STMicroelectronics M24M01-RMN6TG 1 mbit serial iâ²c bus eeprom Datasheet

M24M01-R
1 Mbit serial I²C bus EEPROM
Features
■
Compatible with I2C extended addressing
■
Two-wire I2C serial interface
supports 1 MHz protocol
■
Single supply voltage:
– 1.8 V to 5.5 V
■
Hardware write control
■
Byte and Page Write (up to 256 bytes)
■
Random and Sequential Read modes
■
Self-timed programming cycle
■
Automatic address incrementing
■
Enhanced ESD/Latch-Up protection
■
More than 1 million Write cycles
■
More than 40-year data retention
■
Packages
– ECOPACK® (RoHS compliant)
November 2007
SO8 (MN)
150 mils width
SO8 (MW)
208 mils width
Rev 3
1/30
www.st.com
1
Contents
M24M01-R
Contents
1
Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
2
Signal description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
2.1
Serial Clock (SCL) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
2.2
Serial Data (SDA) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
2.3
Chip Enable (E1, E2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
2.4
Write Control (WC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
2.5
VSS ground . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
2.6
Supply voltage (VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
2.6.1
3
4
2/30
2.6.2
Operating supply voltage VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Power-up conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
2.6.3
Device reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
2.6.4
Power-down conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Device operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
3.1
Start condition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
3.2
Stop condition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
3.3
Acknowledge bit (ACK) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
3.4
Data input . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
3.5
Memory addressing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
3.6
Write operations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
3.7
Byte Write . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
3.8
Page Write . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
3.9
ECC (error correction code) and Write cycling . . . . . . . . . . . . . . . . . . . . . 16
3.10
Minimizing system delays by polling on ACK . . . . . . . . . . . . . . . . . . . . . . 18
3.11
Read operations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
3.12
Random Address Read . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
3.13
Current Address Read . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
3.14
Sequential Read . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
3.15
Acknowledge in Read mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Initial delivery state . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
M24M01-R
Contents
5
Maximum rating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
6
DC and AC parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
7
Package mechanical . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
8
Part numbering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
9
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
3/30
List of tables
M24M01-R
List of tables
Table 1.
Table 2.
Table 3.
Table 4.
Table 5.
Table 6.
Table 7.
Table 8.
Table 9.
Table 10.
Table 11.
Table 12.
Table 13.
Table 14.
Table 15.
Table 16.
4/30
Signal names . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Device select code . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Most significant address byte . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Least significant address byte . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Operating modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
AC measurement conditions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Input parameters. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
DC characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
AC characteristics at 400 kHz. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
AC characteristics at 1 MHz (preliminary data). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
SO8 narrow – 8 lead plastic small outline, 150 mils body width, package
mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
SO8W – 8 lead plastic small outline, 208 mils body width, package
mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
Ordering information scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
M24M01-R
List of figures
List of figures
Figure 1.
Figure 2.
Figure 3.
Figure 4.
Figure 5.
Figure 6.
Figure 7.
Figure 8.
Figure 9.
Figure 10.
Figure 11.
Figure 12.
Figure 13.
Figure 14.
Logic diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
SO connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Device select code . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Maximum Rbus value versus bus parasitic capacitance (Cbus) for an I2C
bus at maximum frequency fC = 400 kHz . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Maximum Rbus value versus bus parasitic capacitance (Cbus) for an I2C
bus at maximum frequency fC = 1MHz . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
I2C bus protocol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Write mode sequences with WC = 1 (data write inhibited) . . . . . . . . . . . . . . . . . . . . . . . . . 14
Write mode sequences with WC = 0 (data write enabled) . . . . . . . . . . . . . . . . . . . . . . . . . 16
Write cycle polling flowchart using ACK . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Read mode sequences . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
AC measurement I/O waveform . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
AC waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
SO8 narrow – 8 lead plastic small outline, 150 mils body width, package outline . . . . . . . 26
SO8W – 8 lead plastic small outline, 208 mils body width, package outline. . . . . . . . . . . . 27
5/30
Description
1
M24M01-R
Description
The M24M01-R is an I2C-compatible electrically erasable programmable memory
(EEPROM) device organized as 128 Kb × 8 bits.
The I2C bus is a two-wire serial interface, comprising a bidirectional data line and a clock
line. The devices carry a built-in 4-bit device type identifier code (1010) in accordance with
the I2C bus definition.
The M24M01-R behaves as a slave in the I2C protocol, with all memory operations
synchronized by the serial clock. Read and Write operations are generated by the bus
master and initiated by a Start condition, followed by the device select code, address bytes
and data bytes. Data transfers are terminated by a Stop condition after an Ack for Write, and
after a NoAck for Read.
When writing data to the memory, the device inserts an acknowledge bit during the 9th bit
time, following the bus master’s 8-bit transmission. When data is read by the bus master, the
bus master acknowledges the receipt of the data byte in the same way.
In order to meet environmental requirements, ST offers the M24M01-R in ECOPACK®
packages. ECOPACK® packages are Lead-free and RoHS compliant.
ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com.
Figure 1.
Logic diagram
VCC
2
E1-E2
SCL
SDA
M24M01-R
WC
VSS
AI13415b
Table 1.
Signal names
Signal name
6/30
Function
Direction
E1, E2
Chip Enable
Input
SDA
Serial Data
I/O
SCL
Serial Clock
Input
WC
Write Control
Input
VCC
Supply voltage
VSS
Ground
M24M01-R
Description
Figure 2.
SO connections
M24M01-R
NC
E1
E2
VSS
1
2
3
4
8
7
6
5
VCC
WC
SCL
SDA
AI13416b
1. See Section 7: Package mechanical for package dimensions, and how to identify pin-1.
2. NC = Not Connected internally.
7/30
Signal description
M24M01-R
2
Signal description
2.1
Serial Clock (SCL)
This input signal is used to strobe all data in and out of the device. In applications where this
signal is used by slave devices to synchronize the bus to a slower clock, the bus master
must have an open drain output, and a pull-up resistor must be connected from Serial Clock
(SCL) to VCC. (Figure 5 indicates how the value of the pull-up resistor can be calculated). In
most applications, though, this method of synchronization is not employed, and so the pullup resistor is not necessary, provided that the bus master has a push-pull (rather than open
drain) output.
2.2
Serial Data (SDA)
This bidirectional signal is used to transfer data in or out of the device. It is an open drain
output that may be wire-OR’ed with other open drain or open collector signals on the bus. A
pull up resistor must be connected from Serial Data (SDA) to VCC. (Figure 5 indicates how
the value of the pull-up resistor can be calculated).
2.3
Chip Enable (E1, E2)
These input signals are used to set the value that is to be looked for on the two bits (b2, b1)
of the 7-bit device select code. These inputs must be tied to VCC or VSS, to establish the
device select code as shown in Figure 3. When not connected (left floating), these inputs
are read as low (0,0).
Figure 3.
Device select code
VCC
VCC
M24xxx
M24xxx
Ei
Ei
VSS
VSS
Ai12806
2.4
Write Control (WC)
This input signal is useful for protecting the entire contents of the memory from inadvertent
write operations. Write operations are disabled to the entire memory array when Write
Control (WC) is driven high. When unconnected, the signal is internally read as VIL, and
Write operations are allowed.
When Write Control (WC) is driven high, device select and address bytes are
acknowledged, Data bytes are not acknowledged.
8/30
M24M01-R
2.5
Signal description
VSS ground
VSS is the reference for the VCC supply voltage.
2.6
Supply voltage (VCC)
2.6.1
Operating supply voltage VCC
Prior to selecting the memory and issuing instructions to it, a valid and stable VCC voltage
within the specified [VCC(min), VCC(max)] range must be applied (see Table 7). In order to
secure a stable DC supply voltage, it is recommended to decouple the VCC line with a
suitable capacitor (usually of the order of 10 nF to 100 nF) close to the VCC/VSS package
pins.
This voltage must remain stable and valid until the end of the transmission of the instruction
and, for a Write instruction, until the completion of the internal write cycle (tW).
2.6.2
Power-up conditions
When the power supply is turned on, VCC rises from VSS to VCC. The VCC rise time must not
vary faster than 1 V/µs.
2.6.3
Device reset
In order to prevent inadvertent Write operations during power-up, a power on reset (POR)
circuit is included. At power-up (continuous rise of VCC), the device does not respond to any
instruction until VCC has reached the power on reset threshold voltage (this threshold is
lower than the minimum VCC operating voltage defined in Table 7). When VCC passes over
the POR threshold, the device is reset and is in Standby Power mode.
In a similar way, during power-down (continuous decrease in VCC), as soon as VCC drops
below the Power On Reset threshold voltage, the device stops responding to any instruction
sent to it.
2.6.4
Power-down conditions
During power-down (continuous decrease in VCC), the device must be in the Standby Power
mode (mode reached after decoding a Stop condition, assuming that is there is no internal
Write cycle in progress).
9/30
Signal description
M24M01-R
Maximum Rbus value versus bus parasitic capacitance (Cbus) for an I2C
bus at maximum frequency fC = 400 kHz
Figure 4.
Bus line pull-up resistor
(k )
100
fC = 400 kHz, tLOW = 1.3 µs
Rbus x Cbus time
constant must be less than
500 ns
VCC
10
Rbus
I²C bus
master
SCL
M24xxx
SDA
1
10
100
Cbus
1000
Bus line capacitor (pF)
ai14796
Bus line pull-up resistor (k )
Figure 5.
Maximum Rbus value versus bus parasitic capacitance (Cbus) for an I2C
bus at maximum frequency fC = 1MHz
100
VCC
fC = 1 MHz, tLOW = 500 ns,
time constant Rbus x Cbus
must be less than 150 ns
Rbus
I²C bus
master
10
fC = 1 MHz, tLOW = 700 ns,
time constant Rbus x Cbus
must be less than 270 ns
SCL
M24xxx
SDA
Cbus
1
10
100
Bus line capacitor (pF)
ai14795
10/30
M24M01-R
Signal description
Figure 6.
I2C bus protocol
SCL
SDA
SDA
Input
START
Condition
SCL
1
SDA
MSB
2
SDA
Change
STOP
Condition
3
7
8
9
ACK
START
Condition
SCL
1
SDA
MSB
2
3
7
8
9
ACK
STOP
Condition
AI00792B
Table 2.
Device select code
Chip Enable
address(2)
Device type identifier(1)
Device select code
A16
RW
b7
b6
b5
b4
b3
b2
b1
b0
1
0
1
0
E2
E1
A16
RW
1. The most significant bit, b7, is sent first.
2. E1 and E2 are compared against the respective external pins on the memory device.
Table 3.
b15
Table 4.
b7
Most significant address byte
b14
b13
b12
b11
b10
b9
b8
b3
b2
b1
b0
Least significant address byte
b6
b5
b4
11/30
Device operation
3
M24M01-R
Device operation
The device supports the I2C protocol. This is summarized in Figure 6. Any device that sends
data on to the bus is defined to be a transmitter, and any device that reads the data to be a
receiver. The device that controls the data transfer is known as the bus master, and the
other as the slave device. A data transfer can only be initiated by the bus master, which will
also provide the serial clock for synchronization. The M24M01-R device is always a slave in
all communication.
3.1
Start condition
Start is identified by a falling edge of Serial Data (SDA) while Serial Clock (SCL) is stable in
the high state. A Start condition must precede any data transfer command. The device
continuously monitors (except during a Write cycle) Serial Data (SDA) and Serial Clock
(SCL) for a Start condition, and will not respond unless one is given.
3.2
Stop condition
Stop is identified by a rising edge of Serial Data (SDA) while Serial Clock (SCL) is stable
and driven high. A Stop condition terminates communication between the device and the
bus master. A Read command that is followed by NoAck can be followed by a Stop condition
to force the device into the Standby mode. A Stop condition at the end of a Write command
triggers the internal EEPROM Write cycle.
3.3
Acknowledge bit (ACK)
The acknowledge bit is used to indicate a successful byte transfer. The bus transmitter,
whether it be bus master or slave device, releases Serial Data (SDA) after sending eight bits
of data. During the 9th clock pulse period, the receiver pulls Serial Data (SDA) low to
acknowledge the receipt of the eight data bits.
3.4
Data input
During data input, the device samples Serial Data (SDA) on the rising edge of Serial Clock
(SCL). For correct device operation, Serial Data (SDA) must be stable during the rising edge
of Serial Clock (SCL), and the Serial Data (SDA) signal must change only when Serial Clock
(SCL) is driven low.
12/30
M24M01-R
3.5
Device operation
Memory addressing
To start communication between the bus master and the slave device, the bus master must
initiate a Start condition. Following this, the bus master sends the device select code, shown
in Table 2 (on Serial Data (SDA), most significant bit first).
The device select code consists of a 4-bit device type identifier, and a 2-bit Chip Enable
“Address” (E2, E1). To address the memory array, the 4-bit device type identifier is 1010b.
Up to four memory devices can be connected on a single I2C bus. Each one is given a
unique 2-bit code on the Chip Enable (E1, E2) inputs. When the device select code is
received, the device only responds if the Chip Enable Address is the same as the value on
the Chip Enable (E1, E2) inputs.
The 8th bit is the Read/Write bit (RW). This bit is set to 1 for Read and 0 for Write operations.
If a match occurs on the device select code, the corresponding device gives an
acknowledgment on Serial Data (SDA) during the 9th bit time. If the device does not match
the device select code, it deselects itself from the bus, and goes into Standby mode.
Table 5.
Operating modes
Mode
Current Address Read
RW bit
WC(1)
Bytes
1
X
1
0
X
Random Address Read
Initial sequence
Start, device select, RW = 1
Start, device select, RW = 0, Address
1
1
X
reStart, device select, RW = 1
Sequential Read
1
X
≥1
Byte Write
0
VIL
1
Start, device select, RW = 0
Page Write
0
VIL
≤256
Start, device select, RW = 0
Similar to Current or Random Address Read
1. X = VIH or VIL.
13/30
Device operation
Figure 7.
M24M01-R
Write mode sequences with WC = 1 (data write inhibited)
WC
ACK
Byte addr
ACK
Byte addr
NO ACK
Data in
Stop
Dev sel
Start
Byte Write
ACK
R/W
WC
ACK
Dev sel
Start
Page Write
ACK
Byte addr
ACK
Byte addr
NO ACK
Data in 1
Data in 2
R/W
WC (cont'd)
NO ACK
Data in N
Stop
Page Write (cont'd)
NO ACK
14/30
AI01120d
M24M01-R
3.6
Device operation
Write operations
Following a Start condition the bus master sends a device select code with the R/W bit (RW)
reset to 0. The device acknowledges this, as shown in Figure 8, and waits for two address
bytes. The device responds to each address byte with an acknowledge bit, and then waits
for the data byte.
Writing to the memory may be inhibited if Write Control (WC) is driven high. Any Write
instruction with Write Control (WC) driven high (during a period of time from the Start
condition until the end of the two address bytes) will not modify the memory contents, and
the accompanying data bytes are not acknowledged, as shown in Figure 7.
Each data byte in the memory has a 17-bit address (the most significant bit b16 is in the
device select code and the Least Significant Bits b15-b0 are defined in two address bytes).
The most significant byte (Table 3) is sent first, followed by the least significant byte
(Table 4).
When the bus master generates a Stop condition immediately after the Ack bit (in the “10th
bit” time slot), either at the end of a Byte Write or a Page Write, the internal memory Write
cycle is triggered. A Stop condition at any other time slot does not trigger the internal Write
cycle.
After the Stop condition, the delay tW, and the successful completion of a Write operation,
the device’s internal address counter is incremented automatically, to point to the next byte
address after the last one that was modified.
During the internal Write cycle, Serial Data (SDA) is disabled internally, and the device does
not respond to any requests.
3.7
Byte Write
After the device select code and the address bytes, the bus master sends one data byte. If
the addressed location is Write-protected, by Write Control (WC) being driven high, the
device replies with NoAck, and the location is not modified. If, instead, the addressed
location is not Write-protected, the device replies with Ack. The bus master terminates the
transfer by generating a Stop condition, as shown in Figure 8.
3.8
Page Write
The Page Write mode allows up to 256 bytes to be written in a single Write cycle, provided
that they are all located in the same ’row’ in the memory: that is, the most significant
memory address bits, b15-b6, are the same. If more bytes are sent than will fit up to the end
of the row, a condition known as ‘roll-over’ occurs. This should be avoided, as data starts to
become overwritten in an implementation dependent way.
The bus master sends from 1 to 256 bytes of data, each of which is acknowledged by the
device if Write Control (WC) is low. If Write Control (WC) is high, the contents of the
addressed memory location are not modified, and each data byte is followed by a NoAck.
After each byte is transferred, the internal byte address counter (the 6 least significant
address bits only) is incremented. The transfer is terminated by the bus master generating a
Stop condition.
15/30
Device operation
Figure 8.
M24M01-R
Write mode sequences with WC = 0 (data write enabled)
WC
ACK
ACK
Byte addr
Byte addr
ACK
Data in
Stop
Dev sel
Start
Byte Write
ACK
R/W
WC
ACK
Dev sel
Start
Page Write
ACK
Byte addr
ACK
Byte addr
ACK
Data in 1
Data in 2
R/W
WC (cont'd)
ACK
Data in N
Stop
Page Write (cont'd)
ACK
3.9
AI01106d
ECC (error correction code) and Write cycling
The M24M01-R device offers an ECC (error correction code) logic which compares each 4byte word with its six associated EEPROM ECC bits. As a result, if a single bit out of 4 bytes
of data happens to be erroneous during a Read operation, the ECC detects it and replaces
it by the correct value. The read reliability is therefore much improved by the use of this
feature.
Note however that even if a single byte has to be written, 4 bytes are internally modified
(plus the ECC word), that is, the addressed byte is cycled together with the three other bytes
making up the word. It is therefore recommended to write by packets of 4 bytes in order to
benefit from the larger amount of Write cycles.
The M24M01-R device is qualified at 1 million (1 000 000) Write cycles, using a cycling
routine that writes to the device by multiples of 4-byte words.
16/30
M24M01-R
Device operation
Figure 9.
Write cycle polling flowchart using ACK
Write cycle
in progress
Start condition
Device select
with RW = 0
NO
First byte of instruction
with RW = 0 already
decoded by the device
ACK
returned
YES
NO
Next
Operation is
addressing the
memory
YES
Send Address
and Receive ACK
ReStart
Stop
NO
StartCondition
YES
Data for the
Write cperation
Ddevice select
with RW = 1
Continue the
Write operation
Continue the
Random Read operation
AI01847d
17/30
Device operation
3.10
M24M01-R
Minimizing system delays by polling on ACK
During the internal Write cycle, the device disconnects itself from the bus, and writes a copy
of the data from its internal latches to the memory cells. The maximum Write time (tw) is
shown in Table 11, but the typical time is shorter. To make use of this, a polling sequence
can be used by the bus master.
The sequence, as shown in Figure 9, is:
●
Initial condition: a Write cycle is in progress.
●
Step 1: the bus master issues a Start condition followed by a device select code (the
first byte of the new instruction).
●
Step 2: if the device is busy with the internal Write cycle, no Ack will be returned and
the bus master goes back to Step 1. If the device has terminated the internal Write
cycle, it responds with an Ack, indicating that the device is ready to receive the second
part of the instruction (the first byte of this instruction having been sent during Step 1).
Figure 10. Read mode sequences
ACK
Data out
Stop
Start
Dev sel
NO ACK
R/W
ACK
Random
Address
Read
Byte addr
Dev sel *
ACK
ACK
Data out 1
Data out
R/W
NO ACK
Data out N
R/W
ACK
ACK
Byte addr
ACK
Byte addr
ACK
Dev sel *
Start
Start
Dev sel *
R/W
ACK
NO ACK
Stop
Start
Dev sel
Sequention
Random
Read
ACK
Byte addr
R/W
ACK
Sequential
Current
Read
ACK
Start
Start
Dev sel *
ACK
Stop
Current
Address
Read
ACK
Data out1
R/W
NO ACK
Stop
Data out N
1. The seven most significant bits of the device select code of a Random Read (in the
be identical.
18/30
AI01105d
1st
and
4th
bytes) must
M24M01-R
3.11
Device operation
Read operations
Read operations are performed independently of the state of the Write Control (WC) signal.
After the successful completion of a Read operation, the device’s internal address counter is
incremented by one, to point to the next byte address.
3.12
Random Address Read
A dummy Write is first performed to load the address into this address counter (as shown in
Figure 10) but without sending a Stop condition. Then, the bus master sends another Start
condition, and repeats the device select code, with the RW bit set to 1. The device
acknowledges this, and outputs the contents of the addressed byte. The bus master must
not acknowledge the byte, and terminates the transfer with a Stop condition.
3.13
Current Address Read
For the Current Address Read operation, following a Start condition, the bus master only
sends a device select code with the R/W bit set to 1. The device acknowledges this, and
outputs the byte addressed by the internal address counter. The counter is then
incremented. The bus master terminates the transfer with a Stop condition, as shown in
Figure 10, without acknowledging the byte.
3.14
Sequential Read
This operation can be used after a Current Address Read or a Random Address Read. The
bus master does acknowledge the data byte output, and sends additional clock pulses so
that the device continues to output the next byte in sequence. To terminate the stream of
bytes, the bus master must not acknowledge the last byte, and must generate a Stop
condition, as shown in Figure 10.
The output data comes from consecutive addresses, with the internal address counter
automatically incremented after each byte output. After the last memory address, the
address counter ‘rolls-over’, and the device continues to output data from memory address
00h.
3.15
Acknowledge in Read mode
For all Read commands, the device waits, after each byte read, for an acknowledgment
during the 9th bit time. If the bus master does not drive Serial Data (SDA) low during this
time, the device terminates the data transfer and switches to its Standby mode.
19/30
Initial delivery state
4
M24M01-R
Initial delivery state
The device is delivered with all the memory array bits set to 1 (each byte contains FFh).
5
Maximum rating
Stressing the device outside the ratings listed in Table 6 may cause permanent damage to
the device. These are stress ratings only, and operation of the device at these, or any other
conditions outside those indicated in the operating sections of this specification, is not
implied. Exposure to absolute maximum rating conditions for extended periods may affect
device reliability. Refer also to the STMicroelectronics SURE Program and other relevant
quality documents.
Table 6.
Absolute maximum ratings
Symbol
TA
TSTG
TLEAD
Parameter
Min.
Max.
Unit
Ambient operating temperature
–40
130
°C
Storage temperature
–65
150
°C
(1)
°C
Lead temperature during soldering
see note
VIO
Input or output range
–0.50
VCC + 0.6
V
VCC
Supply voltage
–0.50
6.5
V
VESD
Electrostatic discharge voltage (Human Body model)(2)
–3000
3000
V
1. Compliant with JEDEC Std J-STD-020D (for small body, Sn-Pb or Pb assembly), the ST ECOPACK®
7191395 specification, and the European directive on Restrictions on Hazardous Substances (RoHS)
2002/95/EU.
2. AEC-Q100-002 (compliant with JEDEC Std JESD22-A114A, C1=100pF, R1=1500Ω, R2=500Ω)
20/30
M24M01-R
6
DC and AC parameters
DC and AC parameters
This section summarizes the operating and measurement conditions, and the DC and AC
characteristics of the device. The parameters in the DC and AC characteristic tables that
follow are derived from tests performed under the measurement conditions summarized in
the relevant tables. Designers should check that the operating conditions in their circuit
match the measurement conditions when relying on the quoted parameters.
Table 7.
Operating conditions
Symbol
VCC
TA
Table 8.
Parameter
Min.
Max.
Unit
Supply voltage
1.8
5.5
V
Ambient operating temperature
–40
85
°C
Max.
Unit
AC measurement conditions
Symbol
CL
Parameter
Min.
Load capacitance
100
Input rise and fall times
pF
50
ns
Input levels
0.2VCC to 0.8VCC
V
Input and output timing reference levels
0.3VCC to 0.7VCC
V
Figure 11. AC measurement I/O waveform
Input Levels
Input and Output
Timing Reference Levels
0.8VCC
0.7VCC
0.3VCC
0.2VCC
AI00825B
Table 9.
Input parameters
Symbol
Parameter(1)
Test condition
Min.
Max.
Unit
CIN
Input capacitance (SDA)
8
pF
CIN
Input capacitance (other pins)
6
pF
ZL
ZH
Input impedance (WC)
VIN < 0.3 VCC
30
kΩ
VIN > 0.7VCC
400
kΩ
1. Sampled only, not 100% tested.
21/30
DC and AC parameters
Table 10.
Symbol
M24M01-R
DC characteristics
Parameter
ILI
Input leakage current
(E1, E2, SCL, SDA)
ILO
Output leakage current
ICC
ICC0
ICC1
Max.
Unit
VIN = VSS or VCC
device in Standby mode
±2
µA
VOUT = VSS or VCC, SDA in Hi-Z
±2
µA
VCC = 1.8 V, fc= 400 kHz
(rise/fall time < 50 ns)
0.8
mA
VCC = 2.5 V, fc= 400 kHz
(rise/fall time < 50 ns)
1
mA
VCC = 5.0 V, fc= 400 kHz
(rise/fall time < 50 ns)
2
mA
1.8 V < VCC < 5.5 V, fc= 1 MHz
(rise/fall time < 50 ns)
2.5
mA
Supply current (Write)
During tW, 1.8V < VCC < 5.5V
5(1)
mA
VIN = VSS or VCC,
VCC = 1.8 V
1
µA
VIN = VSS or VCC,
VCC = 2.5 V
2
µA
VIN = VSS or VCC,
VCC = 5.5 V
3
µA
V
Standby supply current
Input low voltage
(SCL, SDA, WC)
VIH
Input high voltage
(SCL, SDA, WC)
Output low voltage
1.8 V ≤VCC < 2.5 V
–0.45
0.25 VCC
2.5 V ≤VCC ≤5.5 V
–0.45
0.3 VCC
1.8 V ≤VCC < 2.5 V
0.75VCC
VCC+1
2.5 V ≤VCC ≤5.5 V
0.7VCC
VCC+1
V
IOL = 0.7 mA, VCC = 1.8 V
0.2
V
IOL = 2.1 mA, VCC = 2.5 V
0.4
V
IOL = 3.0 mA, VCC = 5.5 V
0.4
V
1. Characterized value, not tested in production.
22/30
Min.
Supply current (Read)
VIL
VOL
Test condition (in addition to
those in Table 7)
M24M01-R
DC and AC parameters
Table 11.
AC characteristics at 400 kHz
Test conditions specified in Table 7
Symbol
Alt.
Parameter
Min.
Max.
Unit
fC
fSCL
Clock frequency
400
kHz
tCHCL
tHIGH
Clock pulse width high
600
ns
tCLCH
tLOW
Clock pulse width low
1300
ns
tXH1XH2(1)
tR
Input signal rise time
20
300
ns
tXL1XL2(1)
tF
Input signal fall time
20
300
ns
tDL1DL2
tF
SDA (out) fall time
20
100
ns
tDXCX
tSU:DAT
Data in set up time
100
ns
tCLDX
tHD:DAT
Data in hold time
0
ns
tCLQX
tDH
Data out hold time
200
ns
tCLQV(2)(3)
tAA
Clock low to next data valid (access time)
200
900
ns
tCHDX(4)
tSU:STA
Start condition set up time
600
ns
tDLCL
tHD:STA
Start condition hold time
600
ns
tCHDH
tSU:STO
Stop condition set up time
600
ns
tDHDL
tBUF
Time between Stop condition and next Start
condition
1300
ns
Pulse width ignored (input filter on SCL and
SDA)
tW
tNS(5)
tWR
Write time 1.8 V < VCC < 5.5 V
100
ns
5
ms
1. Values recommended by the I²C-bus Fast-Mode specification.
2. To avoid spurious Start and Stop conditions, a minimum delay is placed between SCL=1 and the falling or
rising edge of SDA.
3. tCLQV is the time (from the falling edge of SCL) required by the SDA bus line to reach 0.8VCC in a
compatible way with the I2C specification (which specifies tSU:DAT (min) = 100 ns), assuming that the Rbus
× Cbus time constant is less than 500 ns (as specified in Figure 4).
4. For a reStart condition, or following a Write cycle.
5. Characterized only, not tested in production.
23/30
DC and AC parameters
Table 12.
M24M01-R
AC characteristics at 1 MHz (preliminary data)
Test conditions specified in Table 7
Symbol
Alt.
Parameter
Min.
Max.
Unit
fC
fSCL
Clock frequency
0
1
MHz
tCHCL
tHIGH
Clock pulse width high
300
-
ns
tCLCH
tLOW
Clock pulse width low
400
-
ns
tXH1XH2(1)
tR
Input signal rise time
20
300
ns
(1)
tF
Input signal fall time
20
300
ns
(2)
tF
SDA (out) fall time
20
100
ns
tDXCX
tSU:DAT
Data in setup time
80
-
ns
tCLDX
tHD:DAT Data in hold time
0
-
ns
tXL1XL2
tDL1DL2
tCLQX
tDH
Data out hold time
50
-
ns
tCLQV(3)(4)
tAA
Clock low to next data valid (access time)
50
500
ns
tCHDX(5)
tSU:STA
Start condition setup time
250
-
ns
tDLCL
tHD:STA
Start condition hold time
250
-
ns
tCHDH
tSU:STO
Stop condition setup time
250
-
ns
tDHDL
tBUF
Time between Stop condition and next
Start condition
500
-
ns
tW
tWR
Write time
-
5
ms
Pulse width ignored (input filter on SCL
and SDA)
-
50
ns
tNS(2)
1. Values recommended by the I²C-bus Fast-Mode specification.
2. Characterized only, not tested in production.
3. To avoid spurious Start and Stop conditions, a minimum delay is placed between SCL=1 and the falling or
rising edge of SDA.
4. tCLQV is the time (from the falling edge of SCL) required by the SDA bus line to reach 0.8VCC, assuming
that the Rbus × Cbus time constant is less than 150 ns (as specified in Figure 4).
5. For a reStart condition, or following a Write cycle.
24/30
M24M01-R
DC and AC parameters
Figure 12. AC waveforms
tXL1XL2
tCHCL
tXH1XH2
tCLCH
SCL
tDLCL
tXL1XL2
SDA In
tCHDX
tCLDX
tXH1XH2
Start
condition
SDA
Input
SDA tDXCX
Change
tCHDH tDHDL
Start
Stop
condition condition
SCL
SDA In
tW
tCHDH
tCHDX
Stop
condition
Write cycle
Start
condition
tCHCL
SCL
tCLQV
SDA Out
tCLQX
Data valid
tDL1DL2
Data valid
AI00795e
25/30
Package mechanical
7
M24M01-R
Package mechanical
Figure 13. SO8 narrow – 8 lead plastic small outline, 150 mils body width, package
outline
h x 45˚
A2
A
c
ccc
b
e
0.25 mm
GAUGE PLANE
D
k
8
E1
E
1
L
A1
L1
SO-A
1. Drawing is not to scale.
Table 13.
SO8 narrow – 8 lead plastic small outline, 150 mils body width, package
mechanical data
inches(1)
millimeters
Symbol
Typ
Min
A
Max
Typ
1.75
Max
0.0689
A1
0.1
A2
1.25
b
0.28
0.48
0.011
0.0189
c
0.17
0.23
0.0067
0.0091
ccc
0.25
0.0039
0.0098
0.0492
0.1
0.0039
D
4.9
4.8
5
0.1929
0.189
0.1969
E
6
5.8
6.2
0.2362
0.2283
0.2441
E1
3.9
3.8
4
0.1535
0.1496
0.1575
e
1.27
-
-
0.05
-
-
h
0.25
0.5
0.0098
0.0197
k
0°
8°
0°
8°
L
0.4
1.27
0.0157
0.05
L1
1.04
0.0409
1. Values in inches are converted from mm and rounded to 4 decimal digits.
26/30
Min
M24M01-R
Package mechanical
Figure 14. SO8W – 8 lead plastic small outline, 208 mils body width, package outline
A2
A
c
b
CP
e
D
N
E E1
1
A1
k
L
6L_ME
1. Drawing is not to scale.
2. The ‘1’ that appears in the top view of the package shows the position of pin 1 and the ‘N’ indicates the total
number of pins.
Table 14.
SO8W – 8 lead plastic small outline, 208 mils body width, package
mechanical data
inches(1)
millimeters
Symbol
Typ
Min
A
Max
Typ
Min
2.5
Max
0.0984
A1
0
0.25
0
0.0098
A2
1.51
2
0.0594
0.0787
b
0.4
0.35
0.51
0.0157
0.0138
0.0201
c
0.2
0.1
0.35
0.0079
0.0039
0.0138
CP
0.1
0.0039
D
6.05
0.2382
E
5.02
6.22
0.1976
0.2449
E1
7.62
8.89
0.3
0.35
-
-
-
-
k
0°
10°
0°
10°
L
0.5
0.8
0.0197
0.0315
N
8
e
1.27
0.05
8
1. Values in inches are converted from mm and rounded to 4 decimal digits.
27/30
Part numbering
8
M24M01-R
Part numbering
Table 15.
Ordering information scheme
Example:
M24M01
–
H R MN 6
T
P
Device type
M24 = I2C serial access EEPROM
Device function
M01 = 1 Mbit (256 Kb × 8 bits)
Clock frequency
Blank: fC max = 400 kHz
H: fC max = 1 MHz
Operating voltage
R = VCC = 1.8 V to 5.5 V
Package
MN = SO8 (150 mils width)
MW = SO8 (208 mils width)
Device grade
6 = Industrial temperature range, –40 to 85 °C.
Device tested with standard test flow
Option
blank = Standard Packing
T = Tape and Reel Packing
Plating technology
P or G = ECOPACK® (RoHS compliant)
For a list of available options (speed, package, etc.) or for further information on any aspect
of this device, please contact your nearest ST sales office.
The category of second-level interconnect is marked on the package and on the inner box
label, in compliance with JEDEC Standard JESD97. The maximum ratings related to
soldering conditions are also marked on the inner box label.
28/30
M24M01-R
9
Revision history
Revision history
Table 16.
Document revision history
Date
Revision
07-Dec-2006
1
Initial release.
2
Document status promoted from Preliminary Data to full Datasheet.
Section 2.6: Supply voltage (VCC) updated.
Note 1 updated to latest standard revision below Table 6: Absolute
maximum ratings.
VIL, VIH modified and, rise/fall time corrected in Test conditions in
Table 10: DC characteristics.
Package values in inches calculated from mm and rounded to 4
decimal digits (note added below package mechanical data tables in
Section 7: Package mechanical.
3
1 MHz maximum clock frequency added:
– Figure 5: Maximum Rbus value versus bus parasitic capacitance
(Cbus) for an I2C bus at maximum frequency fC = 1MHz
– Table 12: AC characteristics at 1 MHz (preliminary data) added.
tNS moved from Table 9: Input parameters to Table 11: AC
characteristics at 400 kHz. Note removed below Table 9. In Table 11,
tCH1CH2, tCL1CL2 and tDL1DL2 removed, tXH1XH2, tXL1XL2 added,
tDL1DL2 max modified, notes modified.
Figure 4: Maximum Rbus value versus bus parasitic capacitance
(Cbus) for an I2C bus at maximum frequency fC = 400 kHz modified.
Figure 12: AC waveforms modified. Small text changes.
02-Oct-2007
26-Nov-2007
Changes
29/30
M24M01-R
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30/30