Datasheet 1ch Small Package High Side Switch ICs for USB Devices and Memory Cards BD2226G-LB BD2227G-LB General Description Key Specifications This is the product guarantees long time support in Industrial market. BD2226G and BD2227G are low on-resistance N-channel MOSFET high-side power switches, optimized for Universal Serial Bus (USB) applications. BD2226G and BD2227G are equipped with the over-current detection, thermal shutdown, under-voltage lockout and soft-start functions. Input voltage range: 2.7V to 5.5V ON resistance : 150mΩ(Typ.) Over current threshold: 0.75A min., 1.35A max. Standby current: 0.01μA (Typ.) Operating temperature range: -40℃ to +85℃ Package W(Typ.) D(Typ.) H (Max.) 2.90mm x 2.80mm x 1.25mm SSOP5 Features ■ Long time support a product for Industrial applications Over-Current Detection Thermal Shutdown Open-Drain Fault Flag Output Under-Voltage Lockout Soft-Start Circuit Control Input Logic ¾ Active-High (BD2226G) ¾ Active-Low (BD2227G) ■ ■ ■ ■ ■ ■ SSOP5 Applications Industrial Equipment, USB hub in consumer appliances, Car accessory, PC,PC peripheral equipment, and so forth Typical Application Circuit 5V (Typ.) 3.3V CIN VIN VOUT + GND 10kΩ~ 100kΩ CL - EN /OC Lineup Min. 750mA 750mA Over current threshold Typ. Max. 1000mA 1350mA 1000mA 1350mA ○Product structure：Silicon monolithic integrated circuit www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･14･001 Control input logic Package Orderable Part Number High SSOP5 Reel of 3000 BD2226G – LBTR Low SSOP5 Reel of 3000 BD2227G – LBTR ○This product has no designed protection against radioactive rays. 1/21 TSZ02201-0E3E0H300400-1-2 21.Feb.2014 Rev.002 Datasheet BD2226G-LB BD2227G-LB Block Diagram Over-Current Detection Delay Counter Under-Voltage Lockout Charge Pump /OC Thermal Shutdown GND EN(/EN) VIN VOUT Pin Configurations BD2226G TOP VIEW BD2227G TOP VIEW VOUT 5 1 VIN 1 VIN 2 GND VOUT 5 2 GND 3 EN 3 /EN /OC 4 /OC 4 Pin Description Pin No. Symbol I/O 1 VIN - Switch input and supply voltage for the IC. 2 GND - Ground. 3 EN, /EN I Enable input. EN: High level input turns on the switch. (BD2226G) /EN: Low level input turns on the switch. (BD2227G) 4 /OC O Over-current detection pin Low level output during over-current or over-temperature condition. Open-drain fault flag output. 5 VOUT O Switch output. www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 Function 2/21 TSZ02201-0E3E0H300400-1-2 21.Feb.2014 Rev.002 Datasheet BD2226G-LB BD2227G-LB Absolute Maximum Ratings (Ta=25℃) Parameter VIN supply voltage EN(/EN) input voltage /OC voltage /OC sink current Symbol Ratings Unit VIN -0.3 to 6.0 V VEN(/EN) -0.3 to 6.0 V V/OC -0.3 to 6.0 V I/OC 5 mA VOUT voltage VOUT -0.3 to VIN + 0.3 V Storage temperature TSTG -55 to 150 ℃ Power dissipation Pd 675 *1 mW *1 Mounted on 70mm x 70mm x 1.6mm glass epoxy board. Reduce 5.4mW per 1℃ above 25℃ Recommended Operating Range Parameter Symbol Ratings Min. Typ. Max. Unit VIN operating voltage VIN 2.7 5.0 5.5 V Operating temperature TOPR -40 - 85 ℃ Electrical Characteristics (VIN= 5V, Ta= 25℃, unless otherwise specified.) DC Characteristics Parameter Symbol Limits Min. Typ. Max. Unit Conditions Operating current IDD - 110 160 μA Standby current ISTB - 0.01 5 μA VEN(/EN) 2.0 - - V VEN= 5V (BD2226G) V/EN= 0V (BD2227G) VOUT= open VEN= 0V (BD2226G) V/EN= 5V (BD2227G) VOUT= open High input EN(/EN) input voltage EN(/EN) input leakage On-resistance VEN(/EN) - - 0.8 V Low input IEN(/EN) -1 0.01 1 μA VEN(/EN)= 0V or 5V RON - 150 200 mΩ IOUT= 250mA Over-current threshold ITH 750 1000 1350 mA Short circuit output current ISC 500 - - mA /OC output low voltage UVLO threshold V/OC VTUV VOUT= 0V, RMS - - 0.4 V I/OC= 0.5mA 2.1 2.3 2.5 V VIN increasing 2.0 2.2 2.4 V VIN decreasing AC Characteristics Parameter Symbol Limits Unit Conditions Min. Typ. Max. TON1 0.2 1 6 ms RL= 20Ω Output turn-on time TON2 0.3 1.5 10 ms RL= 20Ω Output fall time TOFF1 0.1 1 20 μs RL= 20Ω Output turn-off time TOFF2 0.3 3 40 μs RL= 20Ω T/OC 10 15 20 ms Output rise time /OC delay time www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 3/21 TSZ02201-0E3E0H300400-1-2 21.Feb.2014 Rev.002 Datasheet BD2226G-LB BD2227G-LB Measurement Circuit VIN VIN A A VIN VOUT VIN 1µF RL GND VEN(/EN) GND VEN(/EN) /OC EN(/EN) A. VOUT 1µF Operating current B. EN(/EN) /OC EN,/EN Input voltage, Output rise/fall time VIN VIN A A 10kΩ IOC VIN VOUT VIN 1µF IOUT GND VEN(/EN) C. VOUT 1µF EN(/EN) GND VEN(/EN) /OC On-resistance, Over-current detection /OC EN(/EN) D. /OC Output low voltage Figure 1. Measurement circuit Timing Diagram VEN 50% 50% TON2 90% 10% TON1 TOFF2 90% 90% VOUT 10% TOFF1 10% 10% TON1 Figure 2. Output rise/fall time (BD2226G) www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 50% 50% TON2 TOFF2 90% VOUT V/EN TOFF1 Figure 3. Output rise/fall time (BD2227G) 4/21 TSZ02201-0E3E0H300400-1-2 21.Feb.2014 Rev.002 Datasheet BD2226G-LB BD2227G-LB Typical Performance Curves 140 VIN=5.0V [μA] Ta=25°C 100 OPERATING CURRENT : I OPERATING CURRENT : I 120 DD 120 DD [μA] 140 80 60 40 20 0 100 80 60 40 20 0 2 3 4 5 SUPPLY VOLTAGE : VIN [V] 6 -50 Figure 5. Operating current EN,/EN enable Figure 4. Operating current EN,/EN enable 1.0 1.0 [μA] VIN=5.0V 0.8 DD 0.8 STANDBY CURRENT : I STB [μA] Ta=25°C STANDBY CURRENT : I 0 50 100 AMBIENT TEMPERATURE : Ta[℃] 0.6 0.4 0.2 0.6 0.4 0.2 0.0 0.0 2 3 4 5 SUPPLY VOLTAGE : VIN [V] -50 6 Figure 6. Standby current EN,/EN disable www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 0 50 AMBIENT TEMPERATURE : Ta[℃ ] 100 Figure 7. Standby current EN,/EN disable 5/21 TSZ02201-0E3E0H300400-1-2 21.Feb.2014 Rev.002 Datasheet BD2226G-LB BD2227G-LB Typical Performance Curves - continued 2.0 EN EN ENABLE INPUT CURRENT : V ENABLE INPUT CURRENT : V Ta=25°C 1.5 VIN=5.0V [V] [V] 2.0 Low to High High to Low 1.0 0.5 0.0 Low to High 1.5 High to Low 1.0 0.5 0.0 2 3 4 5 SUPPLY VOLTAGE : VIN [V] 6 -50 0 50 100 AMBIENT TEMPERATURE : Ta[℃] Figure 9. EN,/EN input voltage Figure 8. EN,/EN input voltage 200 200 VIN=5.0V ON RESISTANCE : R ON [mΩ] ON RESISTANCE : R ON [mΩ] Ta=25°C 150 100 50 0 150 100 50 0 2 3 4 5 SUPPLY VOLTAGE : VIN [V] 6 -50 Figure 10. On-resistance www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 0 50 100 AMBIENT TEMPERATURE : Ta[℃ ] Figure 11. On-resistance 6/21 TSZ02201-0E3E0H300400-1-2 21.Feb.2014 Rev.002 Datasheet BD2226G-LB BD2227G-LB Typical Performance Curves - continued 1.3 OVERCURRENT THRESHOLD : ITH [A] OVERCURRENT THRESHOLD : ITH [A] 1.3 Ta=25°C 1.2 1.1 1.0 0.9 0.8 0.7 VIN=5.0V 1.2 1.1 1.0 0.9 0.8 0.7 2 3 4 5 SUPPLY VOLTAGE : VIN [V] 6 -50 0 50 100 AMBIENT TEMPERATURE : Ta[℃] Figure 13. Over-current threshold Figure 12. Over-current threshold 100 100 VIN=5.0V /OC OUTPUT LOW VOLTAGE : V /OC[mV] /OC OUTPUT LOW VOLTAGE : V /OC[mV] Ta=25°C 80 60 40 20 0 80 60 40 20 0 2 3 4 5 SUPPLY VOLTAGE : VIN [V] 6 -50 Figure 15. /OC output low voltage Figure 14. /OC output low voltage www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 0 50 100 AMBIENT TEMPERATURE : Ta[℃] 7/21 TSZ02201-0E3E0H300400-1-2 21.Feb.2014 Rev.002 Datasheet BD2226G-LB BD2227G-LB Typical Performance Curves - continued 1.0 VIN=5.0V UVLO HYSTERESIS VOLTAGE:V HSY[V] UVLO THRESHOLD : V TUVH , VTUVL [V] 2.5 2.4 2.3 VTUVH 2.2 VTUVL 2.1 2.0 -50 VIN=5.0V 0.8 0.6 0.4 0.2 0.0 0 50 100 AMBIENT TEMPERATURE : Ta[℃] -50 Figure 16. UVLO threshold 100 Figure 17. UVLO hysteresis voltage 5.0 5.0 Ta=25°C VIN=5.0V 4.0 4.0 RISE TIME : T ON1 [ms] RISE TIME : T ON1 [ms] 0 50 AMBIENT TEMPERATURE : Ta[℃] 3.0 2.0 1.0 3.0 2.0 1.0 0.0 0.0 2 3 4 5 SUPPLY VOLTAGE : VIN [V] -50 6 Figure 18. Output rise time www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 0 50 AMBIENT TEMPERATURE : Ta[℃ ] 100 Figure 19. Output rise time 8/21 TSZ02201-0E3E0H300400-1-2 21.Feb.2014 Rev.002 Datasheet BD2226G-LB BD2227G-LB Typical Performance Curves - continued 5.0 5.0 Ta=25°C VIN=5.0V [ms] 4.0 ON2 3.0 TURN ON TIME : T TURN ON TIME : TON2[ms] 4.0 2.0 1.0 3.0 2.0 1.0 0.0 0.0 2 3 4 5 SUPPLY VOLTAGE : VIN[V] -50 6 Figure 21. Output turn-on time Figure 20. Output turn-on time 5.0 5.0 VIN=5.0V Ta=25°C 4.0 FALL TIME : T OFF1 [μs] 4.0 FALL TIME : T OFF1 [μs] 0 50 100 AMBIENT TEMPERATURE : Ta[℃] 3.0 2.0 1.0 0.0 3.0 2.0 1.0 0.0 2 3 4 5 SUPPLY VOLTAGE : VIN [V] 6 -50 Figure 22. Output fall time www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 0 50 AMBIENT TEMPERATURE : Ta[℃ ] 100 Figure 23. Output fall time 9/21 TSZ02201-0E3E0H300400-1-2 21.Feb.2014 Rev.002 Datasheet BD2226G-LB BD2227G-LB Typical Performance Curves - continued 6.0 6.0 VIN=5.0V OFF2 [μs] 5.0 4.0 TURN OFF TIME : T TURN OFF TIME : T OFF2 [μs] Ta=25°C 3.0 2.0 1.0 0.0 5.0 4.0 3.0 2.0 1.0 0.0 2 3 4 5 SUPPLY VOLTAGE : VIN [V] 6 -50 Figure 25. Output turn-off time Figure 24. Output turn-off time 20 20 VIN=5.0V Ta=25°C 18 /OC DDLAY TIME : T/OC [ms] /OC DDLAY TIME : T/OC [ms] 0 50 100 AMBIENT TEMPERATURE : Ta[℃] 16 14 12 10 18 16 14 12 10 2 3 4 5 SUPPLY VOLTAGE : VIN [V] 6 -50 Figure 26. /OC delay time www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 0 50 AMBIENT TEMPERATURE : Ta[℃] 100 Figure 27. /OC delay time 10/21 TSZ02201-0E3E0H300400-1-2 21.Feb.2014 Rev.002 Datasheet BD2226G-LB BD2227G-LB Typical Wave Forms (BD2226G) VEN (5V/div.) VEN (5V/div.) V/OC (5V/div.) V/OC (5V/div.) VOUT (5V/div.) VOUT (5V/div.) VIN=5V RL=20Ω IOUT (0.5A/div.) VIN=5V IOUT (0.5A/div.) RL=20Ω TIME(1ms/div.) TIME(1us/div.) Figure 28. Output rise characteristic Figure 29. Output fall characteristic VEN (5V/div.) V/OC (5V/div.) V/OC (5V/div.) VOUT (5V/div.) CL=220uF CL=100uF IOUT (0.5A/div.) IOUT (0.2A/div.) CL=47uF VIN=5V RL=20Ω VIN=5V TIME (1ms/div.) TIME (5ms/div.) Figure 30. Inrush current response Figure 31. Over-current response ramped load www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 11/21 TSZ02201-0E3E0H300400-1-2 21.Feb.2014 Rev.002 Datasheet BD2226G-LB BD2227G-LB Typical Wave Forms - continued VEN (5V/div.) VEN (5V/div.) V/OC (5V/div.) V/OC (5V/div.) VOUT (5V/div.) VOUT (5V/div.) IOUT (0.5A/div.) IOUT (0.5A/div.) VIN=5V VIN=5V TIME (5ms/div.) TIME (100ms/div.) Figure 32. Over-current response Enable to short circuit Figure 33. Over-current response Enable to short circuit VOUT (5V/div.) VIN (5V/div.) V/OC (5V/div.) VOUT (5V/div.) VIN=5V IOUT (0.2A/div.) IOUT (1A/div.) RL=20Ω TIME (5ms/div.) TIME (10ms/div.) Figure 34. Over-current response 1Ω load to enabled device Figure 35. UVLO response Increasing VIN www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 12/21 TSZ02201-0E3E0H300400-1-2 21.Feb.2014 Rev.002 Datasheet BD2226G-LB BD2227G-LB Typical Wave Forms - continued VIN (5V/div.) VOUT (5V/div.) IOUT (0.2A/div.) RL=20Ω TIME (10ms/div.) Figure 36. UVLO response Decreasing VIN Typical Application Circuit 5V (Typ.) 10kΩ to 100kΩ CIN Controller VIN VOUT + GND CL - EN(/EN) /OC Application Information When excessive current flows due to output short-circuit or so, ringing occurs because of inductance between power source line to IC, and may cause bad influences on IC operations. In order to avoid this case, connect a bypass capacitor across IN terminal and GND terminal of IC. 1μF or higher is recommended. Pull up /OC output by resistance 10kΩ to 100kΩ. Set up value which satisfies the application as CL. This application circuit does not guarantee its operation. When using the circuit with changes to the external circuit constants, make sure to leave an adequate margin for external components including AC/DC characteristics as well as dispersion of the IC. www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 13/21 TSZ02201-0E3E0H300400-1-2 21.Feb.2014 Rev.002 Datasheet BD2226G-LB BD2227G-LB Functional Description 1. Switch Operation VIN terminal and VOUT terminal are connected to the drain and the source of switch MOSFET respectively. VIN terminal is used also as power source input to internal control circuit. When the switch is turned on from EN,/EN control input, VIN terminal and VOUT terminal are connected by a 150mΩ(Typ.) switch. In operation, the switch is bidirectional. Therefore, current flows from VOUT terminal to VIN terminal when the potential of VOUT terminal is higher than that of VIN terminal. 2. Thermal Shutdown Circuit (TSD) If over-current would continue, the temperature of the IC would increase drastically. If junction temperature is beyond 135℃(Typ.), with the condition of over-current detection, thermal shutdown circuit operates and turns off the power switch and outputs fault flag (/OC). Otherwise, when junction temperature decreases to lower than 115℃(Typ.), power switch is turned on and fault flag (/OC) is cancelled. Unless the increasing of the chip’s temperature is removed or the output of power switch is turned off, this operation repeats. The thermal shutdown circuit operates when the switch is on (EN,/EN signal is active). 3. Over-Current Detection (OCD) The over-current detection circuit limits current (ISC) and outputs fault flag (/OC) when current flowing in each switch MOSFET exceeds a specified value. There are three types of response against over-current. The over-current detection circuit works when the switch is on (EN,/EN signal is active). 3-1. When the switch is turned on while the output is in short circuit status When the switch is turned on while the output is in short-circuit status, the switch goes into current limit status immediately. 3-2. When the output is in short circuit while the switch is on When the output short-circuits or high-current load is connected while the switch is on, very large current flows until the over current limit circuit reacts. When the current detection and limit circuit works, current limitation is carried out. 3-3. When the output current increases gradually When the output current increases gradually, current limitation does not work until the output current exceeds the over current detection value. When it exceeds the detection value, current limitation is carried out. 4. Under-Voltage Lockout (UVLO) UVLO circuit prevents the switch from turning on until the VIN exceeds 2.3V(Typ.). If the VIN drops below 2.2V(Typ.) while the switch is on, then UVLO shuts off the power switch. UVLO has hysteresis of a 100mV(Typ). Under-voltage lockout circuit works when the switch is on (EN,/EN signal is active). 5. Fault Flag (/OC) Output Fault flag output is an N-MOS open drain output. At detection of over-current and thermal shutdown, output level is low. Over-current detection has delay filter. This filter prevents instantaneous current detection such as inrush current at switch on hot plug from being informed to outside. www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 14/21 TSZ02201-0E3E0H300400-1-2 21.Feb.2014 Rev.002 Datasheet BD2226G-LB BD2227G-LB Over Current Detection Over Current Load Removed VOUT ITH ISC IOUT T/OC V/OC Figure 37. Over-current detection VEN Output Shortcircuit VOUT Thermal Shutdown IOUT V/OC Delay Figure 38. Over-current detection, Thermal shutdown timing (BD2226G) V/EN Output Shortcircuit VOUT Thermal Shutdown IOUT V/OC Delay Figure 39. Over-current detection, Thermal shutdown timing (BD2227G) www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 15/21 TSZ02201-0E3E0H300400-1-2 21.Feb.2014 Rev.002 Datasheet BD2226G-LB BD2227G-LB Power Dissipation (SSOP5 package) 700 POWER DISSIPATION : Pd [mW] 600 500 400 300 200 100 0 0 50 75 85 100 AMBIENT TEMPERATURE : Ta [℃] 25 125 150 * 70mm x 70mm x 1.6mm Glass Epoxy Board Figure 40. Power Dissipation Curve (Pd-Ta Curve) I/O Equivalence Circuit Symbol Pin No. EN (/EN) 3 VOUT 5 Equivalence Circuit EN (/EN) VOUT /OC /OC 4 www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 16/21 TSZ02201-0E3E0H300400-1-2 21.Feb.2014 Rev.002 Datasheet BD2226G-LB BD2227G-LB Operational Notes (1) Absolute maximum ratings Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit between pins. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over the absolute maximum ratings. (2) Recommended operating conditions These conditions represent a range within which the expected characteristics of the IC can be approximately obtained. The electrical characteristics are guaranteed under the conditions of each parameter. (3) Reverse connection of power supply Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply terminals. (4) Power supply lines Design the PCB layout pattern to provide low impedance ground and supply lines. Separate the ground and supply lines of the digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. (5) Ground voltage The voltage of the ground pin must be the lowest voltage of all pins of the IC at all operating conditions. Ensure that no pins are at a voltage below the ground pin at any time, even during transient condition. (6) Short between pins and mounting errors Be careful when mounting the IC on printed circuit boards. The IC may be damaged if it is mounted in a wrong orientation or if pins are shorted together. Short circuit may be caused by conductive particles caught between the pins. (7) Operation under strong electromagnetic field Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction. (8) Testing on application boards When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and storage. (9) Regarding input pins of the IC This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a parasitic diode or transistor. For example (refer to figure below): When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode. When GND > Pin B, the P-N junction operates as a parasitic transistor. Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be avoided. Resistor Transistor (NPN) Pin A Pin B C Pin B B Pin A N P+ N P+ P E N N P+ N B P+ P C N E P substrate Parasitic element GND P substrate GND Parasitic element GND Parasitic GND element Other adjacent elements Figure 41. Example of monolithic IC structure (10) GND wiring pattern When using both small-signal and large-current GND traces, the two ground traces should be routed separately but connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal ground caused by large currents. Also ensure that the GND traces of external components do not cause variations on the GND voltage. The power supply and ground lines must be as short and thick as possible to reduce line impedance. www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 17/21 TSZ02201-0E3E0H300400-1-2 21.Feb.2014 Rev.002 Datasheet BD2226G-LB BD2227G-LB (11) External capacitor When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with temperature and the decrease in nominal capacitance due to DC bias and others. (12) Thermal shutdown circuit (TSD) The IC incorporates a built-in thermal shutdown circuit, which is designed to turn off the IC when the internal temperature of the IC reaches a specified value. Do not continue to operate the IC after this function is activated. Do not use the IC in conditions where this function will always be activated. (13) Thermal consideration Use a thermal design that allows for a sufficient margin by taking into account the permissible power dissipation (Pd) in actual operating conditions. Consider Pc that does not exceed Pd in actual operating conditions (Pc≥Pd). Package Power dissipation : Pd (W)=(Tjmax－Ta)/θja Power dissipation : Pc (W)=(Vcc－Vo)×Io+Vcc×Ib Tjmax : Maximum junction temperature=150℃, Ta : Peripheral temperature[℃] , θja : Thermal resistance of package-ambience[℃/W], Pd : Package Power dissipation [W], Pc : Power dissipation [W], Vcc : Input Voltage, Vo : Output Voltage, Io : Load, Ib : Bias Current www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 18/21 TSZ02201-0E3E0H300400-1-2 21.Feb.2014 Rev.002 Datasheet BD2226G-LB BD2227G-LB Ordering Information B D 2 2 2 x Part Number G - Package G : SSOP5 LBTR Product class LB for Industrial applications Packaging and forming specification TR: Embossed tape and reel Marking Diagram SSOP5 (TOP VIEW) Part Number Marking LOT Number Part Number Part Number Marking BD2226G FY BD2227G FZ www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 19/21 TSZ02201-0E3E0H300400-1-2 21.Feb.2014 Rev.002 Datasheet BD2226G-LB BD2227G-LB Physical Dimension Tape and Reel Information Package Name www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 SSOP5 20/21 TSZ02201-0E3E0H300400-1-2 21.Feb.2014 Rev.002 Datasheet BD2226G-LB BD2227G-LB Revision History Date Revision 13.Mar.2013 001 21.Feb.2014 002 Changes New Release Delete sentence “and log life cycle” in General Description and Futures (page 1). Change “Industrial Applications” to “Industrial Equipment” in Applications (page 1). Applied new style (“title”, “Ordering Information” and “Physical Dimension Tape and Reel Information”). www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 21/21 TSZ02201-0E3E0H300400-1-2 21.Feb.2014 Rev.002 Datasheet Notice Precaution on using ROHM Products 1. If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific Applications. (Note1) Medical Equipment Classification of the Specific Applications JAPAN USA EU CHINA CLASSⅢ CLASSⅡb CLASSⅢ CLASSⅢ CLASSⅣ CLASSⅢ 2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4. The Products are not subject to radiation-proof design. 5. Please verify and confirm characteristics of the final or mounted products in using the Products. 6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7. De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual ambient temperature. 8. Confirm that operation temperature is within the specified range described in the product specification. 9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Precaution for Mounting / Circuit board design 1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification Notice - SS © 2014 ROHM Co., Ltd. All rights reserved. Rev.002 Datasheet Precautions Regarding Application Examples and External Circuits 1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2. You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use. Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. Precaution for Electrostatic This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). Precaution for Storage / Transportation 1. Product performance and soldered connections may deteriorate if the Products are stored in the places where: [a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic 2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period. 3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of which storage time is exceeding the recommended storage time period. Precaution for Product Label QR code printed on ROHM Products label is for ROHM’s internal use only. Precaution for Disposition When disposing Products please dispose them properly using an authorized industry waste company. Precaution for Foreign Exchange and Foreign Trade act Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with ROHM representative in case of export. Precaution Regarding Intellectual Property Rights 1. All information and data including but not limited to application example contained in this document is for reference only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable for infringement of any intellectual property rights or other damages arising from use of such information or data.: 2. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any third parties with respect to the information contained in this document. Other Precaution 1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM. 2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of ROHM. 3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the Products or this document for any military purposes, including but not limited to, the development of mass-destruction weapons. 4. The proper names of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties. Notice - SS © 2014 ROHM Co., Ltd. All rights reserved. Rev.002 Datasheet General Precaution 1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents. ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny ROHM’s Products against warning, caution or note contained in this document. 2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s representative. 3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. Notice – WE © 2014 ROHM Co., Ltd. All rights reserved. Rev.001