Sample & Buy Product Folder Support & Community Tools & Software Technical Documents DS250DF810 SNLS495A – SEPTEMBER 2015 – REVISED JANUARY 2016 DS250DF810 25 Gbps Multi-Rate 8-Channel Retimer 1 Features • 1 • • • • • • • • • • • • Octal-Channel Multi-Rate Retimer with Integrated Signal Conditioning All Channels Lock Independently from 20.6 to 25.8 Gbps (Including Sub-Rates Like 10.3125 Gbps, 12.5 Gbps, and More) Ultra-Low Latency: <500 ps typical for 25.78125 Gbps data rate Single Power Supply, No Low-Jitter Reference Clock Required, and Integrated AC Coupling Capacitors to Reduce Board Routing Complexity and BOM Cost Integrated 2×2 Cross Point Adaptive Continuous Time Linear Equalizer (CTLE) Adaptive Decision Feedback Equalizer (DFE) Low-Jitter Transmitter with 3-Tap FIR Filter Combined Equalization Supporting 35+ dB Channel Loss at 12.9 GHz Adjustable Transmit Amplitude: 205 mVppd to 1225 mVppd (typical) On-Chip Eye Opening Monitor (EOM), PRBS Pattern Checker/Generator Small 8 mm × 13 mm BGA Package with Easy Flow-Through Routing • Unique Pinout Allows Routing High-Speed Signals Underneath the Package Pin-Compatible Repeater Available 2 Applications • • • • Backplane/Mid-plane Reach Extension Jitter Cleaning for Front-Port Optical IEEE802.3bj 100GbE, Infiniband EDR, and OIFCEI-25G-LR/MR/SR/VSR Electrical Interfaces SFP28, QSFP28, CFP2/CFP4, CDFP 3 Description The DS250DF810 is an eight-channel multi-rate Retimer with integrated signal conditioning. It is used to extend the reach and robustness of long, lossy, crosstalk-impaired high-speed serial links while achieving a bit error rate (BER) of 10-15 or less. Each channel of the DS250DF810 independently locks to serial data rates in a continuous range from 20.6 Gbps to 25.8 Gbps or to any supported sub-rate (÷2 and ÷4), including key data rates such as 10.3125 Gbps and 12.5 Gbps, which allows the DS250DF810 to support individual lane Forward Error Correction (FEC) pass-through. Device Information(1) PART NUMBER DS250DF810 PACKAGE BODY SIZE (NOM) 135-pin fcBGA (135) 8.0 mm × 13.0 mm (1) For all available packages, see the orderable addendum at the end of the data sheet. 4 Simplified Schematic . . . RX0P RX0N . . . RX7P RX7N . . . TX0P TX0N . . . . . . 2.5V or 3.3V TX7P TX7N To other opendrain interrupt pins INT_N VDD SMBus 1 NŸ Slave mode EN_SMB TEST SDA(1) SDC(1) To system SMBus Address straps (pull-up, pulldown, or float) ADDR0 ADDR1 25 MHz SMBus Slave mode CAL_CLK_IN CAL_CLK_OUT READ_EN_N ALL_DONE_N 2.5V 1 F (2x) 0.1 F (4x) VDD GND 7R QH[W GHYLFH¶V CAL_CLK_IN Float for SMBus Slave mode, or connect to next GHYLFH¶V 5($'_EN_N for SMBus Master mode (1) SMBus signals need to be pulled up elsewhere in the system. 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. DS250DF810 SNLS495A – SEPTEMBER 2015 – REVISED JANUARY 2016 www.ti.com 5 Description con't. Integrated physical AC coupling capacitors (TX and RX) eliminate the need for external capacitors on the PCB. The DS250DF810 has a single power supply and minimal need for external components. These features reduce PCB routing complexity and BOM cost. The advanced equalization features of the DS250DF810 include a low-jitter 3-tap transmit finite impulse response (FIR) filter, an adaptive continuous-time linear equalizer (CTLE), and an adaptive decision feedback equalizer (DFE). This enables reach extension for lossy interconnect and backplanes with multiple connectors and crosstalk. The integrated CDR function is ideal for front-port optical module applications to reset the jitter budget and retime the high-speed serial data. The DS250DF810 implements 2x2 cross-point on each channel pair, providing the host with both lane crossing and fanout options. The DS250DF810 can be configured either via the SMBus or through an external EEPROM. Up to 16 devices can share a single EEPROM. A non-disruptive on-chip eye monitor and a PRBS generator/checker allow for insystem diagnostics. 2 Submit Documentation Feedback Copyright © 2015–2016, Texas Instruments Incorporated Product Folder Links: DS250DF810 DS250DF810 www.ti.com SNLS495A – SEPTEMBER 2015 – REVISED JANUARY 2016 Table of Contents 1 2 3 4 5 6 7 Features .................................................................. Applications ........................................................... Description ............................................................. Simplified Schematic............................................. Description con't.................................................... Revision History..................................................... Device and Documentation Support.................... 1 1 1 1 2 3 4 7.1 7.2 7.3 7.4 7.5 8 Device Support.......................................................... Community Resources.............................................. Trademarks ............................................................... Electrostatic Discharge Caution ................................ Glossary .................................................................... 4 4 4 4 4 Mechanical, Packaging, and Orderable Information ............................................................. 4 6 Revision History Changes from Original (September 2015) to Revision A • Page Product Preview to Production Data Release ....................................................................................................................... 1 Submit Documentation Feedback Copyright © 2015–2016, Texas Instruments Incorporated Product Folder Links: DS250DF810 3 DS250DF810 SNLS495A – SEPTEMBER 2015 – REVISED JANUARY 2016 www.ti.com 7 Device and Documentation Support 7.1 Device Support 7.1.1 Development Support For additional information, see TI’s Surface Mount Technology (SMT) References at: http://focus.ti.com/quality/docs under the "Quality & Lead (Pb)-Free Data" menu. 7.2 Community Resources The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use. TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers. Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support. 7.3 Trademarks E2E is a trademark of Texas Instruments. 7.4 Electrostatic Discharge Caution These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. 7.5 Glossary SLYZ022 — TI Glossary. This glossary lists and explains terms, acronyms, and definitions. 8 Mechanical, Packaging, and Orderable Information The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. 4 Submit Documentation Feedback Copyright © 2015–2016, Texas Instruments Incorporated Product Folder Links: DS250DF810 PACKAGE OPTION ADDENDUM www.ti.com 29-Jan-2016 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) DS250DF810ABVR ACTIVE FCBGA ABV 135 1000 Green (RoHS & no Sb/Br) SNAGCU Level-3-260C-168 HR -10 to 85 DS250DF8 DS250DF810ABVT ACTIVE FCBGA ABV 135 250 Green (RoHS & no Sb/Br) SNAGCU Level-3-260C-168 HR -10 to 85 DS250DF8 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 29-Jan-2016 In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 29-Jan-2016 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant DS250DF810ABVR FCBGA ABV 135 1000 330.0 24.4 8.4 13.4 3.0 12.0 24.0 Q2 DS250DF810ABVT FCBGA ABV 135 250 178.0 24.4 8.4 13.4 3.0 12.0 24.0 Q2 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 29-Jan-2016 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) DS250DF810ABVR FCBGA ABV 135 1000 367.0 367.0 45.0 DS250DF810ABVT FCBGA ABV 135 250 213.0 191.0 55.0 Pack Materials-Page 2 PACKAGE OUTLINE ABV0135A FCBGA - 2.51 mm max height SCALE 1.300 BALL GRID ARRAY 13.2 12.9 B A (11) BALL A1 CORNER 8.2 7.9 (6) (0.5) C 2.51 MAX SEATING PLANE BALL TYP (0.58) 0.2 C 0.405 TYP 0.325 11.2 TYP SYMM (0.9) TYP J H (0.8) TYP G 6.4 TYP F SYMM E D C 135X B A 0.8 TYP BALL A1 CORNER 1 2 3 4 5 6 7 8 0.51 0.41 0.2 0.08 C A C B 9 10 11 12 13 14 15 0.8 TYP 4221740/A 11/2014 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. www.ti.com EXAMPLE BOARD LAYOUT ABV0135A FCBGA - 2.51 mm max height BALL GRID ARRAY (0.8) TYP 135X ( 0.4) 1 2 3 5 4 6 7 8 9 10 11 12 13 14 15 A B (0.8) TYP C D SYMM E F G H J SYMM LAND PATTERN EXAMPLE SCALE:8X ( 0.4) METAL 0.05 MAX ( 0.4) SOLDER MASK OPENING 0.05 MIN METAL UNDER SOLDER MASK SOLDER MASK OPENING SOLDER MASK DEFINED NON-SOLDER MASK DEFINED (PREFERRED) SOLDER MASK DETAILS NOT TO SCALE 4221740/A 11/2014 NOTES: (continued) 3. Final dimensions may vary due to manufacturing tolerance considerations and also routing constraints. For information, see Texas Instruments literature number SPRU811 (www.ti.com/lit/spru811). www.ti.com EXAMPLE STENCIL DESIGN ABV0135A FCBGA - 2.51 mm max height BALL GRID ARRAY ( 0.4) TYP (0.8) TYP 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 A (0.8) TYP B C D SYMM E F G H J SYMM SOLDER PASTE EXAMPLE BASED ON 0.15 mm THICK STENCIL SCALE:8X 4221740/A 11/2014 NOTES: (continued) 4. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. www.ti.com IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. 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