NTC SMD Thermistors NC 12 – NC 20 Chip thermistors are a high quality and low cost device especially developed for surface mounting applications. They are widely used for temperature compensation but can also achieve temperature control of printed circuits. Its silver - palladium - platinum metallization provides a high degree of resistance to dewetting of the terminations during soldering (typically 260°C / 30 s). NC 12 IEC SIZE : 0805 Types NC 20 IEC SIZE : 1206 3.2 (.126) ± 0.4 (.016) 2 (.079) ± 0.3 (.012) DIMENSIONS: millimeters (inches) 1.6 (.063) ± 0.25 (.010) 1.25 (.049) ± 0.2 (.008) 0.5 (.020) ... 1.5 (.059) 0.5 (.020) ... 1.3 (.051) 0.2 (.008) min 0.2 (.008) min 0.2 (.008) min Terminations 0.2 (.008) min Silver – palladium – platinum metallization Marking On packaging only Climatic category 40/125/56 Operating temperature -55°C to +150°C Tolerance on Rn (25°C) ±5%, ±10%, ±20% Maximum dissipation at 25°C Thermal dissipation factor Thermal time constant 0.12 W 0.24 W 2 mW/°C 4 mW/°C 5s 7s Resistance - Temperature characteristics: pages 36 to 40. APPLICATIONS • • • • • • • • • LCD compensation Battery packs Mobile phones CD players Heating systems Air-conditioning systems Temperature control of Switch Mode Power Supplies Compensation of pressure sensors Protection of power transistors in various electronic circuits HOW TO ORDER 10 NC 20 K0 0103 M BA Type Material Code K (See tables pages 11, 36-40) Resistance 10,000 Ω Tolerance M (±20%) J (±5%) K (±10%) Suffix: Packaging – –: Bulk BA: Plastic tape (180mm diam. reel) BE: Plastic tape (1/2 reel) BC: Plastic tape (330mm diam. reel) BB: Cardboard tape (180mm diam. reel) BF: Cardboard tape (1/2 reel) BD: Cardboard tape (330mm diam. reel) NTC SMD Thermistors NC 12 – NC 20 TABLE OF VALUES NC 20 IEC SIZE : 1206 NC 12 IEC SIZE : 0805 Types Rn at 25°C (Ω) NC 12 KC 0 180 NC 12 KC 0 220 NC 12 KC 0 270 NC 12 KC 0 330 NC 12 KC 0 390 NC 12 KC 0 470 NC 12 KC 0 560 NC 12 KC 0 680 NC 12 KC 0 820 NC 12 KC 0 101 NC 12 MC 0 121 NC 12 MC 0 151 NC 12 MC 0 181 NC 12 MC 0 221 NC 12 MC 0 271 NC 12 MC 0 331 NC 12 MC 0 391 NC 12 MC 0 471 NC 12 MC 0 561 NC 12 MC 0 681 NC 12 MC 0 821 NC 12 MC 0 102 NC 12 MC 0 122 NC 12 MC 0 152 NC 12 MC 0 182 NC 12 MC 0 222 NC 12 MC 0 272 NC 12 MC 0 332 NC 12 J 0 0332 NC 12 J 0 0392 NC 12 J 0 0472 NC 12 J 0 0562 NC 12 K 0 0682 NC 12 K 0 0822 NC 12 K 0 0103 NC 12 K 0 0123 NC 12 L 0 0153 NC 12 L 0 0183 NC 12 M 0 0223 NC 12 M 0 0273 NC 12 M 0 0333 NC 12 M 0 0393 NC 12 N 0 0473 NC 12 N 0 0563 NC 12 L 2 0683 NC 12 N 0 0823 NC 12 P 0 0104 NC 12 P 0 0124 NC 12 P 0 0154 NC 12 P 0 0184 NC 12 Q 0 0224 18 22 27 33 39 47 56 68 82 100 120 150 180 220 270 330 390 470 560 680 820 1,000 1,200 1,500 1,800 2,200 2,700 3,300 3,300 3,900 4,700 5,600 6,800 8,200 10,000 12,000 15,000 18,000 22,000 27,000 33,000 39,000 47,000 56,000 68,000 82,000 100,000 120,000 150,000 180,000 220,000 Material Code KC MC B (K) (B/B (1) ± 5% (2) ± 3% 3470 ± 5% 3910 ± 3% ) at 25°C (%/°C) – 3.9 – 4.4 J 3480 ± 3% – 3.9 K 3630 ± 3% – 4.0 L 3790 ± 3% – 4.2 M 3950 ± 3% – 4.4 N 4080 ± 3% – 4.6 L2 N 3805 ± 3% 4080 ± 3% – 4.1 – 4.6 P 4220 ± 3% – 4.7 Q 4300 ± 3% -4.7 Types Rn at 25°C (Ω) NC 20 KC 0 100 10 NC 20 KC 0 120 12 NC 20 KC 0 150 15 NC 20 KC 0 180 18 NC 20 KC 0 220 22 NC 20 KC 0 270 27 NC 20 KC 0 330 33 NC 20 KC 0 390 39 NC 20 KC 0 470 47 NC 20 KC 0 560 56 NC 20 KC 0 680 68 NC 20 KC 0 820 82 NC 20 KC 0 101 100 NC 20 MC 0 121 120 NC 20 MC 0 151 150 NC 20 MC 0 181 180 NC 20 MC 0 221 220 NC 20 MC 0 271 270 NC 20 MC 0 331 330 NC 20 MC 0 391 390 NC 20 MC 0 471 470 NC 20 MC 0 561 560 NC 20 MC 0 681 680 NC 20 MC 0 821 820 NC 20 MC 0 102 1,000 NC 20 MC 0 122 1,200 NC 20 MC 0 152 1,500 NC 20 I 0 0182 1,800 NC 20 I 0 0222 2,200 NC 20 I 0 0272 2,700 NC 20 I 0 0332 3,300 NC 20 J 0 0392 3,900 NC 20 J 0 0472 4,700 NC 20 J 0 0562 5,600 NC 20 J 0 0682 6,800 NC 20 K 0 0822 8,200 NC 20 K 0 0103 10,000 NC 20 K 0 0123 12,000 NC 20 K 0 0153 15,000 NC 20 L 0 0183 18,000 NC 20 L 0 0223 22,000 NC 20 M 0 0273 27,000 NC 20 M 0 0333 33,000 NC 20 M 0 0393 39,000 NC 20 M 0 0473 47,000 NC 20 N 0 0563 56,000 NC 20 N 0 0683 68,000 NC 20 N 0 0823 82,000 NC 20 N 0 0104 100,000 NC 20 P 0 0124 120,000 NC 20 P 0 0154 150,000 NC 20 P 0 0184 180,000 NC 20 P 0 0224 220,000 NC 20 Q 0 0274 270,000 NC 20 Q 0 0334 330,000 NC 20 Q 0 0394 390,000 NC 20 Q 0 0474 470,000 NC 20 R 0 0564 560,000 NC 20 R 0 0684 680,000 NC 20 R 0 0824 820,000 NC 20 R 0 0105 1,000,000 Material Code B (K) (B/B (1) ± 5% (2) ± 3% ) at 25°C (%/°C) KC 3470 ± 5% – 3.9 MC 3910 ± 3% – 4.4 I 3250 ± 5% – 3.7 J 3480 ± 3% – 3.9 K 3630 ± 3% – 4.0 L 3790 ± 3% – 4.2 M 3950 ± 3% – 4.4 N 4080 ± 3% – 4.6 P 4220 ± 3% – 4.7 Q 4300 ± 3% – 4.7 R 4400 ± 3% – 4.8 11 Packaging for Automatic Insertion NTC Chip Thermistors / NC/NB Series AUTOMATIC INSERTION 5.5 (.217) ±0.2 (.008) Max 3° 30µ ± 5µ T K Designation Tape width Tape thickness Pitch of the sprocket holes Diameter of the sprocket holes Symbol W T P0 D0 Distance Distance (center to center) Distance (center to center) Sizes of the NC 12 (0805) cavities E F P2 A0 B0 K Value 8 0.4 max. 4 1.5 -0 1.75 3.5 2 1.5 2.4 1.4 max. NC 20 (1206) A0 B0 K 1.95 3.55 1.5 max. A1 B1 B0 F R = 0.3 (.012) Max. The mechanical and dimensional reel characteristics are in accordance with the IEC publication 286-3. (.008) Hole 1 (.039) +0.2 -0 Cover Tape Max 3° Super 8 Plastic Tape Packaging: D0 P2 E P0 Max 3° Max 3° A0 Direction of unreeling Tolerance ±0.2 ±0.1 ±0.1 ±0.1 ±0.05 ±0.1 ±0.1 ±0.1 K ±0.1 (size is adjustable) (K = t1 +0.2) ±0.1 ±0.1 K ±0.1 (size is adjustable) (K = t1 +0.2) +0 ø180 (7.09) - 2 (.079) + 0.15 (.006) Reel ø 62 (2.44) ± 1.5 (.059) Direction of unreeling ø 12.75 (.502) - 0 Reel according to ISO/DIS 3639-2 8.4 (.331) 14.4 (.567) max. +0.15 (.006) + 0.5 (.020) ø 20.5 (.087) - 0 QUANTITY PER REEL Type NC - NB 12 NC 20 - NB 20 16 Suffix BA BE BA BE Qty Per Reel 4000 2000 3000 1500 W Upper side Bottom side Packaging for Automatic Insertion NTC Chip Thermistors / NC/NB Series AUTOMATIC INSERTION 8mm Paper Tape Packaging: 10 PITCHES CUMULATIVE TOLERANCE ON TAPE 0.20mm (0.008) P0 The mechanical and dimensional reel characteristics are in accordance with the IEC publication 286-3. BOTTOM COVER TAPE D0 T P2 E1 TOP COVER TAPE F W E2 B0 G T1 T1 Designation Symbol W T P0 Tape width Tape thickness Pitch of the sprocket holes Diameter of the sprocket holes Value 8 1.1 max. 4 1.5 -0/+0.1 1.75 3.5 2 0.10 max. 6.25 min. 0.75 min. 4 2 D0 Distance Distance (center to center) Distance (center to center) Cover tape thickness Distance Distance Component pitch 0805/0603 0402 CAVITY SIZE SEE NOTE 1 A0 CENTER LINES OF CAVITY E1 F P2 T1 E2 G P1 P1 User Direction of Feed Tolerance -.0.1/+0.3 ±0.1 ±0.1 ±0.1 ±0.05 ±0.05 ±0.1 ±0.1 +0 ø180 (7.09) - 2 (.079) + 0.15 (.006) Reel ø 62 (2.44) ± 1.5 (.059) Direction of unreeling ø 12.75 (.502) - 0 Reel according to ISO/DIS 3639-2 8.4 (.331) 14.4 (.567) max. +0.15 (.006) Upper side Bottom side + 0.5 (.020) ø 20.5 (.087) - 0 QUANTITY PER REEL Type NB - NC 12 NB 21 NB 23 Suffix BB BF BB BF Qty Per Reel 4000 2000 10000 5000 17 Surface Mounting Guide Chip Thermistor – Application Notes STORAGE Wave Good solderability is maintained for at least twelve months, provided the components are stored in their “as received” packaging at less than 40°C and 70% RH. 300 Preheat Solder Temp. SOLDERABILITY / LEACHING Terminations to be well soldered after immersion in a 60/40 tin/lead solder bath at 235 ± 5°C for 2 ± 1 seconds. Terminations will resist leaching for at least the immersion times and conditions recommendations shown below. P/N Termination Type AgPdPt Nickel Barrier NC NB Solder Tin/Lead 60/40 60/40 Solder Temp ºC 260 ± 5 260 ± 5 T 200 230ºC to 250ºC 150 100 50 0 Immersion Time Seconds 15 max 30 ± 1 NB products are compatible with a wide range of soldering conditions consistent with good manufacturing practice for surface mount components. This includes Pb free reflow processes with peak temperatures up to 270ºC. Recommended profiles for reflow and wave soldering are shown below for reference. NC products are recommended for lead soldering application or gluing techniques. Natural Cooling 250 1 to 2 min 3 sec. max (Preheat chips before soldering) T/maximum 150°C a) The visual standards used for evaluation of solder joints will need to be modified as lead free joints are not as bright as with tin-lead pastes and the fillet may not be as large. b) Resin color may darken slightly due to the increase in temperature required for the new pastes. c) Lead-free solder pastes do not allow the same self alignment as lead containing systems. Standard mounting pads are acceptable, but machine set up may need to be modified. Reflow 300 D2 RECOMMENDED SOLDERING PAD LAYOUT Natural Cooling Preheat Solder Temp. 250 200 D5 REFLOW SOLDERING 100 50 Case Size 0 1min 1min Temperature °C 0402 NB23 0603 NB21 0805 NB12 1206 NB20 D1 D2 D3 D4 D5 1.70 (.067) 2.30 (.091) 3.00 (.118) 4.00 (.157) 0.60 (.024) 0.80 (.031) 1.00 (.039) 1.00 (.039) 0.50 (.020) 0.70 (.028) 1.00 (.039) 2.00 (.079) 0.60 (.024) 0.80 (0.31) 1.00 (.039) 1.00 (.039) 0.50 (.020) 0.75 (.030) 1.25 (.049) 2.50 (.098) WAVE SOLDERING 50 100 150 • Pre-heating: 150°C ±15°C / 60-90s • Max. Peak Gradient: 2.5°C/s • Peak Temperature: 245°C ±5°C • Time at >230°C: 40s Max. 18 P/N 10 sec. max (Minimize soldering time) 300 250 200 150 100 50 0 0 D3 D4 Dimensions in mm (inches) 220ºC to 250ºC 150 D1 200 250 Time (s) 300 Case Size P/N 0603 NB21 0805 NB12 1206 NB20 D1 D2 D3 D4 D5 3.10 (.122) 4.00 (.157) 5.00 (.197) 1.20 (.047) 1.50 (.059) 1.50 (.059) 0.70 (.028) 1.00 (.039) 2.00 (.079) 1.20 (.047) 1.50 (.059) 1.50 (.059) 0.75 (.030) 1.25 (.049) 1.60 (.063)