The following document contains information on Cypress products. Although the document is marked
with the name “Spansion”, the company that originally developed the specification, Cypress will
continue to offer these products to new and existing customers.
Continuity of Specifications
There is no change to this document as a result of offering the device as a Cypress product. Any
changes that have been made are the result of normal document improvements and are noted in the
document history page, where supported. Future revisions will occur when appropriate, and changes
will be noted in a document history page.
Continuity of Ordering Part Numbers
Cypress continues to support existing part numbers. To order these products, please use only the
Ordering Part Numbers listed in this document.
For More Information
Please contact your local sales office for additional information about Cypress products and solutions.
About Cypress
Cypress (NASDAQ: CY) delivers high-performance, high-quality solutions at the heart of today’s most
advanced embedded systems, from automotive, industrial and networking platforms to highly
interactive consumer and mobile devices. With a broad, differentiated product portfolio that includes
®
NOR flash memories, F-RAM™ and SRAM, Traveo™ microcontrollers, the industry’s only PSoC
®
programmable system-on-chip solutions, analog and PMIC Power Management ICs, CapSense
®
capacitive touch-sensing controllers, and Wireless BLE Bluetooth Low-Energy and USB connectivity
solutions, Cypress is committed to providing its customers worldwide with consistent innovation, bestin-class support and exceptional system value.
MB9A140NB Series
®
32-bit ARM Cortex®-M3 based Microcontroller
MB9AF141LB/MB/NB, MB9AF142LB/MB/NB,
MB9AF144LB/MB/NB
Data Sheet (Full Production)
Notice to Readers: This document states the current technical specifications regarding the Spansion
product(s) described herein. Spansion Inc. deems the products to have been in sufficient production
volume such that subsequent versions of this document are not expected to change. However,
typographical or specification corrections, or modifications to the valid combinations offered may occur.
Publication Number MB9A140NB_DS706-00040
CONFIDENTIAL
Revision 4.0
Issue Date June 10, 2015
D a t a S h e e t
Notice On Data Sheet Designations
Spansion Inc. issues data sheets with Advance Information or Preliminary designations to advise readers
of product information or intended specifications throughout the product life cycle, including development,
qualification, initial production, and full production. In all cases, however, readers are encouraged to
verify that they have the latest information before finalizing their design. The following descriptions of
Spansion data sheet designations are presented here to highlight their presence and definitions.
Advance Information
The Advance Information designation indicates that Spansion Inc. is developing one or more specific
products, but has not committed any design to production. Information presented in a document with this
designation is likely to change, and in some cases, development on the product may discontinue.
Spansion Inc. therefore places the following conditions upon Advance Information content:
“This document contains information on one or more products under development at Spansion
Inc. The information is intended to help you evaluate this product. Do not design in this product
without contacting the factory. Spansion Inc. reserves the right to change or discontinue work on
this proposed product without notice.”
Preliminary
The Preliminary designation indicates that the product development has progressed such that a
commitment to production has taken place. This designation covers several aspects of the product life
cycle, including product qualification, initial production, and the subsequent phases in the manufacturing
process that occur before full production is achieved. Changes to the technical specifications presented
in a Preliminary document should be expected while keeping these aspects of production under
consideration. Spansion places the following conditions upon Preliminary content:
“This document states the current technical specifications regarding the Spansion product(s)
described herein. The Preliminary status of this document indicates that product qualification
has been completed, and that initial production has begun. Due to the phases of the
manufacturing process that require maintaining efficiency and quality, this document may be
revised by subsequent versions or modifications due to changes in technical specifications.”
Combination
Some data sheets contain a combination of products with different designations (Advance Information,
Preliminary, or Full Production). This type of document distinguishes these products and their
designations wherever necessary, typically on the first page, the ordering information page, and pages
with the DC Characteristics table and the AC Erase and Program table (in the table notes). The
disclaimer on the first page refers the reader to the notice on this page.
Full Production (No Designation on Document)
When a product has been in production for a period of time such that no changes or only nominal
changes are expected, the Preliminary designation is removed from the data sheet. Nominal changes
may include those affecting the number of ordering part numbers available, such as the addition or
deletion of a speed option, temperature range, package type, or VIO range. Changes may also include
those needed to clarify a description or to correct a typographical error or incorrect specification.
Spansion Inc. applies the following conditions to documents in this category:
“This document states the current technical specifications regarding the Spansion product(s)
described herein. Spansion Inc. deems the products to have been in sufficient production
volume such that subsequent versions of this document are not expected to change. However,
typographical or specification corrections, or modifications to the valid combinations offered may
occur.”
Questions regarding these document designations may be directed to your local sales office.
MB9A140NB_DS706-00040-4v0-E, June 10, 2015
CONFIDENTIAL
MB9A140NB Series
32-bit ARM® Cortex®-M3 based Microcontroller
MB9AF141LB/MB/NB, MB9AF142LB/MB/NB,
MB9AF144LB/MB/NB
Data Sheet (Full Production)
Description
The MB9A140NB Series are highly integrated 32-bit microcontrollers dedicated for embedded controllers
with low-power consumption mode and competitive cost.
These series are based on the ARM Cortex-M3 Processor with on-chip Flash memory and SRAM, and have
peripheral functions such as various timers, ADCs, and Communication Interfaces (UART, CSIO, I2C).
The products which are described in this data sheet are placed into TYPE6 product categories in FM3
Family Peripheral Manual.
Note: ARM and Cortex are the trademarks of ARM Limited in the EU and other countries.
Publication Number MB9A140NB_DS706-00040
Revision 4.0
Issue Date June 10, 2015
This document states the current technical specifications regarding the Spansion product(s) described herein. Spansion Inc. deems the products to have been in sufficient
production volume such that subsequent versions of this document are not expected to change. However, typographical or specification corrections, or modifications to the
valid combinations offered may occur.
CONFIDENTIAL
D a t a S h e e t
Features
32-bit ARM Cortex-M3 Core
Processor version: r2p1
Up to 40 MHz Frequency Operation
Integrated Nested Vectored Interrupt Controller (NVIC): 1 NMI (non-maskable interrupt) and
48 peripheral interrupts and 16 priority levels
24-bit System timer (Sys Tick): System timer for OS task management
On-chip Memories
[Flash memory]
Dual operation Flash memory
Dual Operation Flash memory has the upper bank and the lower bank.
So, this series could implement erase, write and read operations
for each bank simultaneously.
Main area: Up to 256 Kbytes (Up to 240 Kbytes upper bank + 16 Kbytes lower bank)
Work area: 32 Kbytes (lower bank)
Read cycle: 0 wait-cycle
Security function for code protection
[SRAM]
This Series on-chip SRAM is composed of two independent SRAM (SRAM0, SRAM1). SRAM0 is
connected to I-code bus and D-code bus of Cortex-M3 core. SRAM1 is connected to System bus.
SRAM0: Up to 16 Kbytes
SRAM1: Up to 16 Kbytes
External Bus Interface*
Supports SRAM, NOR Flash memory device
Up to 8 chip selects
8-/16-bit Data width
Up to 25-bit Address bit
Maximum area size : Up to 256 Mbytes
Supports Address/Data multiplex
Supports external RDY function
* : MB9AF141LB, F142LB and F144LB do not support External Bus Interface.
Multi-function Serial Interface (Max 8channels)
4 channels with 16 steps×9-bit FIFO (ch.4 to ch.7), 4 channels without FIFO (ch.0 to ch.3)
Operation mode is selectable from the followings for each channel.
UART
CSIO
I 2C
[UART]
Full-duplex double buffer
Selection with or without parity supported
Built-in dedicated baud rate generator
External clock available as a serial clock
Hardware Flow control* : Automatically control the transmission by CTS/RTS (only ch.4)
Various error detection functions available (parity errors, framing errors, and overrun errors)
* : MB9AF141LB, F142LB and F144LB do not support Hardware Flow control.
[CSIO]
Full-duplex double buffer
Built-in dedicated baud rate generator
Overrun error detection function available
2
[I C]
Standard-mode (Max 100 kbps) / Fast-mode (Max 400 kbps) supported
2
CONFIDENTIAL
MB9A140NB_DS706-00040-4v0-E, June 10, 2015
D a t a S h e e t
DMA Controller (8 channels)
The DMA Controller has an independent bus from the CPU, so CPU and DMA Controller can process
simultaneously.
8 independently configured and operated channels
Transfer can be started by software or request from the built-in peripherals
Transfer address area: 32-bit (4 Gbytes)
Transfer mode: Block transfer/Burst transfer/Demand transfer
Transfer data type: byte/half-word/word
Transfer block count: 1 to 16
Number of transfers: 1 to 65536
A/D Converter (Max 24 channels)
[12-bit A/D Converter]
Successive Approximation type
Built-in 2 units
Conversion time: 2.0 μs @ 2.7 V to 3.6 V
Priority conversion available (priority at 2 levels)
Scanning conversion mode
Built-in FIFO for conversion data storage (for SCAN conversion: 16 steps, for Priority conversion:
4 steps)
Base Timer (Max 8 channels)
Operation mode is selectable from the followings for each channel.
16-bit PWM timer
16-bit PPG timer
16-/32-bit reload timer
16-/32-bit PWC timer
General-Purpose I/O Port
This series can use its pins as general-purpose I/O ports when they are not used for external bus or
peripherals. Moreover, the port relocate function is built in. It can set which I/O port the peripheral function
can be allocated to.
Capable of pull-up control per pin
Capable of reading pin level directly
Built-in the port relocate function
Up to 83 fast general-purpose I/O Ports@100 pin Package
Some ports are 5V tolerant I/O.
See Pin Description to confirm the corresponding pins.
Dual Timer (32-/16-bit Down Counter)
The Dual Timer consists of two programmable 32-/16-bit down counters.
Operation mode is selectable from the followings for each channel.
Free-running
Periodic (=Reload)
One-shot
June 10, 2015, MB9A140NB_DS706-00040-4v0-E
CONFIDENTIAL
3
D a t a S h e e t
HDMI-CEC/Remote Control Receiver (Up to 2 channels)
HDMI-CEC transmitter
Header block automatic transmission by judging Signal free
Generating status interrupt by detecting Arbitration lost
Generating START, EOM, ACK automatically to output CEC transmission by setting 1 byte data
Generating transmission status interrupt when transmitting 1 block (1 byte data and EOM/ACK)
HDMI-CEC receiver
Automatic ACK reply function available
Line error detection function available
Remote control receiver
4 bytes reception buffer
Repeat code detection function available
Real-time clock (RTC)
The Real-time clock can count Year/Month/Day/Hour/Minute/Second/A day of the week from 01 to 99.
The interrupt function with specifying date and time (Year/Month/Day/Hour/Minute/Second/A day of
the week.) is available. This function is also available by specifying only Year, Month, Day, Hour or
Minute.
Timer interrupt function after set time or each set time.
Capable of rewriting the time with continuing the time count.
Leap year automatic count is available.
Watch Counter
The Watch counter is used for wake up from sleep and timer mode.
Interval timer: up to 64 s (Max) @ Sub Clock : 32.768 kHz
External Interrupt Controller Unit
Up to 16 external interrupt input pins
Include one non-maskable interrupt (NMI) input pin
Watchdog Timer (2 channels)
A watchdog timer can generate interrupts or a reset when a time-out value is reached.
This series consists of two different watchdogs, a Hardware watchdog and a Software watchdog.
The Hardware watchdog timer is clocked by the built-in low-speed CR oscillator. Therefore, the Hardware
watchdog is active in any low-power consumption modes except RTC, Stop, Deep Standby RTC and Deep
Standby Stop modes.
CRC (Cyclic Redundancy Check) Accelerator
The CRC accelerator calculates the CRC which has a heavy software processing load, and achieves a
reduction of the integrity check processing load for reception data and storage.
CCITT CRC16 and IEEE-802.3 CRC32 are supported.
CCITT CRC16 Generator Polynomial: 0x1021
IEEE-802.3 CRC32 Generator Polynomial: 0x04C11DB7
4
CONFIDENTIAL
MB9A140NB_DS706-00040-4v0-E, June 10, 2015
D a t a S h e e t
Clock and Reset
[Clocks]
Selectable from five clock sources (2 external oscillators, 2 built-in CR oscillators, and Main PLL).
Main Clock:
Sub Clock:
Built-in high-speed CR Clock:
Built-in low-speed CR Clock:
Main PLL Clock
4 MHz to 48 MHz
32.768 kHz
4 MHz
100 kHz
[Resets]
Reset requests from INITX pin
Power on reset
Software reset
Watchdog timers reset
Low-voltage detection reset
Clock Super Visor reset
Clock Super Visor (CSV)
Clocks generated by built-in CR oscillators are used to supervise abnormality of the external clocks.
External clock failure (clock stop) is detected, reset is asserted.
External frequency anomaly is detected, interrupt or reset is asserted.
Low-Voltage Detector (LVD)
This Series includes 2-stage monitoring of voltage on the VCC pins. When the voltage falls below the
voltage that has been set, Low-Voltage Detector generates an interrupt or reset.
LVD1: error reporting via interrupt
LVD2: auto-reset operation
Low-Power Consumption Mode
Six low-power consumption modes supported.
Sleep
Timer
RTC
Stop
Deep Standby RTC (selectable between keeping the value of RAM and not)
Deep Standby Stop (selectable between keeping the value of RAM and not)
Debug
Serial Wire JTAG Debug Port (SWJ-DP)
Embedded Trace Macrocells (ETM).*
*: MB9AF141LB/MB, F142LB/MB and F144LB/MB support only SWJ-DP.
Unique ID
Unique value of the device (41-bit) is set.
Power Supply
Wide range voltage:
VCC = 1.65 V to 3.6 V
June 10, 2015, MB9A140NB_DS706-00040-4v0-E
CONFIDENTIAL
5
D a t a S h e e t
Product Lineup
Memory size
Product name
Main
On-chip
area
Flash
Work
memory
area
SRAM0
On-chip
SRAM1
SRAM
Total
MB9AF141LB/MB/NB
MB9AF142LB/MB/NB
MB9AF144LB/MB/NB
64 Kbytes
128 Kbytes
256 Kbytes
32 Kbytes
32 Kbytes
32 Kbytes
8 Kbytes
8 Kbytes
16 Kbytes
8 Kbytes
8 Kbytes
16 Kbytes
16 Kbytes
16 Kbytes
32 Kbytes
Function
Product name
Pin count
MB9AF141LB
MB9AF142LB
MB9AF144LB
64
CPU
Freq.
Power supply voltage range
DMAC
External Bus Interface
Multi-function Serial Interface
(UART/CSIO/I2C)
Base Timer
(PWC/Reload timer/PWM/PPG)
Dual Timer
HDMI-CEC/ Remote Control
Receiver
Real-Time Clock
Watch Counter
CRC Accelerator
Watchdog timer
-
MB9AF141MB
MB9AF142MB
MB9AF144MB
MB9AF141NB
MB9AF142NB
MB9AF144NB
80/96
100/112
Cortex-M3
40 MHz
1.65 V to 3.6 V
8ch.
Addr: 21-bit (Max)
Addr: 25-bit (Max)
R/W Data: 8-bit (Max) R/W Data: 8-/16-bit (Max)
CS: 4 (Max)
CS: 8 (Max)
Support: SRAM,
Support: SRAM,
NOR Flash memory
NOR Flash memory
8ch. (Max)
ch.4 to ch.7: FIFO (16steps × 9-bit)
ch.0 to ch.3: No FIFO
8ch. (Max)
1 unit
2ch. (Max)
1 unit
1 unit
Yes
1ch. (SW) + 1ch. (HW)
8 pins (Max) +
11 pins (Max) +
16 pins (Max) +
External Interrupts
NMI × 1
NMI × 1
NMI × 1
I/O ports
51 pins (Max)
66 pins (Max)
83 pins (Max)
12-bit A/D converter
12ch. (2 units)
17ch. (2 units)
24ch. (2 units)
CSV (Clock Super Visor)
Yes
LVD (Low-Voltage Detector)
2ch.
High-speed
4 MHz
Built-in
CR
Low-speed
100 kHz
Debug Function
SWJ-DP
SWJ-DP/ETM
Unique ID
Yes
Note: All signals of the peripheral function in each product cannot be allocated by limiting the pins of package.
It is necessary to use the port relocate function of the I/O port according to your function use.
See Electrical Characteristics 4.AC Characteristics (3)Built-in CR Oscillation Characteristics for
accuracy of built-in CR.
6
CONFIDENTIAL
MB9A140NB_DS706-00040-4v0-E, June 10, 2015
D a t a S h e e t
Packages
Product name
Package
LQFP: FPT-64P-M38 (0.5mm pitch)
LQFP: FPT-64P-M39 (0.65mm pitch)
QFN: LCC-64P-M24 (0.5mm pitch)
LQFP: FPT-80P-M37 (0.5mm pitch)
LQFP: FPT-80P-M40 (0.65mm pitch)
BGA: BGA-96P-M07 (0.5mm pitch)
LQFP: FPT-100P-M23 (0.5mm pitch)
QFP: FPT-100P-M36 (0.65mm pitch)
BGA: BGA-112P-M04 (0.8mm pitch)
: Supported
MB9AF141LB
MB9AF142LB
MB9AF144LB
MB9AF141MB
MB9AF142MB
MB9AF144MB
-
-
-
-
-
MB9AF141NB
MB9AF142NB
MB9AF144NB
-
Note: See Package Dimensions for detailed information on each package.
June 10, 2015, MB9A140NB_DS706-00040-4v0-E
CONFIDENTIAL
7
D a t a S h e e t
Pin Assignment
FPT-100P-M23
VSS
P81
P80
VCC
P60/SIN5_0/TIOA2_2/INT15_1/WKUP3/CEC1/MRDY_1
P61/SOT5_0/TIOB2_2
P62/SCK5_0/ADTG_3/MOEX_1
P63/INT03_0/MWEX_1
P0F/NMIX/CROUT_1/RTCCO_0/SUBOUT_0/WKUP0
P0E/CTS4_0/TIOB3_2/MDQM1_1
P0D/RTS4_0/TIOA3_2/MDQM0_1
P0C/SCK4_0/TIOA6_1/MALE_1
P0B/SOT4_0/TIOB6_1/MCSX0_1
P0A/SIN4_0/INT00_2/MCSX1_1
P09/TRACECLK/TIOB0_2/RTS4_2/MCSX2_1
P08/AN23/TRACED3/TIOA0_2/CTS4_2/MCSX3_1
P07/AN22/TRACED2/ADTG_0/SCK4_2/MCLKOUT_1
P06/AN21/TRACED1/TIOB5_2/SOT4_2/INT01_1/MCSX4_1
P05/AN20/TRACED0/TIOA5_2/SIN4_2/INT00_1/MCSX5_1
P04/TDO/SWO
P03/TMS/SWDIO
P02/TDI/MCSX6_1
P01/TCK/SWCLK
P00/TRSTX/MCSX7_1
VCC
100
99
98
97
96
95
94
93
92
91
90
89
88
87
86
85
84
83
82
81
80
79
78
77
76
(TOP VIEW)
VCC
1
75
VSS
P50/INT00_0/SIN3_1/MADATA00_1
2
74
P20/AN19/INT05_0/CROUT_0/MAD24_1
P51/INT01_0/SOT3_1/MADATA01_1
3
73
P21/AN18/SIN0_0/INT06_1/WKUP2
P52/INT02_0/SCK3_1/MADATA02_1
4
72
P22/AN17/SOT0_0/TIOB7_1
P53/SIN6_0/TIOA1_2/INT07_2/MADATA03_1
5
71
P23/AN16/SCK0_0/TIOA7_1
P54/SOT6_0/TIOB1_2/MADATA04_1
6
70
P1F/AN15/ADTG_5/MAD23_1
P55/SCK6_0/ADTG_1/MADATA05_1
7
69
P1E/AN14/RTS4_1/MAD22_1
P56/INT08_2/MADATA06_1
8
68
P1D/AN13/CTS4_1/MAD21_1
P30/TIOB0_1/INT03_2/MADATA07_1
9
67
P1C/AN12/SCK4_1/MAD20_1
P31/TIOB1_1/SCK6_1/INT04_2/MADATA08_1
10
66
P1B/AN11/SOT4_1/MAD19_1
P32/TIOB2_1/SOT6_1/INT05_2/MADATA09_1
11
65
P1A/AN10/SIN4_1/INT05_1/MAD18_1
P33/INT04_0/TIOB3_1/SIN6_1/ADTG_6/MADATA10_1
12
64
P19/AN09/SCK2_2/MAD17_1
P34/TIOB4_1/MADATA11_1
13
63
P18/AN08/SOT2_2/MAD16_1
P35/TIOB5_1/INT08_1/MADATA12_1
14
62
AVSS
LQFP - 100
49
50
VSS
46
PE0/MD1
PE3/X1
45
P4E/TIOB5_0/INT06_2/SIN7_1/MAD08_1
48
44
P4D/TIOB4_0/SOT7_1/MAD07_1
PE2/X0
43
P4C/TIOB3_0/SCK7_1/CEC0/MAD06_1
47
42
P4B/TIOB2_0/MAD05_1
MD0
41
VCC
40
51
P4A/TIOB1_0/SCK3_2/MAD04_1
25
39
P10/AN00
VSS
P48/INT14_1/SIN3_2/MAD02_1
52
P49/TIOB0_0/SOT3_2/MAD03_1
24
38
P11/AN01/SIN1_1/INT02_1/WKUP1/MAD09_1
P3F/TIOA5_1
INITX
53
37
23
P47/X1A
P12/AN02/SOT1_1/MAD10_1
P3E/TIOA4_1
36
54
P46/X0A
22
35
P13/AN03/SCK1_1/RTCCO_1/SUBOUT_1/MAD11_1
P3D/TIOA3_1
VCC
55
34
21
VSS
P14/AN04/SIN0_1/INT03_1/MAD12_1
P3C/TIOA2_1
33
56
C
20
32
P15/AN05/SOT0_1/MAD13_1
P3B/TIOA1_1
P45/TIOA5_0/MAD01_1
57
31
19
P44/TIOA4_0/MAD00_1
P16/AN06/SCK0_1/MAD14_1
P3A/TIOA0_1/RTCCO_2/SUBOUT_2
30
58
P43/TIOA3_0/ADTG_7
18
29
P17/AN07/SIN2_2/INT04_1/MAD15_1
P39/ADTG_2
28
59
P42/TIOA2_0
17
27
AVCC
P38/SCK5_2/INT11_1/MADATA15_1
26
AVRH
60
VCC
61
16
P41/TIOA1_0/INT13_1
15
P40/TIOA0_0/INT12_1
P36/SIN5_2/INT09_1/MADATA13_1
P37/SOT5_2/INT10_1/MADATA14_1
<Note>
The number after the underscore ("_") in pin names such as XXX_1 and XXX_2 indicates the relocated
port number. For these pins, there are multiple pins that provide the same function for the same channel.
Use the extended port function register (EPFR) to select the pin.
8
CONFIDENTIAL
MB9A140NB_DS706-00040-4v0-E, June 10, 2015
D a t a S h e e t
FPT-100P-M36
P50/INT00_0/SIN3_1/MADATA00_1
VCC
VSS
P81
P80
VCC
P60/SIN5_0/TIOA2_2/INT15_1/WKUP3/CEC1/MRDY_1
P61/SOT5_0/TIOB2_2
P62/SCK5_0/ADTG_3/MOEX_1
P63/INT03_0/MWEX_1
P0F/NMIX/CROUT_1/RTCCO_0/SUBOUT_0/WKUP0
P0E/CTS4_0/TIOB3_2/MDQM1_1
P0D/RTS4_0/TIOA3_2/MDQM0_1
P0C/SCK4_0/TIOA6_1/MALE_1
P0B/SOT4_0/TIOB6_1/MCSX0_1
P0A/SIN4_0/INT00_2/MCSX1_1
P09/TRACECLK/TIOB0_2/RTS4_2/MCSX2_1
P08/AN23/TRACED3/TIOA0_2/CTS4_2/MCSX3_1
P07/AN22/TRACED2/ADTG_0/SCK4_2/MCLKOUT_1
P06/AN21/TRACED1/TIOB5_2/SOT4_2/INT01_1/MCSX4_1
P05/AN20/TRACED0/TIOA5_2/SIN4_2/INT00_1/MCSX5_1
P04/TDO/SWO
P03/TMS/SWDIO
P02/TDI/MCSX6_1
P01/TCK/SWCLK
P00/TRSTX/MCSX7_1
VCC
VSS
P20/AN19/INT05_0/CROUT_0/MAD24_1
P21/AN18/SIN0_0/INT06_1/WKUP2
80
79
78
77
76
75
74
73
72
71
70
69
68
67
66
65
64
63
62
61
60
59
58
57
56
55
54
53
52
51
(TOP VIEW)
P51/INT01_0/SOT3_1/MADATA01_1
81
50
P22/AN17/SOT0_0/TIOB7_1
P52/INT02_0/SCK3_1/MADATA02_1
82
49
P23/AN16/SCK0_0/TIOA7_1
P53/SIN6_0/TIOA1_2/INT07_2/MADATA03_1
83
48
P1F/AN15/ADTG_5/MAD23_1
P54/SOT6_0/TIOB1_2/MADATA04_1
84
47
P1E/AN14/RTS4_1/MAD22_1
P55/SCK6_0/ADTG_1/MADATA05_1
85
46
P1D/AN13/CTS4_1/MAD21_1
P56/INT08_2/MADATA06_1
86
45
P1C/AN12/SCK4_1/MAD20_1
P30/TIOB0_1/INT03_2/MADATA07_1
87
44
P1B/AN11/SOT4_1/MAD19_1
P31/TIOB1_1/SCK6_1/INT04_2/MADATA08_1
88
43
P1A/AN10/SIN4_1/INT05_1/MAD18_1
P32/TIOB2_1/SOT6_1/INT05_2/MADATA09_1
89
42
P19/AN09/SCK2_2/MAD17_1
P33/INT04_0/TIOB3_1/SIN6_1/ADTG_6/MADATA10_1
90
41
P18/AN08/SOT2_2/MAD16_1
P34/TIOB4_1/MADATA11_1
91
40
AVSS
P35/TIOB5_1/INT08_1/MADATA12_1
92
39
AVRH
P36/SIN5_2/INT09_1/MADATA13_1
93
38
AVCC
P37/SOT5_2/INT10_1/MADATA14_1
94
37
P17/AN07/SIN2_2/INT04_1/MAD15_1
P38/SCK5_2/INT11_1/MADATA15_1
95
36
P16/AN06/SCK0_1/MAD14_1
P39/ADTG_2
96
35
P15/AN05/SOT0_1/MAD13_1
P3A/TIOA0_1/RTCCO_2/SUBOUT_2
97
34
P14/AN04/SIN0_1/INT03_1/MAD12_1
P3B/TIOA1_1
98
33
P13/AN03/SCK1_1/RTCCO_1/SUBOUT_1/MAD11_1
P3C/TIOA2_1
99
32
P12/AN02/SOT1_1/MAD10_1
P3D/TIOA3_1
100
31
P11/AN01/SIN1_1/INT02_1/WKUP1/MAD09_1
15
16
17
18
19
20
21
22
23
24
25
26
27
28
P47/X1A
INITX
P48/INT14_1/SIN3_2/MAD02_1
P49/TIOB0_0/SOT3_2/MAD03_1
P4A/TIOB1_0/SCK3_2/MAD04_1
P4B/TIOB2_0/MAD05_1
P4C/TIOB3_0/SCK7_1/CEC0/MAD06_1
P4D/TIOB4_0/SOT7_1/MAD07_1
P4E/TIOB5_0/INT06_2/SIN7_1/MAD08_1
PE0/MD1
MD0
PE2/X0
PE3/X1
VSS
30
14
P46/X0A
29
13
VCC
12
VSS
VCC
P10/AN00
11
C
7
P42/TIOA2_0
9
6
P41/TIOA1_0/INT13_1
10
5
P40/TIOA0_0/INT12_1
P45/TIOA5_0/MAD01_1
4
VCC
8
3
VSS
P43/TIOA3_0/ADTG_7
2
P3F/TIOA5_1
P44/TIOA4_0/MAD00_1
1
P3E/TIOA4_1
QFP - 100
<Note>
The number after the underscore ("_") in pin names such as XXX_1 and XXX_2 indicates the relocated
port number. For these pins, there are multiple pins that provide the same function for the same channel.
Use the extended port function register (EPFR) to select the pin.
June 10, 2015, MB9A140NB_DS706-00040-4v0-E
CONFIDENTIAL
9
D a t a S h e e t
FPT-80P-M37/M40
VSS
P81
P80
VCC
P60/SIN5_0/TIOA2_2/INT15_1/WKUP3/CEC1/MRDY_1
P61/SOT5_0/TIOB2_2
P62/SCK5_0/ADTG_3/MOEX_1
P63/INT03_0/MWEX_1
P0F/NMIX/CROUT_1/RTCCO_0/SUBOUT_0/WKUP0
P0E/CTS4_0/TIOB3_2/MDQM1_1
P0D/RTS4_0/TIOA3_2/MDQM0_1
P0C/SCK4_0/TIOA6_1/MALE_1
P0B/SOT4_0/TIOB6_1/MCSX0_1
P0A/SIN4_0/INT00_2/MCSX1_1
P07/AN22/ADTG_0/MCLKOUT_1
P04/TDO/SWO
P03/TMS/SWDIO
P02/TDI/MCSX6_1
P01/TCK/SWCLK
P00/TRSTX/MCSX7_1
80
79
78
77
76
75
74
73
72
71
70
69
68
67
66
65
64
63
62
61
(TOP VIEW)
VCC
1
60
P20/AN19/INT05_0/CROUT_0/MAD24_1
P50/INT00_0/SIN3_1/MADATA00_1
2
59
P21/AN18/SIN0_0/INT06_1/WKUP2
P51/INT01_0/SOT3_1/MADATA01_1
3
58
P22/AN17/SOT0_0/TIOB7_1
P52/INT02_0/SCK3_1/MADATA02_1
4
57
P23/AN16/SCK0_0/TIOA7_1
P53/SIN6_0/TIOA1_2/INT07_2/MADATA03_1
5
56
P1B/AN11/SOT4_1/MAD19_1
P54/SOT6_0/TIOB1_2/MADATA04_1
6
55
P1A/AN10/SIN4_1/INT05_1/MAD18_1
P55/SCK6_0/ADTG_1/MADATA05_1
7
54
P19/AN09/SCK2_2/MAD17_1
P56/INT08_2/MADATA06_1
8
53
P18/AN08/SOT2_2/MAD16_1
P30/TIOB0_1/INT03_2/MADATA07_1
9
52
AVSS
P31/TIOB1_1/SCK6_1/INT04_2/MADATA08_1
10
51
AVRH
P32/TIOB2_1/SOT6_1/INT05_2/MADATA09_1
11
50
AVCC
P33/INT04_0/TIOB3_1/SIN6_1/ADTG_6/MADATA10_1
12
49
P17/AN07/SIN2_2/INT04_1/MAD15_1
P39/ADTG_2
13
48
P16/AN06/SCK0_1/MAD14_1
P3A/TIOA0_1/RTCCO_2/SUBOUT_2
14
47
P15/AN05/SOT0_1/MAD13_1
P3B/TIOA1_1
15
46
P14/AN04/SIN0_1/INT03_1/MAD12_1
P3C/TIOA2_1
16
45
P13/AN03/SCK1_1/RTCCO_1/SUBOUT_1/MAD11_1
P3D/TIOA3_1
17
44
P12/AN02/SOT1_1/MAD10_1
P3E/TIOA4_1
18
43
P11/AN01/SIN1_1/INT02_1/WKUP1/MAD09_1
P3F/TIOA5_1
19
42
P10/AN00
VSS
20
41
VCC
27
28
29
30
31
32
33
34
35
36
37
P47/X1A
INITX
P48/INT14_1/SIN3_2/MAD02_1
P49/TIOB0_0/SOT3_2/MAD03_1
P4A/TIOB1_0/SCK3_2/MAD04_1
P4B/TIOB2_0/MAD05_1
P4C/TIOB3_0/SCK7_1/CEC0/MAD06_1
P4D/TIOB4_0/SOT7_1/MAD07_1
P4E/TIOB5_0/INT06_2/SIN7_1/MAD08_1
PE0/MD1
MD0
40
26
P46/X0A
VSS
25
VCC
39
24
VSS
PE3/X1
23
C
38
22
P45/TIOA5_0/MAD01_1
PE2/X0
21
P44/TIOA4_0/MAD00_1
LQFP - 80
<Note>
The number after the underscore ("_") in pin names such as XXX_1 and XXX_2 indicates the relocated
port number. For these pins, there are multiple pins that provide the same function for the same channel.
Use the extended port function register (EPFR) to select the pin.
10
CONFIDENTIAL
MB9A140NB_DS706-00040-4v0-E, June 10, 2015
D a t a S h e e t
FPT-64P-M38/M39
VSS
P81
P80
VCC
P60/SIN5_0/TIOA2_2/INT15_1/WKUP3/CEC1
P61/SOT5_0/TIOB2_2
P62/SCK5_0/ADTG_3
P0F/NMIX/CROUT_1/RTCCO_0/SUBOUT_0/WKUP0
P0C/SCK4_0/TIOA6_1
P0B/SOT4_0/TIOB6_1
P0A/SIN4_0/INT00_2
P04/TDO/SWO
P03/TMS/SWDIO
P02/TDI
P01/TCK/SWCLK
P00/TRSTX
64
63
62
61
60
59
58
57
56
55
54
53
52
51
50
49
(TOP VIEW)
VCC
1
48
P21/AN18/SIN0_0/INT06_1/WKUP2
P50/INT00_0/SIN3_1
2
47
P22/AN17/SOT0_0/TIOB7_1
P51/INT01_0/SOT3_1
3
46
P23/AN16/SCK0_0/TIOA7_1
P52/INT02_0/SCK3_1
4
45
P19/AN09/SCK2_2
P30/TIOB0_1/INT03_2
5
44
P18/AN08/SOT2_2
P31/TIOB1_1/SCK6_1/INT04_2
6
43
AVSS
P32/TIOB2_1/SOT6_1/INT05_2
7
42
AVRH
P33/INT04_0/TIOB3_1/SIN6_1/ADTG_6
8
41
AVCC
P39/ADTG_2
9
40
P17/AN07/SIN2_2/INT04_1
P3A/TIOA0_1/RTCCO_2/SUBOUT_2
10
39
P15/AN05
P3B/TIOA1_1
11
38
P14/AN04/INT03_1
P3C/TIOA2_1
12
37
P13/AN03/SCK1_1/RTCCO_1/SUBOUT_1
P3D/TIOA3_1
13
36
P12/AN02/SOT1_1
P3E/TIOA4_1
14
35
P11/AN01/SIN1_1/INT02_1/WKUP1
P3F/TIOA5_1
15
34
P10/AN00
VSS
16
33
VCC
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
C
VCC
P46/X0A
P47/X1A
INITX
P49/TIOB0_0
P4A/TIOB1_0
P4B/TIOB2_0
P4C/TIOB3_0/SCK7_1/CEC0
P4D/TIOB4_0/SOT7_1
P4E/TIOB5_0/INT06_2/SIN7_1
PE0/MD1
MD0
PE2/X0
PE3/X1
VSS
LQFP - 64
<Note>
The number after the underscore ("_") in pin names such as XXX_1 and XXX_2 indicates the relocated
port number. For these pins, there are multiple pins that provide the same function for the same channel.
Use the extended port function register (EPFR) to select the pin.
June 10, 2015, MB9A140NB_DS706-00040-4v0-E
CONFIDENTIAL
11
D a t a S h e e t
LCC-64P- M24
VSS
P81
P80
VCC
P60/SIN5_0/TIOA2_2/INT15_1/WKUP3/CEC1
P61/SOT5_0/TIOB2_2
P62/SCK5_0/ADTG_3
P0F/NMIX/CROUT_1/RTCCO_0/SUBOUT_0/WKUP0
P0C/SCK4_0/TIOA6_1
P0B/SOT4_0/TIOB6_1
P0A/SIN4_0/INT00_2
P04/TDO/SWO
P03/TMS/SWDIO
P02/TDI
P01/TCK/SWCLK
P00/TRSTX
64
63
62
61
60
59
58
57
56
55
54
53
52
51
50
49
(TOP VIEW)
VCC
1
48
P21/AN18/SIN0_0/INT06_1/WKUP2
P50/INT00_0/SIN3_1
2
47
P22/AN17/SOT0_0/TIOB7_1
P51/INT01_0/SOT3_1
3
46
P23/AN16/SCK0_0/TIOA7_1
P52/INT02_0/SCK3_1
4
45
P19/AN09/SCK2_2
P30/TIOB0_1/INT03_2
5
44
P18/AN08/SOT2_2
P31/TIOB1_1/SCK6_1/INT04_2
6
43
AVSS
P32/TIOB2_1/SOT6_1/INT05_2
7
42
AVRH
P33/INT04_0/TIOB3_1/SIN6_1/ADTG_6
8
41
AVCC
P39/ADTG_2
9
40
P17/AN07/SIN2_2/INT04_1
P3A/TIOA0_1/RTCCO_2/SUBOUT_2
10
39
P15/AN05
P3B/TIOA1_1
11
38
P14/AN04/INT03_1
P3C/TIOA2_1
12
37
P13/AN03/SCK1_1/RTCCO_1/SUBOUT_1
P3D/TIOA3_1
13
36
P12/AN02/SOT1_1
P3E/TIOA4_1
14
35
P11/AN01/SIN1_1/INT02_1/WKUP1
P3F/TIOA5_1
15
34
P10/AN00
VSS
16
33
VCC
19
20
21
22
23
24
25
26
27
28
29
30
31
P46/X0A
P47/X1A
INITX
P49/TIOB0_0
P4A/TIOB1_0
P4B/TIOB2_0
P4C/TIOB3_0/SCK7_1/CEC0
P4D/TIOB4_0/SOT7_1
P4E/TIOB5_0/INT06_2/SIN7_1
PE0/MD1
MD0
PE2/X0
PE3/X1
32
18
VSS
17
C
VCC
QFN - 64
<Note>
The number after the underscore ("_") in pin names such as XXX_1 and XXX_2 indicates the relocated
port number. For these pins, there are multiple pins that provide the same function for the same channel.
Use the extended port function register (EPFR) to select the pin.
12
CONFIDENTIAL
MB9A140NB_DS706-00040-4v0-E, June 10, 2015
D a t a S h e e t
BGA-112P-M04
(TOP VIEW)
1
2
3
4
5
6
7
8
9
10
11
A
VSS
P81
P80
VCC
P0E
P0B
AN22
TMS/
SWDIO
TRSTX
VCC
VSS
B
VCC
VSS
P52
P61
P0F
P0C
AN23
TDO/
SWO
TCK/
SWCLK
VSS
TDI
C
P50
P51
VSS
P60
P62
P0D
P09
AN20
VSS
AN19
AN18
D
P53
P54
P55
VSS
P56
P63
P0A
VSS
AN21
AN16
AN15
E
P30
P31
P32
P33
Index
AN17
AN14
AN12
AN11
F
P34
P35
P36
P39
AN13
AN10
AN09
AVRH
G
P37
P38
P3A
P3D
AN08
AN07
AN06
AVSS
H
P3B
P3C
P3E
VSS
P44
P4C
AN05
VSS
AN04
AN03
AVCC
J
VCC
P3F
VSS
P40
P43
P49
P4D
AN02
VSS
AN01
AN00
K
VCC
VSS
X1A
INITX
P42
P48
P4B
P4E
MD1
VSS
VCC
L
VSS
C
X0A
VSS
P41
P45
P4A
MD0
X0
X1
VSS
PFBGA - 112
<Note>
The number after the underscore ("_") in pin names such as XXX_1 and XXX_2 indicates the relocated
port number. For these pins, there are multiple pins that provide the same function for the same channel.
Use the extended port function register (EPFR) to select the pin.
June 10, 2015, MB9A140NB_DS706-00040-4v0-E
CONFIDENTIAL
13
D a t a S h e e t
BGA-96P-M07
(TOP VIEW)
1
2
3
4
5
6
7
8
9
10
11
A
VSS
P81
P80
VCC
VSS
P0F
VSS
AN22
TMS/
SWDIO
TRSTX
VSS
B
VCC
VSS
P52
P61
P63
P0D
P0C
TDO/
SWO
TCK/
SWCLK
VSS
TDI
C
P50
P51
VSS
P60
P62
P0E
P0B
P0A
VSS
AN19
AN18
D
P53
P54
P55
Index
AN17
AN16
VSS
E
P56
P30
P31
AN11
AN10
AN09
F
VSS
VSS
VSS
AN08
AN07
AVRH
G
P32
P33
P39
AN06
AN05
AVSS
H
P3A
P3B
P3C
AN04
AN03
AVCC
J
P3D
P3E
VSS
P3F
P48
P4A
P4D
AN02
VSS
AN01
AN00
K
VCC
VSS
X1A
INITX
P45
P49
P4C
P4E
MD1
VSS
VCC
L
VSS
C
X0A
VSS
P44
VSS
P4B
MD0
X0
X1
VSS
PFBGA - 96
<Note>
The number after the underscore ("_") in pin names such as XXX_1 and XXX_2 indicates the relocated
port number. For these pins, there are multiple pins that provide the same function for the same channel.
Use the extended port function register (EPFR) to select the pin.
14
CONFIDENTIAL
MB9A140NB_DS706-00040-4v0-E, June 10, 2015
D a t a S h e e t
List of Pin Functions
List of Pin Numbers
The number after the underscore ("_") in pin names such as XXX_1 and XXX_2 indicates the relocated
port number. For these pins, there are multiple pins that provide the same function for the same channel.
Use the extended port function register (EPFR) to select the pin.
Pin No
LQFP-100 QFP-100 BGA-112 LQFP-80 BGA-96
1
79
B1
1
B1
2
80
C1
2
C1
LQFP-64
QFN-64
1
2
-
3
81
C2
3
C2
3
-
4
82
B3
4
B3
4
-
5
83
D1
5
D1
-
6
84
D2
6
D2
-
June 10, 2015, MB9A140NB_DS706-00040-4v0-E
CONFIDENTIAL
Pin Name
VCC
P50
INT00_0
SIN3_1
MADATA00_1
P51
INT01_0
SOT3_1
(SDA3_1)
MADATA01_1
P52
INT02_0
SCK3_1
(SCL3_1)
MADATA02_1
P53
SIN6_0
TIOA1_2
INT07_2
MADATA03_1
P54
SOT6_0
(SDA6_0)
TIOB1_2
MADATA04_1
I/O
Circuit
Type
Pin State
Type
-
E
L
E
L
E
L
E
L
E
K
15
D a t a S h e e t
Pin No
LQFP-64
LQFP-100 QFP-100 BGA-112 LQFP-80 BGA-96
QFN-64
7
85
D3
7
D3
-
8
86
D5
8
E1
-
9
87
E1
9
E2
5
-
10
88
E2
10
E3
6
-
11
89
E3
11
G1
7
-
12
90
E4
12
G2
8
13
91
F1
-
-
-
14
92
F2
-
-
-
16
CONFIDENTIAL
Pin Name
P55
SCK6_0
(SCL6_0)
ADTG_1
MADATA05_1
P56
INT08_2
MADATA06_1
P30
TIOB0_1
INT03_2
MADATA07_1
P31
TIOB1_1
SCK6_1
(SCL6_1)
INT04_2
MADATA08_1
P32
TIOB2_1
SOT6_1
(SDA6_1)
INT05_2
MADATA09_1
P33
INT04_0
TIOB3_1
SIN6_1
ADTG_6
MADATA10_1
P34
TIOB4_1
MADATA11_1
P35
TIOB5_1
INT08_1
MADATA12_1
I/O
Circuit
Type
Pin State
Type
E
K
E
L
E
L
E
L
E
L
E
L
E
K
E
L
MB9A140NB_DS706-00040-4v0-E, June 10, 2015
D a t a S h e e t
Pin No
LQFP-64
LQFP-100 QFP-100 BGA-112 LQFP-80 BGA-96
QFN-64
15
93
F3
-
-
-
-
-
-
-
F1
F2
F3
-
16
94
G1
-
-
-
17
95
G2
-
-
-
18
96
F4
13
G3
9
19
97
G3
14
H1
10
20
98
H1
15
H2
11
21
99
H2
16
H3
12
22
100
G4
17
J1
13
-
-
B2
-
B2
-
23
1
H3
18
J2
14
24
2
J2
19
J4
15
25
26
3
4
L1
J1
20
-
L1
-
16
-
June 10, 2015, MB9A140NB_DS706-00040-4v0-E
CONFIDENTIAL
Pin Name
P36
SIN5_2
INT09_1
MADATA13_1
VSS
VSS
VSS
P37
SOT5_2
(SDA5_2)
INT10_1
MADATA14_1
P38
SCK5_2
(SCL5_2)
INT11_1
MADATA15_1
P39
ADTG_2
P3A
TIOA0_1
RTCCO_2
SUBOUT_2
P3B
TIOA1_1
P3C
TIOA2_1
P3D
TIOA3_1
VSS
P3E
TIOA4_1
P3F
TIOA5_1
VSS
VCC
I/O
Circuit
Type
Pin State
Type
E
L
-
E
L
E
L
E
K
E
K
E
K
E
K
E
K
-
E
K
E
K
-
17
D a t a S h e e t
Pin No
LQFP-64
LQFP-100 QFP-100 BGA-112 LQFP-80 BGA-96
QFN-64
27
5
J4
-
-
-
28
6
L5
-
-
-
29
7
K5
-
-
-
30
8
J5
-
-
-
31
9
H5
21
L5
-
32
10
L6
22
K5
-
33
34
35
11
12
13
K2
J3
H4
L2
L4
K1
23
24
25
K2
J3
L6
L2
L4
K1
17
18
36
14
L3
26
L3
19
37
15
K3
27
K3
20
38
16
K4
28
K4
21
39
17
K6
29
J5
-
22
40
18
J6
30
K6
-
18
CONFIDENTIAL
Pin Name
P40
TIOA0_0
INT12_1
P41
TIOA1_0
INT13_1
P42
TIOA2_0
P43
TIOA3_0
ADTG_7
P44
TIOA4_0
MAD00_1
P45
TIOA5_0
MAD01_1
VSS
VSS
VSS
VSS
C
VSS
VCC
P46
X0A
P47
X1A
INITX
P48
INT14_1
SIN3_2
MAD02_1
P49
TIOB0_0
SOT3_2
(SDA3_2)
MAD03_1
I/O Circuit Pin State
Type
Type
E
L
E
L
E
K
E
K
E
K
E
K
-
D
F
D
G
B
C
E
L
E
K
MB9A140NB_DS706-00040-4v0-E, June 10, 2015
D a t a S h e e t
Pin No
LQFP-64
LQFP-100 QFP-100 BGA-112 LQFP-80 BGA-96
QFN-64
23
41
19
L7
31
J6
-
42
20
K7
32
L7
24
-
43
21
H6
33
K7
25
-
44
22
J7
34
J7
26
-
45
23
K8
35
K8
27
46
24
K9
36
K9
28
47
25
L8
37
L8
29
48
26
L9
38
L9
30
49
27
L10
39
L10
31
50
51
28
29
L11
K11
40
41
L11
K11
32
33
52
30
J11
42
J11
34
53
31
J10
43
J10
35
-
June 10, 2015, MB9A140NB_DS706-00040-4v0-E
CONFIDENTIAL
Pin Name
P4A
TIOB1_0
SCK3_2
(SCL3_2)
MAD04_1
P4B
TIOB2_0
MAD05_1
P4C
TIOB3_0
SCK7_1
(SCL7_1)
CEC0
MAD06_1
P4D
TIOB4_0
SOT7_1
(SDA7_1)
MAD07_1
P4E
TIOB5_0
INT06_2
SIN7_1
MAD08_1
MD1
PE0
MD0
X0
PE2
X1
PE3
VSS
VCC
P10
AN00
P11
AN01
SIN1_1
INT02_1
WKUP1
MAD09_1
I/O Circuit Pin State
Type
Type
E
K
E
K
I
S
I
K
I
L
C
E
G
D
A
A
A
B
-
F
M
F
R
19
D a t a S h e e t
Pin No
LQFP-64
LQFP-100 QFP-100 BGA-112 LQFP-80 BGA-96
QFN-64
54
32
J8
44
J8
-
-
K10
J9
-
K10
J9
55
33
H10
45
H10
36
-
37
38
56
34
H9
46
H9
39
57
35
H7
47
G10
-
58
36
G10
48
G9
59
37
G9
49
F10
60
61
62
38
39
40
H11
F11
G11
50
51
52
H11
F11
G11
20
CONFIDENTIAL
-
40
41
42
43
Pin Name
P12
AN02
SOT1_1
(SDA1_1)
MAD10_1
VSS
VSS
P13
AN03
SCK1_1
(SCL1_1)
RTCCO_1
SUBOUT_1
MAD11_1
P14
AN04
INT03_1
SIN0_1
MAD12_1
P15
AN05
SOT0_1
(SDA0_1)
MAD13_1
P16
AN06
SCK0_1
(SCL0_1)
MAD14_1
P17
AN07
SIN2_2
INT04_1
MAD15_1
AVCC
AVRH
AVSS
I/O Circuit Pin State
Type
Type
F
M
-
F
M
F
N
F
M
F
M
F
N
-
MB9A140NB_DS706-00040-4v0-E, June 10, 2015
D a t a S h e e t
Pin No
LQFP-64
LQFP-100 QFP-100 BGA-112 LQFP-80 BGA-96
QFN-64
63
41
G8
53
F9
44
-
45
64
42
F10
54
E11
-
-
H8
-
-
-
65
43
F9
55
E10
-
66
44
E11
56
E9
-
67
45
E10
-
-
-
68
46
F8
-
-
-
69
47
E9
-
-
-
70
48
D11
-
-
-
June 10, 2015, MB9A140NB_DS706-00040-4v0-E
CONFIDENTIAL
Pin Name
P18
AN08
SOT2_2
(SDA2_2)
MAD16_1
P19
AN09
SCK2_2
(SCL2_2)
MAD17_1
VSS
P1A
AN10
SIN4_1
INT05_1
MAD18_1
P1B
AN11
SOT4_1
(SDA4_1)
MAD19_1
P1C
AN12
SCK4_1
(SCL4_1)
MAD20_1
P1D
AN13
CTS4_1
MAD21_1
P1E
AN14
RTS4_1
MAD22_1
P1F
AN15
ADTG_5
MAD23_1
I/O Circuit Pin State
Type
Type
F
M
F
M
-
F
N
F
M
F
M
F
M
F
M
F
M
21
D a t a S h e e t
Pin No
LQFP-64
LQFP-100 QFP-100 BGA-112 LQFP-80 BGA-96
QFN-64
B10
B10
C9
C9
D11
-
71
49
D10
57
D10
46
72
50
E8
58
D9
47
73
51
C11
59
C11
48
74
52
C10
60
C10
-
75
76
53
54
A11
A10
-
A11
-
-
77
55
A9
61
A10
49
-
78
56
B9
62
B9
79
57
B11
63
B11
50
51
-
80
58
A8
64
A9
52
81
59
B8
65
B8
53
22
CONFIDENTIAL
Pin Name
VSS
VSS
VSS
P23
AN16
SCK0_0
(SCL0_0)
TIOA7_1
P22
AN17
SOT0_0
(SDA0_0)
TIOB7_1
P21
AN18
SIN0_0
INT06_1
WKUP2
P20
AN19
INT05_0
CROUT_0
MAD24_1
VSS
VCC
P00
TRSTX
MCSX7_1
P01
TCK
SWCLK
P02
TDI
MCSX6_1
P03
TMS
SWDIO
P04
TDO
SWO
I/O Circuit Pin State
Type
Type
-
F
M
F
M
F
R
F
N
E
J
E
J
E
J
E
J
E
J
MB9A140NB_DS706-00040-4v0-E, June 10, 2015
D a t a S h e e t
Pin No
LQFP-64
LQFP-100 QFP-100 BGA-112 LQFP-80 BGA-96
QFN-64
82
60
C8
-
-
-
-
-
D8
-
-
-
83
61
D9
-
-
-
66
A8
84
62
A7
-
-
-
-
-
-
A7
-
85
63
B7
-
-
-
86
64
C7
-
-
-
87
65
D7
67
C8
54
-
June 10, 2015, MB9A140NB_DS706-00040-4v0-E
CONFIDENTIAL
Pin Name
P05
AN20
TRACED0
TIOA5_2
SIN4_2
INT00_1
MCSX5_1
VSS
P06
AN21
TRACED1
TIOB5_2
SOT4_2
(SDA4_2)
INT01_1
MCSX4_1
P07
AN22
ADTG_0
MCLKOUT_1
TRACED2
SCK4_2
(SCL4_2)
VSS
P08
AN23
TRACED3
TIOA0_2
CTS4_2
MCSX3_1
P09
TRACECLK
TIOB0_2
RTS4_2
MCSX2_1
P0A
SIN4_0
INT00_2
MCSX1_1
I/O Circuit Pin State
Type
Type
F
Q
-
F
Q
F
P
-
F
P
E
O
I
L
23
D a t a S h e e t
Pin No
LQFP-64
LQFP-100 QFP-100 BGA-112 LQFP-80 BGA-96
QFN-64
88
66
A6
68
C7
55
-
56
89
67
B6
69
B7
-
-
D4
C3
-
C3
-
90
68
C6
70
B6
-
91
69
A5
71
C6
-
-
-
-
-
A5
-
92
70
B5
72
A6
57
93
71
D6
73
B5
-
94
72
C5
74
C5
58
-
95
24
CONFIDENTIAL
73
B4
75
B4
59
Pin Name
P0B
SOT4_0
(SDA4_0)
TIOB6_1
MCSX0_1
P0C
SCK4_0
(SCL4_0)
TIOA6_1
MALE_1
VSS
VSS
P0D
RTS4_0
TIOA3_2
MDQM0_1
P0E
CTS4_0
TIOB3_2
MDQM1_1
VSS
P0F
NMIX
CROUT_1
RTCCO_0
SUBOUT_0
WKUP0
P63
INT03_0
MWEX_1
P62
SCK5_0
(SCL5_0)
ADTG_3
MOEX_1
P61
SOT5_0
(SDA5_0)
TIOB2_2
I/O Circuit Pin State
Type
Type
I
K
I
K
-
E
K
E
K
-
E
I
E
L
E
K
E
K
MB9A140NB_DS706-00040-4v0-E, June 10, 2015
D a t a S h e e t
Pin No
LQFP-64
LQFP-100 QFP-100 BGA-112 LQFP-80 BGA-96
QFN-64
96
97
98
99
100
74
75
76
77
78
C4
A4
A3
A2
A1
76
77
78
79
80
June 10, 2015, MB9A140NB_DS706-00040-4v0-E
CONFIDENTIAL
C4
A4
A3
A2
A1
60
61
62
63
64
Pin Name
P60
SIN5_0
TIOA2_2
INT15_1
WKUP3
CEC1
MRDY_1
VCC
P80
P81
VSS
I/O Circuit Pin State
Type
Type
I
T
H
H
H
H
-
25
D a t a S h e e t
List of pin functions
The number after the underscore ("_") in pin names such as XXX_1 and XXX_2 indicates the relocated
port number. For these pins, there are multiple pins that provide the same function for the same channel.
Use the extended port function register (EPFR) to select the pin.
Pin No
Pin
Pin Name
Function
ADC
26
CONFIDENTIAL
ADTG_0
ADTG_1
ADTG_2
ADTG_3
ADTG_4
ADTG_5
ADTG_6
ADTG_7
ADTG_8
AN00
AN01
AN02
AN03
AN04
AN05
AN06
AN07
AN08
AN09
AN10
AN11
AN12
AN13
AN14
AN15
AN16
AN17
AN18
AN19
AN20
AN21
AN22
AN23
Function Description
A/D converter external trigger
input pin
A/D converter analog input pin.
ANxx describes ADC ch.xx.
LQFP- QFP100
100
84
7
18
94
70
12
30
52
53
54
55
56
57
58
59
63
64
65
66
67
68
69
70
71
72
73
74
82
83
84
85
62
85
96
72
48
90
8
30
31
32
33
34
35
36
37
41
42
43
44
45
46
47
48
49
50
51
52
60
61
62
63
BGA- LQFP- BGA112
80
96
A7
D3
F4
C5
D11
E4
J5
J11
J10
J8
H10
H9
H7
G10
G9
G8
F10
F9
E11
E10
F8
E9
D11
D10
E8
C11
C10
C8
D9
A7
B7
66
7
13
74
12
42
43
44
45
46
47
48
49
53
54
55
56
57
58
59
60
66
-
A8
D3
G3
C5
G2
J11
J10
J8
H10
H9
G10
G9
F10
F9
E11
E10
E9
D10
D9
C11
C10
A8
-
LQFP/
QFN64
9
58
8
34
35
36
37
38
39
40
44
45
46
47
48
-
MB9A140NB_DS706-00040-4v0-E, June 10, 2015
D a t a S h e e t
Pin No
Pin
Pin Name
Function
Base
Timer
0
Base
Timer
1
Base
Timer
2
Base
Timer
3
Base
Timer
4
Base
Timer
5
Base
Timer
6
Base
Timer
7
TIOA0_0
TIOA0_1
TIOA0_2
TIOB0_0
TIOB0_1
TIOB0_2
TIOA1_0
TIOA1_1
TIOA1_2
TIOB1_0
TIOB1_1
TIOB1_2
TIOA2_0
TIOA2_1
TIOA2_2
TIOB2_0
TIOB2_1
TIOB2_2
TIOA3_0
TIOA3_1
TIOA3_2
TIOB3_0
TIOB3_1
TIOB3_2
TIOA4_0
TIOA4_1
TIOA4_2
TIOB4_0
TIOB4_1
TIOB4_2
TIOA5_0
TIOA5_1
TIOA5_2
TIOB5_0
TIOB5_1
TIOB5_2
Function Description
Base timer ch.0 TIOA pin
Base timer ch.0 TIOB pin
Base timer ch.1 TIOA pin
Base timer ch.1 TIOB pin
Base timer ch.2 TIOA pin
Base timer ch.2 TIOB pin
Base timer ch.3 TIOA pin
Base timer ch.3 TIOB pin
Base timer ch.4 TIOA pin
Base timer ch.4 TIOB pin
Base timer ch.5 TIOA pin
Base timer ch.5 TIOB pin
5
97
63
18
87
64
6
98
83
19
88
84
7
99
74
20
89
73
8
100
68
21
90
69
9
1
22
91
10
2
60
23
92
61
J4
G3
B7
J6
E1
C7
L5
H1
D1
L7
E2
D2
K5
H2
C4
K7
E3
B4
J5
G4
C6
H6
E4
A5
H5
H3
J7
F1
L6
J2
C8
K8
F2
D9
14
30
9
15
5
31
10
6
16
76
32
11
75
17
70
33
12
71
21
18
34
22
19
35
-
H1
K6
E2
H2
D1
J6
E3
D2
H3
C4
L7
G1
B4
J1
B6
K7
G2
C6
L5
J2
J7
K5
J4
K8
-
BGA- LQFP- BGA112
80
96
TIOA6_1
Base timer ch.6 TIOA pin
89
67
B6
69
B7
56
TIOB6_1
Base timer ch.6 TIOB pin
88
66
A6
68
C7
55
71
72
-
49
50
-
D10
E8
-
57
58
-
D10
D9
-
46
47
-
TIOA7_0
TIOA7_1
TIOA7_2
TIOB7_0
TIOB7_1
TIOB7_2
Base timer ch.7 TIOA pin
Base timer ch.7 TIOB pin
June 10, 2015, MB9A140NB_DS706-00040-4v0-E
CONFIDENTIAL
27
19
85
40
9
86
28
20
5
41
10
6
29
21
96
42
11
95
30
22
90
43
12
91
31
23
44
13
32
24
82
45
14
83
LQFP/
QFN64
10
22
5
11
23
6
12
60
24
7
59
13
25
8
14
26
15
27
-
LQFP- QFP100
100
27
D a t a S h e e t
Pin No
Pin
Function
Debugger
External
Bus
28
CONFIDENTIAL
Pin Name
Function Description
Serial wire debug interface
clock input pin
Serial wire debug interface
SWDIO
data input / output pin
SWO
Serial wire viewer output pin
TCK
J-TAG test clock input pin
TDI
J-TAG test data input pin
TDO
J-TAG debug data output pin
J-TAG test mode state
TMS
input/output pin
TRACECLK Trace CLK output pin of ETM
TRACED0
TRACED1
Trace data output pins of ETM
TRACED2
TRACED3
TRSTX
J-TAG test reset input pin
MAD00_1
MAD01_1
MAD02_1
MAD03_1
MAD04_1
MAD05_1
MAD06_1
MAD07_1
MAD08_1
MAD09_1
MAD10_1
MAD11_1
External bus interface address
MAD12_1
bus
MAD13_1
MAD14_1
MAD15_1
MAD16_1
MAD17_1
MAD18_1
MAD19_1
MAD20_1
MAD21_1
MAD22_1
MAD23_1
MAD24_1
SWCLK
LQFP- QFP100
100
BGA- LQFP- BGA112
80
96
LQFP/
QFN64
78
56
B9
62
B9
50
80
58
A8
64
A9
52
81
78
79
81
59
56
57
59
B8
B9
B11
B8
65
62
63
65
B8
B9
B11
B8
53
50
51
53
80
58
A8
64
A9
52
86
82
83
84
85
77
31
32
39
40
41
42
43
44
45
53
54
55
56
57
58
59
63
64
65
66
67
68
69
70
74
64
60
61
62
63
55
9
10
17
18
19
20
21
22
23
31
32
33
34
35
36
37
41
42
43
44
45
46
47
48
52
C7
C8
D9
A7
B7
A9
H5
L6
K6
J6
L7
K7
H6
J7
K8
J10
J8
H10
H9
H7
G10
G9
G8
F10
F9
E11
E10
F8
E9
D11
C10
61
21
22
29
30
31
32
33
34
35
43
44
45
46
47
48
49
53
54
55
56
60
A10
L5
K5
J5
K6
J6
L7
K7
J7
K8
J10
J8
H10
H9
G10
G9
F10
F9
E11
E10
E9
C10
49
-
MB9A140NB_DS706-00040-4v0-E, June 10, 2015
D a t a S h e e t
Pin No
Pin
Function
External
Bus
Pin Name
MCSX0_1
MCSX1_1
MCSX2_1
MCSX3_1
MCSX4_1
MCSX5_1
MCSX6_1
MCSX7_1
MDQM0_1
MDQM1_1
MOEX_1
MWEX_1
Function Description
External bus interface chip
select output pin
External bus interface byte
mask signal output pin
External bus interface read
enable signal for SRAM
External bus interface write
enable signal for SRAM
MADATA00_1
MADATA01_1
MADATA02_1
MADATA03_1
MADATA04_1
MADATA05_1
MADATA06_1
MADATA07_1
MADATA08_1
External bus interface data bus
MADATA09_1
MADATA10_1
MADATA11_1
MADATA12_1
MADATA13_1
MADATA14_1
MADATA15_1
Address Latch enable signal
for multiplex
External RDY input signal
MRDY_1
MCLKOUT_1 External bus clock output pin
MALE_1
June 10, 2015, MB9A140NB_DS706-00040-4v0-E
CONFIDENTIAL
88
87
86
85
83
82
79
77
90
91
66
65
64
63
61
60
57
55
68
69
A6
D7
C7
B7
D9
C8
B11
A9
C6
A5
68
67
63
61
70
71
C7
C8
B11
A10
B6
C6
LQFP/
QFN64
-
94
72
C5
74
C5
-
93
71
D6
73
B5
-
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
80
81
82
83
84
85
86
87
88
89
90
91
92
93
94
95
C1
C2
B3
D1
D2
D3
D5
E1
E2
E3
E4
F1
F2
F3
G1
G2
2
3
4
5
6
7
8
9
10
11
12
-
C1
C2
B3
D1
D2
D3
E1
E2
E3
G1
G2
-
-
89
67
B6
69
B7
-
96
84
74
62
C4
A7
76
66
C4
A8
-
LQFP- QFP100
100
BGA- LQFP- BGA112
80
96
29
D a t a S h e e t
Pin No
Pin
Function
External
Interrupt
Pin Name
INT00_0
INT00_1
INT00_2
INT01_0
INT01_1
INT02_0
INT02_1
INT03_0
INT03_1
INT03_2
INT04_0
INT04_1
INT04_2
INT05_0
INT05_1
INT05_2
INT06_1
INT06_2
INT07_2
INT08_1
INT08_2
INT09_1
INT10_1
INT11_1
INT12_1
INT13_1
INT14_1
INT15_1
NMIX
30
CONFIDENTIAL
Function Description
External interrupt request 00
input pin
External interrupt request 01
input pin
External interrupt request 02
input pin
External interrupt request 03
input pin
External interrupt request 04
input pin
External interrupt request 05
input pin
External interrupt request 06
input pin
External interrupt request 07
input pin
External interrupt request 08
input pin
External interrupt request 09
input pin
External interrupt request 10
input pin
External interrupt request 11
input pin
External interrupt request 12
input pin
External interrupt request 13
input pin
External interrupt request 14
input pin
External interrupt request 15
input pin
Non-Maskable Interrupt input
pin
2
82
87
3
83
4
53
93
56
9
12
59
10
74
65
11
73
45
80
60
65
81
61
82
31
71
34
87
90
37
88
52
43
89
51
23
C1
C8
D7
C2
D9
B3
J10
D6
H9
E1
E4
G9
E2
C10
F9
E3
C11
K8
2
67
3
4
43
73
46
9
12
49
10
60
55
11
59
35
C1
C8
C2
B3
J10
B5
H9
E2
G2
F10
E3
C10
E10
G1
C11
K8
LQFP/
QFN64
2
54
3
4
35
38
5
8
40
6
7
48
27
5
83
D1
5
D1
-
14
8
92
86
F2
D5
8
E1
-
15
93
F3
-
-
-
16
94
G1
-
-
-
17
95
G2
-
-
-
27
5
J4
-
-
-
28
6
L5
-
-
-
39
17
K6
29
J5
-
96
74
C4
76
C4
60
92
70
B5
72
A6
57
LQFP- QFP100
100
BGA- LQFP- BGA112
80
96
MB9A140NB_DS706-00040-4v0-E, June 10, 2015
D a t a S h e e t
Pin No
Pin
Function
GPIO
Pin Name
P00
P01
P02
P03
P04
P05
P06
P07
P08
P09
P0A
P0B
P0C
P0D
P0E
P0F
P10
P11
P12
P13
P14
P15
P16
P17
P18
P19
P1A
P1B
P1C
P1D
P1E
P1F
P20
P21
P22
P23
Function Description
General-purpose I/O port 0
General-purpose I/O port 1
General-purpose I/O port 2
June 10, 2015, MB9A140NB_DS706-00040-4v0-E
CONFIDENTIAL
LQFP- QFP100
100
77
78
79
80
81
82
83
84
85
86
87
88
89
90
91
92
52
53
54
55
56
57
58
59
63
64
65
66
67
68
69
70
74
73
72
71
55
56
57
58
59
60
61
62
63
64
65
66
67
68
69
70
30
31
32
33
34
35
36
37
41
42
43
44
45
46
47
48
52
51
50
49
BGA- LQFP- BGA112
80
96
A9
B9
B11
A8
B8
C8
D9
A7
B7
C7
D7
A6
B6
C6
A5
B5
J11
J10
J8
H10
H9
H7
G10
G9
G8
F10
F9
E11
E10
F8
E9
D11
C10
C11
E8
D10
61
62
63
64
65
66
67
68
69
70
71
72
42
43
44
45
46
47
48
49
53
54
55
56
60
59
58
57
A10
B9
B11
A9
B8
A8
C8
C7
B7
B6
C6
A6
J11
J10
J8
H10
H9
G10
G9
F10
F9
E11
E10
E9
C10
C11
D9
D10
LQFP/
QFN64
49
50
51
52
53
54
55
56
57
34
35
36
37
38
39
40
44
45
48
47
46
31
D a t a S h e e t
Pin No
Pin
Function
GPIO
32
CONFIDENTIAL
Pin Name
P30
P31
P32
P33
P34
P35
P36
P37
P38
P39
P3A
P3B
P3C
P3D
P3E
P3F
P40
P41
P42
P43
P44
P45
P46
P47
P48
P49
P4A
P4B
P4C
P4D
P4E
P50
P51
P52
P53
P54
P55
P56
P60
P61
P62
P63
P80
P81
PE0
PE2
PE3
Function Description
General-purpose I/O port 3
General-purpose I/O port 4
General-purpose I/O port 5
General-purpose I/O port 6
General-purpose I/O port 8
General-purpose I/O port E
LQFP- QFP100
100
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
27
28
29
30
31
32
36
37
39
40
41
42
43
44
45
2
3
4
5
6
7
8
96
95
94
93
98
99
46
48
49
87
88
89
90
91
92
93
94
95
96
97
98
99
100
1
2
5
6
7
8
9
10
14
15
17
18
19
20
21
22
23
80
81
82
83
84
85
86
74
73
72
71
76
77
24
26
27
BGA- LQFP- BGA112
80
96
E1
E2
E3
E4
F1
F2
F3
G1
G2
F4
G3
H1
H2
G4
H3
J2
J4
L5
K5
J5
H5
L6
L3
K3
K6
J6
L7
K7
H6
J7
K8
C1
C2
B3
D1
D2
D3
D5
C4
B4
C5
D6
A3
A2
K9
L9
L10
9
10
11
12
13
14
15
16
17
18
19
21
22
26
27
29
30
31
32
33
34
35
2
3
4
5
6
7
8
76
75
74
73
78
79
36
38
39
E2
E3
G1
G2
G3
H1
H2
H3
J1
J2
J4
L5
K5
L3
K3
J5
K6
J6
L7
K7
J7
K8
C1
C2
B3
D1
D2
D3
E1
C4
B4
C5
B5
A3
A2
K9
L9
L10
LQFP/
QFN64
5
6
7
8
9
10
11
12
13
14
15
19
20
22
23
24
25
26
27
2
3
4
60
59
58
62
63
28
30
31
MB9A140NB_DS706-00040-4v0-E, June 10, 2015
D a t a S h e e t
Pin No
Pin
Function
Multifunction
Serial
0
Pin Name
Function Description
SIN0_0
SIN0_1
Multi-function serial interface
ch.0 input pin
Multi-function serial interface
ch.0 output pin.
This pin operates as SOT0
when it is used in a
UART/CSIO (operation
modes 0 to 2) and as SDA0
when it is used in an I2C
(operation mode 4).
Multi-function serial interface
ch.0 clock I/O pin.
This pin operates as SCK0
when it is used in a
UART/CSIO (operation
modes 0 to 2) and as SCL0
when it is used in an I2C
(operation mode 4).
Multi-function serial interface
ch.1 input pin
Multi-function serial interface
ch.1 output pin.
This pin operates as SOT1
when it is used in a
UART/CSIO (operation
modes 0 to 2) and as SDA1
when it is used in an I2C
(operation mode 4).
Multi-function serial interface
ch.1 clock I/O pin.
This pin operates as SCK1
when it is used in a
UART/CSIO (operation
modes 0 to 2) and as SCL1
when it is used in an I2C
(operation mode 4).
SOT0_0
(SDA0_0)
SOT0_1
(SDA0_1)
SCK0_0
(SCL0_0)
SCK0_1
(SCL0_1)
Multifunction
Serial
1
SIN1_1
SOT1_1
(SDA1_1)
SCK1_1
(SCL1_1)
June 10, 2015, MB9A140NB_DS706-00040-4v0-E
CONFIDENTIAL
73
56
51
34
C11
H9
59
46
C11
H9
LQFP/
QFN64
48
-
72
50
E8
58
D9
47
57
35
H7
47
G10
-
71
49
D10
57
D10
46
58
36
G10
48
G9
-
53
31
J10
43
J10
35
54
32
J8
44
J8
36
55
33
H10
45
H10
37
LQFP- QFP100
100
BGA- LQFP- BGA112
80
96
33
D a t a S h e e t
Pin No
Pin
Function
Multifunction
Serial
2
Pin Name
SIN2_2
SOT2_2
(SDA2_2)
SCK2_2
(SCL2_2)
Multifunction
Serial
3
SIN3_1
SIN3_2
SOT3_1
(SDA3_1)
SOT3_2
(SDA3_2)
SCK3_1
(SCL3_1)
SCK3_2
(SCL3_2)
34
CONFIDENTIAL
Function Description
Multi-function serial interface
ch.2 input pin
Multi-function serial interface
ch.2 output pin.
This pin operates as SOT2
when it is used in a
UART/CSIO (operation
modes 0 to 2) and as SDA2
when it is used in an I2C
(operation mode 4).
Multi-function serial interface
ch.2 clock I/O pin.
This pin operates as SCK2
when it is used in a
UART/CSIO (operation
modes 0 to 2) and as SCL2
when it is used in an I2C
(operation mode 4).
Multi-function serial interface
ch.3 input pin
Multi-function serial interface
ch.3 output pin.
This pin operates as SOT3
when it is used in a
UART/CSIO (operation
modes 0 to 2) and as SDA3
when it is used in an I2C
(operation mode 4).
Multi-function serial interface
ch.3 clock I/O pin.
This pin operates as SCK3
when it is used in a
UART/CSIO (operation
modes 0 to 2) and as SCL3
when it is used in an I2C
(operation mode 4).
LQFP- QFP100
100
BGA- LQFP- BGA112
80
96
LQFP/
QFN64
59
37
G9
49
F10
40
63
41
G8
53
F9
44
64
42
F10
54
E11
45
2
39
80
17
C1
K6
2
29
C1
J5
2
-
3
81
C2
3
C2
3
40
18
J6
30
K6
-
4
82
B3
4
B3
4
41
19
L7
31
J6
-
MB9A140NB_DS706-00040-4v0-E, June 10, 2015
D a t a S h e e t
Pin No
Pin
Function
Pin Name
Function Description
Multifunction
Serial
4
SIN4_0
SIN4_1
SIN4_2
Multi-function serial interface
ch.4 input pin
SOT4_0
(SDA4_0)
SOT4_1
(SDA4_1)
SOT4_2
(SDA4_2)
SCK4_0
(SCL4_0)
SCK4_1
(SCL4_1)
SCK4_2
(SCL4_2)
Multifunction
Serial
5
RTS4_0
RTS4_1
RTS4_2
CTS4_0
CTS4_1
CTS4_2
SIN5_0
SIN5_2
SOT5_0
(SDA5_0)
SOT5_2
(SDA5_2)
SCK5_0
(SCL5_0)
SCK5_2
(SCL5_2)
Multi-function serial interface
ch.4 output pin.
This pin operates as SOT4
when it is used in a
UART/CSIO (operation
modes 0 to 2) and as SDA4
when it is used in an I2C
(operation mode 4).
Multi-function serial interface
ch.4 clock I/O pin.
This pin operates as SCK4
when it is used in a
UART/CSIO (operation
modes 0 to 2) and as SCL4
when it is used in an I2C
(operation mode 4).
Multi-function serial interface
ch.4 RTS output pin
Multi-function serial interface
ch.4 CTS input pin
Multi-function serial interface
ch.5 input pin
Multi-function serial interface
ch.5 output pin.
This pin operates as SOT5
when it is used in a
UART/CSIO (operation
modes 0 to 2) and as SDA5
when it is used in an I2C
(operation mode 4).
Multi-function serial interface
ch.5 clock I/O pin.
This pin operates as SCK5
when it is used in a
UART/CSIO (operation
modes 0 to 2) and as SCL5
when it is used in an I2C
(operation mode 4).
June 10, 2015, MB9A140NB_DS706-00040-4v0-E
CONFIDENTIAL
87
65
82
65
43
60
D7
F9
C8
67
55
-
C8
E10
-
LQFP/
QFN64
54
-
88
66
A6
68
C7
55
66
44
E11
56
E9
-
83
61
D9
-
-
-
89
67
B6
69
B7
56
67
45
E10
-
-
-
84
62
A7
-
-
-
90
69
86
91
68
85
96
15
68
47
64
69
46
63
74
93
C6
E9
C7
A5
F8
B7
C4
F3
70
71
76
-
B6
C6
C4
-
60
-
95
73
B4
75
B4
59
16
94
G1
-
-
-
94
72
C5
74
C5
58
17
95
G2
-
-
-
LQFP- QFP100
100
BGA- LQFP- BGA112
80
96
35
D a t a S h e e t
Pin No
Pin
Function
Multifunction
Serial
6
Pin Name
Function Description
SIN6_0
SIN6_1
Multi-function serial interface
ch.6 input pin
Multi-function serial interface
ch.6 output pin.
This pin operates as SOT6
when it is used in a
UART/CSIO (operation
modes 0 to 2) and as SDA6
when it is used in an I2C
(operation mode 4).
Multi-function serial interface
ch.6 clock I/O pin.
This pin operates as SCK6
when it is used in a
UART/CSIO (operation
modes 0 to 2) and as SCL6
when it is used in an I2C
(operation mode 4).
Multi-function serial interface
ch.7 input pin
Multi-function serial interface
ch.7 output pin.
This pin operates as SOT7
when it is used in a
UART/CSIO (operation
modes 0 to 2) and as SDA7
when it is used in an I2C
(operation mode 4).
Multi-function serial interface
ch.7 clock I/O pin.
This pin operates as SCK7
when it is used in a
UART/CSIO (operation
modes 0 to 2) and as SCL7
when it is used in an I2C
(operation mode 4).
SOT6_0
(SDA6_0)
SOT6_1
(SDA6_1)
SCK6_0
(SCL6_0)
SCK6_1
(SCL6_1)
Multifunction
Serial
7
SIN7_1
SOT7_1
(SDA7_1)
SCK7_1
(SCL7_1)
36
CONFIDENTIAL
5
12
83
90
D1
E4
5
12
D1
G2
LQFP/
QFN64
8
6
84
D2
6
D2
-
11
89
E3
11
G1
7
7
85
D3
7
D3
-
10
88
E2
10
E3
6
45
23
K8
35
K8
27
44
22
J7
34
J7
26
43
21
H6
33
K7
25
LQFP- QFP100
100
BGA- LQFP- BGA112
80
96
MB9A140NB_DS706-00040-4v0-E, June 10, 2015
D a t a S h e e t
Pin No
Pin
Function
Real-time
clock
Low-Power
Consumption
Mode
Pin Name
RTCCO_0
RTCCO_1
RTCCO_2
SUBOUT_0
SUBOUT_1
SUBOUT_2
WKUP0
WKUP1
WKUP2
WKUP3
HDMICEC/
Remote
Control
CEC0
CEC1
Function Description
0.5 seconds pulse output pin
of Real-time clock
Sub clock output pin
Deep standby mode return
signal input pin 0
Deep standby mode return
signal input pin 1
Deep standby mode return
signal input pin 2
Deep standby mode return
signal input pin 3
HDMI-CEC/RemoteControl
Reception ch.0 input/output
pin
HDMI-CEC/RemoteControl
Reception ch.1 input/output
pin
June 10, 2015, MB9A140NB_DS706-00040-4v0-E
CONFIDENTIAL
92
55
19
92
55
19
70
33
97
70
33
97
B5
H10
G3
B5
H10
G3
72
45
14
72
45
14
A6
H10
H1
A6
H10
H1
LQFP/
QFN64
57
37
10
57
37
10
92
70
B5
72
A6
57
53
31
J10
43
J10
35
73
51
C11
59
C11
48
96
74
C4
76
C4
60
43
21
H6
33
K7
25
96
74
C4
76
C4
60
LQFP- QFP100
100
BGA- LQFP- BGA112
80
96
37
D a t a S h e e t
Pin No
Pin
Function
Pin Name
Reset
INITX
Mode
MD0
MD1
Power
GND
38
CONFIDENTIAL
VCC
VCC
VCC
VCC
VCC
VCC
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
Function Description
External Reset Input pin.
A reset is valid when
INITX=L.
Mode 0 pin.
During normal operation,
MD0=L must be input. During
serial programming to Flash
memory, MD0=H must be
input.
Mode 1 pin.
During serial programming to
Flash memory, MD1=L must
be input.
Power supply Pin
Power supply Pin
Power supply Pin
Power supply Pin
Power supply Pin
Power supply Pin
GND Pin
GND Pin
GND Pin
GND Pin
GND Pin
GND Pin
GND Pin
GND Pin
GND Pin
GND Pin
GND Pin
GND Pin
GND Pin
GND Pin
GND Pin
GND Pin
GND Pin
GND Pin
GND Pin
GND Pin
GND Pin
GND Pin
GND Pin
GND Pin
LQFP100
LQFP/
QFP- BGA- LQFP- BGAQFN100
112
80
96
64
38
16
K4
28
K4
21
47
25
L8
37
L8
29
46
24
K9
36
K9
28
1
26
35
51
76
97
25
34
50
75
100
79
4
13
29
54
75
3
12
28
53
78
B1
J1
K1
K11
A10
A4
B2
L1
K2
J3
H4
L4
L11
K10
J9
H8
B10
C9
A11
D8
D4
C3
A1
1
25
41
77
20
24
40
80
B1
K1
K11
A4
F1
F2
F3
B2
L1
K2
J3
L6
L4
L11
K10
J9
B10
C9
D11
A11
A7
C3
A5
A1
1
18
33
61
16
32
64
MB9A140NB_DS706-00040-4v0-E, June 10, 2015
D a t a S h e e t
Pin No
Pin
Function
Clock
Pin Name
X0
X0A
X1
X1A
CROUT_0
CROUT_1
ADC
power
AVCC
AVRH
ADC
GND
C pin
AVSS
C
Function Description
Main clock (oscillation) input
pin
Sub clock (oscillation) input
pin
Main clock (oscillation) I/O
pin
Sub clock (oscillation) I/O pin
Built-in high-speed CR-osc
clock output port
A/D converter analog power
supply pin
A/D converter analog reference
voltage input pin
BGA- LQFP- BGA112
80
96
LQFP/
QFN64
48
26
L9
38
L9
30
36
14
L3
26
L3
19
49
27
L10
39
L10
31
37
74
92
15
52
70
K3
C10
B5
27
60
72
K3
C10
A6
20
57
60
38
H11
50
H11
41
61
39
F11
51
F11
42
A/D converter GND pin
62
40
G11
52
G11
43
Power stabilization capacity
pin
33
11
L2
23
L2
17
June 10, 2015, MB9A140NB_DS706-00040-4v0-E
CONFIDENTIAL
LQFP- QFP100
100
39
D a t a S h e e t
I/O Circuit Type
Type
Circuit
Remarks
A
It is possible to select the main
oscillation / GPIO function
When the main oscillation is
selected.
Oscillation feedback resistor
: Approximately 1 MΩ
With Standby mode control
Pull-up
resistor
P-ch
P-ch
Digital output
X1
N-ch
Digital output
R
Pull-up resistor control
When the GPIO is selected.
CMOS level output.
CMOS level hysteresis input
With pull-up resistor control
With standby mode control
Pull-up resistor
: Approximately 33 kΩ
IOH= -4 mA, IOL= 4 mA
Digital input
Standby mode control
Clock input
Feedback
resistor
Standby mode control
Digital input
Standby mode control
Pull-up
resistor
R
P-ch
P-ch
Digital output
N-ch
Digital output
X0
Pull-up resistor control
CMOS level hysteresis input
Pull-up resistor
: Approximately 33 kΩ
B
Pull-up resistor
Digital input
40
CONFIDENTIAL
MB9A140NB_DS706-00040-4v0-E, June 10, 2015
D a t a S h e e t
Type
Circuit
Remarks
C
Digital input
Open drain output
CMOS level hysteresis input
Digital output
N-ch
D
It is possible to select the sub
oscillation / GPIO function
Pull-up
resistor
P-ch
P-ch
Digital output
X1A
N-ch
Digital output
R
Pull-up resistor control
Digital input
When the sub oscillation is
selected.
Oscillation feedback resistor
: Approximately 5 MΩ
With Standby mode control
When the GPIO is selected.
CMOS level output.
CMOS level hysteresis input
With pull-up resistor control
With standby mode control
Pull-up resistor
: Approximately 33 kΩ
IOH= -4 mA, IOL= 4 mA
Standby mode control
Clock input
Feedback
resistor
Standby mode control
Digital input
Standby mode control
Pull-up
resistor
R
P-ch
P-ch
Digital output
N-ch
Digital output
X0A
Pull-up resistor control
June 10, 2015, MB9A140NB_DS706-00040-4v0-E
CONFIDENTIAL
41
D a t a S h e e t
Type
Circuit
Remarks
E
P-ch
P-ch
N-ch
CMOS level output
CMOS level hysteresis input
With pull-up resistor control
With standby mode control
Pull-up resistor
: Approximately 33 kΩ
IOH= -4 mA, IOL= 4 mA
When this pin is used as an
I2C pin, the digital output
P-ch transistor is always off
Digital output
Digital output
R
Pull-up resistor control
Digital input
Standby mode control
F
P-ch
P-ch
N-ch
R
CMOS level output
CMOS level hysteresis input
With input control
Analog input
With pull-up resistor control
With standby mode control
Pull-up resistor
: Approximately 33 kΩ
IOH= -4 mA, IOL= 4 mA
When this pin is used as an
I2C pin, the digital output
P-ch transistor is always off
Digital output
Digital output
Pull-up resistor control
Digital input
Standby mode control
Analog input
Input control
G
CMOS level hysteresis input
Mode input
42
CONFIDENTIAL
MB9A140NB_DS706-00040-4v0-E, June 10, 2015
D a t a S h e e t
Type
Circuit
Remarks
CMOS level output
CMOS level hysteresis input
With standby mode control
IOH = -12.0 mA, IOL = 10.5 mA
H
P-ch
N-ch
Digital output
Digital output
R
Digital input
Standby mode control
I
P-ch
P-ch
N-ch
Digital output
Digital output
R
CMOS level output
CMOS level hysteresis input
5 V tolerant
With pull-up resistor control
With standby mode control
Pull-up resistor
: Approximately 33 kΩ
IOH= -4 mA, IOL= 4 mA
Available to control PZR
registers.
When this pin is used as an
I2C pin, the digital output
P-ch transistor is always off
Pull-up resistor control
Digital input
Standby mode control
June 10, 2015, MB9A140NB_DS706-00040-4v0-E
CONFIDENTIAL
43
D a t a S h e e t
Handling Precautions
Any semiconductor devices have inherently a certain rate of failure. The possibility of failure is greatly
affected by the conditions in which they are used (circuit conditions, environmental conditions, etc.). This
page describes precautions that must be observed to minimize the chance of failure and to obtain higher
reliability from your Spansion semiconductor devices.
1. Precautions for Product Design
This section describes precautions when designing electronic equipment using semiconductor devices.
Absolute Maximum Ratings
Semiconductor devices can be permanently damaged by application of stress (voltage, current, temperature,
etc.) in excess of certain established limits, called absolute maximum ratings. Do not exceed these ratings.
Recommended Operating Conditions
Recommended operating conditions are normal operating ranges for the semiconductor device. All the
device's electrical characteristics are warranted when operated within these ranges.
Always use semiconductor devices within the recommended operating conditions. Operation outside these
ranges may adversely affect reliability and could result in device failure.
No warranty is made with respect to uses, operating conditions, or combinations not represented on the data
sheet. Users considering application outside the listed conditions are advised to contact their sales
representative beforehand.
Processing and Protection of Pins
These precautions must be followed when handling the pins which connect semiconductor devices to power
supply and input/output functions.
(1) Preventing Over-Voltage and Over-Current Conditions
Exposure to voltage or current levels in excess of maximum ratings at any pin is likely to cause
deterioration within the device, and in extreme cases leads to permanent damage of the device. Try to
prevent such overvoltage or over-current conditions at the design stage.
(2) Protection of Output Pins
Shorting of output pins to supply pins or other output pins, or connection to large capacitance can
cause large current flows. Such conditions if present for extended periods of time can damage the
device.
Therefore, avoid this type of connection.
(3) Handling of Unused Input Pins
Unconnected input pins with very high impedance levels can adversely affect stability of operation.
Such pins should be connected through an appropriate resistance to a power supply pin or ground pin.
Latch-up
Semiconductor devices are constructed by the formation of P-type and N-type areas on a substrate. When
subjected to abnormally high voltages, internal parasitic PNPN junctions (called thyristor structures) may
be formed, causing large current levels in excess of several hundred mA to flow continuously at the power
supply pin. This condition is called latch-up.
CAUTION: The occurrence of latch-up not only causes loss of reliability in the semiconductor device, but
can cause injury or damage from high heat, smoke or flame. To prevent this from happening, do the
following:
(1) Be sure that voltages applied to pins do not exceed the absolute maximum ratings. This should
include attention to abnormal noise, surge levels, etc.
(2) Be sure that abnormal current flows do not occur during the power-on sequence.
Code: DS00-00004-3E
44
CONFIDENTIAL
MB9A140NB_DS706-00040-4v0-E, June 10, 2015
D a t a S h e e t
Observance of Safety Regulations and Standards
Most countries in the world have established standards and regulations regarding safety, protection from
electromagnetic interference, etc. Customers are requested to observe applicable regulations and standards
in the design of products.
Fail-Safe Design
Any semiconductor devices have inherently a certain rate of failure. You must protect against injury,
damage or loss from such failures by incorporating safety design measures into your facility and equipment
such as redundancy, fire protection, and prevention of over-current levels and other abnormal operating
conditions.
Precautions Related to Usage of Devices
Spansion semiconductor devices are intended for use in standard applications (computers, office automation
and other office equipment, industrial, communications, and measurement equipment, personal or
household devices, etc.).
CAUTION: Customers considering the use of our products in special applications where failure or
abnormal operation may directly affect human lives or cause physical injury or property damage, or where
extremely high levels of reliability are demanded (such as aerospace systems, atomic energy controls, sea
floor repeaters, vehicle operating controls, medical devices for life support, etc.) are requested to consult
with sales representatives before such use. The company will not be responsible for damages arising from
such use without prior approval.
2. Precautions for Package Mounting
Package mounting may be either lead insertion type or surface mount type. In either case, for heat resistance
during soldering, you should only mount under Spansion's recommended conditions. For detailed
information about mount conditions, contact your sales representative.
Lead Insertion Type
Mounting of lead insertion type packages onto printed circuit boards may be done by two methods: direct
soldering on the board, or mounting by using a socket.
Direct mounting onto boards normally involves processes for inserting leads into through-holes on the
board and using the flow soldering (wave soldering) method of applying liquid solder. In this case, the
soldering process usually causes leads to be subjected to thermal stress in excess of the absolute ratings for
storage temperature. Mounting processes should conform to Spansion recommended mounting conditions.
If socket mounting is used, differences in surface treatment of the socket contacts and IC lead surfaces can
lead to contact deterioration after long periods. For this reason it is recommended that the surface treatment
of socket contacts and IC leads be verified before mounting.
Surface Mount Type
Surface mount packaging has longer and thinner leads than lead-insertion packaging, and therefore leads are
more easily deformed or bent. The use of packages with higher pin counts and narrower pin pitch results in
increased susceptibility to open connections caused by deformed pins, or shorting due to solder bridges.
You must use appropriate mounting techniques. Spansion Inc. recommends the solder reflow method, and
has established a ranking of mounting conditions for each product. Users are advised to mount packages in
accordance with Spansion ranking of recommended conditions.
June 10, 2015, MB9A140NB_DS706-00040-4v0-E
CONFIDENTIAL
45
D a t a S h e e t
Lead-Free Packaging
CAUTION: When ball grid array (BGA) packages with Sn-Ag-Cu balls are mounted using Sn-Pb eutectic
soldering, junction strength may be reduced under some conditions of use.
Storage of Semiconductor Devices
Because plastic chip packages are formed from plastic resins, exposure to natural environmental conditions
will cause absorption of moisture. During mounting, the application of heat to a package that has absorbed
moisture can cause surfaces to peel, reducing moisture resistance and causing packages to crack. To prevent,
do the following:
(1) Avoid exposure to rapid temperature changes, which cause moisture to condense inside the product.
Store products in locations where temperature changes are slight.
(2) Use dry boxes for product storage. Products should be stored below 70% relative humidity, and at
temperatures between 5°C and 30°C.
When you open Dry Package that recommends humidity 40% to 70% relative humidity.
(3) When necessary, Spansion Inc. packages semiconductor devices in highly moisture-resistant
aluminum laminate bags, with a silica gel desiccant. Devices should be sealed in their aluminum
laminate bags for storage.
(4) Avoid storing packages where they are exposed to corrosive gases or high levels of dust.
Baking
Packages that have absorbed moisture may be de-moisturized by baking (heat drying). Follow the Spansion
recommended conditions for baking.
Condition: 125°C/24 h
Static Electricity
Because semiconductor devices are particularly susceptible to damage by static electricity, you must take
the following precautions:
(1) Maintain relative humidity in the working environment between 40% and 70%. Use of an apparatus
for ion generation may be needed to remove electricity.
(2) Electrically ground all conveyors, solder vessels, soldering irons and peripheral equipment.
(3) Eliminate static body electricity by the use of rings or bracelets connected to ground through high
resistance (on the level of 1 MΩ).
Wearing of conductive clothing and shoes, use of conductive floor mats and other measures to
minimize shock loads is recommended.
(4) Ground all fixtures and instruments, or protect with anti-static measures.
(5) Avoid the use of styrofoam or other highly static-prone materials for storage of completed board
assemblies.
46
CONFIDENTIAL
MB9A140NB_DS706-00040-4v0-E, June 10, 2015
D a t a S h e e t
3. Precautions for Use Environment
Reliability of semiconductor devices depends on ambient temperature and other conditions as described
above.
For reliable performance, do the following:
(1) Humidity
Prolonged use in high humidity can lead to leakage in devices as well as printed circuit boards. If high
humidity levels are anticipated, consider anti-humidity processing.
(2) Discharge of Static Electricity
When high-voltage charges exist close to semiconductor devices, discharges can cause abnormal
operation. In such cases, use anti-static measures or processing to prevent discharges.
(3) Corrosive Gases, Dust, or Oil
Exposure to corrosive gases or contact with dust or oil may lead to chemical reactions that will
adversely affect the device. If you use devices in such conditions, consider ways to prevent such
exposure or to protect the devices.
(4) Radiation, Including Cosmic Radiation
Most devices are not designed for environments involving exposure to radiation or cosmic radiation.
Users should provide shielding as appropriate.
(5) Smoke, Flame
CAUTION: Plastic molded devices are flammable, and therefore should not be used near combustible
substances. If devices begin to smoke or burn, there is danger of the release of toxic gases.
Customers considering the use of Spansion products in other special environmental conditions should
consult with sales representatives.
Please check the latest handling precautions at the following URL.
http://www.spansion.com/fjdocuments/fj/datasheet/e-ds/DS00-00004.pdf
June 10, 2015, MB9A140NB_DS706-00040-4v0-E
CONFIDENTIAL
47
D a t a S h e e t
Handling Devices
Power supply pins
In products with multiple VCC and VSS pins, respective pins at the same potential are interconnected
within the device in order to prevent malfunctions such as latch-up. However, all of these pins should be
connected externally to the power supply or ground lines in order to reduce electromagnetic emission levels,
to prevent abnormal operation of strobe signals caused by the rise in the ground level, and to conform to the
total output current rating.
Moreover, connect the current supply source with each Power supply pin and GND pin of this device at low
impedance. It is also advisable that a ceramic capacitor of approximately 0.1 µF be connected as a bypass
capacitor between each Power supply pin and GND pin, between AVCC pin and AVSS pin near this device.
Stabilizing supply voltage
A malfunction may occur when the power supply voltage fluctuates rapidly even though the fluctuation is
within the recommended operating conditions of the VCC power supply voltage. As a rule, with voltage
stabilization, suppress the voltage fluctuation so that the fluctuation in VCC ripple (peak-to-peak value) at
the commercial frequency (50 Hz/60 Hz) does not exceed 10% of the VCC value in the recommended
operating conditions, and the transient fluctuation rate does not exceed 0.1 V/μs when there is a momentary
fluctuation on switching the power supply..
Crystal oscillator circuit
Noise near the X0/X1 and X0A/X1A pins may cause the device to malfunction. Design the printed circuit
board so that X0/X1, X0A/X1A pins, the crystal oscillator, and the bypass capacitor to ground are located as
close to the device as possible.
It is strongly recommended that the PC board artwork be designed such that the X0/X1 and X0A/X1A pins
are surrounded by ground plane as this is expected to produce stable operation.
Evaluate oscillation of your using crystal oscillator by your mount board.
Sub crystal oscillator
This series sub oscillator circuit is low gain to keep the low current consumption.
The crystal oscillator to fill the following conditions is recommended for sub crystal oscillator to stabilize
the oscillation.
・Surface mount type
Size:
More than 3.2 mm × 1.5 mm
Load capacitance: Approximately 6 pF to 7 pF
・Lead type
Load capacitance: Approximately 6 pF to 7 pF
48
CONFIDENTIAL
MB9A140NB_DS706-00040-4v0-E, June 10, 2015
D a t a S h e e t
Using an external clock
When using an external clock as an input of the main clock, set X0/X1 to the external clock input, and input
the clock to X0. X1(PE3) can be used as a general-purpose I/O port.
Similarly, when using an external clock as an input of the sub clock, set X0A/X1A to the external clock
input, and input the clock to X0A. X1A (P47) can be used as a general-purpose I/O port.
•
Example of Using an External Clock
Device
X0(X0A)
Can be used as
general-purpose
I/O ports.
Set as
External clock
input
X1(PE3),
X1A (P47)
2
Handling when using Multi-function serial pin as I C pin
If it is using the multi-function serial pin as I2C pins, P-ch transistor of digital output is always disabled.
However, I2C pins need to keep the electrical characteristic like other pins and not to connect to the external
I2C bus system with power OFF.
C Pin
This series contains the regulator. Be sure to connect a smoothing capacitor (C S) for the regulator between
the C pin and the GND pin. Please use a ceramic capacitor or a capacitor of equivalent frequency
characteristics as a smoothing capacitor.
However, some laminated ceramic capacitors have the characteristics of capacitance variation due to
thermal fluctuation (F characteristics and Y5V characteristics). Please select the capacitor that meets the
specifications in the operating conditions to use by evaluating the temperature characteristics of a
capacitor.A smoothing capacitor of about 4.7μF would be recommended for this series.
C
Device
CS
VSS
GND
Mode pins (MD0)
Connect the MD pin (MD0) directly to VCC or VSS pins. Design the printed circuit board such that the
pull-up/down resistor stays low, as well as the distance between the mode pins and VCC pins or VSS pins is
as short as possible and the connection impedance is low, when the pins are pulled-up/down such as for
switching the pin level and rewriting the Flash memory data. It is because of preventing the device
erroneously switching to test mode due to noise.
June 10, 2015, MB9A140NB_DS706-00040-4v0-E
CONFIDENTIAL
49
D a t a S h e e t
Notes on power-on
Turn power on/off in the following order or at the same time.
If not using the A/D converter, connect AVCC = VCC and AVSS = VSS.
Turning on : VCC →AVCC → AVRH
Turning off : AVRH → AVCC → VCC
Serial Communication
There is a possibility to receive wrong data due to the noise or other causes on the serial communication.
Therefore, design a printed circuit board so as to avoid noise.
Consider the case of receiving wrong data due to noise, perform error detection such as by applying a
checksum of data at the end. If an error is detected, retransmit the data.
Differences in features among the products with different memory sizes and between Flash
memory products and MASK products
The electric characteristics including power consumption, ESD, latch-up, noise characteristics, and
oscillation characteristics among the products with different memory sizes and between Flash memory
products and MASK products are different because chip layout and memory structures are different.
If you are switching to use a different product of the same series, please make sure to evaluate the electric
characteristics.
Pull-Up function of 5 V tolerant I/O
Please do not input the signal more than VCC voltage at the time of Pull-Up function use of 5 V tolerant
I/O.
50
CONFIDENTIAL
MB9A140NB_DS706-00040-4v0-E, June 10, 2015
D a t a S h e e t
Block Diagram
TRSTX,TCK,
TDI,TMS
TDO
TRACEDx,
TRACECLK
ETM*1
SWJ-DP
TPIU*
SRAM0
8/16 Kbyte
ROM
Table
1
Multi-layer AHB (Max 40 MHz)
Cortex-M3 Core I
@40 MHz(Max)
D
NVIC
Sys
AHB-APB Bridge:
APB0(Max 40 MHz)
Dual-Timer
WatchDog Timer
(Software)
Clock Reset
Generator
INITX
WatchDog Timer
(Hardware)
SRAM1
8/16 Kbyte
Flash I/F
Security
On-Chip Flash
64+32 Kbyte/
128+32 Kbyte/
256+32 Kbyte
DMAC
8ch.
CSV
X0
X1
X0A
X1A
CROUT
Main
Osc
Sub
Osc
PLL
CR
4 MHz
AHB-AHB
Bridge
CLK
Source Clock
CR
100 kHz
MADx
External Bus I/F*2
ADTGx
TIOAx
TIOBx
Unit 0
Unit 1
Base Timer
16-bit 8ch./
32-bit 4ch.
Power-On
Reset
LVD Ctrl
RTCCO,
SUBOUT
WKUPx
C
CRC
Accelerator
Watch Counter
External Interrupt
Controller
16-pin + NMI
INTx
NMIX
MODE-Ctrl
MD0,
MD1
P0x,
P1x,
HDMI-CEC/
Remote Reciver Control
Real-Time Clock
LVD
Regulator
GPIO
CEC0,CEC1
MCSXx,
MOEX,
MWEX,
MALE,
MRDY,
MCLKOUT,
MDQMx
IRQ-Monitor
AHB-APB Bridge : APB2 (Max 40 MHz)
ANxx
MADATAx
12-bit A/D Converter
AHB-APB Bridge : APB1 (Max 40 MHz)
AVCC,
AVSS,
AVRH
PIN-Function-Ctrl
.
.
.
PEx
Multi-Function Serial I/F
8ch.
(with FIFO ch.4 to ch.7)
HW flow control(ch.4)*2
Deep Standby Ctrl
SCKx
SINx
SOTx
CTS4
RTS4
*1: For the MB9AF141LB/MB, MB9AF142LB/MB, and MB9AF144LB/MB, ETM is not available.
*2: For the MB9AF141LB, MB9AF142LB and MB9AF144LB, the External Bus Interface is not available. And
the Multi-function Serial Interface does not support hardware flow control in these products.
Memory Size
See Memory size in Product Lineup to confirm the memory size.
June 10, 2015, MB9A140NB_DS706-00040-4v0-E
CONFIDENTIAL
51
D a t a S h e e t
Memory Map
Memory Map (1)
Peripherals Area
0x41FF_FFFF
Reserved
0xFFFF_FFFF
Reserved
0xE010_0000
0xE000_0000
Cortex-M3 Private
Peripherals
0x4006_1000
0x4006_0000
0x4005_0000
0x4004_0000
0x4003_F000
Reserved
0x4003_C000
0x4003_B000
0x4003_A000
0x7000_0000
0x6000_0000
External Device
Area
Reserved
0x4003_9000
0x4003_8000
0x4003_7000
0x4003_6000
0x4003_5000
0x4400_0000
0x4200_0000
0x4000_0000
32Mbytes
Bit band alias
Peripherals
Reserved
0x2400_0000
0x2200_0000
0x1FFF_0000
0x0020_8000
0x0020_0000
See the next page
"Memory Map (2)"
for the memory size
details.
0x0010_4000
0x0010_0000
0x4003_3000
0x4003_2000
0x4003_1000
0x4003_0000
0x4002_F000
0x4002_E000
32Mbytes
Bit band alias
Reserved
0x2008_0000
0x2000_0000
0x4003_4000
0x4002_8000
EXT-bus I/F
Reserved
RTC
Watch Counter
CRC
MFS
Reserved
LVD/DS mode
HDMI-CEC/
Remote Control Receiver
GPIO
Reserved
Int-Req.Read
EXTI
Reserved
CR Trim
Reserved
A/DC
0x4002_6000
Reserved
0x4002_5000
Base Timer
Reserved
0x4001_6000
0x4001_5000
0x0000_0000
0x4001_3000
0x4001_2000
0x4001_1000
0x4001_0000
0x4000_1000
0x4000_0000
CONFIDENTIAL
Reserved
0x4002_7000
SRAM1
SRAM0
Reserved
Flash(Work area)
Reserved
Security/CR Trim
Flash(Main area)
52
DMAC
Dual Timer
Reserved
SW WDT
HW WDT
Clock/Reset
Reserved
Flash I/F
MB9A140NB_DS706-00040-4v0-E, June 10, 2015
D a t a S h e e t
Memory Map (2)
MB9AF144LB/MB/NB
MB9AF142LB/MB/NB
0x2008_0000
MB9AF141LB/MB/NB
0x2008_0000
Reserved
0x2008_0000
Reserved
Reserved
0x2000_4000
0x2000_2000
SRAM1
16Kbytes
0x2000_0000
0x2000_0000
SRAM0
16Kbytes
0x1FFF_E000
0x2000_2000
SRAM1
8Kbytes
SRAM0
8Kbytes
0x2000_0000
0x1FFF_E000
SRAM1
8Kbytes
SRAM0
8Kbytes
0x1FFF_C000
SA4-7 (8 KBx4)
Reserved
0x0010_4000
0x0010_2000
0x0010_0000
0x0020_0000
SA4-7 (8 KBx4)
Reserved
0x0010_4000
CR trimming
Security
0x0010_2000
0x0010_0000
0x0020_8000
0x0020_0000
SA4-7 (8 KBx4)
Reserved
Flash(Work area)
32 Kbytes
0x0020_0000
0x0020_8000
Reserved
Flash(Work area)
32 Kbytes
0x0020_8000
Reserved
Flash(Work area)
32 Kbytes
Reserved
0x0010_4000
CR trimming
Security
0x0010_2000
0x0010_0000
CR trimming
Security
Reserved
Reserved
Reserved
0x0000_0000
SA2-3 (8 KBx2)
SA9 (64 KB)
SA8 (48 KB)
0x0000_0000
SA2-3 (8 KBx2)
0x0001_0000
SA8 (48 KB)
0x0000_0000
Flash(Main area)
64 Kbytes
SA8 (48 KB)
0x0002_0000
Flash(Main area)
128 Kbytes
SA9-11 (64 KBx3)
Flash(Main area)
256 Kbytes
0x0004_0000
SA2-3 (8 KBx2)
Refer to the programming manual for the detail of Flash main area.
・MB9AB40N/A40N/340N/140N/150R,MB9B520M/320M/120M Series Flash Programming Manual
June 10, 2015, MB9A140NB_DS706-00040-4v0-E
CONFIDENTIAL
53
D a t a S h e e t
Peripheral Address Map
Start address
End address
Bus
0x4000_0000
0x4000_0FFF
0x4000_1000
0x4000_FFFF
0x4001_0000
0x4001_0FFF
Clock/Reset Control
0x4001_1000
0x4001_1FFF
Hardware Watchdog timer
0x4001_2000
0x4001_2FFF
0x4001_3000
0x4001_4FFF
AHB
APB0
Peripherals
Flash memory I/F register
Reserved
Software Watchdog timer
Reserved
0x4001_5000
0x4001_5FFF
Dual Timer
0x4001_6000
0x4001_FFFF
Reserved
0x4002_0000
0x4002_4FFF
Reserved
0x4002_5000
0x4002_5FFF
Base Timer
0x4002_6000
0x4002_6FFF
Reserved
0x4002_7000
0x4002_7FFF
APB1
A/D Converter
0x4002_8000
0x4002_DFFF
Reserved
0x4002_E000
0x4002_EFFF
Built-in CR trimming
0x4002_F000
0x4002_FFFF
Reserved
0x4003_0000
0x4003_0FFF
External Interrupt
0x4003_1000
0x4003_1FFF
Interrupt Source Check Register
0x4003_2000
0x4003_2FFF
Reserved
0x4003_3000
0x4003_3FFF
GPIO
0x4003_4000
0x4003_4FFF
HDMI-CEC/Remote control Receiver
0x4003_5000
0x4003_57FF
Low-Voltage Detector
0x4003_5800
0x4003_5FFF
0x4003_6000
0x4003_7FFF
0x4003_8000
0x4003_8FFF
Multi-function serial
APB2
Deep standby mode Controller
Reserved
0x4003_9000
0x4003_9FFF
CRC
0x4003_A000
0x4003_AFFF
Watch Counter
0x4003_B000
0x4003_BFFF
Real-time clock
0x4003_C000
0x4003_EFFF
Reserved
0x4003_F000
0x4003_FFFF
External bus interface
0x4004_0000
0x4005_FFFF
0x4006_0000
0x4006_0FFF
0x4006_1000
0x41FF_FFFF
54
CONFIDENTIAL
Reserved
AHB
DMAC register
Reserved
MB9A140NB_DS706-00040-4v0-E, June 10, 2015
D a t a S h e e t
Pin Status in Each CPU State
The terms used for pin status have the following meanings.
INITX=0
This is the period when the INITX pin is the L level.
INITX=1
This is the period when the INITX pin is the H level.
SPL=0
This is the status that the standby pin level setting bit (SPL) in the standby mode control register
(STB_CTL) is set to 0.
SPL=1
This is the status that the standby pin level setting bit (SPL) in the standby mode control register
(STB_CTL) is set to 1.
Input enabled
Indicates that the input function can be used.
Internal input fixed at 0
This is the status that the input function cannot be used. Internal input is fixed at L.
Hi-Z
Indicates that the pin drive transistor is disabled and the pin is put in the Hi-Z state.
Setting disabled
Indicates that the setting is disabled.
Maintain previous state
Maintains the state that was immediately prior to entering the current mode.
If a built-in peripheral function is operating, the output follows the peripheral function.
If the pin is being used as a port, that output is maintained.
Analog input is enabled
Indicates that the analog input is enabled.
Trace output
Indicates that the trace function can be used.
GPIO selected
In Deep standby mode, pins switch to the general-purpose I/O port.
June 10, 2015, MB9A140NB_DS706-00040-4v0-E
CONFIDENTIAL
55
D a t a S h e e t
Pin status type
List of Pin Status
A
Function
group
Power-on
reset or
Device Run mode
INITX
low-voltage
internal
or Sleep
input state
detection
reset state mode state
state
Power
supply
unstable
-
Power
supply
stable
INITX = 0 INITX = 1 INITX = 1
Power supply stable
Timer mode,
RTC mode, or
Stop mode state
Deep standby RTC
mode or Deep standby
Stop mode state
Power supply stable
Power supply stable
INITX = 1
SPL = 0
SPL = 1
INITX = 1
SPL = 0
SPL = 1
Maintain
previous
state
GPIO
Hi-Z /
Hi-Z /
selected
Internal
Internal
Internal
input fixed
input fixed
input fixed
at 0
at 0
at 0
Return from
Deep
standby
mode state
Power
supply
stable
INITX = 1
-
GPIO
selected
Setting
disabled
Setting
disabled
Setting
disabled
Maintain
previous
state
Main crystal
oscillator input
pin/
External main
clock input
selected
Input
enabled
Input
enabled
Input
enabled
Input
enabled
Input
enabled
Maintain
previous
state
GPIO
Hi-Z /
Hi-Z /
selected
Internal
Internal
Internal
input fixed
input fixed
input fixed
at "0"
at 0
at 0
GPIO
selected
Maintain
previous
state
Hi-Z /
Internal
input fixed
at 0
Maintain
previous
state
Input
enabled
Input
enabled
Input
enabled
GPIO
selected
Input
enabled
GPIO
selected
Setting
disabled
Setting
disabled
Setting
disabled
Maintain
previous
state
External main
clock input
selected
Setting
disabled
Setting
disabled
Setting
disabled
Maintain
previous
state
Main crystal
oscillator output
pin
Hi-Z /
Internal
input
fixed at
0/
or Input
enabled
C
INITX
input pin
Pull-up /
Input
enabled
Pull-up /
Input
enabled
Pull-up /
Input
enabled
Pull-up /
Input
enabled
Pull-up /
Input
enabled
Pull-up /
Input
enabled
Pull-up /
Input
enabled
Pull-up /
Input
enabled
Pull-up /
Input
enabled
D
Mode
input pin
Input
enabled
Input
enabled
Input
enabled
Input
enabled
Input
enabled
Input
enabled
Input
enabled
Input
enabled
Input
enabled
Mode
input pin
Input
enabled
Input
enabled
Input
enabled
Input
enabled
Input
enabled
Input
enabled
Input
enabled
Input
enabled
Input
enabled
GPIO
selected
Setting
disabled
Setting
disabled
Setting
disabled
Maintain
previous
state
Maintain
previous
state
Hi-Z /
Input
enabled
GPIO
selected
Hi-Z /
Input
enabled
GPIO
selected
B
CONFIDENTIAL
Hi-Z /
Internal
input fixed
at 0
Maintain
Maintain
Maintain
Maintain
Maintain
Maintain
previous
previous
previous
previous
previous
previous
state/When state/When state/When state/When state/When state/When
Hi-Z /
Hi-Z /
oscillation oscillation oscillation oscillation oscillation oscillation
Internal
Internal
stops*1,
stops*1,
stops*1,
stops*1,
stops*1,
stops*1,
input fixed input fixed
Hi-Z /
Hi-Z /
Hi-Z /
Hi-Z /
Hi-Z /
Hi-Z /
at 0
at 0
Internal
Internal
Internal
Internal
Internal
Internal
input fixed input fixed input fixed input fixed input fixed input fixed
at 0
at 0
at 0
at 0
at 0
at 0
E
56
Maintain
previous
state
MB9A140NB_DS706-00040-4v0-E, June 10, 2015
Pin status type
D a t a S h e e t
Function
group
Power-on
reset or
Device Run mode
INITX
low-voltage
internal
or Sleep
input state
detection
reset state mode state
state
Power
supply
unstable
-
Power
supply
stable
INITX = 0 INITX = 1 INITX = 1
Power supply stable
Timer mode,
RTC mode, or
Stop mode state
Deep standby RTC
mode or Deep standby
Stop mode state
Power supply stable
Power supply stable
INITX = 1
SPL = 0
SPL = 1
INITX = 1
SPL = 0
SPL = 1
Maintain
previous
state
GPIO
Hi-Z /
Hi-Z /
selected
Internal
Internal
Internal
input fixed
input fixed
input fixed
at 0
at 0
at 0
Return from
Deep
standby
mode state
Power
supply
stable
INITX = 1
-
GPIO
selected
Setting
disabled
Setting
disabled
Setting
disabled
Maintain
previous
state
Sub crystal
oscillator input
pin /
External sub
clock input
selected
Input
enabled
Input
enabled
Input
enabled
Input
enabled
Input
enabled
Maintain
previous
state
GPIO
Hi-Z /
Hi-Z /
selected
Internal
Internal
Internal
input fixed
input fixed
input fixed
at 0
at 0
at 0
GPIO
selected
Maintain
previous
state
Hi-Z /
Internal
input fixed
at 0
Maintain
previous
state
GPIO
selected
F
GPIO
selected
Setting
disabled
Setting
disabled
Setting
disabled
Maintain
previous
state
External sub
clock input
selected
Setting
disabled
Setting
disabled
Setting
disabled
Maintain
previous
state
Sub crystal
oscillator output
pin
Hi-Z /
Internal
input
fixed at
0/
or Input
enable
G
H
GPIO
selected
Hi-Z
Hi-Z /
Hi-Z /
Internal
Internal
input fixed input fixed
at 0
at 0
Hi-Z /
Input
enabled
June 10, 2015, MB9A140NB_DS706-00040-4v0-E
CONFIDENTIAL
Hi-Z /
Input
enabled
Maintain
previous
state
Maintain
previous
state
Input
enabled
Input
enabled
Maintain
previous
state
Input
enabled
Hi-Z/
Internal
input fixed
at 0
Input
enabled
Maintain
Maintain
Maintain
Maintain
Maintain
previous
previous
previous
previous
previous
state/When state/When state/When state/When state/When
oscillation oscillation oscillation oscillation oscillation
stops*2,
stops*2,
stops*2,
stops*2,
stops*2,
Hi-Z /
Hi-Z /
Hi-Z/
Hi-Z/
Hi-Z/
Internal
Internal
Internal
Internal
Internal
input fixed input fixed input fixed input fixed input fixed
at 0
at 0
at 0
at 0
at 0
Maintain
previous
state
GPIO
Hi-Z /
Hi-Z /
selected
Internal
Internal
Internal
input fixed
input fixed
input fixed
at 0
at 0
at 0
GPIO
selected
57
Pin status type
D a t a S h e e t
Function
group
Power
supply
unstable
NMIX selected
I
Power-on
reset or
Device Run mode
INITX
low-voltage
internal
or Sleep
input state
detection
reset state mode state
state
Resource other
than above
selected
Setting
disabled
Setting
disabled
Hi-Z
Hi-Z /
Input
enabled
Hi-Z
Pull-up /
Input
enabled
Pull-up /
Input
enabled
J
GPIO
selected
Setting
disabled
Setting
disabled
Setting
disabled
Hi-Z
Hi-Z /
Input
enabled
Hi-Z /
Input
enabled
Setting
disabled
Setting
disabled
Setting
disabled
Resource selected
K
GPIO
selected
External interrupt
enabled selected
L
Resource other
than above
selected
Hi-Z
GPIO
selected
Analog input
selected
Hi-Z
M
Resource other
than above
selected
GPIO
selected
58
CONFIDENTIAL
Setting
disabled
Hi-Z /
Input
enabled
Deep standby RTC
mode or Deep standby
Stop mode state
Power supply stable
Power supply stable
INITX = 1
SPL = 0
SPL = 1
INITX = 1
SPL = 0
SPL = 1
Setting
disabled
Hi-Z /
Input
enabled
GPIO
selected
JTAG
selected
Power
supply
stable
INITX = 0 INITX = 1 INITX = 1
Power supply stable
Timer mode,
RTC mode, or
Stop mode state
Hi-Z /
Input
enabled
Maintain
previous
state
Maintain
previous
state
Maintain
previous
state
Maintain
previous
state
Maintain
previous
state
Maintain
previous
state
Maintain
previous
state
Hi-Z /
Internal
input fixed
at 0
Maintain
previous
state
Setting
disabled
Power
supply
stable
INITX = 1
-
WKUP
input
enabled
Hi-Z /
WKUP
input
enabled
GPIO
selected
Maintain
previous
state
Maintain
previous
state
Maintain
previous
state
GPIO
Hi-Z /
Hi-Z /
selected
Internal
Internal
Internal
input fixed
input fixed
input fixed
at 0
at 0
at 0
GPIO
selected
GPIO
Hi-Z /
Hi-Z /
selected
Internal
Internal
Internal
input fixed
input fixed
input fixed
at 0
at 0
at 0
GPIO
selected
Maintain
previous
state
Maintain
previous
state
Maintain
previous
state
GPIO
Hi-Z /
selected
Internal
Internal
Hi-Z /
input fixed
Internal input fixed
at 0
at 0
input fixed
at 0
Hi-Z /
Hi-Z /
Hi-Z /
Hi-Z /
Hi-Z /
Hi-Z /
Hi-Z /
Internal
Internal
Internal
Internal
Internal
Internal
Internal
input fixed input fixed input fixed input fixed input fixed input fixed input fixed
at 0 /
at 0 /
at 0 /
at 0 /
at 0 /
at 0 /
at 0 /
Analog
Analog
Analog
Analog
Analog
Analog
Analog
input
input
input
input
input
input
input
enabled
enabled
enabled
enabled
enabled
enabled
enabled
Setting
disabled
Return from
Deep
standby
mode state
Maintain
previous
state
Maintain
previous
state
GPIO
Hi-Z /
Hi-Z /
selected
Internal
Internal
Internal
input fixed
input fixed
input fixed
at 0
at 0
at 0
GPIO
selected
Hi-Z /
Internal
input fixed
at 0 /
Analog
input
enabled
GPIO
selected
MB9A140NB_DS706-00040-4v0-E, June 10, 2015
Pin status type
D a t a S h e e t
Function
group
Power
supply
unstable
-
Analog input
selected
N
Power-on
reset or
Device Run mode
INITX
low-voltage
internal
or Sleep
input state
detection
reset state mode state
state
Hi-Z
Power
supply
stable
INITX = 0 INITX = 1 INITX = 1
Power supply stable
Timer mode,
RTC mode, or
Stop mode state
Deep standby RTC
mode or Deep standby
Stop mode state
Power supply stable
Power supply stable
INITX = 1
SPL = 0
SPL = 1
INITX = 1
SPL = 0
SPL = 1
Hi-Z /
Hi-Z /
Hi-Z /
Hi-Z /
Hi-Z /
Hi-Z /
Hi-Z /
Internal
Internal
Internal
Internal
Internal
Internal
Internal
input fixed input fixed input fixed input fixed input fixed input fixed input fixed
at 0 /
at 0 /
at 0 /
at 0 /
at 0 /
at 0 /
at 0 /
Analog
Analog
Analog
Analog
Analog
Analog
Analog
input
input
input
input
input
input
input
enabled
enabled
enabled
enabled
enabled
enabled
enabled
Maintain
previous
state
External interrupt
enabled selected
Resource other
than above
selected
Setting
disabled
Setting
disabled
Setting
disabled
Setting
disabled
Setting
disabled
Setting
disabled
Maintain
previous
state
Maintain
previous
state
GPIO
selected
Trace selected
O
Resource other
than above
selected
Hi-Z
GPIO
selected
Analog input
selected
Hi-Z
Hi-Z /
Input
enabled
Hi-Z /
Input
enabled
Maintain
previous
state
Maintain
previous
state
Hi-Z /
Internal
input fixed
at 0 /
Analog
input
enabled
GPIO
Hi-Z /
selected
Internal
Internal
input fixed
input fixed
at 0
at 0
GPIO
selected
GPIO
Hi-Z /
selected
Internal
Internal
input fixed
input fixed
at 0
at 0
Hi-Z /
Internal
input fixed
at 0
GPIO
selected
Hi-Z /
Hi-Z /
Hi-Z /
Hi-Z /
Hi-Z /
Hi-Z /
Hi-Z /
Internal
Internal
Internal
Internal
Internal
Internal
Internal
input fixed input fixed input fixed input fixed input fixed input fixed input fixed
at 0 /
at 0 /
at 0 /
at 0 /
at 0 /
at 0 /
at 0 /
Analog
Analog
Analog
Analog
Analog
Analog
Analog
input
input
input
input
input
input
input
enabled
enabled
enabled
enabled
enabled
enabled
enabled
Hi-Z /
Internal
input fixed
at 0 /
Analog
input
enabled
Trace
output
Trace selected
Setting
disabled
Setting
disabled
GPIO
selected
June 10, 2015, MB9A140NB_DS706-00040-4v0-E
CONFIDENTIAL
Power
supply
stable
INITX = 1
-
Trace
output
P
Resource other
than above
selected
Hi-Z /
Internal
input fixed
at 0
Return from
Deep
standby
mode state
Setting
disabled
Maintain
previous
state
Maintain
previous
state
GPIO
Hi-Z /
selected
Internal
Hi-Z /
Internal
input fixed
Internal input fixed
at 0
input fixed
at 0
at 0
GPIO
selected
59
Pin status type
D a t a S h e e t
Function
group
Power-on
reset or
Device Run mode
INITX
low-voltage
internal
or Sleep
input state
detection
reset state mode state
state
Power
supply
unstable
-
Analog input
selected
Hi-Z
Power
supply
stable
INITX = 0 INITX = 1 INITX = 1
Power supply stable
Timer mode,
RTC mode, or
Stop mode state
Deep standby RTC
mode or Deep standby
Stop mode state
Power supply stable
Power supply stable
INITX = 1
SPL = 0
SPL = 1
INITX = 1
SPL = 0
SPL = 1
Hi-Z /
Hi-Z /
Hi-Z /
Hi-Z /
Hi-Z /
Hi-Z /
Hi-Z /
Internal
Internal
Internal
Internal
Internal
Internal
Internal
input fixed input fixed input fixed input fixed input fixed input fixed input fixed
at 0 /
at 0 /
at 0 /
at 0 /
at 0 /
at 0 /
at 0 /
Analog
Analog
Analog
Analog
Analog
Analog
Analog
input
input
input
input
input
input
input
enabled
enabled
enabled
enabled
enabled
enabled
enabled
Q
Resource other
than above
selected
Setting
disabled
Setting
disabled
Setting
disabled
Maintain
previous
state
Maintain
previous
state
Hi-Z
External interrupt
enabled selected
Maintain
previous
state
Setting
disabled
Setting
disabled
Setting
disabled
Maintain
previous
state
Maintain
previous
state
Setting
disabled
Setting
disabled
Setting
disabled
Maintain
previous
state
Maintain
previous
state
Hi-Z
Hi-Z /
Input
enabled
Hi-Z /
Input
enabled
Maintain
previous
state
Maintain
previous
state
Resource other
than above
selected
GPIO
selected
CEC
enabled
S
Resource other
than above
selected
GPIO
selected
60
CONFIDENTIAL
GPIO
Hi-Z /
selected
Internal
Internal
input fixed
input fixed
at 0
at 0
Hi-Z /
Hi-Z /
Hi-Z /
Hi-Z /
Hi-Z /
Hi-Z /
Hi-Z /
Internal
Internal
Internal
Internal
Internal
Internal
Internal
input fixed input fixed input fixed input fixed input fixed input fixed input fixed
at 0 /
at 0 /
at 0 /
at 0 /
at 0 /
at 0 /
at 0 /
Analog
Analog
Analog
Analog
Analog
Analog
Analog
input
input
input
input
input
input
input
enabled
enabled
enabled
enabled
enabled
enabled
enabled
WKUP
enabled
R
Maintain
previous
state
Hi-Z /
Internal
input fixed
at 0
GPIO
selected
Analog input
selected
Power
supply
stable
INITX = 1
Hi-Z /
Internal
input fixed
at 0 /
Analog
input
enabled
Trace
output
Trace selected
External interrupt
enabled selected
Return from
Deep
standby
mode state
WKUP
input
enabled
Maintain
previous
state
Hi-Z /
Internal
input fixed
at 0 /
Analog
input
enabled
Hi-Z /
WKUP
input
enabled
GPIO
Hi-Z /
selected
Internal
Internal
Hi-Z /
input fixed
Internal input fixed
at 0
at 0
input fixed
at 0
Maintain
previous
state
GPIO
selected
Maintain
previous
state
GPIO
Hi-Z /
Hi-Z /
selected
Internal
Internal
Internal
input fixed
input fixed
input fixed
at 0
at 0
at 0
GPIO
selected
Maintain
previous
state
GPIO
selected
MB9A140NB_DS706-00040-4v0-E, June 10, 2015
Pin status type
D a t a S h e e t
Function
group
Power
supply
unstable
CEC
enabled
WKUP
enabled
T
Power-on
reset or
Device Run mode
INITX
low-voltage
internal
or Sleep
input state
detection
reset state mode state
state
Setting
disabled
Setting
disabled
Power
supply
stable
INITX = 0 INITX = 1 INITX = 1
Power supply stable
Setting
disabled
Setting
disabled
Setting
disabled
GPIO
selected
Hi-Z /
Input
enabled
Power supply stable
Power supply stable
INITX = 1
SPL = 0
SPL = 1
INITX = 1
SPL = 0
SPL = 1
Maintain
previous
state
Maintain
previous
state
Maintain
previous
state
WKUP
input
enabled
Hi-Z /
WKUP
input
enabled
Hi-Z /
Input
enabled
Maintain
previous
state
Maintain
previous
state
Maintain
previous
state
Hi-Z
Deep standby RTC
mode or Deep standby
Stop mode state
Setting
disabled
External interrupt
enabled selected
Resource other
than above
selected
Maintain
previous
state
Timer mode,
RTC mode, or
Stop mode state
Maintain
previous
state
Return from
Deep
standby
mode state
GPIO
Hi-Z /
selected
Internal
Hi-Z /
Internal
Internal input fixed input fixed
at 0
input fixed
at 0
at 0
Power
supply
stable
INITX = 1
Maintain
previous
state
GPIO
selected
*1: Oscillation is stopped at Sub Timer mode, Low-speed CR Timer mode, RTC mode, Stop mode, Deep
Standby RTC mode, and Deep Standby Stop mode.
*2: Oscillation is stopped at Stop mode and Deep Standby Stop mode.
June 10, 2015, MB9A140NB_DS706-00040-4v0-E
CONFIDENTIAL
61
D a t a S h e e t
Electrical Characteristics
1. Absolute Maximum Ratings
Parameter
Power supply voltage*1, *2
Analog power supply voltage*1, *3
Analog reference voltage*1, *3
Symbol
VCC
AVCC
AVRH
Rating
Min
Max
Unit
Remarks
VSS - 0.5
VSS - 0.5
VSS - 0.5
VSS + 4.6
V
VSS + 4.6
V
VSS + 4.6
V
VCC + 0.5
VSS - 0.5
V
(≤ 4.6 V)
Input voltage*1
VI
VSS - 0.5
VSS + 6.5
V
5 V tolerant
AVCC + 0.5
Analog pin input voltage*1
VIA
VSS - 0.5
V
(≤ 4.6 V)
VCC + 0.5
Output voltage*1
VO
VSS - 0.5
V
(≤ 4.6 V)
10
mA
L level maximum output current*4
IOL
39
mA
P80/P81 pins
4
mA
5
L level average output current*
IOLAV
10.5
mA
P80/P81 pins
L level total maximum output current
∑IOL
100
mA
L level total average output current*6
∑IOLAV
50
mA
- 10
mA
H level maximum output current*4
IOH
- 39
mA
P80/P81 pins
-4
mA
5
H level average output current*
IOHAV
- 12
mA
P80/P81 pins
H level total maximum output current
∑IOH
- 100
mA
H level total average output current*6
∑IOHAV
- 50
mA
Power consumption
PD
300
mW
Storage temperature
TSTG
- 55
+ 150
°C
*1: These parameters are based on the condition that V SS = AVSS = 0 V.
*2: VCC must not drop below VSS - 0.5 V.
*3: Ensure that the voltage does not to exceed VCC + 0.5 V, for example, when the power is turned on.
*4: The maximum output current is defined as the value of the peak current flowing through any one of the
corresponding pins.
*5: The average output current is defined as the average current value flowing through any one of the
corresponding pins for a 100 ms period.
*6: The total average output current is defined as the average current value flowing through all of
corresponding pins for a 100 ms.
<WARNING>
Semiconductor devices may be permanently damaged by application of stress (including, without limitation,
voltage, current or temperature) in excess of absolute maximum ratings.
Do not exceed any of these ratings.
62
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D a t a S h e e t
2. Recommended Operating Conditions
(VSS = AVSS = 0.0V)
Parameter
Power supply voltage
Analog power supply voltage
Symbol
VCC
AVCC
Conditions
-
Value
Min
Max
Unit
Remarks
2
1.65*
3.6
V
1.65
3.6
V
AVCC = VCC
2.7
AVCC
V
AVCC ≥ 2.7 V
Analog reference voltage
AVRH
AVCC
AVCC
V
AVCC<2.7 V
Smoothing capacitor
CS
-1
10
µF For Regulator*1
Operating temperature
TA
- 40
+ 85
°C
*1 : See C Pin in Handling Devices for the connection of the smoothing capacitor.
*2 : In between less than the minimum power supply voltage and low voltage reset/interrupt detection voltage
or more, instruction execution and low voltage detection function by built-in High-speed CR(including
Main PLL is used) or built-in Low-speed CR is possible to operate only.
<WARNING>
The recommended operating conditions are required in order to ensure the normal operation of the
semiconductor device. All of the device's electrical characteristics are warranted when the device is
operated under these conditions.
Any use of semiconductor devices will be under their recommended operating condition.
Operation under any conditions other than these conditions may adversely affect reliability of device and
could result in device failure.
No warranty is made with respect to any use, operating conditions or combinations not represented on this
data sheet. If you are considering application under any conditions other than listed herein, please contact
sales representatives beforehand.
June 10, 2015, MB9A140NB_DS706-00040-4v0-E
CONFIDENTIAL
63
D a t a S h e e t
3. DC Characteristics
(1) Current rating
(VCC = AVCC = 1.65V to 3.6V, VSS = AVSS = 0V, TA = - 40°C to + 85°C)
Parameter Symbol
Pin
name
PLL
Rrun mode
ICC
Power
supply
current
VCC
ICCS
Value
Unit Remarks
Typ*3 Max*4
Conditions
High-speed
CR
Rrun mode
Sub
Rrun mode
Low-speed
CR
Run mode
PLL
Sleep mode
High-speed
CR
Sleep mode
Sub
Sleep mode
Low-speed
CR
Sleep mode
CPU: 40 MHz,
Peripheral: 40 MHz
CPU: 40 MHz,
Peripheral: the clock stops
NOP operation
15.5
21
mA
*1, *5
8.7
12
mA
*1, *5
CPU/ Peripheral: 4 MHz*2
1.8
2.9
mA
*1
CPU/ Peripheral: 32 kHz
110
680
μA
*1, *6
CPU/ Peripheral: 100 kHz
125
700
μA
*1
Peripheral: 40 MHz
9
12.5
mA
*1, *5
Peripheral: 4 MHz*2
0.8
1.6
mA
*1
Peripheral: 32 kHz
96
670
μA
*1, *6
Peripheral: 100 kHz
110
680
μA
*1
*1: When all ports are fixed.
*2: When setting it to 4 MHz by trimming.
*3: TA=+25°C, VCC=3.6 V
*4: TA=+85°C, VCC=3.6 V
*5: When using the crystal oscillator of 4 MHz(Including the current consumption of the oscillation circuit)
*6: When using the crystal oscillator of 32 kHz(Including the current consumption of the oscillation circuit)
64
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MB9A140NB_DS706-00040-4v0-E, June 10, 2015
D a t a S h e e t
Parameter Symbol
Pin
name
Conditions
Main Timer
mode
ICCT
Sub Timer
mode
ICCR
RTC mode
ICCH
Power
supply
current
Stop mode
VCC
ICCHD
ICCRD
Deep Standby
Stop mode
Deep Standby
RTC mode
TA = + 25°C,
When LVD is off
TA = + 85°C,
When LVD is off
TA = + 25°C,
When LVD is off
TA = + 85°C,
When LVD is off
TA = + 25°C,
When LVD is off
TA = + 85°C,
When LVD is off
TA = + 25°C,
When LVD is off
TA = + 85°C,
When LVD is off
TA = + 25°C,
When LVD is off,
When RAM is off
TA = + 25°C,
When LVD is off,
When RAM is on
TA = + 85°C,
When LVD is off,
When RAM is off
TA = + 85°C,
When LVD is off,
When RAM is on
TA = + 25°C,
When LVD is off,
When RAM is off
TA = + 25°C,
When LVD is off,
When RAM is on
TA = + 85°C,
When LVD is off,
When RAM is off
TA = + 85°C,
When LVD is off,
When RAM is on
Value
Unit Remarks
Typ*2 Max*2
2.1
2.5
mA *1, *3
-
3.4
mA *1, *3
12
35
μA *1, *4
-
330
μA *1, *4
9.8
29
μA *1, *4
-
280
μA *1, *4
9
28
μA *1
-
270
μA *1
1.25
7
μA
*1, *4, *5
5.3
18
μA
*1, *4, *5
70
μA
*1, *4, *5
100
μA
*1, *4, *5
1.9
9
μA
*1, *5
5.9
20
μA
*1, *5
75
μA
*1, *5
105
μA
*1, *5
-
-
*1: When all ports are fixed.
*2: VCC=3.6 V
*3: When using the crystal oscillator of 4 MHz(Including the current consumption of the oscillation circuit)
*4: When using the crystal oscillator of 32 kHz(Including the current consumption of the oscillation circuit)
*5: RAM on/off setting is on-chip SRAM only.
June 10, 2015, MB9A140NB_DS706-00040-4v0-E
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65
D a t a S h e e t
· Low-Voltage Detection Current
(VCC = 1.65V to 3.6V, VDDI = 1.1V to 1.3V, VSS = 0V, TA = - 40°C to + 85°C)
Parameter
Low-voltage
detection circuit
(LVD) power
supply current
Symbol
ICCLVD
Pin
name
Conditions
Value
Typ
Max
At operation
for reset
VCC = 3.6 V
0.13
0.3
μA
At not detect
At operation
for interrupt
VCC = 3.6 V
0.13
0.3
μA
At not detect
Unit
Remarks
VCC
· Flash Memory Current
(VCC = 1.65V to 3.6V, VDDI = 1.1V to 1.3V, VSS = 0V, TA = - 40°C to + 85°C)
Parameter
Symbol
Pin
name
Conditions
Flash memory
write/erase
current
ICCFLASH
VCC
At Write/Erase
Value
Typ
Max
Unit
9.5
mA
11.2
Remarks
*
*: The current at which to write or erase Flash memory, I CCFLASH is added to ICC.
· A/D Converter Current
(VCC = VCC28 = AVCC = 1.65V to 3.6V, VDDI = 1.1V to 1.3V, VSS = AVSS = 0V, TA = - 40°C to +85°C)
Parameter
Power supply
current
Reference power
supply current
66
CONFIDENTIAL
Symbol
ICCAD
ICCAVRH
Pin
name
AVCC
AVRH
Value
Typ
Max
Unit
At 1unit
operation
0.27
0.42
mA
At stop
0.03
10
μA
At 1unit
operation
AVRH=3.6 V
0.72
1.29
mA
At stop
0.02
2.6
μA
Conditions
Remarks
MB9A140NB_DS706-00040-4v0-E, June 10, 2015
D a t a S h e e t
(2) Pin Characteristics
(VCC = AVCC = 1.65V to 3.6V, VSS = AVSS = 0V, TA = - 40°C to + 85°C)
Parameter Symbol Pin name
Conditions
CMOS
hysteresis
input pin,
MD0, MD1
VCC ≥ 2.7 V
VCC × 0.8
VCC < 2.7 V
VCC × 0.7
VCC ≥ 2.7 V
VCC × 0.8
H level input
voltage
(hysteresis
input)
L level input
voltage
(hysteresis
input)
VIHS
5 V tolerant
input pin
VILS
CMOS
hysteresis
input pin,
MD0, MD1
5 V tolerant
input pin
4 mA type
H level
output voltage
VOH
P80/P81
4mA type
L level
output voltage
VOL
P80/P81
Input leak
current
Pull-up
resistor value
Input
capacitance
IIL
RPU
CIN
CEC0,
CEC1
Value
Typ
Max
-
VCC + 0.3
V
-
VSS + 5.5
V
VCC ≥ 2.7 V
VCC × 0.2
VSS - 0.3
-
VCC < 2.7 V
V
VCC × 0.3
VCC ≥ 2.7 V
VCC × 0.2
VSS - 0.3
-
VCC < 2.7 V
VCC ≥ 2.7 V,
IOH = - 4 mA
VCC < 2.7 V,
IOH = - 2 mA
VCC ≥ 2.7 V,
IOH = - 12 mA
Other than
VCC,
VSS,
AVCC,
AVSS,
AVRH
Unit Remarks
VCC × 0.7
V
VCC × 0.3
VCC - 0.5
-
VCC
V
VCC - 0.4
-
VCC
V
VSS
-
0.4
V
VSS
-
0.4
V
-5
-
+5
μA
-
-
+1.8
μA
VCC ≥ 2.7 V
21
33
66
VCC < 2.7 V
-
-
134
-
-
5
15
VCC < 2.7 V,
IOH = - 6.5 mA
VCC ≥ 2.7 V,
IOL = 4 mA
VCC < 2.7 V,
IOL = 2 mA
VCC ≥ 2.7 V,
IOL = 10.5 mA
VCC < 2.7 V,
IOL = 5 mA
VCC = AVCC =
AVRH = VSS =
AVSS = 0.0 V
VCC - 0.45
Pull-up pin
June 10, 2015, MB9A140NB_DS706-00040-4v0-E
CONFIDENTIAL
VCC < 2.7 V
Min
kΩ
pF
67
D a t a S h e e t
4. AC Characteristics
(1) Main Clock Input Characteristics
(VCC = 1.65V to 3.6V, VSS = 0V, TA = - 40°C to + 85°C)
Parameter
Input frequency
Input clock cycle
Input clock pulse
width
Input clock rising
time and falling
time
Symbol
Pin
Conditions
name
Value
Min
Max
Unit
VCC ≥ 2.7 V
VCC < 2.7 V
4
4
48
20
MHz
-
4
48
MHz
-
20.83
250
ns
-
PWH/tCYLH,
PWL/tCYLH
45
55
%
tCF,
tCR
-
-
5
ns
-
-
40
MHz
fCH
tCYLH
fCM
X0,
X1
-
Remarks
When crystal oscillator
is connected
When using external
clock
When using external
clock
When using external
clock
When using external
clock
Master clock
Base clock
fCC
40
MHz
(HCLK/FCLK)
Internal operating
clock*1 frequency
fCP0
40
MHz APB0 bus clock*2
fCP1
40
MHz APB1 bus clock*2
fCP2
40
MHz APB2 bus clock*2
Base clock
tCYCC
25
ns
(HCLK/FCLK)
Internal operating
tCYCP0
25
ns
APB0 bus clock*2
1
clock* cycle time
tCYCP1
25
ns
APB1 bus clock*2
tCYCP2
25
ns
APB2 bus clock*2
*1: For more information about each internal operating clock, see Chapter 2-1: Clock in FM3 Family Peripheral
Manual.
*2: For about each APB bus which each peripheral is connected to, see Block Diagram in this data
sheet.
X0
68
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MB9A140NB_DS706-00040-4v0-E, June 10, 2015
D a t a S h e e t
(2) Sub Clock Input Characteristics
(VCC = 1.65V to 3.6V, VSS = 0V, TA = - 40°C to + 85°C)
Parameter
Input frequency
Symbol
Min
Value
Typ
Max
-
-
32.768
-
kHz
-
32
-
100
kHz
Pin
Conditions
name
Unit
fCL
X0A,
X1A
Input clock cycle
tCYLL
-
10
-
31.25
μs
Input clock pulse
width
-
PWH/tCYLL,
PWL/tCYLL
45
-
55
%
Remarks
When crystal
oscillator is
connected
When using
external clock
When using
external clock
When using
external clock
X0A
(3) Built-in CR Oscillation Characteristics
Built-in High-speed CR
(VCC = 1.65V to 3.6V, VSS = 0V, TA = - 40°C to + 85°C)
Parameter
Clock frequency
Symbol
fCRH
Min
Value
Typ
Max
TA = + 25°C
VCC ≥ 2.7 V
3.96
4
4.04
TA = + 25°C
VCC < 2.7 V
3.9
4
4.1
Conditions
TA =
- 40°C to + 85°C
TA =
- 40°C to + 85°C
Unit
Remarks
When trimming*1
MHz
3.84
4
4.16
2.8
-
5.2
When not trimming
Frequency
tCRWT
30
μs *2
stabilization time
*1: In the case of using the values in CR trimming area of Flash memory at shipment for frequency/temperature
trimming.
*2: This is the time to stabilize the frequency of High-speed CR clock after setting trimming value.
This period is able to use High-speed CR clock as source clock.
Built-in Low-speed CR
(VCC = 1.65V to 3.6V, VSS = 0V, TA = - 40°C to + 85°C)
Parameter
Clock frequency
Symbol
Conditions
fCRL
-
June 10, 2015, MB9A140NB_DS706-00040-4v0-E
CONFIDENTIAL
Min
Value
Typ
Max
50
100
150
Unit
Remarks
kHz
69
D a t a S h e e t
(4-1) Operating Conditions of Main PLL (In the case of using main clock for input of PLL)
(VCC = 1.65V to 3.6V, VSS = 0V, TA = - 40°C to + 85°C)
Parameter
Symbol
Min
Value
Typ
Max
Unit
Remarks
PLL oscillation stabilization wait time*1
tLOCK
100
μs
(LOCK UP time)
PLL input clock frequency
fPLLI
4
16
MHz
PLL multiple rate
5
37 multiple
PLL macro oscillation clock frequency
fPLLO
75
150
MHz
Main PLL clock frequency*2
fCLKPLL
40
MHz
*1: Time from when the PLL starts operating until the oscillation stabilizes.
*2: For more information about Main PLL clock (CLKPLL), see Chapter 2-1: Clock in FM3 Family
Peripheral Manual.
(4-2) Operating Conditions of Main PLL (In the case of using the built-in High-speed CR for the input
clock of the Main PLL)
(VCC = 1.65V to 3.6V, VSS = 0V, TA = - 40°C to + 85°C)
Parameter
Symbol
Min
Value
Typ
Max
Unit
Remarks
PLL oscillation stabilization wait time*1
tLOCK
100
μs
(LOCK UP time)
PLL input clock frequency
fPLLI
3.8
4
4.2
MHz
PLL multiple rate
19
35 multiple
PLL macro oscillation clock frequency
fPLLO
72
150
MHz
Main PLL clock frequency*2
fCLKPLL
40
MHz
*1: Time from when the PLL starts operating until the oscillation stabilizes.
*2: For more information about Main PLL clock (CLKPLL), see Chapter 2-1: Clock in FM3 Family
Peripheral Manual.
Note: Make sure to input to the Main PLL source clock, the High-speed CR clock (CLKHC) that the
frequency/temperature has been trimmed.
When setting PLL multiple rate, please take the accuracy of the built-in High-speed CR clock into account
and prevent the master clock from exceeding the maximum frequency.
Main PLL connection
Main clock (CLKMO)
High-speed CR clock (CLKHC)
K
divider
PLL input
clock
Main
PLL
PLL macro
oscillation clock
M
divider
Main PLL
clock
(CLKPLL)
N
divider
70
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MB9A140NB_DS706-00040-4v0-E, June 10, 2015
D a t a S h e e t
(5) Reset Input Characteristics
(VCC = 1.65V to 3.6V, VSS = 0V, TA = - 40°C to + 85°C)
Parameter
Reset input time
Symbol
tINITX
Value
Pin
Conditions
name
Min
Max
INITX
500
-
-
Unit Remarks
ns
(6) Power-on Reset Timing
(VCC= 1.65V to 3.6V, VSS = 0V, TA = - 40°C to + 85°C)
Parameter
Symbol
Power supply rising time
tVCCR
Power supply shut down time
Time until releasing
Power-on reset
tOFF
Pin
name
Value
Max
0
-
ms
1
-
ms
1.34
16.09
ms
VCC
tPRT
Unit
Min
Remarks
VCC_minimum
VCC
VDH_minimum
0.2V
0.2V
0.2V
tVCCR
tPRT
Internal reset
CPU Operation
Reset active
tOFF
Release
start
Glossary
・ VCC_minimum: Minimum VCC of recommended operating conditions
・ VDH_minimum: Minimum detection voltage (when SVHR=00000) of Low-Voltage detection reset
See 6. Low-Voltage Detection Characteristics
June 10, 2015, MB9A140NB_DS706-00040-4v0-E
CONFIDENTIAL
71
D a t a S h e e t
(7) External Bus Timing
External bus clock output characteristics
(VCC = 1.65V to 3.6V, VSS = 0V, TA = - 40°C to + 85°C)
Parameter
Symbol
Pin name
Conditions
Value
Min
Max
Unit
VCC ≥ 2.7 V
40
MHz
VCC < 2.7 V
20
MHz
*: The external bus clock output (MCLKOUT) is a divided clock of HCLK.
For more information about setting of clock divider, see Chapter 12: External Bus Interface in FM3 Family
Peripheral Manual.
When external bus clock is not output, this characteristic does not give any effect on external bus operation.
Output frequency
tCYCLE
MCLKOUT*
MCLKOUT
External bus signal input/output characteristics
(VCC = 1.65V to 3.6V, VSS = 0V, TA = - 40°C to + 85°C)
Parameter
Signal input characteristics
Signal output characteristics
72
CONFIDENTIAL
Symbol
Conditions
VIH
VIL
VOH
-
VOL
Input signal
VIH
VIL
VIH
VIL
Output signal
VOH
VOL
VOH
VOL
Value
Unit
0.8 × VCC
V
0.2 × VCC
V
0.8 × VCC
V
0.2 × VCC
V
Remarks
MB9A140NB_DS706-00040-4v0-E, June 10, 2015
D a t a S h e e t
Separate Bus Access Asynchronous SRAM Mode
(VCC = 1.65V to 3.6V, VSS = 0V, TA = - 40°C to + 85°C)
Parameter
Symbol
Pin name
Conditions
Value
Min
VCC ≥ 2.7 V
MOEX
tOEW
MOEX
MCLK×n-3
Min pulse width
VCC < 2.7 V
VCC ≥ 2.7 V
-9
MCSX ↓ → Address
MCSX[7:0],
tCSL – AV
output delay time
MAD[24:0]
VCC < 2.7 V
-12
VCC ≥ 2.7 V
MOEX ↑ →
MOEX,
tOEH - AX
0
Address hold time
MAD[24:0]
VCC < 2.7 V
VCC ≥ 2.7 V
MCLK×m-9
MCSX ↓ →
tCSL - OEL
MOEX ↓ delay time
VCC < 2.7 V MCLK×m-12
MOEX,
MCSX[7:0]
VCC ≥ 2.7 V
MOEX ↑ →
tOEH - CSH
0
MCSX ↑ time
VCC < 2.7 V
VCC ≥ 2.7 V
MCLK×m-9
MCSX ↓ →
MCSX,
tCSL - RDQML
MDQM ↓ delay time
MDQM[1:0]
VCC < 2.7 V MCLK×m-12
VCC ≥ 2.7 V
30
Data set up →
MOEX,
tDS - OE
MOEX ↑ time
MADATA[15:0]
VCC < 2.7 V
38
VCC ≥ 2.7 V
MOEX ↑ →
MOEX,
tDH - OE
0
Data hold time
MADATA[15:0]
VCC < 2.7 V
VCC ≥ 2.7 V
MWEX
tWEW
MWEX
MCLK×n-3
Min pulse width
VCC < 2.7 V
VCC ≥ 2.7 V
MWEX ↑ → Address
MWEX,
tWEH - AX
0
output delay time
MAD[24:0]
VCC < 2.7 V
VCC ≥ 2.7 V
MCLK×n-9
MCSX ↓ →
tCSL - WEL
MWEX ↓ delay time
VCC < 2.7 V MCLK×n-12
MWEX,
MCSX[7:0]
VCC ≥ 2.7 V
MWEX ↑ →
tWEH - CSH
0
MCSX ↑ delay time
VCC < 2.7 V
VCC ≥ 2.7 V
MCLK×n-9
MCSX ↓→
MCSX,
tCSL-WDQML
MDQM ↓ delay time
MDQM[1:0]
VCC < 2.7 V MCLK×n-12
VCC ≥ 2.7 V
MCLK-9
MWEX ↓→
MCSX,
tCSL - DV
Data output time
MADATA[15:0]
VCC < 2.7 V
MCLK-12
VCC ≥ 2.7 V
MWEX ↑ →
MWEX,
tWEH - DX
0
Data hold time
MADATA[15:0]
VCC < 2.7 V
Note: When the external load capacitance CL = 30 pF (m = 0 to 15, n = 1 to 16).
June 10, 2015, MB9A140NB_DS706-00040-4v0-E
CONFIDENTIAL
Max
+9
+12
MCLK×m+9
MCLK×m+12
MCLK×m+9
MCLK×m+12
MCLK×m+9
MCLK×m+12
MCLK×m+9
MCLK×m+12
-
Unit
ns
ns
ns
ns
ns
ns
ns
-
ns
-
ns
MCLK×m+9
MCLK×m+12
MCLK×n+9
MCLK×n+12
MCLK×m+9
MCLK×m+12
MCLK×n+9
MCLK×n+12
MCLK+9
MCLK+12
MCLK×m+9
MCLK×m+12
ns
ns
ns
ns
ns
ns
73
D a t a S h e e t
MCLK
MCSX[7:0]
MAD[24:0]
MOEX
MDQM[1:0]
MWEX
MADATA[15:0]
74
CONFIDENTIAL
MB9A140NB_DS706-00040-4v0-E, June 10, 2015
D a t a S h e e t
Separate Bus Access Synchronous SRAM Mode
(VCC = 1.65V to 3.6V, VSS = 0V, TA = - 40°C to + 85°C)
Parameter
Address delay time
Symbol
Pin name
Conditions
tAV
MCLK,
MAD[24:0]
VCC ≥ 2.7 V
VCC < 2.7 V
VCC ≥ 2.7 V
VCC < 2.7 V
VCC ≥ 2.7 V
VCC < 2.7 V
VCC ≥ 2.7 V
VCC < 2.7 V
VCC ≥ 2.7 V
VCC < 2.7 V
VCC ≥ 2.7 V
VCC < 2.7 V
VCC ≥ 2.7 V
VCC < 2.7 V
VCC ≥ 2.7 V
VCC < 2.7 V
VCC ≥ 2.7 V
VCC < 2.7 V
VCC ≥ 2.7 V
VCC < 2.7 V
VCC ≥ 2.7 V
VCC < 2.7 V
VCC ≥ 2.7 V
VCC <2.7 V
VCC ≥ 2.7 V
VCC <2.7 V
tCSL
MCSX delay time
tCSH
tREL
MOEX delay time
tREH
Data set up →
MCLK ↑ time
MCLK ↑ →
Data hold time
tDS
tDH
tWEL
MWEX delay time
tWEH
MDQM[1:0]
delay time
tDQML
tDQMH
MCLK,
MCSX[7:0]
MCLK,
MOEX
MCLK,
MADATA[15:0]
MCLK,
MADATA[15:0]
MCLK,
MWEX
MCLK,
MDQM[1:0]
MCLK ↑ →
MCLK,
tODS
Data output time
MADATA[15:0]
MCLK ↑ →
MCLK,
tOD
Data hold time
MADATA[15:0]
Note: When the external load capacitance CL = 30 pF.
Value
Unit
Min
Max
1
12
13
ns
1
12
ns
1
12
ns
1
1
9
12
9
12
ns
ns
24
37
-
ns
0
-
ns
1
1
1
1
MCLK + 1
1
9
12
9
12
9
12
9
12
MCLK + 18
MCLK + 24
18
24
ns
ns
ns
ns
ns
ns
MCLK
MCSX[7:0]
MAD[24:0]
MOEX
MDQM[1:0]
MWEX
MADATA[15:0]
June 10, 2015, MB9A140NB_DS706-00040-4v0-E
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75
D a t a S h e e t
Multiplexed Bus Access Asynchronous SRAM Mode
(VCC = 1.65V to 3.6V, VSS = 0V, TA = - 40°C to + 85°C)
Parameter
Symbol
Pin name
Conditions
Value
Min
VCC ≥ 2.7 V
Multiplexed
tALE-CHMADV
-2
address delay time
VCC < 2.7 V
MALE,
MADATA[15:0]
VCC ≥ 2.7 V MCLK×n+0
Multiplexed
tCHMADH
address hold time
VCC < 2.7 V MCLK×n+0
Note: When the external load capacitance CL = 30 pF (m = 0 to 15, n = 1 to 16).
Max
+10
+20
MCLK×n+10
MCLK×n+20
Unit
ns
ns
MCLK
MCSX[7:0]
MALE
MAD [24:0]
MOEX
MDQM [1:0]
MWEX
MADATA[15:0]
76
CONFIDENTIAL
MB9A140NB_DS706-00040-4v0-E, June 10, 2015
D a t a S h e e t
Multiplexed Bus Access Synchronous SRAM Mode
(VCC = 1.65V to 3.6V, VSS = 0V, TA = - 40°C to + 85°C)
Parameter
Symbol
tCHAL
MALE delay time
tCHAH
Pin name
Conditions
MCLK,
ALE
VCC ≥ 2.7 V
VCC < 2.7 V
VCC ≥ 2.7 V
VCC < 2.7 V
MCLK ↑ →
Multiplexed
tCHMADV
Address delay time
MCLK,
MADATA[15:0]
MCLK ↑ →
Multiplexed
tCHMADX
Data output time
Note: When the external load capacitance CL = 30 pF.
VCC ≥ 2.7 V
Min
VCC < 2.7 V
Unit Remarks
9
12
9
12
ns
ns
ns
ns
1
tOD
ns
1
tOD
ns
1
1
VCC < 2.7 V
VCC ≥ 2.7 V
Value
Max
MCLK
MCSX[7:0]
MALE
MAD [24:0]
MOEX
MDQM [1:0]
MWEX
MADATA[15:0]
June 10, 2015, MB9A140NB_DS706-00040-4v0-E
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D a t a S h e e t
External Ready Input Timing
(VCC = 1.65V to 3.6V, VSS = 0V, TA = - 40°C to + 85°C)
Parameter
MCLK ↑
MRDY input
setup time
Symbol
tRDYI
Pin name Conditions
MCLK,
MRDY
Value
Min
VCC ≥ 2.7 V
23
VCC < 2.7 V
37
Max
-
Unit
Remarks
ns
When RDY is input
···
MCLK
Over 2cycles
Original
MOEX
MWEX
tRDYI
MRDY
When RDY is released
MCLK
··· ···
2 cycles
Extended
MOEX
MWEX
tRDYI
0.5×VCC
MRDY
78
CONFIDENTIAL
MB9A140NB_DS706-00040-4v0-E, June 10, 2015
D a t a S h e e t
(8) Base Timer Input Timing
Timer input timing
(VCC = 1.65V to 3.6V, VSS = 0V, TA = - 40°C to + 85°C)
Parameter
Input pulse width
Symbol
Pin name
Conditions
tTIWH,
tTIWL
TIOAn/TIOBn
(when using as
ECK, TIN)
-
tTIWH
Value
Min
Max
2tCYCP
-
Unit Remarks
ns
tTIWL
ECK
VIHS
TIN
VIHS
VILS
VILS
Trigger input timing
(VCC = 1.65V to 3.6V, VSS = 0V, TA = - 40°C to + 85°C)
Parameter
Input pulse width
Symbol
Pin name
Conditions
tTRGH,
tTRGL
TIOAn/TIOBn
(when using as
TGIN)
-
tTRGH
TGIN
VIHS
Value
Min
Max
2tCYCP
-
Unit Remarks
ns
tTRGL
VIHS
VILS
VILS
Note: tCYCP indicates the APB bus clock cycle time.
About the APB bus number which the Base Timer is connected to, see Block Diagram in this data
sheet.
June 10, 2015, MB9A140NB_DS706-00040-4v0-E
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79
D a t a S h e e t
(9) CSIO/UART Timing
CSIO (SPI = 0, SCINV = 0)
(VCC = 1.65V to 3.6V, VSS = 0V, TA = - 40°C to + 85°C)
Parameter
Pin
Symbol
Conditions
name
Serial clock cycle time
tSCYC
SCK ↓ → SOT delay time
tSLOVI
SIN → SCK ↑ setup time
tIVSHI
SCK ↑ → SIN hold time
tSHIXI
Serial clock L pulse width
tSLSH
SCKx
Serial clock H pulse width
tSHSL
SCKx
SCK ↓ → SOT delay time
tSLOVE
SIN → SCK ↑ setup time
tIVSHE
SCK ↑ → SIN hold time
tSHIXE
SCK falling time
SCK rising time
tF
tR
SCKx
SCKx,
SOTx
SCKx, Master mode
SINx
SCKx,
SINx
SCKx,
SOTx
SCKx,
SINx
SCKx,
SINx
SCKx
SCKx
VCC < 2.7 V
Min
Max
VCC ≥ 2.7 V
Min
Max
Unit
4tCYCP
-
4tCYCP
-
ns
- 30
+ 30
- 20
+ 20
ns
50
-
36
-
ns
0
-
0
-
ns
-
ns
-
ns
2tCYCP 10
tCYCP +
10
-
2tCYCP 10
tCYCP +
10
-
50
-
33
ns
10
-
10
-
ns
20
-
20
-
ns
-
5
5
-
5
5
ns
ns
Slave mode
Notes: The above characteristics apply to clock synchronous mode.
tCYCP indicates the APB bus clock cycle time.
About the APB bus number which Multi-function serial is connected to, see Block Diagram in
this data sheet.
These characteristics only guarantee the same relocate port number.
For example, the combination of SCKx_0 and SOTx_1 is not guaranteed.
When the external load capacitance CL = 30 pF.
80
CONFIDENTIAL
MB9A140NB_DS706-00040-4v0-E, June 10, 2015
D a t a S h e e t
tSCYC
SCK
VOH
VOH
VOL
tSHOVI
VOH
VOL
SOT
tIVSLI
VIH
SIN
tSLIXI
VIH
VIL
VIL
Master mode
tSHSL
SCK
VIH
VIH
VIL
tR
SOT
tSLSH
tF
VIL
VIL
tSHOVE
VOH
VOL
tIVSLE
SIN
VIH
VIL
tSLIXE
VIH
VIL
Slave mode
June 10, 2015, MB9A140NB_DS706-00040-4v0-E
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81
D a t a S h e e t
CSIO (SPI = 0, SCINV = 1)
(VCC = 1.65V to 3.6V, VSS = 0V, TA = - 40°C to + 85°C)
Parameter
Symbol
VCC < 2.7 V
Min
Max
SCKx
SCKx,
SOTx
SCKx, Master mode
SINx
SCKx,
SINx
4tCYCP
-
4tCYCP
-
ns
- 30
+ 30
- 20
+ 20
ns
50
-
36
-
ns
0
-
0
-
ns
-
ns
-
ns
Serial clock cycle time
tSCYC
SCK ↑ → SOT delay time
tSHOVI
SIN → SCK ↓ setup time
tIVSLI
SCK ↓ → SIN hold time
tSLIXI
Serial clock L pulse width
tSLSH
SCKx
Serial clock H pulse width
tSHSL
SCKx
SCK ↑ → SOT delay time
tSHOVE
SIN → SCK ↓ setup time
tIVSLE
SCK ↓ → SIN hold time
tSLIXE
SCK falling time
SCK rising time
tF
tR
VCC ≥ 2.7 V
Min
Max
Pin
Conditions
name
SCKx,
SOTx
SCKx,
SINx
SCKx,
SINx
SCKx
SCKx
2tCYCP 10
tCYCP +
10
-
2tCYCP 10
tCYCP +
10
Unit
-
50
-
33
ns
10
-
10
-
ns
20
-
20
-
ns
-
5
5
-
5
5
ns
ns
Slave mode
Notes: The above characteristics apply to clock synchronous mode.
tCYCP indicates the APB bus clock cycle time.
About the APB bus number which Multi-function serial is connected to, see Block Diagram in
this data sheet.
These characteristics only guarantee the same relocate port number.
For example, the combination of SCKx_0 and SOTx_1 is not guaranteed.
When the external load capacitance CL = 30 pF.
82
CONFIDENTIAL
MB9A140NB_DS706-00040-4v0-E, June 10, 2015
D a t a S h e e t
tSCYC
SCK
VOH
VOH
VOL
tSHOVI
VOH
VOL
SOT
tIVSLI
VIH
SIN
tSLIXI
VIH
VIL
VIL
Master mode
tSHSL
SCK
VIH
VIH
VIL
tR
SOT
tSLSH
tF
VIL
VIL
tSHOVE
VOH
VOL
tIVSLE
SIN
VIH
VIL
tSLIXE
VIH
VIL
Slave mode
June 10, 2015, MB9A140NB_DS706-00040-4v0-E
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83
D a t a S h e e t
CSIO (SPI = 1, SCINV = 0)
(VCC = 1.65V to 3.6V, VSS = 0V, TA = - 40°C to + 85°C)
Parameter
Symbol
VCC < 2.7 V
Min
Max
SCKx
SCKx,
SOTx
SCKx,
SINx Master mode
SCKx,
SINx
SCKx,
SOTx
4tCYCP
-
4tCYCP
-
ns
- 30
+ 30
- 20
+ 20
ns
50
-
36
-
ns
0
-
0
-
ns
-
ns
-
ns
-
ns
Serial clock cycle time
tSCYC
SCK ↑ → SOT delay time
tSHOVI
SIN → SCK ↓ setup time
tIVSLI
SCK ↓→ SIN hold time
tSLIXI
SOT → SCK ↓ delay time
tSOVLI
Serial clock L pulse width
tSLSH
SCKx
Serial clock H pulse width
tSHSL
SCKx
SCK ↑ → SOT delay time
tSHOVE
SIN → SCK ↓ setup time
tIVSLE
SCK ↓→ SIN hold time
tSLIXE
SCK falling time
SCK rising time
tF
tR
VCC ≥ 2.7 V
Min
Max
Pin
Conditions
name
SCKx,
SOTx
SCKx,
SINx
SCKx,
SINx
SCKx
SCKx
2tCYCP 34
2tCYCP 10
tCYCP +
10
-
2tCYCP 34
2tCYCP 10
tCYCP +
10
Unit
-
50
-
33
ns
10
-
10
-
ns
20
-
20
-
ns
-
5
5
-
5
5
ns
ns
Slave mode
Notes: The above characteristics apply to clock synchronous mode.
tCYCP indicates the APB bus clock cycle time.
About the APB bus number which Multi-function serial is connected to, see Block Diagram in
this data sheet.
These characteristics only guarantee the same relocate port number.
For example, the combination of SCKx_0 and SOTx_1 is not guaranteed.
When the external load capacitance CL = 30 pF.
84
CONFIDENTIAL
MB9A140NB_DS706-00040-4v0-E, June 10, 2015
D a t a S h e e t
tSCYC
VOH
SCK
VOL
tSOVLI
SOT
VOH
VOL
VOH
VOL
tIVSLI
tSLIXI
VIH
VIL
SIN
VOL
tSHOVI
VIH
VIL
Master mode
tSLSH
VIH
SCK
SOT
VIL
VIL
tF
*
VOH
VOL
tR
tIVSLE
SIN
tSHSL
VIH
VIH
tSHOVE
VOH
VOL
tSLIXE
VIH
VIL
VIH
VIL
Slave mode
*: Changes when writing to TDR register
June 10, 2015, MB9A140NB_DS706-00040-4v0-E
CONFIDENTIAL
85
D a t a S h e e t
CSIO (SPI = 1, SCINV = 1)
(VCC = 1.65V to 3.6V, VSS = 0V, TA = - 40°C to + 85°C)
Parameter
Symbol
Pin
Conditions
name
VCC < 2.7 V
Min
Max
VCC ≥ 2.7 V
Min
Max
Unit
Serial clock cycle time
tSCYC
SCKx
4tCYCP
-
4tCYCP
-
ns
SCK ↓ → SOT delay time
tSLOVI
SCKx,
SOTx
- 30
+ 30
- 20
+ 20
ns
SIN → SCK ↑ setup time
tIVSHI
50
-
36
-
ns
SCK ↑ → SIN hold time
tSHIXI
0
-
0
-
ns
SOT → SCK ↑ delay time
tSOVHI
-
ns
Serial clock L pulse width
tSLSH
SCKx
-
ns
Serial clock H pulse width
tSHSL
SCKx
-
ns
SCK ↓ → SOT delay time
tSLOVE
SIN → SCK ↑ setup time
tIVSHE
SCK ↑ → SIN hold time
tSHIXE
SCK falling time
SCK rising time
tF
tR
SCKx,
SINx Master mode
SCKx,
SINx
SCKx,
SOTx
SCKx,
SOTx
SCKx,
SINx
SCKx,
SINx
SCKx
SCKx
2tCYCP 34
2tCYCP 10
tCYCP +
10
-
2tCYCP 34
2tCYCP 10
tCYCP +
10
-
50
-
33
ns
10
-
10
-
ns
20
-
20
-
ns
-
5
5
-
5
5
ns
ns
Slave mode
Notes: The above characteristics apply to clock synchronous mode.
tCYCP indicates the APB bus clock cycle time.
About the APB bus number which Multi-function serial is connected to, see Block Diagram in
this data sheet.
These characteristics only guarantee the same relocate port number.
For example, the combination of SCKx_0 and SOTx_1 is not guaranteed.
When the external load capacitance CL = 30 pF.
86
CONFIDENTIAL
MB9A140NB_DS706-00040-4v0-E, June 10, 2015
D a t a S h e e t
tSCYC
VOH
SCK
VOH
VOL
tSOVHI
tSLOVI
VOH
VOL
SOT
VOH
VOL
tSHIXI
tIVSHI
VIH
VIL
SIN
VIH
VIL
Master mode
tR
SCK
tF
tSHSL
VIH
VIH
VIL
tSLSH
VIL
VIL
tSLOVE
VOH
VOL
SOT
VOH
VOL
tIVSHE
tSHIXE
VIH
VIL
SIN
VIH
VIL
Slave mode
UART external clock input (EXT = 1)
(VCC = 1.65V to 3.6V, VSS = 0V, TA = - 40°C to + 85°C)
Parameter
Serial clock L pulse width
Serial clock H pulse width
SCK falling time
SCK rising time
tSLSH
tSHSL
tF
tR
CL = 30 pF
Min
Max
tCYCP + 10
tCYCP + 10
-
5
5
Unit Remarks
ns
ns
ns
ns
tF
tR
t
t
SHSL
SCK
V IL
June 10, 2015, MB9A140NB_DS706-00040-4v0-E
CONFIDENTIAL
Value
Symbol Conditions
V
IH
SLSH
V
IH
V IL
VIL
V
IH
87
D a t a S h e e t
(10) External Input Timing
(VCC = 1.65V to 3.6V, VSS = 0V, TA = - 40°C to + 85°C)
Parameter
Input pulse width
Symbol
tINH,
tINL
Value
Unit
Min
Max
Pin name
Conditions
ADTG
-
2tCYCP*1
-
ns
INTxx,
NMIX
*2
2tCYCP + 100*1
-
ns
*3
500
-
ns
WKUPx
*4
600
-
ns
Remarks
A/D converter
trigger input
External interrupt
NMI
Deep standby
wake up
*1: tCYCP indicates the APB bus clock cycle time.
About the APB bus number which the Multi-function Timer is connected to, see Block Diagram in this
data sheet.
*2: When in Run mode, in Sleep mode.
*3: When in Stop mode, in Timer mode.
*4: When in Deep Standby RTC mode, in Deep Standby Stop mode.
88
CONFIDENTIAL
MB9A140NB_DS706-00040-4v0-E, June 10, 2015
D a t a S h e e t
2
(11) I C Timing
(VCC = 1.65V to 3.6V, VSS = 0V, TA = - 40°C to + 85°C)
Parameter
Symbol
Conditions
Standard-mode
Min
Max
Fast-mode
Unit Remarks
Min
Max
SCL clock frequency
FSCL
0
100
0
400 kHz
(Repeated) START
condition hold time
tHDSTA
4.0
0.6
μs
SDA ↓ → SCL ↓
SCL clock L width
tLOW
4.7
1.3
μs
SCL clock H width
tHIGH
4.0
0.6
μs
(Repeated) START
condition setup time
tSUSTA
4.7
0.6
μs
SCL ↑ → SDA ↓
CL = 30 pF,
R = (Vp/IOL)*1
Data hold time
tHDDAT
0
3.45*2
0
0.9*3 μs
SCL ↓ → SDA ↓ ↑
Data setup time
tSUDAT
250
100
ns
SDA ↓ ↑ → SCL ↑
STOP condition setup time
tSUSTO
4.0
0.6
μs
SCL ↑ → SDA ↑
Bus free time between
STOP condition and
tBUF
4.7
1.3
μs
START condition
Noise filter
tSP
2 tCYCP*4
2 tCYCP*4
ns
*1: R and C represent the pull-up resistor and load capacitance of the SCL and SDA lines, respectively.
Vp indicates the power supply voltage of the pull-up resistor and IOL indicates VOL guaranteed current.
*2: The maximum tHDDAT must satisfy that it does not extend at least L period (tLOW) of device's SCL signal.
*3: A Fast-mode I2C bus device can be used on a Standard-mode I2C bus system as long as the device satisfies
the requirement of tSUDAT ≥ 250 ns.
*4: tCYCP is the APB bus clock cycle time.
About the APB bus number that I2C is connected to, see Block Diagram in this data sheet.
To use Standard-mode, set the APB bus clock at 2 MHz or more.
To use Fast-mode, set the APB bus clock at 8 MHz or more.
SDA
SCL
June 10, 2015, MB9A140NB_DS706-00040-4v0-E
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89
D a t a S h e e t
(12) ETM Timing
(VCC = 1.65V to 3.6V, VSS = 0V, TA = - 40°C to + 85°C)
Parameter
Data hold
TRACECLK
frequency
Pin name
Conditions
tETMH
TRACECLK,
TRACED[3:0]
VCC ≥ 2.7 V
2
11
VCC < 2.7 V
2
15
VCC ≥ 2.7 V
-
40
MHz
VCC < 2.7 V
-
20
MHz
VCC ≥ 2.7 V
25
-
ns
VCC < 2.7 V
50
-
ns
1/ tTRACE
TRACECLK
TRACECLK
clock cycle
Value
Unit
Min Max
Symbol
tTRACE
Remarks
ns
Note: When the external load capacitance CL = 30 pF.
HCLK
TRACECLK
TRACED[3:0]
90
CONFIDENTIAL
MB9A140NB_DS706-00040-4v0-E, June 10, 2015
D a t a S h e e t
(13) JTAG Timing
(VCC = 1.65V to 3.6V, VSS = 0V, TA = - 40°C to + 85°C)
Parameter
Symbol Pin name
Conditions
TCK,
TMS, TDI
TCK,
TMS, TDI
VCC ≥ 2.7 V
VCC < 2.7 V
VCC ≥ 2.7 V
VCC < 2.7 V
VCC ≥ 2.7 V
TMS, TDI setup
time
tJTAGS
TMS, TDI hold time
tJTAGH
TDO delay time
tJTAGD
TCK,
TDO
VCC < 2.7 V
Note: When the external load capacitance CL = 30 pF.
Value
Min
Max
Unit
15
-
ns
15
-
ns
-
25
-
45
Remarks
ns
TCK
TMS/TDI
TDO
June 10, 2015, MB9A140NB_DS706-00040-4v0-E
CONFIDENTIAL
91
D a t a S h e e t
5. 12-bit A/D Converter
Electrical Characteristics for the A/D Converter
(VCC = AVCC = 1.65V to 3.6V, VSS = AVSS = 0V, TA = - 40°C to + 85°C)
Value
Typ
Max
-
±2
12
± 4.5
bit
LSB
-
-
± 2.2
± 2.5
LSB
VZT
ANxx
-
±6
± 15
mV
VFST
ANxx
-
Parameter
Symbol
Pin
name
Min
Resolution
Integral Nonlinearity
Differential
Nonlinearity
Zero transition voltage
Full-scale transition
voltage
-
-
-
Conversion time
-
-
Sampling time*2
tS
-
tCCK
-
tSTT
-
-
AVCC
-
AVRH
Compare clock
cycle*3
AVRH ± 6 AVRH ± 15
2.0*1
4.0*1
10*1
0.6
1.2
3.0
100
200
500
-
Unit
mV
-
μs
10
us
-
1000
ns
-
-
1.0
μs
-
0.27
0.03
0.42
10
mA
μA
-
0.72
1.29
mA
-
0.02
2.6
μA
pF
LSB
μA
State transition time to
operation permission
Power supply current
(analog + digital)
Reference power
supply current
(between AVRH to
AVSS)
Analog input capacity
CAIN
-
-
-
Analog input resistor
RAIN
-
-
-
Interchannel disparity
Analog port input
current
Analog input voltage
-
-
-
-
9.4
2.2
5.5
10.5
4
-
ANxx
-
-
5
-
ANxx
Remarks
kΩ
AVCC ≥ 2.7 V
1.8 V< AVCC < 2.7 V
1.65 V< AVCC < 1.8 V
AVCC ≥ 2.7 V
1.8 V< AVCC < 2.7 V
1.65 V< AVCC < 1.8 V
AVCC ≥ 2.7 V
1.8 V< AVCC < 2.7 V
1.65 V< AVCC < 1.8 V
A/D 1unit operation
When A/D stops
A/D 1unit operation
AVRH=3.6 V
When A/D stops
AVCC ≥ 2.7 V
1.8 V< AVCC < 2.7 V
1.65 V< AVCC < 1.8 V
AVSS
AVRH
V
2.7
AVCC ≥ 2.7 V
Reference voltage
AVRH
AVCC
V
AVCC
AVCC < 2.7 V
*1: The conversion time is the value of sampling time (tS) + compare time (tC).
The condition of the minimum conversion time is the following.
AVCC ≥ 2.7 V, HCLK=40 MHz
sampling time: 0.6 μs, compare time: 1.4 μs
1.8 V < AVCC < 2.7 V, HCLK=40 MHz
sampling time: 1.2 μs, compare time: 2.8 μs
1.65 V < AVCC < 1.8 V, HCLK=40 MHz sampling time: 3 μs, compare time: 7 μs
Ensure that it satisfies the value of the sampling time (tS) and compare clock cycle (tCCK).
For setting of the sampling time and the compare clock cycle, see Chapter 1-1: A/D Converter in FM3
Family Peripheral Manual Analog Macro Port.
The register setting of the A/D Converter are reflected in the operation according to the APB bus clock
timing.
The sampling clock and compare clock is generated from the Base clock (HCLK).
About the APB bus number which the A/D Converter is connected to, see Block Diagram in this data
sheet.
*2: A necessary sampling time changes by external impedance.
Ensure that it set the sampling time to satisfy (Equation 1).
*3: The compare time (tC) is the value of (Equation 2).
92
CONFIDENTIAL
MB9A140NB_DS706-00040-4v0-E, June 10, 2015
D a t a S h e e t
REXT
ANxx
Analog input pin
Comparator
RAIN
Analog
signal source
CAIN
(Equation 1) tS ≥ ( RAIN + REXT ) × CAIN × 9
tS:
RAIN:
CAIN:
REXT:
Sampling time[ns]
input resistor of A/D[kΩ] = 2.2 kΩ at 2.7 V < AVCC < 3.6 V
input resistor of A/D[kΩ] = 5.5 kΩ at 1.8 V < AVCC < 2.7 V
input resistor of A/D[kΩ] = 10.5 kΩ at 1.65 V < AVCC < 1.8 V
input capacity of A/D[pF] = 9.4 pF at 1.65 V < AVCC < 3.6 V
Output impedance of external circuit[kΩ]
(Equation 2) tC = tCCK × 14
tC:
tCCK:
Compare time
Compare clock cycle
June 10, 2015, MB9A140NB_DS706-00040-4v0-E
CONFIDENTIAL
93
D a t a S h e e t
Definition of 12-bit A/D Converter Terms
Resolution:
Integral Nonlinearity:
Differential Nonlinearity:
Analog variation that is recognized by an A/D converter.
Deviation of the line between the zero-transition point
(0b000000000000 ←→ 0b000000000001) and the full-scale transition
point (0b111111111110 ←→ 0b111111111111) from the actual conversion
characteristics.
Deviation from the ideal value of the input voltage that is required to
change the output code by 1 LSB.
Integral Nonlinearity
Differential Nonlinearity
0xFFF
Actual conversion
characteristics
0xFFE
0x(N+1)
{1 LSB(N-1) + VZT}
VFST
VNT
0x004
(Actuallymeasured
value)
(Actually-measured
value)
0x003
Digital output
Digital output
0xFFD
0xN
Actual conversion
characteristics
Ideal characteristics
V(N+1)T
0x(N-1)
(Actually-measured
value)
Actual conversion
characteristics
Ideal characteristics
0x002
VNT
(Actually-measured
value)
0x(N-2)
0x001
VZT (Actually-measured value)
AVSS
Actual conversion characteristics
AVRH
AVSS
AVRH
Analog input
Linearity error of digital output N =
Analog input
VNT - {1LSB × (N - 1) + VZT}
1LSB
Differential linearity error of digital output N =
1LSB =
V(N + 1) T - VNT
1LSB
[LSB]
- 1 [LSB]
VFST - VZT
4094
N:
A/D converter digital output value.
Voltage at which the digital output changes from 0x000 to 0x001.
VFST: Voltage at which the digital output changes from 0xFFE to 0xFFF.
VNT: Voltage at which the digital output changes from 0x(N − 1) to 0xN.
VZT:
94
CONFIDENTIAL
MB9A140NB_DS706-00040-4v0-E, June 10, 2015
D a t a S h e e t
6. Low-Voltage Detection Characteristics
(1) Low-Voltage Detection Reset
(TA = - 40°C to + 85°C)
Parameter
Symbol
Conditions
Min
Value
Typ
Max
Unit
Remarks
Detected voltage
VDL
1.38
1.50
1.60
V When voltage drops
SVHR*1 = 00000
Released voltage
VDH
1.43
1.55
1.65
V When voltage rises
Detected voltage
VDL
1.43
1.55
1.65
V When voltage drops
SVHR*1 = 00001
Released voltage
VDH
Same as SVHR = 00000 value V When voltage rises
Detected voltage
VDL
1.47
1.60
1.73
V When voltage drops
SVHR*1 = 00010
Released voltage
VDH
Same as SVHR = 00000 value V When voltage rises
Detected voltage
VDL
1.52
1.65
1.78
V When voltage drops
1
SVHR* = 00011
Released voltage
VDH
Same as SVHR = 00000 value V When voltage rises
Detected voltage
VDL
1.56
1.70
1.84
V When voltage drops
SVHR*1 = 00100
Released voltage
VDH
Same as SVHR = 00000 value V When voltage rises
Detected voltage
VDL
1.61
1.75
1.89
V When voltage drops
SVHR*1 = 00101
Released voltage
VDH
Same as SVHR = 00000 value V When voltage rises
Detected voltage
VDL
1.66
1.80
1.94
V When voltage drops
SVHR*1 = 00110
Released voltage
VDH
Same as SVHR = 00000 value V When voltage rises
Detected voltage
VDL
1.70
1.85
2.00
V When voltage drops
1
SVHR* = 00111
Released voltage
VDH
Same as SVHR = 00000 value V When voltage rises
Detected voltage
VDL
1.75
1.90
2.05
V When voltage drops
SVHR*1 = 01000
Released voltage
VDH
Same as SVHR = 00000 value V When voltage rises
Detected voltage
VDL
1.79
1.95
2.11
V When voltage drops
SVHR*1 = 01001
Released voltage
VDH
Same as SVHR = 00000 value V When voltage rises
Detected voltage
VDL
1.84
2.00
2.16
V When voltage drops
SVHR*1 = 01010
Released voltage
VDH
Same as SVHR = 00000 value V When voltage rises
Detected voltage
VDL
1.89
2.05
2.21
V When voltage drops
1
SVHR* = 01011
Released voltage
VDH
Same as SVHR = 00000 value V When voltage rises
Detected voltage
VDL
2.30
2.50
2.70
V When voltage drops
SVHR*1 = 01100
Released voltage
VDH
Same as SVHR = 00000 value V When voltage rises
Detected voltage
VDL
2.39
2.60
2.81
V When voltage drops
SVHR*1 = 01101
Released voltage
VDH
Same as SVHR = 00000 value V When voltage rises
Detected voltage
VDL
2.48
2.70
2.92
V When voltage drops
SVHR*1 = 01110
Released voltage
VDH
Same as SVHR = 00000 value V When voltage rises
Detected voltage
VDL
2.58
2.80
3.02
V When voltage drops
1
SVHR* = 01111
Released voltage
VDH
Same as SVHR = 00000 value V When voltage rises
Detected voltage
VDL
2.67
2.90
3.13
V When voltage drops
SVHR*1 = 10000
Released voltage
VDH
Same as SVHR = 00000 value V When voltage rises
Detected voltage
VDL
2.76
3.00
3.24
V When voltage drops
SVHR*1 = 10001
Released voltage
VDH
Same as SVHR = 00000 value V When voltage rises
Detected voltage
VDL
2.85
3.10
3.35
V When voltage drops
SVHR*1 = 10010
Released voltage
VDH
Same as SVHR = 00000 value V When voltage rises
Detected voltage
VDL
2.94
3.20
3.46
V When voltage drops
1
SVHR* = 10011
Released voltage
VDH
Same as SVHR = 00000 value V When voltage rises
LVD stabilization
5200 ×
tLVDW
μs
wait time
tCYCP*2
LVD detection
tLVDDL
200
μs
delay time
*1: The SVHR bit of Low-Voltage Detection Voltage Control Register (LVD_CTL) is initialized to 00000 by
Low-Voltage Detection Reset.
*2: tCYCP indicates the APB2 bus clock cycle time.
June 10, 2015, MB9A140NB_DS706-00040-4v0-E
CONFIDENTIAL
95
D a t a S h e e t
(2) Interrupt of Low-Voltage Detection
(TA = - 40°C to + 85°C)
Parameter
Symbol
Conditions
Detected voltage
VDL
SVHI = 00100
Released voltage
VDH
Detected voltage
VDL
SVHI = 00101
Released voltage
VDH
Detected voltage
VDL
SVHI = 00110
Released voltage
VDH
Detected voltage
VDL
SVHI = 00111
Released voltage
VDH
Detected voltage
VDL
SVHI = 01000
Released voltage
VDH
Detected voltage
VDL
SVHI = 01001
Released voltage
VDH
Detected voltage
VDL
SVHI = 01010
Released voltage
VDH
Detected voltage
VDL
SVHI = 01011
Released voltage
VDH
Detected voltage
VDL
SVHI = 01100
Released voltage
VDH
Detected voltage
VDL
SVHI = 01101
Released voltage
VDH
Detected voltage
VDL
SVHI = 01110
Released voltage
VDH
Detected voltage
VDL
SVHI = 01111
Released voltage
VDH
Detected voltage
VDL
SVHI = 10000
Released voltage
VDH
Detected voltage
VDL
SVHI = 10001
Released voltage
VDH
Detected voltage
VDL
SVHI = 10010
Released voltage
VDH
Detected voltage
VDL
SVHI = 10011
Released voltage
VDH
LVD stabilization
tLVDW
wait time
LVD detection delay
tLVDDL
time
*: tCYCP indicates the APB2 bus clock cycle time.
96
CONFIDENTIAL
Min
Value
Typ Max
1.56
1.61
1.61
1.66
1.66
1.70
1.70
1.75
1.75
1.79
1.79
1.84
1.84
1.89
1.89
1.93
2.30
2.39
2.39
2.48
2.48
2.58
2.58
2.67
2.67
2.76
2.76
2.85
2.85
2.94
2.94
3.04
1.70
1.75
1.75
1.80
1.80
1.85
1.85
1.90
1.90
1.95
1.95
2.00
2.00
2.05
2.05
2.10
2.50
2.60
2.60
2.70
2.70
2.80
2.80
2.90
2.90
3.00
3.00
3.10
3.10
3.20
3.20
3.30
-
-
-
-
1.84
1.89
1.89
1.94
1.94
2.00
2.00
2.05
2.05
2.11
2.11
2.16
2.16
2.21
2.21
2.27
2.70
2.81
2.81
2.92
2.92
3.02
3.02
3.13
3.13
3.24
3.24
3.35
3.35
3.46
3.46
3.56
5200 ×
tCYCP*
200
Unit
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
Remarks
When voltage drops
When voltage rises
When voltage drops
When voltage rises
When voltage drops
When voltage rises
When voltage drops
When voltage rises
When voltage drops
When voltage rises
When voltage drops
When voltage rises
When voltage drops
When voltage rises
When voltage drops
When voltage rises
When voltage drops
When voltage rises
When voltage drops
When voltage rises
When voltage drops
When voltage rises
When voltage drops
When voltage rises
When voltage drops
When voltage rises
When voltage drops
When voltage rises
When voltage drops
When voltage rises
When voltage drops
When voltage rises
μs
μs
MB9A140NB_DS706-00040-4v0-E, June 10, 2015
D a t a S h e e t
7. Flash Memory Write/Erase Characteristics
(1) Write / Erase time
(VCC = 1.65V to 3.6V, TA = - 40°C to + 85°C)
Parameter
Sector erase
time
Value
Typ*
Max*
1.1
2.7
Large Sector
Unit
s
Small Sector
0.3
Half word (16-bit)
write time
0.9
Remarks
Includes write time prior to internal
erase
Not including system-level overhead
time
Includes write time prior to internal
Chip erase time
6.8
18
s
erase
*: The typical value is immediately after shipment, the maximam value is guarantee value under 100,000 cycle
of erase/write.
30
528
μs
(2) Write cycles and data hold time
Erase/write cycles (cycle)
Data hold time (year)
1,000
20*
10,000
*: At average + 85C
June 10, 2015, MB9A140NB_DS706-00040-4v0-E
CONFIDENTIAL
Remarks
10*
97
D a t a S h e e t
8.
Return Time from Low-Power Consumption Mode
(1) Return Factor: Interrupt/WKUP
The return time from Low-Power consumption mode is indicated as follows. It is from receiving the
return factor to starting the program operation.
・ Return Count Time
(VCC = 1.65V to 3.6V, VDDI = 1.1V to 1.3V, VSS = 0V, TA = - 40°C to + 85°C)
Parameter
Symbol
Max*
Low-speed CR Timer mode
tICNT
Unit
40
80
μs
350
700
μs
690
880
μs
523
μs
603
μs
μs
RTC mode,
278
Stop mode
318
Deep Standby RTC mode
Deep Standby Stop mode
278
*: The maximum value depends on the accuracy of built-in CR.
Remarks
μs
tCYCC
Sleep mode
High-speed CR Timer mode,
Main Timer mode,
PLL Timer mode
Sub Timer mode
Value
Typ
523
When RAM is off
When RAM is on
・ Operation example of return from Low-Power consumption mode (by external interrupt*)
External
interrupt
Interrupt factor
accept
Active
tICNT
CPU
Operation
Interrupt factor
clear by CPU
Start
*: External interrupt is set to detecting fall edge.
98
CONFIDENTIAL
MB9A140NB_DS706-00040-4v0-E, June 10, 2015
D a t a S h e e t
・ Operation example of return from Low-Power consumption mode (by internal resource interrupt*)
Internal
resource
interrupt
Interrupt factor
accept
Active
tICNT
CPU
Operation
Interrupt factor
clear by CPU
Start
*: Internal resource interrupt is not included in return factor by the kind of Low-Power consumption mode.
Notes:
・ The return factor is different in each Low-Power consumption modes.
See Chapter 6: Low Power Consumption Mode and Operations of Standby Modes in FM3 Family
Peripheral Manual.
・ When interrupt recoveries, the operation mode that CPU recoveries depend on the state before the
Low-Power consumption mode transition. See Chapter 6: Low Power Consumption Mode in FM3
Family Peripheral Manual.
June 10, 2015, MB9A140NB_DS706-00040-4v0-E
CONFIDENTIAL
99
D a t a S h e e t
(2) Return Factor: Reset
The return time from Low-Power consumption mode is indicated as follows. It is from releasing reset to
starting the program operation.
・ Return Count Time
(VCC = 1.65V to 3.6V, VDDI = 1.1V to 1.3V, VSS = 0V, TA = - 40°C to + 85°C)
Parameter
Symbol
Value
Unit
Typ
Max*
148
263
μs
148
263
μs
258
483
μs
Sub Timer mode
322
516
μs
RTC/Stop mode
278
523
μs
603
523
μs
μs
Sleep mode
High-speed CR Timer mode,
Main Timer mode,
PLL Timer mode
Low-speed CR Timer mode
tRCNT
318
Deep Standby RTC mode
Deep Standby Stop mode
278
*: The maximum value depends on the accuracy of built-in CR.
Remarks
When RAM is off
When RAM is on
・ Operation example of return from Low-Power consumption mode (by INITX)
INITX
Internal reset
Reset active
Release
tRCNT
CPU
Operation
100
CONFIDENTIAL
Start
MB9A140NB_DS706-00040-4v0-E, June 10, 2015
D a t a S h e e t
・ Operation example of return from low power consumption mode (by internal resource reset*)
Internal
resource
reset
Internal reset
Reset active
Release
tRCNT
CPU
Operation
Start
*: Internal resource reset is not included in return factor by the kind of Low-Power consumption mode.
Notes:
・ The return factor is different in each Low-Power consumption modes.
See Chapter 6: Low Power Consumption Mode and Operations of Standby Modes in FM3 Family
Peripheral Manual.
・ When interrupt recoveries, the operation mode that CPU recoveries depend on the state before the
Low-Power consumption mode transition. See Chapter 6: Low Power Consumption Mode in FM3
Family Peripheral Manual.
・ The time during the power-on reset/low-voltage detection reset is excluded. See (6) Power-on
Reset Timing in 4. AC Characteristics in Electrical Characteristics for the detail on the time
during the power-on reset/low-voltage detection reset.
・ When in recovery from reset, CPU changes to the High-speed CR Run mode. When using the
main clock or the PLL clock, it is necessary to add the main clock oscillation stabilization wait
time or the Main PLL clock stabilization wait time.
・ The internal resource reset means the watchdog reset and the CSV reset.
June 10, 2015, MB9A140NB_DS706-00040-4v0-E
CONFIDENTIAL
101
D a t a S h e e t
Ordering Information
Part number
On-chip
Flash
memory
On-chip
SRAM
MB9AF141LBPMC1-G-JNE2
Main: 64 Kbyte
Work: 32 Kbyte
16 Kbyte
MB9AF142LBPMC1-G-JNE2
Main: 128 Kbyte
Work: 32 Kbyte
16 Kbyte
MB9AF144LBPMC1-G-JNE2
Main: 256 Kbyte
Work: 32 Kbyte
32 Kbyte
MB9AF141LBPMC-G-JNE2
Main: 64 Kbyte
Work: 32 Kbyte
16 Kbyte
MB9AF142LBPMC-G-JNE2
Main: 128 Kbyte
Work: 32 Kbyte
16 Kbyte
MB9AF144LBPMC-G-JNE2
Main: 256 Kbyte
Work: 32 Kbyte
32 Kbyte
MB9AF141LBQN-G-AVE2
Main: 64 Kbyte
Work: 32 Kbyte
16 Kbyte
MB9AF142LBQN-G-AVE2
Main: 128 Kbyte
Work: 32 Kbyte
16 Kbyte
MB9AF144LBQN-G-AVE2
Main: 256 Kbyte
Work: 32 Kbyte
32 Kbyte
MB9AF141MBPMC-G-JNE2
Main: 64 Kbyte
Work: 32 Kbyte
16 Kbyte
MB9AF142MBPMC-G-JNE2
Main: 128 Kbyte
Work: 32 Kbyte
16 Kbyte
MB9AF144MBPMC-G-JNE2
Main: 256 Kbyte
Work: 32 Kbyte
32 Kbyte
MB9AF141MBPMC1-G-JNE2
Main: 64 Kbyte
Work: 32 Kbyte
16 Kbyte
MB9AF142MBPMC1-G-JNE2
Main: 128 Kbyte
Work: 32 Kbyte
16 Kbyte
MB9AF144MBPMC1-G-JNE2
Main: 256 Kbyte
Work: 32 Kbyte
32 Kbyte
MB9AF141MBBGL-GE1
Main: 64 Kbyte
Work: 32 Kbyte
16 Kbyte
MB9AF142MBBGL-GE1
Main: 128 Kbyte
Work: 32 Kbyte
16 Kbyte
MB9AF144MBBGL-GE1
Main: 256 Kbyte
Work: 32 Kbyte
32 Kbyte
MB9AF141NBPMC-G-JNE2
Main: 64 Kbyte
Work: 32 Kbyte
16 Kbyte
MB9AF142NBPMC-G-JNE2
Main: 128 Kbyte
Work: 32 Kbyte
16 Kbyte
MB9AF144NBPMC-G-JNE2
Main: 256 Kbyte
Work: 32 Kbyte
32 Kbyte
102
CONFIDENTIAL
Package
Packing
Plastic LQFP 64-pin
(0.5mm pitch),
(FPT-64P-M38)
Plastic LQFP 64-pin
(0.65mm pitch),
(FPT-64P-M39)
Plastic QFN 64-pin
(0.5mm pitch),
(LCC-64P-M24)
Plastic LQFP 80-pin
(0.5mm pitch),
(FPT-80P-M37)
Tray
Plastic LQFP 80-pin
(0.65mm pitch),
(FPT-80P-M40)
Plastic PFBGA 96-pin
(0.5mm pitch),
(BGA-96P-M07)
Plastic LQFP 100-pin
(0.5mm pitch),
(FPT-100P-M23)
MB9A140NB_DS706-00040-4v0-E, June 10, 2015
D a t a S h e e t
On-chip
Flash
memory
On-chip
SRAM
MB9AF141NBPQC-G-JNE2
Main: 64 Kbyte
Work: 32 Kbyte
16 Kbyte
MB9AF142NBPQC-G-JNE2
Main: 128 Kbyte
Work: 32 Kbyte
16 Kbyte
MB9AF144NBPQC-G-JNE2
Main: 256 Kbyte
Work: 32 Kbyte
32 Kbyte
MB9AF141NBBGL-GE1
Main: 64 Kbyte
Work: 32 Kbyte
16 Kbyte
MB9AF142NBBGL-GE1
Main: 128 Kbyte
Work: 32 Kbyte
16 Kbyte
MB9AF144NBBGL-GE1
Main: 256 Kbyte
Work: 32 Kbyte
32 Kbyte
Part number
June 10, 2015, MB9A140NB_DS706-00040-4v0-E
CONFIDENTIAL
Package
Packing
Plastic QFP 100-pin
(0.65mm pitch),
(FPT-100P-M36)
Tray
Plastic PFBGA 112-pin
(0.8mm pitch),
(BGA-112P-M04)
103
D a t a S h e e t
Package Dimensions
100-pin plastic LQFP
Lead pitch
0.50 mm
Package width ×
package length
14.00 mm × 14.00 mm
Lead shape
Gullwing
Lead bend
direction
Normal bend
Sealing method
Plastic mold
Mounting height
1.70 mm MAX
Weight
0.65 g
(FPT-100P-M23)
100-pin plastic LQFP
(FPT-100P-M23)
Note 1) * : These dimensions do not include resin protrusion.
Note 2) Pins width and pins thickness include plating thickness.
Note 3) Pins width do not include tie bar cutting remainder.
16.00±0.20(.630±.008)SQ
*14.00±0.10(.551±.004)SQ
75
51
76
50
0.08(.003)
Details of "A" part
1.50 +0.20
- 0.10
(.059+.008
-.004)
(Mounting height)
INDEX
100
26
"A"
1
C
0.22±0.05
(.009±.002)
0.08(.003)
2009-2010 FUJITSU SEMICONDUCTOR LIMITED F100034S-c-3-4
104
CONFIDENTIAL
0.60±0.15
(.024±.006)
25
0.50(.020)
0°~8°
0.50±0.20
(.020±.008)
M
0.10±0.10
(.004±.004)
(Stand off)
0.25(.010)
0.145±0.055
(.006±.002)
Dimensions in mm (inches).
Note:The values in parentheses are reference values.
MB9A140NB_DS706-00040-4v0-E, June 10, 2015
D a t a S h e e t
100-pin plastic QFP
Lead pitch
0.65 mm
Package width ×
package length
14.00 mm × 20.00 mm
Lead shape
Gullwing
Sealing method
Plastic mold
Mounting height
3.35 mm MAX
Code
(Reference)
P-QFP100-14 × 20-0.65
(FPT-100P-M36)
100-pin plastic QFP
(FPT-100P-M36)
Note 1) * : These dimensions do not include resin protrusion.
Note 2) Pins width and pins thickness include plating thickness.
Note 3) Pins width do not include tie bar cutting remainder.
23.90±0.40(.941±.016)
* 20.00±0.20(.787±.008)
80
51
81
50
0.10(.004)
17.90± 0.40
(.705±.016)
*14.00±0.20
(.551±.008)
INDEX
Details of "A" part
100
1
30
0.65(.026)
0.32 ± 0.05
(.013±.002)
0.13(.005)
"A"
C
2011 FUJITSU SEMICONDUCTOR LIMITED HMbF100-36Sc-1-1
June 10, 2015, MB9A140NB_DS706-00040-4v0-E
CONFIDENTIAL
0.25(.010)
+0.35
3.00 –0.20
+.014
.118 –.008
(Mounting height)
0~8°
31
M
0.17 ± 0.06
(.007 ±. 002)
0.80 ± 0.20
(.031 ±. 008)
0.88 ± 0.15
(.035 ±. 006)
0.25 ± 0.20
(.010 ±. 008)
(Stand off)
Dimensions in mm (inches).
Note: The valuesin parentheses are reference values.
105
D a t a S h e e t
80-pin plastic LQFP
Lead pitch
0.50 mm
Package width ×
package length
12.00 mm × 12.00 mm
Lead shape
Gullwing
Lead bend
direction
Normal bend
Sealing method
Plastic mold
Mounting height
1.70 mm MAX
Weight
0.47 g
(FPT-80P-M37)
80-pin plastic LQFP
(FPT-80P-M37)
Note 1) * : These dimensions do not include resin protrusion.
Note 2) Pins width and pins thickness include plating thickness.
Note 3) Pins width do not include tie bar cutting remainder.
14.00± 0.20(.551 ± .008)SQ
*12.00± 0.10(.472 ± .004)SQ
60
0.145± 0.055
(.006 ± .002)
41
Details of "A" part
61
40
+0.20
1.50 –0.10
(Mounting height)
+.008
.059 –.004
0.25(.010)
0~8°
0.08(.003)
INDEX
80
0.50 ± 0.20
(.020 ± .008)
0.60 ± 0.15
(.024 ± .006)
0.10 ± 0.05
(.004 ± .002)
(Stand off)
21
"A"
1
20
0.50(.020)
0.22± 0.05
(.009± .002)
C
0.08(.003)
2009-2010 FUJITSU SEMICONDUCTOR LIMITED F80037S-c-1-2
106
CONFIDENTIAL
M
Dimensions in mm (inches).
Note: The values in parentheses are reference values.
MB9A140NB_DS706-00040-4v0-E, June 10, 2015
D a t a S h e e t
80-pin plastic LQFP
Lead pitch
0.65 mm
Package width ×
package length
14.00 mm × 14.00 mm
Lead shape
Gullwing
Sealing method
Plastic mold
Mounting height
1.60 mm Max.
Code
(Reference)
P-LQFP80-14 × 14-0.65
(FPT-80P-M40)
80-pin plastic LQFP
(FPT-80P-M40)
Note 1) * : These dimensions do not include resin protrusion.
Note 2) Pins width and pins thickness include plating thickness.
Note 3) Pins width do not include
16.00±0.20(.630±.008)SQ
*14.00±0.10(.551±.004)SQ
60
0.145±0.055
(.006±.002)
41
Details of "A" part
40
61
1.50±0.10
(.059±.004)
0.25(.010)
0.10(.004)
0˚~7˚
INDEX
0.50±0.20
(.020±.008)
21
80
0.65(.026)
C
0.60±0.15
(.024±.006)
20
1
0.32±0.06
(.013±.002)
0.13(.005)
M
2012 FUJITSU SEMICONDUCTOR LIMITED HMbF80-40Sc-1-1
June 10, 2015, MB9A140NB_DS706-00040-4v0-E
CONFIDENTIAL
0.10±0.05
(.004±.002)
Dimensions in mm (inches).
Note: The values in parentheses are reference values.
107
D a t a S h e e t
64-pin plastic LQFP
Lead pitch
0.50 mm
Package width ×
package length
10.00 mm × 10.00 mm
Lead shape
Gullwing
Lead bend
direction
Normal bend
Sealing method
Plastic mold
Mounting height
1.70 mm MAX
Weight
0.32 g
(FPT-64P-M38)
64-pin plastic LQFP
(FPT-64P-M38)
Note 1) * : These dimensions do not include resin protrusion.
Note 2) Pins width and pins thickness include plating thickness.
Note 3) Pins width do not include tie bar cutting remainder.
12.00±0.20(.472±.008)SQ
*10.00±0.10(.394±.004)SQ
48
0.145 ± 0.055
(.006 ± .002)
33
49
Details of "A" part
32
0.08(.003)
+0.20
1.50 –0.10
(Mounting height)
+.008
.059 –.004
0.25(.010)
0~8°
INDEX
64
17
1
0.22±0.05
(.009±.002)
0.08(.003)
2010 FUJITSU SEMICONDUCTOR LIMITED F64038S-c-1-2
108
CONFIDENTIAL
0.10 ± 0.10
(.004±.004)
(Stand off)
"A"
16
0.50(.020)
C
0.50±0.20
(.020±.008)
0.60 ± 0.15
(.024±.006)
M
Dimensions in mm (inches).
Note: The values in parentheses are reference values.
MB9A140NB_DS706-00040-4v0-E, June 10, 2015
D a t a S h e e t
64-pin plastic LQFP
Lead pitch
0.65 mm
Package width ×
package length
12.00 mm × 12.00 mm
Lead shape
Gullwing
Sealing method
Plastic mold
Mounting height
1.70 mm MAX
Weight
0.47 g
(FPT-64P-M39)
64-pin plastic LQFP
(FPT-64P-M39)
Note 1) Pins width and pins thickness include plating thickness.
14.00±0.20(.551±.008)SQ
12.00±0.10(.472±.004)SQ
48
0.145±0.055
(.006±.002)
33
Details of "A" part
32
49
+0.20
1.50 –0.10
+.008
.059 –.004
0.10(.004)
INDEX
1
16
0.65(.026)
C
0.50±0.20
(.020±.008)
0.60±0.15
(.024±.006)
17
64
0.32±0.05
(.013±.002)
CONFIDENTIAL
0.10±0.10
(.004±.004)
0.25(.010)BSC
"A"
0.13(.005)
M
2010-2011 FUJITSU SEMICONDUCTOR LIMITED HMbF64-39Sc-2-2
June 10, 2015, MB9A140NB_DS706-00040-4v0-E
0~8˚
Dimensions in mm (inches).
Note: The values in parentheses are reference values.
109
D a t a S h e e t
64-pin plastic QFN
Lead pitch
0.50 mm
Package width ×
package length
9.00 mm × 9.00 mm
Sealing method
Plastic mold
Mounting height
0.90 mm MAX
Weight
-
(LCC-64P-M24)
64-pin plastic QFN
(LCC-64P-M24)
9.00±0.10
(.354±.004)
6.00±0.10
(.236±.004)
9.00±0.10
(.354±.004)
0.25±0.05
(.010±.002)
6.00±0.10
(.236±.004)
INDEX AREA
0.45 (.018)
1PIN ID
(0.20R (.008R))
0.85±0.05
(.033±.002)
0.05 (.002) MAX
C
CONFIDENTIAL
0.40±0.05
(.016±.002)
(0.20 (.008))
2011 FUJITSU SEMICONDUCTOR LIMITED HMbC64-24Sc-2-1
110
0.50 (.020)
(TYP)
Dimensions in mm (inches).
Note: The values in parentheses are reference values.
MB9A140NB_DS706-00040-4v0-E, June 10, 2015
D a t a S h e e t
112-ball plastic PFBGA
Ball pitch
0.80 mm
Package width ×
package length
10.00 × 10.00 mm
Lead shape
Soldering ball
Sealing method
Plastic mold
Ball size
Ф 0.45 mm
Mounting height
1.45 mm Max.
Weight
0.22 g
(BGA-112P-M04)
112-ball plastic PFBGA
(BGA-112P-M04)
10.00±0.10(.394±.004)
0.20(.008) S B
0.80(.031)
REF
B
11
10
9
8
7
6
5
4
3
2
0.80(.031)
REF
A
10.00±0.10
(.394±.004)
1
L K J H G F
(INDEX AREA)
0.35±0.10
(.014±.004)
(Stand off)
0.20(.008) S A
1.25±0.20
(.049±.008)
(Seated height)
ED C B A
INDEX
112-Ф0.45±010
(112-Ф0.18±.004)
Ф0.08(.003) M S A B
S
0.10(.004) S
C
2003-2010 FUJITSU SEMICONDUCTOR LIMITED B112004S-c-2-3
June 10, 2015, MB9A140NB_DS706-00040-4v0-E
CONFIDENTIAL
Dimensions in mm (inches).
Note: The values in parentheses are reference values.
111
D a t a S h e e t
96-pin plastic FBGA
Lead pitch
0.5 mm
Package width ×
package length
6.00 mm × 6.00 mm
Lead shape
Ball
Sealing method
Plastic mold
Mounting height
1.30 mm MAX
Weight
0.08 g
(BGA-96P-M07)
96-pin plastic FBGA
(BGA-96P-M07)
6.00±0.10(.236±.004)
5.00(.197)
REF
B
0.20(.008) S B
0.50
(.020)
TYP
11
10
9
8
A
7
5.00(.197)
REF
6.00±0.10
(.236±.004)
6
5
0.50(.020)
TYP
4
3
2
1
L
K
J
H G F E D C B A
(INDEX AREA)
INDEX
0.20(.008) S A
96-ø0.30±0.10
(96-ø.012±.004)
ø0.05(.002)
M
S A B
S
0.08(.003) S
C
2012 FUJITSU SEMICONDUCTOR LIMITED B96007S-c-1-1
112
CONFIDENTIAL
1.15±0.15
(Seated height)
(.045±.006)
0.25±0.10
(Stand off)
(.010±.004)
Dimensions in mm (inches).
Note: The values in parentheses are reference values.
MB9A140NB_DS706-00040-4v0-E, June 10, 2015
D a t a S h e e t
Major Changes
Page
Section
Revision 2.0
FEATURE
2
On-chip Memories
5
Unique ID
PRODUCT LINEUP
6
Function
48
HANDLING DEVICES
MEMORY MAP
53
Memory Map (2)
PIN STATUS IN EACH CPU STATE
58
List of Pin Status
ELECTRICAL CHARACTERISTICS
65
3.DC Characteristics
(1) Current rating
4.AC Characteristics
69
(3) Built-in CR Oscillation Characteristics
Built-in high-speed CR
(7) External Bus Timing
73, 74
Separate Bus Access Asynchronous
SRAM Mode
75
Separate Bus Access Synchronous SRAM Mode
80, 82,
(9) CSIO Timing
84, 86
89
(11) I2C Timing
92
5. 12-bit A/D Converter
• Electrical Characteristics for the A/D Converter
94
• Definition of 12-bit A/D Converter Terms
95
6. Low-Voltage Detection Characteristics
(1) Low-Voltage Detection Reset
96
(2) Interrupt of Low-Voltage Detection
Revision 2.1
Revision 3.0
-
-
-
-
2
3
6
51
52
63
64,65
86
FEATURES
•External Bus Interface
•Multi-function Serial Interface
PRODUCT LINEUP
•Function
BLOCK DIAGRAM
MEMORY MAP
•Memory Map (1)
ELECTRICAL CHARACTERISTICS
2.Recommended Operating Conditions
3.DC Characteristics
(1)Current rating
(9)CSIO Timing
•Synchronous serial (SPI=1, SCINV=1)
(9) CSIO Timing
• External clock(EXT=1):asyntironous only
(12)I2C Timing
88
June 10, 2015, MB9A140NB_DS706-00040-4v0-E
CONFIDENTIAL
Change Results
Revised the descriptions of [Flash memory].
Added the descriptions of "Unique ID".
Added the descriptions.
Revised the Pin status type of "I".
Revised the descriptions of Power supply current.
Added the "Flash memory write/erase current".
Added the footnote.
Revised the table and the footnote.
Revised the table and the figure.
Revised the title to "CSIO Timing".
Revised the note.
Revised the footnote.
• Revised the parameter.
• Revised the symbol.
• Corrected the value.
• Revised the parameter.
• Revised the symbol.
• Corrected "Conditions" and "Value" in the table.
• Added the Item.
• Added the footnote.
Added the Item.
Company name and layout design change
Corrected the Series name.
MB9A140NA Series → MB9A140NB Series
Corrected the Product name as follows.
MB9AF144LB, MB9AF142LB, MB9AF141LB
MB9AF144MB, MB9AF142MB, MB9AF141MB
MB9AF144NB, MB9AF142NB, MB9AF141NB
Added the Item.
• Maximum area size : Up to 256 Mbytes
Corrected the description of "I2C"
Added the footnote
Corrected the figure
Corrected the address "External Device Area"
Add the footnote
•Corrected the Condition
•Delete the minmun value
•Corrected the remarks
•Add the footnote
Corrected the figure of "MS bit=1"
Corrected the figure
Corrected the description as follows.
•Typical mode → Standard-mode
•High-speed mode→ Fast-mode
113
D a t a S h e e t
Page
91
Section
5.12-bit A/D Converter
•Electrical Characteristics for
the A/D Converter
ORDERING INFORMATON
98
Revision 4.0
Memory Map
53
· Memory map(2)
Electrical Characteristics
64 - 66
3. DC Characteristics
(1) Current rating
Electrical Characteristics
67
3. DC Characteristics
(2) Pin Characteristics
Electrical Characteristics
4. AC Characteristics
70
(4-1) Operating Conditions of Main PLL
(4-2) Operating Conditions of Main PLL
Electrical Characteristics
71
4. AC Characteristics
(6) Power-on Reset Timing
Electrical Characteristics
80 - 87
4. AC Characteristics
(9) CSIO/UART Timing
92
98 - 101
102, 103
114
CONFIDENTIAL
Electrical Characteristics
5. 12bit A/D Converter
Electrical Characteristics
8. Return Time from Low-Power Consumption
Mode
Ordering Information
Change Results
•Corrected the terminal name
AN00 ~ AN23 → ANxx
•Corrected the minmum value of "Sampling time"
•Corrected the max and min value of "State transition time to
oprerationpermission"
•Corrected the footnote
Corrected the "Part number"
Added the summary of Flash memory sector and the note
· Changed the table format
· Added Main Timer mode current
· Moved A/D Converter Current
Added input leak current of CEC pin at power off.
Added the figure of Main PLL connection
· Added Time until releasing Power-on reset
· Changed the figure of timing
· Modified from UART Timing to CSIO/UART Timing
· Changed from Internal shift clock operation to Master mode
· Changed from External shift clock operation to Slave mode
· Added the typical value of Integral Nonlinearity, Differential
Nonlinearity, Zero transition voltage and Full-scale transition voltage
· Added Conversion time at AVcc < 2.7V
Added Return Time from Low-Power Consumption Mode
Changed notation of part number
MB9A140NB_DS706-00040-4v0-E, June 10, 2015
D a t a S h e e t
June 10, 2015, MB9A140NB_DS706-00040-4v0-E
CONFIDENTIAL
115
D a t a S h e e t
116
CONFIDENTIAL
MB9A140NB_DS706-00040-4v0-E, June 10, 2015
D a t a S h e e t
June 10, 2015, MB9A140NB_DS706-00040-4v0-E
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117
D a t a S h e e t
Colophon
The products described in this document are designed, developed and manufactured as contemplated for general use,
including without limitation, ordinary industrial use, general office use, personal use, and household use, but are not
designed, developed and manufactured as contemplated (1) for any use that includes fatal risks or dangers that, unless
extremely high safety is secured, could have a serious effect to the public, and could lead directly to death, personal injury,
severe physical damage or other loss (i.e., nuclear reaction control in nuclear facility, aircraft flight control, air traffic
control, mass transport control, medical life support system, missile launch control in weapon system), or (2) for any use
where chance of failure is intolerable (i.e., submersible repeater and artificial satellite). Please note that Spansion will not
be liable to you and/or any third party for any claims or damages arising in connection with above-mentioned uses of the
products. Any semiconductor devices have an inherent chance of failure. You must protect against injury, damage or loss
from such failures by incorporating safety design measures into your facility and equipment such as redundancy, fire
protection, and prevention of over-current levels and other abnormal operating conditions. If any products described in
this document represent goods or technologies subject to certain restrictions on export under the Foreign Exchange and
Foreign Trade Law of Japan, the US Export Administration Regulations or the applicable laws of any other country, the
prior authorization by the respective government entity will be required for export of those products.
Trademarks and Notice
The contents of this document are subject to change without notice. This document may contain information on a
Spansion product under development by Spansion. Spansion reserves the right to change or discontinue work on any
product without notice. The information in this document is provided as is without warranty or guarantee of any kind as to
its accuracy, completeness, operability, fitness for particular purpose, merchantability, non-infringement of third-party
rights, or any other warranty, express, implied, or statutory. Spansion assumes no liability for any damages of any kind
arising out of the use of the information in this document.
Copyright © 2013-2015 Cypress All rights reserved. Spansion®, the Spansion logo, MirrorBit®, MirrorBit® EclipseTM,
ORNANDTM, Easy DesignSimTM, TraveoTM and combinations thereof, are trademarks and registered trademarks of
Spansion LLC in the United States and other countries. Other names used are for informational purposes only and may be
trademarks of their respective owners.
118
CONFIDENTIAL
MB9A140NB_DS706-00040-4v0-E, June 10, 2015