Murata GCM216 Chip monolithic ceramic capacitors for automotive Datasheet

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Chip Monolithic
Ceramic Capacitors
for Automotive
Cat.No.C03E-4
C03E.pdf
10.5.20
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o Part Numbering
Chip Monolithic Ceramic Capacitors
(Part Number)
GC
M
18
8
q
w
e
r t
R7 1H
y
102
K
u
i
A37 D
o
!0
rDimension (T)
qProduct ID
wSeries
Product ID
Code
Dimension (T)
Code
Series
3
0.3mm
J
Soft Termination Type Power-train, Safety Equipment
5
0.5mm
M
Power-train, Safety Equipment
6
0.6mm
GC
eDimension (LgW)
8
0.8mm
9
0.85mm
Code
Dimension (LgW)
EIA
A
1.0mm
03
0.6g0.3mm
0201
B
1.25mm
15
1.0g0.5mm
0402
C
1.6mm
18
1.6g0.8mm
0603
D
2.0mm
21
2.0g1.25mm
0805
E
2.5mm
31
3.2g1.6mm
1206
M
1.15mm
32
3.2g2.5mm
1210
N
1.35mm
43
4.5g3.2mm
1812
Q
1.5mm
55
5.7g5.0mm
2220
R
1.8mm
X
Depends on individual standards.
tTemperature Characteristics
Temperature Characteristic Codes
Code
Temperature Characteristics
Public STD Code
Reference
Temperature
Temperature
Range
Operating
Temperature
Range
Capacitance Change or
Temperature Coefficient
5C
C0G
EIA
25°C
25 to 125°C
0±30ppm/°C
-55 to 125°C
7U
U2J
EIA
25°C
25 to 125°C
-750±120ppm/°C
-55 to 125°C
C7
X7S
EIA
25°C
-55 to 125°C
±22%
-55 to 125°C
R7
X7R
EIA
25°C
-55 to 125°C
±15%
-55 to 125°C
oCapacitance Change from each temperature
Capacitance Change from 25°C (%)
Murata Code
–55°C
–30°C
–10°C
Max.
Min.
Max.
Min.
Max.
Min.
5C
0.58
–0.24
0.40
–0.17
0.25
–0.11
7U
8.78
5.04
6.04
3.47
3.84
2.21
uCapacitance
yRated Voltage
Expressed by three-digit alphanumerics. The unit is pico-farad
(pF). The first and second figures are significant digits, and the
third figure expresses the number of zeros which follow the two
numbers.
If there is a decimal point, it is expressed by the capital letter "R".
In this case, all figures are significant digits.
Code
Rated Voltage
0J
DC6.3V
1A
DC10V
1C
DC16V
1E
DC25V
YA
DC35V
Code
Capacitance
1H
DC50V
R50
0.5pF
2A
DC100V
1R0
1.0pF
2E
DC250V
100
10pF
2J
DC630V
103
10000pF
Ex.)
Continued on the following page.
2
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• Please
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this catalog
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!Note • This
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10.5.20
sales representatives
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• This catalog
has only
typical specifications
because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
Continued from the preceding page.
iCapacitance Tolerance
Capacitance Step
Code
Capacitance Tolerance
TC
Series
C
±0.25pF
C0G
GCM
V5pF
E12, 1pF Step *
D
±0.5pF
C0G
GCM
6.0 to 9.0pF
E12, 1pF Step *
C0G
GCM
U10pF
E12 Step
U2J
GCM
J
±5%
K
±10%
X7S, X7R
GCJ/GCM
E6 Step
M
±20%
X7S, X7R
GCM
E6 Step
E12 Step
* E24 series is also available.
oIndividual Specification Code
Expressed by three figures.
!0Package
Code
Package
L
ø180mm Embossed Taping
D
ø180mm Paper Taping
K
ø330mm Embossed Taping
J
ø330mm Paper Taping
B
Bulk
C
Bulk Case
3
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Chip Monolithic Ceramic Capacitors for Automotive
1
for Automotive GCM Series
e
g
e
1. The GCM series meet AEC-Q200 requirements.
2. Higher resistance of solder-leaching due to
the Ni-barriered termination, applicable for
reflow-soldering, and flow-soldering
(GCM18/21/31 type only).
3. The operating temperature range of R7/C7/5C
series: -55 to 125 degree C.
4. A wide selection of sizes is available, from
miniature LxWxT:0.6x0.3x0.3mm to LxWxT:
3.2x2.5x2.5mm.
5. The GCM series is available in paper or embossed
tape and reel packaging for automatic placement.
6. The GCM series is lead free product.
■ Applications
T
■ Features
L
Part Number
GCM033
GCM155
GCM188*
GCM216
GCM219
GCM21B
GCM319
GCM31M
GCM31C
GCM32N
GCM32R
GCM32D
GCM32E
W
Dimensions (mm)
L
W
T
e
g min.
0.6 ±0.03 0.3 ±0.03 0.3 ±0.03 0.1 to 0.2
0.2
1.0 ±0.05 0.5 ±0.05 0.5 ±0.05 0.15 to 0.35 0.3
0.8 ±0.1 0.2 to 0.5
1.6 ±0.1 0.8 ±0.1
0.5
0.6 ±0.1
2.0 ±0.15 1.25 ±0.15 0.85 ±0.1 0.2 to 0.7
0.7
1.25 ±0.15
0.85 ±0.1
3.2 ±0.15 1.6 ±0.15
1.15 ±0.1 0.3 to 0.8
1.5
1.6 ±0.2
3.2 ±0.2 1.6 ±0.2
1.35 ±0.15
1.8 ±0.2
0.3 min.
1.0
3.2 ±0.3 2.5 ±0.2
2.0 ±0.2
2.5 ±0.2
Case: 1.6 ±0.07(L)g0.8 ±0.07(W)g0.8 ±0.07(T)
* Bulk
The figure indicates typical specification.
Automotive electronic equipment (Power-train,
safety equipment)
5
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!Note • This
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C03E.pdf
10.5.20
sales representatives
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• This catalog
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Capacitance Table
1
Temperature Compensating Type C0G(5C)
6
ex.6: T Dimension Part Number Code
LxW 0.6x0.3 1.0x0.5 1.6x0.8 2.0x1.25 3.2x1.6
(03) (15) (18)
(21)
(31)
[mm] <0201> <0402> <0603> <0805> <1206>
Rated Voltage 25 50 100 50 100 50 100 50
[Vdc] (1E) (1H) (2A) (1H) (2A) (1H) (2A) (1H)
Capacitance
1.0pF(1R0)
2.0pF(2R0)
3.0pF(3R0)
4.0pF(4R0)
5.0pF(5R0)
6.0pF(6R0)
7.0pF(7R0)
8.0pF(8R0)
9.0pF(9R0)
10pF(100)
12pF(120)
15pF(150)
18pF(180)
22pF(220)
27pF(270)
33pF(330)
39pF(390)
47pF(470)
56pF(560)
68pF(680)
82pF(820)
100pF(101)
120pF(121)
150pF(151)
180pF(181)
220pF(221)
270pF(271)
330pF(331)
390pF(391)
470pF(471)
560pF(561)
680pF(681)
820pF(821)
1000pF(102)
1200pF(122)
1500pF(152)
1800pF(182)
2200pF(222)
2700pF(272)
3300pF(332)
3900pF(392)
4700pF(472)
5600pF(562)
6800pF(682)
8200pF(822)
10000pF(103)
12000pF(123)
15000pF(153)
18000pF(183)
22000pF(223)
27000pF(273)
33000pF(333)
39000pF(393)
47000pF(473)
56000pF(563)
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
9
9
9
9
9
9
B
B
9
9
9
9
9
9
9
9
9
9
9
9
9
9
9
9
9
9
9
9
9
9
M
M
The part numbering code is shown in ( ) and Unit is shown in [ ].
4
6
< >: EIA [inch] Code
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• This catalog
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Capacitance Table
1
High Dielectric Constant Type X7R(R7)/X7S(C7)
6
LxW
[mm]
0.6x0.3
(03)
<0201>
1.0x0.5
(15)
<0402>
1.6x0.8
(18)
<0603>
2.0x1.25
(21)
<0805>
ex.6: T Dimension Part Number Code
3.2x1.6
(31)
<1206>
3.2x2.5
(32)
<1210>
Rated Voltage 25 16 10 100 50 25 16 100 50 25 16 6.3 100 50 35 25 16 10 6.3 100 50 25 16 10 6.3 100 50 25 16 10 6.3
[Vdc] (1E) (1C) (1A) (2A) (1H) (1E) (1C) (2A) (1H) (1E) (1C) (0J) (2A) (1H) (YA) (1E) (1C) (1A) (0J) (2A) (1H) (1E) (1C) (1A) (0J) (2A) (1H) (1E) (1C) (1A) (0J)
Capacitance
100pF(101)
3
150pF(151)
3
220pF(221)
3
5
5
330pF(331)
3
5
5
470pF(471)
3
5
5
680pF(681)
3
5
5
1000pF(102)
3
5
5
8
8
1500pF(152)
3
5
5
8
8
5
5
8
8
5
5
8
8
5
5
8
8
8
2200pF(222)
3
3300pF(332)
3
4700pF(472)
3
6800pF(682)
3
5
8
6
10000pF(103)
3
5
5
8
8
6
15000pF(153)
5
5
8
8
6
22000pF(223)
5
5
8
8
6
33000pF(333)
5
5
8
8
9
9
47000pF(473)
5
5
8
8
B
B
8
8
B
B
8
8
B
B
0.15µF(154)
8
8
0.22µF(224)
8
8
68000pF(683)
5
0.10µF(104)
5
8
0.33µF(334)
0.47µF(474)
8
0.68µF(684)
1.0µF(105)
2.2µF(225)
8
8
B
M
M
B
B
8
9
B
8
B
9
M
M
8
B
B
9
M
8
B
B
9
M
B
B
B
B
B
8
4.7µF(475)
10µF(106)
C
E
D
M
C
B
22µF(226)
C
C
E
D
E
C
C
47µF(476)
The part numbering code is shown in ( ) and Unit is shown in [ ].
9
B
D
E
E
E
< >: EIA [inch] Code
5
7
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1
Temperature Compensating Type
L x W [mm]
0.6x0.3(03)<0201>
1.0x0.5(15)<0402>
25(1E)
50(1H)
Rated Volt. [Vdc]
50(1H)
C0G(5C)
TC
Capacitance
Tolerance
Part Number
1.0pF(1R0)
±0.25pF(C)
GCM0335C1E1R0CD03D
GCM1555C1H1R0CZ13D
GCM1885C2A1R0CZ13D
GCM1885C1H1R0CZ13D
2.0pF(2R0)
±0.25pF(C)
GCM0335C1E2R0CD03D
GCM1555C1H2R0CZ13D
GCM1885C2A2R0CZ13D
GCM1885C1H2R0CZ13D
3.0pF(3R0)
±0.25pF(C)
GCM0335C1E3R0CD03D
GCM1555C1H3R0CZ13D
GCM1885C2A3R0CZ13D
GCM1885C1H3R0CZ13D
4.0pF(4R0)
±0.25pF(C)
GCM0335C1E4R0CD03D
GCM1555C1H4R0CZ13D
GCM1885C2A4R0CZ13D
GCM1885C1H4R0CZ13D
5.0pF(5R0)
±0.25pF(C)
GCM0335C1E5R0CD03D
GCM1555C1H5R0CZ13D
GCM1885C2A5R0CZ13D
GCM1885C1H5R0CZ13D
6.0pF(6R0)
±0.5pF(D)
GCM0335C1E6R0DD03D
GCM1555C1H6R0DZ13D
GCM1885C2A6R0DZ13D
GCM1885C1H6R0DZ13D
7.0pF(7R0)
±0.5pF(D)
GCM0335C1E7R0DD03D
GCM1555C1H7R0DZ13D
GCM1885C2A7R0DZ13D
GCM1885C1H7R0DZ13D
8.0pF(8R0)
±0.5pF(D)
GCM0335C1E8R0DD03D
GCM1555C1H8R0DZ13D
GCM1885C2A8R0DZ13D
GCM1885C1H8R0DZ13D
9.0pF(9R0)
±0.5pF(D)
GCM0335C1E9R0DD03D
GCM1555C1H9R0DZ13D
GCM1885C2A9R0DZ13D
GCM1885C1H9R0DZ13D
10pF(100)
±5%(J)
GCM0335C1E100JD03D
GCM1555C1H100JZ13D
GCM1885C2A100JA16D
GCM1885C1H100JA16D
12pF(120)
±5%(J)
GCM0335C1E120JD03D
GCM1555C1H120JZ13D
GCM1885C2A120JA16D
GCM1885C1H120JA16D
15pF(150)
±5%(J)
GCM0335C1E150JD03D
GCM1555C1H150JZ13D
GCM1885C2A150JA16D
GCM1885C1H150JA16D
18pF(180)
±5%(J)
GCM0335C1E180JD03D
GCM1555C1H180JZ13D
GCM1885C2A180JA16D
GCM1885C1H180JA16D
22pF(220)
±5%(J)
GCM0335C1E220JD03D
GCM1555C1H220JZ13D
GCM1885C2A220JA16D
GCM1885C1H220JA16D
27pF(270)
±5%(J)
GCM0335C1E270JD03D
GCM1555C1H270JZ13D
GCM1885C2A270JA16D
GCM1885C1H270JA16D
33pF(330)
±5%(J)
GCM0335C1E330JD03D
GCM1555C1H330JZ13D
GCM1885C2A330JA16D
GCM1885C1H330JA16D
39pF(390)
±5%(J)
GCM0335C1E390JD03D
GCM1555C1H390JZ13D
GCM1885C2A390JA16D
GCM1885C1H390JA16D
47pF(470)
±5%(J)
GCM0335C1E470JD03D
GCM1555C1H470JZ13D
GCM1885C2A470JA16D
GCM1885C1H470JA16D
56pF(560)
±5%(J)
GCM0335C1E560JD03D
GCM1555C1H560JZ13D
GCM1885C2A560JA16D
GCM1885C1H560JA16D
68pF(680)
±5%(J)
GCM0335C1E680JD03D
GCM1555C1H680JZ13D
GCM1885C2A680JA16D
GCM1885C1H680JA16D
82pF(820)
±5%(J)
GCM0335C1E820JD03D
GCM1555C1H820JZ13D
GCM1885C2A820JA16D
GCM1885C1H820JA16D
100pF(101)
±5%(J)
GCM0335C1E101JD03D
GCM1555C1H101JZ13D
GCM1885C2A101JA16D
GCM1885C1H101JA16D
120pF(121)
±5%(J)
GCM1555C1H121JA16D
GCM1885C2A121JA16D
GCM1885C1H121JA16D
150pF(151)
±5%(J)
GCM1555C1H151JA16D
GCM1885C2A151JA16D
GCM1885C1H151JA16D
180pF(181)
±5%(J)
GCM1555C1H181JA16D
GCM1885C2A181JA16D
GCM1885C1H181JA16D
220pF(221)
±5%(J)
GCM1555C1H221JA16D
GCM1885C2A221JA16D
GCM1885C1H221JA16D
270pF(271)
±5%(J)
GCM1555C1H271JA16D
GCM1885C2A271JA16D
GCM1885C1H271JA16D
330pF(331)
±5%(J)
GCM1555C1H331JA16D
GCM1885C2A331JA16D
GCM1885C1H331JA16D
390pF(391)
±5%(J)
GCM1555C1H391JA16D
GCM1885C2A391JA16D
GCM1885C1H391JA16D
470pF(471)
±5%(J)
GCM1555C1H471JA16D
GCM1885C2A471JA16D
GCM1885C1H471JA16D
560pF(561)
±5%(J)
GCM1885C2A561JA16D
GCM1885C1H561JA16D
680pF(681)
±5%(J)
GCM1885C2A681JA16D
GCM1885C1H681JA16D
820pF(821)
±5%(J)
GCM1885C2A821JA16D
GCM1885C1H821JA16D
1000pF(102)
±5%(J)
GCM1885C2A102JA16D
GCM1885C1H102JA16D
1200pF(122)
±5%(J)
GCM1885C2A122JA16D
GCM1885C1H122JA16D
1500pF(152)
±5%(J)
GCM1885C2A152JA16D
GCM1885C1H152JA16D
1800pF(182)
±5%(J)
GCM1885C1H182JA16D
2200pF(222)
±5%(J)
GCM1885C1H222JA16D
2700pF(272)
±5%(J)
GCM1885C1H272JA16D
3300pF(332)
±5%(J)
GCM1885C1H332JA16D
3900pF(392)
±5%(J)
GCM1885C1H392JA16D
The part numbering code is shown in ( ) and Unit is shown in [ ].
(Part Number) GC
M
03
3
5C 1E
q
w
e
r t
y
1R0
C
u
i
< >: EIA [inch] Code
D03 D
o
!0
qProduct ID
wSeries
tTemperature Characteristics
iCapacitance Tolerance
Packaging Code in Part Number is a code shows STD 180mm Reel Taping.
8
1.6x0.8(18)<0603>
100(2A)
eDimension (LgW)
yRated Voltage
oIndividual Specification Code
rDimension (T)
uCapacitance
!0Package
PDF catalog
is downloaded
from!CAUTION
the website (for
of Murata
Manufacturing
co., ltd.
Therefore,
it’s specifications
areinsubject
to change
or oursmoking
productsand/or
in it may
be discontinued
without advance notice. Please check with our
• Please
read rating and
storage,
operating, rating,
soldering,
mounting
and handling)
this catalog
to prevent
burning,
etc.
!Note • This
!Note
C03E.pdf
10.5.20
sales representatives
or product
engineers
before ordering.
• This catalog
has only
typical specifications
because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
1
Temperature Compensating Type
2.0x1.25(21)<0805>
L x W [mm]
100(2A)
Rated Volt. [Vdc]
3.2x1.6(31)<1206>
50(1H)
100(2A)
50(1H)
C0G(5C)
TC
Capacitance
Tolerance
Part Number
100pF(101)
±5%(J)
GCM2165C2A101JA16D
120pF(121)
±5%(J)
GCM2165C2A121JA16D
150pF(151)
±5%(J)
GCM2165C2A151JA16D
180pF(181)
±5%(J)
GCM2165C2A181JA16D
220pF(221)
±5%(J)
GCM2165C2A221JA16D
270pF(271)
±5%(J)
GCM2165C2A271JA16D
330pF(331)
±5%(J)
GCM2165C2A331JA16D
390pF(391)
±5%(J)
GCM2165C2A391JA16D
470pF(471)
±5%(J)
GCM2165C2A471JA16D
560pF(561)
±5%(J)
GCM2165C2A561JA16D
GCM2165C1H561JA16D
680pF(681)
±5%(J)
GCM2165C2A681JA16D
GCM2165C1H681JA16D
820pF(821)
±5%(J)
GCM2165C2A821JA16D
GCM2165C1H821JA16D
1000pF(102)
±5%(J)
GCM2165C2A102JA16D
GCM2165C1H102JA16D
1200pF(122)
±5%(J)
GCM2165C2A122JA16D
GCM2165C1H122JA16D
1500pF(152)
±5%(J)
GCM2165C2A152JA16D
GCM2165C1H152JA16D
1800pF(182)
±5%(J)
GCM2165C2A182JA16D
GCM2165C1H182JA16D
GCM3195C2A182JA16D
2200pF(222)
±5%(J)
GCM2165C2A222JA16D
GCM2165C1H222JA16D
GCM3195C2A222JA16D
2700pF(272)
±5%(J)
GCM2165C2A272JA16D
GCM2165C1H272JA16D
GCM3195C2A272JA16D
3300pF(332)
±5%(J)
GCM2165C2A332JA16D
GCM2165C1H332JA16D
GCM3195C2A332JA16D
3900pF(392)
±5%(J)
GCM2165C1H392JA16D
GCM3195C2A392JA16D
4700pF(472)
±5%(J)
GCM2165C1H472JA16D
GCM3195C2A472JA16D
GCM3195C1H472JA16D
5600pF(562)
±5%(J)
GCM2195C1H562JA16D
GCM3195C2A562JA16D
GCM3195C1H562JA16D
6800pF(682)
±5%(J)
GCM2195C1H682JA16D
GCM3195C2A682JA16D
GCM3195C1H682JA16D
8200pF(822)
±5%(J)
GCM2195C1H822JA16D
GCM3195C2A822JA16D
GCM3195C1H822JA16D
10000pF(103)
±5%(J)
GCM2195C1H103JA16D
GCM3195C2A103JA16D
GCM3195C1H103JA16D
12000pF(123)
±5%(J)
GCM2195C1H123JA16D
GCM3195C1H123JA16D
15000pF(153)
±5%(J)
GCM2195C1H153JA16D
GCM3195C1H153JA16D
18000pF(183)
±5%(J)
GCM21B5C1H183JA16L
GCM3195C1H183JA16D
22000pF(223)
±5%(J)
GCM21B5C1H223JA16L
GCM3195C1H223JA16D
27000pF(273)
±5%(J)
GCM3195C1H273JA16D
33000pF(333)
±5%(J)
GCM3195C1H333JA16D
39000pF(393)
±5%(J)
GCM3195C1H393JA16D
47000pF(473)
±5%(J)
GCM31M5C1H473JA16L
56000pF(563)
±5%(J)
GCM31M5C1H563JA16L
The part numbering code is shown in ( ) and Unit is shown in [ ].
< >: EIA [inch] Code
9
PDF catalog
is downloaded
from!CAUTION
the website (for
of Murata
Manufacturing
co., ltd.
Therefore,
it’s specifications
areinsubject
to change
or oursmoking
productsand/or
in it may
be discontinued
without advance notice. Please check with our
• Please
read rating and
storage,
operating, rating,
soldering,
mounting
and handling)
this catalog
to prevent
burning,
etc.
!Note • This
!Note
C03E.pdf
10.5.20
sales representatives
or product
engineers
before ordering.
• This catalog
has only
typical specifications
because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
1
High Dielectric Constant Type
0.6x0.3(03)<0201>
L x W [mm]
25(1E)
Rated Volt. [Vdc]
16(1C)
Capacitance
Tolerance
Part Number
100pF(101)
±10%(K)
GCM033R71E101KA03D
150pF(151)
±10%(K)
GCM033R71E151KA03D
220pF(221)
±10%(K)
GCM033R71E221KA03D
330pF(331)
±10%(K)
GCM033R71E331KA03D
470pF(471)
±10%(K)
GCM033R71E471KA03D
680pF(681)
±10%(K)
GCM033R71E681KA03D
1000pF(102)
±10%(K)
GCM033R71E102KA03D
1500pF(152)
±10%(K)
GCM033R71E152KA03D
2200pF(222)
±10%(K)
GCM033R71C222KA55D
3300pF(332)
±10%(K)
GCM033R71C332KA55D
4700pF(472)
±10%(K)
GCM033R71A472KA03D
6800pF(682)
±10%(K)
GCM033R71A682KA03D
10000pF(103)
±10%(K)
GCM033R71A103KA03D
1.0x0.5(15)<0402>
L x W [mm]
100(2A)
Rated Volt. [Vdc]
50(1H)
25(1E)
16(1C)
X7R(R7)
TC
Capacitance
Tolerance
Part Number
220pF(221)
±10%(K)
GCM155R72A221KA37D
GCM155R71H221KA37D
330pF(331)
±10%(K)
GCM155R72A331KA37D
GCM155R71H331KA37D
470pF(471)
±10%(K)
GCM155R72A471KA37D
GCM155R71H471KA37D
680pF(681)
±10%(K)
GCM155R72A681KA37D
GCM155R71H681KA37D
1000pF(102)
±10%(K)
GCM155R72A102KA37D
GCM155R71H102KA37D
1500pF(152)
±10%(K)
GCM155R72A152KA37D
GCM155R71H152KA37D
2200pF(222)
±10%(K)
GCM155R72A222KA37D
GCM155R71H222KA37D
3300pF(332)
±10%(K)
GCM155R72A332KA37D
GCM155R71H332KA37D
4700pF(472)
±10%(K)
GCM155R72A472KA37D
GCM155R71H472KA37D
6800pF(682)
±10%(K)
GCM155R71H682KA55D
10000pF(103)
±10%(K)
GCM155R71H103KA55D
GCM155R71E103KA37D
15000pF(153)
±10%(K)
GCM155R71H153KA55D
GCM155R71E153KA55D
22000pF(223)
±10%(K)
GCM155R71H223KA55D
GCM155R71E223KA55D
33000pF(333)
±10%(K)
GCM155R71E333KA55D
GCM155R71C333KA37D
47000pF(473)
±10%(K)
GCM155R71E473KA55D
GCM155R71C473KA37D
68000pF(683)
±10%(K)
GCM155R71C683KA55D
0.10µF(104)
±10%(K)
GCM155R71C104KA55D
The part numbering code is shown in ( ) and Unit is shown in [ ].
(Part Number) GC
M
03
3
R7 1E
q
w
e
r t
y
101
K
u
i
< >: EIA [inch] Code
A03 D
o
!0
qProduct ID
wSeries
tTemperature Characteristics
iCapacitance Tolerance
Packaging Code in Part Number is a code shows STD 180mm Reel Taping.
10
10(1A)
X7R(R7)
TC
eDimension (LgW)
yRated Voltage
oIndividual Specification Code
rDimension (T)
uCapacitance
!0Package
PDF catalog
is downloaded
from!CAUTION
the website (for
of Murata
Manufacturing
co., ltd.
Therefore,
it’s specifications
areinsubject
to change
or oursmoking
productsand/or
in it may
be discontinued
without advance notice. Please check with our
• Please
read rating and
storage,
operating, rating,
soldering,
mounting
and handling)
this catalog
to prevent
burning,
etc.
!Note • This
!Note
C03E.pdf
10.5.20
sales representatives
or product
engineers
before ordering.
• This catalog
has only
typical specifications
because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
1
High Dielectric Constant Type
1.6x0.8(18)<0603>
L x W [mm]
100(2A)
Rated Volt. [Vdc]
50(1H)
25(1E)
16(1C)
X7R(R7)/X7S(C7)
TC
Capacitance
Tolerance
Part Number
1000pF(102)
±10%(K)
GCM188R72A102KA37D
GCM188R71H102KA37D
1500pF(152)
±10%(K)
GCM188R72A152KA37D
GCM188R71H152KA37D
2200pF(222)
±10%(K)
GCM188R72A222KA37D
GCM188R71H222KA37D
3300pF(332)
±10%(K)
GCM188R72A332KA37D
GCM188R71H332KA37D
4700pF(472)
±10%(K)
GCM188R72A472KA37D
GCM188R71H472KA37D
6800pF(682)
±10%(K)
GCM188R72A682KA37D
GCM188R71H682KA37D
10000pF(103)
±10%(K)
GCM188R72A103KA37D
GCM188R71H103KA37D
15000pF(153)
±10%(K)
GCM188R72A153KA37D
GCM188R71H153KA37D
22000pF(223)
±10%(K)
GCM188R72A223KA37D
GCM188R71H223KA37D
33000pF(333)
±10%(K)
GCM188R71H333KA55D
GCM188R71E333KA37D
47000pF(473)
±10%(K)
GCM188R71H473KA55D
GCM188R71E473KA37D
68000pF(683)
±10%(K)
GCM188R71H683KA57D
GCM188R71E683KA57D
0.10µF(104)
±10%(K)
GCM188R71H104KA57D
GCM188R71E104KA57D
0.15µF(154)
±10%(K)
GCM188R71H154KA64D
GCM188R71E154KA37D
0.22µF(224)
±10%(K)
GCM188R71H224KA64D
GCM188R71E224KA55D
0.33µF(334)
±10%(K)
0.47µF(474)
±10%(K)
GCM188R71E474KA64D
GCM188R71C474KA55D
1.0µF(105)
±10%(K)
GCM188R71E105KA64D
GCM188R71C105KA64D
GCM188R72A104KA64D
GCM188R71C104KA37D
GCM188R71C334KA37D
1.6x0.8(18)<0603>
L x W [mm]
6.3(0J)
Rated Volt. [Vdc]
X7R(R7)
TC
Capacitance
2.2µF(225)
Tolerance
±10%(K)
Part Number
GCM188R70J225KE22D
The part numbering code is shown in ( ) and Unit is shown in [ ].
< >: EIA [inch] Code
11
PDF catalog
is downloaded
from!CAUTION
the website (for
of Murata
Manufacturing
co., ltd.
Therefore,
it’s specifications
areinsubject
to change
or oursmoking
productsand/or
in it may
be discontinued
without advance notice. Please check with our
• Please
read rating and
storage,
operating, rating,
soldering,
mounting
and handling)
this catalog
to prevent
burning,
etc.
!Note • This
!Note
C03E.pdf
10.5.20
sales representatives
or product
engineers
before ordering.
• This catalog
has only
typical specifications
because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
1
High Dielectric Constant Type
2.0x1.25(21)<0805>
L x W [mm]
100(2A)
Rated Volt. [Vdc]
50(1H)
35(YA)
Capacitance
Tolerance
Part Number
6800pF(682)
±10%(K)
GCM216R72A682KA37D
10000pF(103)
±10%(K)
GCM216R72A103KA37D
15000pF(153)
±10%(K)
GCM216R72A153KA37D
22000pF(223)
±10%(K)
GCM216R72A223KA37D
33000pF(333)
±10%(K)
GCM219R72A333KA37D
GCM219R71H333KA37D
47000pF(473)
±10%(K)
GCM21BR72A473KA37L
GCM21BR71H473KA37L
68000pF(683)
±10%(K)
GCM21BR72A683KA37L
GCM21BR71H683KA37L
0.10µF(104)
±10%(K)
GCM21BR72A104KA37L
GCM21BR71H104KA37L
0.15µF(154)
±10%(K)
GCM21BR71H154KA37L
GCM21BR71E154KA37L
0.22µF(224)
±10%(K)
GCM21BR71H224KA37L
GCM21BR71E224KA37L
0.33µF(334)
±10%(K)
GCM219R71H334KA55D
GCM21BR71E334KA37L
0.47µF(474)
±10%(K)
GCM21BR71H474KA55L
0.68µF(684)
±10%(K)
GCM21BR7YA684KA55L
GCM21BR71E684KA55L
1.0µF(105)
±10%(K)
GCM21BR7YA105KA55L
GCM21BR71E105KA56L
2.2µF(225)
±10%(K)
GCM219R71E474KA55D
GCM21BR71E225KA73L
2.0x1.25(21)<0805>
L x W [mm]
16(1C)
Rated Volt. [Vdc]
10(1A)
6.3(0J)
X7R(R7)/X7S(C7)
TC
Capacitance
Tolerance
Part Number
0.68µF(684)
±10%(K)
1.0µF(105)
±10%(K)
GCM219R71C105KA37D
2.2µF(225)
±10%(K)
GCM21BR71C225KA64L
GCM21BR71A225KA37L
4.7µF(475)
±10%(K)
GCM21BR71C475KA73L
GCM21BC71A475KA73L
10µF(106)
±10%(K)
GCM219R71C684KA37D
GCM21BR70J106KE22L
3.2x1.6(31)<1206>
L x W [mm]
100(2A)
Rated Volt. [Vdc]
50(1H)
25(1E)
16(1C)
X7R(R7)
TC
Capacitance
Tolerance
Part Number
0.10µF(104)
±10%(K)
GCM319R72A104KA37D
0.15µF(154)
±10%(K)
GCM31MR72A154KA37L
0.22µF(224)
±10%(K)
GCM31MR72A224KA37L
0.33µF(334)
±10%(K)
GCM31MR71H334KA37L
0.47µF(474)
±10%(K)
GCM31MR71H474KA37L
0.68µF(684)
±10%(K)
GCM31MR71H684KA55L
1.0µF(105)
±10%(K)
GCM31MR71H105KA55L
2.2µF(225)
±10%(K)
GCM31CR71H225KA55L
4.7µF(475)
±10%(K)
10µF(106)
±10%(K)
GCM31MR71E225KA57L
GCM31CR71E475KA55L
GCM31CR71C475KA37L
GCM31CR71C106KA64L
3.2x1.6(31)<1206>
L x W [mm]
10(1A)
Rated Volt. [Vdc]
6.3(0J)
X7R(R7)
TC
Capacitance
Tolerance
10µF(106)
±10%(K)
22µF(226)
±20%(M)
Part Number
GCM31CR71A106KA64L
GCM31CR70J226ME23L
The part numbering code is shown in ( ) and Unit is shown in [ ].
(Part Number) GC
M
21
6
R7 2A
q
w
e
r t
y
682
K
u
i
< >: EIA [inch] Code
A37 D
o
!0
qProduct ID
wSeries
tTemperature Characteristics
iCapacitance Tolerance
Packaging Code in Part Number is a code shows STD 180mm Reel Taping.
12
25(1E)
X7R(R7)
TC
eDimension (LgW)
yRated Voltage
oIndividual Specification Code
rDimension (T)
uCapacitance
!0Package
PDF catalog
is downloaded
from!CAUTION
the website (for
of Murata
Manufacturing
co., ltd.
Therefore,
it’s specifications
areinsubject
to change
or oursmoking
productsand/or
in it may
be discontinued
without advance notice. Please check with our
• Please
read rating and
storage,
operating, rating,
soldering,
mounting
and handling)
this catalog
to prevent
burning,
etc.
!Note • This
!Note
C03E.pdf
10.5.20
sales representatives
or product
engineers
before ordering.
• This catalog
has only
typical specifications
because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
1
High Dielectric Constant Type
3.2x2.5(32)<1210>
L x W [mm]
100(2A)
Rated Volt. [Vdc]
50(1H)
25(1E)
16(1C)
X7R(R7)
TC
Capacitance
Tolerance
1.0µF(105)
±10%(K)
2.2µF(225)
±10%(K)
4.7µF(475)
±10%(K)
10µF(106)
±10%(K)
22µF(226)
±20%(M)
Part Number
GCM32ER71H105KA37L
GCM32DR72A225KA64L
GCM32ER71H475KA55L
GCM32DR71E475KA55L
GCM32ER71E106KA57L
GCM32DR71C106KA37L
GCM32ER71C226ME19L
3.2x2.5(32)<1210>
L x W [mm]
10(1A)
Rated Volt. [Vdc]
6.3(0J)
X7R(R7)
TC
Capacitance
Tolerance
22µF(226)
±20%(M)
47µF(476)
±20%(M)
Part Number
GCM32ER71A226ME12L
The part numbering code is shown in ( ) and Unit is shown in [ ].
GCM32ER70J476ME19L
< >: EIA [inch] Code
13
PDF catalog
is downloaded
from!CAUTION
the website (for
of Murata
Manufacturing
co., ltd.
Therefore,
it’s specifications
areinsubject
to change
or oursmoking
productsand/or
in it may
be discontinued
without advance notice. Please check with our
• Please
read rating and
storage,
operating, rating,
soldering,
mounting
and handling)
this catalog
to prevent
burning,
etc.
!Note • This
!Note
C03E.pdf
10.5.20
sales representatives
or product
engineers
before ordering.
• This catalog
has only
typical specifications
because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
GCM Series Specification
and Test Methods
Specifications
and Test Methods
No.
1
AEC-Q200
Test Item
Specifications
AEC-Q200 Test Method
Temperature Compensating Type
High Dielectric Type
Pre-and Post-Stress
Electrical Test
–
High Temperature The measured and observed characteristics should satisfy the
Exposure (Storage) specifications in the following table.
2
Appearance
No marking defects
Capacitance
Change
Within ±2.5% or ±0.25pF
(Whichever is larger)
Q/D.F.
30pFmin.: QU1000
30pFmax.: QU400+20C
C: Nominal Capacitance (pF)
I.R.
More than 10,000MΩ or 500Ω · F
(Whichever is smaller)
Temperature
Cycle
No marking defects
Capacitance
Change
Within ±2.5% or ±0.25pF
(Whichever is larger)
Q/D.F.
I.R.
4
5
*1
30pFmin.: QU1000
30pFmax.: QU400+20C
C: Nominal Capacitance (pF)
Sit the capacitor for 1000±12 hours at 150±3°C. Let sit for 24±2
hours at room temperature, then measure.
W.V.: 25Vmin.: 0.03 max.
W.V.: 16V: 0.05 max.
*1
The measured and observed characteristics should satisfy the
specifications in the following table.
Appearance
3
Within ±10.0%
Within ±10.0%
Step
*1
*1
1
Temp. (°C) -55+0/-3
Time (min.)
W.V.: 25Vmin.: 0.03 max.
W.V.: 16V: 0.05 max.
More than 10,000MΩ or 500Ω · F
(Whichever is smaller)
Fix the capacitor to the supporting jig in the same manner and
under the same conditions as (18). Perform the 1000 cycles
according to the four heat treatments listed in the following table.
Let sit for 24±2 hours at room temperature, then measure
15±3
2
3
4
Room
Room
125+3/-0 (∆C/R7/C7)
Temp.
Temp.
15±3
1
1
• Initial measurement for high dielectric constant type
Perform a heat treatment at 150 W0
Y10 °C for one hour and then
let sit for 24±2 hours at room temperature.
Perform the initial measurement.
Destructive
Physical Analysis
No defects or abnormalities
Per EIA-469
Moisture
Resistance
The measured and observed characteristics should satisfy the
specifications in the following table.
Apply the 24-hour heat (25 to 65°C) and humidity (80 to 98%)
treatment shown below, 10 consecutive times.
Let sit for 24±2 hours at room temperature, then measure.
Appearance
No marking defects
Capacitance
Change
Within ±3.0% or ±0.30pF
(Whichever is larger)
Within ±12.5%
Q/D.F.
30pFmin.: QU350
10pF and over, 30pF and below:
5
– C
QU275+2
10pFmax.: QU200+10C
C: Nominal Capacitance (pF)
W.V.: 25Vmin.: 0.03 max.
W.V.: 16V: 0.05 max.
*1
*1
I.R.
°C
70
65
60
65
50
45
40
35
30
25
20
15
10
5
0
-5
-10
Temperature
1
More than 10,000MΩ or 500Ω · F
(Whichever is smaller)
Humidity
90-98%
Humidity Humidity Humidity
80-98% 90-98% 80-98%
Humidity
90-98%
+10
-2 °C
Initial measurement
One cycle 24 hours
0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24
Hours
Biased Humidity
6
The measured and observed characteristics should satisfy the
specifications in the following table.
Appearance
No marking defects
Capacitance
Change
Within ±3.0% or ±0.30pF
(Whichever is larger)
Q/D.F.
30pF and over: QU200
0
30pF and below: QU100+ 1–
3 C
C: Nominal Capacitance (pF)
I.R.
More than 1,000MΩ or 50Ω · F
(Whichever is smaller)
Within ±12.5%
*1
W.V.: 25Vmin.: 0.035 max.
W.V.: 16V: 0.05 max.
Apply the rated voltage and 1.3+0.2/-0Vdc (add 6.8k Ω resistor)
at 85±3°C and 80 to 85% humidity for 1000±12 hours.
Remove and let sit for 24±2 hours at room temperature, then
measure.
The charge/discharge current is less than 50mA.
*1
*1: The figure indicates typical specification. Please refer to individual specifications.
Continued on the following page.
14
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• Please
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C03E.pdf
10.5.20
sales representatives
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before ordering.
• This catalog
has only
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• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
GCM SeriesSpecifications
Specification and Test Methods
Continued from the preceding page.
No.
AEC-Q200
Test Item
Operational Life
Specifications
AEC-Q200 Test Method
Temperature Compensating Type
High Dielectric Type
The measured and observed characteristics should satisfy the
specifications in the following table.
Appearance
No marking defects
Capacitance
Change
Within ±3.0% or ±0.30pF
(Whichever is larger)
Within ±12.5%
Q/D.F.
30pFmin.: QU350
10pF and over, 30pF and below:
5
– C
QU275+2
10pFmax.: QU200+10C
C: Nominal Capacitance (pF)
W.V.: 25Vmin.: 0.035 max.
W.V.: 16V: 0.05 max.
I.R.
More than 1,000MΩ or 50Ω · F
(Whichever is smaller)
7
Apply 200% of the rated voltage for 1000±12 hours at
125±3°C. Let sit for 24±2 hours at room temperature, then
measure. *2
The charge/discharge current is less than 50mA.
*1
• Initial measurement for high dielectric constant type.
Apply 200% of the rated DC voltage for one hour at the maximum
operating temperature ±3°C. Remove and let sit for 24±2 hours
at room temperature. Perform initial measurement. *2
*1
8
External Visual
No defects or abnormalities
Visual inspection
9
Physical Dimension
Within the specified dimensions
Using calipers
10
11
Resistance
to Solvents
Mechanical
Shock
Appearance
No marking defects
Capacitance
Change
Within the specified tolerance
Q/D.F.
30pFmin.: QU1000
30pFmax.: QU400+20C
C: Nominal Capacitance (pF)
I.R.
More than 10,000MΩ or 500Ω · F
(Whichever is smaller)
Appearance
No marking defects
Capacitance
Change
Within the specified tolerance
Q/D.F.
30pFmin.: QU1000
30pFmax.: QU400+20C
C: Nominal Capacitance (pF)
I.R.
More than 10,000MΩ or 500Ω · F
(Whichever is smaller)
Appearance
No defects or abnormalities
Capacitance
Change
Within the specified tolerance
Q/D.F.
30pFmin.: QU1000
30pFmax.: QU400+20C
C: Nominal Capacitance (pF)
I.R.
More than 10,000MΩ or 500Ω · F
(Whichever is smaller)
12 Vibration
Resistance to
Soldering Heat
13
*1
W.V.: 25Vmin.: 0.025 max.
W.V.: 16V: 0.035 max.
*1
*1
W.V.: 25Vmin.: 0.025 max.
W.V.: 16V: 0.035 max.
Per MIL-STD-202 Method 215
Solvent 1: 1 part (by volume) of isopropyl alcohol
3 parts (by volume) of mineral spirits
Solvent 2: Terpene defluxer
Solvent 3: 42 parts (by volume) of water
1 part (by volume) of propylene glycol
monomethyl ether
1 part (by volume) of monoethanolamine
Three shocks in each direction should be applied along 3
mutually perpendicular axes of the test specimen (18 shocks).
The specified test pulse should be Half-sine and should have a
duration: 0.5ms, peak value: 1500g and velocity change: 4.7m/s.
*1
*1
W.V.: 25Vmin.: 0.025 max.
W.V.: 16V: 0.035 max.
*1
Solder the capacitor to the test jig (glass epoxy board) in the
same manner and under the same conditions as (19). The
capacitor should be subjected to a simple harmonic motion
having a total amplitude of 1.5mm, the frequency being varied
uniformly between the approximate limits of 10 and 2000Hz. The
frequency range, from 10 to 2000Hz and return to 10Hz, should
be traversed in approximately 20 minutes. This motion should be
applied for 12 items in each 3 mutually perpendicular directions
(total of 36 times).
The measured and observed characteristics should satisfy the
specifications in the following table.
Immerse the capacitor in a eutectic solder solution at 260±5°C for
10±1 seconds. Let sit at room temperature for 24±2 hours, then
measure.
Appearance
No marking defects
Capacitance
Change
Within the specified tolerance
Q/D.F.
30pFmin.: QU1000
30pFmax.: QU400+20C
C: Nominal Capacitance (pF)
I.R.
More than 10,000MΩ or 500Ω · F
(Whichever is smaller)
*1
W.V.: 25Vmin.: 0.025 max.
W.V.: 16V: 0.035 max.
• Initial measurement for high dielectric constant type
Perform a heat treatment at 150W0
Y10 °C for one hour and then let
sit for 24±2 hours at room temperature.
Perform the initial measurement.
*1
*1: The figure indicates typical specification. Please refer to individual specifications.
*2: Some of the parts are applicable in rated voltage x 150%. Please refer to individual specifications.
Continued on the following page.
15
1
PDF catalog
is downloaded
from!CAUTION
the website (for
of Murata
Manufacturing
co., ltd.
Therefore,
it’s specifications
areinsubject
to change
or oursmoking
productsand/or
in it may
be discontinued
without advance notice. Please check with our
• Please
read rating and
storage,
operating, rating,
soldering,
mounting
and handling)
this catalog
to prevent
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etc.
!Note • This
!Note
C03E.pdf
10.5.20
sales representatives
or product
engineers
before ordering.
• This catalog
has only
typical specifications
because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
1
GCM Series Specification
and Test Methods
Specifications
and Test Methods
Continued from the preceding page.
No.
AEC-Q200
Test Item
Thermal Shock
Specifications
AEC-Q200 Test Method
Temperature Compensating Type
High Dielectric Type
The measured and observed characteristics should satisfy the
specifications in the following table.
Appearance
No marking defects
Capacitance
Change
Within ±2.5% or ±0.25pF
(Whichever is larger)
Q/D.F.
30pF min.: QU1000
30pF max.: QU400+20C
C: Nominal Capacitance (pF)
I.R.
More than 10,000MΩ or 500Ω · F
(Whichever is smaller)
Appearance
No marking defects
Capacitance
Change
Within the specified tolerance
Q/D.F.
30pF min.: QU1000
30pF max.: QU400+20C
C: Nominal Capacitance (pF)
I.R.
More than 10,000MΩ or 500Ω · F
(Whichever is smaller)
14
15 ESD
Within ±10.0%
*1
W.V.: 25Vmin.: 0.025 max.
W.V.: 16V: 0.035 max.
*1
*1
Fix the capacitor to the supporting jig in the same manner and
under the same conditions as (18). Perform the 300 cycles
according to the two heat treatments listed in the following table
(Maximum transfer time is 20 seconds). Let sit for 24±2 hours at
room temperature, then measure.
Step
Temp. (°C)
Time (min.)
1
-55+0/-3
15±3
2
125+3/-0 (5C, C7, R7)
15±3
• Initial measurement for high dielectric constant type
W0
Perform a heat treatment at 150Y10
°C for one hour and then
let sit for 24±2 hours at room temperature.
Perform the initial measurement.
Per AEC-Q200-002
W.V.: 25Vmin.: 0.025 max.
W.V.: 16V: 0.035 max.
*1
(a) Preheat at 155°C for 4 hours. After preheating, immerse the
capacitor in a solution of ethanol (JIS-K-8101) and rosin (JISK-5902) (25% rosin in weight proportion). Immerse in eutectic
solder solution for 5+0/-0.5 seconds at 235±5°C.
16 Solderability
(b) Should be placed into steam aging for 8 hours±15 minutes.
After preheating, immerse the capacitor in a solution of
ethanol (JIS-K-8101) and rosin (JIS-K-5902) (25% rosin in
weight proportion). Immerse in eutectic solder solution for
5+0/-0.5 seconds at 235±5°C.
95% of the terminations is to be soldered evenly and
continuously.
(c) Should be placed into steam aging for 8 hours±15 minutes.
After preheating, immerse the capacitor in a solution of
ethanol (JIS-K-8101) and rosin (JIS-K-5902) (25% rosin in
weight proportion). Immerse in eutectic solder solution for 120
±5 seconds at 260±5°C.
Appearance
No defects or abnormalities
Capacitance
Change
Within the specified tolerance
Q/D.F.
30pF min.: QU1000
30pF max.: QU400+20C
C: Nominal Capacitance (pF)
Electrical
17 Characterization
I.R.
Dielectric
Strength
Visual inspection.
The capacitance/Q/D.F. should be measured at 25°C at the
frequency and voltage shown in the table.
(1) Temperature Compensating Type
*1
W.V.: 25V min.: 0.025 max.
W.V.: 16V: 0.035 max
Capacitance
CV1000pF
CG1000pF
*1
25°C
More than 10,000MΩ or 500Ω · F
(Whichever is smaller)
Max. Operating Temperature···125°C
More than 10,000MΩ or 100Ω · F
(Whichever is smaller)
Max. Operating Temperature···125°C
More than 1,000MΩ or 10Ω · F
(Whichever is smaller)
No failure
Voltage
0.5 to 5Vrms
1±0.2Vrms
Frequency
1±0.1kHz
120±24Hz
Voltage
1±0.2Vrms
0.5±0.1Vrms
(2) High Dielectric Type
Capacitance
CV10µF
CG10µF
25°C
More than 100,000MΩ or 1,000Ω · F
(Whichever is smaller)
Frequency
1±0.1MHz
1±0.1kHz
The insulation resistance should be measured with a DC voltage
not exceeding the rated voltage at 25°C and 125°C and within 2
minutes of charging.
No failure should be observed when 250% of the rated voltage is
applied between the terminations for 1 to 5 seconds, provided the
charge/discharge current is less than 50mA.
*1: The figure indicates typical specification. Please refer to individual specifications.
Continued on the following page.
16
PDF catalog
is downloaded
from!CAUTION
the website (for
of Murata
Manufacturing
co., ltd.
Therefore,
it’s specifications
areinsubject
to change
or oursmoking
productsand/or
in it may
be discontinued
without advance notice. Please check with our
• Please
read rating and
storage,
operating, rating,
soldering,
mounting
and handling)
this catalog
to prevent
burning,
etc.
!Note • This
!Note
C03E.pdf
10.5.20
sales representatives
or product
engineers
before ordering.
• This catalog
has only
typical specifications
because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
GCM SeriesSpecifications
Specification and Test Methods
Continued from the preceding page.
18
AEC-Q200
Test Item
Specifications
AEC-Q200 Test Method
Temperature Compensating Type
Appearance
No marking defects
Capacitance
Change
Within ±5.0% or ±0.5pF
(Whichever is larger)
Q/D.F.
30pF min.: QU1000
30pF max.: QU400+20C
C: Nominal Capacitance (pF)
High Dielectric Type
Within ±10.0%
*1
W.V.: 25Vmin.: 0.025 max.
W.V.: 16V: 0.035 max.
Board
Flex
Solder the capacitor on the test jig (glass epoxy board) shown in
Fig. 1 using a eutectic solder. Then apply a force in the direction
shown in Fig. 2 for 5±1sec. The soldering should be done by the
reflow method and should be conducted with care so that the
soldering is uniform and free of defects such as heat shock.
Type
GCM03
GCM15
GCM18
GCM21
GCM31
GCM32
b
a
0.3
0.5
0.6
0.8
2.0
2.0
b
0.9
1.5
2.2
3.0
4.4
4.4
c
0.3
0.6
0.9
1.3
1.7
2.6
C
I.R.
(in mm)
40
No.
*1
More than 10,000MΩ or 500Ω · F
(Whichever is smaller)
20
a
114
Pressunzing
speed: 1.0mm/sec
Pressurize
100
R4
t: 1.6mm
(GCM03/15: 0.8mm)
Fig. 1
Flexure: V2
(High Dielectric Type)
Flexure: V3
(Temperature
Compensating Type)
Capacitance meter
45
45
Fig. 2
19
Appearance
No marking defects
Capacitance
Change
Within the specified tolerance
Q/D.F.
30pF min.: QU1000
30pF max.: QU400+20C
C: Nominal Capacitance (pF)
*1
W.V.: 25Vmin.: 0.025 max.
W.V.: 16V: 0.035 max.
Solder the capacitor to the test jig (glass epoxy board) shown in
Fig. 3 using a eutectic solder. Then apply *18N force in parallel
with the test jig for 60sec.
The soldering should be done either with an iron or using the
reflow method and should be conducted with care so that the
soldering is uniform and free of defects such as heat shock.
*2N (GCM03/15)
Type
GCM03
GCM15
GCM18
GCM21
GCM31
GCM32
Terminal
Strength
a
0.3
0.4
1.0
1.2
2.2
2.2
*1
c
0.3
0.5
1.2
1.65
2.0
2.9
(in mm)
c
More than 10,000MΩ or 500Ω · F
(Whichever is smaller)
a
b
I.R.
b
0.9
1.5
3.0
4.0
5.0
5.0
(t=1.6mm
GCM03/15: 0.8mm)
Solder resist
Baked electrode or
copper foil
Fig. 3
Place the capacitor in the beam load fixture as Fig. 4.
Apply a force.
< Chip Length: 2.5mm max. >
Iron Board
20 Beam Load Test
The chip endure following force.
< Chip L dimension: 2.5mm max. >
Chip thickness G 0.5mm rank: 20N
Chip thickness V 0.5mm rank: 8N
< Chip L dimension: 3.2mm min. >
Chip thickness F 1.25mm rank: 15N
Chip thickness U 1.25mm rank: 54.5N
Speed supplied the Stress Load: 0.5mm / sec.
< Chip Length: 3.2mm min. >
L
0.6
Speed supplied the Stress Load: 2.5mm / sec.
Fig. 4
*1: The figure indicates typical specification. Please refer to individual specifications.
Continued on the following page.
17
1
PDF catalog
is downloaded
from!CAUTION
the website (for
of Murata
Manufacturing
co., ltd.
Therefore,
it’s specifications
areinsubject
to change
or oursmoking
productsand/or
in it may
be discontinued
without advance notice. Please check with our
• Please
read rating and
storage,
operating, rating,
soldering,
mounting
and handling)
this catalog
to prevent
burning,
etc.
!Note • This
!Note
C03E.pdf
10.5.20
sales representatives
or product
engineers
before ordering.
• This catalog
has only
typical specifications
because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
1
GCM Series Specification
and Test Methods
Specifications
and Test Methods
Continued from the preceding page.
No.
21
AEC-Q200
Test Item
Specifications
AEC-Q200 Test Method
Temperature Compensating Type
Capacitance
Change
Within the specified tolerance
(Table A)
Temperature
Coefficient
Within the specified tolerance
(Table A)
High Dielectric Type
C7: Within ±22%
(-55°C to +125°C)
R7: Within ±15%
(-55°C to +125°C)
Capacitance
Temperature
Characteristics
Capacitance
Drift
The capacitance change should be measured after 5 min. at
each specified temperature stage.
(1) Temperature Compensating Type
The temperature coefficient is determined using the capacitance
measured in step 3 as a reference. When cycling the
temperature sequentially from step1 through 5 (∆C: +25°C to
+125°C: other temp. coeffs.: +25°C to +85°C) the capacitance
should be within the specified tolerance for the temperature
coefficient and capacitance change as shown in Table A. The
capacitance drift is calculated by dividing the differences
between the maximum and minimum measured values in steps
1, 3 and 5 by the capacitance value in step 3.
Step
1
2
3
4
5
Within ±0.2% or ±0.05 pF
(Whichever is larger)
* Do not apply to 1X/25V
Temperature (°C)
25±2
-55±3
25±2
125±3
25±2
(2) High Dielectric Constant Type
The ranges of capacitance change compared with the above
25°C value over the temperature ranges shown in the table
should be within the specified ranges.
· Initial measurement for high dielectric constant type.
Perform a heat treatment at 150+0/-10°C for one hour and then
set for 24±2 hours at room temperature.
Perform the initial measurement.
*1: The figure indicates typical specification. Please refer to individual specifications.
Table A
Char.
5C
-55
Nominal Values (ppm/°C) Note1
0T30
Max.
0.58
Min.
-0.24
Capacitance Change from 25°C (%)
-30
Max.
Min.
0.40
-0.17
Note 1: Nominal values denote the temperature coefficient within a range of 25°C to 125°C (for 5C).
18
-10
Max.
0.25
Min.
-0.11
PDF catalog
is downloaded
from!CAUTION
the website (for
of Murata
Manufacturing
co., ltd.
Therefore,
it’s specifications
areinsubject
to change
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productsand/or
in it may
be discontinued
without advance notice. Please check with our
• Please
read rating and
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and handling)
this catalog
to prevent
burning,
etc.
!Note • This
!Note
C03E.pdf
10.5.20
sales representatives
or product
engineers
before ordering.
• This catalog
has only
typical specifications
because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
Package
Minimum Quantity Guide
Quantity (pcs.)
Dimensions (mm)
ø180mm reel
Part Number
ø330mm reel
Bulk Case
Bulk Bag
Paper Tape Embossed Tape Paper Tape Embossed Tape Packaging Code: C Packaging Code: B
Packaging Code: D Packaging Code: L Packaging Code: J Packaging Code: K
L
W
T
GCM03
0.6
0.3
0.3
15,000
-
50,000
-
-
GCM15
1.0
0.5
0.5
10,000
-
50,000
-
50,000
GCM18
1.6
0.8
0.8
4,000
-
10,000
-
0.6
4,000
-
10,000
-
0.85
4,000
-
10,000
-
1.25
-
3,000
-
10,000
0.85
4,000
-
10,000
-
-
1,000
1.15
-
3,000
-
10,000
-
1,000
1.6
-
2,000
-
6,000
-
1,000
1.15
-
3,000
-
10,000
-
1,000
1.35
-
2,000
-
8,000
-
1,000
1.6
-
2,000
-
6,000
-
1,000
1.8/2.0/2.5
-
1,000
-
4,000
-
1,000
GCM21
2.0
GCM31
3.2
GCM32
3.2
1.25
1.6
2.5
1,000
15,000
1,000
1)
1,000
10,000
1,000
-
1,000
5,000
1)
1,000
1) There are parts number without bulk case.
Tape Carrier Packaging
1. Dimensions of Reel
ø180mm Reel
ø330mm Reel
2.0±0.5
2.0±0.5
ø330±2.0
ø50 min.
ø50 min.
ø21.0±0.8
ø13.0±0.5
ø180+0
-3.0
ø13.0±0.5
ø21.0±0.8
10±1.5 for 8mm wide tape
14±1.5 for 12mm wide tape
10±1.5 for 8mm wide tape
14±1.5 for 12mm wide tape
(in mm)
Continued on the following page.
19
1
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Package
Continued from the preceding page.
2. Dimensions of Paper Tape
8mm width 4mm pitch Tape
8mm width 2mm pitch Tape
4.0±0.1
A
1.75±0.1
0.8 max.
Direction of Feed
Direction of Feed
Part Number
2.0±0.05
B
A
2.0±0.05
1.1 max.
3.5±0.05
1.75±0.1
8.0±0.3
2.0±0.05
3.5±0.05
4.0±0.1
+0.1
ø1.5 -0
8.0±0.3
4.0±0.1
+0.1
ø1.5- 0
B
A
B
GCM18
1.05±0.1
1.85±0.1
Part Number
GCM21
(TV0.85mm)
1.55±0.15
2.3±0.15
GCM31
(TV0.85mm)
2.0±0.2
3.6±0.2
GCM32
(T=0.85mm)
2.8±0.2
3.6±0.2
A*
B*
GCM03
0.37
0.67
GCM15
0.65
1.15
*Nominal Value
(in mm)
3. Dimensions of Embossed Tape
8mm width 4mm pitch Tape
4.0±0.1
1.75±0.1
3.5±0.05
2.0±0.1
A
Direction of feed
Part Number
0.2±0.1
8.0±0.3
+0.1
4.0±0.1 ø1.5 -0
B
1
2.5 max.
(3.0 max. T=1.8mm/2.0mm)
A
B
GCM21
(T=1.25mm)
1.45±0.2
2.25±0.2
GCM31
(TU1.15mm)
1.9±0.2
3.5±0.2
GCM32
(TU1.15mm)
2.8±0.2
3.5±0.2
*Nominal Value
(in mm)
Continued on the following page.
20
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Package
Continued from the preceding page.
4. Taping Method
(1) Tapes for capacitors are wound clockwise. The
sprocket holes are to the right as the tape is pulled
toward the user.
(2) Part of the leader and part of the empty tape should
be attached to the end of the tape as follows.
(3) The top tape and base tape are not attached at the
end of the tape for a minimum of 5 pitches.
(4) Missing capacitors number within 0.1% of the number
per reel or 1 pc, whichever is greater, and are not
continuous.
(5) The top tape and bottom tape should not protrude
beyond the edges of the tape and should not cover
sprocket holes.
(6) Cumulative tolerance of sprocket holes, 10 pitches:
±0.3mm.
(7) Peeling off force: 0.1 to 0.6N* in the direction shown
below.
*GCM03: 0.05 to 0.5N
Vacant Section Chip-mounting Unit Vacant Section
Leader unit
160 min.
190 min.
210 min.
(Top Tape alone)
Direction of Feed
(in mm)
165 to
180˚
Top Tape
Base Tape
Dimensions of Bulk Case Packaging
6.8
8.8
12.0
The bulk case uses antistatic materials. Please contact
Murata for details.
31.5
36.0
1.5
2.0
3.0
110
(in mm)
21
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1
!Caution (Storage and Operation Condition)
■ Storage and Operation condition
1. The performance of chip monolithic ceramic capacitors
may be affected by the storage conditions.
1-1. Store capacitors in the following conditions:
Temperature of +5°C to +40°C and a Relative
Humidity of 20% to 70%.
(1) Sunlight, dust, rapid temperature changes,
corrosive gas atmosphere or high temperature
and humidity conditions during storage may affect
the solderability and the packaging performance.
Please use product within six months of receipt.
(2) Please confirm solderability before using after
six months. Store the capacitors without opening
the original bag. Even if the storage period is
short, do not exceed the specified atmospheric
conditions.
22
1-2. Corrosive gas can react with the termination
(external) electrodes or lead wires of capacitors, and
result in poor solderability. Do not store the
capacitors in an atmosphere consisting of corrosive
gas (e.g., hydrogen sulfide, sulfur dioxide, chlorine,
ammonia gas, etc.).
1-3. Due to moisture condensation caused by rapid
humidity changes, or the photochemical change
caused by direct sunlight on the terminal electrodes
and/or the resin/epoxy coatings, the solderability and
electrical performance may deteriorate. Do not store
capacitors under direct sunlight or in high humidity
conditions.
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!Caution (Rating)
!Caution
■ Rating
1. Temperature Dependent Characteristics
1. The electrical characteristics of the capacitor can change
with temperature.
1-1. For capacitors having larger temperature
dependency, the capacitance may change with
temperature changes.
The following actions are recommended in order to
insure suitable capacitance values.
(1) Select a suitable capacitance for the operating
temperature range.
Typical Temperature Characteristics Char. R7(X7R)
Typical Temperature Characteristics Char. R6(X5R)
20
20
15
15
Capacitance Change (%)
Capacitance Change (%)
(2) The capacitance may change within the rated
temperature.
When you use a high dielectric constant type
capacitors in a circuit that needs a tight (narrow)
capacitance tolerance. Example: a time constant
circuit., please carefully consider the
characteristics of these capacitors, such as their
aging, voltage, and temperature characteristics.
And check capacitors using your actual
appliances at the intended environment and
operating conditions.
10
5
0
-5
-10
-15
-20
-75
-50
-25
0
25
50
75
100
Temperature (°C)
10
5
0
-5
-10
-15
-20
-75
-50
-25
0
25
50
75
100
125
150
Temperature (°C)
Typical Temperature Characteristics Char. F5(Y5V)
Capacitance Change (%)
40
20
0
-20
-40
-60
-80
-100
-50
-25
0
25
50
75
100
Temperature (°C)
2. Measurement of Capacitance
1. Measure capacitance with the voltage and the frequency
specified in the product specifications.
1-1. The output voltage of the measuring equipment may
decrease when capacitance is high occasionally.
Please confirm whether a prescribed measured
voltage is impressed to the capacitor.
1-2. The capacitance values of high dielectric constant
type capacitors change depending on the AC voltage
applied. Please consider the AC voltage
characteristics when selecting a capacitor to be used
in a AC circuit.
Continued on the following page.
23
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1
!Caution (Rating)
Continued from the preceding page.
3. Applied Voltage
1. Do not apply a voltage to the capacitor that exceeds the
rated voltage as called-out in the specifications.
1-1. Applied voltage between the terminals of a capacitor
shall be less than or equal to the rated voltage.
(1) When AC voltage is superimposed on DC voltage,
the zero-to-peak voltage shall not exceed the
rated DC voltage.
When AC voltage or pulse voltage is applied, the
peak-to-peak voltage shall not exceed the rated
DC voltage.
(2) Abnormal voltages (surge voltage, static
electricity, pulse voltage, etc.) shall not exceed
the rated DC voltage.
Typical Voltage Applied to the DC Capacitor
DC Voltage
E
DC Voltage+AC
E
AC Voltage
E
Pulse Voltage
0
E
0
0
0
(E: Maximum possible applied voltage.)
1-2. Influence of overvoltage
Overvoltage that is applied to the capacitor may
result in an electrical short circuit caused by the
breakdown of the internal dielectric layers .
The time duration until breakdown depends on the
applied voltage and the ambient temperature.
4. Applied Voltage and Self-heating Temperature
1. When the capacitor is used in a high-frequency voltage,
pulse voltage, application, be sure to take into account
self-heating may be caused by resistant factors of the
capacitor.
1-1. The load should be contained to the level such that
when measuring at atmospheric temperature of 25°C,
the product's self-heating remains below 20°C and
surface temperature of the capacitor in the actual
circuit remains within the maximum operating
temperature.
Continued on the following page.
24
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!Caution (Rating)
!Caution
Continued from the preceding page.
[DC Voltage Characteristics]
Capacitance Change (%)
20
0
-20
-40
-60
-80
-100
0
1
2
3
4
5
6
7
DC Voltage (VDC)
[AC Voltage Characteristics]
30
Capacitance Change (%)
5. DC Voltage and AC Voltage Characteristic
1. The capacitance value of a high dielectric constant type
capacitor changes depending on the DC voltage applied.
Please consider the DC voltage characteristics when a
capacitor is selected for use in a DC circuit.
1-1. The capacitance of ceramic capacitors may change
sharply depending on the applied voltage. (See
figure)
Please confirm the following in order to secure the
capacitance.
(1) Whether the capacitance change caused by the
applied voltage is within the range allowed or not.
(2) In the DC voltage characteristics, the rate of
capacitance change becomes larger as voltage
increases. Even if the applied voltage is below
the rated voltage. When a high dielectric constant
type capacitor is in a circuit that needs a tight
(narrow) capacitance tolerance. Example: a time
constant circuit., please carefully consider the
characteristics of these capacitors, such as their
aging, voltage, and temperature characteristics.
And check capacitors using your actual
appliances at the intended environment and
operating conditions.
2. The capacitance values of high dielectric constant type
capacitors change depending on the AC voltage applied.
Please consider the AC voltage characteristics when
selecting a capacitor to be used in a AC circuit.
20
10
0
-10
-20
-30
-40
-50
-60
0.0
0.5
1.0
1.5
2.0
2.5
AC Voltage (Vr.m.s.)
20
Capacitor Change (%)
6. Capacitance Aging
1. The high dielectric constant type capacitors have the
characteristic in which the capacitance value decreases
with passage of time.
When you use a high dielectric constant type capacitors
in a circuit that needs a tight (narrow) capacitance
tolerance. Example: a time constant circuit., please
carefully consider the characteristics of these capacitors,
such as their aging, voltage, and temperature
characteristics. And check capacitors using your actual
appliances at the intended environment and operating
conditions.
10
0
-10
-20
5C
-30
R∆
-40
10
100
1000
10000
Time (Hr)
Continued on the following page.
25
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1
!Caution (Rating)
Continued from the preceding page.
7. Vibration and Shock
1. The capacitors mechanical actress (vibration and shock)
shall be specified for the use environment.
Please confirm the kind of vibration and/or shock, its
condition, and any generation of resonance.
Please mount the capacitor so as not to generate
resonance, and do not allow any impact on the terminals.
2. Mechanical shock due to falling may cause damage or a
crack in the dielectric material of the capacitor.
Do not use a fallen capacitor because the quality and
reliability may be deteriorated.
3. When printed circuit boards are piled up or handled, the
corners of another printed circuit board should not be
allowed to hit the capacitor in order to avoid a crack or
other damage to the capacitor.
26
Crack
Floor
Mounting printed circuit board
Crack
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!Caution
!Caution (Soldering and Mounting)
■ Soldering and Mounting
1. Mounting Position
1. Confirm the best mounting position and direction that
minimizes the stress imposed on the capacitor during
flexing or bending the printed circuit board.
1-1. Choose a mounting position that minimizes the
stress imposed on the chip during flexing or bending
of the board.
[Component Direction]
Locate chip
horizontal to the
direction in
which stress
acts.
[Chip Mounting Close to Board Separation Point]
Perforation
A
C
Chip arrangement
Worst A-C-(B~D) Best
B
D
Slit
2. Information before Mounting
1. Do not re-use capacitors that were removed from the
equipment.
2. Confirm capacitance characteristics under actual applied
voltage.
3. Confirm the mechanical stress under actual process and
equipment use.
4. Confirm the rated capacitance, rated voltage and other
electrical characteristics before assembly.
5. Prior to use, confirm the Solderability for the capacitors
that were in long-term storage.
6. Prior to measuring capacitance, carry out a heat
treatment for capacitors that were in long-term storage.
7. The use of Sn-Zn based solder will deteriorate the
reliability of the MLCC.
Please contact our sales representative or product
engineers on the use of Sn-Zn based solder in advance.
3. Maintenance of the Mounting (pick and place) Machine
1. Make sure that the following excessive forces are not
applied to the capacitors.
1-1. In mounting the capacitors on the printed circuit
board, any bending force against them shall be kept
to a minimum to prevent them from any bending
damage or cracking. Please take into account the
following precautions and recommendations for use
in your process.
(1) Adjust the lowest position of the pickup nozzle so
as not to bend the printed circuit board.
(2) Adjust the nozzle pressure within a static load of
1N to 3N during mounting.
2. Dirt particles and dust accumulated between the suction
nozzle and the cylinder inner wall prevent the nozzle from
moving smoothly. This imposes greater force upon the
chip during mounting, causing cracked chips. Also the
locating claw, when worn out, imposes uneven forces on
the chip when positioning, causing cracked chips. The
suction nozzle and the locating claw must be maintained,
checked and replaced periodically.
[Incorrect]
Suction Nozzle
Deflection
Board
Board Guide
[Correct]
Support Pin
Continued on the following page.
27
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!Caution (Soldering and Mounting)
Continued from the preceding page.
4-1. Reflow Soldering
1. When sudden heat is applied to the components, the
mechanical strength of the components will decrease
because a sudden temperature change causes
deformation inside the components. In order to prevent
mechanical damage to the components, preheating is
required for both the components and the PCB board.
Preheating conditions are shown in table 1. It is required to
keep the temperature differential between the solder and
the components surface (∆T) as small as possible.
2. Solderability of Tin plating termination chips might be
deteriorated when a low temperature soldering profile
where the peak solder temperature is below the melting
point of Tin is used. Please confirm the Solderability of Tin
plated termination chips before use.
3. When components are immersed in solvent after mounting,
be sure to maintain the temperature difference (∆T)
between the component and the solvent within the range
shown in the table 1.
[Standard Conditions for Reflow Soldering]
,,,
,,,
,,,
,,,
,,,
,,,
,,,
,,,
,,,
Infrared Reflow
Temperature (D)
Soldering
Peak Temperature
Gradual
Cooling
200°C
∆T
170°C
150°C
130°C
Preheating
Time
60-120 seconds 30-60 seconds
Vapor Reflow
Temperature (D)
Soldering
Peak Temperature
Gradual
Cooling
∆T
170°C
150°C
130°C
Table 1
Part Number
Temperature Differential
GRM03/15/18/21/31
∆TV190°C
GCM32
∆TV130°C
Preheating
Recommended Conditions
60-120 seconds
Pb-Sn Solder
Infrared Reflow Vapor Reflow
Lead Free Solder
Time
20 seconds max.
[Allowable Reflow Soldering Temperature and Time]
Peak Temperature
230 to 250°C
230 to 240°C
240 to 260°C
Atmosphere
Air
Air
Air or N2
Pb-Sn Solder: Sn-37Pb
Lead Free Solder: Sn-3.0Ag-0.5Cu
Soldering Temperature (D)
1
280
270
260
250
240
230
220
0
30
60
90
120
Soldering Time (sec.)
In case of repeated soldering, the accumulated
soldering time must be within the range shown above.
4. Optimum Solder Amount for Reflow Soldering
4-1. Overly thick application of solder paste results in a
excessive solder fillet height.
This makes the chip more susceptible to mechanical
and thermal stress on the board and may cause the
chips to crack.
4-2. Too little solder paste results in a lack of adhesive
strength on the outer electrode, which may result in
chips breaking loose from the PCB.
4-3. Make sure the solder has been applied smoothly to
the end surface to a height of 0.2mm* min.
0.2mm∗ min.
∗ GRM03: 1/3 of Chip Thickness min.
in section
Inverting the PCB
Make sure not to impose any abnormal mechanical shocks
to the PCB.
Continued on the following page.
28
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!Caution
!Caution (Soldering and Mounting)
Continued from the preceding page.
4-2. Flow Soldering
Table 2
Part Number
Temperature Differential
Temperature (D)
Soldering
Soldering
Peak
Temperature
Gradual
Cooling
∆T
Preheating
Peak
Temperature
Preheating
30-90 seconds
Time
5 seconds max.
[Allowable Flow Soldering Temperature and Time]
280
270
260
250
240
230
220
0
10
20
30
40
Soldering Time (sec.)
In case of repeated soldering, the accumulated
soldering time must be within the range shown above.
∆TV150°C
GCM18/21/31
,,,,
,,,,
,,,,
,,,
,,,
[Standard Conditions for Flow Soldering]
Soldering Temperature (D)
1. When sudden heat is applied to the components, the
mechanical strength of the components will decrease
because a sudden temperature change causes
deformation inside the components. In order to prevent
mechanical damage in the components, preheating
should be required for both of the components and the
PCB board.
Preheating conditions are shown in table 2. It is required
to keep temperature differential between the solder and
the components surface (∆T) as small as possible.
2. Excessively long soldering time or high soldering
temperature can result in leaching of the outer electrodes,
causing poor adhesion or a reduction in capacitance
value due to loss of contact between electrodes and end
termination.
3. When components are immersed in solvent after
mounting, be sure to maintain the temperature difference
(∆T) between the component and solvent within the range
shown in the table 2.
4. Do not apply flow soldering to chips not listed in table 2.
Recommended Conditions
Pb-Sn Solder
Lead Free Solder
Preheating Peak Temperature
90 to 110°C
100 to 120°C
Soldering Peak Temperature
240 to 250°C
250 to 260°C
Atmosphere
Air
N2
Pb-Sn Solder: Sn-37Pb
Lead Free Solder: Sn-3.0Ag-0.5Cu
5. Optimum Solder Amount for Flow Soldering
5-1. The top of the solder fillet should be lower than the
thickness of components. If the solder amount is
excessive, the risk of cracking is higher during board
bending or any other stressful condition.
Up to Chip Thickness
Adhesive
in section
Continued on the following page.
29
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1
!Caution (Soldering and Mounting)
Continued from the preceding page.
4-3. Correction with a Soldering Iron
1. When sudden heat is applied to the components when
using a soldering iron, the mechanical strength of the
components will decrease because the extreme
temperature change can cause deformations inside the
components. In order to prevent mechanical damage to
the components, preheating is required for both the
components and the PCB board. Preheating conditions,
(The "Temperature of the Soldering Iron Tip", "Preheating
Temperature", "Temperature Differential" between the
iron tip and the components and the PCB), should be
within the conditions of table 3. It is required to keep the
temperature differential between the soldering iron and
the component surfaces (∆T) as small as possible.
2. After soldering, do not allow the component/PCB to
rapidly cool down.
3. The operating time for the re-working should be as short
as possible. When re-working time is too long, it may
cause solder leaching, and that will cause a reduction in
the adhesive strength of the terminations.
4. Optimum Solder amount when re-working with a
Soldering lron
4-1. In case of sizes smaller than 0603, (GCM03/15/18),
the top of the solder fillet should be lower than 2/3's
of the thickness of the component or 0.5mm
whichever is smaller. In case of 0805 and larger
sizes, (GCM21/31/32), the top of the solder fillet
should be lower than 2/3's of the thickness of the
component. If the solder amount is excessive, the
risk of cracking is higher during board bending or
under any other stressful condition.
4-2. A soldering iron with a tip of ø3mm or smaller should
be used. It is also necessary to keep the soldering
iron from touching the components during the
re-work.
4-3. Solder wire with ø0.5mm or smaller is required for
soldering.
Table 3
Part Number
Temperature Preheating Temperature
of Soldering
Differential Atmosphere
Iron Tip Temperature
(∆T)
GCM03/15/18/21/31 350°C max. 150°C min. ∆TV190°C
Air
280°C max. 150°C min. ∆TV130°C
Air
GCM32
*Applicable for both Pb-Sn and Lead Free Solder.
Pb-Sn Solder: Sn-37Pb
Lead Free Solder: Sn-3.0Ag-0.5Cu
Solder Amount
in section
4-4. Leaded Component Insertion
1. If the PCB is flexed when leaded components (such as
transformers and ICs) are being mounted, chips may
crack and solder joints may break.
Before mounting leaded components, support the PCB
using backup pins or special jigs to prevent warping.
5. Washing
Excessive ultrasonic oscillation during cleaning can cause
the PCBs to resonate, resulting in cracked chips or broken
solder joints. Take note not to vibrate PCBs.
Continued on the following page.
30
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!Caution
!Caution (Soldering and Mounting)
Continued from the preceding page.
6. Electrical Test on Printed Circuit Board
1. Confirm position of the support pin or specific jig, when
inspecting the electrical performance of a capacitor after
mounting on the printed circuit board.
1-1. Avoid bending printed circuit board by the pressure
of a test pin, etc.
The thrusting force of the test probe can flex the PCB,
resulting in cracked chips or open solder joints.
Provide support pins on the back side of the PCB to
prevent warping or flexing.
1-2. Avoid vibration of the board by shock when a test pin
contacts a printed circuit board.
[Not Recommended]
Peeling
Test-pin
[Recommended]
Support Pin
Test-pin
7. Printed Circuit Board Cropping
1. After mounting a capacitor on a printed circuit board, do
not apply any stress to the capacitor that is caused by
bending or twisting the board.
1-1. In cropping the board, the stress as shown right may
cause the capacitor to crack.
Try not to apply this type of stress to a capacitor.
[Bending]
[Twisting]
2. Check of the cropping method for the printed circuit
board in advance.
2-1. Printed circuit board cropping shall be carried out by
using a jig or an apparatus to prevent the mechanical
stress which can occur to the board.
(1) Example of a suitable jig
Recommended example: the board should be
pushed as close to the near the cropping jig as
possible and from the back side of board in order
to minimize the compressive stress applied to
capacitor.
Not recommended example* when the board is
pushed at a point far from the cropping jig and
from the front side of board as below, the
capacitor may form a crack caused by the tensile
stress applied to capacitor.
[Outline of Jig]
Printed Circuit Board
Boad Cropping Jig
Recommended
Direction of Load
Printed Circuit Board
V-groove
Not recommended
Direction of Load
Load Point
Components
Load Point
Printed Circuit Board
Components
Continued on the following page.
31
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1
!Caution (Soldering and Mounting)
Continued from the preceding page.
(2) Example of a suitable machine
An outline of a printed circuit board cropping
machine is shown as follows. Along the lines with
the V-grooves on printed circuit board, the top
and bottom blades are aligned to one another
when cropping the board.
The misalignment of the position between top and
bottom blades may cause the capacitor to crack.
[Outline of Machine]
Top Blade
Printed Circuit Board
Top Blade
[Principle of Operation]
Bottom Blade
V-groove
[Cross-section Diagram]
Printed Circuit Board
V-groove
Recommended
32
Not Recommended
Top-bottom Misalignment
Left-right Misalignment
Front-rear Misalignment
Top Blade
Top Blade
Top Blade
Top Blade
Bottom Blade
Bottom Blade
Bottom Blade
Bottom Blade
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!Caution
!Caution (Others)
■ Others
1. Under Operation of Equipment
1-1. Do not touch a capacitor directly with bare hands
during operation in order to avoid the danger of a
electric shock.
1-2. Do not allow the terminals of a capacitor to come in
contact with any conductive objects (short-circuit).
Do not expose a capacitor to a conductive liquid,
inducing any acid or alkali solutions.
1-3. Confirm the environment in which the equipment will
operation is under the specified conditions.
Do not use the equipment under the following
environment.
(1) Being spattered with water or oil.
(2) Being exposed to direct sunlight.
(3) Being exposed to Ozone, ultraviolet rays or
radiation.
(4) Being exposed to toxic gas (e.g., hydrogen sulfide,
sulfur dioxide, chlorine, ammonia gas, etc.)
(5) Any vibrations or mechanical shocks exceeding
the specified limits.
(6) Moisture condensing environments.
1-4. Use damp proof countermeasures if using under any
conditions that can cause condensation.
2. Others
2-1. In an Emergency
(1) If the equipment should generate smoke, fire or
smell, immediately turn off or unplug the
equipment.
If the equipment is not turned off or unplugged,
the hazards may be worsened by supplying
continuous power.
(2) In this type of situation, do not allow face and
hands to come in contact with the capacitor or
burns may be caused by the capacitors high
temperature.
2-2. Disposal of Waste
When capacitors are disposed, they must be burned
or buried by the industrial waste vender with the
appropriate licenses.
2-3. Circuit Design
GRM, GCM, GMA/D, LLL/A/M, ERB, GQM, GJM,
GNM Series capacitors in this catalog are not safety
certified products.
2-4. Remarks
Failure to follow the cautions may result, worst case,
in a short circuit and smoking when the product is
used.
The above notices are for standard applications and
conditions. Contact us when the products are used in
special mounting conditions.
Select optimum conditions for operation as they
determine the reliability of the product after assembly.
The data herein are given in typical values, not
guaranteed ratings.
33
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1
Notice (Rating)
■ Rating
1. Operating Temperature
1. The operating temperature limit depends on the
capacitor.
1-1. Do not apply temperatures exceeding the upper
operating temperature.
It is necessary to select a capacitor with a suitable
rated temperature which will cover the operating
temperature range.
Also it is necessary to consider the temperature
distribution in equipment and the seasonal
temperature variable factor.
1-2. Consider the self-heating of the capacitor
The surface temperature of the capacitor shall be
the upper operating temperature or less when
including the self-heating factors.
2. Atmosphere Surroundings (gaseous and liquid)
1. Restriction on the operating environment of capacitors.
1-1. The capacitor, when used in the above, unsuitable,
operating environments may deteriorate due to
the corrosion of the terminations and the
penetration of moisture into the capacitor.
34
1-2. The same phenomenon as the above may occur
when the electrodes or terminals of the capacitor
are subject to moisture condensation.
1-3. The deterioration of characteristics and insulation
resistance due to the oxidization or corrosion of
terminal electrodes may result in breakdown when
the capacitor is exposed to corrosive or volatile
gases or solvents for long periods of time.
3. Piezo-electric Phenomenon
1. When using high dielectric constant type capacitors in
AC or pulse circuits, the capacitor itself vibrates at
specific frequencies and noise may be generated.
Moreover, when the mechanical vibration or shock is
added to capacitor, noise may occur.
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Notice
Notice (Soldering and Mounting)
■ Soldering and Mounting
1. PCB Design
1. Notice for Pattern Forms
1-1. Unlike leaded components, chip components are
susceptible to flexing stresses since they are
mounted directly on the substrate.
They are also more sensitive to mechanical and
thermal stresses than leaded components.
Excess solder fillet height can multiply these stresses
and cause chip cracking. When designing substrates,
take land patterns and dimensions into consideration
to eliminate the possibility of excess solder fillet
height.
1-2. It is possible for the chip to crack by the expansion
and shrinkage of a metal board. Please contact us if
you want to use our ceramic capacitors on a metal
board such as Aluminum.
Pattern Forms
Prohibited
Correct
Chassis
Solder (ground)
Solder Resist
Placing Close to Chassis
Electrode Pattern
Lead Wire
Solder Resist
Placing
of Chip Components
and Leaded Components
Soldering Iron
Lead Wire
Placing
of Leaded Components
after Chip Component
Solder Resist
Solder Resist
Lateral Mounting
Continued on the following page.
35
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1
Notice (Soldering and Mounting)
Continued from the preceding page.
2. Land Dimensions
2-1. Chip capacitor can be cracked due to the stress of
PCB bending / etc if the land area is larger than
needed and has an excess amount of solder.
Please refer to the land dimensions in table 1 for flow
soldering, table 2 for reflow soldering.
Please confirm the suitable land dimension by
evaluating of the actual SET / PCB.
Land
Chip Capacitor
c
b
Solder Resist
a
Table 1 Flow Soldering Method
Dimensions
Chip (LgW)
a
b
c
GCM18
1.6g0.8
0.6 to 1.0
0.8 to 0.9
0.6 to 0.8
GCM21
2.0g1.25
1.0 to 1.2
0.9 to 1.0
0.8 to 1.1
GCM31
3.2g1.6
2.2 to 2.6
1.0 to 1.1
1.0 to 1.4
Part Number
(in mm)
Table 2 Reflow Soldering Method
Dimensions
Chip (LgW)
a
GCM03
0.6g0.3
0.2 to 0.3
0.2 to 0.35
0.2 to 0.4
GCM15
1.0g0.5
0.3 to 0.5
0.35 to 0.45
0.4 to 0.6
Part Number
b
c
GCM18
1.6g0.8
0.6 to 0.8
0.6 to 0.7
0.6 to 0.8
GCM21
2.0g1.25
1.0 to 1.2
0.6 to 0.7
0.8 to 1.1
GCM31
3.2g1.6
2.2 to 2.4
0.8 to 0.9
1.0 to 1.4
GCM32
3.2g2.5
2.0 to 2.4
1.0 to 1.2
1.8 to 2.3
(in mm)
2. Adhesive Application
1. Thin or insufficient adhesive can cause the chips to
loosen or become disconnected during flow soldering.
The amount of adhesive must be more than dimension c,
shown in the drawing at right, to obtain the correct
bonding strength.
The chip's electrode thickness and land thickness must
also be taken into consideration.
2. Low viscosity adhesive can cause chips to slip after
mounting. The adhesive must have a viscosity of
5000Pa • s (500ps) min. (at 25°C).
3. Adhesive Coverage
Part Number
GCM18
Chip Capacitor
a=20 to 70µm
b=30 to 35µm
c=50 to 105µm
a
c
Board
Adhesive
Land
b
Adhesive Coverage*
0.05mg min.
GCM21
0.1mg min.
GCM31
0.15mg min.
*Nominal Value
3. Adhesive Curing
1. Insufficient curing of the adhesive can cause chips to
disconnect during flow soldering and causes deterioration
in the insulation resistance between the outer electrodes
due to moisture absorption.
Control curing temperature and time in order to prevent
insufficient hardening.
Continued on the following page.
36
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Notice
Notice (Soldering and Mounting)
Continued from the preceding page.
4. Flux Application
1. An excessive amount of flux generates a large quantity of
flux gas, which can cause a deterioration of Solderability.
So apply flux thinly and evenly throughout. (A foaming
system is generally used for flow soldering).
2. Flux containing too a high percentage of halide may
cause corrosion of the outer electrodes unless there is
sufficient cleaning. Use flux with a halide content of 0.1%
max.
3. Do not use strong acidic flux.
4. Do not use water-soluble flux.
(*Water-soluble flux can be defined as non rosin type flux
including wash-type flux and non-wash-type flux.)
5. Flow Soldering
o Set temperature and time to ensure that leaching of the
outer electrode does not exceed 25% of the chip end
area as a single chip (full length of the edge A-B-C-D
shown right) and 25% of the length A-B shown below as
mounted on substrate.
[As a Single Chip]
A
B
D
Outer Electrode
C
[As Mounted on Substrate]
B
A
6. Washing
1. Please evaluate a capacitor by actual cleaning equipment
and condition surely for confirming the quality and select
the applicable solvent.
2. Unsuitable cleaning solvent may leave residual flux, other
foreign substances, causing deterioration of electrical
characteristics and the reliability of the capacitors.
3. Select the proper cleaning conditions.
3-1. Improper cleaning conditions (excessive or
insufficient) may result in the deterioration of the
performance of the capacitors.
7. Coating
1. A crack may be caused in the capacitor due to the stress
of the thermal contraction of the resin during curing
process.
The stress is affected by the amount of resin and curing
contraction.
Select a resin with small curing contraction.
The difference in the thermal expansion coefficient
between a coating resin or a molding resin and capacitor
may cause the destruction and deterioration of the
capacitor such as a crack or peeling, and lead to the
deterioration of insulation resistance or dielectric
breakdown.
Select a resin for which the thermal expansion coefficient
is as close to that of capacitor as possible.
A silicone resin can be used as an under-coating to buffer
against the stress.
2. Select a resin that is less hygroscopic.
Using hygroscopic resins under high humidity conditions
may cause the deterioration of the insulation resistance of
a capacitor.
An epoxy resin can be used as a less hygroscopic resin.
37
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1
Notice (Others)
■ Others
1. Transportation
1. The performance of a capacitor may be affected by the
conditions during transportation.
1-1. The capacitors shall be protected against
excessive temperature, humidity and mechanical
force during transportation.
(1) Climatic condition
• low air temperature: -40°C
• change of temperature air/air: -25°C/+25°C
• low air pressure: 30 kPa
• change of air pressure: 6 kPa/min.
(2) Mechanical condition
Transportation shall be done in such a way that
the boxes are not deformed and forces are not
directly passed on to the inner packaging.
38
1-2. Do not apply excessive vibration, shock, and
pressure to the capacitor.
(1) When excessive mechanical shock or pressure
is applied to a capacitor, chipping or cracking
may occur in the ceramic body of the capacitor.
(2) When a sharp edge of an air driver, a soldering
iron, tweezers, a chassis, etc. impacts strongly
on the surface of capacitor, the capacitor may
crack and short-circuit.
1-3. Do not use a capacitor to which excessive shock
was applied by dropping, etc.
The capacitor dropped accidentally during
processing may be damaged.
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Chip Monolithic Ceramic Capacitors for Automotive
Medium Voltage for Automotive GCM Series Low Dissipation Factor
e
g
e
2
■ Features
T
1. The GCM series meet AEC-Q200 requirements.
2. Low-loss and suitable for high frequency circuits
3. Murata's original internal electrode structure
realizes high flash-over voltage.
4. A new monolithic structure for small, surfacemountable devices capable of operating at high
voltage levels.
5. Sn-plated external electrodes realize good
solderability.
6. Use the GCM21/31 type with flow or reflow soldering,
and other types with reflow soldering only.
L
Part Number
GCM21A
GCM21B
GCM31A
GCM31B
GCM32A
W
Dimensions (mm)
L
W
T
e min.
1.0 +0,- 0.3
2.0 ±0.2 1.25 ±0.2
1.25 ±0.2
1.0 +0,- 0.3
0.3
3.2 ±0.2 1.6 ±0.2
1.25 +0,- 0.3
3.2 ±0.2 2.5 ±0.2 1.0 +0,- 0.3
g min.
0.7
1.5
■ Applications
Ideal for use on high frequency pulse circuits such
as snubber circuits for DC-DC converters.
Electrode g
min.
(mm)
Electrode e
(mm)
1.0
0.7
0.3 min.
1.25
1.0
0.7
0.3 min.
1.25
1.0
0.7
0.3 min.
2.0
1.25
1.0
0.7
0.3 min.
220 ±5%
2.0
1.25
1.0
0.7
0.3 min.
U2J (EIA)
270 ±5%
2.0
1.25
1.0
0.7
0.3 min.
DC250
U2J (EIA)
330 ±5%
2.0
1.25
1.0
0.7
0.3 min.
DC250
U2J (EIA)
390 ±5%
2.0
1.25
1.0
0.7
0.3 min.
GCM21A7U2E471JX01D
DC250
U2J (EIA)
470 ±5%
2.0
1.25
1.0
0.7
0.3 min.
GCM21A7U2E561JX01D
DC250
U2J (EIA)
560 ±5%
2.0
1.25
1.0
0.7
0.3 min.
GCM21A7U2E681JX01D
DC250
U2J (EIA)
680 ±5%
2.0
1.25
1.0
0.7
0.3 min.
GCM21A7U2E821JX01D
DC250
U2J (EIA)
820 ±5%
2.0
1.25
1.0
0.7
0.3 min.
GCM21A7U2E102JX01D
DC250
U2J (EIA)
1000 ±5%
2.0
1.25
1.0
0.7
0.3 min.
GCM21A7U2E122JX01D
DC250
U2J (EIA)
1200 ±5%
2.0
1.25
1.0
0.7
0.3 min.
GCM21A7U2E152JX01D
DC250
U2J (EIA)
1500 ±5%
2.0
1.25
1.0
0.7
0.3 min.
GCM21A7U2E182JX01D
DC250
U2J (EIA)
1800 ±5%
2.0
1.25
1.0
0.7
0.3 min.
GCM21A7U2E222JX01D
DC250
U2J (EIA)
2200 ±5%
2.0
1.25
1.0
0.7
0.3 min.
GCM21B7U2E272JX03L
DC250
U2J (EIA)
2700 ±5%
2.0
1.25
1.25
0.7
0.3 min.
GCM31A7U2E272JX01D
DC250
U2J (EIA)
2700 ±5%
3.2
1.6
1.0
1.5
0.3 min.
GCM21B7U2E332JX03L
DC250
U2J (EIA)
3300 ±5%
2.0
1.25
1.25
0.7
0.3 min.
GCM31A7U2E332JX01D
DC250
U2J (EIA)
3300 ±5%
3.2
1.6
1.0
1.5
0.3 min.
GCM21B7U2E392JX03L
DC250
U2J (EIA)
3900 ±5%
2.0
1.25
1.25
0.7
0.3 min.
GCM31A7U2E392JX01D
DC250
U2J (EIA)
3900 ±5%
3.2
1.6
1.0
1.5
0.3 min.
GCM21B7U2E472JX03L
DC250
U2J (EIA)
4700 ±5%
2.0
1.25
1.25
0.7
0.3 min.
GCM31A7U2E472JX01D
DC250
U2J (EIA)
4700 ±5%
3.2
1.6
1.0
1.5
0.3 min.
GCM21B7U2E562JX03L
DC250
U2J (EIA)
5600 ±5%
2.0
1.25
1.25
0.7
0.3 min.
GCM31A7U2E562JX01D
DC250
U2J (EIA)
5600 ±5%
3.2
1.6
1.0
1.5
0.3 min.
GCM31B7U2E682JX01L
DC250
U2J (EIA)
6800 ±5%
3.2
1.6
1.25
1.5
0.3 min.
GCM31B7U2E822JX01L
DC250
U2J (EIA)
8200 ±5%
3.2
1.6
1.25
1.5
0.3 min.
GCM31B7U2E103JX01L
DC250
U2J (EIA)
10000 ±5%
3.2
1.6
1.25
1.5
0.3 min.
GCM31A7U2J100JX01D
DC630
U2J (EIA)
10 ±5%
3.2
1.6
1.0
1.5
0.3 min.
GCM31A7U2J120JX01D
DC630
U2J (EIA)
12 ±5%
3.2
1.6
1.0
1.5
0.3 min.
GCM31A7U2J150JX01D
DC630
U2J (EIA)
15 ±5%
3.2
1.6
1.0
1.5
0.3 min.
Part Number
Rated Voltage
(V)
TC Code
(Standard)
Capacitance
(pF)
Length L Width W Thickness T
(mm)
(mm)
(mm)
GCM21A7U2E101JX01D
DC250
U2J (EIA)
100 ±5%
2.0
1.25
GCM21A7U2E121JX01D
DC250
U2J (EIA)
120 ±5%
2.0
GCM21A7U2E151JX01D
DC250
U2J (EIA)
150 ±5%
2.0
GCM21A7U2E181JX01D
DC250
U2J (EIA)
180 ±5%
GCM21A7U2E221JX01D
DC250
U2J (EIA)
GCM21A7U2E271JX01D
DC250
GCM21A7U2E331JX01D
GCM21A7U2E391JX01D
Continued on the following page.
39
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• Please
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C03E.pdf
10.5.20
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• This catalog
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• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
Continued from the preceding page.
2
Electrode g
min.
(mm)
Electrode e
(mm)
1.0
1.5
0.3 min.
1.0
1.5
0.3 min.
1.6
1.0
1.5
0.3 min.
3.2
1.6
1.0
1.5
0.3 min.
39 ±5%
3.2
1.6
1.0
1.5
0.3 min.
47 ±5%
3.2
1.6
1.0
1.5
0.3 min.
U2J (EIA)
56 ±5%
3.2
1.6
1.0
1.5
0.3 min.
DC630
U2J (EIA)
68 ±5%
3.2
1.6
1.0
1.5
0.3 min.
GCM31A7U2J820JX01D
DC630
U2J (EIA)
82 ±5%
3.2
1.6
1.0
1.5
0.3 min.
GCM31A7U2J101JX01D
DC630
U2J (EIA)
100 ±5%
3.2
1.6
1.0
1.5
0.3 min.
GCM31A7U2J121JX01D
DC630
U2J (EIA)
120 ±5%
3.2
1.6
1.0
1.5
0.3 min.
GCM31A7U2J151JX01D
DC630
U2J (EIA)
150 ±5%
3.2
1.6
1.0
1.5
0.3 min.
GCM31A7U2J181JX01D
DC630
U2J (EIA)
180 ±5%
3.2
1.6
1.0
1.5
0.3 min.
GCM31A7U2J221JX01D
DC630
U2J (EIA)
220 ±5%
3.2
1.6
1.0
1.5
0.3 min.
GCM31A7U2J271JX01D
DC630
U2J (EIA)
270 ±5%
3.2
1.6
1.0
1.5
0.3 min.
GCM31A7U2J331JX01D
DC630
U2J (EIA)
330 ±5%
3.2
1.6
1.0
1.5
0.3 min.
GCM31A7U2J391JX01D
DC630
U2J (EIA)
390 ±5%
3.2
1.6
1.0
1.5
0.3 min.
GCM31A7U2J471JX01D
DC630
U2J (EIA)
470 ±5%
3.2
1.6
1.0
1.5
0.3 min.
GCM31A7U2J561JX01D
DC630
U2J (EIA)
560 ±5%
3.2
1.6
1.0
1.5
0.3 min.
GCM31A7U2J681JX01D
DC630
U2J (EIA)
680 ±5%
3.2
1.6
1.0
1.5
0.3 min.
GCM31A7U2J821JX01D
DC630
U2J (EIA)
820 ±5%
3.2
1.6
1.0
1.5
0.3 min.
GCM31A7U2J102JX01D
DC630
U2J (EIA)
1000 ±5%
3.2
1.6
1.0
1.5
0.3 min.
GCM32A7U2J122JX01D
DC630
U2J (EIA)
1200 ±5%
3.2
2.5
1.0
1.5
0.3 min.
GCM32A7U2J152JX01D
DC630
U2J (EIA)
1500 ±5%
3.2
2.5
1.0
1.5
0.3 min.
GCM32A7U2J182JX01D
DC630
U2J (EIA)
1800 ±5%
3.2
2.5
1.0
1.5
0.3 min.
GCM32A7U2J222JX01D
DC630
U2J (EIA)
2200 ±5%
3.2
2.5
1.0
1.5
0.3 min.
Part Number
Rated Voltage
(V)
TC Code
(Standard)
Capacitance
(pF)
GCM31A7U2J180JX01D
DC630
U2J (EIA)
18 ±5%
3.2
1.6
GCM31A7U2J220JX01D
DC630
U2J (EIA)
22 ±5%
3.2
1.6
GCM31A7U2J270JX01D
DC630
U2J (EIA)
27 ±5%
3.2
GCM31A7U2J330JX01D
DC630
U2J (EIA)
33 ±5%
GCM31A7U2J390JX01D
DC630
U2J (EIA)
GCM31A7U2J470JX01D
DC630
U2J (EIA)
GCM31A7U2J560JX01D
DC630
GCM31A7U2J680JX01D
40
Length L Width W Thickness T
(mm)
(mm)
(mm)
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Medium Voltage for Automotive GCM Series Low Disspation Specifications
Factor Specifications
TestMethods
Methods
andand
Test
No.
AEC-Q200
Test Item
1
Pre-and Post-Stress
Electrical Test
Specifications
AEC-Q200 Test Method
–
High Temperature The measured and observed characteristics should satisfy the
Exposure (Storage) specifications in the following table.
2
Appearance No marking defects
2
Capacitance Within ±2.5% or ±0.25pF
Change
(Whichever is larger)
Q
QU1000
I.R.
More than 10,000MΩ or 500MΩ · µF
(Whichever is smaller)
Temperature
Cycle
The measured and observed characteristics should satisfy the
specifications in the following table.
Appearance No marking defects
3
4
Capacitance Within ±2.5% or ±0.25pF
Change
(Whichever is larger)
Q
QU1000
I.R.
More than 10,000MΩ or 500MΩ · µF
(Whichever is smaller)
Sit the capacitor for 1000±12 hours at 150±3°C. Let sit for 24±2
hours at room temperature, then measure.
Fix the capacitor to the supporting jig in the same manner and
under the same conditions as (19). Perform the 1000 cycles
according to the 4 heat treatments listed in the following table.
Let sit for 24±2 hours at room temperature, then measure.
Step
1
2
3
4
Temp. (°C) -55+0/-3 Room Temp. 125+3/-0 Room Temp.
Time (min.) 15±3
1
1
15±3
Destructive
Physical Analysis
No defects or abnormalities
Per EIA-469
Moisture
Resistance
The measured and observed characteristics should satisfy the
specifications in the following table.
Apply the 24 hour heat (25 to 65°C) and humidity (80 to 98%)
treatment shown below, 10 consecutive times.
Let sit for 24±2 hours at room temperature, then measure.
Appearance No marking defects
Capacitance Within ±3.0% or ±0.3pF
Change
(Whichever is larger)
QU350
I.R.
More than 10,000MΩ or 500MΩ · µF
(Whichever is smaller)
Humidity
90-98%
Temperature
Q
°C
70
65
60
55
50
45
40
35
30
25
20
15
10
5
0
-5
-10
5
Humidity Humidity Humidity
80-98% 90-98% 80-98%
Humidity
90-98%
+10
-2 °C
Initial measurement
One cycle 24 hours
0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24
Hours
Biased Humidity
The measured and observed characteristics should satisfy the
specifications in the following table.
Appearance No marking defects
6
Capacitance Within ±3.0% or ±0.3pF
Change
(Whichever is larger)
Q
QU200
I.R.
More than 1,000MΩ or 50MΩ · µF
(Whichever is smaller)
Operational Life
The measured and observed characteristics should satisfy the
specifications in the following table.
Appearance No marking defects
7
Apply the rated voltage and DC1.3+0.2/-0V (add 6.8kΩ
resistor) at 85±3°C and 80 to 85% humidity for 1000±12 hours.
Remove and let sit for 24±2 hours at room temperature, then
measure.
The charge/discharge current is less than 50mA.
Capacitance Within ±3.0% or ±0.3pF
Change
(Whichever is larger)
Q
QU350
I.R.
More than 1,000MΩ or 50MΩ · µF
(Whichever is smaller)
Apply voltage as Table for 1000±12 hours at 125±3°C. Let sit
for 24±2 hours at room temperature, then measure.
Rated Voltage
DC250V
DC630V
Applied Voltage
150% of the rated voltage
120% of the rated voltage
The charge/discharge current is less than 50mA.
8
External Visual
No defects or abnormalities
Visual inspection
9
Physical Dimension
Within the specified dimensions
Using calipers and micrometers
Continued on the following page.
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• Please
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10.5.20
sales representatives
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before ordering.
• This catalog
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Medium Voltage forand
Automotive
GCM Series Low Disspation Factor Specifications and Test Methods
Specifications
Test Methods
Continued from the preceding page.
No.
AEC-Q200
Test Item
Specifications
Appearance No marking defects
2
10
Resistance
to Solvents
Capacitance
Within the specified tolerance
Change
Q
QU1000
I.R.
More than 10,000MΩ or 500MΩ · µF
(Whichever is smaller)
AEC-Q200 Test Method
Per MIL-STD-202 Method 215
Solvent 1: 1 part (by volume) of isopropyl alcohol
3 parts (by volume) of mineral spirits
Solvent 2: Terpene defluxer
Solvent 3: 42 parts (by volume) of water
1 part (by volume) of propylene glycol
monomethyl ether
1 part (by volume) of monoethanolomine
Appearance No marking defects
Mechanical
11
Shock
Capacitance
Within the specified tolerance
Change
Q
QU1000
I.R.
More than 10,000MΩ or 500MΩ · µF
(Whichever is smaller)
Appearance No defects or abnormalities
Capacitance
Within the specified tolerance
Change
12 Vibration Q
I.R.
Resistance to
Soldering Heat
QU1000
More than 10,000MΩ or 500MΩ · µF
(Whichever is smaller)
Three shocks in each direction should be applied along 3
mutually perpendicular axes of the test specimen (18 shocks).
The specified test pulse should be Half-sine and should have a
duration: 0.5ms, peak value: 1500g and velocity change: 4.7m/s.
Solder the capacitor to the test jig (glass epoxy board) in the
same manner and under the same conditions as (19). The
capacitor should be subjected to a simple harmonic motion
having a total amplitude of 1.5mm, the frequency being varied
uniformly between the approximate limits of 10 and 2000Hz. The
frequency range, from 10 to 2000Hz and return to 10Hz, should
be traversed in approximately 20 minutes. This motion should be
applied for 12 items in each 3 mutually perpendicular directions
(total of 36 times).
The measured and observed characteristics should satisfy the
specifications in the following table.
Appearance No marking defects
Capacitance
Within the specified tolerance
Change
13
Q
QU1000
I.R.
More than 10,000MΩ or 500MΩ · µF
(Whichever is smaller)
Thermal Shock
The measured and observed characteristics should satisfy the
specifications in the following table.
Appearance No marking defects
14
Capacitance Within ±2.5% or ±0.25pF
Change
(Whichever is larger)
Q
QU1000
I.R.
More than 10,000MΩ or 500MΩ · µF
(Whichever is smaller)
Immerse the capacitor in a eutectic solder solution at 260±5°C for
10±1 seconds. Let sit at room temperature for 24±2 hours, then
measure.
Fix the capacitor to the supporting jig in the same manner and
under the same conditions as (19). Perform the 300 cycles
according to the two heat treatments listed in the following table
(Maximum transfer time is 20 seconds). Let sit for 24±2 hours at
room temperature, then measure.
Step
Temp. (°C)
Time (min.)
1
-55+0/-3
15±3
2
125+3/-0
15±3
Appearance No marking defects
Capacitance
Within the specified tolerance
Change
Per AEC-Q200-002
15 ESD
Q
QU1000
I.R.
More than 10,000MΩ or 500MΩ · µF
(Whichever is smaller)
(a) Preheat at 155°C for 4 hours. After preheating, immerse the
capacitor in a solution of ethanol (JIS-K-8101) and rosin (JISK-5902) (25% rosin in weight proportion). Immerse in eutectic
solder solution for 5+0/-0.5 seconds at 235±5°C.
16 Solderability
95% of the terminations is to be soldered evenly and
continuously.
(b) Should be placed into steam aging for 8 hours±15 minutes.
After preheating, immerse the capacitor in a solution of
ethanol (JIS-K-8101) and rosin (JIS-K-5902) (25% rosin in
weight proportion). Immerse in eutectic solder solution for
5+0/-0.5 seconds at 235±5°C.
(c) Should be placed into steam aging for 8 hours±15 minutes.
After preheating, immerse the capacitor in a solution of
ethanol (JIS-K-8101) and rosin (JIS-K-5902) (25% rosin in
weight proportion). Immerse in eutectic solder solution for 120
±5 seconds at 260±5°C.
Continued on the following page.
42
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• Please
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C03E.pdf
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sales representatives
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before ordering.
• This catalog
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typical specifications
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• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
Medium Voltage for Automotive GCM Series Low Disspation Specifications
Factor Specifications
TestMethods
Methods
andand
Test
Continued from the preceding page.
No.
AEC-Q200
Test Item
AEC-Q200 Test Method
Appearance No defects or abnormalities
Visual inspection.
Capacitance
Within the specified tolerance
Change
The capacitance/Q should be measured at 25°C at the frequency
and voltage shown in the table.
Q
Electrical
17 Characterization
Specifications
Capacitance
CF1000pF
CU1000pF
QU1000
25°C
More than 100,000MΩ or 1,000MΩ · µF
(Whichever is smaller)
Max. Operating Temperature···125°C
More than 10,000MΩ or 100MΩ · µF
(Whichever is smaller)
No failure should be observed when voltage in Table is applied
between the terminations for 1 to 5 seconds, provided the
charge/discharge current is less than 50mA.
No failure
Rated Voltage
DC250V
DC630V
Appearance No marking defects
Board
Flex
Test Voltage
200% of the rated voltage
150% of the rated voltage
Solder the capacitor on the test jig (glass epoxy board) shown in
Fig. 1 using a eutectic solder. Then apply a force in the direction
shown in Fig. 2 for 5±1 seconds. The soldering should be done
by the reflow method and should be conducted with care so that
the soldering is uniform and free of defects such as heat shock.
Capacitance Within ±5.0% or ±0.5pF
Change
(Whichever is larger)
Type
GCM21
GCM31
GCM32
b
a
0.8
2.0
2.0
b
3.0
4.4
4.4
c
1.3
1.7
2.6
(in mm)
C
20
40
18
Voltage
AC0.5 to 5V(r.m.s.)
AC1±0.2V(r.m.s.)
The insulation resistance should be measured with a DC voltage
not exceeding the rated voltage at 25°C and 125°C and within 2
minutes of charging.
I.R.
Dielectric
Strength
Frequency
1±0.2MHz
1±0.2kHz
50
Pressunzing
speed: 1.0mm/s
Pressurize
a
R4
100
t: 1.6mm
Fig. 1
Capacitance meter
45
45
Flexure: V3
Fig. 2
Appearance No marking defects
Capacitance
Within the specified tolerance
Change
Q
QU1000
Solder the capacitor to the test jig (glass epoxy board) shown in
Fig. 3 using a eutectic solder. Then apply 18N force in parallel
with the test jig for 60 seconds.
The soldering should be done by the reflow method and should
be conducted with care so that the soldering is uniform and free
of defects such as heat shock.
Type
GCM21
GCM31
GCM32
b
4.0
5.0
5.0
c
1.65
2.0
2.9
Terminal
Strength
(in mm)
c
More than 10,000MΩ or 500MΩ · µF
(Whichever is smaller)
a
I.R.
b
19
a
1.2
2.2
2.2
t: 1.6mm
Solder resist
Baked electrode or
copper foil
Fig. 3
Continued on the following page.
43
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• Please
read rating and
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soldering,
mounting
and handling)
this catalog
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10.5.20
sales representatives
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engineers
before ordering.
• This catalog
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• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
Medium Voltage forand
Automotive
GCM Series Low Disspation Factor Specifications and Test Methods
Specifications
Test Methods
Continued from the preceding page.
No.
AEC-Q200
Test Item
Specifications
AEC-Q200 Test Method
Place the capacitor in the beam load fixture as Fig. 4.
Apply a force.
< Chip L dimension: 2.5mm max. >
2
Iron Board
20 Beam Load Test
The chip endure following force.
< Chip L dimension: 2.5mm max. >
Chip thickness G 0.5mm rank: 20N
Chip thickness V 0.5mm rank: 8N
< Chip L dimension: 3.2mm min. >
Chip thickness F 1.25mm rank: 15N
Chip thickness U 1.25mm rank: 54.5N
< Chip L dimension: 3.2mm min. >
L
0.6 L
Fig. 4
Speed supplied the Stress Load: 2.5mm / s
-750±120 ppm/°C
Capacitance (Temp. Range: +25 to +125°C)
Change
-750±120, -347 ppm/°C
(Temp. Range: -55 to +25°C)
21
Capacitance
Temperature
Characteristics
Capacitance
Drift
44
Within ±0.5% or ±0.05 pF
(Whichever is larger)
The capacitance change should be measured after 5 minutes
at each specified temperature stage.
The temperature coefficient is determined using the capacitance
measured in step 3 as a reference. When cycling the
temperature sequentially from step1 through 5 the capacitance
should be within the specified tolerance for the temperature
coefficient. The capacitance drift is calculated by dividing the
differences between the maximum and minimum measured
values in steps 1, 3 and 5 by the capacitance value in step 3.
Step
1
2
3
4
5
Temperature (°C)
25±2
-55±3
25±2
125±3
25±2
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GCM2195C2A120JD27J GCM219R72A271KD46F GCM2165C1H471JA02D GCM1885C1H470JA16D
GCM319R72A681KD79D GCM1885C1H100FA16D GCM1885C1H101JA02D GCM21BR71C334KC01L
GCM21BR71H104KA02K GCM188R71C104KA13D GCM188R11H103KA01D GCM1882C1H270JD01D
GCM1882C1H101JD01D GCM1885C1H3R0CD43D GCM1885C1H3R0CD27D GCM1885C1H4R0CD27D
GCM188R11H331KD01D GCM2165C1H180JD01D GCM2165C1H180JD14D GCM21BR71A105KC16L
GCM21BR71A105KC02K GCM1885C1H120JD30E GCM2162C1H680JD14D GCM188R71E273JA02D
GCM188R71E223KA02D GCM2165C1H820JD43D GCM219R71H123KA01D GCM188R71C473KA02J
GCM1882C1H5R0CD01D GCM188R11C104KA13D GCM32RR71H105MA17L GCM21BR71H473KD58E
GCM2165C1H220JD43D GCM21BR72A103KA02L GCM21BR72A103KA01K GCM188R71H331KD01D
GCM1885C1H180JA02D GCM1885C1H9R1CD43D GCM216R11H821KA01D GCM32ER71E225KA02L
GCM31MR71A225KC25L GCM32ER71E225MA02L GCM216R71H472KA19D GCM216R71H472KA26D
GCM216R71H472KA01K GCM1885C1H270JA01D GCM188R11H102KA01D GCM31MR71H154KA37L
GCM1885C1H8R0BZ13D GCM1885C2A102JA16D GCM188R71C104KA37D GCM188R72A103KA37D
GCM1885C1H1R0CZ13D GCM3195C1H223JA16D GCM21BR71C225KA64L GCM1555C1H100JZ13D
GCM32ER71H475KA55L GCM155R71C104KA55D GCM31CR71H225KA55L GCM2195C2A152JA16D
GCM1885C2A101JA16D GCM188R71C474KA55D GCM188R71H104KA57D GCM1885C2A100JA16D
GCM1555C1H1R0CZ13D GCM31CR71A106KA64L GCM3195C2A562JA16D GCM1885C1H102JA16D
GCM155R72A472KA37D GCM155R71E473KA55D GCM155R71H102KA37D GCM155R72A102KA37D
GCM188R71H103KA37D GCM155R71H223KA55D GCM31CR71E475KA55L GCM1885C1H100JA16D
GCM2195C1H103JA16D GCM21BR71E225KA73L GCM32ER71A226KE12L GCM21BR71E105KA56L
GCM1885C2A1R0CZ13D GCM31CR71C106KA64L GCM188R72A102KA37D GCM188R71H102KA37D
GCM188R71E474KA64D GCM188R72A223KA37D GCM1555C1H471JA16D GCM155R71H103KA55D
GCM1555C1H101JZ13D GCM21BR72A104KA37L GCM32ER71E106KA57L GCM155R71H681KA37D
GCM32ER71E225KA17L GCM31MR71C105KC23L GCM31MR71C105KC21L GCM31MR71C105KC02L
GCM31MR71C105KC18K GCM31MR71C105KC16L GCM32ER71H105MA17L GCM216R71H222KA19D