CYStech Electronics Corp. Spec. No. : C236K3 Issued Date : 2012.10.23 Revised Date : 2013.12.25 Page No. : 1/6 Silicon PNP Epitaxial Planar Transistor BTA1972K3 Description • High BVCEO • High current capability • Pb-free lead plating and halogen-free package Symbol Outline TO-92L BTA1972K3 B：Base C：Collector E：Emitter Ordering Information Device BTA1972K3-0-TB-G BTA1972K3-0-BM-G Package TO-92L (Pb-free lead plating and halogen-free package) TO-92L (Pb-free lead plating and halogen-free package) Shipping 2000 pcs / tape & box 500 pcs / bag, 10 bags/box, 10 boxes/carton Environment friendly grade : S for RoHS compliant products, G for RoHS compliant and green compound products Packing spec, TB : 2000 pcs / tape & box ; BM : 500 pcs/bag, 10 bags/box, 10 boxes/carton Product rank, zero for no rank products Product name BTA1972K3 CYStek Product Specification CYStech Electronics Corp. Spec. No. : C236K3 Issued Date : 2012.10.23 Revised Date : 2013.12.25 Page No. : 2/6 Absolute Maximum Ratings (Ta=25°C) Parameter Collector-Base Voltage Collector-Emitter Voltage Emitter-Base Voltage Collector Current (DC) Collector Current (Pulse) Base Current Collector Power Dissipation Junction Temperature Storage Temperature Symbol VCBO VCEO VEBO IC ICP IB PC Tj Tstg Limits -400 -400 -7 -0.3 -7 -0.1 900 150 -55~+150 Unit V V V A A A mW °C °C Characteristics (Ta=25°C) Symbol BVCBO BVCEO BVEBO ICBO IEBO ICES *VCE(sat) 1 *VCE(sat) 2 *VCE(sat) 3 *VBE(sat) hFE 1 *hFE 2 *hFE 3 *hFE 4 fT Cob Min. -400 -400 -7 120 120 120 100 40 - Typ. -0.08 -0.12 -0.2 -0.8 - Max. -1 -100 -1 -0.15 -0.2 -0.4 -1 270 8 Unit V V V μA nA μA V V V V MHz pF Test Conditions IC=-50μA IC=-1mA IE=-50μA VCB=-400V VEB=-7V VCE=-400V, VBE=0V IC=-10mA, IB=-1mA IC=-50mA, IB=-5mA IC=-100mA, IB=-10mA IC=-100mA, IB=-10mA VCE=-10V, IC=-1mA VCE=-10V, IC=-10mA VCE=-10V, IC=-50mA VCE=-10V, IC=-100mA VCE=-10V, IC=-10mA VCB=-10V, IE=0A,f=1MHz *Pulse Test: Pulse Width ≤380µs, Duty Cycle≤2% BTA1972K3 CYStek Product Specification Spec. No. : C236K3 Issued Date : 2012.10.23 Revised Date : 2013.12.25 Page No. : 3/6 CYStech Electronics Corp. Typical Characteristics Current Gain vs Collector Current Saturation Voltage vs Collector Current 10000 Saturation Voltage-(mV) Current Gain--- HFE 1000 VCE=10V 100 VCESAT 1000 IC=30IB 100 VCE=5V IC=10IB 10 10 1 10 100 1000 1 10 Collector Current ---IC(mA) Collector Current ---IC(mA) 100 Transition Frequency vs Collector Current Saturation Voltage vs Collector Current 100 Transiition Frequency---fT(MHz) 10000 Saturation Voltage-(mV) IC=20IB VBESAT@IC=10IB 1000 100 VCE=10V 10 1 10 100 1000 1 10 Collector Current--- IC(mA) Collector Current--- IC(mA) Capacitance Characteristics 100 Power Derating Curve 1000 1000 Power Dissipation---PD(mW) 900 Capacitance-(pF) f=1MHz Cib 100 10 Cob 800 700 600 500 400 300 200 100 0 1 0.1 1 10 Reverse-bised Voltage---(V) BTA1972K3 100 0 50 100 150 200 Ambient Temperature---TA(℃) CYStek Product Specification CYStech Electronics Corp. Spec. No. : C236K3 Issued Date : 2012.10.23 Revised Date : 2013.12.25 Page No. : 4/6 TO-92L Taping Outline DIM A1 A T d d1 P P0 P2 F1, F2 △h W W0 W1 W2 H H0 L1 D0 t1 t2 P1 △P BTA1972K3 Item Millimeters Component body width Component body height Component body thickness Lead wire diameter Lead wire diameter 1 Pitch of component Feed hole pitch Hole center to component center Lead to lead distance Component alignment, F-R Tape width Hole down tape width Hole position Hole down tape position Height of component from tape center Lead wire clinch height Lead wire (tape portion) Feed hole diameter Taped lead thickness Carrier tape thickness Position of hole Min. 4.70 7.80 3.70 0.35 0.60 12.40 12.50 6.05 2.20 -1.00 17.50 5.50 8.50 19.00 15.50 2.50 3.80 0.35 0.15 3.55 Max. 5.10 8.20 4.10 0.55 0.80 13.00 12.90 6.65 2.80 1.00 19.00 6.50 9.50 1.00 21.00 16.50 4.20 0.45 0.25 4.15 Component alignment -1.00 1.00 CYStek Product Specification CYStech Electronics Corp. Spec. No. : C236K3 Issued Date : 2012.10.23 Revised Date : 2013.12.25 Page No. : 5/6 Recommended wave soldering condition Product Pb-free devices Peak Temperature 260 +0/-5 °C Soldering Time 5 +1/-1 seconds Recommended temperature profile for IR reflow Profile feature Average ramp-up rate (Tsmax to Tp) Preheat −Temperature Min(TS min) −Temperature Max(TS max) −Time(ts min to ts max) Time maintained above: −Temperature (TL) − Time (tL) Peak Temperature(TP) Time within 5°C of actual peak temperature(tp) Ramp down rate Time 25 °C to peak temperature Sn-Pb eutectic Assembly Pb-free Assembly 3°C/second max. 3°C/second max. 100°C 150°C 60-120 seconds 150°C 200°C 60-180 seconds 183°C 60-150 seconds 240 +0/-5 °C 217°C 60-150 seconds 260 +0/-5 °C 10-30 seconds 20-40 seconds 6°C/second max. 6 minutes max. 6°C/second max. 8 minutes max. Note : All temperatures refer to topside of the package, measured on the package body surface. BTA1972K3 CYStek Product Specification CYStech Electronics Corp. Spec. No. : C236K3 Issued Date : 2012.10.23 Revised Date : 2013.12.25 Page No. : 6/6 TO-92L Dimension Marking: Product Name A1972 Date Code: Year+Month □□ Year: 7→2007, 8→2008 Month: 1→1, 2→2, ‧‧‧, 9→9, A→10, B→11, C→12 Style: Pin 1.Emitter 2.Collector 3.Base 3-Lead TO-92L Plastic Package CYStek Package Code: K3 Inches DIM Min. 0.146 0.050 0.014 0.024 0.014 0.185 0.157 Max. 0.161 0.062 0.022 0.031 0.018 0.201 - Millimeters Min. Max. 3.700 4.100 1.280 1.580 0.350 0.550 0.600 0.800 0.350 0.450 4.700 5.100 4.000 - A A1 b b1 c D D1 Notes: 1.Controlling dimension: millimeters. DIM E e e1 L ϕ h Inches Min. 0.307 Max. 0.323 *0.05 0.096 0.543 0.000 0.104 0.559 0.063 0.012 *: Typical Millimeters Min. Max. 7.800 8.200 *1.270 2.440 2.640 13.800 14.200 1.600 0.000 0.300 2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.If there is any question with packing specification or packing method, please contact your local CYStek sales office. Material: • Lead: Pure tin plated. • Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0. Important Notice: • All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek. • CYStek reserves the right to make changes to its products without notice. • CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. • CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. BTA1972K3 CYStek Product Specification