NVTFS5824NL Power MOSFET 60 V, 20.5 mW, 37 A, Single N−Channel Features • • • • • • Small Footprint (3.3 x 3.3 mm) for Compact Design Low RDS(on) to Minimize Conduction Losses Low Capacitance to Minimize Driver Losses NVTFS5824NLWF − Wettable Flanks Product AEC−Q101 Qualified and PPAP Capable These Devices are Pb−Free and are RoHS Compliant www.onsemi.com V(BR)DSS RDS(on) MAX 20.5 mW @ 10 V 60 V 37 A 27 mW @ 4.5 V MAXIMUM RATINGS (TJ = 25°C unless otherwise noted) Parameter Symbol Value Unit Drain−to−Source Voltage VDSS 60 V Gate−to−Source Voltage VGS ±20 V ID 37 A Continuous Drain Current RYJ−mb (Notes 1, 2, 3, 4) Power Dissipation RYJ−mb (Notes 1, 2, 3) Continuous Drain Current RqJA (Notes 1 & 3, 4) Power Dissipation RqJA (Notes 1, 3) Pulsed Drain Current Tmb = 25°C Steady State Tmb = 100°C Tmb = 25°C 26 PD Steady State ID TA = 25°C, tp = 10 ms Source Current (Body Diode) Single Pulse Drain−to−Source Avalanche Energy (TJ = 25°C, VDD = 24 V, VGS = 10 V, IL(pk) = 20 A, L = 0.1 mH, RG = 25 W) Lead Temperature for Soldering Purposes (1/8″ from case for 10 s) S (1, 2, 3) A 7.6 PD W 3.2 1.6 IDM 127 A TJ, Tstg −55 to +175 °C IS 18 A EAS 20 mJ TL 260 °C Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. THERMAL RESISTANCE MAXIMUM RATINGS (Note 1) Parameter MARKING DIAGRAM 5.4 TA = 100°C Operating Junction and Storage Temperature G (4) 28 TA = 100°C TA = 25°C N−Channel D (5 − 8) W 57 Tmb = 100°C TA = 25°C ID MAX Symbol Value Unit Junction−to−Case − Steady State (Note 3) RqJC 2.6 °C/W Junction−to−Ambient − Steady State (Note 3) RqJA 47 1 WDFN8 (m8FL) CASE 511AB XXXX A Y WW G 1 S S S G XXXX AYWWG G D D D D = Specific Device Code = Assembly Location = Year = Work Week = Pb−Free Package (Note: Microdot may be in either location) ORDERING INFORMATION See detailed ordering, marking and shipping information in the package dimensions section on page 5 of this data sheet. 1. The entire application environment impacts the thermal resistance values shown, they are not constants and are only valid for the particular conditions noted. 2. Psi (Y) is used as required per JESD51−12 for packages in which substantially less than 100% of the heat flows to single case surface. 3. Surface−mounted on FR4 board using a 650 mm2, 2 oz. Cu pad. 4. Continuous DC current rating. Maximum current for pulses as long as 1 second is higher but is dependent on pulse duration and duty cycle. © Semiconductor Components Industries, LLC, 2015 July, 2015 − Rev. 0 1 Publication Order Number: NVTFS5824NL/D NVTFS5824NL ELECTRICAL CHARACTERISTICS (TJ = 25°C unless otherwise noted) Parameter Symbol Test Condition Min V(BR)DSS VGS = 0 V, ID = 250 mA 60 Typ Max Unit OFF CHARACTERISTICS Drain−to−Source Breakdown Voltage Zero Gate Voltage Drain Current IDSS VGS = 0 V, VDS = 60 V TJ = 25°C 1.0 TJ = 125°C 10 IGSS VDS = 0 V, VGS = "20 V Gate Threshold Voltage VGS(TH) VGS = VDS, ID = 250 mA Drain−to−Source On Resistance RDS(on) VGS = 10 V, ID = 10 A Gate−to−Source Leakage Current V mA "100 nA 2.5 V 17.5 20.5 mW 27 ON CHARACTERISTICS (Note 5) 1.5 VGS = 4.5 V, ID = 10 A 23.5 gFS VDS = 15 V, ID = 5 A 8 S Input Capacitance Ciss 850 pF Output Capacitance Coss VGS = 0 V, f = 1.0 MHz, VDS = 25 V Reverse Transfer Capacitance Crss 50 Total Gate Charge QG(TOT) 8.3 nC Threshold Gate Charge QG(TH) 1 nC Forward Transconductance CHARGES AND CAPACITANCES Gate−to−Source Charge QGS Gate−to−Drain Charge QGD Total Gate Charge QG(TOT) VGS = 4.5 V, VDS = 48 V, ID = 10 A 85 3 4 VGS = 10 V, VDS = 48 V, ID = 10 A 16 nC td(on) 9 ns tr VGS = 4.5 V, VDS = 48 V, ID = 10 A 29 SWITCHING CHARACTERISTICS (Note 6) Turn−On Delay Time Rise Time Turn−Off Delay Time Fall Time td(off) tf 14 21 DRAIN−SOURCE DIODE CHARACTERISTICS Forward Diode Voltage VSD Reverse Recovery Time tRR Charge Time ta Discharge Time tb Reverse Recovery Charge VGS = 0 V, IS = 10 A TJ = 25°C 0.8 TJ = 125°C 0.7 18 VGS = 0 V, dlS/dt = 100 A/ms, IS = 10 A QRR www.onsemi.com 2 V ns 14 4 17 5. Pulse Test: Pulse Width ≤ 300 ms, Duty Cycle ≤ 2%. 6. Switching characteristics are independent of operating junction temperatures. 1.2 nC NVTFS5824NL TYPICAL CHARACTERISTICS 50 60 10 V 50 4.0 V 40 3.8 V 30 3.6 V ID, DRAIN CURRENT (A) ID, DRAIN CURRENT (A) VDS ≥ 10 V TJ = 25°C VGS = 4.5 V 3.4 V 20 3.2 V 10 20 TJ = 25°C 10 TJ = 125°C 0 1 2 3 0 5 4 1 2 3 4 5 VGS, GATE−TO−SOURCE VOLTAGE (V) Figure 1. On−Region Characteristics Figure 2. Transfer Characteristics 0.040 0.050 ID = 10 A TJ = 25°C 0.040 TJ = 25°C 0.030 0.030 VGS = 4.5 V VGS = 10 V 0.020 0.020 0.010 0.010 2 4 6 8 5 10 VGS, GATE−TO−SOURCE VOLTAGE (V) 2.40 2.00 15 20 25 30 35 40 Figure 4. On−Resistance vs. Drain Current and Gate Voltage 100000 VGS = 0 V ID = 10 A VGS = 10 V IDSS, LEAKAGE (nA) 2.20 10 ID, DRAIN CURRENT (A) Figure 3. On−Resistance vs. Gate−to−Source Voltage RDS(on), DRAIN−TO−SOURCE RESISTANCE (NORMALIZED) TJ = −55°C VDS, DRAIN−TO−SOURCE VOLTAGE (V) RDS(on), DRAIN−TO−SOURCE RESISTANCE (W) RDS(on), DRAIN−TO−SOURCE RESISTANCE (W) 30 3.0 V 2.8 V 0 40 1.80 10000 1.60 1.40 1.20 1.00 TJ = 150°C 1000 TJ = 125°C 0.80 0.60 −50 100 −25 0 25 50 75 100 125 TJ, JUNCTION TEMPERATURE (°C) 150 175 10 Figure 5. On−Resistance Variation with Temperature 20 30 40 50 VDS, DRAIN−TO−SOURCE VOLTAGE (V) Figure 6. Drain−to−Source Leakage Current vs. Voltage www.onsemi.com 3 60 NVTFS5824NL TYPICAL CHARACTERISTICS 10 VGS, GATE−TO−SOURCE VOLTAGE (V) 1200 VGS = 0 V C, CAPACITANCE (pF) 1000 TJ = 25°C Ciss 800 600 400 Coss 200 0 Crss 0 10 20 30 40 50 DRAIN−TO−SOURCE VOLTAGE (V) QT 8 6 4 VDS = 48 V ID = 10 A TJ = 25°C 0 4 8 12 Qg, TOTAL GATE CHARGE (nC) Figure 7. Capacitance Variation 40 IS, SOURCE CURRENT (A) VDD = 48 V ID = 10 A VGS = 4.5 V t, TIME (ns) 100.0 td(off) tr td(on) tf 10.0 1.0 1 10 RG, GATE RESISTANCE (W) 100 VGS = 0 V TJ = 25°C 30 20 10 0 0.5 Figure 9. Resistive Switching Time Variation vs. Gate Resistance 1.0 Figure 10. Diode Forward Voltage vs. Current VGS = 10 V Single Pulse TC = 25°C 100 ms 10 ms 1 ms 10 ms 10 1 RDS(on) Limit Thermal Limit Package Limit 0.1 dc 1 10 VDS, DRAIN−TO−SOURCE VOLTAGE (V) EAS, SINGLE PULSE DRAIN−TO− SOURCE AVALANCHE ENERGY (mJ) ID, DRAIN CURRENT (A) 0.6 0.7 0.8 0.9 VSD, SOURCE−TO−DRAIN VOLTAGE (V) 20 1000 0.1 16 Figure 8. Gate−to−Source Voltage vs. Total Charge 1000.0 100 Qgd 2 0 60 Qgs 100 ID = 20 A 15 10 5 0 25 Figure 11. Maximum Rated Forward Biased Safe Operating Area 50 75 100 125 150 TJ, STARTING JUNCTION TEMPERATURE (°C) Figure 12. Maximum Avalanche Energy vs. Starting Junction Temperature www.onsemi.com 4 175 NVTFS5824NL TYPICAL CHARACTERISTICS RqJA(t) (°C/W) EFFECTIVE TRANSIENT THERMAL RESISTANCE 100 Duty Cycle = 0.5 10 1 0.2 0.1 0.05 0.02 0.01 0.1 Single Pulse 0.01 0.000001 0.00001 0.0001 0.001 0.01 0.1 1 10 100 1000 PULSE TIME (sec) Figure 13. Thermal Response DEVICE ORDERING INFORMATION Marking Package Shipping† NVTFS5824NLTAG 5824 WDFN8 (Pb−Free) 1500 / Tape & Reel NVTFS5824NLWFTAG 24LW WDFN8 (Pb−Free) 1500 / Tape & Reel NVTFS5824NLTWG 5824 WDFN8 (Pb−Free) 5000 / Tape & Reel NVTFS5824NLWFTWG 24LW WDFN8 (Pb−Free) 5000 / Tape & Reel Device †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. www.onsemi.com 5 NVTFS5824NL PACKAGE DIMENSIONS WDFN8 3.3x3.3, 0.65P CASE 511AB ISSUE D 2X NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION D1 AND E1 DO NOT INCLUDE MOLD FLASH PROTRUSIONS OR GATE BURRS. 0.20 C D A B D1 2X 0.20 C 8 7 6 5 4X q E1 E c 1 2 3 4 A1 TOP VIEW 0.10 C A 0.10 C SIDE VIEW 0.10 8X b C A B 0.05 C 4X DETAIL A 6X C e SEATING PLANE DETAIL A 8X e/2 L 0.42 4 INCHES NOM 0.030 −−− 0.012 0.008 0.130 BSC 0.116 0.120 0.078 0.083 0.130 BSC 0.116 0.120 0.058 0.063 0.009 0.012 0.026 BSC 0.012 0.016 0.026 0.032 0.012 0.017 0.002 0.005 0.055 0.059 0_ −−− MIN 0.028 0.000 0.009 0.006 0.65 PITCH PACKAGE OUTLINE K MAX 0.031 0.002 0.016 0.010 0.124 0.088 0.124 0.068 0.016 0.020 0.037 0.022 0.008 0.063 12 _ 4X 0.66 M E3 8 G MILLIMETERS MIN NOM MAX 0.80 0.70 0.75 0.00 −−− 0.05 0.23 0.30 0.40 0.15 0.20 0.25 3.30 BSC 2.95 3.05 3.15 1.98 2.11 2.24 3.30 BSC 2.95 3.05 3.15 1.47 1.60 1.73 0.23 0.30 0.40 0.65 BSC 0.30 0.41 0.51 0.65 0.80 0.95 0.30 0.43 0.56 0.06 0.13 0.20 1.40 1.50 1.60 0_ −−− 12 _ SOLDERING FOOTPRINT* 1 E2 DIM A A1 b c D D1 D2 E E1 E2 E3 e G K L L1 M q 5 D2 BOTTOM VIEW 3.60 L1 0.75 2.30 0.57 0.47 2.37 3.46 DIMENSION: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. 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