Surface Mount Fuse (Thin Film Chip Fuse) Pb Document No TCT-060S001A Issued date 2014/02/25 Page 1/6 RoHS 1. Scope This specification applies for the fuse series of surface mount fuse made by TA-I. 2. Construction Termination Marking Sn Plating Over Coat Ceramic Substrate: Al2O3 Cu / Ni Plating Fuse Element: Cu/Sn 3. Type Designation CT 06 T V5 R50 2 Chip Fuse Rated Voltage Packaging Size V3:32VDC./32VAC. 06:0603(1608) T: Paper Tape (4K) Rated Current R50:0.50A V5:50VDC./32VAC. TA-I TECHNOLOGY CO., LTD Surface Mount Fuse (Thin Film Chip Fuse) Pb Document No TCT-060S001A Issued date 2014/02/25 Page 2/6 RoHS 4. Dimensions Unit: mm Dimensions (mm) Type (Size code) CT06 (0603) L W C d t 1.65±0.2 0.85±0.2 0.5±0.2 0.5±0.2 0.8±0.20 5. Marking Symbol for Rating Current Symbol Rating Current(A) B 0.2 C D 0.25 0.315 E F K L M P N S T 3 U W Y 0.4 0.5 0.8 1 1.25 1.5 1.6 2 2.5 3 3.15 4 5 TA-I TECHNOLOGY CO., LTD Surface Mount Fuse (Thin Film Chip Fuse) Pb Document No TCT-060S001A Issued date 2014/02/25 Page 3/6 RoHS 6. Applications and ratings Marking Rated Current CT06V5TR20 B 0.20A Resistance* (mΩ) Typical 3000 CT06V5TR25 C 0.25A 1500 CT06V5TR315 D 0.315A 750 CT06V5TR40 E 0.40A 496 CT06V5TR50 F 0.50A 343 CT06V5TR80 CT06V5T1R0 CT06V5T1R25 CT06V5T1R50 CT06V5T1R60 CT06V3T2R0 CT06V3T2R50 CT06V3T3R00 CT06V3T3R15 CT06V3T4R0 CT06V3T5R0 K L M P N S T 3 U W Y 0.80A 1.00A 1.25A 1.50A 1.60A 2.00A 2.50A 3.00A 3.15A 4.00A 5.00A 142 88 63 60 56 34 24.5 20 19 13 10 Part Designation Fusing Time Open within 2 min.at 200% rated current Rated Voltage Breaking Capacity 50V DC / 32V AC 50A 50V DC 32V AC 32V DC/AC 50A 32V DC/AC *Resistance was measured with less than 10% of rated current. 7.Pre-Arcing time Rated Current 1.25×In (Min) 2.0×In (Max) 10.0×In (Max) 0.2~5A(Type F) 1 hrs 120s 10ms Note: Pre-arcing time at 10 times rated current according to the following types: Type FF: less than 1ms Type F: from 1ms to 10ms Type T: greater than 10ms to 100ms Type TT: greater than 100ms to 1000ms TA-I TECHNOLOGY CO., LTD Surface Mount Fuse (Thin Film Chip Fuse) Pb RoHS Document No TCT-060S001A Issued date 2014/02/25 Page 4/6 8. Reliability Tests Parameter Requirement Test Method Reference Standard Carrying capacity No fusing Rated current ,4hr UL248-14 Fusing Time Within 2 minute 200% of its rated current IEC60127-4-9.2.1 Without permanent The rated voltage of the fuse and shall arcing、 Breaking capacity be maintained for 30 s after the fuse has operated. ignition、 bursting of fuse Insulation 0.1MΩ and Measure with DC twice the rated Resistance more voltage after breaking capacity IEC60127-1 IEC60127-4-9.3.1 IEC60127-4-9.3.3 Bending Test No mechanical damages Distance between holding points: 90mm, Bending:3mm,1time ,30sec IEC60115-1-4.33 Resistance to solder Heat ∣△ R∣＜20% 260℃±5℃,10±1second IEC60028-2-58 Solderability 95% coverage minimum 235℃±5℃, 2±0.2second (Solder : Sn96.5 / Ag3.0 / Cu0.5) IEC60028-2-58 Temperature Rise △ T<70℃ 125% of its rated current, Measure of surface temperature rise IEC60127-4-9.7 Resistance to Dry ∣△ R∣＜20% 155℃±5℃,96 hrs Heat No evident damages on 15 s with a piece of cloth soaked in Resistance to protective water and again for 15 s with a piece of Solvent coating and cloth soaked in petroleum spirit. marking Thermal Shock ∣△ R∣＜10% -55℃/+25℃/+155℃/+25℃, 10 cycles Humidity ∣△ R∣＜20% 40±2°C/90~95%RH,1000 hrs IEC60115-1-4.23.2 JIS C5201-1-4.23.2 IEC60127-1-6.2 MIL-STD 202-107G MIL-STD-202G Method 103B 9. Storage Conditions: Temperature: 5℃~35℃,Humidity:40%~75% 10. Shelf Life: 2 years from manufacturing date TA-I TECHNOLOGY CO., LTD Surface Mount Fuse (Thin Film Chip Fuse) Pb Document No TCT-060S001A Issued date 2014/02/25 Page 5/6 RoHS 11. Label F type(Pre-Arcing time) Date Code Rating current Type QTY: 5000 PCS F LOT NO: Maker's Name Rating current Customer Code T005F0005K 1005 R50 200% CT06V5T TA-I TECHNOLOGY CO.,LTD Lead Free 0603 50VDC/32VAC (T) F 0.5A 200% 36H00823-00M CT06V5TR50 13.09.12 Part Designation Date Customer Label 12. Recommended land patterns TA-I TECHNOLOGY CO., LTD Surface Mount Fuse (Thin Film Chip Fuse) Pb RoHS Document No TCT-060S001A Issued date 2014/02/25 Page 6/6 13. Recommend IR – Reflow profile : (solder : Sn96.5 / Ag3 / Cu0.5) Peak : 250 5 ℃ , 5 sec 0 Pre – heat Zone : 150 to 180 ℃, 90±30 sec Soldering Zone : 230℃ or higher , 30±10 sec 14. ECN Engineering Change Notice: The customer will be informed with ECN if there is significant modification on the characteristics and materials described in Approval Sheet. 15.Approvals IEC60127-1&IEC60127-4 15. Manufacturing Country & City : TA-I TECHNOLOGY CO., LTD. ( Taiwan– Tao Yuan ) TAIT : No.26, Lane 470, Nan-Shan Rd., Sec.2, Lu-Chu Hsiang,Taoyuan, Taiwan Tel: (+886) 3-3246169 Fax : (+886) 3-3246167 Associated companies : (1) TA-I TECHNOLOGY ( SU ZHOU ) CO., LTD. ( China – Su Zhou) No.675,Luxiang North Road,Songling Town, Wujiang, China (215200) Tel :(+86) 512-63457879 Fax : (+86) 512-63457869 (2) TA-I TECHNOLOGY ELECTRONIC (DONGGUAN ) CO., LTD. ( China –Dongguan ) Chang xie Road,shien-Ma shiang Changping Town, Dongguan City,Guangdong Tel : (+86) 769-8339-4790〜3 Fax : (+86) 769-8339-4794 (3) TAI OHM ELECTRONICS ( M ) SDN. BHD. ( Malaysia – Penang ) Plot 564-D ,Lorong Perusahaan Baru 2, Kawasan Perusahaan Perai, 13600 Perai, Penang, Malaysia. Tel :(+60) 4- 3900480 Fax : (+60) 4-3901481 (4) P.T.TAI ELECTRONIC Indonesia ( Indonesia – Jakarta ) Blok T1 E,F, Jl. Jababeka IV CikarangIndustrial Estate Bekasi, 17530 Indonesia Tel :(+62) 21-44820254 Fax : (+62) 21-44820256 TA-I TECHNOLOGY CO., LTD