NOM02A4-MW60G 200DPI Ultra High-Speed Contact Image Sensor Module Description www.onsemi.com The NOM02A4−MW60G contact image sensor (CIS) module integrates a white LED light source, lens and image sensor in a compact housing. The module is designed for document scanning, mark reading, gaming and office automation equipment applications and is suitable for scanning documents up to 216 mm wide. Four parallel analog video outputs are used to achieve an ultra high−speed scanning rate of 90 ms/line. The NOM02A4−MW60G module employs proprietary CMOS image sensing technology from ON Semiconductor to achieve high−speed performance and high sensitivity. IMAGE SENSOR MODULE A4 CASE MODAB Features MARKING DIAGRAM NOM02A4−MW60G YYMMSSSSSS YY MM SSSSSS G = Year = Month = Serial Number = Pb−Free Package GND VOUT3 VOUT4 VDD SP GND CP VSS GLED VLED CONNECTOR PIN ASSIGNMENT VOUT2 Light Source, Lens and Sensor are Integrated Into a Single Module 216 mm Scanning Width at 7.9 dots per mm Resolution 90 msec/Line Scanning Speed @ 5.0 MHz Pixel Rate Four Parallel Analog Video Outputs Supports A4 Paper Size at up to 286 Pages per Minute White LED Light Source Wide Dynamic Range Compact 232.1 mm x 19.2 mm x 13.7 mm Module Housing Low Power Light Weight 2.5 oz Packaging These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant VOUT1 • • • • • • • • • • • 1 2 3 4 5 6 7 8 9 10 11 12 Applications • Currency Verification • Document Scanning • Mark Readers Including Balloting, Test Scoring and Gaming • Machines Office Automation Equipment ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 2 of this data sheet. 4 Contact Image Sensor Module Analog to Digital Converters DSP LED Drivers Parallel Port Transceiver Paper Insertion Sensing Switch Scan System Timing and Control Motor Motor Controller and Driver Figure 1. Typical Scanner Application © Semiconductor Components Industries, LLC, 2015 April, 2015 − Rev. 2 1 Publication Order Number: NOM02A4−MW60G/D NOM02A4−MW60G Table 1. ORDERING INFORMATION Part Number NOM02A4−MW60G Package Shipping Configuration (Pb−free) 100 per packing carton White LED Light Bar VLED GLED VDD (+5 V) Rod Lens GND VSS (−5 V) Amp VOUT4 Amp VOUT3 Amp VOUT2 Amp VOUT1 Photo Sensor Array SP Buf CP Buf 1 2 3 4 1728 Shift Register VOUT1 Pixels 1 to 448 VOUT2 Pixels 449 to 896 VOUT3 Pixels 897 to 1344 VOUT4 Pixels 1345 to 1728 Pixel 1 corresponds to connector end of the module Figure 2. Simplified Block Diagram Table 2. PIN FUNCTION DESCRIPTION Pin Pin Name Description 1 VOUT1 Analog Video Output 1 2 VOUT2 Analog Video Output 2 3 GND 4 VOUT3 Ground Analog Video Output 3 5 VOUT4 Analog Video Output 4 6 VDD 7 SP 8 GND +5 V power supply Shift register start pulse Ground 9 CP 10 VSS Sampling clock pulse 11 GLED Ground for the LED light source 12 VLED Power supply for the LED light source −5 V to −12 V power supply www.onsemi.com 2 NOM02A4−MW60G Table 3. ABSOLUTE MAXIMUM RATINGS Parameter Symbol Value Unit VDD 7 V VSS −15 V VLED 6 V Power supply current ILED 550 mA Input voltage range for SP, CP Vin −0.5 to VDD + 0.5 V TSTG −20 to 75 °C HSTG 10 to 90 % ESDHBM $2 kV Power supply voltage Storage Temperature Storage Humidity, Non−Condensing ESD Capability, Contact Discharge (Note 1) Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. This module assembly has been ESD tested to IEC61000−4−2 (HBM) Contact Discharge Table 4. RECOMMENDED OPERATING RANGES (Unless otherwise specified, these specifications apply TA = 25°C) (Note 2) Symbol Min Typ Max Unit VDD 4.5 5 5.5 V VSS −12 −5 −4.5 V VLED 4.5 5 5.5 V IDD 50 87 95 mA ISS 20 25 30 mA ILED 270 350 430 mA Low level input voltage for SP, CP VIL 0 0 0.8 V High level input voltage for SP, CP VIH 4.5 5.0 VDD + 0.3 V Line scanning rate (Note 4) Parameter Power supply voltage (Note 3) Power supply current Tint 75 90 224 ms Clock frequency (Note 5) f 2.0 5.0 6.0 MHz Clock period to 166 200 500 ns Clock pulse width (Note 6) tw 42 50 125 ns Clock pulse high duty cycle DCCP 20 25 60 % twSP 150 180 480 ns Start pulse setup time tsu 20 ns Start pulse hold time th 20 ns Prohibit crossing time (Note 7) tprh 20 ns Clock to Video output propagation delay rising (Note 8) tpcor 100 ns Clock to Video output propagation delay falling (Note 8) tpcof 20 ns Operating Temperature Top 0 50 °C Operating Humidity, Non−Condensing Hop 10 60 % Start pulse width (Note 6) 2. 3. 4. 5. 6. 7. Refer to Figure 3 for more information on AC characteristics VLED directly affects illumination intensity, which directly affects VOUT. Tint is the line scanning rate or integration time. Tint is determined by the interval between two start pulses. The clock is proportional to Tint. Main clock frequency (f) corresponds to the video sampling frequency. Min, Typ, Max specifications reflect operation at the corresponding Min, Typ, Max clock frequency. Prohibit crossing time is to insure that two start pulses are not supplied in the same scan line time. SP may only be active high during one falling edge of CP for any given scan. 8. Applies to VOUT1, VOUT2, VOUT3 and VOUT4 which have identical electrical characteristics. The only physical difference is the active scan length of VOUT4 which has 64 less pixels. www.onsemi.com 3 NOM02A4−MW60G Table 5. PHYSICAL SPECIFICATIONS Symbol Typ Unit Scan width Parameter PDw 216 mm Number of Photo Detector Arrays PDAn 27 arrays PDn 1728 elements PDn1,2,3 448 elements PDn4 384 elements Number of Photo Detectors Number of Photo Detectors for VOUT1, VOUT2, VOUT3 Number of Photo Detectors for VOUT4 Table 6. PHYSICAL CHARACTERISTICS Parameter Pixel pitch Symbol Min PDsp Typ Max Unit mm 125 Inter−array spacing PDAsp 150 180 210 mm Inter−array vertical alignment PDAvxp −40 0 40 mm X Y 0.2 0.16 0.24 0.23 0.305 0.31 White LED chromaticity coordinates Table 7. ELECTRO−OPTICAL CHARACTERISTICS TEST CONDITIONS Parameter Symbol Value Unit VDD 5.0 V VSS −5.0 V VLED 5.0 V f 5.0 MHz DCCP 25 % Tint 90 ms LED arrays pulsed time on (Note 9) LED_Ton 26 ms LED arrays pulsed time off (Note 9) LED_Toff 356 ms Top 25 °C Power supply voltage Clock frequency Clock pulse high duty cycle Line scanning rate Operating Temperature 9. Production tested with pulsing LEDs. www.onsemi.com 4 NOM02A4−MW60G Table 8. ELECTRO−OPTICAL CHARACTERISTICS (Unless otherwise specified, these specifications were achieved with the test conditions defined in Table 7) Parameter Bright analog output voltage (Note 10) Bright output non−uniformity (Note 11) Symbol Min Typ Max Unit Vpavg 0.9 1.0 1.1 V Up −30 30 % Bright output non−uniformity total (Note 12) Uptotal 60 % Adjacent pixel non−uniformity (Note 13) Upadj 25 % Dark output voltage (Note 14) Vd 200 mV Dark non−uniformity (Note 15) Ud 75 mV Modulation transfer function at 50 line pairs per in (lp/in) (Note 16) MTF50 40 % Modulation transfer function at 100 line pairs per in (lp/in) (Notes 16, 17) MTF100 20 % 10. Vpavg = Ȍ Vp(n)/1728, where Vp is the pixel amplitude value of VOUT for a bright signal defined as a white document with LEDs turned on, n is the sequential pixel number in one scan line. 11. Up = [(Vpmax – Vpavg)/Vpavg] x 100%, or [Vpavg – Vpmin)/Vpavg] x 100%, whichever is greater, where Vpmax is the maximum pixel voltage of any pixel at full bright Vpmin is the minimum pixel voltage of any pixel at full bright 12. Uptotal = [(Vpmax – Vpmin)/Vpavg] x 100%, 13. Upadj = MAX [ | (Vp(n) – Vp(n+1) | / Vp(n)] x 100%, where Upadj is the nonuniformity in percent between adjacent pixels for a bright background 14. Vd is the pixel amplitude value of VOUT for a dark signal defined as a black document with LEDs turned off 15. Ud = Vdmax – Vdmin, where Vdmax is the maximum pixel voltage of any dark pixel with the LEDs turned off Vdmin is the minimum pixel voltage of any dark pixel with the LEDs turned off 16. MTF = [(Vmax – Vmin)/(Vmax + Vmin)] x 100%, where Vmax is the maximum output voltage at the specified line pairs per inch (lp/in) Vmin is the minimum output voltage at the specified lp/in 17. For information only. to tw CP tprh tprh th SP tsu tpcof twSP Vd Vp VOUT GND tpcor Pixel 1 Pixel 2 Figure 3. Timing Diagram www.onsemi.com 5 Pixel 3 Pixel 4 NOM02A4−MW60G DESCRIPTION OF OPERATION processed, the motor advances the paper and the next scan The NOM02A4−MW60G module consists of 27 contact line is captured. image sensors, each with 64 pixel elements, that are Initialization cascaded to provide 1728 photo−detectors with their associated multiplex switches and four double−buffered digital shift registers that control its sequential readout. Four Document no buffer amplifiers amplify the video pixels from the image Detected? sensors and output the four analog video signals of the module as shown in Figure 2. In operation, the sensors Start Scan produce analog image pixel signals (or video signals) SP= , CP= CTR=0 proportional to the exposure on the corresponding picture elements on the document. Each of the VOUT1, VOUT2 CP= and VOUT3 signals output 448 pixels for each scan line. The VOUT4 signal outputs 384 valid pixels followed by 64 null Read 4 Pixels into Memory pixels for each scan line. The first bit shifted out from VOUT1 during each scan represents the first pixel on the no connector end of the module. CTR++ == 448 A pictorial of the NOM02A4−MW60G cross section view is shown in Figure 4. Mounted in the module is a one−to−one graded−index micro lens array that focuses the scanned Transfer Scan Line Data document image onto the sensing plane. Illumination is accomplished by means of an integrated LED light source. Document yes All components are housed in a small plastic housing, which Detected? has a glass cover. The top surface of the glass acts as the focal point for the object being scanned and protects the imaging array, micro lens assembly and LED light source from dust. Done Functional Description Glass Window Document Surface Figure 5. Typical Scanner Algorithm Figure 5 outlines the basic steps in the scanner control sequence. First the circuits are initialized and the scanner waits for a document to be detected, usually by a paper sensing switch. Then a start pulse and clock pulse are supplied to capture a line image. At the next clock pulse the first pixel value appears on the output. The pixel can be stored in a local line buffer memory. Subsequent clocks cause the remaining pixels to be shifted out and stored in the line buffer. Once the complete line has been shifted out it can be transferred to the host application and the system advances the paper and the line scan process repeats until the paper sensing switch indicates the document has passed completely through the scanner. Light Path Rod Lens Module Housing LED Bar Sensors PCB Figure 4. Module Cross Section View Connector Pin Out Description Connections to the module are via a 3.5 x 16.75mm 12−pin connector (Molex part number 53048−1210) located at one end of the module as shown in the package drawing on page 8. The location of pin number 1 is indicated on the package drawing. Device Marking and Barcode Description Each module is marked with a tag that contains the part number, a number combining the manufacturing date code and serial number and a barcode. The barcode presents the date code and serial number in Interleave 2 of 5 barcode format as follows YYMMSSSSSS where YY is the year, MM is the month, and SSSSSS is the serial number. Scanner Applications A typical use of the NOM02A4−MW60G module in scanner applications is shown in Figure 6. The document to be digitized is fed into the scanner where a sensor detects its presence. The scanner then operates the motor to move the paper under the contact image sensor module. The module illuminates the paper with internal LEDs and the image sensor pixel array detects the amount of reflected light and simultaneously measures a full line of pixels which are sampled and transferred to a FIFO for storage and conversion to a parallel output format. Once the pixel line is Glass Lens Care Precautions should be taken to avoid scratching or touching the glass lens. The glass lens may be cleaned with alcohol. www.onsemi.com 6 NOM02A4−MW60G Figure 6. Typical Scanner Assembly www.onsemi.com 7 NOM02A4−MW60G PACKAGE DIMENSIONS IMAGE SENSOR MODULE A4 CASE MODAB ISSUE B NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. LEADING EDGE OF THE APPROACH ANGLE ON THE GLASS IS LOWER THAN THE TOP OF THE HOUSING. 4. BORE DEPTH IS 6.0 WITH A 0.2 LEAD−IN CHAMFER. 5. CONNECTOR ASSEMBLY; MOLEX 53048−1210, 1 X 12 PIN, PITCH 1.25. 6. GLASS IS GLUED ON ALL 4 SIDES. 7. GLASS THICKNESS IS 1.85. 8. USE M2.3 SELF TAPPING SCREWS FOR MOUNTING. TORQUE SCREWS BETWEEN 1.80 KGF−CM AND 2.00 KGF−CM. 9. DIMENSION D1 DENOTES THE SCAN LENGTH. 10. DIMENSION K DENOTES THE POSITION OF THE FIRST PIXEL. MILLIMETERS DIM MIN MAX A 12.60 13.60 A1 5.45 6.45 A2 0.58 REF B 17.70 18.30 B1 18.70 19.30 B2 5.50 6.50 C 15.30 15.70 D 231.50 232.50 D1 216.00 REF E 2.15 2.25 F 112.50 113.50 H 34.50 35.50 J 5.70 6.30 K 5.30 7.30 L 6.00 REF www.onsemi.com 8 NOM02A4−MW60G PACKING DIMENSIONS NO. NAME MATERIAL 1 Shockproof Pad EPE 2 Packing Tray POLYFOAM 3 Conduct Electricity Sheet PE + CONDUCTIVE SHEET 4 Waterproof Bag PE 5 Packing Box−Carton KRAFT PAPER ON Semiconductor and the are registered trademarks of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States and/or other countries. SCILLC owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. 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