ON NCP186AMX300TAG Fast transient response low voltage 1 a ldo Datasheet

NCP186
Fast Transient Response
Low Voltage 1 A LDO
The NCP186x series are CMOS LDO regulators featuring 1 A
output current. The input voltage is as low as 1.8 V and the output
voltage can be set from 1.2 V.
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Features
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Operating Input Voltage Range: 1.8 V to 5.5 V
Output Voltage Range: 1.2 to 3.9 V
Quiescent Current typ. 90 mA
Low Dropout: 100 mV typ. at 1 A, VOUT = 3.0 V
High Output Voltage Accuracy ±1%
Stable with Small 1 mF Ceramic Capacitors
Over−current Protection
Built−in Soft Start Circuit to Suppress Inrush Current
Thermal Shutdown Protection: 165°C
With (NCP186A) and Without (NCP186B) Output Discharge
Function
Available in Small xDFN8 1.2 x 1.6 mm Package
These are Pb−free Devices
Typical Applications
• Battery Powered Equipment
• Portable Communication Equipment
• Cameras, Image Sensors and Camcorders
VIN
PIN CONNECTIONS
OUT
1
8
IN
OUT
2
7
IN
N/C
3
6
EN
FB
4
5
GND
(Top View)
MARKING DIAGRAM
VOUT
IN
CIN
1 mF
XDFN8
MX SUFFIX
CASE 711AS
OUT
ON
EN
GND
XXMG
G
COUT
1 mF
NCP186
FB
XX = Specific Device Code
M = Date Code
G
= Pb−Free Package
OFF
Figure 1. Typical Application Schematic
(Note: Microdot may be in either location)
ORDERING INFORMATION
See detailed ordering and shipping information in the ordering
information section on page 4 of this data sheet.
© Semiconductor Components Industries, LLC, 2015
June, 2015 − Rev. 0
1
Publication Order Number:
NCP186/D
NCP186
IN
OUT
VOLTAGE REFERENCE
AND
SOFT−START
IN
OUT
VOLTAGE REFERENCE
AND
SOFT−START
FB
FB
EN
EN
0.7 V
0.7 V
GND
THERMAL
SHUTDOWN
GND
THERMAL
SHUTDOWN
NCP186A (with output discharge)
NCP186B (without output discharge)
Figure 2. Internal Block Diagram
Table 1. PIN FUNCTION DESCRIPTION
Pin No. XDFN6
Pin Name
Description
1
OUT
LDO output pin
3
N/C
Not internally connected. This pin can be tied to the ground plane to improve thermal dissipation.
4
FB
Feedback input pin
5
GND
Ground pin
6
EN
Chip enable input pin (active “H”)
7
IN
Power supply input pin
EPAD
It’s recommended to connect the EPAD to GND, but leaving it open is also acceptable
2
8
EPAD
Table 2. ABSOLUTE MAXIMUM RATINGS
Rating
Input Voltage (Note 1)
Output Voltage
Chip Enable Input
Symbol
Value
Unit
IN
−0.3 to 6.0
V
OUT
−0.3 to VIN + 0.3
V
EN
−0.3 to 6.0
V
IOUT
Internally Limited
mA
TJ(MAX)
150
°C
TSTG
−55 to 150
°C
ESD Capability, Human Body Model (Note 2)
ESDHBM
2000
V
ESD Capability, Machine Model (Note 2)
ESDMM
200
V
Output Current
Maximum Junction Temperature
Storage Temperature
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. Refer to ELECTRICAL CHARACTERISTIS and APPLICATION INFORMATION for Safe Operating Area.
2. This device series incorporates ESD protection and is tested by the following methods:
ESD Human Body Model tested per AEC−Q100−002 (EIA/JESD22−A114)
ESD Machine Model tested per AEC−Q100−003 (EIA/JESD22−A115)
Latchup Current Maximum Rating tested per JEDEC standard: JESD78
Table 3. THERMAL CHARACTERISTICS
Rating
Thermal Resistance, Junction−to−Air, XDFN8 1.2 mm x 1.6 mm
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2
Symbol
Value
Unit
RqJA
111
°C/W
NCP186
Table 4. ELECTRICAL CHARACTERISTICS
VIN = VOUT_NOM + 0.5 V or VIN = 1.8 V whichever is greater; IOUT = 1 mA; CIN = COUT = 1.0 mF (effective capacitance) (Note 3);
VEN = 1.2 V; TJ = 25°C; unless otherwise noted. The specifications in bold are guaranteed at −40°C ≤ TJ ≤ 125°C.
Parameter
Test Conditions
Operating Input Voltage
Output Voltage
VOUT_NOM + 0.5 V ≤ VIN ≤ 5.5 V,
IOUT = 0 to 1 A, −40°C ≤ TJ ≤ 85°C
Symbol
Min
VIN
VOUT
VOUT_NOM + 0.5 V ≤ VIN ≤ 5.5 V,
IOUT = 0 to 1 A, −40°C ≤ TJ ≤ 125°C
Typ
Max
Unit
1.8
5.5
V
−1.0
1.0
%
−2.0
1.0
Load Regulation
IOUT = 1 mA to 1000 mA
LoadReg
0.7
5.0
mV
Line Regulation
VIN = VOUT_NOM + 0.5 V to 5.0 V
LineReg
0.002
0.1
%/V
Dropout Voltage
IOUT = 1 A
VDO
405
585
mV
VOUT_NOM = 1.75 V
180
295
VOUT_NOM = 1.8 V
175
285
VOUT_NOM = 1.85 V
170
280
VOUT_NOM = 2.5 V
120
190
VOUT_NOM = 2.8 V
110
170
VOUT_NOM = 3.0 V
100
160
VOUT_NOM = 3.3 V
95
145
VOUT_NOM = 3.5 V
92
135
VOUT_NOM = 3.9 V
86
130
IQ
90
140
mA
0.1
1.5
mA
VOUT_NOM = 1.2 V
When VOUT falls to
VOUT_NOM – 100 mV
Quiescent Current
IOUT = 0 mA
Standby Current
VEN = 0 V
ISTBY
Output Current Limit
VOUT = 90% of VOUT_NOM
IOCL
1100
1400
mA
Output Short Circuit Current
VOUT = 0 V
IOSC
1100
1400
mA
Enable Input Current
Enable Threshold Voltage
IEN
0.15
0.6
mA
V
EN Input Voltage “H”
VENH
EN Input Voltage “L”
VENL
Power Supply Rejection Ratio
VIN = VOUT_NOM + 1.0 V, Ripple 0.2 Vp−p,
IOUT = 30 mA, f = 1 kHz
PSRR
75
dB
Output Noise
f = 10 Hz to 100 kHz
VN
48
mVRMS
Output Discharge Resistance
(NCP186A option only)
VIN = 5.5 V, VEN = 0 V, VOUT = 1.8 V
RAD
34
W
Thermal Shutdown
Temperature
Temperature rising from TJ = +25°C
TSD
165
°C
TSDH
20
°C
Thermal Shutdown Hysteresis Temperature falling from TSD
1.0
0.4
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
3. Effective capacitance, including the effect of DC bias, tolerance and temperature. See the Application Information section for more
information.
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3
NCP186
ORDERING INFORMATION TABLE
Part Number
Voltage
Option
Marking
Option
NCP186AMX120TAG
1.2 V
FA
With active discharge
NCP186AMX175TAG
1.75 V
FC
With active discharge
NCP186AMX180TAG
1.8 V
FD
With active discharge
NCP186AMX185TAG
1.85 V
FL
With active discharge
NCP186AMX250TAG
2.5 V
FE
With active discharge
NCP186AMX280TAG
2.8 V
FF
With active discharge
NCP186AMX300TAG
3.0 V
FG
With active discharge
NCP186AMX330TAG
3.3 V
FH
With active discharge
NCP186AMX350TAG
3.5 V
FJ
With active discharge
NCP186AMX390TAG
3.9 V
FK
With active discharge
NCP186BMX120TAG
1.2 V
HA
Without active discharge
NCP186BMX175TAG
1.75 V
HC
Without active discharge
NCP186BMX180TAG
1.8 V
HD
Without active discharge
NCP186BMX185TAG
1.85 V
HL
Without active discharge
NCP186BMX250TAG
2.5 V
HE
Without active discharge
NCP186BMX280TAG
2.8 V
HF
Without active discharge
NCP186BMX300TAG
3.0 V
HG
Without active discharge
NCP186BMX330TAG
3.3 V
HH
Without active discharge
NCP186BMX350TAG
3.5 V
HJ
Without active discharge
NCP186BMX390TAG
3.9 V
HK
Without active discharge
Package
Shipping
XDFN−8
(Pb−Free)
3000/Tape&Reel
711AS
XDFN−8
(Pb−Free)
3000/Tape&Reel
711AS
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NCP186
TYPICAL CHARACTERISTICS
1.212
1.209
1.814
1.206
1.809
OUTPUT VOLTAGE (V)
OUTPUT VOLTAGE (V)
VIN = VOUT−NOM + 0.5 V or VIN = 1.8 V, whichever is greater, VEN = 1.2 V, IOUT = 1 mA, CIN = COUT = 1.0 mF, TJ = 25°C.
1.203
1.200
1.197
1.194
1.191
1.188
1.185
1.182
1.179
1.176
−40
0
20
40
60
80
100
120
1.789
1.784
1.779
40
60
80
100
120
3.932
3.922
3.284
3.274
3.264
3.254
VOUT−NOM = 3.3 V
−20
0
20
40
60
80
3.912
3.902
3.892
3.882
3.872
3.862
3.852
VOUT−NOM = 3.9 V
3.842
3.244
100
3.832
3.822
−40
120
−20
0
20
40
60
80
100
TEMPERATURE (°C)
TEMPERATURE (°C)
Figure 5. Output Voltage vs. Temperature
Figure 6. Output Voltage vs. Temperature
0.10
120
5
VOUT−NOM = 1.2 V
VOUT−NOM = 1.8 V
VOUT−NOM = 3.3 V
VOUT−NOM = 3.9 V
VOUT−NOM = 1.2 V
VOUT−NOM = 1.8 V
VOUT−NOM = 3.3 V
VOUT−NOM = 3.9 V
4
LOAD REGULATION (mV)
LINE REGULATION (%/V)
20
Figure 4. Output Voltage vs. Temperature
3.294
0.04
0
Figure 3. Output Voltage vs. Temperature
3.304
0.06
−20
TEMPERATURE (°C)
3.314
0.08
VOUT−NOM = 1.8 V
TEMPERATURE (°C)
OUTPUT VOLTAGE (V)
OUTPUT VOLTAGE (V)
1.794
1.769
1.764
−40
3.324
3.234
−40
1.799
1.774
VOUT−NOM = 1.2 V
−20
1.804
0.02
0
−0.02
−0.04
−0.06
VIN = VOUT−NOM + 0.5 V to 5.0 V, VIN ≥ 1.8 V
−0.08
−0.10
−40 −20
0
20
40
60
80
100 120
3
2
1
0
−1
−2
IOUT = 1 mA to 1000 mA
−3
−4
−5
−40
−20
0
20
40
60
80
100
TEMPERATURE (°C)
TEMPERATURE (°C)
Figure 7. Line Regulation vs. Temperature
Figure 8. Load Regulation vs. Temperature
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5
120
NCP186
TYPICAL CHARACTERISTICS
VIN = VOUT−NOM + 0.5 V or VIN = 1.8 V, whichever is greater, VEN = 1.2 V, IOUT = 1 mA, CIN = COUT = 1.0 mF, TJ = 25°C.
275
275
250
VOUT−NOM = 1.8 V
DROPOUT VOLTAGE (mV)
DROPOUT VOLTAGE (mV)
250
TJ = 125°C
225
TJ = 25°C
200
175
150
125
TJ = −40°C
100
75
50
25
0
0
200
400
600
800
1000
175
150
125
IOUT = 500 mA
100
75
IOUT = 200 mA
50
−20
0
20
40
IOUT = 10 mA
100 120
80
60
OUTPUT CURRENT (mA)
TEMPERATURE (°C)
Figure 9. Dropout Voltage vs. Output Current
Figure 10. Dropout Voltage vs. Temperature
140
TJ = 125°C
VOUT−NOM = 3.3 V
VOUT−NOM = 3.3 V
120
DROPOUT VOLTAGE (mV)
DROPOUT VOLTAGE (mV)
IOUT = 1000 mA
200
25
0
−40
140
TJ = 25°C
100
80
60
TJ = −40°C
40
120
IOUT = 1000 mA
100
80
IOUT = 500 mA
60
40
IOUT = 200 mA
20
20
0
0
200
400
600
800
IOUT = 10 mA
0
−40
1000
−20
0
20
40
60
80
100
120
OUTPUT CURRENT (mA)
TEMPERATURE (°C)
Figure 11. Dropout Voltage vs. Output Current
Figure 12. Dropout Voltage vs. Temperature
450
120
QUIESCENT CURRENT (mA)
TJ = 125°C
TJ = 25°C
400
GROUND CURRENT (mA)
VOUT−NOM = 1.8 V
225
350
TJ = −40°C
300
250
200
150
100
50
110
100
VOUT−NOM = 1.2 V
90
VOUT−NOM = 1.8 V
VOUT−NOM = 3.3 V
80
VOUT−NOM = 3.9 V
70
VOUT−NOM = 1.8 V
IOUT = 0 mA
0
0
200
400
600
800
60
−40
1000
−20
0
20
40
60
80
100
120
OUTPUT CURRENT (mA)
TEMPERATURE (°C)
Figure 13. Ground Current vs. Output Current
Figure 14. Quiescent Current vs. Temperature
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NCP186
TYPICAL CHARACTERISTICS
VIN = VOUT−NOM + 0.5 V or VIN = 1.8 V, whichever is greater, VEN = 1.2 V, IOUT = 1 mA, CIN = COUT = 1.0 mF, TJ = 25°C.
120
110
100
TJ = −40°C
90
80
70
VOUT−NOM = 1.8 V
IOUT = 0 mA
60
2.5
3.0
3.5
4.5
4.0
5.0
5.5
0.6
0.5
0.4
0.3
0.2
VEN = 0 V
−20
0
20
40
60
80
100
120
TEMPERATURE (°C)
Figure 15. Quiescent Current vs. Input Voltage
Figure 16. Standby Current vs. Temperature
OUTPUT CURRENT LIMIT (A)
1.9
2.0
VOUT−NOM = 3.9 V
VOUT−NOM = 3.3 V
1.8
1.7
VOUT−NOM = 1.2 V
1.6
1.5
1.4
VOUT−NOM = 1.8 V
1.3
1.2
1.1
−40
VOUT−FORCED = 0 V
−20
0
20
40
60
80
100
120
VOUT−NOM = 1.8 V
1.9
VOUT−NOM = 3.9 V
VOUT−NOM = 3.3 V
1.8
1.7
VOUT−NOM = 1.2 V
1.6
1.5
1.4
1.3
1.2
1.1
−40
VOUT−FORCED = 90% of VOUT−NOM
−20
0
20
40
60
80
100
TEMPERATURE (°C)
TEMPERATURE (°C)
Figure 17. Short Circuit Current vs.
Temperature
Figure 18. Output Current Limit vs.
Temperature
120
0.6
1.0
0.9
ENABLE INPUT CURRENT (mA)
SHORT CIRCUIT CURRENT (A)
0.7
INPUT VOLTAGE (V)
2.0
ENABLE THRESHOLD VOLTAGE (V)
0.8
0.1
0
−40
50
2.0
VOUT−NOM = 1.2 V
VOUT−NOM = 1.8 V
VOUT−NOM = 3.3 V
VOUT−NOM = 3.9 V
0.9
STANDBY CURRENT (mA)
QUIESCENT CURRENT (mA)
1.0
TJ = 125°C
TJ = 25°C
OFF −> ON
0.8
ON −> OFF
0.7
0.6
0.5
0.4
−40 −20
0
20
40
60
80
100
0.5
0.4
0.3
0.2
0.1
0
−40
120
VOUT−NOM = 1.2 V
VOUT−NOM = 1.8 V
VOUT−NOM = 3.3 V
VOUT−NOM = 3.9 V
−20
0
20
40
60
80
100
TEMPERATURE (°C)
TEMPERATURE (°C)
Figure 19. Enable Threshold Voltage vs.
Temperature
Figure 20. Enable Input Current vs.
Temperature
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120
NCP186
TYPICAL CHARACTERISTICS
90
50
45
VOUT−FORCED = VOUT−NOM
VIN = 5.5 V
VEN = 0 V
80
70
60
PSRR (dB)
40
35
30
20
−40
50
COUT = 1 mF X7R 0805
40
30
20
VOUT−NOM = 1.2 V
VOUT−NOM = 3.3 V
25
VOUT−NOM = 1.8 V, VIN = 2.8 V
VOUT−NOM = 3.3 V, VIN = 4.3 V
10
0
−20
0
20
40
60
80
100
120
10
100
1k
10k
100k
1M
TEMPERATURE (°C)
FREQUENCY (Hz)
Figure 21. Output Discharge Resistance vs.
Temperature (NCP186A option only)
Figure 22. Power Supply Rejection Ratio
OUTPUT VOLTAGE NOISE (nV/√Hz)
6
VOUT−NOM = 1.8 V, VIN = 2.8 V
VOUT−NOM = 3.9 V, VIN = 4.9 V
5
COUT = 1 mF X7R 0805
4
Integral Noise:
VOUT−NOM = 1.8 V
10 Hz − 100 kHz: 45 mVrms
10 Hz − 1 MHz: 61 mVrms
VOUT−NOM = 3.9 V
10 Hz − 100 kHz: 52 mVrms
10 Hz − 1 MHz: 68 mVrms
3
2
1
0
10
100
1K
10K
100K
1M
FREQUENCY (Hz)
Figure 23. Output Voltage Noise Spectral
Density
100 mA/div
VOUT−NOM = 1.2 V
IIN
VIN
VOUT
1 V/div
50 mA/div
VOUT−NOM = 1.2 V
1 V/div
OUTPUT DISCHARGE RESISTANCE (W)
VIN = VOUT−NOM + 0.5 V or VIN = 1.8 V, whichever is greater, VEN = 1.2 V, IOUT = 1 mA, CIN = COUT = 1.0 mF, TJ = 25°C.
IIN
VIN
VOUT
1 ms/div
20 ms/div
Figure 24. Turn−ON/OFF − VIN driven (slow)
Figure 25. Turn−ON − VIN driven (fast)
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10M
NCP186
TYPICAL CHARACTERISTICS
VIN = VOUT−NOM + 0.5 V or VIN = 1.8 V, whichever is greater, VEN = 1.2 V, IOUT = 1 mA, CIN = COUT = 1.0 mF, TJ = 25°C.
VOUT−NOM = 3.9 V
100 mA/div
50 mA/div
VOUT−NOM = 3.9 V
IIN
VIN
IIN
VIN
VOUT
1 V/div
1 V/div
VOUT
20 ms/div
1 ms/div
500 mV/div
1 V/div
VEN
VOUT−NOM = 1.2 V
Device with output discharge
VEN
VOUT
VOUT−NOM = 1.8 V
Device without output discharge
50 mA/div
50 mA/div
VOUT
Figure 27. Turn−ON − VIN driven (fast)
500 mV/div
1 V/div
Figure 26. Turn−ON/OFF − VIN driven (slow)
IIN
IIN
200 ms/div
200 ms/div
Figure 28. Turn−ON/OFF − EN driven
Figure 29. Turn−ON/OFF − EN driven
VOUT−NOM = 3.9 V
500 mV/div
VIN
tR = tF = 1 ms
1.8 V
10 mV/div
10 mV/div
500 mV/div
VOUT−NOM = 1.2 V
2.8 V
VOUT
1.2 V
5.4 V
VIN
tR = tF = 1 ms
4.4 V
VOUT
3.9 V
10 ms/div
10 ms/div
Figure 30. Line Transient Response
Figure 31. Line Transient Response
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NCP186
TYPICAL CHARACTERISTICS
1 V/div
VIN
500 mA/div
1000 mA
tR = tF = 1 ms
1 mA
1.2 V
VIN
1000 mA
tR = tF = 1 ms
IOUT
1 mA
VOUT
3.9 V
VOUT−NOM = 1.2 V
VOUT−NOM = 3.9 V
10 ms/div
10 ms/div
Figure 32. Load Transient Response
Figure 33. Load Transient Response
220
1.6
200
PD(MAX), 2 oz Cu 1.4
180
1.2
160
PD(MAX), 1 oz Cu 1.0
140
0.8
120
qJA, 1 oz Cu
0.6
100
qJA, 2 oz Cu
0.4
80
0.2
60
0
100
200
300
400
500
0
600
PCB COPPER AREA (mm2)
Figure 34. qJA and PD(MAX) vs. Copper Area
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PD(MAX), MAXIMUM POWER DISSIPATION (W)
VOUT
50 mV/div
IOUT
qJA, JUNCTION−TO−AMBIENT
THERMAL RESISTANCE (°C/W)
50 mV/div
500 mA/div
1 V/div
VIN = VOUT−NOM + 0.5 V or VIN = 1.8 V, whichever is greater, VEN = 1.2 V, IOUT = 1 mA, CIN = COUT = 1.0 mF, TJ = 25°C.
NCP186
APPLICATIONS INFORMATION
General
Enable Operation
The NCP186 is a high performance 1 A low dropout linear
regulator (LDO) delivering excellent noise and dynamic
performance. Thanks to its adaptive ground current
behavior the device consumes only 90 mA typ. of quiescent
current (no−load condition).
The regulator features low noise of 48 mVRMS, PSRR of
75 dB at 1 kHz and very good line/load transient
performance. Such excellent dynamic parameters, small
dropout voltage and small package size make the device an
ideal choice for powering the precision noise sensitive
circuitry in portable applications.
A logic EN input provides ON/OFF control of the output
voltage. When the EN is low the device consumes as low as
100 nA typ. from the IN pin.
The device is fully protected in case of output overload,
output short circuit condition or overheating, assuring a very
robust design.
The LDO uses the EN pin to enable/disable its operation
and to deactivate/activate the output discharge function
(A−version only).
If the EN pin voltage is < 0.4 V the device is disabled and
the pass transistor is turned off so there is no current flow
between the IN and OUT pins. On A−version the active
discharge transistor is active so the output voltage is pulled
to GND through 34 W (typ.) resistor.
If the EN pin voltage is > 1.0 V the device is enabled and
regulates the output voltage. The active discharge transistor
is turned off.
The EN pin has internal pull−down current source with
value of 150 nA typ. which assures the device is turned off
when the EN pin is unconnected. In case when the EN
function isn’t required the EN pin should be tied directly to
IN pin.
Output Current Limit
Output current is internally limited to a 1.4 A typ. The
LDO will source this current when the output voltage drops
down from the nominal output voltage (test condition is
VOUT−NOM – 100mV). If the output voltage is shorted to
ground, the short circuit protection will limit the output
current to 1.4 A typ. The current limit and short circuit
protection will work properly over the whole temperature
and input voltage ranges. There is no limitation for the short
circuit duration.
Input Capacitor Selection (CIN)
Input capacitor connected as close as possible is necessary
to ensure device stability. The X7R or X5R capacitor should
be used for reliable performance over temperature range.
The value of the input capacitor should be 1 mF or greater for
the best dynamic performance. This capacitor will provide
a low impedance path for unwanted AC signals or noise
modulated onto the input voltage.
There is no requirement for the ESR of the input capacitor
but it is recommended to use ceramic capacitor for its low
ESR and ESL. A good input capacitor will limit the
influence of input trace inductance and source resistance
during load current changes.
Thermal Shutdown
When the LDO’s die temperature exceeds the thermal
shutdown threshold value the device is internally disabled.
The IC will remain in this state until the die temperature
decreases by value called thermal shutdown hysteresis.
Once the IC temperature falls this way the LDO is back
enabled. The thermal shutdown feature provides the
protection against overheating due to some application
failure and it is not intended to be used as a normal working
function.
Output Capacitor Selection (COUT)
The LDO requires an output capacitor connected as close
as possible to the output and ground pins. The recommended
capacitor value is 1 mF, ceramic X7R or X5R type due to its
low capacitance variations over the specified temperature
range. The LDO is designed to remain stable with minimum
effective capacitance of 0.8 mF. When selecting the capacitor
the changes with temperature, DC bias and package size
needs to be taken into account. Especially for small package
size capacitors such as 0201 the effective capacitance drops
rapidly with the applied DC bias voltage (refer the
capacitor’s datasheet for details).
There is no requirement for the minimum value of
equivalent series resistance (ESR) for the COUT but the
maximum value of ESR should be less than 0.5 W. Larger
capacitance and lower ESR improves the load transient
response and high frequency PSRR. Only ceramic
capacitors are recommended, the other types like tantalum
capacitors not due to their large ESR.
Power Dissipation
Power dissipation caused by voltage drop across the LDO
and by the output current flowing through the device needs
to be dissipated out from the chip. The maximum power
dissipation is dependent on the PCB layout, number of used
Cu layers, Cu layers thickness and the ambient temperature.
The maximum power dissipation can be computed by
following equation:
P D(MAX) +
TJ * TA
[W]
q JA
(eq. 1)
Where (TJ − TA) is the temperature difference between the
junction and ambient temperatures and θJA is the thermal
resistance (dependent on the PCB as mentioned above).
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NCP186
The power dissipated by the LDO for given application
conditions can be calculated by the next equation:
P D + V IN @ I GND ) ǒV IN * V OUTǓ @ I OUT [W]
100 kHz) can be tuned by the selection of COUT capacitor
and proper PCB layout. A simple LC filter could be added
to the LDO’s IN pin for further PSRR improvement.
(eq. 2)
Enable Turn−On Time
Where IGND is the LDO’s ground current, dependent on
the output load current.
Connecting the exposed pad and N/C pin to a large ground
planes helps to dissipate the heat from the chip.
The relation of θJA and PD(MAX) to PCB copper area and
Cu layer thickness could be seen on the Figure 34.
The enable turn−on time is defined as the time from EN
assertion to the point in which VOUT will reach 98% of its
nominal value. This time is dependent on various
application conditions such as VOUT−NOM, COUT and TA.
PCB Layout Recommendations
To obtain good transient performance and good regulation
characteristics place CIN and COUT capacitors as close as
possible to the device pins and make the PCB traces wide.
In order to minimize the solution size, use 0402 or 0201
capacitors size with appropriate effective capacitance.
Larger copper area connected to the pins will also improve
the device thermal resistance. The actual power dissipation
can be calculated from the equation above (Power
Dissipation section). Exposed pad and N/C pin should be
tied to the ground plane for good power dissipation.
Reverse Current
The PMOS pass transistor has an inherent body diode
which will be forward biased in the case when VOUT > VIN.
Due to this fact in cases, where the extended reverse current
condition can be anticipated the device may require
additional external protection.
Power Supply Rejection Ratio
The LDO features very high power supply rejection ratio.
The PSRR at higher frequencies (in the range above
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12
NCP186
PACKAGE DIMENSIONS
XDFN8 1.6x1.2, 0.4P
CASE 711AS
ISSUE A
D
8X
ÍÍÍ
ÍÍÍ
ÍÍÍ
0.10 C
0.10 C
2X
0.10 C
L1
DETAIL A
OPTIONAL
CONSTRUCTION
E
PIN ONE
IDENTIFIER
2X
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
L
A
B
DIM
A
A1
b
D
D2
E
E2
e
L
L1
ÉÉ
ÉÉ
ÇÇ
EXPOSED Cu
TOP VIEW
MOLD CMPD
DETAIL B
OPTIONAL
CONSTRUCTION
A
DETAIL B
MILLIMETERS
MIN
MAX
0.30
0.45
0.00
0.05
0.13
0.23
1.60 BSC
1.20
1.40
1.20 BSC
0.20
0.40
0.40 BSC
0.15
0.25
0.05 REF
A1
8X
RECOMMENDED
MOUNTING FOOTPRINT*
0.08 C
NOTE 3
C
SIDE VIEW
1.44
PACKAGE
OUTLINE
8X
0.35
D2
DETAIL A
1
8X
SEATING
PLANE
1.40
4
E2
L1
0.44
8X
1
0.26
0.40
PITCH
DIMENSIONS: MILLIMETERS
8
8X
L
5
8X
e
e/2
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
b
0.10 C A
B
0.05 C
BOTTOM VIEW
ON Semiconductor and the
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NCP186/D