Material Content Data Sheet Sales Product Name ICE3RBR1765JZ MA# MA001359396 Package PG-DIP-7-3 Issued 17. April 2015 Weight* 644.95 mg Construction Element Material Group Substances CAS# if applicable Weight [mg] Average Mass [%] chip leadframe inorganic material inorganic material non noble metal non noble metal non noble metal noble metal organic material plastics inorganic material non noble metal noble metal plastics noble metal < 10% silicon phosphorus zinc iron copper gold carbon black epoxy resin silicondioxide tin silver epoxy resin silver 7440-21-3 7723-14-0 7440-66-6 7439-89-6 7440-50-8 7440-57-5 1333-86-4 60676-86-0 7440-31-5 7440-22-4 7440-22-4 3.779 0.59 0.048 0.01 0.194 0.03 300 3.872 0.60 6003 157.218 24.38 25.02 243767 250145 0.430 0.07 0.07 666 666 2.350 0.36 wire encapsulation leadfinish plating glue *deviation Sum [%] Average Mass [ppm] Sum [ppm] 0.59 5860 5860 75 3643 63.440 9.84 404.138 62.65 72.85 626616 728623 6.540 1.01 1.01 10141 10141 1.594 0.25 0.25 2472 2472 0.236 0.04 1.114 0.17 98364 366 0.21 Sum in total: 100.00 Important Remarks: 1. 2. 3. Infineon Technologies AG provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. This product is in compliance with EU Directive 2011/65/EU (RoHS) and does not use any exemption. Company Infineon Technologies AG Address 81726 München Internet www.infineon.com 1727 2093 1000000