1 of 3 Creation Date : November 22, 2017 (GMT) Multilayer Ceramic Chip Capacitors C1005X5R1A475K050BE TDK item description C1005X5R1A475KT***S Applications Commercial Grade Feature Soft Soft Termination Series C1005 [EIA 0402] Status Production Size Length(L) 1.00mm +0.25,-0.10mm Width(W) 0.50mm +0.20,-0.10mm Thickness(T) 0.50mm +0.20,-0.10mm Terminal Width(B) 0.10mm Min. Terminal Spacing(G) 0.30mm Min. Recommended Land Pattern (PA) 0.30mm to 0.50mm Recommended Land Pattern (PB) 0.35mm to 0.45mm Recommended Land Pattern (PC) 0.40mm to 0.60mm Electrical Characteristics Capacitance 4.7μF ±10% Rated Voltage 10VDC Temperature Characteristic X5R(±15%) Dissipation Factor (Max.) 10% Insulation Resistance (Min.) 21MΩ Other Soldering Method Reflow AEC-Q200 No Packing Punched (Paper)Taping [180mm Reel] Package Quantity 10000pcs ! Images are for reference only and show exemplary products. ! This PDF document was created based on the data listed on the TDK Corporation website. ! All specifications are subject to change without notice. Copyright(c) TDK Corporation. All rights reserved. Multilayer Ceramic Chip Capacitors 2 of 3 Creation Date : November 22, 2017 (GMT) C1005X5R1A475K050BE Characteristic Graphs(This is reference data, and does not guarantee the products characteristics.) ! Images are for reference only and show exemplary products. ! This PDF document was created based on the data listed on the TDK Corporation website. ! All specifications are subject to change without notice. Copyright(c) TDK Corporation. All rights reserved. Multilayer Ceramic Chip Capacitors C1005X5R1A475K050BE Associated Images Land Pattern (Terminal Connection) ! Images are for reference only and show exemplary products. ! This PDF document was created based on the data listed on the TDK Corporation website. ! All specifications are subject to change without notice. Copyright(c) TDK Corporation. All rights reserved. 3 of 3 Creation Date : November 22, 2017 (GMT)