Top View 0.95mm [0.037"] 0.95mm [0.037"] 40.00mm [1.575"] 1.27mm typ. 0.00mm [0.000"] Side View 40.00mm [1.575"] 1.68mm [0.066"] 1 3.76mm [0.148"] 0.20mm [0.008"]±0.0005" 38.10mm [1.500"] 2 1 Substrate: 1.59mm ±0.18mm [0.0625" ±0.007"] FR4/G10 or equivalent high temp material. 2 Pins: material- Brass Alloy 360 1/2 hard; finish0.25µm [10µ"] Au over 1.27µm [50µ"] Ni (min.). Description: Giga-snaP BGA SMT Land Socket 520 position BGA surface mount land pattern to terminal pins (1.27mm [0.050"] centers, 31x31 array) Tolerances: diameters ±0.03mm [±0.001”], PCB perimeters ±0.13mm [±0.005”], PCB thicknesses ±0.18mm [±0.007"], pitches (from true position) ±0.08mm [±0.003"], all other tolerances ±0.13mm [±0.005”] unless stated otherwise. Materials and specifications are subject to change without notice. Scale: 3:1 LS-BGA520A-31 Drawing Status: Released © 2009 IRONWOOD ELECTRONICS, INC. Tele: (800) 404-0204 www.ironwoodelectronics.com Drawing: S. Faiz Date: 2/26/09 File: LS-BGA520A-31 Dwg Modified: Rev: A