Cypress CYW43903KUBG Wicedâ ¢ ieee 802.11 a/b/g/n soc with anembedded applications processor Datasheet

CYW43903
PRELIMINARY
WICED™ IEEE 802.11 a/b/g/n SoC with an
Embedded Applications Processor
The Cypress CYW43903 embedded wireless system-on-a-chip (SoC) is uniquely suited for Internet-of-Things applications. It supports all rates specified in the IEEE 802.11 b/g/n specifications.The device includes an ARM Cortex-based applications processor, a
single stream IEEE 802.11n MAC/baseband/radio, a power amplifier (PA), and a receive low-noise amplifier (LNA). It also supports
optional antenna diversity for improved RF performance in difficult environments.
The CYW43903 is an optimized SoC targeting embedded Internet-of-Things applications in the industrial and medical sensor, home
appliance markets. Using advanced design techniques and process technology to reduce active and idle power, the device is
designed for embedded applications that require minimal power consumption and a compact size.
The device includes a PMU for simplifying system power topology and allows for direct operation from a battery while maximizing
battery life.
Cypress Part Numbering Scheme
Cypress is converting the acquired IoT part numbers from Broadcom to the Cypress part numbering scheme. Due to this conversion,
there is no change in form, fit, or function as a result of offering the device with Cypress part number marking. The Table 1 provides
Cypress ordering part number that matches an existing IoT part number.
Table 1. Mapping Table for Part Number between Broadcom and Cypress
Broadcom Part Number
Cypress Part Number
BCM43903
CYW43903
BCM43903KUBG
CYW43903KUBG
Features
Application Processor Features
■
ARM Cortex-R4 32-bit RISC processor.
■
1 MB of on-chip SRAM for code and data.
■
An on-chip cryptography core
■
640 KB of ROM containing WICED SDK components such
as RTOS and TCP/IP stack.
■
17 GPIOs supported.
■
Q-SPI serial flash interface to support up to 40 Mbps of peak
transfer.
■
Support for UART (3), SPI or CSC master, interfaces.
(Cypress Serial Control (CSC) is an I2C-compatible interface.)
■
On-chip power and low-noise amplifiers.
■
An internal fractional nPLL allows support for a wide range of
reference clock frequencies.
■
Integrated ARM Cortex-R4 processor with tightly coupled
memory for complete WLAN subsystem functionality, minimizing the need to wake up the applications processor for
standard WLAN functions (to further minimize power consumption while maintaining the ability to upgrade to future
features in the field).
■
Software architecture supported by standard WICED SDK
allows easy migration from existing discrete MCU designs
and to future devices.
■
Key IEEE 801.11x Features
■
Single-band 2.4 GHz IEEE 802.11n compliant.
■
Single-stream spatial multiplexing up to 72 Mbps.
■
Supports 20 MHz channels with optional SGI.
■
Full IEEE 802.11 b/g legacy compatibility with enhanced performance.
■
TX and RX low-density parity check (LDPC) support for
improved range and power efficiency.
Cypress Semiconductor Corporation
Document Number: 002-14826 Rev. *G
•
Security support:
WPA and WPA2 (Personal) support for powerful encryption and authentication.
❐ AES and TKIP in hardware for faster data encryption and
IEEE 802.11i compatibility.
❐ Reference WLAN subsystem provides Cisco Compatible
Extensions (CCX, CCX 2.0, CCX 3.0, CCX 4.0, and CCX
5.0).
❐ Wi-Fi Protected Setup and Wi-Fi Easy-Setup
Worldwide regulatory support: Global products supported
with worldwide design approval.
❐
■
198 Champion Court
•
San Jose, CA 95134-1709
•
408-943-2600
Revised January 11, 2018
PRELIMINARY
CYW43903
General Features
■
Supports battery voltage range from 3.0V to 4.8V with an
internal switching regulator.
■
Programmable dynamic power management.
■
6 Kb OTP memory for storing board parameters.
■
151-ball WLBGA (4.91mm x 5.85mm, 0.4 mm pitch).
Figure 1. Functional Block Diagram
CYW43903
1 MB RAM,
640 KB ROM
UART
SPI
APPS ARM
Cortex-R4
32 KB (I),
32 KB (D)
ICACHE
CSC
PWM (6)
PWM
CSC
SPI
SPI or CSC
AXI to AXI
Bridge
GPIO
GPIO (17)
TCM
512 KB RAM
320 KB ROM
JTAG
WLAN
ARM
Cortex-R4
AXI-to-AXI
Bridge
Crytography
Engine
AXI
AXI
DMA
32 kHz
External LPO
WLAN
APPS Domain
IEEE 802.11 MAC
RF Switch Controls
1 x 1, IEEE 802.11n PHY
Always-On Domain
REG_ON
HIB_REG_ON_IN
AXI
SR_Eng
PMU
Control
VBAT
PS RAM
LNA
PMU
TX
Switch
PS
VIO
2.4 GHz Radio
AXI-to-AXI
Bridge
2.4 GHz
37.4 MHz Crystal
PA
TX
Switch
CSC = Cypress Serial Control. An I2C‐compatible interface.
WRF_PAOUT_2G
WRF_RFIN_2G
Document Number: 002-14826 Rev. *G
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PRELIMINARY
CYW43903
Contents
1. Overview ............................................................ 5
1.1
Introduction ......................................................... 5
1.1.1 Features .................................................. 6
1.2
Standards Compliance ........................................ 7
2. Power Supplies and Power Management ....... 8
2.1
Power Supply Topology ...................................... 8
2.2
CYW43903 Power Management Unit Features .. 8
2.3
Power Management .......................................... 11
2.4
PMU Sequencing .............................................. 11
2.5
Power-Off Shutdown ......................................... 12
2.6
Power-Up/Power-Down/Reset Circuits ............. 12
3. Frequency References ................................... 13
3.1
Crystal Interface and Clock Generation ............ 13
3.2
External Frequency Reference ......................... 14
3.3
External 32.768 kHz Low-Power Oscillator ....... 15
4. Applications Subsystem ................................ 16
7.2.8 MAC-PHY Interface ................................24
7.3
IEEE 802.11™ b/g/n PHY ...................................25
8. WLAN Radio Subsystem ............................... 26
8.1
Receiver Path .....................................................26
8.2
Transmit Path .....................................................26
8.3
Calibration ..........................................................26
9. Pinout and Signal Descriptions..................... 27
9.1
Ball Map .............................................................27
9.2
Ball List ...............................................................28
9.3
Signal Descriptions ............................................30
10. GPIO Signals and Strapping Options ........... 34
10.1 Overview ............................................................34
10.2 Weak Pull-Down and Pull-Up Resistances ........34
10.3 Strapping Options ..............................................34
10.4 Alternate GPIO Signal Functions .......................35
11. Pin Multiplexing .............................................. 36
4.1
Overview ........................................................... 16
4.2
Applications CPU and Memory Subsystem ...... 16
12. I/O States ......................................................... 38
4.3
Memory-to-Memory DMA Core ......................... 16
13. Electrical Characteristics............................... 40
4.4
Cryptography Core ............................................ 16
13.1 Absolute Maximum Ratings ...............................40
5. Applications Subsystem External Interfaces 17
13.2 Environmental Ratings .......................................41
5.1
GPIO ................................................................. 17
5.2
Cypress Serial Control ...................................... 17
5.3
JTAG and ARM Serial Wire Debug ................... 17
5.4
PWM ................................................................. 18
5.5
SPI Flash ........................................................... 18
5.6
UART ................................................................ 18
5.7
SPI .................................................................... 19
6. Global Functions............................................. 20
6.1
External Coexistence Interface ......................... 20
6.2
One-Time Programmable Memory .................... 20
6.3
Hibernation Block .............................................. 20
6.4
System Boot Sequence ..................................... 21
7. Wireless LAN Subsystem............................... 22
7.1
WLAN CPU and Memory Subsystem ............... 22
7.2
IEEE 802.11n MAC ........................................... 22
7.2.1 PSM ....................................................... 23
7.2.2 WEP ...................................................... 23
7.2.3 TXE ........................................................ 23
7.2.4 RXE ....................................................... 24
7.2.5 IFS ......................................................... 24
7.2.6 TSF ........................................................ 24
7.2.7 NAV ....................................................... 24
Document Number: 002-14826 Rev. *G
13.3 Electrostatic Discharge Specifications ...............41
13.4 Recommended Operating Conditions and DC
Characteristics ...................................................41
13.5 Power Supply Segments ....................................43
13.6 GPIO, UART, and JTAG Interfaces DC
Characteristics ...................................................43
14. WLAN RF Specifications................................ 44
14.1 Introduction ........................................................44
14.2 2.4 GHz Band General RF Specifications ..........44
14.3 WLAN 2.4 GHz Receiver Performance
Specifications .....................................................45
14.4 WLAN 2.4 GHz Transmitter Performance
Specifications .....................................................47
14.5 General Spurious Emissions Specifications .......48
14.5.1 Transmitter Spurious Emissions
Specifications .........................................48
14.5.2 Receiver Spurious Emissions
Specifications .........................................48
15. Internal Regulator Electrical Specifications. 49
15.1 Core Buck Switching Regulator .........................49
15.2 3.3V LDO (LDO3P3) ..........................................50
15.3 CLDO .................................................................51
15.4 LNLDO ...............................................................52
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CYW43903
15.5 BBPLL LDO ....................................................... 53
19. Thermal Information ....................................... 61
16. System Power Consumption ......................... 54
19.1 Package Thermal Characteristics ......................61
16.1 WLAN Current Consumption ............................. 54
16.1.1 2.4 GHz Mode ....................................... 54
19.2 Junction Temperature Estimation and PSIJT
Versus THETAJC ............................................................. 61
17. SPI Flash Characteristics............................... 55
17.1 SPI Flash Timing ............................................... 55
17.1.1 Read-Register Timing ............................ 55
17.1.2 Write-Register Timing ............................ 56
17.1.3 Memory Fast-Read Timing .................... 57
17.1.4 Memory-Write Timing ............................ 58
17.1.5 SPI Flash Parameters ........................... 59
19.3 Environmental Characteristics ...........................61
20. Mechanical Information.................................. 62
21. Ordering Information...................................... 63
22. Additional Information ................................... 63
22.1 Acronyms and Abbreviations .............................63
22.2 IoT Resources ....................................................63
18. Power-Up Sequence and Timing ................... 60
22.3 Errata .................................................................63
18.1 Sequencing of Reset and Regulator Control
Signals .............................................................. 60
18.1.1 Description of Control Signals ............... 60
18.1.2 Control Signal Timing Diagrams ............ 60
Document History Page ................................................. 64
Document Number: 002-14826 Rev. *G
Sales, Solutions, and Legal Information ...................... 65
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PRELIMINARY
CYW43903
1. Overview
1.1 Introduction
The Cypress CYW43903 is a single-chip device that provides the highest level of integration for an embedded system-on-a-chip with
integrated IEEE 802.11 b/g/n MAC/baseband/radio and a separate ARM Cortex-R4 applications processor. It provides a small formfactor solution with minimal external components to drive down cost for mass volumes and allows for an embedded system with
flexibility in size, form, and function. Comprehensive power management circuitry and software ensure that the system can meet the
needs of highly embedded systems that require minimal power consumption and reliable operation.
Figure 2 shows the interconnect of all the major physical blocks in the CYW43903 and their associated external interfaces, which are
described in greater detail in Applications Subsystem External Interfaces.
Figure 2. Block Diagram and I/O
CYW43903
RF TX
SPI Flash
APPS Subsystem
WLAN Subsystem
ARM Cortex‐R4
160 MHz
32 KB I‐cache
32 KB D‐cache
ARM Cortex‐R4
160 MHz
448 KB ROM TCM
576 KB SRAM TCM
1 MB SRAM
640 KB ROM
802.11n
1x1
2.4 GHz
RF RX
GPIO[16:0]
2x 2-Wire UART
4-Wire UART
SPI/CSC
CSC
JTAG/SWD
WAKE
Switch Control
Antenna Diversity
VDDIOs
GND
Note: Another SPI interface can be defined by reconfiguring GPIO_8 through GPIO_11 and another CSC interface can be defined
by reconfiguring GPIO_12 and GPIO_13 (see Table 11, “Pin Multiplexing,”).
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PRELIMINARY
CYW43903
1.1.1 Features
The CYW43903 supports the following features:
■
ARM Cortex-R4 clocked at 160 MHz.
■
1 MB of SRAM and 640 KB ROM available for the applications processor.
■
One high-speed 4-wire UART interface with operation up to 4 Mbps.
■
Two low-speed 2-wire UART interfaces multiplexed on general purpose I/O (GPIO) pins.
■
One dedicated CSC1 interface.
Note: Another CSC interface can be defined by reconfiguring GPIOs. See Table 11, “Pin Multiplexing,”.
■
One SPI master interface with operation up to 24 MHz.
Either or both of the SPI interfaces can be used as CSC master interfaces. This is in addition to the two dedicated CSC interfaces.
Note: In addition to the dedicated CSC interface, the SPI interface can be used as a CSC master interface.
Note: Another SPI interface can be defined by reconfiguring GPIOs. See Table 11, “Pin Multiplexing,”.
■
One SPI master interface for serial flash.
■
Six dedicated PWM outputs.
■
17 GPIOs.
■
IEEE 802.11 b/g/n 1×1 2.4 GHz radio.
■
Single- and dual-antenna support.
1.Cypress Serial Control (CSC) is an I2C-compatible interface.
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CYW43903
1.2 Standards Compliance
The CYW43903 supports the following standards:
■
IEEE 802.11n
■
IEEE 802.11b
■
IEEE 802.11g
■
IEEE 802.11d
■
IEEE 802.11h
■
IEEE 802.11i
■
Security:
■
❐
WEP
❐
WPA Personal
❐
WPA2 Personal
❐
WMM
❐
WMM-PS (U-APSD)
❐
WMM-SA
❐
AES (hardware accelerator)
❐
TKIP (hardware accelerator)
❐
CKIP (software support)
Proprietary Protocols:
❐
CCXv2
❐
CCXv3
❐
CCXv4
❐
CCXv5
❐
WFAEC
The CYW43903 supports the following additional standards:
■
IEEE 802.11r—Fast Roaming (between APs)
■
IEEE 802.11w—Secure Management Frames
■
IEEE 802.11 Extensions:
■
IEEE 802.11e QoS enhancements (already supported as per the WMM specification)
■
IEEE 802.11i MAC enhancements
■
IEEE 802.11k radio resource measurement
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CYW43903
2. Power Supplies and Power Management
2.1 Power Supply Topology
One core buck regulator, multiple LDO regulators, and a power management unit (PMU) are integrated into the CYW43903. All
regulators are programmable via the PMU. These blocks simplify power supply design for application and WLAN functions in
embedded designs.
A single VBAT (3.0V to 4.8V DC maximum) and VIO supply (1.8V to 3.3V) can be used, with all additional voltages being provided
by the regulators in the CYW43903.
The REG_ON control signal is used to power up the regulators and take the appropriate sections out of reset. The CBUCK, CLDO,
LNLDO, and other regulators power up when any of the reset signals are deasserted. All regulators are powered down only when
REG_ON is deasserted. The regulators may be turned off/on based on the dynamic demands of the digital baseband.
The CYW43903 provides a low power-consumption mode whereby the CBUCK, CLDO, and LNLDO regulators are shut down. When
in this state, the low-power linear regulator (LPLDO1) supplied by the system VIO supply provides the CYW43903 with all required
voltages.
2.2 CYW43903 Power Management Unit Features
The CYW43903 supports the following Power Management Unit (PMU) features:
■
VBAT to 1.35Vout (550 mA maximum) core buck (CBUCK) switching regulator
■
VBAT to 3.3Vout (450 mA maximum) LDO3P3
■
1.35V to 1.2Vout (350 mA maximum) CLDO with bypass mode for deep-sleep
■
1.35V to 1.2Vout (55 mA maximum) LDO for BBPLL
■
Additional internal LDOs (not externally accessible)
■
PMU internal timer auto-calibration by the crystal clock for precise wake-up timing from the low power-consumption mode.
Figure 3 and Figure 4 show the regulators and a typical power topology.
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PRELIMINARY
CYW43903
Figure 3. Typical Power Topology (Page 1 of 2)
WLRF TX Mixer and PA (not always)
CYW43903 1.2V
VBAT
Operational:
2.3V to 4.8V
Performance:
3.0V to 4.8V
Absolute Maximum: 5.5V
VDDIO
Operational:
3.3V
Cap-less
LNLDO
1.2V
Cap-less
LNLDO
1.2V
Cap-less
VCOLDO
1.2V
Cap-less
LNLDO
1.2V
Cap-less
LNLDO
1.2V
15 mA
XTAL LDO
1.2V
Mini‐PMU
(Inside WL Radio)
VBAT
1.35V
Core Buck
Regulator
(CBUCK)
CLDO
WLRF LOGEN
WLRF LNA
WLRF AFE and TIA
WLRF TX
WLRF ADC REF
WLRF XTAL
WLRF RFPLL, PFD, and MMD
1.3V, 1.2V,
.095V (AVS)
WLAN/CLB/Top, Always On
WL PHY
WL Subcore
WL VDDM (SRAMS in AOS)
APPS VDDM
VDDIO
LPLDO1
1.35V
APPS SOCSRAM
APPS Subcore
REG_ON
BBPLL
LNLDO
1.2V
Supply ball
Supply bump/pad
Power
switch
Ground ball
Ground bump/pad
No power switch
WLAN reset
ball
External to chip
No dedicated power switch, but internal power‐
down modes and block‐specific power switches
Document Number: 002-14826 Rev. *G
WL BBPLL/DFLL
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PRELIMINARY
CYW43903
Figure 4. Typical Power Topology (Page 2 of 2)
CYW43903 2.5V and 3.3V
450 to
800 mA
WLRF PA
3.3V
VBAT
LDO3P3
WLRF Pad
VDDIO_RF
WL OTP 3.3V
2.5V Cap-less
LNLDO
WL RF RX, TX, NMOS, Mini-PMU LDOs
2.5V Cap-less
LNLDO
2.5V
2.5V Cap-less
LNLDO
2.5V
WL RF VCO
WL RF CP
VCOLDO2P5
Inside WL Radio
Supply ball
Supply bump/pad
Power
switch
Ground ball
Ground bump/pad
No power switch
External to chip
No dedicated power switch, but internal power‐
down modes and block‐specific power switches
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CYW43903
2.3 Power Management
The CYW43903 has been designed with the stringent power consumption requirements of mobile devices in mind. All areas of the
chip design are optimized to minimize power consumption. Silicon processes and cell libraries were chosen to reduce leakage current
and supply voltages. Additionally, the CYW43903 includes an advanced Power Management Unit (PMU) sequencer. The PMU
sequencer provides significant power savings by putting the CYW43903 into various power management states appropriate to the
environment and activities that are being performed. The power management unit enables and disables internal regulators, switches,
and other blocks based on a computation of the required resources and a table that describes the relationship between resources
and the time needed to enable and disable them. Power-up sequences are fully programmable. Configurable, free-running counters
(running at a 32.768 kHz LPO clock) in the PMU sequencer are used to turn on and turn off individual regulators and power switches.
Clock speeds are dynamically changed (or gated altogether) as a function of the mode. Slower clock speeds are used whenever
possible.
Table 2 provides descriptions for the CYW43903 power modes.
Table 2. CYW43903 Power Modes
Mode
Description
Active
All WLAN blocks in the CYW43903 are powered up and fully functional with active carrier sensing and frame
transmission and receiving.
All required regulators are enabled and put in the most efficient mode based on the load current. Clock speeds
are dynamically adjusted by the PMU sequencer.
Doze
The radio, analog domains, and most of the linear regulators are powered down.
The rest of the CYW43903 remains powered up in an idle state. All main clocks (PLL, crystal oscillator, or
TCXO) are shut down to minimize active power consumption. The 32.768 kHz LPO clock is available only for
the PMU sequencer. This condition is necessary to allow the PMU sequencer to wake up the chip and transition
to Active mode. In Doze mode, the primary power consumed is due to leakage current.
Deep-sleep
Most of the chip, including both analog and digital domains and most of the regulators, is powered off.
Logic states in the digital core are saved and preserved in a retention memory in the Always-On domain before
the digital core is powered off. Upon a wake-up event triggered by the PMU timers or an external interrupt, logic
states in the digital core are restored to their pre-deep-sleep settings to avoid lengthy HW reinitialization.
Power-down
The CYW43903 is effectively powered off by shutting down all internal regulators.
The chip is brought out of this mode by external logic re-enabling the internal regulators.
2.4 PMU Sequencing
The PMU sequencer minimizes system power consumption. It enables and disables various system resources based on a computation of required resources and a table that describes the relationship between resources and the time required to enable and disable
them.
Resource requests can come from several sources: clock requests from cores, the minimum resources defined in the ResourceMin
register, and the resources requested by any active resource-request timers. The PMU sequencer maps clock requests into a set of
resources required to produce the requested clocks.
Each resource is in one of the following four states:
■
enabled
■
disabled
■
transition_on
■
transition_off
The timer contains 0 when the resource is enabled or disabled and a nonzero value when in a transition state. The timer is loaded
with the time_on or time_off value of the resource after the PMU determines that the resource must be enabled or disabled and
decrements on each 32.768 kHz PMU clock. When it reaches 0, the state changes from transition_off to disabled or transition_on to
enabled. If the time_on value is 0, the resource can transition immediately from disabled to enabled. Similarly, a time_off value of 0
indicates that the resource can transition immediately from enabled to disabled. The terms enable sequence and disable sequence
refer to either the immediate transition or the timer load-decrement sequence.
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CYW43903
During each clock cycle, the PMU sequencer performs the following actions:
■
Computes the required resource set based on requests and the resource dependency table.
■
Decrements all timers whose values are nonzero. If a timer reaches 0, the PMU clears the ResourcePending bit of the resource
and inverts the ResourceState bit.
■
Compares the request with the current resource status and determines which resources must be enabled or disabled.
■
Initiates a disable sequence for each resource that is enabled, is no longer being requested, and has no powered-up dependents.
■
Initiates an enable sequence for each resource that is disabled, is being requested, and has all of its dependencies enabled.
2.5 Power-Off Shutdown
The CYW43903 provides a low-power shutdown feature that allows the device to be turned off while the host, and any other system
devices remain operational. When the CYW43903 is not needed in the system, VDDIO_RF and VDDC are shut down while VDDIO
remains powered. This allows the CYW43903 to be effectively off while keeping the I/O pins powered so that they do not draw extra
current from devices connected to the I/O.
During a low-power shutdown state, provided VDDIO remains applied to the CYW43903, all outputs are tristated and most inputs
signals are disabled. Input voltages must remain within the limits defined for normal operation. This is done to prevent current paths
or create loading on any digital signals in the system, and enables the CYW43903 to be fully integrated in an embedded device while
taking full advantage of the lowest power-saving modes.
When the CYW43903 is powered on from this state, it is the same as a normal power-up and does not retain any information about
its state from before it was powered down.
2.6 Power-Up/Power-Down/Reset Circuits
The CYW43903 has two signals (see Table 3) that enable or disable circuits and the internal regulator blocks, allowing the host to
control power consumption. For timing diagrams of these signals and the required power-up sequences, see Power-Up Sequence
and Timing.
Table 3. Power-Up/Power-Down/Reset Control Signals
Signal
Description
REG_ON
This signal is used by the PMU to power up the CYW43903. It controls the internal CYW43903 regulators.
When this pin is high, the regulators are enabled and the device is out of reset. When this pin is low, the device
is in reset and the regulators are disabled. This pin has an internal 200 k pull-down resistor that is enabled
by default. It can be disabled through programming.
HIB_REG_ON_IN
This signal is used by the hibernation block to decide whether or not to power down the internal CYW43903
regulators. If HIB_REG_ON_IN is low, the regulators will be disabled. For a signal at HIB_REG_ON_IN to
function as intended, HIB_REG_ON_OUT must be connected to REG_ON.
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CYW43903
3. Frequency References
An external crystal is used for generating all radio frequencies and normal-operation clocking. As an alternative, an external frequency
reference can be used. In addition, a low-power oscillator (LPO) is provided for lower power mode timing.
3.1 Crystal Interface and Clock Generation
The CYW43903 can use an external crystal to provide a frequency reference. The recommended crystal oscillator configuration,
including all external components, is shown in Figure 5. Consult the reference schematics for the latest configuration.
Figure 5. Recommended Oscillator Configuration
Device boundary
C
WRF_XTAL_XON
1.3 pF
27 pF
37.4 MHz
C
x ohms
27 pF
Programmable internal shunt caps are
from 0 pF to 7.5 pF in steps of 0.5 pF.
WRF_XTAL_XOP
0.4 pF
External resistor and programmable
internal resistor value is determined
by crystal drive level.
Programmable internal series resistor is from 50 ohms to 500 ohms
in steps of 50 ohms. Boot‐up ROM value is 50 ohms.
Note: A reference schematic is available for further details. Contact your Cypress FAE.
A fractional-N synthesizer in the CYW43903 generates the radio frequencies, clocks, and data/packet timing, enabling it to operate
using a wide selection of frequency references.
The recommended default frequency reference is a 37.4 MHz crystal. The signal characteristics for the crystal interface are listed in
Table 4.
Note: Although the fractional-N synthesizer can support alternative reference frequencies, frequencies other than the default require
support to be added in the driver, plus additional extensive system testing. Contact Cypress for further details.
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CYW43903
3.2 External Frequency Reference
As an alternative to a crystal, an external precision frequency reference can be used, provided that it meets the phase noise requirements listed in Table 4.
If used, the external clock should be connected to the WRF_XTAL_XON pin through an external 1000 pF coupling capacitor, as shown
in Figure 6. The internal clock buffer connected to this pin will be turned off when the CYW43903 goes into sleep mode. When the
clock buffer turns on and off, there will be a small impedance variation. Power must be supplied to the WRF_XTAL_VDD1P35 pin.
Figure 6. Recommended Circuit to Use With an External Reference Clock
1000 pF
Reference
Clock
WRF_XTAL_XON
NC
WRF_XTAL_XOP
Table 4. Crystal Oscillator and External Clock—Requirements and Performance
External Frequency
Reference2
Crystal1
Parameter
Frequency
Conditions/Notes
2.4 GHz and 5 GHz bands:
IEEE 802.11a/b/g/n operation
Frequency tolerance over the Without trimming
lifetime of the equipment,
including temperature3
Min.
Typ.
Max.
Min.
Typ.
Max.
Units
–
37.4
–
–
–37.4
–
MHz
–20
–
20
–20
–
20
ppm
Crystal load capacitance
–
–
16
–
–
–
–
pF
ESR
–
–
–
60
–
–
–
Ω
Drive level
External crystal must be able to
tolerate this drive level.
200
–
–
–
–
–
µW
Input impedance
(WRF_XTAL_XON)
Resistive
–
–
–
30k
100k
–
Ω
Capacitive
–
–
7.5
–
–
7.5
pF
WRF_XTAL_XON
Input low level
DC-coupled digital signal
–
–
–
0
–
0.2
V
WRF_XTAL_XON
Input high level
DC-coupled digital signal
–
–
–
1.0
–
1.26
V
WRF_XTAL_XON
input voltage
(see Figure 6)
IEEE 802.11b/g operation only
–
–
–
400
–
1200
mVp-p
WRF_XTAL_XON
input voltage
(see Figure 6)
IEEE 802.11n AC-coupled analog
input
–
–
–
1
–
–
Vp-p
Duty cycle
37.4 MHz clock
–
–
–
40
50
60
%
37.4 MHz clock at 10 kHz offset
–
–
–
–
–
–129
dBc/Hz
37.4 MHz clock at 100 kHz offset
–
–
–
–
–
–136
dBc/Hz
37.4 MHz clock at 10 kHz offset
–
–
–
–
–
–134
dBc/Hz
37.4 MHz clock at 100 kHz offset
–
–
–
–
–
–141
dBc/Hz
4
Phase noise
(IEEE 802.11b/g)
noise4
Phase
(IEEE 802.11n, 2.4 GHz)
1. (Crystal) Use WRF_XTAL_XON and WRF_XTAL_XOP.
2. See External Frequency Reference for alternative connection methods.
3. It is the responsibility of the equipment designer to select oscillator components that comply with these specifications.
4. Assumes that external clock has a flat phase noise response above 100 kHz.
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3.3 External 32.768 kHz Low-Power Oscillator
The CYW43903 uses a secondary low frequency clock for low-power-mode timing. Either the internal low-precision LPO or an external
32.768 kHz precision oscillator is required. The internal LPO frequency range is approximately 33 kHz ± 30% over process, voltage,
and temperature, which is adequate for some applications. However, one tradeoff caused by this wide LPO tolerance is a small current
consumption increase during power save mode that is incurred by the need to wake-up earlier to avoid missing beacons.
Whenever possible, the preferred approach is to use a precision external 32.768 kHz clock that meets the requirements listed in
Table 5.
Table 5. External 32.768 kHz Sleep Clock Specifications
Parameter
LPO Clock
Units
Nominal input frequency
32.768
kHz
Frequency accuracy
±200
ppm
Duty cycle
30–70
%
Input signal amplitude
200–3300
mV, p-p
Signal type
Square-wave or sine-wave
–
>100k
<5
Ω
pF
<10,000
ppm
Input
impedance1
Clock jitter (during initial start-up)
1. When power is applied or switched off.
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4. Applications Subsystem
4.1 Overview
The Applications subsystem contains the general use CPU, memory, the standalone DMA core, the cryptography core, and the
majority of the external interfaces.
4.2 Applications CPU and Memory Subsystem
This subsystem has an integrated 32-bit ARM Cortex-R4 processor with an internal 32 KB D-cache and an internal 32 KB I-cache.
The ARM Cortex-R4 is a low-power processor that features a low gate count, low interrupt latency, and low-cost debugging capabilities. It is intended for deeply embedded applications that require fast interrupt response features. The ARM Cortex-R4 implements
the ARM v7-R architecture and supports the Thumb-2 instruction set.
At 0.19 µW/MHz, the Cortex-R4 is the most power efficient general-purpose microprocessor available, outperforming 8- and 16-bit
devices on a MIPS/µW basis. It also supports integrated sleep modes.
Using multiple technologies to reduce cost, the ARM Cortex-R4 enables improved memory utilization, reduced pin overhead, and
reduced silicon area. It also has extensive debugging features, including real-time tracing of program execution.
On-chip memory for the CPU includes 1 MB SRAM, 640 KB ROM, and an 8 KB RAM powered independently of the application
subsystem.
4.3 Memory-to-Memory DMA Core
The CYW43903 memory-to-memory DMA (M2MDMA) engine contains eight DMA channel pairs, each containing one transmit/pull
engine and one receive/push engine.
The DMA engine provides general purpose data movement between memories that can be on the device, attached directly to the
device, or accessed through a host interface. The transmit/pull engine reads data from the source memory and immediately passes
it to the paired receive/push engine, which proceeds to write it to the destination memory. Multiple masters can program the individual
channels, and multiple interrupts are provided so that interrupts for different channels can be routed separately to different masters.
4.4 Cryptography Core
This core provides general purpose data movement between memories, which may be either on the device, attached directly to the
device, or accessed through a host interface. The transmit/pull engine reads data from the source memory and passes it immediately
to the paired receive/push engine that proceeds to write it to the destination memory. Multiple masters may program the individual
channels, and multiple interrupts are provided so that interrupts for different channels can be routed separately to different masters.
The cryptography block provides a hardware accelerator for enciphering and deciphering data that has undergone processing using
standards-based encryption algorithms. The cryptography block includes the following primary features:
■
Encryption and hash engines that support single pass AUTH-ENC or ENC-AUTH processing.
■
A scalable AES module that supports CBC, ECB, CTR, CFB, OFB, and XTS encryption with 128-, 192-, and 256-bit key sizes.
■
A scalable DES module that supports DES and 3DES in ECB and CBC modes.
■
An RC4 stream cipher module that supports state initialization, state update, and key-stream generation.
■
MD5, SHA1, SHA224, and SHA256 engines that support pure hash or HMAC operations.
■
A built-in 512-byte key cache for locally protected key storage.
OTP memory is used to store authentication keys.
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5. Applications Subsystem External Interfaces
5.1 GPIO
There are 17 general-purpose I/O (GPIO) pins available on the CYW43903. The GPIOs can be used to connect to various external
devices.
Upon power-up and reset, these pins are tristated. Subsequently, they can be programmed to be either input or output pins via the
GPIO control register. In addition, the GPIO pins can be assigned to various other functions.
Apart from other functions, GPIOs are used to set bootstrap options and use the JTAG interface for debugging during software
development.
5.2 Cypress Serial Control
The CYW43903 has two Cypress Serial Control (CSC2) master interfaces for external communication with codecs, DACs, NVRAM,
etc. The I/O pads can be configured as pull-ups or pull-ups can be installed on the reference design to support a multimaster on an
open drain bus.
5.3 JTAG and ARM Serial Wire Debug
The CYW43903 supports the IEEE 1149.1 JTAG boundary scan standard for performing device package and PCB assembly testing
during manufacturing. In addition, the JTAG interface allows Cypress to assist customers by using proprietary debug and characterization test tools during board bring-up. Therefore, it is highly recommended to provide access to the JTAG pins by means of test
points or a header on all PCB designs.
The CYW43903 also supports ARM Serial Wire Debug (SWD) for connecting a JTAG debugger directly to both ARM Cortex-R4s. For
SWD, the combination of a clock and a bidirectional signal (on a single pin) provides normal JTAG debug and test functionality. The
reduced pin-count SWD interface is a high-performance alternative to the JTAG interface.
Table 6 shows the JTAG_SEL and TAP_SEL states for test and debug function selection. Test and debug function selection is
independent of the debugging interface (JTAG or SWD) being used.
Table 6. JTAG_SEL and TAP_SEL States for Test and Debug Function Selection
JTAG_SEL State
TAP_SEL State
Test and Debug Function
0
0
JTAG not used.
0
1
JTAG not used.
1
0
Access the LV tap directly for ATE and bring-up.
1
1
Access either of the ARM Cortex-R4’s directly via either the 5-pin JTAG port or the 2-pin
SWD configuration.
Note: JTAG_SEL is exposed on a dedicated physical pin. TAP_SEL uses the GPIO_8 physical pin.
2. Cypress Serial Control is an I2C compatible interface.
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5.4 PWM
The CYW43903 provides up to six independent pulse width modulation (PWM) channels. The following features apply to the PWM
channels:
■
Each channel is a square wave generator with a programmable duty cycle.
■
Each channel generates its duty cycle by dividing down the input clock.
■
Both the high and low duration of the duty cycle can be divided down independently by a 16-bit divider register.
■
Each channel can work independently or update simultaneously.
■
Pairs of PWM outputs can be inverted for devices that need a differential output.
■
Continuous or single pulses can be generated.
■
The input clock can either be a high-speed clock from a PLL channel or a lower speed clock at the crystal frequency.
5.5 SPI Flash
The SPI flash interface supports the following features:
■
A SPI-compatible serial bus.
■
An 80 MHz (maximum) clock frequency.
■
Increased Throughput to 40 MBps in Quad-mode or upto 10 MBps in single Mode3.
■
Support for either ×1 or ×4 addresses with ×4 data.
■
3-bytes and 4-byte addressing modes.
■
A configurable dummy-cycle count that is programmable from 1 to 15.
■
Programmable instructions output to serial flash.
■
An option to change the sampling edge from rising-edge to falling-edge for read-back data when in high-speed mode.
5.6 UART
A high-speed 4-wire CTS/RTS UART interface can be enabled by software and has dedicated pins. Provided primarily for debugging
during development, this UART enables the CYW43903 to operate as RS-232 data termination equipment (DTE) for exchanging and
managing data with other serial devices. It is compatible with the industry standard 16550 UART and provides a FIFO size of 64 × 8
in each direction.
There are two low-speed UART interfaces on the CYW43903. Each functions as a standard 2-wire UART. They are also enabled as
alternate functions on GPIOs and can be enabled independently of the 4-wire fast UART.
Note: The high-speed, 4-wire UART interface is identified as UART0 in this document and in reference schematics. The two lowspeed, 2-wire UART interfaces are identified as UART1 and UART2 in this document and in the reference schematics.
3. Note that the clock needs to be constrained to ~26.67MHz for reliable operation at high operating temperatures. The throughput of the SPI Flash block is
therefore restricted to ~13 MBps for Quad mode and ~3 MBps for single mode.
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5.7 SPI
CYW43903 contains one SPI block. This block support a fixed SPI mode (CPOL = 0, CPHA = 0) and 8-bit data read/write.
■
CPOL = 0: Clock idles at 0, and each cycle consists of a pulse of 1. The leading edge is a rising edge, and the trailing edge is a
falling edge.
■
CPHA = 0: The "out" side changes the data on the trailing edge of the preceding clock cycle, while the "in" side captures the
data on (or shortly after) the leading edge of the clock cycle.
The SPI hardware block supports a hold time of 25ns and a maximum clock frequency of 40MHz. If a SPI slave does not support the
above mode or requires a hold time greater than 25ns, a bit banging software SPI driver should be used. Cypress's WICED SDK
provides and example of such a driver.
Note that the maximum SPI frequency support by a software SPI driver is much lower than 40 MHz.
SPI0 mentioned in Table 8 is multiplexed with GPIOs and can therefore support a bit banging based software SPI driver.
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6. Global Functions
6.1 External Coexistence Interface
An external handshake interface is available to enable signaling between the device and an external colocated wireless device, such
as Bluetooth, to manage wireless medium sharing for optimum performance.
Figure 7 shows the coexistence interface.
Figure 7. Cypress 2-Wire External Coexistence Interface
CYW43903
WLAN
GCI
BT\IC
SECI_OUT
SECI_IN
UART_IN
UART_OUT
NOTES:
 SECI_OUT/BT_TXD and SECI_IN/BT_RXD are multiplexed on the GPIOs.
 The 2‐wire coexistence interface is intended for future compatibility with the BT SIG 2‐wire interface that is being standardized for Core 4.1.
Note: SECI UART is the same as UART2, one of the low-speed UART interfaces mentioned in section 5.7 and in the reference
schematics.
6.2 One-Time Programmable Memory
Various hardware configuration parameters can be stored in an internal 6144-bit (768 bytes) One-Time Programmable (OTP) memory
that is read by system software after a device reset. In addition, customer-specific parameters, including the system vendor ID and
MAC address can be stored, depending on the specific board design.
The initial state of all bits in an unprogrammed OTP memory device is 0. After any bit is programmed to a 1, it cannot be reprogrammed
to 0. The entire OTP memory array can be programmed in a single write-cycle using a utility provided with the Cypress WLAN
manufacturing test tools. Alternatively, multiple write cycles can be used to selectively program specific bytes, but only bits that are
still in the 0 state can be altered during each programming cycle.
Prior to OTP memory programming, all values should be verified using the appropriate editable nvram.txt file. The nvram.txt file is
provided with the reference board design package.
6.3 Hibernation Block
The Hibernation (HIB) block is a self-contained power domain that can be used to completely shut down the rest of the CYW43903.
This optional block uses the HIB_REG_ON_OUT pin to drive the REG_ON pin. Therefore, for the HIB block to work as designed, the
HIB_REG_ON_OUT pin must be connected to the REG_ON pin. To use the HIB block, software programs the HIB block with a wake
count and then asserts a signal indicating that the chip should be put into hibernation. After assertion, the HIB block drives
HIB_REG_ON_OUT low for the number of 32 kHz clock cycles programmed as the wake count. After the wake-count timer expires,
HIB_REG_ON_OUT is driven high. Other than the logic state of the HIB block, no state is saved in the CYW43903 during hibernation.
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6.4 System Boot Sequence
The following general sequence occurs after a CYW43903 is powered on:
1. Either REG_ON or HIB_REG_ON_IN is asserted.
Note: For HIB_REG_ON_IN to function as intended, HIB_REG_ON_OUT must be connected to REG_ON.
2. The core LDO (CLDO) and LDO3P3 outputs stabilize.
3. The OTP memory bits are used to initialize various functions, such as PMU trimming, package selection, memory size selection,
etc.
4. The APP and WLAN cores are powered up.
5. The XTAL is powered up.
6. The APP and WLAN CPU bootup sequences start.
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7. Wireless LAN Subsystem
7.1 WLAN CPU and Memory Subsystem
The CYW43903 WLAN section includes an integrated 32-bit ARM Cortex-R4 processor with internal RAM and ROM. The ARM CortexR4 is a low-power processor that features a low gate count, a small interrupt latency, and low-cost debug capabilities. It is intended
for deeply embedded applications that require fast interrupt response features. Delivering more than a 30% performance gain over
ARM7TDMI, the ARM Cortex-R4 implements the ARM v7-R architecture with support for the Thumb-2 instruction set.
At 0.19 µW/MHz, the Cortex-R4 is the most power efficient general-purpose microprocessor available, outperforming 8- and 16-bit
devices on MIPS/µW. It also supports integrated sleep modes.
On-chip memory for this CPU includes 576 KB of SRAM and 448 KB of ROM.
7.2 IEEE 802.11n MAC
The CYW43903 WLAN media access controller (MAC) is designed to support high-throughput operation with low power consumption.
It does so without compromising the Bluetooth coexistence policies, thereby enabling optimal performance over both networks. In
addition, several power-saving modes have been implemented that allow the MAC to consume very little power while maintaining
network-wide timing synchronization. The architecture diagram of the MAC is shown in Figure 8.
The following sections provide an overview of the important MAC modules.
Figure 8. WLAN MAC Architecture
Em bedded CPU Interface
Host Registers, DM A Engines
TX‐FIFO
32 KB
PM Q
RX‐FIFO
10 KB
PSM
PSM
UCODE
M em ory
IFS
Backoff, BTCX
W EP
TKIP, AES, W API
TSF
SHM
BUS
IHR
NAV
EXT‐ IHR
BUS
TXE
TX A‐M PDU
RXE
RX A‐M PDU
Shared M em ory
6 KB
M AC‐PHY Interface
The CYW43903 WLAN MAC supports features specified in the IEEE 802.11 base standard and amended by IEEE 802.11n. The key
MAC features include:
■
Transmission and reception of aggregated MPDUs (A-MPDU) for high throughput (HT).
■
Support for power management schemes, including WMM power-save, power-save multi-poll (PSMP), and multiphase PSMP
operation.
■
Support for immediate ACK and Block-ACK policies.
■
Interframe space timing support, including RIFS.
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■
Support for RTS/CTS and CTS-to-self frame sequences for protecting frame exchanges.
■
Back-off counters in hardware for supporting multiple priorities as specified in the WMM specification.
■
Timing synchronization function (TSF), network allocation vector (NAV) maintenance, and target beacon transmission time
(TBTT) generation in hardware.
■
Hardware offload for AES-CCMP, legacy WPA TKIP, legacy WEP ciphers, WAPI, and support for key management.
■
Support for coexistence with Bluetooth and other external radios.
■
Programmable independent basic service set (IBSS) or infrastructure basic service set functionality.
■
Statistics counters for MIB support.
7.2.1 PSM
The programmable state machine (PSM) is a microcoded engine that provides most of the low-level control to the hardware in order
to implement the IEEE 802.11 specification. It is a microcontroller that is highly optimized for flow-control operations, which are
predominant in implementations of communication protocols. The instruction set and fundamental operations are simple and general,
allowing algorithms to be optimized very late in the design process. It also allows for changes to the algorithms to track evolving IEEE
802.11 specifications.
The PSM fetches instructions from microcode memory. It uses the shared memory to obtain operands for instructions, as a data store,
and to exchange data between both the host and the MAC data pipeline (via the SHM bus). The PSM also uses a scratch-pad memory
(similar to a register bank) to store frequently accessed and temporary variables.
The PSM exercises fine-grained control over the hardware engines by programming internal hardware registers (IHR). These IHRs
are colocated with the hardware functions they control and are accessed by the PSM via the IHR bus.
The PSM fetches instructions from the microcode memory using an address determined by the program counter, instruction literal,
or a program stack. For ALU operations, the operands are obtained from shared memory, scratch-pad memory, IHRs, or instruction
literals, and the results are written into the shared memory, scratch-pad memory, or IHRs.
There are two basic branch instructions: conditional branches and ALU-based branches. To better support the many decision points
in the IEEE 802.11 algorithms, branches can depend on either readily available signals from the hardware modules (branch condition
signals are available to the PSM without polling the IHRs) or on the results of ALU operations.
7.2.2 WEP
The wired equivalent privacy (WEP) engine encapsulates all the hardware accelerators to perform encryption and decryption as well
as MIC computation and verification. The accelerators implement the following cipher algorithms: legacy WEP, WPA TKIP, WPA2
AES-CCMP.
The PSM determines, based on the frame type and association information, the appropriate cipher algorithm to use. It supplies the
keys to the hardware engines from an on-chip key table. The WEP interfaces with the transmit engine (TXE) to encrypt and compute
the MIC on transmit frames and the receive engine (RXE) to decrypt and verify the MIC on receive frames.
7.2.3 TXE
The transmit engine (TXE) constitutes the transmit data path of the MAC. It coordinates the DMA engines to store the transmit frames
in the TXFIFO. It interfaces with the WEP module to encrypt frames and transfers the frames across the MAC-PHY interface at the
appropriate time determined by the channel-access mechanisms.
The data received from the DMA engines are stored in transmit FIFOs. The MAC has multiple logical queues to support traffic streams
that have different QoS priority requirements. The PSM uses the channel access information from the IFS module to schedule a queue
from which the next frame is transmitted. Once the frame is scheduled, the TXE hardware transmits the frame based on a precise
timing trigger received from the IFS module.
The TXE module also contains the hardware that allows the rapid assembly of MPDUs into an A-MPDU for transmission. The hardware
module aggregates the encrypted MPDUs by adding appropriate headers and pad delimiters as needed.
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7.2.4 RXE
The receive engine (RXE) constitutes the receive data path of the MAC. It interfaces with the DMA engine to drain the received frames
from the RXFIFO. It transfers bytes across the MAC-PHY interface and interfaces with the WEP module to decrypt frames. The
decrypted data is stored in the RXFIFO.
The RXE module contains filters that are programmed by the PSM to accept or filter frames based on several criteria such as receiver
address, BSSID, and certain frame types.
The RXE module also contains the hardware required to detect A-MPDUs, parse the headers of the containers, and disaggregate
them into component MPDUS.
7.2.5 IFS
The IFS module contains the timers required to determine interframe-space timing including RIFS timing. It also contains multiple
backoff engines required to support prioritized access to the medium as specified by WMM.
The interframe-spacing timers are triggered by the cessation of channel activity on the medium, as indicated by the PHY. These timers
provide precise timing to the TXE to begin frame transmission. The TXE uses this information to send response frames or perform
transmit frame-bursting (RIFS or SIFS separated, as within a TXOP).
The backoff engines (for each access category) monitor channel activity, in each slot duration, to determine whether to continue or
pause the backoff counters. When the backoff counters reach 0, the TXE gets notified so that it may commence frame transmission.
In the event of multiple backoff counters decrementing to 0 at the same time, the hardware resolves the conflict based on policies
provided by the PSM.
The IFS module also incorporates hardware that allows the MAC to enter a low-power state when operating under the IEEE power
save mode. In this mode, the MAC is in a suspended state with its clock turned off. A sleep timer, whose count value is initialized by
the PSM, runs on a slow clock and determines the duration over which the MAC remains in this suspended state. When the timer
expires, the MAC is restored to its functional state. The PSM updates the TSF timer based on the sleep duration, ensuring that the
TSF is synchronized to the network.
The IFS module also contains the PTA hardware that assists the PSM in Bluetooth coexistence functions.
7.2.6 TSF
The timing synchronization function (TSF) module maintains the TSF timer of the MAC. It also maintains the target beacon transmission time (TBTT). The TSF timer hardware, under the control of the PSM, is capable of adopting timestamps received from beacon
and probe response frames in order to maintain synchronization with the network.
The TSF module also generates trigger signals for events that are specified as offsets from the TSF timer, such as uplink and downlink
transmission times used in PSMP.
7.2.7 NAV
The network allocation vector (NAV) timer module is responsible for maintaining the NAV information conveyed through the duration
field of MAC frames. This ensures that the MAC complies with the protection mechanisms specified in the standard.
The hardware, under the control of the PSM, maintains the NAV timer and updates the timer appropriately based on received frames.
This timing information is provided to the IFS module, which uses it as a virtual carrier-sense indication.
7.2.8 MAC-PHY Interface
The MAC-PHY interface consists of a data path interface to exchange RX/TX data from/to the PHY. In addition, there is an
programming interface that can be controlled either by the host or the PSM to configure and control the PHY.
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CYW43903
7.3 IEEE 802.11™ b/g/n PHY
The CYW43903 WLAN digital PHY complies with IEEE 802.11b/g/n single-stream specifications to provide wireless LAN connectivity
supporting data rates from 1 Mbps to 72 Mbps for low-power, high-performance, handheld applications.
The PHY has been designed to work in the presence of interference, radio nonlinearity, and various other impairments. It incorporates
optimized implementations of filters, FFTs, and Viterbi-decoder algorithms. Efficient algorithms have been designed to achieve
maximum throughput and reliability, including algorithms for carrier sensing and rejection, frequency/phase/timing acquisition and
tracking, and channel estimation and tracking. The PHY receiver also contains a robust IEEE 802.11b demodulator. The PHY carriersensing algorithm provides high throughput for IEEE 802.11b/g hybrid networks with Bluetooth coexistence.
The key PHY features include:
■
Programmable data rates from MCS0–7 in 20 MHz channels.
■
Support for Optional Short GI and Green Field modes in TX and RX.
■
TX and RX LDPC for improved range and power efficiency.
■
All scrambling, encoding, forward error correction, and modulation in the transmit direction and inverse operations in the receive
direction.
■
Support for IEEE 802.11h/k for worldwide operation.
■
Advanced algorithms for low power consumption and enhanced sensitivity, range, and reliability.
■
Algorithms to improve performance in the presence of externally received Bluetooth signals.
■
An automatic gain control scheme for blocking and nonblocking cellular applications.
■
Closed loop transmit power control.
■
Digital RF chip calibration algorithms to handle CMOS RF chip process, voltage, and temperature (PVT) variations.
■
On-the-fly channel frequency and transmit power selection.
■
Per-packet RX antenna diversity.
■
Available per-packet channel quality and signal-strength measurements.
■
Compliance with FCC and other worldwide regulatory requirements.
Figure 9. WLAN PHY Block Diagram
Filters
and
Radio
Comp
AFE
and
Radio
Radio
Control
Block
Carrier Sense,
AGC, and Rx
FSM
Tx FSM
Common
Logic
Block
Filters
and
Radio
Comp
CCK/DSSS
Demodulate
Frequency
and Timing
Synch
OFDM
Demodulate
Buffers
Viterbi Decoder
Descramble
and Deframe
FFT/IFFT
MAC
Interface
Modulation
and Coding
Frame and
Scramble
PA Comp
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Spread
COEX
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CYW43903
8. WLAN Radio Subsystem
The CYW43903 includes an integrated WLAN RF transceiver that has been optimized for use in 2.4 GHz Wireless LAN systems. It
has been designed to provide low-power, low-cost, and robust communications for applications operating in the globally available 2.4
GHz unlicensed ISM band. The transmit and receive sections include all on-chip filtering, mixing, and gain control functions.
Ten RF control signals are available to drive external RF switches. See the reference board schematics for more information.
A block diagram of the radio subsystem is shown in Figure 10. Note that integrated on-chip baluns (not shown) convert the fully
differential transmit and receive paths to single-ended signal pins.
8.1 Receiver Path
The CYW43903 has a wide dynamic range, direct conversion receiver that employs high-order on-chip channel filtering to ensure
reliable operation in the noisy 2.4 GHz ISM band. The 2.4 GHz path has a dedicated on-chip low-noise amplifier (LNA).
8.2 Transmit Path
Baseband data is modulated and upconverted to the 2.4 GHz ISM band. Linear on-chip power amplifiers deliver high output powers
while meeting IEEE 802.11b/g/n specifications without the need for external PAs. When using the internal PA, which is required in the
2.4 GHz band, closed-loop output power control is completely integrated.
8.3 Calibration
The CYW43903 features dynamic and automatic on-chip calibration to continually compensate for temperature and process variations
across components. These calibration routines are performed periodically during the course of normal radio operation. Examples of
some of the automatic calibration algorithms are baseband filter calibration for optimum transmit and receive performance and LOFT
calibration for carrier leakage reduction. In addition, I/Q calibration and VCO calibration are performed on-chip. No per-board
calibration is required during manufacturing testing. This helps to minimize the test time and cost in large-volume production environments.
Figure 10. Radio Functional Block Diagram
WL TX 2.4 GHz Mixer
WL DAC
WL TXLPF
TX Mode
Switch
WL PA
WL DAC
WL TXLPF
WLAN BB
Voltage
Regulators
WL ADC
WL RXLPF
TX Mode
Switch
WL‐G‐LNA11
WL G‐LNA12
WL ADC
WL RX 2.4 GHz Mixer
WL RXLPF
WL 2.4 GHz TX
WL 2.4 GHz RX
WL LOGEN
WL PLL
XON
Shared XO
LPO/Ext LPO/RCAL
Document Number: 002-14826 Rev. *G
XOP
Page 26 of 65
PRELIMINARY
CYW43903
9. Pinout and Signal Descriptions
9.1 Ball Map
Figure 11. 151-Ball WLBGA Map—Top View with Balls Facing Down
P
N
M
L
12
VDDIO
RF_SW_
CTRL_8
RF_SW_
CTRL_7
11
RF_SW_
CTRL_9
VSSC
RF_SW_
CTRL_1
VSSC
VDDC
RF_SW_
CTRL_6
NC_J10
VSSC
GPIO_2
GPIO_4
VDDIO
NC_H9
VSSC
VSSC
VSSC
SRSTN
K
PWR_GND
J
NC_J12
NC_J11
10
JTAG_SEL
NC_N10
RF_SW_
CTRL_5
9
RF_SW_
CTRL_2
RF_SW_
CTRL_3
RF_SW_
CTRL_0
RF_SW_
CTRL_4
VDDIO_RF
VSSC
8
OTP_VDD3P3
AVDD1P2
LPO_XTAL_IN
VSSC
VDDIO_RF
VDDIO
7
WRF_XTAL_
XON
WRF_XTAL_
GND1P2
AVSS
VDDC
VDDIO
6
WRF_XTAL_
XOP
WRF_XTAL_
VDD1P35
WRF_XTAL_
VDD1P2
WRF_SYNTH_
VDD3P3
VDDC
VSSC
5
WRF_PMU_
VDD1P35
WRF_SYNTH_
VDD1P2
WRF_SYNTH_
GND
WRF_VCO_
GND
VDDC
VSSC
4
WRF_RX5G_
GND
WRF_AFE_
VDD1P35
WRF_GENERAL
_GND
WRF_EXT_
TSSIA
VSSC
RF_GND_P3
WRF_GENERAL
2_GND
WRF_AFE_
GND
WRF_GPAIO_
OUT
HIB_REG_
ON_IN
HIB_LPO_
SELMODE
2
RF_GND_P2
WRF_PA_
GND3P3
WRF_TXMIX_
VDD
WRF_RX2G_
GND
VSSC
1
WRF_PA_
VDD3P3
WRF_
PAOUT_2G
WRF_RFIN_
2G
M
L
3
P
N
Document Number: 002-14826 Rev. *G
H
NC_H12
VDDC
VDDC
G
GPIO_3
NC_G11
F
GPIO_6
GPIO_5
E
D
C
B
A
VOUT_3P3
LDO_
VDDBAT5V
LDO_
VDD1P5
SR_
VDDBAT5V
SR_PVSS
12
VOUT_LNLDO
VOUT_
HSICLDO
VOUT_CLDO
SR_VLX
11
VSSC
PMU_AVSS
VOUT_
CLDO_SENSE
WL_REG_ON
10
VDDIO
GPIO_8
VSSC
I2C0_SDATA
VDDC
9
GPIO_13
VSSC
I2C0_CLK
UART0_TXD
VDDIO
8
VSSC
UART0_RXD
UART0_RTS
UART0_CTS
7
VDDIO
VSSC
VDDC
VDDC
VSSC
SPI0_CS
GPIO_12
SPI0_SISO
SFL_CS
6
VDDC
GPIO_7
SPI0_MISO
SPI0_CLK
SFL_CLK
5
VDDC
SFL_IO3
SFL_IO2
SFL_IO0
4
VSSC
VDDC
VSSC
SFL_IO1
GPIO_14
3
GPIO_15
2
VSSC
HIB_WAKE_B
VSSC
HIB_XTALOUT
HIB_XTALIN
VSSC
VDDC
GPIO_9
VSSC
GPIO_16
VSSC
VSSC
VDDC
HIB_REG_ON_O
UT
HIB_VDDO
VDDC
GPIO_0
GPIO_1
GPIO_10
GPIO_11
K
J
H
G
F
E
D
C
B
1
A
Page 27 of 65
PRELIMINARY
CYW43903
9.2 Ball List
Table 7 contains the 151-ball WLBGA net names.
Table 7. WLBGA Net Names
Ball
Ball
Net Name
Net Name
A2
GPIO_15
D8
VSSC
A3
GPIO_14
D9
GPIO_8
A4
SFL_IO0
D10
VSSC
A5
SFL_CLK
D11
VOUT_LNLDO
A6
SFL_CS
D12
LDO_VDDBAT5V
A7
UART0_CTS
E1
GPIO_0
A8
VDDIO
E2
GPIO_9
A9
VDDC
E3
VSSC
A10
REG_ON
E5
GPIO_7
A11
SR_VLX
E6
SPI0_CS
A12
SR_PVSS
E8
GPIO_13
B1
GPIO_11
E9
VDDIO
B2
VSSC
E10
VDDIO
B3
SFL_IO1
E11
VDDIO
B4
SFL_IO2
E12
VOUT_3P3
B5
SPI0_CLK
F1
VDDC
B6
SPI0_SISO
F2
VDDC
B7
UART0_RTS
F5
VDDC
B8
UART0_TXD
F6
VSSC
B9
I2C0_SDATA
F8
VSSC
B10
VOUT_CLDO_SENSE
F9
VSSC
B11
VOUT_CLDO
F10
GPIO_4
B12
SR_VDDBAT5V
F11
GPIO_5
C1
GPIO_10
F12
GPIO_6
C2
GPIO_16
G1
HIB_VDDO
C3
VSSC
G2
VSSC
C4
SFL_IO3
G3
VSSC
C5
SPI0_MISO
G4
VSSC
C6
GPIO_12
G6
VDDC
C7
UART0_RXD
G7
VSSC
C8
I2C0_CLK
G9
VSSC
C9
VSSC
G10
GPIO_2
C10
PMU_AVSS
G11
NC_G11
C11
VOUT_HSICLDO
G12
GPIO_3
C12
LDO_VDD1P5
H1
HIB_REG_ON_OUT
D1
GPIO_1
H2
HIB_XTALIN
D2
VSSC
H3
HIB_WAKE_B
D3
VDDC
H5
VDDC
D4
VDDC
H7
VDDC
D7
VSSC
H9
NC_H9
Document Number: 002-14826 Rev. *G
Page 28 of 65
PRELIMINARY
Ball
Net Name
CYW43903
Ball
Net Name
H10
VSSC
M7
AVSS
H11
VDDC
M8
LPO_XTAL_IN
H12
NC_H12
M9
RF_SW_CTRL_0
J1
VDDC
M10
RF_SW_CTRL_5
J2
HIB_XTALOUT
M11
VSSC
J3
HIB_LPO_SELMODE
M12
RF_SW_CTRL_8
J5
VSSC
N2
WRF_AFE_GND
J6
VSSC
N3
WRF_AFE_GND
J8
VDDIO
N4
WRF_AFE_VDD1P35
J9
VSSC
N5
WRF_SYNTH_VDD1P2
J10
NC_J10
N6
WRF_XTAL_VDD1P35
J11
NC_J11
N7
WRF_AFE_GND
J12
NC_J12
N8
AVDD1P2
K1
VSSC
N9
RF_SW_CTRL_3
K2
VSSC
N10
NC_N10
K3
HIB_REG_ON_IN
N11
RF_SW_CTRL_9
K4
VSSC
N12
VDDIO
K5
VDDC
P1
WRF_PA_VDD3P3
K6
VDDC
P2
RF_GND_P2
K7
VDDIO
P3
RF_GND_P3
K8
VDDIO_RF
P4
WRF_AFE_GND
K9
VDDIO_RF
P5
WRF_PMU_VDD1P35
K10
RF_SW_CTRL_6
P6
WRF_XTAL_XOP
K11
VSSC
P7
WRF_XTAL_XON
K12
PWR_GND
P8
OTP_VDD3P3
L1
WRF_RFIN_2G
P9
RF_SW_CTRL_2
L2
WRF_AFE_GND
P10
JTAG_SEL
L3
WRF_GPAIO_OUT
P11
SRSTN
L4
WRF_EXT_TSSIA
L5
WRF_AFE_GND
L6
WRF_SYNTH_VDD3P3
L7
VDDC
L8
VSSC
L9
RF_SW_CTRL_4
L10
VDDC
L11
RF_SW_CTRL_1
L12
RF_SW_CTRL_7
M1
WRF_PAOUT_2G
M2
WRF_TXMIX_VDD
M3
WRF_AFE_GND
M4
WRF_AFE_GND
M5
WRF_AFE_GND
M6
WRF_XTAL_VDD1P2
Document Number: 002-14826 Rev. *G
Page 29 of 65
PRELIMINARY
CYW43903
9.3 Signal Descriptions
Table 8 provides the signal name, type, and description for each CYW43903 ball. The symbols shown under Type indicate pin
directions (I/O = bidirectional, I = input, and O = output) and the internal pull-up/pull-down characteristics (PU = weak internal pull-up
resistor and PD = weak internal pull-down resistor), if any.
Table 8. Signal Descriptions
Ball Number
Signal Name
Type
Description
Cypress Serial Control (CSC) Interfaces
C8
I
B9
I2
2C0_CLK
C0_SDATA
O
CSC master clock.
I/O
CSC serial data
Clocks
P6
WRF_XTAL_XOP
I
XTAL oscillator input.
P7
WRF_XTAL_XON
O
XTAL oscillator output.
M8
LPO_XTAL_IN
I
External sleep clock input (32.768 kHz).
H2
HIB_XTALIN
I
3.3V 32 kHz crystal input
J2
HIB_XTALOUT
O
3.3V 32 kHz crystal output
GPIO Interface (WLAN)
E1
GPIO_0
I/O
D1
GPIO_1
I/O
G10
GPIO_2
I/O
G12
GPIO_3
I/O
F10
GPIO_4
I/O
F11
GPIO_5
I/O
F12
GPIO_6
I/O
E5
GPIO_7
I/O
D9
GPIO_8
I/O
E2
GPIO_9
I/O
C1
GPIO_10
I/O
B1
GPIO_11
I/O
C6
GPIO_12
I/O
E8
GPIO_13
I/O
A3
GPIO_14
I/O
A2
GPIO_15
I/O
C2
GPIO_16
I/O
Programmable GPIO pins.
Ground
L2, L5, M3, M4, M5, N2, N3, N7, WRF_AFE_GND
P4
GND
AFE ground
M11, K11, H10, D10, J9, G9, F9, VSSC
C9, L8, F8, D8, G7, D7, J6, F6,
J5, K4, G4, G3, E3, C3, K2, G2,
D2, B2, K1
GND
Core ground for WLAN and APP sections
A12
GND
Power ground
SR_PVSS
C10
PMU_AVSS
GND
Quiet ground
M7
AVSS
GND
Baseband PLL ground
Document Number: 002-14826 Rev. *G
Page 30 of 65
PRELIMINARY
CYW43903
Table 8. Signal Descriptions (Cont.)
Ball Number
Signal Name
Type
Description
Hibernation Block, Power-Down/Power-Up, and Reset
A10
REG_ON
I
Used by PMU to power up or power down the internal
CYW43903 regulators used by the WLAN and APP
sections. Also, when deasserted, this pin holds the WLAN
and APP sections in reset. This pin has an internal 200 kΩ
pull-down resistor that is enabled by default. It can be
disabled through programming.
K3
HIB_REG_ON_IN
I
Used by the hibernation block to power up or power down
the internal CYW43903 regulators. For applications that
use the hibernation block, HIB_REG_ON_OUT must
connect to REG_ON. Also, when deasserted, this pin
holds the WLAN and APP sections in reset.
H1
HIB_REG_ON_OUT
O
REG_ON output signal generated by the hibernation
block.
H3
HIB_WAKE_B
I
Wake up chip from hibernation mode.
J3
HIB_LPO_SELMODE
I
Select precise or coarse 32 kHz clock.
P11
SRSTN
I
System reset. This active-low signal resets the
backplanes.
JTAG Interface
P10
JTAG_SEL
I
JTAG select. This pin must be connected to ground if the
JTAG interface is not used.
No Connects
J10, J11, J12, H9, H12, G11,
N10, L4
NC_J10, NC_J11, NC_J12,
NC_H9, NC_H12, NC_G11,
NC_N10, WRF_EXT_TSSIA
–
No connect
Power Supplies (Miscellaneous)
P8
OTP_VDD3P3
PWR
OTP 3.3V supply
H11, L10, A9, L7, H7, K6, G6,
K5, H5, F5, D4, D3, F2, J1, F1
VDDC
PWR
1.2V core supply for WLAN
N12, E11, E10, E9, J8, A8, K7
VDDIO
PWR
I/O supply
K8, K9
VDDIO_RF
PWR
I/O supply for RF switch control pads (3.3V).
K12
PWR_GND
GND
Power supply ground
G1
HIB_VDDO
PWR
I/O supply for hibernation block
N8
AVDD1P2
PWR
1.2V supply for baseband PLL
Power Supplies (WLAN)
L6
WRF_SYNTH_VDD3P3
PWR
Synthesizer VDD 3.3V supply
P1
WRF_PA_VDD3P3
PWR
2.4 GHz PA 3.3V VBAT supply
P5
WRF_PMU_VDD1P35
PWR
PMU 1.35V supply
M2
WRF_TXMIX_VDD
PWR
3.3V supply for TX mixer
N5
WRF_SYNTH_VDD1P2
PWR
1.2V supply for synthesizer
N4
WRF_AFE_VDD1P35
PWR
1.35V supply for the analog front end (AFE)
PWM Interface (Alternate Function for GPIOs)
–
PWM0
O
Pulse width modulation bit 0.
–
PWM1
O
Pulse width modulation bit 1
–
PWM2
O
Pulse width modulation bit 2
–
PWM3
O
Pulse width modulation bit 3
Document Number: 002-14826 Rev. *G
Page 31 of 65
PRELIMINARY
CYW43903
Table 8. Signal Descriptions (Cont.)
Ball Number
Signal Name
Type
Description
–
PWM4
O
Pulse width modulation bit 4
–
PWM5
O
Pulse width modulation bit 5
RF Signal Interface (WLAN)
L1
WRF_RFIN_2G
I
2.4 GHz WLAN receiver input
P3
RF_GND_P3
GND
RF ground
M1
WRF_PAOUT_2G
O
2.4 GHz WLAN PA output
P2
RF_GND_P2
GND
RF ground
L3
WRF_GPAIO_OUT
I/O
Analog GPIO
RF Switch Control Lines
M9
RF_SW_CTRL_0
O
L11
RF_SW_CTRL_1
O
P9
RF_SW_CTRL_2
O
N9
RF_SW_CTRL_3
O
L9
RF_SW_CTRL_4
O
M10
RF_SW_CTRL_5
I/O
K10
RF_SW_CTRL_6
I/O
L12
RF_SW_CTRL_7
I/O
M12
RF_SW_CTRL_8
I/O
N11
RF_SW_CTRL_9
I/O
Programmable RF switch control lines. The control lines
are programmable via the driver and nvram.txt file.
SPI Flash Interface
A5
SFL_CLK
O
Flash clock
A4
SFL_IO0
I/O
Flash data
B3
SFL_IO1
I/O
Flash data
B4
SFL_IO2
I/O
Flash data
C4
SFL_IO3
I/O
Flash data
A6
SFL_CS
O
Flash slave select
SPI Interface
Note: The SPI interface can alternatively be configured and used as a CSC interface.
B5
SPI0_CLK
O
SPI clock
C5
SPI0_MISO
I
SPI data master in
B6
SPI0_SISO
O
SPI data master out
E6
SPI0_CS
O
SPI slave select
UART Interface
A7
UART0_CTS
I
UART clear-to-send
B7
UART0_RTS
O
UART request-to-send
C7
UART0_RXD
I
UART serial input
B8
UART0_TXD
O
UART serial output
Voltage Regulators (Integrated)
B12
SR_VDDBAT5V
I
VBAT.
A11
SR_VLX
O
CBUCK switching regulator output
Document Number: 002-14826 Rev. *G
Page 32 of 65
PRELIMINARY
CYW43903
Table 8. Signal Descriptions (Cont.)
Ball Number
Signal Name
Type
Description
C12
LDO_VDD1P5
I
LNLDO input
D12
LDO_VDDBAT5V
I
LDO VBAT
N6
WRF_XTAL_VDD1P35
I
XTAL LDO input (1.35V)
M6
WRF_XTAL_VDD1P2
O
XTAL LDO output (1.2V)
D11
VOUT_LNLDO
O
Terminate with 2.2 μF capacitor to GND
B11
VOUT_CLDO
O
Output of core LDO
E12
VOUT_3P3
O
LDO 3.3V output
B10
VOUT_CLDO_SENSE
O
Voltage sense pin for core LDO
C11
VOUT_HSICLDO
O
Output of HSIC LDO
Document Number: 002-14826 Rev. *G
Page 33 of 65
PRELIMINARY
CYW43903
10. GPIO Signals and Strapping Options
10.1 Overview
This section describes GPIO signals and strapping options. The pins are sampled at power-on reset (POR) to determine various
operating modes. Sampling occurs a few milliseconds after an internal POR or deassertion of the external POR. After the POR, each
pin assumes the GPIO or alternative function specified in Table 10. Each strapping option pin has an internal pull-up (PU) or pull-down
(PD) resistor that determines the default mode. To change the mode, connect an external PU resistor to VDDIO or a PD resistor to
ground, using a 10 kΩ resistor or less.
Note: Refer to the reference board schematics for more information.
10.2 Weak Pull-Down and Pull-Up Resistances
At VDDO = 3.3V ±10%, the minimum, typical, and maximum weak pull-down resistances (for a pin voltage of VDDO) are 37.99 kΩ,
44.57 kΩ, and 51.56 kΩ, respectively. At VDDO = 3.3V ±10%, the minimum, typical, and maximum weak pull-up resistances (for a
pin voltage of 0V) are 34.73 kΩ, 39.58 kΩ, and 44.51 kΩ, respectively.
10.3 Strapping Options
Table 9 provides the strapping options.
Table 9. Strapping Options
Pin Name
Strap
#
Default Internal
Pull During
Strap
Description
GPIO_1
GSPI_MODE
D1
PD
Enable gSPI interface
GPIO_7
WCPU_BOOT_MODE
E5
PD
Boot from SoC SROM or SoC SRAM
GPIO_11
ACPU_BOOT_MODE
B1
PD
Boot from tightly coupled memory (TCM) ROM or TCM
RAM
GPIO_13
SDIO_MODE
E8
PD
Select either SDIO host mode or SDIO device mode
GPIO_15
VTRIM_EN
A2
PD
Enable PMU voltage trimming
RF_SW_CTRL_5
DAP_CLK_SEL
M10
PD
Select XTAL clock or the test clock (tck) for the debug
access port (DAP)
RF_SW_CTRL_7
RSRC_INIT_MODE
L12
PD
PMU resource initialization mode selection
Document Number: 002-14826 Rev. *G
Page 34 of 65
PRELIMINARY
CYW43903
10.4 Alternate GPIO Signal Functions
Table 10 provides the alternate signal functions of the GPIO signals.
Table 10. Alternate GPIO Signal Functions
GPIO
Default
GPIO_0
–
GPIO_1
GPIO_2
JTAG_SEL
Default Pull
HOLD/PDLOW/
PDHIGH
Strap
Comments
–
No pull
HOLD
–
8 mA
–
–
Down
HOLD
GSPI_MODE
8 mA
GCI_GPIO(0)
JTAG_TCK
No pull
HOLD
–
8 mA
GPIO_3
GCI_GPIO(1)
JTAG_TMS
No pull
HOLD
–
8 mA
GPIO_4
GCI_GPIO(2)
JTAG_TDI
No pull
HOLD
–
8 mA
GPIO_5
GCI_GPIO(3)
JTAG_TDO
No pull
HOLD
–
8 mA
GPIO_6
GCI_GPIO(4)
JTAG_TRST
No pull
HOLD
–
8 mA
GPIO_7
–
–
Down
HOLD
WCPU_BOOT_MODE
8 mA
GPIO_8
GPIO_8
–
No pull
HOLD
–
8 mA
8 mA
GPIO_9
GPIO_9
–
Down
HOLD
GPIO_10
GPIO_10
–
No pull
HOLD
–
8 mA
GPIO_11
–
–
Down
HOLD
ACPU_BOOT_MODE
8 mA
GPIO_12
GPIO_12
–
No pull
HOLD
–
8 mA
GPIO_13
–
–
Down
HOLD
SDIO_MODE
8 mA
GPIO_14
GPIO_14
–
No pull
HOLD
–
8 mA
GPIO_15
–
–
Down
HOLD
VTRIM_EN
8 mA
GPIO_16
–
–
No pull
HOLD
–
8 mA
Document Number: 002-14826 Rev. *G
Page 35 of 65
PRELIMINARY
CYW43903
11. Pin Multiplexing
Table 11 shows the pin multiplexing functions.
Table 11. Pin Multiplexing
Function
Pin
1
2
3
4
5
6
7
8
9
10
11
GPIO_0
GPIO_0
UART0_RXD
I2C1_SDATA
PWM0
SPI1_MISO
PWM2
GPIO_12
GPIO_8
–
PWM4
–
GPIO_1
GPIO_1
UART0_TXD
I2C1_CLK
PWM1
SPI1_CLK
PWM3
GPIO_13
GPIO_9
–
PWM5
–
GPIO_2
GPIO_2
–
–
GCI_GPIO_0
–
–
–
–
TCK
–
–
GPIO_3
GPIO_3
–
–
GCI_GPIO_1
–
–
–
–
TMS
–
–
GPIO_4
GPIO_4
–
–
GCI_GPIO_2
–
–
–
–
TDI
–
–
GPIO_5
GPIO_5
–
–
GCI_GPIO_3
–
–
–
–
TDO
–
–
GPIO_6
GPIO_6
–
–
GCI_GPIO_4
–
–
–
–
TRST_L
–
–
GPIO_7
GPIO_7
UART0_
RTS_OUT
PWM1
PWM3
SPI1_CS
I2C1_CLK
GPIO_15
GPIO_11
PMU_TEST_
O
–
PWM5
GPIO_8
GPIO_8
SPI1_MISO
PWM2
PWM4
UART0_RXD
–
GPIO_16
GPIO_12
TAP_SEL_P
I2C1_SDATA
PWM0
GPIO_9
GPIO_9
SPI1_CLK
PWM3
PWM5
UART0_TXD
–
GPIO_0
GPIO_13
–
I2C1_CLK
PWM1
GPIO_10
GPIO_10
SPI1_MOSI
PWM4
I2C1_SDATA
UART0_
CTS_IN
PWM0
GPIO_1
GPIO_14
PWM2
–
–
GPIO_11
GPIO_11
SPI1_CS
PWM5
I2C1_CLK
UART0_
RTS_OUT
PWM1
GPIO_7
GPIO_15
PWM3
–
–
GPIO_12
GPIO_12
I2C1_SDATA
UART0_RXD
SPI1_MISO
PWM2
PWM4
GPIO_8
GPIO_16
PWM0
–
–
GPIO_13
GPIO_13
I C1_CLK
UART0_TXD
SPI1_CLK
PWM3
PWM5
GPIO_9
GPIO_0
PWM1
–
–
GPIO_14
GPIO_14
PWM0
UART0_
CTS_IN
SPI1_MOSI
I2C1_SDATA
–
GPIO_10
–
PWM4
–
PWM2
GPIO_15
GPIO_15
PWM1
UART0_
RTS_OUT
SPI1_CS
I2C1_CLK
–
GPIO_11
GPIO_7
PWM5
–
PWM3
GPIO_16
GPIO_16
UART0_
CTS_IN
PWM0
PWM2
SPI1_MOSI
I2C1_SDATA
GPIO_14
GPIO_10
RF_
DISABLE_L
–
PWM4
RF_SW_
CTRL_5
RF_SW_
CTRL_5
GCI_GPIO_5
–
–
–
–
–
–
–
–
–
RF_SW_
CTRL_6
RF_SW_
CTRL_6
UART_
DBG_RX1
SECI_IN1
–
–
–
–
–
–
–
–
RF_SW_
CTRL_7
RF_SW_
CTRL_7
UART_
DBG_TX1
SECI_OUT1
–
–
–
–
–
–
–
–
2
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Page 36 of 65
PRELIMINARY
CYW43903
Table 11. Pin Multiplexing
Function
Pin
1
2
3
4
5
6
7
8
9
10
11
RF_SW_
CTRL_8
RF_SW_
CTRL_8
SECI_IN1
UART_
DBG_RX1
–
–
–
–
–
–
–
–
RF_SW_
CTRL_9
RF_SW_
CTRL_9
SECI_OUT1
UART_
DBG_TX1
–
–
–
–
–
–
–
–
SPI0_MISO
SPI0_MISO
GPIO_17
GPIO_24
–
–
–
–
–
–
–
–
SPI0_CLK
SPI0_CLK
GPIO_18
GPIO_25
–
–
–
–
–
–
–
–
SPI0_MOSI
SPI0_MOSI
GPIO_19
GPIO_26
–
–
–
–
–
–
–
–
SPI0_CS
SPI0_CS
GPIO_20
GPIO_27
–
–
–
–
–
–
–
–
I2C0_SDATA
I2C0_SDATA
GPIO_21
GPIO_28
–
–
–
–
–
–
–
–
I2C0_CLK
I2C0_CLK
GPIO_22
GPIO_29
–
–
–
–
–
–
–
–
1. UART_DBG_TX and UART_DBG_RX are for UART1 mentioned in section 5.7 and in the reference schematics. SECI_IN and SECI_OUT are for UART2 mentioned in section 5.7 and in the reference schematics.
Document Number: 002-14826 Rev. *G
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CYW43903
12. I/O States
Table 12 provides I/O state information for the signals listed.
The following notations are used in Table 12:
■
I: Input signal
■
O: Output signal
■
I/O: Input/Output signal
■
PU = Pulled up
■
PD = Pulled down
■
NoPull = Neither pulled up nor pulled down
Table 12. I/O States
Low Power State/Sleep (All
Power Present)
Power-down2
(REG_ON Held Low)
Out-of-Reset; Before
Software Download
(REG_ON High)
I/O
Keeper1
HIB_REG_ON_IN
I
N
Input; PD (Pull-down can be
disabled.)
Input; PD (Pull-down can be
disabled.)
Input
Input
–
REG_ON
I
N
Input; PD (Pull-down can be
disabled.)
Input; PD (Pull-down can be
disabled.)
Input; PD (of 200 kΩ)
Input; PD (of 200 kΩ)
–
GPIO_0
I/O
Y
Input/Output; PU, PD, or
NoPull (programmable
[Default: PD])
Input/Output; PU, PD, or NoPull
(programmable [Default: PD])
High-Z, NoPull
Input; PD
VDDIO
GPIO_1
I/O
Y
Input/Output; PU, PD, or
NoPull (programmable
[Default: NoPull])
Input/Output; PU, PD, or NoPull
(programmable [Default:
NoPull])
High-Z, NoPull
Input; NoPull
VDDIO
GPIO_2
I/O
Y
Input/Output; PU, PD, or
NoPull (programmable
[Default: NoPull])
Input/Output; PU, PD, or NoPull
(programmable [Default:
NoPull])
High-Z, NoPull
Input; NoPull
VDDIO
GPIO_3
I/O
Y
Input/Output; PU, PD, or
NoPull (programmable
[Default: PD])
Input/Output; PU, PD, or NoPull
(programmable [Default: PD])
High-Z, NoPull
Input; PD
VDDIO
GPIO_4
I/O
Y
Input/Output; PU, PD, or
NoPull (programmable
[Default: NoPull])
Input/Output; PU, PD, or NoPull
(programmable [Default:
NoPull])
High-Z, NoPull
Input; NoPull
VDDIO
GPIO_5
I/O
Y
Input/Output; PU, PD, or
NoPull (programmable
[Default: PD])
Input/Output; PU, PD, or NoPull
(programmable [Default: PD])
High-Z, NoPull
Input; PD
VDDIO
Ball Name
Document Number: 002-14826 Rev. *G
Active Mode
Power Rail
Page 38 of 65
PRELIMINARY
CYW43903
Table 12. I/O States
Low Power State/Sleep (All
Power Present)
Power-down2
(REG_ON Held Low)
Out-of-Reset; Before
Software Download
(REG_ON High)
I/O
Keeper1
GPIO_6
I/O
Y
Input/Output; PU, PD, or
NoPull (programmable
[Default: NoPull])
Input/Output; PU, PD, or NoPull
(programmable [Default:
NoPull])
High-Z, NoPull
Input; NoPull
VDDIO
GPIO_7
I/O
Y
Input/Output; PU, PD, or
NoPull (programmable
[Default: NoPull])
Input/Output; PU, PD, or NoPull
(programmable [Default:
NoPull])
High-Z, NoPull
Input; NoPull
VDDIO
GPIO_8
I/O
Y
Input/Output; PU, PD, or
NoPull (programmable
[Default: PD])
Input/Output; PU, PD, or NoPull
(programmable [Default: PD])
High-Z, NoPull
Input; PD
VDDIO
GPIO_9
I/O
Y
Input/Output; PU, PD, or
NoPull (programmable
[Default: PD])
Input/Output; PU, PD, or NoPull
(programmable [Default: PD])
High-Z, NoPull
Input; PD
VDDIO
GPIO_10
I/O
Y
Input/Output; PU, PD, or
NoPull (programmable
[Default: NoPull])
Input/Output; PU, PD, or NoPull
(programmable [Default:
NoPull])
High-Z, NoPull
Input; NoPull
VDDIO
GPIO_11
I/O
Y
Input/Output; PU, PD, or
NoPull (programmable
[Default: PD])
Input/Output; PU, PD, or NoPull
(programmable [Default: PD])
High-Z, NoPull
Input; PD
VDDIO
GPIO_12
I/O
Y
Input/Output; PU, PD, or
NoPull (programmable
[Default: NoPull])
Input/Output; PU, PD, or NoPull
(programmable [Default:
NoPull])
High-Z, NoPull
Input; NoPull
VDDIO
GPIO_13
I/O
Y
Input/Output; PU, PD, or
NoPull (programmable
[Default: NoPull])
Input/Output; PU, PD, or NoPull
(programmable [Default:
NoPull])
High-Z, NoPull
Input; NoPull
VDDIO
GPIO_14
I/O
Y
Input/Output; PU, PD, or
NoPull (programmable
[Default: NoPull])
Input/Output; PU, PD, or NoPull
(programmable [Default:
NoPull])
High-Z, NoPull
Input; NoPull
VDDIO
GPIO_15
I/O
Y
Input/Output; PU, PD, or
NoPull (programmable
[Default: NoPull])
Input/Output; PU, PD, or NoPull
(programmable [Default:
NoPull])
High-Z, NoPull
Input; NoPull
VDDIO
GPIO_16
I/O
Y
Input/Output; PU, PD, or
NoPull (programmable
[Default: NoPull])
Input/Output; PU, PD, or NoPull
(programmable [Default:
NoPull])
High-Z, NoPull
Input; NoPull
VDDIO
RF_SW_CTRL
(0 to 9)
I/O
Y
Output; NoPull
Output; NoPull
High-Z
Output; NoPull
VDDIO_RF
Ball Name
Active Mode
Power Rail
1. Keeper column: N = pad has no keeper. Y = pad has a keeper. Keeper is always active except in power-down state. If there is no keeper, and it is an input and there is NoPull, then the pad should be driven to
prevent leakage due to floating pad (WL_REG_ON, for example).
2. In the power-down state (xx_REG_ON=0): High-Z; NoPull => the pad is disabled because power is not supplied.
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CYW43903
13. Electrical Characteristics
Note: Values in this data sheet are design goals and are subject to change based on the results of device characterization.
13.1 Absolute Maximum Ratings
Caution! The absolute maximum ratings in Table 13 indicate levels where permanent damage to the device can occur, even if these
limits are exceeded for only a brief duration. Functional operation is not guaranteed under these conditions. Operation at absolute
maximum conditions for extended periods can adversely affect long-term reliability of the device.
Table 13. Absolute Maximum Ratings
Parameter
DC supply for VBAT and PA driver supply
1
Symbol
VBAT
Value
–0.5 to +5.5
Unit
V
DC supply voltage for digital I/O
VDDIO
–0.5 to 3.9
V
DC supply voltage for RF switch I/O
VDDIO_RF
–0.5 to 3.9
V
–
–0.5 to 1.575
V
VDD3P3RF
–0.5 to 3.6
V
1.35V DC supply voltage for RF analog4
VDD1P35RF
–0.5 to 1.5
V
1.2V DC supply voltage for RF analog5
VDD1P2RF
–0.5 to 1.26
V
1.2V DC supply voltage for analog circuits6
VDD1P2A
–0.5 to 1.26
V
DC supply voltage for the core7
VDDC
–0.5 to 1.32
V
DC supply voltage for OTP memory
OTP_VDD3P3
–0.5 to 3.9
V
Maximum undershoot voltage for I/O
Vundershoot
–0.5
V
Maximum junction temperature
Tj
125
°C
DC input supply voltage for CLDO, LNLDO, and LDO2
3.3V DC supply voltage for RF analog
3
1. For the SR_VDDBAT5V and LDO_VDDBAT5V supplies.
2. For the LDO_VDD1P5 and WRF_XTAL_VDD1P35 supplies.
3. For the WRF_SYNTH_VDD3P3, WRF_PA_VDD3P3, and WRF_TXMIX_VDD supplies.
4. For WRF_PMU_VDD1P35 and WRF_AFE_VDD1P35 supplies.
5. For the WRF_SYNTH_VDD1P2 supply.
6. For the AVDD1P2 supply.
7. For the VDD supply.
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CYW43903
13.2 Environmental Ratings
The environmental ratings are shown in Table 14.
Table 14. Environmental Ratings
Characteristic
Value
Ambient temperature (TA)
Units
–30 to +85
Conditions/Comments
°C
Functional operation
Storage temperature
–40 to +125
°C
–
Relative humidity
Less than 60
%
Storage
Less than 85
%
Operation
13.3 Electrostatic Discharge Specifications
Extreme caution must be exercised to prevent electrostatic discharge (ESD) damage. Proper use of wrist and heel grounding straps
to discharge static electricity is required when handling these devices. Always store unused material in its antistatic packaging.
Table 15. ESD Specifications
Pin Type
Symbol
Condition
ESD Rating
Unit
1.5 k
V
ESD
ESD_HAND_HBM
Human body model contact discharge per JEDEC
EID/JESD22-A114
CDM
ESD_HAND_CDM
Charged device model contact discharge per JEDEC 250
EIA/JESD22-C101
V
13.4 Recommended Operating Conditions and DC Characteristics
Caution! Functional operation is not guaranteed outside of the limits shown in Table 16. Operation outside these limits for extended
periods can adversely affect long-term reliability of the device.
Table 16. Recommended Operating Conditions and DC Characteristics
Value
Parameter
Symbol
DC supply voltage for VBAT
VBAT
DC supply voltage for digital I/O
VDDIO
Minimum
Typical
Maximum
Unit
3.6
4.8
V
1.71
–
3.63
V
3.13
3.3
3.6
V
1
2.3
DC supply voltage for RF switch I/Os
VDDIO_RF
DC input supply voltage for CLDO, LNLDO, and LDO
–
1.3
1.35
1.5
V
3.3V DC supply voltage for RF analog
VDD3P3RF3
3
3.3
3.45
V
1.35V DC supply voltage for RF analog
VDD1P35RF3
1.3
1.35
1.5
V
1.2V DC supply voltage for RF analog
VDD1P2RF3
1.1
1.2
1.26
V
1.2V DC supply voltage for analog
VDD1P2A3
1.1
1.2
1.26
V
DC supply voltage for core
VDDC
1.14
1.2
1.26
V
2.97
3.3
3.63
V
DC supply voltage for OTP memory
2
2
OTP_VDD3P3
DC supply voltage for TCXO input buffer
WRF_TCXO_VDD
1.62
1.8
1.98
V
Internal POR threshold
Vth_POR
0.4
–
0.7
V
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3
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CYW43903
Table 16. Recommended Operating Conditions and DC Characteristics (Cont.)
Value
Parameter
Symbol
Minimum
Typical
Maximum
Unit
Other Digital I/O Pins
For VDDIO = 1.8V:
Input high voltage
VIH
0.65 × VDDIO
–
–
V
Input low voltage
VIL
–
–
0.35 ×
VDDIO
V
Output high voltage @ 2 mA
VOH
VDDIO – 0.45
–
–
V
Output low voltage @ 2 mA
VOL
–
–
0.45
V
For VDDIO = 3.3V:
Input high voltage
VIH
2.00
–
–
V
Input low voltage
VIL
–
–
0.80
V
Output high voltage @ 2 mA
VOH
VDDIO – 0.4
–
–
V
Output low voltage @ 2 mA
VOL
–
–
0.40
V
RF Switch Control Output Pins4
For VDDIO_RF = 3.3V:
Output high voltage @ 2 mA
Output low voltage @ 2 mA
Input capacitance
VOH
VDDIO – 0.4
–
–
V
VOL
–
–
0.40
V
CIN
–
–
5
pF
1. The CYW43903 is functional across this range of voltages. Optimal RF performance specified in the data sheet, however, is guaranteed only for 3V < VBAT < 4.8V.
2. VDD3P3RF, which is an internally generated supply, can drive this node. There is sufficient current and the appropriate state is maintained during hibernation and
sleep cycles.
3. Internally generated supply.
4. Programmable 2 mA to 16 mA drive strength. Default is 10 mA.
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CYW43903
13.5 Power Supply Segments
The digital I/O's are placed in physical segments. The supply voltage for each segment can be independently selected.
Table 17 shows the power supply segments and the I/O pins associated with each segment.
Table 17. Power Supply Segments
Power Supply Segment
Pins
VDDIO
GPIO_0, GPIO_1, GPIO_2, GPIO_3, GPIO_4, GPIO_5, GPIO_6, GPIO_7, GPIO_8, GPIO_9,
GPIO_10, GPIO_11, GPIO_12, GPIO_13, GPIO_14, GPIO_15, GPIO_16, I2C0_CLK,
I2C0_SDATA, I2C1_CLK, I2C1_SDATA, JTAG_SEL, SFL_CLK, SFL_CS, SFL_IO0, SFL_IO1,
SFL_IO2, SFL_IO3, SPI0_CLK, SPI0_CS, SPI0_MISO, SPI0_SISO, SPI1_CLK, SPI1_CS,
SPI1_MISO, SPI1_SISO, SRSTN, UART0_CTS, UART0_RTS, UART0_RXD, UART0_TXD
VDDIO_RF
RF_SW_CTRL_0, RF_SW_CTRL_1, RF_SW_CTRL_2, RF_SW_CTRL_3, RF_SW_CTRL_4,
RF_SW_CTRL_5, RF_SW_CTRL_6, RF_SW_CTRL_7, RF_SW_CTRL_8, RF_SW_CTRL_9
13.6 GPIO, UART, and JTAG Interfaces DC Characteristics
Table 18. GPIO, UART, and JTAG Interfaces
Parameter
Symbol
Minimum
Maximum
Units
Conditions
Logic input high voltage
VIH
2.0
VDDIO + 0.5
V
–
Logic input low voltage
VIL
–0.5
0.8
V
–
Logic output high voltage
VOH
2.4
–
V
–
Logic output low voltage
VOL
–
0.4
V
–
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Page 43 of 65
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CYW43903
14. WLAN RF Specifications
14.1 Introduction
The CYW43903 includes an integrated direct conversion radio that supports the 2.4 GHz band. This section describes the RF
characteristics of the 2.4 GHz radio.
Note: Values in this section of the data sheet are design goals and are subject to change based on device characterization results.
Unless otherwise stated, limit values apply for the conditions specified in Table 14, “Environmental Ratings,” and Table 16, “Recommended Operating Conditions and DC Characteristics,”. Typical values apply for the following conditions:
■
VBAT = 3.6V
■
Ambient temperature +25°C
Figure 12. Port Locations for WLAN Testing
CYW43903
Chip Output Port
2.4 GHz WLAN TX
(WRF_PAOUT_2G)
Filter
2.4 GHz WLAN RX
(WRF_RFIN_2G)
RF Port
Chip Input Port
14.2 2.4 GHz Band General RF Specifications
Table 19. 2.4 GHz Band General RF Specifications
Item
Condition
Minimum
Typical
Maximum
Unit
TX/RX switch time
Including TX ramp down
–
–
5
μs
RX/TX switch time
Including TX ramp up
–
–
2
μs
Power-up and power-down ramp time
DSSS/CCK modulations
–
–
<2
μs
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14.3 WLAN 2.4 GHz Receiver Performance Specifications
Note: The specification shown in Table 20 apply at the chip ports, unless otherwise defined.
Table 20. WLAN 2.4 GHz Receiver Performance Specifications
Parameter
Condition/Notes
Minimum
Typical
Maximum
Unit
Frequency range
–
2400
–
2500
MHz
RX sensitivity IEEE 802.11b
(8% PER for 1024 octet PSDU)
1 Mbps DSSS
–
–98.9
–
dBm
2 Mbps DSSS
–
–96.0
–
dBm
5.5 Mbps DSSS
–
–93.9
–
dBm
11 Mbps DSSS
–
–90.4
–
dBm
6 Mbps OFDM
–
–95.0
–
dBm
9 Mbps OFDM
–
–93.8
–
dBm
12 Mbps OFDM
–
–92.7
–
dBm
18 Mbps OFDM
–
–90.3
–
dBm
24 Mbps OFDM
–
–87.1
–
dBm
36 Mbps OFDM
–
–83.6
–
dBm
48 Mbps OFDM
–
–79.3
–
dBm
54 Mbps OFDM
–
–78.0
–
dBm
–
–94.6
–
dBm
–
–92.1
–
dBm
RX sensitivity IEEE 802.11g
(10% PER for 1024 octet PSDU)
RX sensitivity IEEE 802.11n
20 MHz channel spacing for all MCS rates
(10% PER for 4096 octet PSDU) 1
MCS0
Defined for default parameters:
MCS1
800 ns GI and non-STBC.
MCS2
Input in-band IP3
Maximum receive level
@ 2.4 GHz
–
–89.8
–
dBm
MCS3
–
–86.6
–
dBm
MCS4
–
–83.0
–
dBm
MCS5
–
–78.3
–
dBm
MCS6
–
–76.6
–
dBm
MCS7
–
–75.0
–
dBm
Maximum LNA gain
–
–8
–
dBm
Minimum LNA gain
–
+9
–
dBm
@ 1, 2 Mbps
(8% PER, 1024 octets)
–3.5
–
–
dBm
@ 5.5, 11 Mbps
(8% PER, 1024 octets)
–9.5
–
–
dBm
@ 6, 9, 12 Mbps
(10% PER, 1024 octets)
–9.5
–
–
dBm
@ MCS0–2 rates
(10% PER, 4095 octets)
–9.5
–
–
dBm
@ 18, 24, 36, 48, 54 Mbps
(10% PER, 1024 octets)
–14.5
–
–
dBm
@ MCS3–7 rates
(10% PER, 4095 octets)
–14.5
–
–
dBm
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CYW43903
Table 20. WLAN 2.4 GHz Receiver Performance Specifications (Cont.)
Parameter
Adjacent channel rejection-DSSS
(Difference between interfering
and desired signal at 8% PER for
1024 octet PSDU with desired
signal level as specified in
Condition/Notes.)
Condition/Notes
Minimum
Typical
Maximum
Unit
Desired and interfering signal 30 MHz apart
1 Mbps DSSS
–74 dBm
35
–
–
dB
2 Mbps DSSS
–74 dBm
35
–
–
dB
Desired and interfering signal 25 MHz apart
5.5 Mbps DSSS
–70 dBm
35
–
–
dB
11 Mbps DSSS
–70 dBm
35
–
–
dB
6 Mbps OFDM
–79 dBm
16
–
–
dB
9 Mbps OFDM
–78 dBm
15
–
–
dB
12 Mbps OFDM
–76 dBm
13
–
–
dB
18 Mbps OFDM
–74 dBm
11
–
–
dB
24 Mbps OFDM
–71 dBm
8
–
–
dB
36 Mbps OFDM
–67 dBm
4
–
–
dB
48 Mbps OFDM
–63 dBm
0
–
–
dB
54 Mbps OFDM
–62 dBm
–1
–
–
dB
MCS0
–79 dBm
16
–
–
dB
MCS1
–76 dBm
13
–
–
dB
MCS2
–74 dBm
11
–
–
dB
MCS3
–71 dBm
8
–
–
dB
MCS4
–67 dBm
4
–
–
dB
MCS5
–63 dBm
0
–
–
dB
MCS6
–62 dBm
–1
–
–
dB
MCS7
–61 dBm
–2
–
–
dB
Maximum receiver gain
–
–
–
66
–
dB
Gain control step
–
–
–
3
–
dB
–5
–
5
dB
Adjacent channel rejection-OFDM
(Difference between interfering
and desired signal (25 MHz apart)
at 10% PER for 1024 octet PSDU
with desired signal level as
specified in Condition/Notes.)
Adjacent channel rejection MCS0–
7
(Difference between interfering
and desired signal (25 MHz apart)
at 10% PER for 4096 octet PSDU
with desired signal level as
specified in Condition/Notes.)
RSSI
accuracy2
Range
–953
dBm to –30 dBm
Range above –30 dBm
–8
–
8
dB
Return loss
Zo = 50Ω, across the dynamic range
10
11.5
13
dB
Receiver cascaded noise figure
At maximum gain
–
4
–
dB
1. Sensitivity degradations for alternate settings in MCS modes. MM: 0.5 dB drop, and SGI: 2 dB drop.
2. The minimum and maximum values shown have a 95% confidence level.
3. –95 dBm with calibration at time of manufacture, –92 dBm without calibration.
Document Number: 002-14826 Rev. *G
Page 46 of 65
PRELIMINARY
CYW43903
14.4 WLAN 2.4 GHz Transmitter Performance Specifications
Note: Unless otherwise noted, the values shown in Table 21 apply at the chip ports.
Table 21. WLAN 2.4 GHz Transmitter Performance Specifications
Parameter
Frequency range
Condition/Notes
–
EVM1
Typical
Maximum
Unit
2400
–
2500
MHz
–9 dB
–
20.5
–
dBm
–8 dB
–
20
–
dBm
–13 dB
–
20
–
dBm
OFDM, 16-QAM
–19 dB
–
19
–
dBm
OFDM, 64-QAM (R = 3/
4)
–25 dB
–
19
–
dBm
OFDM, 64-QAM (MCS7, –27 dB
HT20)
–
18.5
–
dBm
OFDM, BPSK
5 dBm
–29
–31
–
dB
OFDM, 64-QAM
5 dBm
–31
–33
–
dB
MCS7
5 dBm
–33
DSS/CCK
RF port TX power
(highest power setting, 25°C, and OFDM, BPSK
VBAT = 3.6)
OFDM, QPSK
OFDM EVM2
(25°C, VBAT = 3.6V)
Minimum
–35
–
dB
Phase noise
37.4 MHz crystal, integrated from 10 kHz to –
10 MHz
0.45
–
Degrees
TX power control dynamic range
–
–
–
dB
Closed-loop TX power variation at Across full temperature and voltage range. –
highest
Applies to 10 dBm to 20 dBm output power
power level setting
range.
10
–
±1.5
dB
Carrier suppression
–
dBc
–
15
–
Gain control step
–
–
0.25
–
dB
Return loss at Chip port TX
Zo = 50Ω
–
6
–
dB
1. This specification row indicates the linear power specification as measured from the chip output port. The requirement is in dBm (TX power). The ratio (dB) in the
Conditions/Notes column is the EVM.
2. This specification row indicates the EVM floor. The requirement is in dB (EVM). The power in the Conditions/Notes column is the TX power specification in dBm.
Document Number: 002-14826 Rev. *G
Page 47 of 65
PRELIMINARY
CYW43903
14.5 General Spurious Emissions Specifications
This section provides the TX and RX spurious emissions specifications for the WLAN 2.4 GHz band. The recommended spectrum
analyzer settings for the spurious emissions specifications are provided in Table 22.
Table 22. Recommended Spectrum Analyzer Settings
Parameter
Setting
Resolution bandwidth (RBW)
1 MHz
Video bandwidth (VBW)
1 MHz
Sweep
Auto
Span
100 MHz
Detector
Maximum peak
Trace
Maximum hold
Modulation
OFDM
14.5.1 Transmitter Spurious Emissions Specifications
2.4 GHz Band Spurious Emissions
20-MHz Channel Spacing
Note: Possible AFE combinations are as follows. The AFE=VCO/18 specifications for channel 2442 are listed in Table 23
.
Table 23. 2.4 GHz Band, 20-MHz Channel Spacing TX Spurious Emissions Specifications
2G - 20 MHz BW
Spurious Emissions Level (dBm)
Emissions Frequency Range (MHz)
Channel Power (dBm)
CH2442
1000-2000
21
–50
2000-2400
21
–40
2500-3000
21
–40
3000-4000
21
–39
4000-5000
21
–24
5000-6000
21
–48
6000-7000
21
–49
7000-8000
21
–13
8000-10000
21
–43
10000-12000
21
–52
12000-15000
21
–50
15000-20000
21
–49
14.5.2 Receiver Spurious Emissions Specifications
Table 24. 2G General Receiver Spurious Emissions
Band
2G
Frequency Range
Typical
Maximum
Unit
2.4 GHz < f < 2.5 GHz
–75.5
–74.1
dBm
3.6 GHz < f < 3.8 GHz
–52.8
–50.9
dBm
Document Number: 002-14826 Rev. *G
Page 48 of 65
PRELIMINARY
CYW43903
15. Internal Regulator Electrical Specifications
15.1 Core Buck Switching Regulator
Note: Values in this data sheet are design goals and are subject to change based on device characterization results.
Note: Functional operation is not guaranteed outside of the specification limits provided in this section.
Table 25. Core Buck Switching Regulator (CBUCK) Specifications
Specification
Input supply voltage (DC)
Notes
DC voltage range inclusive of disturbances.
Min.
Typ.
Max.
3.0
3.6
4.81
Unit
V
PWM mode switching frequency
CCM, load > 100 mA VBAT = 3.6V.
–
4
–
MHz
PWM output current
–
–
–
550
mA
Output current limit
–
–
1400
–
mA
Output voltage range
Programmable, 30 mV steps. Default = 1.35V.
1.2
1.35
1.5
V
PWM output voltage DC accuracy
Includes load and line regulation. Forced PWM mode.
–4
–
4
%
PWM ripple voltage, static
Measure with 20 MHz bandwidth limit.
Static load. Max. ripple based on VBAT = 3.6V,
Vout = 1.35V, Fsw = 4 MHz, 2.2 μH inductor with min.
effective L > 1.05 μH,
cap. + board total – ESR < 20 mΩ, Cout > 1.9 μF,
ESL<200 pH
–
7
20
mVpp
PWM mode peak efficiency
Peak efficiency at 200 mA load.
78
86
–
%
PFM mode efficiency
10 mA load current.
70
81
–
%
Start-up time from power down
VIO already ON and steady. Time from REG_ON rising
edge to CLDO reaching 1.2V.
–
400
500
µs
External inductor
0806 size, 2.2 μH, DCR = 0.11Ω, ACR = 1.18Ω @
4 MHz.
–
2.2
–
µH
External output capacitor
Ceramic, X5R, 0402, ESR <30 mΩ at 4 MHz, 4.7 μF
±20%, 6.3V.
2.02
4.7
103
µF
External input capacitor
For SR_VDDBAT5V pin, ceramic, X5R, 0603, ESR <
30 mΩ at 4 MHz, ±4.7 μF ±20%, 6.3V.
0.672
4.7
–
µF
Input supply voltage ramp-up time
0 to 4.3V.
40
–
–
µs
1. The maximum continuous voltage is 4.8V. Voltages up to 6.0V for up to 10 seconds, cumulative duration, over the lifetime of the device are allowed. Voltages as
high as 5.0V for up to 250 seconds, cumulative duration, over the lifetime of the device are allowed.
2. Minimum capacitor value refers to the residual capacitor value after taking into account the part-to-part tolerance, DC-bias, temperature, and aging.
3. Total capacitance includes those connected at the far end of the active load.
Document Number: 002-14826 Rev. *G
Page 49 of 65
PRELIMINARY
CYW43903
15.2 3.3V LDO (LDO3P3)
Table 26. LDO3P3 Specifications
Specification
Input supply voltage, Vin
Notes
Min.
Typ.
Max.
Units
Min. = Vo + 0.2V = 3.5V dropout voltage requirement 3.0
must be met under maximum load for performance
specifications.
3.6
4.81
V
Output current
–
0.001
–
450
mA
Nominal output voltage, Vo
Default = 3.3V.
–
3.3
–
V
Dropout voltage
At max. load.
–
–
200
mV
Output voltage DC accuracy
Includes line/load regulation.
–5
–
+5
%
Quiescent current
No load.
–
–
85
µA
Line regulation
Vin from (Vo + 0.2V) to 4.8V, max. load.
–
–
3.5
mV/V
Load regulation
Load from 1 mA to 450 mA.
–
–
0.3
mV/mA
PSRR
Vin ≥ Vo + 0.2V, Vo = 3.3V, Co = 4.7 µF, Max load,
100 Hz to 100 kHz.
20
–
–
dB
LDO turn-on time
Chip already powered up.
–
160
250
µs
External output capacitor, Co
Ceramic, X5R, 0402,(ESR: 5 mΩ–240 mΩ), ± 10%,
10V.
4.7
10
µF
External input capacitor
For LDO_VDDBAT5V pin (shared with band gap)
–
ceramic, X5R, 0402, (ESR: 30mΩ–200 mΩ), ± 10%,
10V.
Not needed if sharing 4.7 µF VBAT capacitor with
SR_VDDBAT5V.
4.7
–
µF
1.0
2
1. The maximum continuous voltage is 4.8V. Voltages up to 6.0V for up to 10 seconds, cumulative duration, over the lifetime of the device are allowed. Voltages as
high as 5.0V for up to 250 seconds, cumulative duration, over the lifetime of the device are allowed.
2. Minimum capacitor value refers to the residual capacitor value after taking into account the part-to-part tolerance, DC-bias, temperature, and aging.
Document Number: 002-14826 Rev. *G
Page 50 of 65
PRELIMINARY
CYW43903
15.3 CLDO
Table 27. CLDO Specifications
Specification
Notes
Input supply voltage, Vin
Min. = 1.2 + 0.15V = 1.35V dropout voltage requirement must be met
under maximum load.
Min.
Typ.
Max.
Units
1.3
1.35
1.5
V
Output current
–
0.2
–
350
mA
Output voltage, Vo
Programmable in 10 mV steps. Default = 1.2.V.
0.95
1.2
1.26
V
Dropout voltage
At max. load.
–
–
150
mV
Output voltage DC
accuracy
Includes line/load regulation.
–4
–
+4
%
Quiescent current
No load.
–
26
–
µA
200 mA load.
–
2.48
–
mA
Line regulation
Vin from (Vo + 0.15V) to 1.5V, maximum load.
–
–
5
mV/V
Load regulation
Load from 1 mA to 300 mA.
–
0.02
0.05
mV/mA
Leakage current
Power down.
–
10
40
µA
Bypass mode.
–
2
6
µA
PSRR
@1 kHz, Vin ≥ 1.35V, Co = 4.7 µF.
20
–
Start-up time of PMU
VIO up and steady. Time from the REG_ON rising edge to the CLDO
reaching 1.2V.
–
–
700
µs
LDO turn-on time
LDO turn-on time when the rest of the chip is up.
–
140
180
µs
3.761
4.7
–
µF
1
2.2
µF
External output capacitor, Total ESR: 5 mΩ–240 mΩ.
Co
External input capacitor
Only use an external input capacitor at the LDO_VDD1P5 pin if it is not –
supplied from the CBUCK output.
dB
1. Minimum capacitor value refers to the residual capacitor value after taking into account the part-to-part tolerance, DC-bias, temperature, and aging.
Document Number: 002-14826 Rev. *G
Page 51 of 65
PRELIMINARY
CYW43903
15.4 LNLDO
Table 28. LNLDO Specifications
Specification
Notes
Min.
Units
1.5
V
mA
Min. VIN = VO + 0.15V = 1.35V (where VO = 1.2V)dropout voltage
requirement must be met under maximum load.
Output current
–
0.1
–
150
Output voltage, Vo
Programmable in 25 mV steps. Default = 1.2V.
1.1
1.2
1.275 V
Dropout voltage
At maximum load.
–
–
150
mV
Output voltage DC
accuracy
Includes line/load regulation.
–4
–
+4
%
Quiescent current
No load.
–
44
–
µA
Max. load.
–
970
990
µA
Line regulation
Vin from (Vo + 0.1V) to 1.5V, 150 mA load.
–
–
5
mV/V
Load regulation
Load from 1 mA to 150 mA.
–
0.02
0.05
mV/
mA
Leakage current
Power-down.
–
–
10
µA
Output noise
@30 kHz, 60–150 mA load Co = 2.2 µF. @100 kHz, 60–150 mA
load
Co = 2.2 µF.
–
–
60
35
nV/rt
Hz nV/
rt Hz
PSRR
@ 1kHz, Input > 1.35V, Co= 2.2 µF, Vo = 1.2V.
20
–
–
dB
LDO turn-on time
LDO turn-on time when the rest of the chip is up.
–
140
180
µs
2.2
4.7
µF
1
2.2
µF
External input capacitor
1
0.5
Only use an external input capacitor at the LDO_VDD1P5 pin if it is –
not supplied from the CBUCK output. Total ESR (trace/capacitor): 30
mΩ–200 mΩ.
1.35
Max.
Input supply voltage, Vin
External output capacitor, Total ESR (trace/capacitor): 5 mΩ–240 mΩ.
Co
1.3
Typ.
1. Minimum capacitor value refers to the residual capacitor value after taking into account the part-to-part tolerance, DC-bias, temperature, and aging.
Document Number: 002-14826 Rev. *G
Page 52 of 65
PRELIMINARY
CYW43903
15.5 BBPLL LDO
Table 29. BBPLL LDO Specifications
Parameter
Conditions and Comments
Min.
Typ.
Max.
Units
Input supply voltage, Vin
Min. Vin= Vo + 0.15V = 1.35V (for Vo = 1.2V).
The dropout voltage requirement must be met under maximum
load.
1.3
1.35
1.5
V
Output voltage, Vo
Programmable in 25 mV steps. Default = 1.2V.
1.1
1.2
1.275
V
Dropout voltage
At max. load
–
–
150
mV
Output voltage DC
accuracy
Includes line/load regulation.
–4
–
+4
%
Output current
Peak load = 80 mA, average = 35 mA
0.1
–
55
mA
Quiescent current
No load
–
10
12
μA
55 mA load
–
550
570
μA
Line regulation
Vin from (Vo + 0.15V) to 1.5V; 200 mA load
–
–
5
mV/V
Load regulation
load from 1mA to 200 mA; Vin ≥ (Vo + 0.15V)
–
0.025
0.045
mV/mA
Leakage current
Powered down. Junction temperature is 85°C.
–
5
20
μA
Bypass mode
–
0.2
1.5
μA
PSRR
@1 kHz, Vin ≥ Vo + 0.15V, Co = 4.7 μF
20
–
–
dB
Start-up time of PMU
VIO up and steady. Time from REG_ON rising edge to CLDO
reaching 99% of Vo.
–
530
700
us
LDO turn-on time
The LDO turn-on time when the rest of the chip is up.
–
140
180
us
Inrush current
Vin=Vo+0.15V to 1.5V, Co=0.47uF, no load
–
60
70
mA
External output capacitor,
Co
Ceramic, X5R, size 0201, max. 6.3V, 20% tolerance
0.27
0.47
–
μF
External input capacitor
Only use an external input capacitor at the LDO_VDD1P5 pin if it
is not supplied from the CBUCK output.
–
1
–
μF
Document Number: 002-14826 Rev. *G
Page 53 of 65
PRELIMINARY
CYW43903
16. System Power Consumption
Note: Values in this data sheet are design goals and are subject to change based on the results of device characterization.
Note: Unless otherwise stated, these values apply for the conditions specified in Table 16, “Recommended Operating Conditions and
DC Characteristics,”.
16.1 WLAN Current Consumption
The tables in this subsection show the typical, total current used by the CYW43903. Current values may be measured with the APPS
core powered off. The first column of the table, the mode description, will state the power condition of the APPS core.
16.1.1 2.4 GHz Mode
Table 30. 2.4 GHz Mode WLAN Current Consumption
VBAT = 3.6V 1 (μA)
Mode
VDDIO =
VDDIO_HIB = 3.3V 1, 2(μA)
Sleep Modes
3
3
Sleep 4, 5
6
160
IEEE Power Save, DTIM=1, single RX, APPS powered down 6
2180
160
IEEE Power Save, DTIM=3, single RX, APPS powered down 7
680
160
IEEE Power Save, DTIM=9, single RX, APPS powered down
233
160
Radio off
3
Active Modes
Continuous RX mode MCS7, HT20, 1SS, APPS powered up 8, 9
57,200
60
CRS-HT20, APPS powered up 10
55,200
60
Continuous TX mode 1 Mbps, APPS powered up 11
325,000
60
Continuous TX mode MCS7, HT20, 1SS, 1 TX, APPS powered up 12
302,000
60
Ping to associated access point 11
336,000
60
Sleep
6
160
Ping Modes
1. Typical silicon.
2. VIO is specified with all pins idle (not switching) and not driving any loads.
3. REG_ON is low or the device is in hibernation, and all supplies are present.
4. REG_ON is high. APPS domain is powered down. WLAN domain is in low-power state retention mode. Top level is powered up.
5. Inter-beacon current.
6. Beacon Interval = 102.4 ms. Beacon duration = 1 ms @ 1 Mbps. Average current over 3× DTIM intervals.
7. Beacon interval = 307.2 ms. Beacon duration = 1 ms @ 1 Mbps. Average current over 3× DTIM intervals.
8. Duty cycle is 100%. Carrier sense (CS) detect/packet receive.
9. Measured using packet engine test mode.
10. Carrier sense (CCA) when no carrier present.
11. Duty cycle is 100%. TX power at chip output ~17.7 dBm.
12. Duty cycle is 100%. TX power at chip output ~15.2 dBm.
Document Number: 002-14826 Rev. *G
Page 54 of 65
PRELIMINARY
CYW43903
17. SPI Flash Characteristics
17.1 SPI Flash Timing
17.1.1 Read-Register Timing
Figure 13 shows the SPI flash extended and quad read-register timing.
Note: Regarding Figure 13: All Read Register commands except Read Lock Register are supported. A Read Nonvolatile Configuration Register operation will output data
starting from the least significant byte.
Figure 13. SPI Flash Read-Register Timing
Extended
0
7
8
9
10
11
12
13
14
15
C
LSB
DQ0
Command
MSB
DQ1
LSB
High-Z
DOUT
DOUT
DOUT
DOUT
DOUT
DOUT
DOUT
DOUT
DOUT
MSB
Quad
0
1
2
3
C
LSB
DQ[3:0]
Command
MSB
Document Number: 002-14826 Rev. *G
LSB
DOUT
DOUT
DOUT
Don’t care
MSB
Page 55 of 65
PRELIMINARY
CYW43903
17.1.2 Write-Register Timing
Figure 14 shows the SPI flash extended and quad write-register timing.
Note: Regarding Figure 14:
1. All write-register commands except Write Lock Register are supported.
2. The waveform must be extended for each protocol: to 23 for extended and five for quad.
3. A Write Nonvolatile Configuration Register operation requires data being sent starting from the least significant byte.
Figure 14. SPI Flash Write-Register Timing
Extended
0
7
8
9
10
11
12
13
14
15
C
LSB
LSB
DQ0
Command
DIN
MSB
Quad
DIN
DIN
DIN
DIN
DIN
DIN
DIN
DIN
MSB
0
1
2
3
C
LSB
DQ[3:0]
LSB
DIN
Command
MSB
Document Number: 002-14826 Rev. *G
DIN
DIN
MSB
Page 56 of 65
PRELIMINARY
CYW43903
17.1.3 Memory Fast-Read Timing
Figure 15 shows the SPI flash extended and quad memory fast-read timing.
Note: Regarding Figure 15:
1. 24-bit addressing is used, so A[MAX] = A[23] and A[MIN] = A[0].
2. For an extended SPI protocol, Cx = 7 + (A[MAX] + 1).
3. For a quad SPI protocol, Cx = 1 + (A[MAX] + 1)/4.
Figure 15. Memory Fast-Read Timing
Extended
0
7
8
Cx
C
A[MIN]
LSB
Command
DQ0
MSB
DQ1
A[MAX]
LSB
DOUT
High-Z
DOUT
DOUT
DOUT
DOUT
DOUT
DOUT
DOUT
DOUT
MSB
Dummy Cycles
Quad
0
1
2
Cx
C
LSB
A[MIN]
LSB
DQ[3:0]
Command
MSB
DOUT
A[MAX]
DOUT
MSB
Dummy Cycles
Document Number: 002-14826 Rev. *G
DOUT
Don’t care
Page 57 of 65
PRELIMINARY
CYW43903
17.1.4 Memory-Write Timing
Figure 16 shows the SPI flash extended and quad memory-write (Page Program) timing.
Note: Regarding Figure 16:
1. For an extended SPI protocol, Cx = 7 + (A[MAX] + 1).
2. For a quad SPI protocol, Cx = 1 + (A[MAX] + 1)/4.
Figure 16. Memory-Write Timing
Extended
0
7
8
Cx
C
LSB
A[MIN]
LSB
DIN
Command
DQ0
MSB
Quad
A[MAX]
0
1
DIN
DIN
DIN
DIN
DIN
DIN
DIN
DIN
MSB
2
Cx
C
LSB
A[MIN]
LSB
DQ[3:0]
Command
MSB
Document Number: 002-14826 Rev. *G
DIN
A[MAX]
DIN
DIN
MSB
Page 58 of 65
PRELIMINARY
CYW43903
17.1.5 SPI Flash Parameters
The combination of Figure 17 and Table 31 provide the SPI flash timing parameters.
Figure 17. SPI Flash Timing Parameters Diagram
T_DVCH
Clock (C)
T_CHDX
Data in (DIN)
(DQ1 in Serial [Extended] mode)
(DQ[3:0] in Quad mode)
T_CLQX
Data out (DOUT)
(DQ0 in Serial [Extended] mode)
(DQ[3:0] in Quad mode)
T_CLQV
Table 31. SPI Flash Timing Parameters
Parameter
Description
Minimum
Maximum
Units
T_DVCH
Data setup time
2
–
ns
T_CHDX
Data hold time
3
–
ns
T_CLQX
Output hold time
1
–
ns
T_CLQV
Output valid time (with a 10 pF load)
–
5
ns
Document Number: 002-14826 Rev. *G
Page 59 of 65
PRELIMINARY
CYW43903
18. Power-Up Sequence and Timing
18.1 Sequencing of Reset and Regulator Control Signals
The CYW43903 has two signals that allow the host to control power consumption by enabling or disabling the internal regulator blocks.
These signals are described below. Additionally, diagrams are provided to indicate proper sequencing of the signals for various
operational states (see Figure 18 and Figure 19). The timing values indicated are minimum required values; longer delays are also
acceptable.
18.1.1 Description of Control Signals
■
REG_ON: Used by the PMU to power-up the CYW43903. It controls the internal CYW43903 regulators. When this pin is high,
the regulators are enabled and the device is out of reset. When this pin is low the regulators are disabled.
■
HIB_REG_ON_IN: Used by the Hibernation (HIB) block to power up the internal CYW43903 regulators. If the HIB_REG_ON_IN
pin is low, the regulators are disabled. For the HIB_REG_ON_IN pin to work as designed, HIB_REG_ON_OUT must be connected to REG_ON.
Note: The CYW43903 has an internal power-on reset (POR) circuit. The device will be held in reset for a maximum of 110 ms after
VDDC and VDDIO have both passed the POR threshold.
Note: The 10%–90% VBAT rise time should not be faster than 40 microseconds. VBAT should be up before or at the same time as
VDDIO. VDDIO should not be present first or be held high before VBAT is high.
18.1.2 Control Signal Timing Diagrams
Figure 18. REG_ON = High, No HIB_REG_ON_OUT Connection to REG_ON
3 2 .6 7 8 k H z
S le e p C lo c k
VBAT
V D D IO
~ 2 S le e p C y c le s
REG_O N
H IB _ R E G _ O N _ IN
Figure 19. HIB_REG_ON_IN = High, HIB_REG_ON_OUT Connected to REG_ON
3 2 .6 7 8 k H z
S le e p C lo c k
VBAT
V D D IO
~ 2 S le e p C y c le s
H IB _ R E G _ O N _ IN
Document Number: 002-14826 Rev. *G
Page 60 of 65
PRELIMINARY
CYW43903
19. Thermal Information
19.1 Package Thermal Characteristics
Table 32. Package Thermal Characteristics1
Characteristic
WLBGA
JA (°C/W) (value in still air)
JB (°C/W)
JC (°C/W)
31.72
JT (°C/W)
4.3
JB (°C/W)
9.28
Maximum Junction Temperature Tj (°C)
113.9
Maximum power dissipation (W)
1.38
3.95
2.16
1. No heat sink, TA = 70°C. This is an estimate based on a 4-layer PCB that conforms to EIA/JESD51–7. Air velocity is 0 m/s.
19.2 Junction Temperature Estimation and PSIJT Versus THETAJC
Package thermal characterization parameter PSI–JT (JT) yields a better estimation of actual junction temperature (TJ) versus using
the junction-to-case thermal resistance parameter Theta–JC (JC). The reason for this is that JC assumes that all the power is
dissipated through the top surface of the package case. In actual applications, some of the power is dissipated through the bottom
and sides of the package. JT takes into account power dissipated through the top, bottom, and sides of the package. The equation
for calculating the device junction temperature is:
TJ = TT + P x YJT
Where:
■
TJ = Junction temperature at steady-state condition (°C)
■
TT = Package case top center temperature at steady-state condition (°C)
■
P = Device power dissipation (Watts)
■
JT = Package thermal characteristics; no airflow (°C/W)
19.3 Environmental Characteristics
For environmental characteristics data, see Table 14, “Environmental Ratings,”.
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20. Mechanical Information
Figure 20. WLBGA Package
Document Number: 002-14826 Rev. *G
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CYW43903
21. Ordering Information
Part Number
CYW43903KUBG
Package
4.91 mm x 5.85 mm, 0.4 mm ball pitch,
151-pin WLBGA
Description
–
Operating
Ambient
Temperature
–30°C to +85°C
22. Additional Information
22.1 Acronyms and Abbreviations
In most cases, acronyms and abbreviations are defined upon first use. For a more complete list of acronyms and other terms used in
Cypress documents, go to: http://www.cypress.com/glossary.
22.2 IoT Resources
Cypress provides a wealth of data at http://www.cypress.com/internet-things-iot to help you to select the right IoT device for your
design, and quickly and effectively integrate the device into your design. Cypress provides customer access to a wide range of
information, including technical documentation, schematic diagrams, product bill of materials, PCB layout information, and software
updates. Customers can acquire technical documentation and software from the Cypress Support Community website
(https://community.cypress.com/)
22.3 Errata
1. The RTC block has been deprecated from this datasheet in revision *A and later. This block is used by Cypress for internal
testing/validation/verification and is not intended for customers to use.
2. The details of the SPI hardware blocks was not available in revision *E and 5.7 SPI has been added in Revision *F.
Note that the SPI hardware blocks can only support a hold time of 25ns and a fixed SPI mode (CPHA=0, CPOL = 0). For slaves that
require higher hold times or a different mode, a bit banging based SPI driver is recommended.
3. The clock for the SPI Flash block needs to be constrained to ~26.67MHz for reliable operation at high operating temperatures.
The throughput of the SPI Flash block is therefore restricted to ~13 MBps for Quad mode and ~3 MBps for single mode
Document Number: 002-14826 Rev. *G
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Document History Page
Document Title: CYW43903 WICED™ IEEE 802.11 a/b/g/n SoC with an Embedded Applications Processor
Document Number: 002-14826
ECN
Orig. of
Change
**
–
–
10/15/2015
*A
–
–
11/03/2015
43903-DS101-R
Updated:
Table 21: “Absolute Maximum Ratings”, Table 24: “Recommended Operating
Conditions and DC Characteristics”, Table 30: “WLAN 2.4 GHz Receiver
Performance Specifications”, Table 31: “WLAN 2.4 GHz Transmitter Performance
Specifications”
*B
–
–
03/12/2016
43903-DS102-R
Updated:
General edits
*C
5445059
UTSV
11/28/2016
Added Cypress Part Numbering Scheme and Mapping Table.
Updated to Cypress template.
*D
5593296
TREB
01/24/2017
Removed 43909 Documentation.
Updated Cypress Logo and Copyright.
*E
5909757
UTSV
10/12/2017
Updated 512 KB to 1 MB in the following pages:
Features on page 1, Figure 1 on page 2, Figure 2 on page 5, Features on page 6,
Applications CPU and Memory Subsystem on page 16.
*F
5986964
SHJL
12/11/2017
Updated “Broadcom Serial Control (BSC)” to “Cypress Serial Control (BSC)”
throughout the document.
Added VBAT in Figure 1 on page 2.
Updated the footnotes in Table 4 on page 14.
Deleted 3.3 Frequency Selection and Real-Time Clock.
Added “Note: JTAG_SEL is exposed on a dedicated physical pin. TAP_SEL uses
the GPIO_8 physical pin.” below Table 6.
Added “Note: The high-speed, 4-wire UART interface is identified as UART0 in this
document and in reference schematics. The two low-speed,
2-wire UART interfaces are identified as UART1 and UART2 in this document and
in the reference schematics” in the UART on page 18.
Added footnote in Table 11 on page 36 and Table 30 on page 54.
Added section SPI on page 19.
Added Errata on page 63
*G
6026132
SHJL
1/11/2018
Updated footnote of 5.5 SPI Flash as “Note that the clock needs to be constrained
to ~26.67MHz for reliable operation at high operating temperatures. The throughput
of the SPI Flash block is therefore restricted to ~13 MBps for Quad mode and ~3
MBps for single mode”.
Added “ The clock for the SPI Flash block needs to be constrained to ~26.67MHz for
reliable operation at high operating temperatures.
The throughput of the SPI Flash block is therefore restricted to ~13 MBps for Quad
mode and ~3 MBps for single mode.” to 22.3.Errata.
Revision
Submission
Date
Description of Change
43903-DS100-R
Initial Release
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Document Number: 002-14826 Rev. *G
Revised January 11, 2018
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