1 of 3 Creation Date : January 17, 2017 (GMT) Multilayer Ceramic Chip Capacitors C3225C0G3A472J200AC TDK item description C3225C0G3A472JT**** Commercial Grade Applications Please refer to Part No. CGA6M1C0G3A472J200AC for Automotive use. Feature High High Voltage (1000V and over) Series C3225 [EIA 1210] Status Production Size Length(L) 3.20mm ±0.40mm Width(W) 2.50mm ±0.30mm Thickness(T) 2.00mm ±0.20mm Terminal Width(B) 0.20mm Min. Terminal Spacing(G) Recommended Land Pattern (PA) 2.00mm to 2.40mm Recommended Land Pattern (PB) 1.00mm to 1.20mm Recommended Land Pattern (PC) 1.90mm to 2.50mm Recommended Slit Pattern (SD) Electrical Characteristics Capacitance 4.7nF ±5% Rated Voltage 1kVDC Temperature Characteristic C0G(0±30ppm/°C) Q (Min.) 1000 Insulation Resistance (Min.) 10000MΩ Other Soldering Method Reflow AEC-Q200 No Packing Blister (Plastic)Taping [180mm Reel] Package Quantity 1000pcs ! Images are for reference only and show exemplary products. ! This PDF document was created based on the data listed on the TDK Corporation website. ! All specifications are subject to change without notice. Copyright(c) TDK Corporation. All rights reserved. Multilayer Ceramic Chip Capacitors 2 of 3 Creation Date : January 17, 2017 (GMT) C3225C0G3A472J200AC Characteristic Graphs(This is reference data, and does not guarantee the products characteristics.) ! Images are for reference only and show exemplary products. ! This PDF document was created based on the data listed on the TDK Corporation website. ! All specifications are subject to change without notice. Copyright(c) TDK Corporation. All rights reserved. Multilayer Ceramic Chip Capacitors C3225C0G3A472J200AC Associated Images Land Pattern (Terminal Connection) ! Images are for reference only and show exemplary products. ! This PDF document was created based on the data listed on the TDK Corporation website. ! All specifications are subject to change without notice. Copyright(c) TDK Corporation. All rights reserved. 3 of 3 Creation Date : January 17, 2017 (GMT)