OPA2348-HiRel www.ti.com SBOS482 – NOVEMBER 2009 1-MHz, 45-μA CMOS RAIL-TO-RAIL OPERATIONAL AMPLIFIER Check for Samples: OPA2348-HiRel FEATURES 1 • • • • • • • • • 0°C to 70°C Known Good Die Separated (Sawn) Die Mounted on Wafer Tape Controlled Baseline Low Quiescent Current (IQ): 45 μA (Typ) Low Cost Rail-to-Rail Input and Output Single Supply: 2.1 V to 5.5 V Input Bias Current: 0.5 pA (Typ) High Speed:Power With Bandwidth: 1 MHz APPLICATIONS • • • • • Portable Equipment Battery-Powered Equipment Smoke Alarms CO Detectors Medical Instrumentation DESCRIPTION The OPA2348 is a single-supply low-power CMOS operational amplifier. Featuring an extended bandwidth of 1 MHz and a supply current of 45 μA, the OPA2348 is useful for low-power applications on single supplies of 2.1 V to 5.5 V. Low supply current of 45 μA and an input bias current of 0.5 pA make the OPA2348 an optimal candidate for low-power high-impedance applications such as smoke detectors and other sensors. ORDERING INFORMATION (1) (1) (2) TA PACKAGE (2) ORDERABLE PART NUMBER TOP-SIDE MARKING 0°C to 70°C KGD OPA2348CKGD4 NA For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI web site at www.ti.com. Package drawings, thermal data, and symbolization are available at www.ti.com/packaging. 1 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2009, Texas Instruments Incorporated OPA2348-HiRel SBOS482 – NOVEMBER 2009 www.ti.com BARE DIE INFORMATION DIE THICKNESS BACKSIDE FINISH BACKSIDE POTENTIAL BOND PAD METALLIZATION COMPOSITION 10 mils. Silicon with backgrind V- Al-Si-Cu (0.5%) Origin a c b d Table 1. BOND PAD COORDINATES 2 DESCRIPTION PAD NUMBER a b c d V+ 1 965.6 5 1041.8 81.2 Out A 2 839.4 5 915.6 81.2 -In A 3 713.2 5 789.4 81.2 +In A 4 587 5 663.2 81.2 Out B 5 383.6 5 459.8 81.2 -In B 6 257.4 5 333.6 81.2 +In B 7 131.2 5 207.4 81.2 V- 8 5 5 81.2 81.2 Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated Product Folder Link(s): OPA2348-HiRel OPA2348-HiRel www.ti.com SBOS482 – NOVEMBER 2009 ½ 391.4 mm V+ ½ ½ Out A -In A Out B 1046.8 mm 60 mm ½ +In A -In B +In B ½ ½ V- 60 mm Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated Product Folder Link(s): OPA2348-HiRel 3 OPA2348-HiRel SBOS482 – NOVEMBER 2009 www.ti.com This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. ABSOLUTE MAXIMUM RATINGS (1) over operating free-air temperature range (unless otherwise noted) VS Supply voltage, V– to V+ VIN Input voltage, signal input terminals (2) IIN Input current, signal input terminals (2) 7.5 V (V– – 0.5 V) to (V+ + 0.5 V) 10 mA Output short-circuit duration (3) Continuous θJA Thermal impedance, junction to free air (4) TA Operating free-air temperature 0°C to 70°C TSTG Storage temperature –0°C to 70°C TJ Operating virtual-junction temperature (1) (2) (3) (4) 97.1°C/W 70°C Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. Input terminals are diode-clamped to the power-supply rails. Input signals that can swing more than 0.5 V beyond the supply rails should be current-limited to 10 mA or less. Short-circuit to ground, one amplifier per package. The package thermal impedance is calculated in accordance with JESD 51-5. RECOMMENDED OPERATING CONDITIONS VS Supply voltage, V– to V+ TA Operating free-air temperature 4 Submit Documentation Feedback MIN MAX 2.1 5.5 UNIT V 0 70 °C Copyright © 2009, Texas Instruments Incorporated Product Folder Link(s): OPA2348-HiRel OPA2348-HiRel www.ti.com SBOS482 – NOVEMBER 2009 ELECTRICAL CHARACTERISTICS VS = 2.5 V to 5.5 V, RL = 100 kΩ connected to VS/2, VOUT = VS/2 (unless otherwise noted) PARAMETER TEST CONDITIONS VOS Input offset voltage VS = 5 V, VCM = (V–) + 0.8 V ΔVOS/ ΔT Offset voltage drift over temperature PSRR Offset voltage drift vs power supply Offset voltage channel separation VS = 2.5 V to 5.5 V, VCM < (V+) – 1.7 V TA (1) MIN 25°C TYP MAX 1 5 Full range UNIT mV 6 Full range 4 25°C 60 Full range μV/°C 175 μV/V 300 dc 25°C 0.2 μV/V f = 1 kHz 25°C 134 dB VCM Input common-mode voltage range CMRR Input common-mode rejection ratio IB Input bias current 25°C ±0.5 ±10 pA IOS Input offset current 25°C ±0.5 ±10 pA (V–) – 0.2 V < VCM < (V+) – 1.7 V (V–) – 0.2 25°C 70 Full range 66 25°C 60 Full range 56 VS = 5.5 V, (V–) – 0.2 V < VCM < (V+) + 0.2 V VS = 5.5 V, (V–) < VCM < (V+) 25°C Input impedance V 82 dB 71 1013||3 Differential ZI (V+) + 0.2 25°C Ω||pF 1013||3 Common-mode Input voltage noise VCM < (V+) – 1.7 V, f = 0.1 Hz to 10 Hz 25°C 10 μVPP Vn Input voltage noise density VCM < (V+) – 1.7 V, f = 1 kHz 25°C 35 nV/√Hz In Input current noise density VCM < (V+) – 1.7 V, f = 1 kHz 25°C 4 fA/√Hz VS = 5 V, RL = 100 kΩ, 0.025 V < VO < 4.975 V AOL Open-loop voltage gain VS = 5V, RL = 5 kΩ, 0.125 V < VO < 4.875 V RL = 100 kΩ, AOL > 94 dB Voltage output swing from rail RL = 5 kΩ, AOL > 90 dB 25°C 94 Full range 90 25°C 90 Full range 88 25°C 25°C CLOAD Capacitive load drive See Typical Characteristics 25°C GBW Gain-bandwidth product CL = 100 pF SR Slew rate CL = 100 pF, G = +1 ts 25 100 125 25 25°C mV 125 ±10 mA 25°C 1 MHz 25°C 0.5 V/μs 5 μs CL = 100 pF, VS = 5.5 V, 2V- step, G = +1 25°C Overload recovery time VIN × Gain > VS 25°C 1.6 μs THD+N Total harmonic distortion plus noise CL = 100 pF, VS = 5.5 V, VO = 3 VPP, G = +1, f = 1 kHz 25°C 0.0023 % IQ Quiescent current Per amplifier 25°C 45 (1) Settling time 18 Full range Output short-circuit current dB 98 Full range ISC 0.1% 108 0.01% Full range 7 65 75 μA Full range TA = 0°C to 70°C Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated Product Folder Link(s): OPA2348-HiRel 5 OPA2348-HiRel SBOS482 – NOVEMBER 2009 www.ti.com TYPICAL CHARACTERISTICS TA = 25°C, RL = 100 kΩ connected to VS/2, VOUT = VS/2 (unless otherwise noted) OPEN-LOOP GAIN AND PHASE vs FREQUENCY PSRR AND CMRR vs FREQUENCY 140 100 0 80 –45 80 Gain 60 Phase –90 40 20 –135 PSRR, CMRR (dB) 100 Phase (°) Open-Loop Gain (dB) 120 CMRR 60 40 PSRR 20 0 –20 0.1 1 10 100 1k 10k 100k 1M 0 –180 10M 100 10 1k Frequency (Hz) MAXIMUM OUTPUT VOLTAGE vs FREQUENCY 6 10k 100k 1M 10M Frequency (Hz) CHANNEL SEPARATION vs FREQUENCY 140 VS = 5.5V Channel Separation (dB) Output Voltage (Vp-p) 5 VS = 5V 4 3 2 VS = 2.5V 1 120 100 80 60 0 1k 10k 100k 1M 100 10 10M 1k QUIESCENT AND SHORT-CIRCUIT CURRENT vs SUPPLY VOLTAGE 45 7 IQ 35 4 Output Voltage Swing (V) 10 Short-Circuit Current (mA) 55 +125°C +25°C 1.5 –40°C 1 Sourcing Current 0.5 0 –0.5 –1 Sinking Current –1.5 –40°C +25°C –2 25 1 3 3.5 4 4.5 5 5.5 +125°C –2.5 0 5 10 15 20 Output Current (mA) Supply Voltage (V) 6 10M VS = ±2.5V 2 ISC 2.5 1M 2.5 13 2 100k OUTPUT VOLTAGE SWING vs OUTPUT CURRENT 65 Quiescent Current (µA) 10k Frequency (Hz) Frequency (Hz) Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated Product Folder Link(s): OPA2348-HiRel OPA2348-HiRel www.ti.com SBOS482 – NOVEMBER 2009 TYPICAL CHARACTERISTICS (continued) TA = 25°C, RL = 100 kΩ connected to VS/2, VOUT = VS/2 (unless otherwise noted) OPEN-LOOP GAIN AND PSRR vs TEMPERATURE COMMON-MODE REJECTION vs TEMPERATURE 130 100 Open-Loop Gain and Power Supply Rejection (dB) Common-Mode Rejection (dB) AOL, RL = 100kΩ 90 V– < V CM < (V+) – 1.7V 80 V– < V CM < V+ 70 60 120 AOL, RL = 5kΩ 110 100 90 80 PSRR 70 60 50 –75 –50 –25 0 25 50 75 100 125 –50 –75 150 –25 0 QUIESCENT AND SHORT-CIRCUIT CURRENT vs TEMPERATURE 75 55 12 45 10 IQ 35 8 25 6 15 Input Bias Current (pA) 14 ISC 4 –25 0 25 50 75 100 125 100 125 150 1k 100 10 1 0.1 150 –75 –50 –25 0 25 50 75 100 Temperature (°C) Temperature (°C) OFFSET VOLTAGE PRODUCTION DISTRIBUTION OFFSET VOLTAGE DRIFT MAGNITUDE PRODUCTION DISTRIBUTION 125 150 25 20 16 Percentage of Amplifiers (%) Typical production distribution of packaged units. 18 Percent of Amplifiers (%) 75 10k Short-Circuit Current (mA) Quiescent Current (µA) 65 –50 50 INPUT BIAS (IB) CURRENT vs TEMPERATURE 16 –75 25 Temperature (°C) Temperature (°C) 14 12 10 8 6 4 Typical production distribution of packaged units. 20 15 10 5 2 0 0 –6 –5 –4 –3 –2 –1 0 1 2 3 4 5 6 1 Offset Voltage (mV) 2 3 4 5 6 7 8 9 10 11 12 Offset Voltage Drift (µV/°C) Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated Product Folder Link(s): OPA2348-HiRel 7 OPA2348-HiRel SBOS482 – NOVEMBER 2009 www.ti.com TYPICAL CHARACTERISTICS (continued) TA = 25°C, RL = 100 kΩ connected to VS/2, VOUT = VS/2 (unless otherwise noted) SMALL-SIGNAL OVERSHOOT vs LOAD CAPACITANCE PERCENT OVERSHOOT vs LOAD CAPACITANCE 60 60 50 40 40 Overshoot (%) Small-Signal Overshoot (%) G = –1V/V, R FB = 100kW 50 30 G = +1V/V, R L = 100kW 20 30 20 G = ±5V/V, R FB = 100kW G = –1V/V, R FB = 5kW 10 10 0 0 10 100 1k 10k 10 100 LARGE-SIGNAL STEP RESPONSE G = +1V/V, R L = 100kW, CL = 100pF 20mV/div 500mV/div SMALL-SIGNAL STEP RESPONSE G = +1V/V, R L = 100kW, CL = 100pF 10µs/div TOTAL HARMONIC DISTORTION + NOISE vs FREQUENCY INPUT CURRENT AND VOLTAGE NOISE SPECTRAL DENSITY vs FREQUENCY 1.000 1k 100 IN VN 100 10 1 10 1 10 100 1k 10k 100k Total Harmonic Distortion + Noise (%) 1k Current Noise (fA√Hz) 10k Voltage Noise (nV/√Hz) 10k Load Capacitance (pF) 2µs/div 0.100 0.010 0.001 10 100 1k 10k 100k Frequency (Hz) Frequency (Hz) 8 1k Load Capacitance (pF) Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated Product Folder Link(s): OPA2348-HiRel OPA2348-HiRel www.ti.com SBOS482 – NOVEMBER 2009 APPLICATION INFORMATION OPA2348 op amps are unity-gain stable and suitable for a wide range of general-purpose applications. The OPA2348 features wide bandwidth and unity-gain stability with rail-to-rail input and output for increased dynamic range. Figure 1 shows the input and output waveforms for the OPA2348 in unity-gain configuration. Operation is from a single 5-V supply with a 100-kΩ load connected to VS/2. The input is a 5-VPP sinusoid. Output voltage is approximately 4.98 VPP. Power-supply pins should be bypassed with 0.01-μF ceramic capacitors. G = +1V/V, VS = +5V Output (Inverted on Scope) 1V/div 5V 0V 20µs/div Figure 1. Rail-to-Rail Input/Output Operating Voltage OPA2348 op amps are fully specified and tested from 2.5 V to 5.5 V. However, supply voltage may range from 2.1 V to 5.5 V. Parameters are tested over the specified supply range, a unique feature of the OPA2348. In addition, all temperature specifications apply from 0°C to 70°C. Most behavior remains virtually unchanged throughout the full operating voltage range. Parameters that vary significantly with operating voltages or temperature are shown in the Typical Characteristics. Common-Mode Voltage Range The input common-mode voltage range of the OPA2348 extends 200 mV beyond the supply rails. This is achieved with a complementary input stage—an N-channel input differential pair in parallel with a P-channel differential pair. The N-channel pair is active for input voltages close to the positive rail, typically (V+) – 1.2 V to 300 mV above the positive supply, while the P-channel pair is on for inputs from 300 mV below the negative supply to approximately (V+) – 1.4 V. There is a small transition region, typically (V+) – 1.4 V to (V+) – 1.2 V, in which both pairs are on. This 200-mV transition region, shown in Figure 2, can vary ±300 mV with process variation. Thus, the transition region (both stages on) can range from (V+) – 1.7 V to (V+) – 1.5 V on the low end, up to (V+) – 1.1 V to (V+) – 0.9 V on the high end. Within the 200-mV transition region, PSRR, CMRR, offset voltage, offset drift, and THD may be degraded compared to operation outside this region. Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated Product Folder Link(s): OPA2348-HiRel 9 OPA2348-HiRel SBOS482 – NOVEMBER 2009 www.ti.com OFFSET VOLTAGE vs FULL COMMON-MODE VOLTAGE RANGE 2 Offset Voltage (mV) 1.5 1 0.5 0 –0.5 –1 V– V+ –1.5 –2 –0.5 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5 Common-Mode Voltage (V) Figure 2. Behavior of Typical Transition Region at Room Temperature Rail-to-Rail Input The input common-mode range extends from (V–) – 0.2 V to (V+) + 0.2 V. For normal operation, inputs should be limited to this range. The absolute maximum input voltage is 500 mV beyond the supplies. Inputs greater than the input common-mode range but less than the maximum input voltage, while not valid, do not cause any damage to the op amp. Unlike some other op amps, if input current is limited the inputs may go beyond the power supplies without phase inversion, as shown in Figure 3. VIN G = +1V/V, V S = +5V 5V 1V/div VOUT 0V 10µs/div Figure 3. No Phase Inversion With Inputs Greater Than Power-Supply Voltage Normally, input currents are 0.5 pA. However, large inputs (greater than 500 mV beyond the supply rails) can cause excessive current to flow in or out of the input pins. Therefore, as well as keeping the input voltage below the maximum rating, it is also important to limit the input current to less than 10 mA. This is easily accomplished with an input voltage resistor, as shown in Figure 4. +5V IOVERLOAD 10mA max 1/2 OPA2348 VOUT VIN 5kW Figure 4. Input Current Protection for Voltages Exceeding the Supply Voltage 10 Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated Product Folder Link(s): OPA2348-HiRel OPA2348-HiRel www.ti.com SBOS482 – NOVEMBER 2009 Rail-to-Rail Output A class AB output stage with common-source transistors is used to achieve rail-to-rail output. This output stage is capable of driving 5-kΩ loads connected to any potential between V+ and ground. For light resistive loads (>100 kΩ), the output voltage can typically swing to within 18 mV from supply rail. With moderate resistive loads (10 kΩ to 50 kΩ), the output voltage can typically swing to within 100 mV of the supply rails while maintaining high open-loop gain (see the typical characteristic "Output Voltage Swing vs Output Current"). Capacitive Load and Stability The OPA2348 in a unity-gain configuration can directly drive up to 250-pF pure capacitive load. Increasing the gain enhances the amplifier’s ability to drive greater capacitive loads (see the typical characteristic "Small-Signal Overshoot vs Capacitive Load"). In unity-gain configurations, capacitive load drive can be improved by inserting a small (10 Ω to 20 Ω) resistor, RS, in series with the output, as shown in Figure 5. This significantly reduces ringing while maintaining dc performance for purely capacitive loads. However, if there is a resistive load in parallel with the capacitive load, a voltage divider is created, introducing a direct current (dc) error at the output and slightly reducing the output swing. The error introduced is proportional to the ratio RS/RL and is generally negligible. V+ RS 1/2 OPA2348 VOUT 10W to 20W VIN RL CL Figure 5. Series Resistor in Unity-Gain Buffer Configuration Improves Capacitive Load Drive In unity-gain inverter configuration, phase margin can be reduced by the reaction between the capacitance at the op amp input and the gain setting resistors, thus degrading capacitive load drive. Best performance is achieved by using small-valued resistors. For example, when driving a 500-pF load, reducing the resistor values from 100 kΩ to 5 kΩ decreases overshoot from 55% to 13% (see the typical characteristic "Small-Signal Overshoot vs. Load Capacitance"). However, when large valued resistors cannot be avoided, a small (4 pF to 6 pF) capacitor, CFB, can be inserted in the feedback, as shown in Figure 6. This significantly reduces overshoot by compensating the effect of capacitance, CIN, which includes the amplifier's input capacitance and PC board parasitic capacitance. CFB RF RI VIN 1/2 OPA2348 VOUT CIN CL Figure 6. Improving Capacitive Load Drive Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated Product Folder Link(s): OPA2348-HiRel 11 OPA2348-HiRel SBOS482 – NOVEMBER 2009 www.ti.com Driving Analog-to-Digital Converters (ADCs) The OPA2348 op amps are optimized for driving medium-speed sampling ADCs. The OPA2348 op amps buffer the ADC input capacitance and resulting charge injection while providing signal gain. Figure 7 shows the OPA2348 in a basic noninverting configuration driving the ADS7822. The ADS7822 is a 12-bit, micropower sampling converter in the MSOP-8 package. When used with the low-power miniature packages of the OPA348, the combination is ideal for space-limited, low-power applications. In this configuration, an RC network at the ADC input can be used to provide for anti-aliasing filter and charge injection current. +5V 0.1µF 0.1µF 1 VREF 8 V+ DCLOCK 500W 1/2 OPA2348 +In ADS7822 12-Bit A/D 2 VIN –In CS/SHDN 3 3300pF DOUT 7 6 Serial Interface 5 GND 4 VIN = 0 V to 5 V for 0-V to 5-V output. NOTE: A/D Input = 0 to V REF RC network filters high-frequency noise. Figure 7. Noninverting Configuration Driving ADS7822 The OPA2348 can also be used in noninverting configuration driving ADS7822 in limited low-power applications. In this configuration, an RC network at the ADC input can be used to provide for antialiasing filter and charge injection current. See Figure 7 for the OPA2348 driving an ADS7822 in a speech bandpass filtered data acquisition system. This small low-cost solution provides the necessary amplification and signal conditioning to interface directly with an electret microphone. This circuit operates with VS = 2.7 V to 5 V with less than 250-μA typical quiescent current. V+ = +2.7V to 5V Passband 300Hz to 3kHz R9 510kW R1 1.5kW R2 1MW R4 20kW C3 33pF C1 1000pF 1/2 OPA2348 Electret Microphone(1) R3 1MW R6 100kΩ R7 51kW R8 150kW VREF 1 8 V+ 7 C2 1000pF 1/2 OPA2348 +IN ADS7822 6 12-Bit A/D 5 2 –IN DCLOCK DOUT CS/SHDN Serial Interface 3 4 R5 20kW G = 100 GND (1) Electret microphone powered by R1. Figure 8. Speech Bandpass Filtered Data Acquisition System 12 Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated Product Folder Link(s): OPA2348-HiRel PACKAGE OPTION ADDENDUM www.ti.com 1-Dec-2009 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing OPA2348CKGD4 ACTIVE XCEPT KGD Pins Package Eco Plan (2) Qty 0 1 TBD Lead/Ball Finish Call TI MSL Peak Temp (3) Call TI (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 1 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed. TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. To minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in such safety-critical applications. TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions: Products Amplifiers Data Converters DLP® Products DSP Clocks and Timers Interface Logic Power Mgmt Microcontrollers RFID RF/IF and ZigBee® Solutions amplifier.ti.com dataconverter.ti.com www.dlp.com dsp.ti.com www.ti.com/clocks interface.ti.com logic.ti.com power.ti.com microcontroller.ti.com www.ti-rfid.com www.ti.com/lprf Applications Audio Automotive Broadband Digital Control Medical Military Optical Networking Security Telephony Video & Imaging Wireless www.ti.com/audio www.ti.com/automotive www.ti.com/broadband www.ti.com/digitalcontrol www.ti.com/medical www.ti.com/military www.ti.com/opticalnetwork www.ti.com/security www.ti.com/telephony www.ti.com/video www.ti.com/wireless Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2009, Texas Instruments Incorporated