Material Content Data Sheet Sales Product Name SAF-XC836M-2FRI AB MA# MA000999878 Package PG-TSSOP-28-1 Issued Weight* Construction Element Material Group Substances CAS# if applicable chip leadframe inorganic material non noble metal non noble metal noble metal organic material plastics inorganic material non noble metal noble metal plastics noble metal < 10% silicon nickel iron gold carbon black epoxy resin silicondioxide tin silver acrylic resin silver 7440-21-3 7440-02-0 7439-89-6 7440-57-5 1333-86-4 60676-86-0 7440-31-5 7440-22-4 7440-22-4 wire encapsulation leadfinish plating glue *deviation 29. August 2013 Weight [mg] 107.13 mg Average Mass [%] Sum [%] 4.20 Average Mass [ppm] Sum [ppm] 41960 41960 4.495 4.20 14.398 13.44 19.882 18.56 32.00 185589 319981 0.584 0.55 0.55 5451 5451 0.190 0.18 134392 1776 8.055 7.52 55.179 51.49 59.19 515059 592022 1.539 1.44 1.44 14370 14370 1.416 1.32 1.32 13214 13214 0.279 0.26 1.114 1.04 75187 2600 1.30 10402 Sum in total: 100,00 Important Remarks: 1. 2. 3. Infineon Technologies AG provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. Company Infineon Technologies AG Address 81726 München Internet www.infineon.com 13002 1000000