ETC2 DSI45-12 Rectifier diode Datasheet

DSI45
Rectifier Diode
Reverse Voltage:
Forward Current:
800 to 1600V
45A
Features:
C
●
A
z
z
z
A=Anode C=Cathode
z
Circuit
Glass passivated chips
Low Leakage Current
Low Forward Voltage
RoHS Compliance
Input rectification
Applications
+
●
●
●
●
Module Type
TYPE
DSI45-08
DSI45-12
DSI45-16
Maximum Ratings
Symbol
Item
Average forward current
IF(AV)
Forward surge current, max.
IFSM
2
Value for fusing
it
Supplies for DC power equipment
DC supply for PWM inverter
Field supply for DC motors
Battery DC power supplies
VRRM
VRSM
800V
1200V
1600V
900V
1300V
1700V
Values
Units
45
500
A
A
1250
A2s
2500
V
Operating Junction Temperature
-40 to +150
℃
Tstg
Storage Temperature
Md
Mounting torque
-40 to +150
0.8...1.2
Nm
6
g
Visol
Tvj
Weight
Conditions
Tc=100℃
t=10mS Tvj =45℃
Isolation Breakdown Voltage(R.M.S)
a.c.50HZ;r.m.s.;1min
Approximate Weight
Thermal Characteristics
Symbol
Item
Rth(j-c) Thermal Impedance, max.
Rth(c-s) Thermal Impedance, max.
Conditions
℃
Values
Units
Junction to Case
0.65
℃/W
Case to Heatsink
0.20
℃/W
Electrical Characteristics
Symbol
VFM
Item
Conditions
T=25℃ IF=45A
T=150℃ IF=45A
Forward Voltage Drop, max.
rF
Slope resistance
calculation only
for
power
loss
VFO
Threshold voltage
calculation only
for
power
loss
IRRM
Repetitive Peak Reverse Current, max.
Document Number: DSI45
Apr.26, 2011
Values
Min. Typ. Max.
-
1.1
1.28
1.20
Units
V
Tj =150℃
7.7
mΩ
Tj =150℃
0.76
V
Tvj =25℃ VRD=VRRM
Tvj =150℃ VRD=VRRM
-
-
5
µA
-
-
3
mA
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DSI45
Performance Curves
1000
100
A
W
100
max.
50
10
25℃
- - -150℃
IF
Pvtot
0
1
0.5
VF
1.0
1.5
2.0
V
0 ID
2.5
10
20
30
40
A 50
Fig2. Power dissipation
Fig1. Forward Characteristics
1.0
1000
℃/ W
A
50HZ
Zth(j-C)
500
0.5
0
0
0.001
0.01
0.1
1.0
10
S 100
1
10
cycles 100
Fig4. Max Non-Repetitive Forward Surge
Current
Fig3. Transient thermal impedance
50
A
40
30
20
10
ID
0
0
Tc
50
100
℃ 150
Fig5.Forward Current Derating Curve
Document Number: DSI45
Apr.26, 2011
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2
DSI45
Package Outline Information
CASE: TO-247
Dimensions in inches (mm)
Document Number: DSI45
Apr.26, 2011
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