 0.15 0.14 1) This is the measured thermal conductivity of the Hi-Flow coating. It represents one conducting layer in a three-layer laminate.The Hi-Flow coatings are phase change compounds.These layers will respond to heat and pressure induced stresses.The overall conductivity of the material in post-phase change, thin film products is highly dependent upon the heat and pressure applied.This characteristic is not accounted for in ASTM D5470. Please contact Bergquist Product Management if additional specifications are required. 2) The ASTM D5470 test fixture was used and the test sample was conditioned at 70°C prior to test.The recorded value includes interfacial thermal resistance.These values are provided for reference only. Actual application performance is directly related to the surface roughness, flatness and pressure applied. Application Methods: 1. Hand-apply to 40°- 50°C heat sink.The heat sink is heated in an oven or by a heat gun to between 40°- 50°C allowing the Hi-Flow® 300G pad to be applied like an adhesive pad.The heat sink is then cooled to room temperature and packaged. 2. Hand-apply to 20°- 35°C heat sink. Hi-Flow® 300G can be applied to a room temperature heat sink with the assistance of a foam roller.The pad is positioned on the heat sink and a hand roller is used to apply pressure of 30 psi. 3. Automated equipment with 30 psi pressure. A pick-and-place automated dispensing unit can be used to apply Hi-Flow® 300G to a room temperature heat sink.The placement head should have a soft silicone rubber pad, and apply 30 psi pressure to the pad on transfer to the 20°- 35°C heat sink. • With or without pressure sensitive adhesive. Note: To build a part number, visit our website at www.bergquistcompany.com. PDS_HF_300G_September 2008 TDS Hi-Flow® 300G, September 2008 Disclaimer Note: The information provided in this Technical Data Sheet (TDS) including the recommendations for use and application of the product are based on our knowledge and experience of the product as at the date of this TDS. The product can have a variety of different applications as well as differing application and working conditions in your environment that are beyond our control. Henkel is, therefore, not liable for the suitability of our product for the production processes and conditions in respect of which you use them, as well as the intended applications and results. We strongly recommend that you carry out your own prior trials to confirm such suitability of our product. Any liability in respect of the information in the Technical Data Sheet or any other written or oral recommendation(s) regarding the concerned product is excluded, except if otherwise explicitly agreed and except in relation to death or personal injury caused by our negligence and any liability under any applicable mandatory product liability law. In case products are delivered by Henkel Belgium NV, Henkel Electronic Materials NV, Henkel Nederland BV, Henkel Technologies France SAS and Henkel France SA please additionally note the following: In case Henkel would be nevertheless held liable, on whatever legal ground, Henkel’s liability will in no event exceed the amount of the concerned delivery. In case products are delivered by Henkel Colombiana, S.A.S. the following disclaimer is applicable: The information provided in this Technical Data Sheet (TDS) including the recommendations for use and application of the product are based on our knowledge and experience of the product as at the date of this TDS. Henkel is, therefore, not liable for the suitability of our product for the production processes and conditions in respect of which you use them, as well as the intended applications and results. We strongly recommend that you carry out your own prior trials to confirm such suitability of our product. Any liability in respect of the information in the Technical Data Sheet or any other written or oral recommendation(s) regarding the concerned product is excluded, except if otherwise explicitly agreed and except in relation to death or personal injury caused by our negligence and any liability under any applicable mandatory product liability law. In case products are delivered by Henkel Corporation, Resin Technology Group, Inc., or Henkel Canada Corporation, the following disclaimer is applicable: The data contained herein are furnished for information only and are believed to be reliable. We cannot assume responsibility for the results obtained by others over whose methods we have no control. It is the user’s responsibility to determine suitability for the user’s purpose of any production methods mentioned herein and to adopt such precautions as may be advisable for the protection of property and of persons against any hazards that may be involved in the handling and use thereof. In light of the foregoing, Henkel Corporation specifically disclaims all warranties expressed or implied, including warranties of merchantability or fitness for a particular purpose, arising from sale or use of Henkel Corporation’s products. Henkel Corporation specifically disclaims any liability for consequential or incidental damages of any kind, including lost profits. The discussion herein of various processes or compositions is not to be interpreted as representation that they are free from domination of patents owned by others or as a license under any Henkel Corporation patents that may cover such processes or compositions. We recommend that each prospective user test his proposed application before repetitive use, using this data as a guide. This product may be covered by one or more United States or foreign patents or patent applications. 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