Freescale MC33797EK/R2 Four channel squib driver ic Datasheet

Freescale Semiconductor
Technical Data
MC33797
Rev 2.0, 07/2005
Four Channel Squib Driver IC
33797
The Four Channel Squib Driver IC is a complete squib diagnostic
and deployment interface for use in automotive air bag modules.
Extensive diagnostics and system control features are incorporated
to provide fail-safe operation. The device contains a serial peripheral
interface (SPI) compatible 8-bit interface to allow microprocessor
control.
SQUIB DRIVER
The device has the capability to be used in a standard four-channel
squib driver IC or in a cross-coupled state with the high- and low-side
squib drivers located on separate squib driver ICs. Both the high- and
low-side output drivers are protected against temporary shorts to
battery or ground. The current limit threshold is set by an external
resistor.
Features
• Four-Channel High-Side and Low-Side 2.0 A FET Switches
• Externally Adjustable FET Current Limiting
• Adjustable Current Limit Range: 0.8 A to 2.0 A
• Individual Channel Current Limit Detection with Timing Duration
Measurement, Communicated via SPI
• 8-Bit SPI for Diagnostics and FET Switch Activation
• Diagnostics for High-Side Safing Sensor Status
• Resistance and Voltage Diagnostics for Squibs
• Squib Driver IC Capability to Be Used for Cross-Coupled Driver
Firing Application (Allows High- and Low-Side FET Switches to Be
Located on Separate Squib Driver ICs)
• Pb-Free Packaging designated by Suffix Code EK
VPWR
EK SUFFIX (Pb-Free)
98ARH99137A
32-TERMINAL SOICW
ORDERING INFORMATION
Device
Temperature
Range (TA)
Package
MC33797EK/R2
-40°C to 85°C
32 SOICW
33797
VIN
VBOOST1
TYPICAL
AIR BAG
POWER SUPPLY
FIRING
CAP
VFIRE_1A
SENSE
VFIRE_1B
VDIAG_2
VBOOST2
FIRING
CAP
5.0 V
SQB_HI
VDIAG_1
SQB_LO
VFIRE_RTN
VFIRE_2A
VFIRE_2B
R_LIMIT_1
R_LIMIT_2
VDD
CS
CLK
MICROPROCESSOR
ENABLE
ENABLE
MISO
MOSI
RST
FEN_1
FEN_2
R_DIAG
GND
Figure 1. 33797 Simplified Application Diagram
* This document contains certain information on a new product.
Specifications and information herein are subject to change without notice.
© Freescale Semiconductor, Inc., 2005. All rights reserved.
/4
/4
/4
/2
SQUIB
(1A, 1B, 2A, 2B)
INTERNAL BLOCK DIAGRAM
VFIRE_RTN
SENSE_2B
SQB_HI_2B
Driver Control
SQB_LO_2B
Driver Control
VFIRE_1B
VDD
VDIAG_1
CLK
MISO
MOSI
CS
FEN_2
FEN_1
SQB_LO_2A
VFIRE_1A
SQB_HI_1A
SENSE_1A
SQB_LO_1A
VFIRE_RTN
SQB_LO_1B
Driver Control
SENSE_2A
Control and Diagnostic Multiplex
SQB_HI_2A
Driver Control
VFIRE_2A
VDIAG_2
VFIRE_2B
INTERNAL BLOCK DIAGRAM
SENSE_1B
SQB_HI_1B
RST
R_LIMIT_1
R_DIAG
R_LIMIT_2
GND
Figure 2. 33797 Simplified Internal Block Diagram
33797
2
Analog Integrated Circuit Device Data
Freescale Semiconductor
TERMINAL CONNECTIONS
TERMINAL CONNECTIONS
SQB_LO_1A
SENSE_1A
MOSI
CLK
SQB_HI_1A
VFIRE_1A
VDIAG_1
GND
MISO
VDD
VFIRE_1B
SQB_HI_1B
FEN_1
R_LIMIT_1
SENSE_1B
SQB_LO_1B
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
SQB_LO_2A
SENSE_2A
CS
RST
SQB_HI_2A
VFIRE_2A
VDIAG_2
VFIRE_RTN
VFIRE_RTN
R_DIAG
VFIRE_2B
SQB_HI_2B
FEN_2
R_LIMIT_2
SENSE_2B
SQB_LO_2B
Figure 3. Terminal Function Description
Table 1. Terminal Function Description
Terminal
Terminal
Name
Terminal Function
1
SQB_LO_1A
Output
2
SENSE_1A
3
Formal Name
Terminal Description
Squib Lo 1A
Drain of the low-side switch that connects to the low terminal of
Squib_1A
Input
Squib Sense 1A
Used during standard applications involving a four-channel
squib driver IC or during cross-coupling applications involving
two four-channel squib driver ICs (squib driver IC #1 and squib
driver IC #2).
MOSI
Input
Data Input 1
Serial data input for SPI interface.
4
CLK
Input
Serial Clock
Serial clock input for SPI interface.
5
SQB_HI_1A
Output
Squib Hi 1A
Drain of the high-side switch that connects to the low terminal of
Squib_1A
6
VFIRE_1A
Supply
Squib Firing Supply
1A
Firing supply terminal for Squib_1A.
7
VDIAG_1
Input
Squib Diagnostic 1A
and 1A
Diagnostic terminal for high-side safing sensor for squibs 1A
and 1B and the VFIRE supply voltage.
8
GND
Ground
Device Ground
Device ground terminal for internal logic and diagnostic circuitry.
9
MISO
Output
Data Output 0
Serial data output for SPI interface.
10
VDD
Input
Logic Power
Device power terminal for internal logic and diagnostic circuitry.
11
VFIRE_1B
Supply
Squib Firing Supply
1B
Firing supply terminal for Squib_1B.
12
SQB_HI_1B
Output
Squib Hi 1B
Drain of the high-side switch that connects to the low terminal of
Squib_1B
13
FEN_1
Input
FET Driver 1A and
1B
Active high input signal to enable operation of the squib_1A and
Squib_1BFET drivers.
14
R_LIMIT_1
Output
Limit Resistor - 1A
and 1B
External resistor to ground is used to set current limit for
Squib_1A and squib_1B FET drivers.
33797
Analog Integrated Circuit Device Data
Freescale Semiconductor
3
TERMINAL CONNECTIONS
Table 1. Terminal Function Description (continued)
Terminal
Terminal
Name
Terminal Function
15
SENSE_1B
Input
16
SQB_LO_1B
17
Formal Name
Terminal Description
Squib Sense 1B
Used during standard applications involving a four-channel
squib driver IC and during cross-coupling applications involving
two four-channel squib driver ICs (squib driver IC #1 and squib
driver IC #2).
Output
Squib Lo 1B
Drain of the low-side switch that connects to the low terminal of
Squib_1B
SQB_LO_2B
Output
Squib Lo 2B
Drain of the low-side switch that connects to the low terminal of
Squib_2B
18
SENSE_2B
Input
Squib Sense 2B
Used during standard applications involving a four-channel
squib driver IC and during cross-coupling applications involving
two four-channel squib driver ICs (squib driver IC #1 and squib
driver IC #2).
19
R_LIMIT_2
Output
Limit Resistor - 2A
and 2B
External resistor to ground is used to set current limit for
Squib_2A and squib_2B FET drivers.
20
FEN_2
Input
FET Driver 2A
and 2B
Active high input signal to enable operation of the squib_2A and
Squib_2B FET drivers.
21
SQB_HI_2B
Output
Squib Hi 2B
Drain of the high-side switch that connects to the low terminal of
Squib_2B.
22
VFIRE_2B
Supply
Squib Firing Supply
2B
Firing supply terminal for squib_2B.
23
R_DIAG
Input
Limit Resistor Diagnostic
External resistor to ground is used to set the diagnostic current
for squib resistance.
24
VFIRE_RTN
Ground
Squib Fire Power
Ground
Power Ground for squibs 1A, 1B, 2A, and 2B
25
VFIRE_RTN
Ground
Squib Fire Power
Ground
Power Ground for squibs 1A, 1B, 2A, and 2B
26
VDIAG_2
Supply
Squib Diagnostic 2A
and 2b
Diagnostic terminal for high-side safing sensor for squibs 2A
and 2B and the VFIRE supply voltage.
27
VFIRE_2A
Supply
Squib Firing Supply
2A
Firing supply terminal for squib_ 2A
28
SQB_HI_2A
Output
Squib Hi 2A
Drain of the high-side switch that connects to the low terminal of
Squib_2A
29
RST
Input
Reset
Reset, Active Low
30
CS
Input
Chip Select
Chip Select for SPI interface, Active Low
31
SENSE_2A
Input
Squib Sense 2A
Used during standard applications involving a four-channel
squib driver IC or during cross-coupling applications involving
two four-channel squib driver ICs (squib driver IC #1 and squib
driver IC #2).
32
SQB_LO_2A
Output
Squib Lo 2A
Drain of the low-side switch that connects to the low terminal of
Squib_2A
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Analog Integrated Circuit Device Data
Freescale Semiconductor
MAXIMUM RATINGS
MAXIMUM RATINGS
Table 2. Maximum Ratings (1)
All voltages are with respect to ground unless otherwise noted.
Rating
Symbol
Value
Unit
VDD
7.0
V
INPUT ELECTRICAL RATINGS
Voltage on VDD
Voltage on Input terminals CS, CLK, D1, D0, FEN_1, FEN_2, RESETB,
R_DIAG, R_LIMIT_X
VI
V
-0.3 to VDD + 0.3
Voltage on Squib terminals SQB_HI_XX, SQB_LO_XX, SENSE_XX
VVFIRE_XX
-0.3 to VVFIRE + 0.3
V
Voltage on terminals VDIAG_X, VFIRE_XX
VDIAG_X
-0.3 to 35
V
VESD1
±2000
VESD2
±200
V
ESD Voltage
Human Body Model
(2)
Machine Model (3)
V
VFPULSE
Maximum VVFIRE with Pulsed Output (4), (5)
35
RSQUIB = 2.0 Ω, tON = 0.8 ms, ISQUIB = 2.24 A
25
RSQUIB = 1.2 Ω, tON = 0.8 ms, ISQUIB = 2.24 A
25
RSQUIB = 0.1 Ω, tON = 0.60 ms, ISQUIB = 2.24 A
THERMAL RATINGS
TSTG
Storage Temperature
Junction Temperature Ambient
Continuous (Prior to Squib Deployment)
t ≤ 5.0 ms (Post-Squib Deployment)
Lead Soldering Temperature (6)
Thermal Resistance (Junction-to-Ambient)
155
°C
°C
TA
85
TJCONT
TJDPYD
100
TSOLDER
245
°C
RθJ-A
74
°C/W
300
OPERATING RATINGS (7)
Low-Side FET Fire Conditions
RSQUIB
2.0 Ω
1.2 Ω
0.1 Ω
tON
2.6 ms
2.6 ms
2.6 ms
ISQUIB
3.0 A
3.0 A
3.0 A
VSQUIBHI
16 V
16 V
16 V
Notes
1. Absolute maximum ratings indicate limits beyond which damage to the device may occur.
2. ESD1 testing is performed in accordance with the Human Body Model (CZAP = 100 pF, RZAP = 1500 Ω).
3.
ESD2 testing is performed in accordance with the Machine Model (CZAP = 200 pF, RZAP = 0 Ω).
4.
With a nominal squib load, the FET squib driver will not enter thermal shutdown until the driver has been active for a minimum of 2.1 ms.
The individual squib driver thermal shutdown will not affect other squib driver firing “ON” times. With a shorted squib load, the FET squib
driver will not enter thermal shutdown until the driver has been active for a minimum of 2.1 ms. When the thermal shutdown limit is
exceeded, the FET driver will turn OFF and the thermal status bit will be set to 1. The FET squib driver can be activated through the
arm/fire command when the TEMPRENABLE (MIN) is reached (thermal shutdown status “0”). Nominal squib load is 2.15 Ω ±0.15 Ω.
Shorted squib load is 0.1 Ω.
Three-squib driver with RSQUIB = 0.1 Ω conditions. Remaining squib driver conditions: RSQUIB = 1.2 Ω, tON = 4.0 ms, ISQUIB = 2.0 A,
VVDIAG_X = VVFIRE_XX = 35 V.
5.
6.
7.
Lead soldering temperature limit is for 10 seconds maximum duration; not designed for immersion soldering. Exceeding these limits
may cause malfunction or permanent damage to the device.
Operating ratings indicate conditions for which the device is intended to be functional. For guaranteed specifications and test conditions,
refer to the static and dynamic electrical characteristics tables on the following pages.
33797
Analog Integrated Circuit Device Data
Freescale Semiconductor
5
STATIC ELECTRICAL CHARACTERISTICS
STATIC ELECTRICAL CHARACTERISTICS
Table 3. Static Electrical Characteristics
Characteristics noted under conditions 4.75 V ≤ VDD ≤ 5.25 V; 7.0 V ≤ VVFIRE_XX ≤ 35 V; VVDIAG_X = VVFIRE_XX; FEN 1 = FEN 2
= VDD; RR_LIMIT_X = 10 kΩ ±1%, RR_DIAG = 10 kΩ ±1%, -40°C ≤ TA ≤ +85°C, GND = 0 unless otherwise noted. Typical values
noted reflect the approximate parameter means at TA = 25°C under nominal conditions unless otherwise noted.
Characteristic
Symbol
Min
Typ
Max
Unit
VDD
4.57
5.0
5.25
V
Leakage Current at Minimum High Side Driver Breakdown Voltage
IDHSD
–
39
100
µA
Leakage Current at Minimum Low Side Driver Breakdown Voltage
IDLSD
–
65
100
µA
INPUT VOLTAGE (VDD)
Input Voltage
FET DRIVERS
High-Side Driver Current Limit Range Set via Rlimit Resistor with Low
Battery Condition
tON ≤ 4.0 ms, RR_LIMIT_X = 10 kΩ, 5.0 V ≤ VVFIRE ≤ 7.0 V, RSQUIB =
2.0 Ω
High-Side Driver Low Current Limit Range Set via Rlimit Resistor
SQLO = 16 V
0.93
1.03
1.21
1.4
1.54
1.76
2.0
2.24
2.1
2.24
2.47
2.65
3.0
3.14
IHS x 0.85
–
IHS x 1.0
A
A
A
A
IMEAS
7.0 V ≤ VVFIRE ≤ 35 V
Driver ON Resistance (per FET)
0.81
ILS
7.0 V = SQLO < 16 V
High-Side Driver Current Limit Detect Threshold (8)
2.9
IHS(HISET)
tON ≤ 0.8 ms, RR_LIMIT_X = RL=45.3 kΩ, 7.0 V ≤ VVFIRE ≤ 35 V
Low-Side Drivers Current Limit
1.4
IHS(NOM)
tON ≤ 2.6 ms, RR_LIMIT_X = RL=10 kΩ, 7.0 V ≤ VVFIRE ≤ 35 V
High-Side Driver High Current Limit Range Set via Rlimit Resistor
1.09
IHS(LOSET)
tON ≤ 2.6 ms, RR_LIMIT_X = RL=4.32 kΩ, 7.0 V ≤ VVFIRE ≤ 35 V
High-Side Driver Nominal Current Limit Range Set via Rlimit Resistor
A
IHS(LBAT)
A
Ω
RDS(ON)
–
–
1.0
2.0
15
5.0
No Fire—Worst Case Diagnostics ($83/$2F Command Active)
–
–
17.5
Firing (with All FET Drivers “ON”)
–
4.3
6.0
22
34
55
32
37
43
–
1.8
10
–
140
200
VVFIRE = 5.0 V, ILOAD = 0.5 A
VDD Operating Current
Standby (Diagnostics off, SPI “OFF”)
VFIRE Quiescent Current (9)
IRRE
With Diagnostics Off
VDIAG Current During Squib Diagnostics
Per VDIAG terminal, excluding Firing Current, IHS = 2.0 A
mA
mA
IRRE
Excluding Firing Current, IHS = 2.0 A
VDIAG Operating Current During Firing
µA
IRRE
With Squib Resistance Diagnostics Active
VFIRE Operating Current During Firing
mA
IDD
µA
IRRE
Notes
8. Guaranteed by design
9. VFIRE quiescent current includes any leakage current through squib.
33797
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Analog Integrated Circuit Device Data
Freescale Semiconductor
STATIC ELECTRICAL CHARACTERISTICS
Table 3. Static Electrical Characteristics (continued)
Characteristics noted under conditions 4.75 V ≤ VDD ≤ 5.25 V; 7.0 V ≤ VVFIRE_XX ≤ 35 V; VVDIAG_X = VVFIRE_XX; FEN 1 = FEN 2
= VDD; RR_LIMIT_X = 10 kΩ ±1%, RR_DIAG = 10 kΩ ±1%, -40°C ≤ TA ≤ +85°C, GND = 0 unless otherwise noted. Typical values
noted reflect the approximate parameter means at TA = 25°C under nominal conditions unless otherwise noted.
Characteristic
Symbol
VFIRE1A / VFIRE2A Current During High Side Safing Sensor Diagnostics
(Command $CO)
IRRE
Maximum Allowable External Resistance to Ground During Firing (10)
FET Driver Thermal Shutdown Re-Enable Threshold After Drive Cool-down
22
32
55
0.3
2.0
3.8
90
135
180
mA
µA
µF
–
–
0.12
–
–
0.15
160
–
190
90
–
110
Ω
RSMAX
VFIRE_RTN terminal to Ground
Individual FET Driver Thermal Shutdown (10), (11)
µA
CSMAX
Per Squib terminal SQB_LO and SQB_HI
TSD
TREN
(10), (11)
Unit
400
IQVFIRETOTAL
All VFIRE terminals measured together, with Diagnostics Off
Maximum Allowable External Capacitance to Ground (10)
350
IRRE
Either VFIRE!B or VFIRE2B Diagnostic active
VFIRE Quiescent Current - Total
Max
IRRE
Per VFIREXB terminal, with High Side Safing Sensor Diagnostic active
VFIRE1B / VFIRE2B Current During VFIRE Diagnostics (Command $C5)
Typ
µA
260
Per VFIREXA terminal, with High Side Safing Sensor Diagnostic active
VFIRE1B / VFIRE2B Current During High Side Safing Sensor Diagnostics
(Command $CO)
Min
C
C
FET DRIVERS HIGH- AND LOW-SIDE DRIVER TRANSISTOR STATUS/DIAGNOSTICS ($82, $83 COMMANDS)
5.5
6.0
6.5
2.0
10
50
1.0
1.4
2.0
2.0
10
50
IFEN
-25
-40
-50
µA
Logic Low Level
VFEN(LO)
0.0
2.5
0.35 x VDD
V
Fire Enable Terminal Logic High Level
VFEN(HI)
0.65 x VDD
2.5
1.0 x VDD
V
Voltage Transistor Test Threshold for High-Side Driver Transistor
VTRANTST1
High-Side Driver Current Limit During High-Side Driver Transistor
Diagnostics
ITRANTST1
V
mA
15 V ≤ VVFIRE_XX ≤ 35 V
Voltage Transistor Test Threshold for Low-Side Driver Transistor
VTRANTST2
Low-Side Driver Current Limit During Low-Side Driver Transistor
Diagnostics
ITRANTST2
V
mA
15 V ≤ VVFIRE_XX ≤ 35 V
FEN INPUT TERMINAL (FEN_1 AND FEN_2)
Internal Current Pull-Down
Notes
10. Guaranteed by design.
11. With a nominal squib load, the FET squib driver will not enter thermal shutdown until the driver has been active for a minimum of 2.1 ms.
The individual squib driver thermal shutdown will not affect other squib driver firing ON times. With a shorted squib load, the FET squib
driver will not enter thermal shutdown until the driver has been active for a minimum of 2.1 ms. When the thermal shutdown limit is
exceeded, the FET driver will turn OFF and the thermal status bit will be set to 1. The FET squib driver can be activated through the
arm/fire command when the TEMPRENABLE (MIN) is reached (thermal shutdown status “0”). Nominal squib load: 2.15 Ω ±0.15 Ω.
Shorted squib load: 0.1 Ω.
33797
Analog Integrated Circuit Device Data
Freescale Semiconductor
7
STATIC ELECTRICAL CHARACTERISTICS
Table 3. Static Electrical Characteristics (continued)
Characteristics noted under conditions 4.75 V ≤ VDD ≤ 5.25 V; 7.0 V ≤ VVFIRE_XX ≤ 35 V; VVDIAG_X = VVFIRE_XX; FEN 1 = FEN 2
= VDD; RR_LIMIT_X = 10 kΩ ±1%, RR_DIAG = 10 kΩ ±1%, -40°C ≤ TA ≤ +85°C, GND = 0 unless otherwise noted. Typical values
noted reflect the approximate parameter means at TA = 25°C under nominal conditions unless otherwise noted.
Characteristic
Symbol
Min
Typ
Max
Unit
VDDRST
–
–
4.1
V
IRST
-6
-10
-15
µA
RST Logic Low Level
VRST(LO)
0.0
2.5
0.35 x VDD
V
RST Logic High Level
VRST(HI)
0.65 x VDD
2.5
1.0 x VDD
V
Diagnostic Current Through Squib (14)
IDIAG
30
34
40.5
mA
Resistance Threshold 1 (14)
RTH1
1.2
1.4
1.6
Ω
Resistance Threshold 2 (14)
RTH2
1.6
1.8
2.1
Ω
Resistance Threshold 3 (14)
RTH3
2.1
2.4
2.6
Ω
Resistance Threshold 4 (14)
RTH4
2.6
2.9
3.2
Ω
(14)
RTH5
3.3
3.7
4.4
Ω
Resistance Threshold 6 (14)
RTH6
4.6
5.4
6.0
Ω
(14)
RTH7
5.7
6.5
7.1
Ω
Resistance Threshold 8 (14)
RTH8
6.7
7.8
8.5
Ω
RST INPUT TERMINAL (ACTIVE LOW) (12)
System Reset Threshold
Internal Current Pull-Down
SQUIB DIAGNOSTICS ($D0–$D3 COMMANDS) (13)
Resistance Threshold 5
Resistance Threshold 7
SQUIB SHORT-TO-BATTERY/GROUND DIAGNOSTICS AND SQUIB HARNESS SHORT-TO-BATTERY/GROUND DIAGNOSTICS WITH
AN OPEN SQUIB ($C1, $C3 COMMANDS)
Voltage Threshold for SQB_LO and SQB_HI Shorted to VPWR
VTHSB
7.0 V ≤ VVDIAG_X ≤ 35 V
Voltage Threshold for SQB_LO and SQB_HI Shorted to Ground
V
1.3
1.4
1.6
-500
-800
-900
1.7
3.5
3.7
5.75
–
6.75
µA
ISOURSHRTS
1.0 V ≤ SENSE_XX ≤ 16 V, 7.0 V ≤ VVDIAG_X ≤ 35 V
Voltage Threshold for SQB_LO or SQB_HI Shorted to VPWR with an Open
Squib using $C3 Command
6.4
ISINKSHRTS
1.0 V ≤ SENSE_XX ≤ 16 V, Typical = 800 µA
Current Source Shorts Measurements I_SQB_HI_XX (15)
6.0
VTHSG
7.0 V ≤ VVDIAG_X ≤ 35 V
Current Sink Shorts Measurements I_SQB_LO_XX (15)
V
5.7
VTHSB_SO
mA
V
RSQUIB = Open
Notes
12. Reset Bar range of operation: The minimum system reset bar threshold/active will be set to “0” for a value of VDD ≤ 4.1 V.
13.
14.
By changing the R_DIAG resistor value, the resistance thresholds can be varied in a linear relationship.The R_DIAG resistance can be
changed by ±10% to shift the thresholds by ±10%. Design goal for resistance threshold change is ±15%. R_DIAG threshold limit may
have to be changed to accommodate ±15% change. Example: Shifting the R_DIAG resistance value ±10%, the resistance threshold
will change by ±10%. Refer to Table 4, page 11.
RR_DIAG = 10 kΩ ±1.0%
15.
XX = 1A, 1B, 2A, or 2B.
33797
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Analog Integrated Circuit Device Data
Freescale Semiconductor
STATIC ELECTRICAL CHARACTERISTICS
Table 3. Static Electrical Characteristics (continued)
Characteristics noted under conditions 4.75 V ≤ VDD ≤ 5.25 V; 7.0 V ≤ VVFIRE_XX ≤ 35 V; VVDIAG_X = VVFIRE_XX; FEN 1 = FEN 2
= VDD; RR_LIMIT_X = 10 kΩ ±1%, RR_DIAG = 10 kΩ ±1%, -40°C ≤ TA ≤ +85°C, GND = 0 unless otherwise noted. Typical values
noted reflect the approximate parameter means at TA = 25°C under nominal conditions unless otherwise noted.
Characteristic
Symbol
Min
Typ
Max
Unit
Voltage Threshold for SQB_LO or SQB_HI Shorted to Ground with an Open
Squib using $C3 Command
VTHSG_SO
1.3
1.8
2.0
V
150
–
350
mA
1.0
1.4
2.0
RSQUIB = Open
DIAGNOSTICS FOR SQUIB CONTINUITY BETWEEN SENSE_XX AND SQB_LO_XX ($C2 COMMAND)
Current Threshold for SQUIB_LO_1A, 1B, 2A, and 2B Continuity Check for
Standard and Cross-coupled Conditions ($C2) SQUIB_LO_XXCONT
ITHSQB CON
(16)
7.0 V ≤ VVDIAG_X ≤ 35 V
DIAGNOSTICS FOR SQUIB SHORT BETWEEN FIRING LOOPS ($E0–$E3, $E8 COMMANDS)
Voltage Threshold for Standard Squib Connection
VTHSQBNOM
7.0 V ≤ VVDIAG_X ≤ 35 V
V
VTHSSQB
Voltage Threshold for SQUIB_X Shorted to SQUIB_Y (1 or More Shorted
Conditions)
Short Between Squib Lines (Loops) (SQUIB_XX_SSQB_YY) (17)
V
1.0
1.4
2.0
VDIAG SUPPLY DIAGNOSTICS ($C0 COMMAND)
VDIAG Supply Voltage High Threshold
VDHI
15
17
18.3
V
VDIAG Supply Voltage Low Threshold
VDLO
5.7
6.5
7.0
V
VFIRE Supply Voltage High Threshold
VFDHI
15
17
18.3
V
VFIRE Supply Voltage Low Threshold
VFLO
5.7
6.5
7.0
V
VFIRE SUPPLY DIAGNOSTICS VFIRE_1B AND VFIRE_2B ($C5 COMMAND)
VDIAG SUPPLY DIAGNOSTICS VDIAG_1 AND VDIAG_2 (ADDITIONAL VOLTAGE THRESHOLDS) ($C5 COMMAND)
VDIAG Supply Voltage Threshold 4
VVDIAG_X V4
30.2
32.8
36.2
V
VDIAG Supply Voltage Threshold 3
VVDIAG_X V3
25.5
27.7
30.2
V
VDIAG Supply Voltage Threshold 2
VVDIAG_X V2
20.5
22.6
25.5
V
VDIAG Supply Voltage Threshold 1
VVDIAG_X V1
16
18.4
20.5
V
R_RTN1 Short-to-Ground Threshold (Open Ground Connection)
RRTN1
0.15
–
0.6
Ω
R_RTN2 Short-to-Ground Threshold (Open Ground Connection)
RRTN2
0.15
–
0.6
Ω
VFIRE_RTN DIAGNOSTICS ($C9 COMMAND)
HIGH-SIDE SAFING SENSOR DIAGNOSTICS ($C0 COMMAND)
R_HS Valid Resistor Range
RHS
15 V ≤ VVDIAG_X ≤ 35 V
R_HS Open Threshold
15 V ≤ VVDIAG_X ≤ 35 V
kΩ
4.1
5.1
6.1
6.1
7.2
9.0
RHSO
kΩ
Notes
16. XX = 1A, 1B, 2A, or 2B
17. XX and YY = 1A, 1B, 2A, or 2B
33797
Analog Integrated Circuit Device Data
Freescale Semiconductor
9
STATIC ELECTRICAL CHARACTERISTICS
Table 3. Static Electrical Characteristics (continued)
Characteristics noted under conditions 4.75 V ≤ VDD ≤ 5.25 V; 7.0 V ≤ VVFIRE_XX ≤ 35 V; VVDIAG_X = VVFIRE_XX; FEN 1 = FEN 2
= VDD; RR_LIMIT_X = 10 kΩ ±1%, RR_DIAG = 10 kΩ ±1%, -40°C ≤ TA ≤ +85°C, GND = 0 unless otherwise noted. Typical values
noted reflect the approximate parameter means at TA = 25°C under nominal conditions unless otherwise noted.
Characteristic
Symbol
Min
Typ
Max
Unit
R_HS Short Threshold
RHSS
2.8
–
4.1
kΩ
VFIRE_XA & VFIRE_XB Current during High Side Safing Test at Open
Threshold
I1HSO
VFIRE_1A & VFIRE_1B or VFIRE_2A & VFIRE_2B
µA
270
VFIRE_XA & VFIRE_XB Current during High Side Safing Test at Short
Threshold
360
410
µA
I1HSS
VFIRE_1A & VFIRE_1B or VFIRE_2A & VFIRE_2B
287
385
436
HIGH-SIDE SAFING SENSOR DIAGNOSTICS WITH 1 SAFING SENSOR IN FIRING PATH CONNECTED TO VFIRE_1A AND VFIRE_2A
TERMINALS (GUARANTEED BY DESIGN) ($C0 COMMAND)
Total VFIRE_XX Current during High Side Safing Test at Open Threshold
µA
I2HSO
574
705
835
605
748
892
1.99
–
2.93
2.93
3.35
4.43
1.41
1.61
1.99
RRL
4.32
–
45.3
kΩ
R_LIMIT Open Threshold (“Out of Range Threshold”)
RRLO
60
76
105
kΩ
R_LIMIT Short-to-Ground Threshold (“Out of Range Threshold”)
RRLS
3.0
3.5
4.31
kΩ
Maximum External Capacitance to Ground
CRL
–
–
20
pF
RRD
8.0
–
13
kΩ
R_DIAG Open Threshold (“Out of Range Threshold”)
RRDO
13
23
60
kΩ
R_DIAG Short-to-Ground Threshold (“Out of Range Threshold”)
RRDS
3.0
5.4
8.0
kΩ
Maximum External Capacitance to Ground
CRD
–
–
20
pF
VFIRE_1A, VFIRE_1B, VFIRE_2A & VFIRE_2B terminals
Total VFIRE_XX Current during High Side Safing Test at Short Threshold
µA
I2HSS
VFIRE_1A, VFIRE_1B, VFIRE_2A & VFIRE_2B terminals
kΩ
R2HS
R_HS Valid Resistor Range
15 V ≤ VVDIAG_X ≤ 35 V
kΩ
R2HSO
R_HS Open Threshold
15 V ≤ VVDIAG_X ≤ 35 V
kΩ
R2HSS
R_HS Short Threshold
15 V ≤ VVDIAG_X ≤ 35 V
R_LIMIT RESISTOR DIAGNOSTICS ($C8 COMMAND)
R_LIMIT Valid Resistor Range
R_DIAG RESISTOR DIAGNOSTICS ($C8 COMMAND)
(18)
R_DIAG Valid Resistor Range
Notes
18. By changing the R_DIAG resistor value, the resistance thresholds can be varied by a linear relationship.The R_DIAG resistance could
be changed by ±10% to shift the thresholds by ±10%. Design goal for resistance threshold change is ±15%. R_DIAG threshold limit may
have to be changed to accommodate ±15% change. Example: Shifting the R_DIAG resistance value ±10%, the resistance threshold
will change by ±10%. Refer to Table 4.
33797
10
Analog Integrated Circuit Device Data
Freescale Semiconductor
STATIC ELECTRICAL CHARACTERISTICS
Table 3. Static Electrical Characteristics (continued)
Characteristics noted under conditions 4.75 V ≤ VDD ≤ 5.25 V; 7.0 V ≤ VVFIRE_XX ≤ 35 V; VVDIAG_X = VVFIRE_XX; FEN 1 = FEN 2
= VDD; RR_LIMIT_X = 10 kΩ ±1%, RR_DIAG = 10 kΩ ±1%, -40°C ≤ TA ≤ +85°C, GND = 0 unless otherwise noted. Typical values
noted reflect the approximate parameter means at TA = 25°C under nominal conditions unless otherwise noted.
Characteristic
Symbol
Min
Typ
Max
Unit
0.0
–
0.2
0.7
–
1.0
VLthr
0.35
–
0.65
x VDD
D1 Pull-Down Current
ID1
-6.0
-10
-15
µA
CLK Pull-Down Current
ICLK
-6.0
-10
-15
µA
CS Pull-Up Current
ICSBAR
10
20
30
µA
HI-Z Leakage (D0)
IHI-Z
–
–
±10
µA
SERIAL INTERFACE
x VDD
VOlow
Output Logic Low Level (D0)
ISINK = -800 µA
x VDD
VOhigh
Output Logic High Level (D0)
ISOURCE = 800 µA
Input Logic Threshold (D1, CS, CLK)
Table 4. Resistance Range vs. R_DIAG
R_DIAG
IDIAG
(NOM)
RTH1
Min/Max
RTH2
Min/Max
RTH3
Min/Max
RTH4
Min/Max
RTH5
Min/Max
RTH6
Min/Max
RTH7
Min/Max
RTH8
Min/Max
8.0 kΩ
(-20%)
41
0.9 / 1.3
1.2 / 1.7
1.6 / 2.1
2.0 / 2.6
2.6 / 3.6
3.6 / 4.8
4.5 / 5.7
5.3 / 6.8
9.0 kΩ
(-10%)
38
1.0 / 1.4
1.4 / 1.9
1.9 / 2.3
2.3 / 2.9
2.0 / 4.0
4.1 / 5.4
5.1 / 6.4
6.0 / 7.7
10.0 kΩ
35
1.2 / 1.6
1.6 / 2.1
2.1 / 2.6
2.6 / 3.2
3.3 / 4.4
4.6 / 6.0
5.7 / 7.1
6.7 / 8.5
11.0 kΩ
(+10%)
32
1.3 / 1.8
1.8 / 2.3
2.3 / 2.9
2.9 / 3.6
3.6 / 4.9
5.0 / 6.6
6.2 / 7.8
7.4 / 9.4
12.0 kΩ
(+20%)
29
1.4 / 1.9
1.9 / 2.5
2.5 / 3.1
3.1 / 3.9
3.9 / 5.3
5.5 / 7.2
6.8 / 8.6
8.0 / 10.2
13.0 kΩ
(+30%)
26
1.5 / 2.1
2.1 / 2.7
2.7 / 3.4
3.4 / 4.2
4.2 / 5.8
6.0 / 7.8
7.4 / 9.3
8.7 / 11.1
33797
Analog Integrated Circuit Device Data
Freescale Semiconductor
11
DYNAMIC ELECTRICAL CHARACTERISTICS
DYNAMIC ELECTRICAL CHARACTERISTICS
Table 5. Dynamic Electrical Characteristics
Characteristics noted under conditions 4.75 V ≤ VDD ≤ 5.25 V; 7.0 V ≤ VVFIRE_XX ≤ 35 V; VVDIAG_X = VVFIRE_XX; FEN 1 = FEN 2
= VDD; RR_LIMIT_X = 10 kΩ ±1%, RR_DIAG = 10 kΩ ±1%, -40°C ≤ TA ≤ +85°C, GND = 0 unless otherwise noted. Typical values
noted reflect the approximate parameter means at TA = 25°C under nominal conditions unless otherwise noted.
Characteristic
Symbol
Min
Typ
Max
Unit
tCYC
200
–
–
ns
34
–
–
34
–
–
SERIAL INTERFACE
CLK Cycle Time (1/FCLK) (19)
CLK High Time (19)
tHI
VCLK > VDD x 70%
CLK Low Time (19)
tLO
VCLK < VDD x 20%
Clock Rise Time (19)
CSB
–
–
20
62
–
–
62
–
–
30
–
–
30
–
–
–
–
62
–
–
62
ns
ns
ns
ns
ns
ns
ns
ns
ns
–
–
75
tHO
D0 held After CLK ↑
Diagnostic Delay Time (Between Two Successive Commands)
20
tV
CLK ↑ to D0 Valid, CLOAD = 100 pF
Data Out Hold Time (20)
–
tDIS
CSB ↑ to D0 HI-Z
Data Out Valid Time (20)
–
ns
tA
to D0 Valid
Data Out Disable Time (20)
20
tH
D1 Hold Time After CLK ↑
Data Out Access Time (20)
–
tSU
D1 Valid Before CLK
Data In Hold Time (20)
–
tLAG
CLK ↓ Before CSB ↑
Data In Setup Time (20)
20
tLEAD
CSB ↓ Before CLK ↑
Chip Select Hold Time (20)
–
tF
VDO = 70% VDD to 20% VDD, CLOAD = 100 pF
Chip Select Setup Time (20)
–
tR
VDO = 20% VDD to 70% VDD, CLOAD = 100 pF
Data Out Fall Time (20)
ns
tFALL
VCLK = 70% VDD to 20% VDD, CLOAD = 100 pF
Data Out Rise Time (20)
ns
tRISE
VCLK = 20% VDD to 70% VDD, CLOAD = 100 pF
Clock Fall Time (19)
ns
tDIAG
ns
0.0
–
–
2.5
–
–
µs
Notes
19. Determined by Design
20. Guaranteed by Characterization
33797
12
Analog Integrated Circuit Device Data
Freescale Semiconductor
DYNAMIC ELECTRICAL CHARACTERISTICS
Table 5. Dynamic Electrical Characteristics (continued)
Characteristics noted under conditions 4.75 V ≤ VDD ≤ 5.25 V; 7.0 V ≤ VVFIRE_XX ≤ 35 V; VVDIAG_X = VVFIRE_XX; FEN 1 = FEN 2
= VDD; RR_LIMIT_X = 10 kΩ ±1%, RR_DIAG = 10 kΩ ±1%, -40°C ≤ TA ≤ +85°C, GND = 0 unless otherwise noted. Typical values
noted reflect the approximate parameter means at TA = 25°C under nominal conditions unless otherwise noted.
Characteristic
Symbol
Min
Typ
Max
–
–
72
–
–
10
Unit
FET DRIVERS
Turn-On Delay Time
tON
CS ↑ to 80% IHS
Turn-Off Delay Time
tOFF
CS ↑ to 20% IHS
Diagnostic Timing/Resolution
µs
µs
tRESOLUTION
5.0 V ≤ VVDIAG_X ≤ 35 V, IHS ≥ IMEAS, 0 s ≤ tMEASURE_TIME ≤ 6.375 ms,
CSQUIB_HI = 0.12 µF, CSQUIB_LO = 0.12 µF
µs
21.25
25
28.75
DIAGNOSTIC DELAY TIME
Squib Resistance Diagnostic Delay Time (21)
From CSB ↑ Until Transistor Test Results Are Valid, CSQUIB_HI = 0.12 µF,
CSQUIB_LO = 0.12 µF
Squib Open/Short Diagnostic Delay Time (21)
–
Results Are Valid
–
1000
µs
tDIAG7
–
–
1000
µs
tDIAG9
–
–
1000
–
–
300
–
–
3000
–
–
3000
12
14
16
µs
tDIAG10
µs
tDIAG11
From CSB ↑ Until VTHSQBCON Diagnostic Results Are Valid
Squib Short Between Firing Loops Diagnostic Delay Time From CSB ↑ Until
3000
µs
–
From CSB ↑ Until VFIRE_RTN Diagnostic Results Are Valid
Squib Continuity Diagnostic Delay Time (21)
–
tDIAG6
15 V ≤ VVDIAG_X ≤ 35 V, From CSB ↑ Until Transistor Test Results Are
Valid, CSQUIB_HI = 0.12 µF, CSQUIB_LO = 0.12 µF, CVDIAG < 0.015 µF
VFIRE_RTN Diagnostic Delay Time (21)
3000
µs
–
15 V ≤ VVDIAG_X ≤ 35 V, From CSB ↑ Until High-Side Safing Sensor
Diagnostic Results Are Valid, CVDIAG < 0.015 µF
FET Drivers High- and Low-Side Driver Transistor Diagnostic Delay Time (21)
–
tDIAG4
15 V ≤ VVDIAG_X ≤ 35 V, From CSB ↑ Until High-Side Safing Sensor
Diagnostic Results Are Valid, CVDIAG < 0.015 µF
High-Side Safing Sensor Diagnostic Delay Time (21)
300
µs
–
(21)
VFIRE Supply Diagnostic Delay Time (21)
–
tDIAG2
From CSB ↑ Until Squib Open/Short Diagnostic Results Are Valid,
CSQUIB_HI = 0.12 µF, CSQUIB_LO = 0.12 µF
VDIAG Supply Diagnostic Delay Time From CSB ↑ until VDIAG Diagnostic
µs
tDIAG1
µs
tDIAG12
VTHSSQB Diagnostic Results Are Valid (21)
FEN INPUT TERMINAL
Minimum Pulse Width
FENFILTER
µs
Notes
21. Guaranteed by Characterization
33797
Analog Integrated Circuit Device Data
Freescale Semiconductor
13
TIMING DIAGRAMS
TIMING DIAGRAMS
Chip
Select
(/CS)
CS
80%
IHS
20%
tON
tOFF
Figure 4. Driver Timing Diagram
CS
CLK
MISO
MSB
6
5
4
3
2
1
LSB
MOSI
MSB
6
5
4
3
2
1
LSB
Figure 5. Freescale SPI
CS
CLK
MISO
MSB
6
5
4
3
2
1
LSB
MOSI
MSB
6
5
4
3
2
1
LSB
Figure 6. Alternative SCI Mode
33797
14
Analog Integrated Circuit Device Data
Freescale Semiconductor
FUNCTIONAL DESCRIPTION
INTRODUCTION
FUNCTIONAL DESCRIPTION
INTRODUCTION
The Four-Channel Squib Driver IC is a complete squib
diagnostic and deployment interface for use in automotive air
bag modules. Extensive diagnostics and system control
features are incorporated to provide fail-safe operation.
side fire return can be checked for an open condition (open
ground connection). The SPI interface, along with the
additional FEN terminal, is used to arm and fire a selected
squib.
The device contains a serial peripheral interface- (SPI)
compatible 8-bit interface for microprocessor control. This
interface allows the microprocessor to set up and read back
the results of all internal diagnostic functions. Squib
resistance level, along with possible shorts-to-battery or
ground, open ground connections, or shorts between squib
firing loops, are included in the diagnostic set. Additionally,
the squib supply voltage levels can be checked and the low-
The device has the capability to be used in a standard fourchannel squib driver IC or in a cross-coupled state with the
high- and low-side squib drivers located on separate squib
driver ICs.
Both the high-side and low-side output drivers are
protected against temporary shorts to battery or ground. The
current limit threshold is set by an external resistor.
FUNCTIONAL TERMINAL DESCRIPTION
INTRODUCTION
DEVICE GROUND (GND)
In this section references are made to XX; e.g., in
SENSE_XX, SQB_LO_XX, and SQB_LO_XX_CONT. In
these and similar instances, XX denotes 1A, 1B, 2A, and 2B.
Device ground terminal for internal logic and diagnostic
circuitry.
SERIAL CLOCK (SCLK)
Serial clock input for SPI interface. Data on the D1 terminal
is clocked into the device on the rising edge. Data is clocked
out of the device via the D0 terminal on the falling edge. Default
state is low with no connection.
CHIP SELECT (CS)
Chip select for SPI interface. Active low. On rising edge,
data shifted into the shift register is internally latched. On
falling edge, diagnostic results are latched into shift register.
Default state is high with no connection.
MASTEROUT/SLAVE IN (MOSI)
Serial data input to 33797 SPI interface. Default state is
low with no connection.
MASTER IN/SLAVE OUT (MISO)
Serial data output from 33797 SPI interface.
DEVICE POWER (VDD)
Device power terminal for internal logic and diagnostic
circuitry.
RESET (RST)
Reset Bar. Active low. With low input signal the internal
functions of the squib driver IC are disabled and all data in the
serial interface shift registers is cleared. Default state is low
with no connection.
LIMIT RESISTOR - DIAGNOSTIC (R_DIAG)
External resistor to ground is used to set the diagnostic
current for squib resistance.
LIMIT RESISTOR 1A AND 1B (R_LIMIT_1)
External resistor to ground is used to set current limit for
squibs 1A and 1B FET drivers.
LIMIT RESISTOR 2A AND 2B (R_LIMIT_2)
FET DRIVER 1A AND 1B (FEN_1)
External resistor to ground is used to set current limit for
squibs 2A and 2B FET drivers.
Active high input signal to enable operation of squibs 1A
and 1B FET drivers. All diagnostic functions are available
while terminal is low. Default state is low with no connection.
SQUIB DIAGNOSTIC 1A AND 1B (VDIAG_1)
FET DRIVER 2A AND 2B (FEN_2)
Diagnostic terminals for the high-side safing sensors for
squibs 1A and 1B, as well as the VFIRE supply voltage.
Active high input signal to enable operation of squibs 2A
and 2B FET drivers. All diagnostic functions are available
while terminal is low. Default state is low with no connection.
33797
Analog Integrated Circuit Device Data
Freescale Semiconductor
15
FUNCTIONAL DESCRIPTION
FUNCTIONAL TERMINAL DESCRIPTION
SQUIB DIAGNOSTIC 2A AND 2B (VDIAG_2)
DESIGN NOTES
Diagnostic terminals for the high-side safing sensors for
squibs 2A and 2B, as well as the VFIRE supply voltage.
Diagnostics always have the form of a forcing function and
a measurement or sense function. In a cross couple
configuration, most diagnostics are unaffected and are single
commands except for $C2 Low Side FET Continuity and
$E<3:0> Harness Shorts, and 83/2x Low- Side FET test. This
command must be sent to each IC to be executed. For these
three diagnostics, two commands are required because the
forcing function and sensing function are on separate ICs.
SQUIB SENSE XX (SENSE_XX)
The Sense terminals are used exclusively for diagnostics
related to the squib, driver FETs, or harness. Commands
using the Sense terminals include:
• C1, C2, C3, C9
• D<3:0>
• E<3:0>
• E9
• 82/1x
• 83/2x
Independent of the system configuration, normal or cross
coupled, the Sense terminal, xx and SquibHi, xx of a single
IC are always connected to the same squib with the SquibHi
pin connected to the high terminal of the squib and the Sense
pin connected to the low terminal of the squib. A cross
coupled configuration is achieved by only cross coupling the
squib low pins. See Figure 7 and Figure 8.
STANDARD APPLICATIONS
In the standard mode, the $C2 (SQUIB_LO_XX_CONT)
command will be used to check continuity of the low-side
driver from the SQB_LO_XX terminal to the high-side driver
FET (see Figure 7).
CROSS-COUPLED APPLICATIONS
Used during cross-coupling applications involving two
four-channel squib driver ICs (squib driver IC #1 and squib
driver IC #2). SENSE_XX terminals from squib driver IC #1
are connected to their respective squib minus terminals
(Squib Low/SQB_LO_XX) from squib driver IC #2 (Figure 8).
SENSE_XX terminals are used to feed diagnostic signals
back to squib driver IC #1 for determining squib resistance,
short-to-battery/ground, and squib loop-to-loop short
conditions. During a fire event, the fire current passes from
squib driver IC #1 high-side driver though the squib to squib
driver IC #2 low-side driver (Figure 8). In the cross-coupled
mode, the squib driver IC #2 $C2 (SQUIB_LO_XX_CONT)
command will be used to check continuity of the low-side
driver from the SQB_LO_XX terminal to the low-side driver
FET.
Harness Shorts Diagnostics: Force using $E<3:0> on
IC#1, Sense $E8 on IC2
Low-Side FET Continuity: Force using $C1 on IC#1,
Sense using $C2 on IC#2
Low-Side FET Test: Force using $C1 on IC#1, Sense
using $C2 on IC#2
An active 600 µA current sink is located in the SENSE_XX
terminal. The sink current is used to pull the charge off of the
external EMC/filter caps after a diagnostic measurement has
been made.
SQUIB HI XX (SQB_HI_XX)
Squib high terminals for squibs 1A, 1B, 2A, and 2B. These
terminals are connected to the sources of the high-side FET
drivers, as well as the diagnostic circuitry.
SQUIB LOW XX (SQB_LO_XX)
Squib low terminals for squibs 1A, 1B, 2A, and 2B. These
terminals are connected to the drains of the low-side FET
drivers, as well as the diagnostic circuitry.
SQUIB FIRING SUPPLY XX (VFIRE_XX)
Firing supply terminals for squibs 1A, 1B, 2A, and 2B.
These terminals are connected to the drains of the high-side
FET drivers. Feedback for high-side safing for squibs 1A and
1B will be referenced from VFIRE_1A and squibs 2A and 2B
from VFIRE_2A. For high-side safing, VFIRE_1B should be
connected to VFIRE_1A terminal and VFIRE_2B to
VFIRE_2A terminal.
SQUIB FIRE POWER GROUND (VFIRE_RTN)
Return for squibs 1A, 1B, 2A AND 2B. The terminals are
tied to the source terminals of both low-side FET drivers, as
well as the diagnostic circuitry. The RTN terminals are tied
internally.
33797
16
Analog Integrated Circuit Device Data
Freescale Semiconductor
FUNCTIONAL DESCRIPTION
FUNCTIONAL TERMINAL DESCRIPTION
VBOOST
Dri ver Control 1A
VFIRE
CS1
SPI Interface
+
Squib 1
SENSE_1A
-
SQUIB IC #1
$C2 Command checks this
Figure 7. Standard Squib Firing
VBOOST
CS1
SPI Interface
CS2
Dri ver Control 1A
VFIRE
+
Squib 1
SENSE_1A
Squib 2
SQUIB ASIC #1
Dri ver Control
VFIRE
+
SENSE_1A
-
SQUIB ASIC #2
$C2 Command checks this
Figure 8. Cross-Coupled Squib Firing
33797
Analog Integrated Circuit Device Data
Freescale Semiconductor
17
FUNCTIONAL DESCRIPTION
FUNCTIONAL DEVICE OPERATION
FUNCTIONAL DEVICE OPERATION
OPERATIONAL MODES
INTRODUCTION
In this section references are made to XX; e.g., in
SQB_HI_XX, SQB_LO_XX, and SENSE_XX terminals.
SQB_HI_XX refers to SQB_HI_1A, SQB_HI_1B,
SQB_HI_2A or SQB_HI_2B, SQB_LO_1A, etc.
SERIAL INTERFACE
An 8-bit shift register is provided for communication
through the serial port to a microprocessor. The four-wire SPI
interface is used to read from, and write to, the shift register.
Data written to the shift register will control the firing of the
FET switches or select a diagnostic mode. Data is
sequentially shifted into and out of the shift register, most
significant bit first.
Data read from the shift register will contain the results of
the diagnostic mode selected in the previous 8-bit write. If a
NOP command is written, all diagnostic modes are cleared
and the data in the shift registers will be read out. With any
undefined commands, all diagnostic modes are cleared and
the data in the shift registers will be read out. All functions are
set when CS goes high. All diagnostic commands are cleared
on the next valid SPI command.
SPI INTERFACE INTEGRITY CHECK
The $96 command with corresponding $69 return byte
during the next 8-bit write is used as an echo function to
diagnose the SPI integrity (refer to Table 8).
The Diagnostic Data Out bits not containing data are set to
zero.
Only 8-bit words will be accepted. Any words that are ≤7
bits or ≥9 bits will be ignored or cleared.
The second byte for command programming will be
treated as a NOP if any FET is firing. The programming
commands must be sequential or they will be treated as a
NOP.
The four-channel squib driver IC is a slave peripheral
device designed to interface to a Freescale SPI or other serial
peripheral interface. Data is read on the rising edge of CLK,
and data is transferred out on the rising edge of CLK. On the
falling edge of CSB, the IC configures itself for one of two SPI
modes. If CLK is low, the IC will configure itself to be in
Freescale SPI mode (see Figure 5). If CLK is high, the IC will
configure itself to be in an alternative SCI mode (see
Figure 6). In both cases, data is still read off the rising edge
and transferred off the falling edge of the CLK. When the IC
is deselected (CSB goes high), then D0 is a high-impedance
output.
Response bit 7 of command $C8 (refer to Table 7,
page 22) is hard-wired to “1” or “0” to identify the squib IC as
a four- or two-channel squib driver IC. When a $C8 command
is issued for the four-channel squib driver IC, the response bit
7 is set to a “0”. When a $C8 command is issued for the twochannel squib driver IC, the response bit 7 is set to a “1”.
STANDARD SQUIB IC FUNCTION
The standard squib IC application utilizes the high- and
low-side squib drivers from the same squib driver ICs (see
Figure 7, Standard Squib Firing).
The SENSE_XX (1A, 1B, 2A, 2B) terminal is connected to
SQB_LO_XX (1A, 1B, 2A, 2B). Squib diagnostics are
conducted using this terminal. In the standard mode, the $C2
(SQUIB_LO_XX_CONT) command will be used to check
continuity of the low-side driver from the SQB_LO_XX
terminal (1A, 1B, 2A, 2B) to the low-side driver FET
(Figure 7).
The low-side driver continuity is checked during the
continuity test. The driver continuity information will be
cleared after the information is transmitted on the next valid
SPI command.
EXAMPLE—STANDARD SQUIB COMMAND SPI
SEQUENCE FROM MICROCONTROLLER
TX: Request squib short-to-battery/GND diagnostic measurement ($C1).
RX: Previous executed command information.
TX: Request squib 1A resistance measurement ($D0–
$D3).
RX: Receive results from short-to-battery/GND diagnostics.
TX: Request squib 1B resistance measurement ($D0–
$D3).
RX: Receive measured squib 1A resistance information.
TX: Request squib 2A resistance measurement ($D0–
$D3).
RX: Receive measured squib 1B resistance information.
TX: Request squib 2B resistance measurement ($D0–
$D3).
RX: Receive measured squib 2A resistance information
TX: Request continuity command ($C2).
RX: Receive measured squib 2B resistance information
TX: Request another command sequence.
RX: Receive low-side driver 1A, 1B, 2A, and 2B continuity
information. Latches will be cleared after data transferred from the squib IC (clear on rising edge of chip
select).
33797
18
Analog Integrated Circuit Device Data
Freescale Semiconductor
FUNCTIONAL DESCRIPTION
FUNCTIONAL DEVICE OPERATION
TX: Request loop-to-loop short command ($E0–$E3)
RX: Previous executed command information.
EXAMPLE—CROSS-COUPLED SQUIB COMMAND
SPI SEQUENCE FROM MICROCONTROLLER
TX: Request another command sequence.
RX: Receive loop-to-loop results from test.
TX: Squib IC #1 request squib 1A resistance measurement
($D0).
RX: Previous executed command information.
CROSS-COUPLED SQUIB IC FUNCTION
The cross-coupled application utilizes the high- and lowside squib drivers from two different squib driver ICs (see
Figure 8, Cross-Coupled Squib Firing, page 17.) Through the
SPI interface, the squib IC will maintain the capability to
conduct standard diagnostics (short-to-battery, short-toground, short between squibs, and squib diagnostics)
between two different squib ICs. The squib IC must maintain
the capability to fire the squib drivers with the ARM and FIRE
command in either cross-coupled or single IC applications.
When the firing squib driver IC is used in cross-coupled
applications, the low-side squib driver must be activated prior
to activating the high-side squib driver.
Cross-coupling the high- and low-side squib driver from
two different squib driver ICs must be done without interfering
with standard squib operations when the squib IC is used in
an application where the high- and low-side squib drivers are
located on the same IC.
All remaining diagnostic functions will operate standard in
either a cross-coupled or single IC applications. These
functions include RR_DIAG, RR_LIMIT_X, High side, VVFIRE_XX,
VVFIRE_RTN, VTRANSTX, squib current timing measurement,
and FEN_1 and FEN_2 diagnostics.
The SENSE_1A (1B, 2A, or 2B) terminal squib IC #1 is
connected to SQB_LO_1A (1B, 2A, or 2B) terminal squib
driver IC #2 and is used to feed the diagnostic signal for
determining squib resistance and short-to-battery/ground
conditions (see Figure 8, page 17). During a fire event, the
fire current passes from squib driver IC #1 high-side driver
though the squib to squib driver IC #2 low-side driver. In the
cross-coupled mode, the squib driver IC #2 $C2
(SQUIB_LO_1A_CONT, [1B, 2A, or 2B]) command will be
used to check continuity of the low-side driver from the
SQB_LO_1A (1B, 2A, or 2B) terminal to the low-side driver
FET.
The low-side driver continuity is checked during the
continuity test. The driver continuity information will be
cleared after the information is transmitted on the next valid
SPI command.
TX: Run another command on the same squib IC #1.
RX: Receive measured squib 1A resistance information.
TX: Squib IC #1 request continuity command ($C2).
RX: Previous executed command information.
TX: Squib IC #2 request continuity command ($C2).
RX: Previous executed command information.
TX: Squib IC #2 request continuity command ($C2).
RX: Receive low-side driver continuity information for lowside drivers which reside on IC #2.
TX: Squib IC #1 request another command sequence.
RX: Receive low-side driver continuity information for lowside drivers that reside on IC #1.
TX: Squib IC #1 request loop-to-loop short command
($E0–$E3)
RX: Previous executed command information.
TX: Squib IC #2 request loop to loop short command for
other ICs ($E8).
RX: Previous executed command information.
TX: Squib IC #2 request loop-to-loop short command for
other ICs ($E8).
RX: Receive loop-to-loop results from test run on IC #1.
TX: Squib IC #1 request another command sequence.
RX: Receive loop-to-loop results from test run on IC #1.
FIRING A SQUIB
The firing of a squib driver requires the FEN_1 and FEN_2
terminals to be high and two separate 8-bit writes be made to
the shift register. With FEN_1 terminal high, squibs 1A and
1B can be armed and fired. With FEN_2 terminal high,
squibs 2A and 2B can be armed and fired. The first write is to
ARM squib drivers in preparation of receiving the fire
command. Squib 1A and squib 1B can be armed separately
from squib 2A and squib 2B (refer to Table 6) or all squibs
can be fired at once (refer to Table 7). All ARM and 5X (Fire)
commands will be echoed back on the SPI Data output.
Table 6. Squib Firing Commands
Hex Code
Command Description
A0 ARM Squib Drivers 1A and 1B
A1 ARM Squib Drivers 2A and 2B
33797
Analog Integrated Circuit Device Data
Freescale Semiconductor
19
FUNCTIONAL DESCRIPTION
FUNCTIONAL DEVICE OPERATION
Table 6. Squib Firing Commands
Byte #1
Byte #2
Squib B
High Side
Squib B
Low Side
Squib A
High Side
A0
ARM Squib Drivers 1A and 1B
A1
ARM Squib Drivers 2A and 2B
Squib A
Low Side
Squib 2B
A2
Squib 2A
Squib 1B
Squib A1
ARM Squib Drivers 1A, 1B, 2A, 2B
50
OFF
OFF
OFF
OFF
OFF
OFF
OFF
OFF
51
OFF
OFF
OFF
ON
OFF
OFF
OFF
ON
52
OFF
OFF
ON
OFF
OFF
OFF
ON
OFF
53
OFF
OFF
ON
ON
OFF
OFF
ON
ON
54
OFF
ON
OFF
OFF
OFF
ON
OFF
OFF
55
OFF
ON
OFF
ON
OFF
ON
OFF
ON
56
OFF
ON
ON
OFF
OFF
ON
ON
OFF
57
OFF
ON
ON
ON
OFF
ON
ON
ON
58
ON
OFF
OFF
OFF
ON
OFF
OFF
OFF
59
ON
OFF
OFF
ON
ON
OFF
OFF
ON
5A
ON
OFF
ON
OFF
ON
OFF
ON
OFF
5B
ON
OFF
ON
ON
ON
OFF
ON
ON
5C
ON
ON
OFF
OFF
ON
ON
OFF
OFF
5D
ON
ON
OFF
ON
ON
ON
OFF
ON
5E
ON
ON
ON
OFF
ON
ON
ON
OFF
5F
ON
ON
ON
ON
ON
ON
ON
ON
The second write is to actually fire the desired driver. The
four most significant bits of the second write are used to
establish a parity with the four most significant bits of the first
write. The four least significant bits are the data bits, and
each bit represents a squib driver or squib driver pair. If there
is a parity mismatch of the four most significant bits, the data
bits will be ignored and the squib drivers will not have their
status changed. The 2-byte write sequence must then be
started again. During the first write, when the drivers are
armed, all diagnostic functions are cleared.
Once fired, a driver can only be turned off by one of the
following:
• Sending a valid 2-byte write sequence through the shift
register.
• Having the reset terminal pulled low.
• Having the thermal shutdown limit exceeded (once
minimum firing duration requirement has been met;
refer to Note 4 in the Maximum Ratings table, page 5).
• Having the FEN terminal pulled low. Note that the code
sequences allow any combination of drivers to be
turned on or off.
Once fired, the current limit measurement register
increments when the squib current is measured and is above
the IMEAS threshold during the timer activation.
The FEN_1 or FEN_2 terminal must be high to enable
firing of the drivers. If fire command is active and the FEN (1
or 2) terminal is pulled low, the FET drivers will turn off
(assuming the latch and hold function is not in effect; refer to
paragraph entitled FEN_1 and FEN_2, page 28). If fire
command is active and the FEN (1 or 2) terminal is pulled
high, the FET driver will turn on.
33797
20
Analog Integrated Circuit Device Data
Freescale Semiconductor
FUNCTIONAL DESCRIPTION
FUNCTIONAL DEVICE OPERATION
During the firing of a squib, significant I•R losses may
occur, which could cause a voltage shift across a circuit
board trace. It is recommended that current paths for
Table 7. Diagnostic Bit Definitions
Hex
Code
Command
Description
discharging the firing supply storage capacitors through the
squib be kept as short as possible and isolated from logic and
diagnostic grounds.
Diagnostic Data Out (Available on Next Command)
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
0
0
0
0
0
0
0
0
SQB_1A
BIT 6
SQB_1A
BIT 5
SQB_1A
BIT 4
SQB_1A
BIT 3
SQB_1A
BIT 2
SQB_1A
BIT 1
SQB_1A
BIT 0
LS
SQB_1B
BIT 4
SQB_1B
BIT 3
SQB_1B
BIT 2
SQB_1B
BIT 1
SQB_1B
BIT 0
LS
00
NOP
70
Squib 1A Current
Measurement
Time
SQB_1A
BIT 7
MS
71
Squib 1B Current
Measurement
Time
SQB_1B
BIT 7
MS
72
Squib 2A Current
Measurement
Time
SQB_2A
BIT 7
MS
SQB_2A
BIT 6
SQB_2A
BIT 5
SQB_2A
BIT 4
SQB_2A
BIT 3
SQB_2A
BIT 2
SQB_2A
BIT 1
SQB_2A
BIT 0
LS
73
Squib 2B Current
Measurement
Time
SQB_2B
BIT 7
MS
SQB_2B
BIT 6
SQB_2B
BIT 5
SQB_2B
BIT 4
SQB_2B
BIT 3
SQB_2B
BIT 2
SQB_2B
BIT 1
SQB_2B
BIT 0
LS
79
Squib X Current
Status
0
0
0
0
7F
Thermal
Shutdown Status
ThermalSD
Thermal
LSDSTAT
_2B
Thermal
HSDSTAT
_2B
Thermal
LSDSTAT
_2A
Thermal
HSDSTAT
_2A
Thermal
LSDSTAT
_1B
Thermal
HSDSTAT
_1B
Thermal
LSDSTAT
_1A
Thermal
HSDSTAT
_1A
C0
VDIAG and HighSide Safing
Sensor
Diagnostics
RSSLO
RSSHI
VDIAG _2
VDIAG _2
RSSLO
RSSHI
VDIAG _1
VDIAG _1
VDHI
VDLO
VDHI
VDLO
C1
Squib Short-toGround/Short-toBattery
Diagnostics
SQB_2B
NO_SH_
GND
SQB_2B
NO_SH_
BATT
SQB_2A
NO_SH_
GND
SQB_2A
NO_SH_
BATT
SQB_1A
NO_SH_
GND
SQB_1A
NO_SH_
BATT
C2
Low-Side Driver
Continuity Status
0
0
0
0
C3
Harness Short-toGround/ Short-toBattery with
Squib Open (No
Squib Present)
SQB_2B
OPEN
NO_SH_
GND
SQB_2B
OPEN
NO_SH_
BATT
SQB_2A
OPEN
NO_SH_
GND
SQB_2A
OPEN
NO_SH_
BATT
Hex
Code
Command
Description
C5
VFIRE_1B and
VFIRE_2B
Voltage
SQB_1B BIT SQB_1B BIT
6
5
SQB_2B
SQB_2A
SQB_1B
SQB_1A
Current Limit Current Limit Current Limit Current Limit
Status
Status
Status
Status
SQB_1B
NO_SH_
GND
SQB_1B
NO_SH_
BATT
SQB_LO_2B_ SQB_LO_2A SQB_LO_1B SQB_LO_1A
CONT
CONT
CONT
CONT
SQB_1B
OPEN
NO_SH_
GND
SQB_1B
OPEN
NO_SH_
BATT
SQB_1A
OPEN
NO_SH_
GND
SQB_1A
OPEN
NO_SH_
BATT
Diagnostic Data Out (Available on Next Command)
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
0
0
0
VFIRE _B
X
X
VHI
VLO
Tested
33797
Analog Integrated Circuit Device Data
Freescale Semiconductor
21
FUNCTIONAL DESCRIPTION
FUNCTIONAL DEVICE OPERATION
Table 7. Diagnostic Bit Definitions (continued)
C6
VDIAG_1 and
VDIAG_2
Diagnostics
VDIAG_2
V4
VDIAG_2
V3
VDIAG_2
V2
VDIAG_2
V1
VDIAG_1
V4
VDIAG_1
V3
VDIAG_1
V2
VDIAG_1
V1
C8
FEN Status,
R_LIMIT_X,
R_DIAG Status,
IC Type
1
R_LIMIT_2
NO_FAULT
R_LIMIT_1
NO_FAULT
R_DIAG
NO_ FAULT
FEN 2
Latch
Status
FEN 1 Latch
Status
FEN 2
Status
FEN 1
Status
C9
VFIRE_RTN
Status
(Open Ground)
0
0
0
0
0
0
VFIRE_
RTN_2
VF2LOW
VFIRE_
RTN_1
VF1LOW
D0
Squib 1A
Resistance
SQB_1A
RC8
SQB_1A
RC7
SQB_1A
RC6
SQB_1A RC5 SQB_1A RC4
SQB_1A
RC3
SQB_1A
RC2
SQB_1A
RC1
D1
Squib 1B
Resistance
SQB_1B
RC8
SQB_1B
RC7
SQB_1B
RC6
SQB_1B RC5 SQB_1B RC4
SQB_1B
RC3
SQB_1B
RC2
SQB_1B
RC1
D2
Squib 2A
Resistance
SQB_2A
RC8
SQB_2A
RC7
SQB_2A
RC6
SQB_2A RC5 SQB_2A RC4
SQB_2A
RC3
SQB_2A
RC2
SQB_2A
RC1
D3
Squib 2B
Resistance
SQB_2B
RC8
SQB_2B
RC7
SQB_2B
RC6
SQB_2B RC5 SQB_2B RC4
SQB_2B
RC3
SQB_2B
RC2
SQB_2B
RC1
E0
Shorts Between
Squib Loops,
Squib 1A
0
0
0
0
SQB_2B
SQB_1A
SQB_2A
SQB_1A
SQB_1B
SQB_1A
SQB_1A
E1
Shorts Between
Squib Loops,
SQUIB 1B
0
0
0
0
SQB_2B
SQB_1B
SQB_2A
SQB_1B
SQB_1B
SQB_1A
SQB_1B
E2
Shorts Between
Squib Loops,
Squib 2A
0
0
0
0
SQB_2B
SQB_2A
SQB_2A
SQB_1B
SQB_2A
SQB_1A
SQB_2A
E3
Shorts Between
Squib Loops,
Squib 2B
0
0
0
0
SQB_2B
SQB_2A
SQB_2B
SQB_1B
SQB_2B
SQB_1A
SQB_2B
E8
Shorts Between
Squib Loops, for
Additional ICs
0
0
0
0
SQB_2B
SHORT
SQB_2A
SHORT
SQB_1B
SHORT
SQB_1A
SHORT
33797
22
Analog Integrated Circuit Device Data
Freescale Semiconductor
FUNCTIONAL DESCRIPTION
FUNCTIONAL DEVICE OPERATION
Table 8. Command Programming and Diagnostic Bit Definitions
Hex
Code
3X
80
XX
81
Command
Description
Command Programming Input and Diagnostic Data Out (Available on Next Command) (22)
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Current
Measurement
Register Reset
Command for
Squib X
Current 1=ON
0
0
1
1
SQB_2B
Data/Timer
Reset
SQB_2A
SQB_1B
SQB_1A
Data/Timer Data/Timer Data/Timer
Reset
Reset
Reset
DATA OUT
Squib X Current
Register Reset
Status
0
0
1
1
SQB_2B
Data/Timer
Reset
SQB_2A
SQB_1B
SQB_1A
Data/Timer Data/Timer Data/Timer
Reset
Reset
Reset
Unlock for FEN 1
Counter Registers
Programming.
1
0
0
0
0
0
0
0
Response DATA
Output: Command
Echoed
1
0
0
0
0
0
0
0
Programming
Command for
FEN 1 Counter
1=ON
FEN1 CNT
BIT 7
MSB
FEN1 CNT
BIT 6
FEN1 CNT
BIT 5
FEN1 CNT
BIT 4
FEN1 CNT
BIT 3
FEN1 CNT
BIT 2
FEN1 CNT
BIT 1
FEN1 CNT
BIT 0
LSB
Response DATA
OUT
FEN 1 Counter
Programming
Status
FEN1 CNT
BIT 7
MSB
FEN1 CNT
BIT 6
FEN1 CNT
BIT 5
FEN1 CNT
BIT 4
FEN1 CNT
BIT 3
FEN1 CNT
BIT 2
FEN1 CNT
BIT 1
FEN1 CNT
BIT 0
LSB
Unlock for FEN 2
Counter Registers
Programming
1
0
0
0
0
0
0
1
Response DATA
Output: Command
Echoed
1
0
0
0
0
0
0
1
Notes
22. The second byte for command programming will be treated as a NOP if any FET is firing. The programming commands have to be
sequential or they will be treated as a NOP.
33797
Analog Integrated Circuit Device Data
Freescale Semiconductor
23
FUNCTIONAL DESCRIPTION
FUNCTIONAL DEVICE OPERATION
Table 8. Command Programming and Diagnostic Bit Definitions (continued)
Hex
Code
XX
Command
Description
Command Programming Input and Diagnostic Data Out (Available on Next Command) (23)
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
FEN2 CNT
BIT 7
MS
FEN2 CNT
BIT 6
FEN2 CNT
BIT 5
FEN2 CNT
BIT 4
FEN2 CNT
BIT 3
FEN2 CNT
BIT 2
FEN2 CNT
BIT 1
FEN2 CNT
BIT 0
LS
FEN2 CNT
BIT 7
MS
FEN2 CNT
BIT 6
FEN2 CNT
BIT 5
FEN2 CNT
BIT 4
FEN2 CNT
BIT 3
FEN2 CNT
BIT 2
FEN2 CNT
BIT 1
FEN2 CNT
BIT 0
LS
Unlock to Test
High-Squib Drivers
1A, 1B, 2A, 2B
1
0
0
0
0
0
1
0
Response DATA
Output: Command
Echoed
1
0
0
0
0
0
1
0
High-Side Driver
Transistor Test
Command
0
0
0
1
SQB_ 2B
High-Side
Driver “ON”
Response DATA
OUT
High-Side Driver
Transistor Status
VTRANTST1
0
0
0
0
Unlock to Test Low
Squib Drivers 1A,
1B, 2A, and 2B
1
0
0
0
0
0
1
1
Response Data
Output: Command
Echoed
1
0
0
0
0
0
1
1
Low-Side Driver
Transistor Test
Command
0
0
1
0
SQB_ 2B
Low-Side
Driver “ON”
Response DATA
OUT Low-Side
Driver Transistor
Status VTRANTST2
0
0
0
0
Programming
Command for
FEN 2 Counter
1=ON
Response DATA
OUT
FEN 2 Counter
Programming
Status
82
1X
83
2X
SQB_2B
SQB_ 2A
SQB_1B
SQB_1A
High-Side
High-Side
High-Side
Driver “ON” Driver “ON” Driver “ON”
SQB_2A
SQB_1B
SQB_1A
HSDSTAT_2B HSDSTAT_2A HSDSTAT_1B HSDSTAT_1A
SQB_2B
SQB_2A
SQB_1B
SQB_1A
Low-Side
Low-Side
Low-Side
Driver “ON” Driver “ON” Driver “ON”
SQB_2A
SQB_1B
SQB_1A
LSDSTAT_ 2B LSDSTAT_ 2A LSDSTAT_1B LSDSTAT_1A
Notes
23. The second byte for command programming will be treated as a NOP if any FET is firing. The programming commands have to be
sequential or they will be treated as a NOP.
Hex
Code
Command
Description
Command Programming Input and Diagnostic Data Out (Available on Next Command) (24)
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
33797
24
Analog Integrated Circuit Device Data
Freescale Semiconductor
FUNCTIONAL DESCRIPTION
PROTECTION AND DIAGNOSIS FEATURES
Table 8. Command Programming and Diagnostic Bit Definitions (continued)
90
Reserved for
Freescale
Read NVM Low
X
X
X
X
X
X
X
X
91
Reserved for
Freescale
Read NVM High
X
X
X
X
X
X
X
X
92
Reserved for
Freescale
NVM Enable
X
X
X
X
X
X
X
X
93
Reserved for
Freescale
Test Mode Enable
X
X
X
X
X
X
X
X
96
SPI Integrity Check
1
0
0
1
0
1
1
0
Response DATA
OUT: $69 Echo to
Diagnose the SPI
Integrity
0
1
1
0
1
0
0
1
Notes
24. The second byte for command programming will be treated as a NOP if any FET is firing. The programming commands have to be
sequential or they will be treated as a NOP.
PROTECTION AND DIAGNOSIS FEATURES
The diagnostic circuit’s internal references are provided by
a bandgap voltage reference, and by scaled currents
determined by the resistor value of R_DIAG and the value of
the bandgap voltage. Refer to Table 7, Diagnostic Bit
Definitions, and Table 8, Command Programming and
Diagnostic Bit Definitions, as necessary throughout this
section.
R_DIAG and R_LIMIT_X RESISTOR DIAGNOSTICS
($C8 COMMAND)
This function monitors reference currents derived by the
R_LIMIT_1, R_LIMIT_2, and R_DIAG resistors. An open
terminal or short to ground will cause the comparator to give
an “out of range resistor value” indication. A short to VDD will
have the same effect as an open terminal and will cause an
“out of range resistor value” indication.
R_LIMIT_X and R_DIAG DATA RESULTS
If R_LIMIT_X is open, shorted to ground, or shorted to
VDD, the bit R_LIMIT_NO_FAULT will be set to “0”. Standard
operation will have this bit set to “1”.
If R_DIAG is open, shorted to ground, or shorted to VDD,
the bit R_DIAG_NO_FAULT will be set to “0”. Standard
operation will have this bit set to “1”.
The FEN 1 and FEN 2 status bits are a reflection of the
FEN_1 and FEN_2 terminals.
HIGH-SIDE SAFING SENSOR DIAGNOSTICS
($C0 COMMAND)
This function monitors the VFIRE_XX terminal connection
to the VDIAG_X terminal. The high-side safing function is
attached to the VFIRE _1A and VFIRE_2A terminals. The
high-side safing function is not available on the VFIRE _1B
and VFIRE_2B terminals.
When enabled, this diagnostic circuit will typically draw
less than 500 µA from the VFIRE supply voltage source.
Internal window comparators will monitor the voltage
difference between the VDIAG_X terminal and the
VFIRE_XX terminal, and will provide two bits of data to
indicate if the terminal voltage is either above (open) or below
(shorted) the threshold levels.
When using a high-side safing sensor, typical 5.1 kΩ
reference resistor must be placed across the sensor to
provide a current path for the diagnostic circuit. As long as
there is a current path and the safing sensor switch is open,
the resulting differential voltage will fall between the
comparator thresholds so that neither an open fault nor a
shorted fault condition will be indicated. A closed safing
sensor will be indicated as a short, and a loss of the
connection between the VDIAG_X terminal and the
VFIRE_XX terminal will be indicated as an open. Any
external capacitance on the VFIRE_XX terminal will affect
the time needed to settle to an accurate value.
33797
Analog Integrated Circuit Device Data
Freescale Semiconductor
25
FUNCTIONAL DESCRIPTION
PROTECTION AND DIAGNOSIS FEATURES
HIGH-SIDE SAFING SENSOR DIAGNOSTIC DATA
RESULTS
If the VFIRE_XX terminal is shorted to the VDIAG_X
terminal, the RSSLO bit will be set to “1” and the RSSHI bit
will be set to “1”. If the VFIRE_XX terminal has no connection
to the VDIAG_X terminal, the RSSLO bit will be set to “0” and
the RSSHI bit will be set to “0”. Standard operation with a
safing sensor resistor will have the RSSHI bit set to “1” and
the RSSLO bit set to “0”.
FIRING SUPPLY VOLTAGE (VDIAG_X)
DIAGNOSTICS ($C0 COMMAND)
This function monitors the voltage on the VDIAG_X
terminal. The supply voltage is compared to two thresholds
(nominal and minimum) and will provide two bits of data to
indicate if the terminal voltage is above, below, or in between
the predetermined threshold levels. There is one diagnostic
circuit for each VDIAG_X terminal.
VDIAG_X SUPPLY VOLTAGE DIAGNOSTIC DATA
RESULTS
If the VDIAG_X voltage is above the high limit, bits VDHI
and VDLO will both be set to “1”. If the VDIAG_X voltage is
between the high limit and the low limit, bit VDHI will be set to
“0” and VDLO will be set to “1”. If the VDIAG_X voltage is
below the low limit, bits VDHI and VDLO will both be set to
“0”.
FIRING SUPPLY VOLTAGE (VFIRE_XX)
DIAGNOSTICS ($C5 COMMAND)
This function monitors the voltage on the VFIRE_XX
terminal. The supply voltage is compared to two thresholds
(nominal and minimum) and will provide two bits of data to
indicate if the terminal voltage is above, below, or in between
the predetermined threshold levels. There is one diagnostic
circuit for each VFIRE_XX terminal.
VFIRE_XX SUPPLY VOLTAGE DIAGNOSTIC DATA
RESULTS
If the VFIRE_XX voltage is above the high limit, bits VFHI
and VFLO will both be set to “1”. If the VFIRE_XX voltage is
between the high limit and the low limit, bit VFHI will be set to
“0” and VFLO will be set to “1”. If the VFIRE_XX voltage is
below the low limit, bits VFHI and VFLO will both be set to “0”.
FIRING SUPPLY VOLTAGE DIAGNOSTICS,
VDIAG_X V1, V2, V3, V4 ($C6 COMMAND)
The VDIAG_X V1, V2, V3, V4 function monitors voltage on
the VDIAG terminals. The voltage being measured is then
compared to four thresholds and will provide four bits of data
to indicate if the terminal voltage is above, below, or between
the predetermined threshold levels. There is one diagnostic
circuit for each VDIAG_X terminal.
VDIAG_X VOLTAGE DIAGNOSTIC DATA RESULTS
If the VDIAG_X voltage is above the threshold limit, the
VDIAG_X VX bit will be set to “1”. If the VDIAG_X voltage is
below the threshold limit, the VDIAG_X VX bit will be set to
“0”.
VFIRE_RTN DIAGNOSTICS ($C9 COMMAND)
This function monitors the resistance on the VFIRE_RTN
terminal for open terminal connections. The VFIRE_RTN
voltage is compared to a threshold to determine if the
VFIRE_RTN terminal connection between the terminal and
the printed circuit board is shorted or open.
VFIRE_RTN DIAGNOSTIC DATA RESULTS
If the VFIRE_RTN terminal is above the threshold limit
(open), the VFIRE_RTN X VFXLOW will be set to “1”. If the
VFIRE_RTN terminal is below the threshold limit (shorted),
the VFIRE_RTN X VFXLOW will be set to “0”.
VFIRE return tests are disabled during firing.
DESIGN NOTES
For all standard or cross-coupled squib IC configurations,
the SQB_LO_XX terminal must be tied to a SENSE_XX
terminal for either squib IC #1 or squib IC #2 (see Figure 7
and Figure 8).
An active 600 µA current sink is located in the SENSE_XX
terminal. The sink current is used to pull the charge off the
external EMC/filter caps after a diagnostic measurement has
been made.
SQUIB SHORT-TO-BATTERY/GROUND
DIAGNOSTICS ($C1 COMMAND)
This function monitors the voltage on the SENSE_XX
terminals. The voltage is compared to two thresholds
(minimum and maximum) and will provide two bits of data to
indicate if the terminal voltage is above, below, or in between
the predetermined threshold levels.
When enabled, a 2.7 mA current source located in the
SQB_HI_XX terminal is activated, sourcing current from the
SQB_HI_XX to the SENSE_XX terminal. When resistive
measurement legs to comparators located in the SENSE_XX
terminal are activated, a fault on either side of the squib can
be easily detected. An external current path that causes the
SQB_LO_XX, SQB_HI_XX, or SENSE_XX terminal to be
pulled below the minimum threshold, will be indicated as a
“Short to Ground”.
If the SQB_LO_XX, SQB_HI_XX, or SENSE_XX terminal
has an external current path that causes the terminal to be
33797
26
Analog Integrated Circuit Device Data
Freescale Semiconductor
FUNCTIONAL DESCRIPTION
PROTECTION AND DIAGNOSIS FEATURES
pulled above the maximum threshold, a “Short to Battery” will
be indicated.
SQUIB SHORT-TO-BATTERY/GROUND
DIAGNOSTIC DATA RESULTS
If SQB_LO_XX, SQB_HI_XX, or SENSE_XX terminal is
shorted to battery, the bit NO_SH_BATT will be set to “0”. If
a SQB_LO_XX, SQB_HI_XX, or SENSE_XX terminal is
shorted to ground, the bit NO_SH_GND will be set to “0”.
During standard operation, both NO_SH_BATT and
NO_SH_GND will be set to “1”.
Note This diagnostic circuit uses an internal 2.7 mA
current source connected to the SQB_HI_XX terminal as a
bias. If the SQB_LO_XX and SQB_HI_XX terminals have
any capacitance (due to discrete capacitors or parasitic
loading), the diagnostic condition will require a settling time
based on the RC time constant.
SQUIB HARNESS SHORT-TO-BATTERY/GROUND
DIAGNOSTICS WITH AN OPEN SQUIB ($C3
COMMAND)
This diagnostic function is to be used with no squib present
(open squib condition) in the wiring harness. For an open
squib condition, the function must monitor the voltage on the
SQB_HI_XX and SQB_LO_XX terminals for “Short to
Ground” and “Short to Battery” conditions.
This function monitors the voltage on the SENSE_XX
terminals. The voltage is compared to two thresholds
(minimum and maximum) and will provide two bits of data to
indicate if the terminal voltage is above, below, or in between
the predetermined threshold levels.
When enabled, a pair of opposing N-channel CMOS
transistors are activated, creating roughly a 500Ω resistance
between the SQB_HI_XX and SQB_LO_XX terminals
together.
A 2.7 mA current source located in the SQB_HI_XX
terminal is activated, sourcing current from the SQB_HI_XX
to the SQB_LO_XX terminal to the SENSE_XX terminal.
When resistive measurement legs to comparators located in
the SENSE_XX terminal are activated, a short to BAT/GND
fault can easily be detected. An external current path that
causes the SQB_LO_XX, SQB_HI_XX, or SENSE_XX
terminal to be pulled below the minimum threshold, will be
indicated as a “Short-to-Ground”.
If the SQB_LO_XX, SQB_HI_XX, or SENSE_XX terminal
has an external current path that causes the terminal to be
pulled above the maximum threshold, a “Short-to-Battery” will
be indicated.
SQUIB SHORT-TO-BATTERY/GROUND
DIAGNOSTIC DATA RESULTS
If SQB_LO_XX, SQB_HI_XX, or SENSE_XX terminal is
shorted to battery, the bit OPEN NO_SH_BATT will be set to
“0”. If a SQB_LO_XX, SQB_HI_XX, or SENSE_XX terminal
is shorted to Ground, the bit OPEN NO_SH_GND will be set
to “0”. During standard operation, both OPEN NO_SH_BATT
and OPEN NO_SH_GND will be set to “1”.
Notes
1. This diagnostic circuit uses an internal 2.7 mA current
source connected to the SQB_HI_XX terminal as a
bias. If the SQB_LO_XX and SQB_HI_XX terminals
have any capacitance (due to discrete capacitors or
parasitic loading) the diagnostic condition will require a
settling time based on the RC time constant.
2. With an OPEN NO_SH_GND or OPEN_NO_SH_BATT
indicated, the SQB_HI_XX or SQB_LO_XX line
contains the fault condition. The standard squib shortto-battery/ground diagnostics ($C1) can be executed
to determine if the fault condition is on the SQB_HI_XX
terminal or the SQB_LO_XX terminal.
CONTINUITY TEST for the LOW-SIDE DRIVER
SQB_LO_XX CONNECTION ($C2 COMMAND)
(LOW-SIDE DRIVER CONTINUITY STATUS)
Low-side driver continuity is checked during the continuity
test diagnostics. This function is used to check continuity at
the SQB_LO_XX terminal connection. When enabled, a
2.0 mA current source located in the SQB_HI_XX terminal is
activated sourcing current from the SQB_HI_XX to the
SQB_LO_XX terminal.
For a standard connection, the SQUIB_LO_XX_CON bit
will be set to “1”. With an open circuit connection, the
SQUIB_LO_XX bit will be set to “0”. The driver continuity
information will be cleared after the information is transmitted
on the next valid SPI command.
SQUIB RESISTANCE DIAGNOSTICS ($D0–$D3
COMMAND)
This function monitors squib resistance. When enabled, a
diagnostic current derived from R_DIAG is passed through
the selected squib. The resulting voltage across the squib is
amplified and passed to an 8-bit voltage level detector. The
eight bits of data will indicate if the selected squib has a
resistance value above or below predetermined thresholds.
The value of R_DIAG can be varied to allow the detection
range to be altered. Increasing the value of R_DIAG will
reduce the diagnostic current; thus, a higher squib resistance
will be needed to reach the same RTH points. In the case that
R_DIAG is a short-to-ground, the diagnostic current through
the squib resistance will typically be less than 50 mA.
SQUIB RESISTANCE DIAGNOSTIC DATA
RESULTS
A comparator result bit set to “1” indicates that the input
voltage is above the threshold resistance for that bit. Thus an
open squib would cause all bits to be set to “1”; likewise, a
shorted squib will cause all bits to be set to “0”.
Squib resistance tests are disabled during firing.
33797
Analog Integrated Circuit Device Data
Freescale Semiconductor
27
FUNCTIONAL DESCRIPTION
PROTECTION AND DIAGNOSIS FEATURES
SQUIB DIAGNOSTICS SHORTS BETWEEN SQUIB
LINES (FIRING LOOPS) ($EX COMMAND)
This function monitors conditions that have shorts
between squib lines (firing loops). When enabled, a 2.7 mA
current source located in the SQB_HI_XX terminal is
activated sourcing current from the selected SQB_HI_XX to
the SENSE_XX terminal. The resulting voltage is checked on
all other squib lines to determine if the squib lines are
shorted. In applications using more than one squib driver IC,
a separate command can also be issued to check all squibs
for shorted squib lines.
SQUIB DIAGNOSTICS SHORTS BETWEEN SQUIB
LINES DIAGNOSTIC DATA RESULTS (SHORTS
BETWEEN FIRING LOOPS)
A comparator result bit set to “1” for SQUIB_XX indicates
standard test current detected in squib line under test.
A comparator result bit set to “0” for SQUIB_XX indicates
faulty diagnostic current detected in squib line under test.
A comparator result bit set to “1” for SQUIB_XX_SSQB_ YY
indicates that the squib line is shorted to the squib under test.
A comparator result bit set to “0” for SQUIB_XX_SSQB_YY
indicates no shorted squib line detected (standard
conditions). If more than two squibs are shorted together, the
response will consist of all “0”s.
RESET (RST)
The Reset terminal has an internal current pull-down of
typically 40 µA. While this terminal is low, the internal
functions of the squib driver IC are disabled and all data in the
serial interface shift registers is cleared. This includes all FEN
1 and 2 counter programming, squib driver activation, and
squib driver FET tests. With a minimum system VDD ≤ 4.1 V,
the system reset bar threshold will be set to “0”.
FEN_1 and FEN_2 (FEN) ($C8 COMMAND)
FEN_1 and FEN_2 have an internal current pull-down of
typically 40 µA. While the FEN terminal is low, firing of the
FET drivers is disabled. All internal diagnostic functions and
results will be available through the serial interface. The FEN
terminal must be pulled high to enable firing of the FET
drivers. Also, the terminal state can be used to turn the FET
driver “ON” and “OFF” after the arm and fire command has
been issued. (That is, once the FET drivers are turned on,
pulling FEN_1 or FEN_2 low can turn the drivers off if the
latch and hold function is not active, and pulling FEN_1 or
FEN_2 high will activate the drivers if the fire command is still
active). Status of FEN 1 and FEN 2 is contained in the C8
diagnostic byte, as shown in Table 7, Diagnostic Bit
Definitions, page 22.)
The FEN_1 and FEN_2 function should be capable of
latching and holding the enable function for electronic safing
function input. This function is required for dual-stage air bag
applications. FEN_1 or FEN_2 will be considered active
when either terminal is active (“1”) for more than 12 ms.
Tolerance range for the filter to be used will be 12 to 16 µs.
When FEN_1 or FEN_2 input is active high, the FEN_1 or
FEN_2 function will be active high. When the FEN_1 or
FEN_2 input state transitions from high to low, a
programmable latching function will hold the FEN function
active until the timeout of the FEN timer. The programmable
latch and hold function will be capable of delays from 1.0 ms
to 255 ms, in 1.0 ms increments. The timer is reset to
programmed time when FEN_1 or FEN_2 terminal transitions
from “0” to “1”. The programmable counter delay will be set
through an SPI command during module power-up/proveout. The default for the counter will be 0 ms.
The bits FEN 1 and FEN 2 STATUS are a reflection of
their respective terminals.
The counter will be reset to 0-Sec time during a reset
condition.
Notes
1. Status information will be required to read counterprogrammed value.
2. Precautions need to be taken in the design to prevent
the latching function from becoming a glitch catching
function.
FEN 1 and FEN 2 COUNTER PROGRAMMING ($80
and $81 COMMAND)
The FEN 1 and FEN 2 counters require two separate 8-bit
writes be made to the shift register. The first write is to unlock
($80 or $81) and reset the FEN counter registers in
preparation of receiving a command. The second byte
contains the programming information to set the required
counter delay time (0 ms to 255 ms with 1.0 ms interval).
Squib IC Power-Up default and $80 or $81 followed by $00
command will set the counter to 0 ms timer delay (refer to
Table 8, page 23.)
The FEN 1 and FEN 2 Counter programming status bits
are a reflection of the counters programming. The
programming status information can be compared to the data
sent to ensure the squib driver was programmed properly.
Counter programming status will be shifted from the shift
register during the next read/write operation (Table 8). All
unlock commands will be echoed back on the SPI Data
output.
FET DRIVER CURRENT LIMIT
A single resistor is used to set the current limit protection
of the high-side drivers of both squib channels. The low-side
current limit is never less than the high-side current limit.
Table 9. RR_LIMIT_X Current Limit
RR_LIMIT_X
VVFIRE = 7.0 V
VVFIRE = 35 V
4.32 kΩ
0.92 A
0.92 A
10 kΩ
1.37 A
1.37 A
45.3 kΩ
2.0 A
2.0 A
33797
28
Analog Integrated Circuit Device Data
Freescale Semiconductor
FUNCTIONAL DESCRIPTION
PROTECTION AND DIAGNOSIS FEATURES
Example of current limit conditions:
RR_LIMIT_X =10 kΩ, IHS = A ± A
The high-side driver controls the current through the squib.
The current limit for the low-side driver is only to protect the
low-side driver stage from excessive current in the event of a
short to battery.
With RR_LIMIT_X conditions <4.32 kΩ or shorted to ground,
the current limit will default to the RR_LIMIT_X = 10 kΩ current
limit, not to exceed. With RR_LIMIT_X resistance value >60 kΩ
or open, the current limit will default to the RR_LIMIT_X =
10 kΩ maximum current limit.
FET DRIVER CURRENT LIMIT MEASUREMENT
($7X COMMAND)
This function measures the firing current in each squib line
and records the “ON” time in which the IMEAS is above the
threshold for each squib. (Refer to Dynamic Electrical
Characteristics table, page 12.) The timing registers can be
reset via SPI command so additional current measurements
can be made.
An 8-bit message will be used to determine 255 time
steps. The driver current limit measurement is activated when
each individual high-side driver is activated. Each time the
squib current is measured above the IMEAS threshold during
the timer activation, a status bit will be set to “1”. If the current
measured is not above the IMEAS threshold during the timer
activation, the timing data log bit will not increment. Each
squib timing register can be reset via SPI command so
additional current measurements can be made. Initial squib
IC power-up will reset the timing registers (i.e., “Power-ON
Reset”). When reset, the current limit measurement register
byte will be set to $00.
Command $79 will indicate the status of the current limit
measurement comparator. The current limit measurement
from the test is captured and loaded into the register on the
next valid SPI command. When the firing current is above
IMEAS, the current limit is activated and the status bit will be
set to “1”. If the firing current is below IMEAS, the current limit
status bit will be set to “0”.
FET DRIVER CURRENT LIMIT MEASUREMENT
RESET COMMAND ($3X COMMAND)
The current limit status registers can be individually reset
with the command set found in Table 8. When the register bit
is set to “1” for squib X, the current measurement register will
be reset to $00.
SQUIB DRIVER THERMAL SHUTDOWN
($7F COMMAND)
With a nominal squib load, the FET squib driver will not
enter thermal shutdown until the driver has been active for a
minimum of 2.09 ms. The individual squib driver thermal
shutdown will not affect other squib drivers firing “ON” times.
With a shorted squib load, the FET squib driver will not
enter thermal shutdown until the driver has been active for a
minimum of 2.090 ms. For the shorted squib load, the
associated FET squib driver may enter thermal shutdown
with an “ON” time of 2.09 ms ≤ tON ≤ 2.82 ms.
When the thermal shutdown limit is exceeded, the thermal
status will be set to “1”. The thermal shutdown status ($7F)
diagnostics latch the thermal bit status when executed. The
Squib Driver Thermal shutdown status latch will be cleared
after the information is transmitted on the next valid SPI
command (i.e., TX: NOP or next $7F, latch cleared on rising
edge of chip select).
The FET squib driver can be activated through the arm/fire
command when the TEMPRENABLE (MIN) is reached (thermal
shutdown status “0”).
VTRANTSTX, HIGH- AND LOW-SIDE SQUIB DRIVER
FET TEST and STATUS ($82 TO $83 COMMAND)
This function checks the squib driver FET transistor status.
The high- and low-side squib driver FET test requires
FEN_1 and FEN_2 terminals to be low and two separate 8bit write commands to be made to the shift register. With the
FEN_1 and FEN_2 terminals status LOW, the first write is to
unlock in preparation of receiving the diagnostic command
for testing the high- and low-side squib drivers. The unlock
command ($82 and $83) is an “AND” function with the FEN_1
and FEN_2 BAR. All transistor test unlock commands ($82
and $83) will be echoed back on the SPI Data output.
The high- or low-side squib driver FET test will be aborted
if firing from any FET is enabled.
During the first write (unlock command), all diagnostic
functions are cleared. After the second write is completed, all
other diagnostic functions are made available again.
Squib 1A, squib 1B, squib 2A, and squib 2B high-side
squib drivers will be activated and diagnosed by the $82
followed by $1X diagnostic command (refer to Table 8,
page 24). A load from the SQB_HI_XX terminal to the
SENSE_XX terminal is required for the high-side squib driver
to be tested.
Squib 1A, squib 1B, squib 2A, and squib 2B low-side
squib drivers will be activated and diagnosed by the $83
followed by $2X diagnostic command (Table 8).
When enabled the high- or low-side FET driver will be
enabled and current limited to a nominal current limit of
10 mA. The high- and low-side driver test time is not
automated and is controlled through SPI.
When either a $82 or a $83 command is issued, the
previous transistor test will stop to prevent coinciding highand low-side FET drive transistors from turning “ON”. This
prevents high- and low-side drivers from being activated
simultaneously.
Note The high- or low-side squib driver test is capable of
checking a code sequence, allowing any combination of highor low-side drivers to be tested.
33797
Analog Integrated Circuit Device Data
Freescale Semiconductor
29
FUNCTIONAL DESCRIPTION
PROTECTION AND DIAGNOSIS FEATURES
The diagnostic squib driver bit (HSDSTAT_X or
LSDSTAT_X) will be set to “1” if the squib driver did not
activate (turn “ON”) during the diagnostic test. The diagnostic
squib driver bit (HSDSTAT_X or LSDSTAT_X) will be set to
“0” if the squib driver did activate (turn “ON”) during the
diagnostic test. Diagnostic data will be shifted from the shift
register during the next read/write operation.
The diagnostic squib driver register will be set/cleared to
“0” when the unlock command is loaded ($82 or $83 loaded
with rising edge of CS).
A diagnostic bit set to “0” indicates standard squib driver
transistor operation.
33797
30
Analog Integrated Circuit Device Data
Freescale Semiconductor
PACKAGING
PACKAGE DIMENSIONS
PACKAGING
PACKAGE DIMENSIONS
Important For the most current revision of the package, visit www.freescale.com and do a keyword search on the 98A drawing
number below.
NOTES:
1. ALL DIMENSIONS ARE IN MILLIMETERS.
2. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
3. DATUMS B AND C TO BE DETERMINED AT THE
PLANE WHERE THE BOTTOM OF THE LEADS EXIT
THE PLASTIC BODY.
4. THIS DIMENSION DOES NOT INCLUDE MOLD
FLASH, PROTRUSION OR GATE BURRS. MOLD
FLASH, PROTRUSION OR GATE BURRS SHALL
NOT EXCEED 0.15 MM PER SIDE. THIS
DIMENSION IS DETERMINED AT THE PLANE
WHERE THE BOTTOM OF THE LEADS EXIT THE
PLASTIC BODY.
5. THIS DIMENSION DOES NOT INCLUDE
INTERLEAD FLASH OR PROTRUSIONS.
INTERLEAD FLASH AND PROTRUSIONS SHALL
NOT EXCEED 0.25 MM PER SIDE. THIS
DIMENSION IS DETERMINED AT THE PLANE
WHERE THE BOTTOM OF THE LEADS EXIT THE
PLASTIC BODY.
6. THIS DIMENSION DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL NOT CAUSE THE LEAD
WIDTH TO EXCEED 0.4 MM PER SIDE. DAMBAR
CANNOT BE LOCATED ON THE LOWER RADIUS
OR THE FOOT. MINIMUM SPACE BETWEEN
PROTRUSION AND ADJACENT LEAD SHALL NOT
LESS THAN 0.07 MM.
7. EXACT SHAPE OF EACH CORNER IS OPTIONAL.
8. THESE DIMENSIONS APPLY TO THE FLAT
SECTION OF THE LEAD BETWEEN 0.10 MM AND
0.3 MM FROM THE LEAD TIP.
9. THE PACKAGE TOP MAY BE SMALLER THAN THE
PACKAGE BOTTOM. THIS DIMENSION IS
DETERMINED AT THE OUTERMOST EXTREMES
OF THE PLASTIC BODY EXCLUSIVE OF MOLD
FLASH, TIE BAR BURRS, GATE BURRS AND
INTER-LEAD FLASH, BUT INCLUDING ANY
MISMATCH BETWEEN THE TOP AND BOTTOM OF
THE PLASTIC BODY.
10.3
7.6
7.4
C
5
1
B
2.65
2.35
9
30X
32
0.65
PIN 1 ID
4
9
B
16
11.1
10.9
CL
17
A
5.15
SEATING
PLANE
32X
2X 16 TIPS
0.10 A
0.3 A B C
A
(0.29)
A
0.25
0.19
(0.203)
0.38
0.22
6
0.13
BASE METAL
M
C A
R0.08 MIN
0.25
PLATING
M
B
GAUGE PLANE
8
SECTION A-A
ROTATED 90 ° CLOCKWISE
8°
0°
0°
MIN
0.29
0.13
0.9
0.5
SECTION B-B
EK SUFFIX
(32-LEAD SOIC)
PLASTIC PACKAGE
98ARH99137A
33797
Analog Integrated Circuit Device Data
Freescale Semiconductor
31
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MC33797
Rev 2.0
07/2005
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