Material Content Data Sheet Sales Product Name SAF-C164CI-8EM CB MA# MA001053002 Package PG-MQFP-80-7 Issued 29. August 2013 Weight* 995.30 mg Construction Element Material Group Substances CAS# if applicable Weight [mg] Average Mass [%] chip leadframe inorganic material non noble metal inorganic material non noble metal non noble metal noble metal organic material plastics inorganic material non noble metal noble metal plastics noble metal < 10% silicon magnesium silicon nickel copper gold carbon black epoxy resin silicondioxide tin silver acrylic resin silver 7440-21-3 7439-95-4 7440-21-3 7440-02-0 7440-50-8 7440-57-5 1333-86-4 60676-86-0 7440-31-5 7440-22-4 7440-22-4 43.021 4.32 0.375 0.04 376 1.624 0.16 1631 7.494 0.75 240.318 24.15 25.10 241454 250991 4.075 0.41 0.41 4094 4094 2.024 0.20 wire encapsulation leadfinish plating glue *deviation Sum [%] Average Mass [ppm] Sum [ppm] 4.32 43225 43225 7530 2033 85.672 8.61 586.884 58.96 67.77 589657 677766 9.487 0.95 0.95 9532 9532 7.024 0.71 0.71 7057 7057 1.460 0.15 5.841 0.59 86076 1467 0.74 Sum in total: 100,00 Important Remarks: 1. 2. 3. Infineon Technologies AG provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. Company Infineon Technologies AG Address 81726 München Internet www.infineon.com 5868 7335 1000000