bq2000 www.ti.com SLUS138D – JANUARY 2008 – REVISED DECEMBER 2009 Programmable Multi-Chemistry Fast-Charge Management IC Check for Samples: bq2000 FEATURES 1 • • • • • • • • Safe Management of Fast Charge for NiCd, NiMH, or Li-Ion Battery Packs High-Frequency Switching Controller for Efficient and Simple Charger Design Pre-Charge Qualification for Detecting Shorted, Damaged, or Overheated Cells Fast-Charge Termination by Peak Voltage (PVD) for Nickel chemistries, Minimum Current for Li-Ion chemistries, Maximum Temperature, and Maximum Charge Time Selectable Top-Off Mode for Achieving Maximum Capacity in NiMH Batteries Programmable Trickle-Charge Mode for Reviving Deeply Discharged Batteries and for Postcharge Maintenance Built-in Battery Removal and Insertion Detection Sleep Mode for Low Power Consumption APPLICATIONS • • • Multi-Chemistry Charger Nickel Charger High-Power, Multi-Cell Charger GENERAL DESCRIPTION The bq2000 is a programmable, monolithic IC for fast-charge management of nickel cadmium (NiCd), nickel metal-hydride (NiMH), or lithium-ion (Li-Ion) batteries in single- or multi-chemistry applications. The bq2000 chooses the proper battery chemistry (either nickel or lithium) and proceeds with the optimal charging and termination algorithms. This process eliminates undesirable, undercharged, or overcharged conditions, and allows accurate and safe termination of fast charge Depending on the chemistry, the bq2000 provides a number of charge termination criteria: • Peak voltage, PVD (for NiCd and NiMH) • Minimum charge current (for Li-Ion) • Maximum temperature • Maximum charge time For safety, the bq2000 inhibits fast charge until the battery voltage and temperature are within user-defined limits. If the battery voltage is below the low-voltage threshold, the bq2000 uses trickle-charge to condition the battery. For NiMH batteries, the bq2000 provides an optional top-off charge to maximize the battery capacity. The integrated high-speed comparator allows the bq2000 to be the basis for a complete, high-efficiency battery charger circuit for both nickel-based and lithium-based chemistries. 8-Pin DIP or Narrow SOIC or TSSOP spacer between para and illustration Pin Names SNS Current-sense input SNS 1 8 MOD VSS System ground VSS 2 7 VCC LED Charge-status output BAT Battery-voltage input LED 3 6 RC TS Temperature-sense input BAT 4 5 TS RC Timer-program input VCC Supply-voltage input MOD Modulation-control output 1 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2008–2009, Texas Instruments Incorporated bq2000 SLUS138D – JANUARY 2008 – REVISED DECEMBER 2009 www.ti.com These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. PIN DESCRIPTIONS SNS Current-sense input Enables the bq2000 to sense the battery current via the voltage developed on this pin by an external sense-resistor connected in series with the battery pack VSS System Ground Connect to the battery’s negative terminal LED Charge-status output Open-drain output that indicates the charging status by turning on, turning off, or flashing an external LED, driven through a resistor. BAT Battery-voltage input Battery-voltage sense input. A simple resistive divider, across the battery terminals, generates this input. TS Temperature-sense input Input for an external battery-temperature monitoring circuit. An external resistive divider network with a negative temperature-coefficient thermistor sets the lower and upper temperature thresholds. RC Timer-program input Used to program the maximum fast charge-time, maximum top-off charge-time, hold-off period, trickle charge rate, and to disable or enable top-off charge. A capcitor from VCC and a resistor to ground connect to this pin. VCC Supply-voltage input Recommended bypassing is 10µF + 0.1µF to 0.22µF of decoupling capacitance near the pin. MOD Modulation-control output Push-pull output that controls the charging current to the battery. MOD switches high to enable charging current to flow and low to inhibit charging-current flow. 2 Submit Documentation Feedback Copyright © 2008–2009, Texas Instruments Incorporated Product Folder Link(s): bq2000 bq2000 www.ti.com SLUS138D – JANUARY 2008 – REVISED DECEMBER 2009 FUNCTIONAL DESCRIPTION The bq2000 is a versatile, multi-chemistry battery charge control device. See Figure 1 for a functional block diagram and Figure 2 for a state diagram. TS Voltage Reference BAT OSC Voltage Comparators 3x ADC PVD ALU Clock Phase Generator Timer Charge Control LED Voltage Comparators MOD RC Internal OSC SNS VCC VSS Figure 1. Functional Block Diagram Submit Documentation Feedback Copyright © 2008–2009, Texas Instruments Incorporated Product Folder Link(s): bq2000 3 bq2000 SLUS138D – JANUARY 2008 – REVISED DECEMBER 2009 www.ti.com VCC Reset or Battery Replacement at any time 4.0 V < VCC < 6.0 V Charge Initialization VBAT < VSLP VMCV < VBAT < VSLP Battery Voltage (Voltage at BAT pin checked continuously. PVD checked at rate of MTO/128.) Sleep Mode Charge Qualification State VSLP < VBAT < VCC VBAT < VMCV VTS > VHTF Charge Suspended Battery Temperature (Temperature at TS pin checked continuously) VTS < VHTF VTS < VHTF VLBAT < VBAT < VMCV and VHTF < VTS < VLTF VBAT < VLBAT or VTS > VLTF VTS > VLTF Battery Conditioning Current Regulation VLBAT < VBAT and VHTF < VTS < VLTF PVD (after hold-off period), or VTS < VTCO or Time = MTO NO Trickle Maintenance Charge Top-Off Selected? VTS > VLTF Fast Charge State VTS > VLTF Time < MTO and VBAT reaches VMCV Voltage Regulation YES Current Taper (IBAT < Imin). or Time = 2 x MTO or VTS < VTCO VTS < VLTF and Time < MTO VTS > VHTF Top-Off Time = MTO VBAT ≥ VMCV Done VBAT ≥ VMCV VTS < VHTF Charge Suspended (See Note) VTS < VHTF VTS > VHTF and Time < MTO VCC Reset or Battery Replacement or Capacity Depletion (Li-lon) NOTE: If VTS < VTCO at any time, may only return to Trickle Maintenance Charge state and not to Top-Off. Figure 2. State Diagram 4 Submit Documentation Feedback Copyright © 2008–2009, Texas Instruments Incorporated Product Folder Link(s): bq2000 bq2000 www.ti.com SLUS138D – JANUARY 2008 – REVISED DECEMBER 2009 ABSOLUTE MAXIMUM RATINGS (1) VALUE UNIT –0.3 to 7 V –0.3 to VCC V Operating ambient temperature –20 to 70 °C Storage temperature –40 to 125 °C 260 °C VCC VCC relative to VSS VT DC voltage applied on any pin, relative to VSS TOPR TSTG TSOLDER Soldering temperature (10 s max.) (1) Permanent device damage may occur if Absolute Maximum Ratings are exceeded. Functional operation should be limited to the Recommended DC Operating Conditions detailed in this data sheet. Exposure to conditions beyond the operational limits for extended periods of time may affect device reliability. DC THRESHOLDS (1) TA = TOPR; VCC = 5V ±20% (unless otherwise specified) PARAMETER TEST CONDITIONS TYPICAL TOLERANCE UNIT VTCO Temperature cutoff Voltage at the TS pin 0.225 × VCC ±5% V VHTF High-temperature fault Voltage at the TS pin 0.25 × VCC ±5% V VLTF Low-temperature fault Voltage at the TS pin 0.5 × VCC ±5% V VMCV Maximum cell voltage Voltage at the BAT pin 2.00 ±0.75% VLBAT Minimum cell voltage Voltage at the BAT pin 950 ±5% mV PVD BAT input change for PVD detection Voltage at the BAT pin 3.8 ±20% mV VSNSHI High threshold at SNS Voltage at the SNS pin 50 ±10 mV VSNSLO Low threshold at SNS Voltage at the SNS pin –50 ±10 mV VSLP Sleep-mode input threshold Voltage at the BAT pin VCC–1 ±0.5 V VRCH Recharge threshold Voltage at the BAT pin VMCV–0.1 ±0.02 V (1) V All voltages are relative to VSS except as noted. RECOMMENDED DC OPERATING CONDITIONS over operating free-air temperature range (unless otherwise noted) TEST CONDITIONS VCC Supply voltage ICC Supply current Exclusive of external loads ICCS Sleep current VBAT = VSLPM VTS Thermistor input VTS < 0.5 V prohibited VOH Output high input MOD, IOH = 10 mA VOL Output low input MOD, LED, IOL = 10 mA IOZ High-impedance leakage current LED Isnk Sink current MOD, LED RMTO Charge timer resistor CMTO Charge timer capacitor MIN TYP MAX 4 5 6 V 0.5 1 mA 5 µA VCC V 0.5 UNIT VCC–0.4 V 0.2 V 5 µA 20 mA 2 250 kΩ 0.001 1 µF IMPEDANCE PARAMETER MIN TYP MAX UNIT RBAT Battery input impedance 10 MΩ RTS TS input impedance 10 MΩ RSNS SNS input impedance 10 MΩ TIMING TA = TOPR; VCC = 5 V ±20% (unless otherwise noted) PARAMETER dMTO MTO time-base variation fTRKL Pulse-trickle frequency MIN TYP –5% 0.9 MAX UNIT 5% 1 1.1 Submit Documentation Feedback Copyright © 2008–2009, Texas Instruments Incorporated Product Folder Link(s): bq2000 Hz 5 bq2000 SLUS138D – JANUARY 2008 – REVISED DECEMBER 2009 www.ti.com Initiation and Charge Qualification The bq2000 initiates a charge cycle when it detects • Application of power to VCC • Battery replacement • Exit from sleep mode • Capacity depletion (Li-Ion only) Immediately following initiation, the IC enters a charge-qualification mode. The bq2000 charge qualification is based on battery voltage and temperature. If the voltage on the BAT pin is less than the internal threshold, VLBAT, the bq2000 enters the battery conditioning state. This condition indicates the possibility of a defective or shorted battery pack. In an attempt to revive a fully depleted pack, the bq2000 enables the MOD pin to trickle-charge at a rate of once every 1.0s. As explained in the section "Top-Off and Pulse-Trickle Maintenance Charge," the trickle pulse-width is user-selectable and is set by the value of the resistance connected between the RC pin and VSS. During charge qualification, the LED pin blinks at a 1Hz rate, indicating the pending status of the charger. Once battery conditioning (trickle charge) has raised the voltage on the BAT pin above VLBAT, the IC enters fast charge, if the battery temperature is within the VLTF to VHTF range. The BQ2000 will stay in the battery conditioning state indefinitely and will not progress to fast charge until the voltage on the BAT pin is above VLBAT and the temperature is within the VLTF and VHTF range. No timer is implemented during battery conditioning. Battery Chemistry The bq2000 detects the battery chemistry by monitoring the battery-voltage profile during the initial stage of the fast charge. If the voltage on the BAT pin rises to the internal VMCV reference, the IC assumes a Li-Ion battery. Otherwise, the bq2000 assumes a NiCd/NiMH chemistry. While in the fast charge state, the LED pin is pulled low (the LED is on). As shown in Figure 3, a resistor voltage-divider between the battery pack's positive terminal and VSS scales the battery voltage. A low-pass filter then smooths out this voltage to present a clean signal to the BAT pin. In a mixed-chemistry design, a common voltage-divider is used as long as the maximum charge voltage of the nickel-based pack is below that of the Li-Ion pack. Otherwise, different scaling is required. BAT+ 2 VSS bq2000 4 RB1 BAT RB2 Figure 3. Battery Voltage Divider and Filter Once the chemistry is determined, the bq2000 completes the fast charge with the appropriate charge algorithm (Table 1). The user can customize the algorithm by programming the device using an external resistor and a capacitor connected to the RC pin, as discussed in later sections. NiCd and NiMH Batteries Following charge qualification (which includes trickle charge, if required ), the bq2000 fast-charges NiCd or NiMH batteries using a current-limited algorithm. During the fast-charge period, it monitors charge time, temperature, and voltage for adherence to the termination criteria. This monitoring is further explained in later sections. Following fast charge, the battery is topped off, if top-off is selected. The charging cycle ends with a trickle maintenance-charge that continues as long as the voltage on the BAT pin remains below VMCV. 6 Submit Documentation Feedback Copyright © 2008–2009, Texas Instruments Incorporated Product Folder Link(s): bq2000 bq2000 www.ti.com SLUS138D – JANUARY 2008 – REVISED DECEMBER 2009 Lithium-Ion Batteries The bq2000 uses a two-phase fast-charge algorithm for Li-Ion batteries (Figure 4). In phase one, the bq2000 regulates constant current until VBAT rises to VMCV. Once VBAT = VMCV, the device identifies the cell as a Li-ion, and changes the termination method from PVD to minimum current. The bq2000 then moves to phase two, regulates the battery with constant voltage of VMCV, and terminates when the charging current falls below the IMIN threshold or the timer expires (whichever happens first). A new charge cycle is started if the cell voltage falls below the VRCH threshold. Current IMAX Charge Qualification VMCV Voltage Fast Charge Phase 1 VLBAT Phase 2 Voltage Trickle Current IMIN Time Figure 4. Lithium-Ion Charge Algorithm During the current-regulation phase, the bq2000 monitors charge time, battery temperature, and battery voltage for adherence to the termination criteria. During the final constant-voltage stage, in addition to the charge time and temperature, it monitors the charge current as a termination criterion. There is no post-charge maintenance mode for Li-Ion batteries. Table 1 summarizes the charging process for both Nickel and Li-Ion batteries. Table 1. Charge Algorithm BATTERY CHEMISTRY CHARGE ALGORITHM 1. Charge qualification 2. Trickle charge, if required NiCd or NiMH (VBAT < VMCV always) 3. Fast charge (constant current) 4. Charge termination (peak voltage, maximum charge time = 1 MTO) 5. Top-off (optional) 6. Trickle charge 1. Charge qualification 2. Trickle charge, if required Li-Ion (VBAT ≤ VMCV ) 3. Fast charge (constant current) 4. Fast charge (constant voltage) 5. Charge termination (minimum current, maximum charge time = 2 MTO) FAST CHARGE TERMINATION Initial Hold-OFF Period The bq2000 incorporates a user programmable hold-off period to avoid premature fast charge termination that can occur with brand new cells at the very beginning of fast charge. The values of the external resistor and capacitor connected to the RC pin set the initial hold-off period. During this period, the bq2000 avoids early termination due to an initial peak in the battery voltage by disabling the peak voltage-detection (PVD) feature. This period is fixed at the programmed value of the maximum charge time (MTO) divided by 32. Submit Documentation Feedback Copyright © 2008–2009, Texas Instruments Incorporated Product Folder Link(s): bq2000 7 bq2000 SLUS138D – JANUARY 2008 – REVISED DECEMBER 2009 hold-off period = www.ti.com MTO 32 (1) Maximum Charge Time (NiCD, NiMH, and Li-Ion) The bq2000 sets the maximum charge-time through the RC pin. With the proper selection of external resistor and capacitor values, various time-out values may be achieved. If the timer expires while still in constant-current charging, the bq2000 assumes a Nickel chemistry and proceeds to top-off charge (if top-off is enabled) or trickle maintenance charge. Figure 5 shows a typical connection. 2 VSS VCC 7 bq2000 CMTO RC 6 RMTO Figure 5. Typical Connection for the RC Input The following equation shows the relationship between the RMTO and CMTO values and the maximum charge time (MTO) for the bq2000: MTO = RMTO ´ CMTO ´ 35,988 (2) MTO is measured in minutes, RMTO in ohms, and CMTO in farads. (Note: RMTO and CMTO values also determine other features of the device. See Table 4 and Table 5 for details. If, during fast charge, VTS > VLTF, then the timer is paused and the IC enters battery conditioning charge until VTS < VLTF. Since the IC is in the battery conditioning state, the LED flashes at the 1 Hz rate. Once VTS<VLTF, fast charge restarts and the timer resumes from where it left off with no change in total fast charge time. For Li-Ion cells, when the battery reaches the constant-voltage phase of fast charge, the bq2000 adds an additional MTO of time to whatever time was left over from the constant current fast charge timer. Thus, the pack could spend longer than 1 MTO in constant-voltage fast charge, but is always limited to 1 MTO in constant-current fast charge. This feature provides the additional charge time required for Li-Ion cells. For Nickel cells, if top-off is enabled, the timer is reset on the completion of fast charge before beginning top-off charge. Maximum Temperature (NiCd, NiMH, Li-Ion) A negative-coefficient thermistor, referenced to VSS and placed in thermal contact with the battery, may be used as a temperature-sensing device. Figure 6 shows a typical temperature-sensing circuit. 8 Submit Documentation Feedback Copyright © 2008–2009, Texas Instruments Incorporated Product Folder Link(s): bq2000 bq2000 www.ti.com SLUS138D – JANUARY 2008 – REVISED DECEMBER 2009 VCC 2 VCC 7 VSS RT1 bq2000 TS 5 RT2 N Battery T Pack C Figure 6. Temperature Monitoring Configuration During fast charge, the bq2000 compares the battery temperature to an internal high-temperature cutoff threshold, VTCO, and a low-temperature threshold, VLTF. During fast charge only, the VHTF fault comparator is disabled. When the voltage at the TS pin is lower than VTCO, the bq2000 terminates fast charge, moves to the charge suspended state, and turns off the LED. When VTS rises above VHTF, the bq2000 will resume charging in the trickle maintenance charge state, per Figure 2. In fast charge (either constant current or constant voltage fast charge), when the voltage on the TS pin is higher than VLTF, the charger enters the battery conditioning state, as described in the previous section. Fast charge is resumed when VTS is less than VLTF. Peak Voltage (NiCd, NiMH) The bq2000 uses a peak-voltage detection (PVD) scheme to terminate fast charge for NiCd and NiMH batteries. The bq2000 continuously monitors the voltage on the BAT pin, representing the battery voltage, to ensure that it never exceeds VMCV (maximum cell voltage). In addition, it also samples, at a rate of MTO/128, the voltage on the BAT pin and triggers the peak detection feature if this value falls below the maximum sampled value by as much as 3.8mV (PVD). In preparation for sampling the BAT pin voltage, the bq2000 briefly turns off most circuits (the MOD and RC pins will both go low) in order to get the cleanest possible, noise-free measurement. While the monitoring of the BAT pin voltage is continuous, the sampling of the BAT pin voltage with the internal ADC only occurs during the constant current regulation phase of fast charge. If the cell voltage reaches VMCV, the pack is assumed to be Li-Ion and the BAT pin voltage sampling is disabled, as PVD is not a termination criterion for Lithium cells. As shown in Figure 3, a resistor voltage-divider between the battery pack's positive terminal and VSS scales the battery voltage measured at the BAT pin. For Li-Ion battery packs, the resistor values RB1 and RB2 are calculated by the following equation: RB1 RB2 æ ö V = ç N ´ CELL ÷ - 1 VMCV ø è (3) where N is the number of cells in series and VCELL is the manufacturer-specified charging voltage. RB1 + RB2 should be at least 200kΩ and no more than 1MΩ. A NiCd or NiMH battery pack consisting of N series cells may benefit by the selection of the RB1 value to be N–1 times larger than the RB2 value. This sets the per cell regulation voltage (VCELL) equal to VMCV. It is critical that VCELL be set high enough that the nickle pack not reach voltage regulation, thus allowing proper termination by PVD. Typical VCELL for a nickle pack is between 1.7V and 2V. In a mixed-chemistry design, a common voltage-divider is used as long as the maximum charge voltage of the nickel-based pack is below that of the Li-Ion pack. Otherwise, different scaling is required. See Figure 7 for an example. Submit Documentation Feedback Copyright © 2008–2009, Texas Instruments Incorporated Product Folder Link(s): bq2000 9 bq2000 SLUS138D – JANUARY 2008 – REVISED DECEMBER 2009 www.ti.com Q1 FMMT718 D4 DC+ S1A D3 MMSD914LT L1 C6 47 mF BAT+ 47 mH Q2 MMBT3904LT1 D2 ZHCS1000 R12 120 OHMS D5 MMSD914LT C9 R10 1 KW 1000 PF Q3 MMBT3904LT1 VCC R2 2 KW D6 BZT52-C5V1 C3 10 mF C7 4.7 PF C4 0.0022 mF R1 D1 U1 1 SNS 2 VSS 3 LED 4 BAT RED R11 220 W C2 0.1 C8 0.33 mF R6 210 KW C5 10 mF R4 12.4K 100 KW 8 7 6 5 MOD VCC RC TS THERM bq2000 C1 0.1 R8 6.81 KW R9 R5 20 KW CHEMISTRY 221 KW BATR7 200 KW R13 1.1K R3 0.05 W DCNOTES: 1. For Li-Ion, the CHEMISTRY is left floating. For NiCd/NiMH, the CHEMISTRY is tied to BAT2. DC input voltage: 9–16V 3. Charge current: 1A 4. L1: 3L Global P/N PKSMD-1005-470K-1A Figure 7. Single-Cell Li-Ion, 3-Cell NiCd/NiMH 1A Charger Minimum Current (Li-Ion Only) The bq2000 monitors the charging current during the voltage-regulation phase of Li-Ion batteries. Fast charge is terminated when the current is tapered off to 14% of the maximum charging current. Once constant-current fast charge has ended, the bq2000 either measures the value of the CMTO capacitor (in the case of Nickel batteries) and then proceeds to either top-off or trickle maintenance charge or simply completes the constant-voltage stage of fast charge (in the case of a Li-Ion cell). Top-Off and Pulse-Trickle Maintenance Charge An optional top-off charge is available for NiCd or NiMH batteries. Top-off may be desirable on batteries that have a tendency to terminate charge before reaching full capacity. To enable this option, the capacitance value of CMTO connected between the RC pin and VCC (Figure 5) should be greater than 0.13µF, and the value of the resistor connected to this pin should be less than 250kΩ. To disable top-off, the capacitance value should be less than 0.07µF. The tolerance of the capacitor needs to be taken into account in component selection. Once top-off is started, the timer is reset and top-off proceeds until the timer expires, VMCV is reached, or there is a temperature fault. During top-off, current is delivered to the battery in pulses that occur each second. The fixed pulse width allows an average current of 1/16 of the fast charge current to be delivered to the battery every second. The LED is always off during top-off and trickle maintenance charge. 10 Submit Documentation Feedback Copyright © 2008–2009, Texas Instruments Incorporated Product Folder Link(s): bq2000 bq2000 www.ti.com SLUS138D – JANUARY 2008 – REVISED DECEMBER 2009 During top-off, there are three different temperature faults that can occur. If VTS > VLTF, top-off is suspended, the timer is paused, and trickle charge is started. When VTS falls below VLTF, top-off is resumed. If VTS < VHTF, all charging stops, but the timer keeps counting. When VTS > VHTF, top-off is resumed, if there is still time remaining on the timer. If there is not time left, trickle maintenance charge is entered. If VTS < VTCO, all charging stops. Only trickle maintenance charge may resume after VTS > VHTF. Pulsewidth - ms Following top-off, the bq2000 trickle-charges the battery by enabling the MOD pin to charge at a rate of once every 1.0 second. The trickle pulse-width is user-selectable and is set by the value of the resistor RMTO, connected between the RC pin and VSS. Figure 8 shows the relationship between the trickle pulse-width and the value of RMTO. The typical tolerance of the pulsewidth below 150kΩ is ±10%. 200 180 160 140 120 100 80 60 40 20 4 3 2 1 Shows Tolerance 2 4 6 8 10 50 100 RMTO - kW 150 200 250 Figure 8. Relationship Between Trickle Pulse-Width and Value of RMTO Note that with an RMTO value around 150 kΩ, the trickle charge pulse width is nearly identical to the top-off pulse width of 62.5 ms (1/16 of a second). With RMTO values near 150 kΩ, it can be difficult to tell which state the IC is in (top-off or trickle charge). The best way to tell if the bq2000 is in top-off or trickle charge is to look at the RC pin when the temperature is between the LTF and HTF. In top-off, the RC pin will be counting and will have a sawtooth waveform on it. In trickle charge, there is no timer and the RC pin will be at a DC value. The RC pin contains valuable information in determining what state the bq2000 is in, since it always operates in one of three modes. If the RC pin is low (around VSS potential), the IC is in sleep mode. (If the RC pin is low for brief instants during fast charge, the bq2000 is sampling the BAT pin for PVD). If the RC pin is at some DC value (usually around 1-2V), then the IC has paused the timer or the timer is inactive. If the RC pin is a sawtooth waveform (similar to Figure 15), then the timer is running and the RC pin is considered “active.” Lastly, the RC pin can be loaded by too large of a C or too small of an R. This will sometimes make the usual sawtooth waveform look like a triangle waveform on an oscilloscope (the rise time is lengthened), or the RC signal could have the appearance of being clipped (flat top or bottom). The timer will be unreliable under these conditions and the bq2000 should not be operated in this manner. Table 2 summarizes the different states of the RC pin. Table 2. RC Pin Status bq2000 CHARGE STATE TS PIN STATE RC PIN BEHAVIOR Battery absent N/A 1-2V DC level Sleep mode N/A Ground (Vss) Charge qualification (including battery conditioning (trickle charge) and charge suspended) N/A 1-2V DC level VTS < VLTF Active VTS > VLTF (in battery conditioning state) 1-2V DC level (timer is paused and will resume when VTS < VLTF) Fast charge (current and voltage regulation) Submit Documentation Feedback Copyright © 2008–2009, Texas Instruments Incorporated Product Folder Link(s): bq2000 11 bq2000 SLUS138D – JANUARY 2008 – REVISED DECEMBER 2009 www.ti.com Table 2. RC Pin Status (continued) bq2000 CHARGE STATE TS PIN STATE RC PIN BEHAVIOR VTS > VLTF (in trickle maintenance charge state) 1-2V DC level (timer is paused and will resume when VTS < VLTF) VLTF > VTS > VHTF Active VHTF > VTS > VTCO Active (timer is still counting, even though charging is suspended) Trickle maintenance charge (after fast charge) N/A 1-2V DC level Charge complete N/A Active Top-off charge Both top-off and trickle maintenance charge are terminated and the pack never receives any more charge (until a charge initialization occurs) if the voltage on the BAT pin reaches VMCV. During trickle maintenance charge, charging is suspended if VTS < VHTF. It resumes when VTS > VHTF. The bq2000 is designed to remain in trickle maintenance charge forever (excluding the two faults just mentioned) in order to keep a Nickel pack full. Charge Current Control The bq2000 implements a hysteretic control loop that regulates the current being delivered to the battery pack to a user programmable value that is set by the value of the RSNS resistor. A second, outer control loop reduces the average current delivered to the pack in order to clamp the voltage at the BAT pin to a maximum of VMCV. The bq2000 modulates the MOD pin to regulate the current and voltage of the pack. The bq2000 monitors charge current at the SNS input by sensing the voltage drop across a sense-resistor, RSNS, in series with the battery pack. See Figure 9 for a typical current-sensing circuit. Rf RSNS 1 SNS Cf 2 BAT- VSS bq2000 Power Supply ground bq2000 ground and BAT- Figure 9. Current-Sensing Circuit RSNS is sized to provide the desired fast-charge current (IMAX). 0.05 IMAX = RSNS (4) If the voltage at the SNS pin is greater than VSNSLO or less than VSNSHI, the bq2000 switches the MOD output high to pass charge current to the battery. When the SNS voltage is less than VSNSLO or greater than VSNSHI, the bq2000 switches the MOD output low to shut off charging current to the battery. A hysteresis capacitor (CHYS) is required between the CMOD pin and the SNS pin to add a healthy amount of hysteresis to the current sense signal. Typical hysteresis values are between 5 and 25 mV. The amount of hysteresis can be calculated by examining the capacitive divider formed by CHYS and Cf. CHYS Hysteresis (V) = VCC ´ (C HYS + Cf ) (5) Being a hysteretic controller, the switching frequency of the bq2000 is determined by the values of several of the external circuit components. The components that affect the switching frequency are: input voltage, RSNS value, inductor value, hysteresis capacitor value (CHYS), and the value of the filter on the current sense signal (Rf and Cf values). Rf and Cf have the most impact on the switching frequency and are also the components that are easiest to change to adjust the frequency, as they do not affect anything else in the circuit (besides, of course, the cleanliness and quality of the current sense signal being fed to the bq2000). In general, increasing the input 12 Submit Documentation Feedback Copyright © 2008–2009, Texas Instruments Incorporated Product Folder Link(s): bq2000 bq2000 www.ti.com SLUS138D – JANUARY 2008 – REVISED DECEMBER 2009 voltage and/or inductor value or decreasing CHYS and/or the Rf × Cf filter corner frequency will increase the switching frequency. Figure 10 and Figure 11 show empirical data on the variation in switching frequency based on adjusting Rf and Cf. This data was taken with an input voltage of 12V, inductor value of 220 µH, RSNS value of 50 mΩ, and CHYS value of 4.7 pF. Typical switching frequencies for the bq2000 are between 100 and 200 kHz, though it is possible to achieve switching frequencies in excess of 300kHz. 180 160 fs - Switching Frequency - kHz Rf = 748W 140 120 100 80 60 40 20 0 220 720 1220 1720 2220 2720 3220 3720 4220 Cf - pF Figure 10. Switching Frequency vs Capacitance 210 fs - Switching Frequency - kHz 190 Cf = 1000pF 170 150 130 110 90 70 50 200 300 400 500 600 700 800 900 1000 1100 1200 Rf - W Figure 11. Switching Frequency vs Resistance Submit Documentation Feedback Copyright © 2008–2009, Texas Instruments Incorporated Product Folder Link(s): bq2000 13 bq2000 SLUS138D – JANUARY 2008 – REVISED DECEMBER 2009 www.ti.com TEMPERATURE MONITORING The bq2000 measures the temperature by the voltage at the TS pin. This voltage is typically generated by a negative-temperature-coefficient thermistor. The bq2000 compares this voltage against its internal threshold voltages to determine if charging is safe. These thresholds are the following: • High-temperature cutoff voltage: VTCO = 0.225 × VCC. This voltage corresponds to the maximum temperature (TCO) at which any charging is allowed. The bq2000 terminates charging if the voltage on the TS pin falls below VTCO. • High-temperature fault voltage: VHTF = 0.25 × VCC. This voltage corresponds to a maximum allowed pack temperature (HTF) in all states except for fast charge. During fast charge, HTF faults are disabled to allow for a normal increase in pack temperature. • Low-temperature fault voltage: VLTF = 0.5 × VCC. This voltage corresponds to the minimum temperature (LTF) at which fast charging or top-off is allowed. If the voltage on the TS pin rises above VLTF, the bq2000 suspends either fast charge or top-off and begins a trickle charge. When the voltage falls back below VLTF, fast charge or top-off resumes from the point where suspended. If VTS > VLTF, the charger will always be in trickle charge. Table 3 summarizes these various conditions. Table 3. Temperature-Monitoring Conditions and Actions TEMPERATURE CONDITION ACTION During charge qualification, no effect VTS > VLTF Cold battery – checked at all times VHTF < VTS < VLTF Optimal charging range During fast charge, suspends fast charge and moves into charge qualification, pauses timer, and flashes LED During top-off, suspends top-off and moves into trickle maintenance charge and pauses timer During trickle maintenance charge, no effect Allows all stages of charging During charge qualification, stops charging VTS < VHTF Hot battery – checked at all times, except during fast charge During fast charge, no effect During top-off, stops charging During trickle maintenance charge, stops charging During charge qualification, stops charging VTS < VTCO Battery exceeding maximum allowable temperature – checked at all times During fast charge, terminates fast charge and stops charging, turns off LED During top-off, terminates top-off and stops charging During trickle maintenance charge, stops charging Table 4. Summary of NiCd or NiMH Charging Characteristics VALUE (1) PARAMETER Maximum cell voltage (VMCV) 2V Minimum pre-charge qualification voltage (VLBAT) 950 mV High-temperature cutoff voltage (VTCO) 0.225 × VCC High-temperature fault voltage (VHTF) 0.25 × VCC Low-temperature fault voltage (VLTF) 0.5 × VCC bq2000 fast-charge maximum time out (MTO) RMTO × CMTO × 35,988 Fast-charge charging current (IMAX) 0.05/RSNS Hold-off period MTO/32 Top-off charging current (optional) IMAX/16 Top-off period (optional) MTO Trickle-charge frequency 1Hz Trickle-charge pulse-width (1) 14 See Figure 8 See the DC Thresholds Specification for details. Submit Documentation Feedback Copyright © 2008–2009, Texas Instruments Incorporated Product Folder Link(s): bq2000 bq2000 www.ti.com SLUS138D – JANUARY 2008 – REVISED DECEMBER 2009 Table 5. Summary of Li-Ion Charging Characteristics VALUE (1) PARAMETER Maximum cell voltage (VMCV) 2V Minimum pre-charge qualification voltage (VLBAT) 950 mV High-temperature cutoff voltage (VTCO) 0.225 × VCC High-temperature fault voltage (VHTF) 0.25 × VCC Low-temperature fault voltage (VLTF) 0.5 × VCC 2 × RMTO × CMTO × 35,988 (See Maximum Charge Time section for full explanation) bq2000 fast-charge maximum time out (MTO) Fast-charge charging current (IMAX) 0.05/RSNS Hold-off period MTO/32 Minimum current (for fast-charge termination) IMAX/7 Trickle-charge frequency (before fast charge only) 1Hz Trickle-charge pulse-width (before fast charge only) (1) See Figure 8 See the DC Thresholds Specification for details. Charge Status Display The charge status is indicated by open-drain output LED. Table 6 summarizes the display output of the bq2000. A temperature fault or timer expiring changes the charge state immediately (according to Figure 2) and will thus change the LED status immediately and accordingly. Table 6. Charge Status Display bq2000 CHARGE STATE LED STATUS Charge qualification (including battery conditioning and charge suspended) 1 Hz flash Fast charge (current and voltage regulation) Low Top-off charge Trickle maintenance charge (after fast charge) Charge complete High impedance Battery absent Sleep mode Sleep Mode The bq2000 features a sleep mode for low power consumption. This mode is enabled when the voltage at the BAT pin is above the low-power-mode threshold, VSLP. During sleep mode, the bq2000 shuts down all unnecessary internal circuits, drives the LED output to high-impedance state, and drives the MOD pin low. Restoring BAT below the VMCV threshold initiates the IC and starts a fast-charge cycle. Normally, the bq2000 only enters sleep mode when there is no battery connected on the output and the charger is idling with nothing to charge. In addition, VIN needs to be high enough such that when VIN is present on the output, VBAT would be greater than VSLP. In sleep mode, the output voltage will decay to VMCV at which point the bq2000 turns on and pulses the MOD pin several times. With no battery connected, the output will rise to near VIN at which point the bq2000 re-enters sleep mode. During sleep mode, the RC pin will be at VSS potential. A typical sleep mode waveform is shown in Figure 18. Submit Documentation Feedback Copyright © 2008–2009, Texas Instruments Incorporated Product Folder Link(s): bq2000 15 bq2000 SLUS138D – JANUARY 2008 – REVISED DECEMBER 2009 www.ti.com TYPICAL CHARACTERISTICS CH1 = RC pin, 2V/div CH1 = RC pin, 2V/div 1 CH2 = MOD pin, 5V/div CH2 = MOD pin, 5V/div Voltage - V Voltage - V 2 CH3 = VO, 5V/div 2 CH3 = VI, 5V/div 3 CH4 = LED pin, 5V/div 1 CH4 = LED pin, 5V/div 4 3 4 Time - 0.2s/div Time - 0.2s/div Figure 12. bq2000 Start-up on Battery Insertion Figure 13. bq2000 Start-up on Vin CH1 = VO, 5V/div CH2 = RC pin, 1V/div CH1 = VO, 5V/div 1 Voltage - V Voltage - V 1 CH2 = BAT pin, 1V/div CH3 = MOD pin, 5V/div 3 2 CH3 = MOD pin, 5V/div 3 Time - 0.5s/div CH4 = LED pin, 1V/div 4 Time - 0.5ms/div Figure 14. Battery Removal During Fast Charge 16 2 Submit Documentation Feedback Figure 15. bq2000 in Fast Charge Copyright © 2008–2009, Texas Instruments Incorporated Product Folder Link(s): bq2000 bq2000 www.ti.com SLUS138D – JANUARY 2008 – REVISED DECEMBER 2009 TYPICAL CHARACTERISTICS (continued) CH1 = VO, 5V/div 1 CH2 = RC pin, 1V/div CH1 = SNS pin, 20mV/div CH3 = MOD pin, 5V/div 2 Voltage - V Voltage - V 1 CH2 = MOD pin, 5V/div 3 2 4 CH4 = LED pin, 1V/div Time - 2ms/div Time - 10ms/div Figure 16. bq2000 in Fast Charge Figure 17. bq2000 Fast Charge SNS and MOD Waveforms CH1 = VO, 10V/div Voltage - V 1 CH2 = BAT pin, 1V/div CH3 = RC pin, 2V/div 2 3 4 CH4 = MOD pin, 5V/div Time - 1s/div Figure 18. bq2000 in Sleep Mode Submit Documentation Feedback Copyright © 2008–2009, Texas Instruments Incorporated Product Folder Link(s): bq2000 17 bq2000 SLUS138D – JANUARY 2008 – REVISED DECEMBER 2009 www.ti.com REVISION HISTORY Changes from Revision September 1998 (*) to Revision 1 Page • Changed the device status From: Preliminary To: Final ....................................................................................................... 1 • Changed the DC THRESHOLDS - VTCO, VHTF, VLTF Tolerance ............................................................................................ 5 • Changed the RECOMMENDED DC OPERATING CONDITIONS - RMTO, CMTO Values ...................................................... 5 • Added Figure 3 - Battery Voltage Divider and Filter ............................................................................................................. 6 • Changed MTO equation From: MTO = R x C x 71,976 ........................................................................................................ 8 • Added Figure 8 ................................................................................................................................................................... 11 Changes from Revision 1 (January 1999) to Revision 2 Page • Changed Table 4 - VBLAT value ........................................................................................................................................... 14 • Changed Table 5 - VBLAT value ........................................................................................................................................... 15 Changes from Revision 2 (March 1999) to Revision 3 Page • Added the TSSOP Package option ...................................................................................................................................... 1 • Added Figure 2 State Diagram ............................................................................................................................................. 4 • Changed the DC THRESHOLDS - VTCO, VHTF, VLTF Tolerance ............................................................................................ 5 • Changed Figure 7 - Single-Cell Li-Ion, 3-Cell NiCd/NiMH 1A Charger .............................................................................. 10 • Changed the Top-Off and Pulse-Trickle Maintenance Charge section - Updated requirement for enabling top-off .......... 10 Changes from Revision 3 (May 1999) to Revision 4 Page • Changed Rec DC Operating Conditions, VOH - From: MIN = VCC - 0.2 at IOH = 20mA To: MIN = VCC - 0.4 at IOH = 10mA ..................................................................................................................................................................................... 5 • Changed Rec DC Operating Conditions, VOH - From: IOH = 20mA To: IOH = 10mA ............................................................. 5 • Changed Figure 8 - Updated tolerance on the curve ......................................................................................................... 11 Changes from Revision 4 (February 2000) to Revision 5 Page • Changed Figure 2 State Diagram - Battery voltage detail From: (checked at all times) To: Voltage regulation checked constantly. PVD checked at rate of MTO/64. ......................................................................................................... 4 • Changed Figure 2 State Diagram - Battery temperature detail From: (checked at all times) To;: (checked 1,750 times per second) ................................................................................................................................................................. 4 Changes from Revision 5 (February 2001) to Revision 6 • Changed the Top-Off and Pulse-Trickle Maintenance Charge section - First paragraph From: the value of the resistor connected to this pin should be less than 15kΩ To: the value of the resistor connected to this pin should be less than 250kΩ .................................................................................................................................................................. 10 Changes from Revision 6 (January 2008) to Revision D • 18 Page Page Changed the data sheet format. The data sheet was originally from Benchmark Products. In revision D, the data sheet was converted to the TI format, and a re-write of the data sheet was implemented .................................................. 1 Submit Documentation Feedback Copyright © 2008–2009, Texas Instruments Incorporated Product Folder Link(s): bq2000 PACKAGE OPTION ADDENDUM www.ti.com 11-Apr-2013 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish (2) MSL Peak Temp Op Temp (°C) Top-Side Markings (3) (4) BQ2000PN-B5 ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type -20 to 70 2000PN-B5 BQ2000PW ACTIVE TSSOP PW 8 150 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -20 to 70 BQ200 BQ2000PWG4 ACTIVE TSSOP PW 8 150 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -20 to 70 BQ200 BQ2000PWR ACTIVE TSSOP PW 8 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -20 to 70 BQ200 BQ2000PWRG4 ACTIVE TSSOP PW 8 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -20 to 70 BQ200 BQ2000SN-B5 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -20 to 70 2000 BQ2000SN-B5G4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -20 to 70 2000 BQ2000SN-B5TR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -20 to 70 2000 BQ2000SN-B5TRG4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -20 to 70 2000 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com (3) 11-Apr-2013 MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Top-Side Marking for that device. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 5-Feb-2014 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant BQ2000PWR TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1 BQ2000SN-B5TR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 5-Feb-2014 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) BQ2000PWR TSSOP PW 8 2000 367.0 367.0 35.0 BQ2000SN-B5TR SOIC D 8 2500 367.0 367.0 35.0 Pack Materials-Page 2 PACKAGE OUTLINE PW0008A TSSOP - 1.2 mm max height SCALE 2.800 SMALL OUTLINE PACKAGE C 6.6 TYP 6.2 SEATING PLANE PIN 1 ID AREA A 0.1 C 6X 0.65 8 1 3.1 2.9 NOTE 3 2X 1.95 4 5 B 4.5 4.3 NOTE 4 SEE DETAIL A 8X 0.30 0.19 0.1 C A 1.2 MAX B (0.15) TYP 0.25 GAGE PLANE 0 -8 0.15 0.05 0.75 0.50 DETAIL A TYPICAL 4221848/A 02/2015 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed 0.15 mm per side. 4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.25 mm per side. 5. Reference JEDEC registration MO-153, variation AA. www.ti.com EXAMPLE BOARD LAYOUT PW0008A TSSOP - 1.2 mm max height SMALL OUTLINE PACKAGE 8X (1.5) 8X (0.45) SYMM 1 8 (R0.05) TYP SYMM 6X (0.65) 5 4 (5.8) LAND PATTERN EXAMPLE SCALE:10X SOLDER MASK OPENING METAL SOLDER MASK OPENING METAL UNDER SOLDER MASK 0.05 MAX ALL AROUND 0.05 MIN ALL AROUND SOLDER MASK DEFINED NON SOLDER MASK DEFINED SOLDER MASK DETAILS NOT TO SCALE 4221848/A 02/2015 NOTES: (continued) 6. Publication IPC-7351 may have alternate designs. 7. Solder mask tolerances between and around signal pads can vary based on board fabrication site. www.ti.com EXAMPLE STENCIL DESIGN PW0008A TSSOP - 1.2 mm max height SMALL OUTLINE PACKAGE 8X (1.5) 8X (0.45) SYMM (R0.05) TYP 1 8 SYMM 6X (0.65) 5 4 (5.8) SOLDER PASTE EXAMPLE BASED ON 0.125 mm THICK STENCIL SCALE:10X 4221848/A 02/2015 NOTES: (continued) 8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 9. Board assembly site may have different recommendations for stencil design. www.ti.com IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily performed. TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use of any TI components in safety-critical applications. In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and requirements. Nonetheless, such components are subject to these terms. No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties have executed a special agreement specifically governing such use. Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of non-designated products, TI will not be responsible for any failure to meet ISO/TS16949. Products Applications Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers DLP® Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps DSP dsp.ti.com Energy and Lighting www.ti.com/energy Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial Interface interface.ti.com Medical www.ti.com/medical Logic logic.ti.com Security www.ti.com/security Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video RFID www.ti-rfid.com OMAP Applications Processors www.ti.com/omap TI E2E Community e2e.ti.com Wireless Connectivity www.ti.com/wirelessconnectivity Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2015, Texas Instruments Incorporated