DS36C279 www.ti.com SNLS098B – JULY 2000 – REVISED APRIL 2013 DS36C279 Low Power EIA-RS-485 Transceiver with Sleep Mode Check for Samples: DS36C279 FEATURES DESCRIPTION • The DS36C279 is a low power differential bus/line transceiver designed to meet the requirements of RS485 Standard for multipoint data transmission. In addition it is compatible with TIA/EIA-422-B. 1 • • • • • • • • • • • • (1) 100% RS-485 Compliant – Specified RS-485 Device Interoperation Low Power CMOS Design: ICC 500 μA Max Automatic Sensing Sleep Mode – Reduces ICC to 10 μA Maximum Built-in Power Up/Down Glitch-Free Circuitry – Permits Live Transceiver Intersection/Displacement SOIC Packages Industrial Temperature Range: −40°C to +85°C On-Board Thermal Shutdown Circuitry – Prevents Damage to the Device in the Event of Excessive Power Dissipation Wide Common Mode Range: −7V to +12V Receive Open Input Fail-Safe (1) ¼ Unit Load (DS36C279): ≥ 128 Nodes ½ Unit Load (DS36C279T): ≥ 64 Nodes ESD (Human Body Model): ≥ 2 kV Drop-In Replacement for: – LTC485 MAX485 DS75176 DS3695 Non-terminated, open input only The sleep mode feature automatically puts the device in a power saving mode when both the driver and receiver are disabled. (2) The device is ideal for use in power conscious applications where the device may be disabled for extended periods of time. The driver and receiver outputs feature TRI-STATE capability. The driver outputs operate over the entire common mode range of −7V to +12V. Bus contention or fault situations that cause excessive power dissipation within the device are handled by a thermal shutdown circuit, which forces the driver outputs into a high impedance state. The receiver incorporates a fail safe circuit which ensures a high output state when the inputs are left open. (3) The DS36C279T is fully specified over the industrial temperature range (−40°C to +85°C). (2) (3) Device enters sleep mode if enable conditions are held > 600 ns Non-terminated, open input only Connection and Logic Diagram Figure 1. See Package Number D 1 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2000–2013, Texas Instruments Incorporated DS36C279 SNLS098B – JULY 2000 – REVISED APRIL 2013 www.ti.com TRUTH TABLE DRIVER SECTION RE* DE DI DO/RI X H H H DO*/RI* L X H L L H X L X Z Z RECEIVER SECTION RE* DE RI-RI* RO L L ≥+0.2V H L L ≤−0.2V H L X L L (1) (2) OPEN L Z (2) (1) H Device enters sleep mode if enable conditions are held > 600 ns Non-terminated, open input only These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. ABSOLUTE MAXIMUM RATINGS (1) (2) Supply Voltage (VCC) +12V −0.5V to (VCC +0.5V) Input Voltage (DE, RE*, & DI) Common Mode (VCM) Driver Output/Receiver Input ±15V Input Voltage (DO/RI, DO*/RI*) ±14V −0.5V to (VCC +0.5V) Receiver Output Voltage Maximum Package Power Dissipation @ +25°C D Package 1190 mW, derate 9.5 mW/°C above +25°C −65°C to +150°C Storage Temperature Range Lead Temperature (1) (2) (Soldering 4 sec) +260°C Absolute Maximum Ratings are those values beyond which the safety of the device cannot be ensured. They are not meant to imply that the devices should be operated at these limits. The table of Electrical Characteristics specifies conditions of device operation. If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and specifications. RECOMMENDED OPERATING CONDITIONS Supply Voltage (VCC) Typ Max Units +5.0 +5.25 V +12 V −7 Bus Voltage Operating Free Air Temperature (TA) Min +4.75 DS36C279T −40 +25 +85 °C 0 +25 +70 °C DS36C279 2 Submit Documentation Feedback Copyright © 2000–2013, Texas Instruments Incorporated Product Folder Links: DS36C279 DS36C279 www.ti.com SNLS098B – JULY 2000 – REVISED APRIL 2013 ELECTRICAL CHARACTERISTICS (1) (2) Over Supply Voltage and Operating Temperature ranges, unless otherwise specified Symbol Parameter Conditions Reference Min (422) (485) Typ Max Unit s 1.5 5.0 V 0 5.0 V 5.0 V DIFFERENTIAL DRIVER CHARACTERISTICS VOD1 Differential Output Voltage IO = 0 mA (No Load) VOD0 Output Voltage VOD0* Output Voltage IO = 0 mA (Output to GND) VOD2 Differential Output Voltage (Termination Load) 0 RL = 50Ω (422) RL = 27Ω (485) (3) See Figure 2 2.0 2.8 1.5 2.3 5.0 V V (422, 485) −0.2 0.1 +0.2 V 1.5 2.0 5.0 V 0 3.0 V 0 3.0 V −0.2 +0.2 V ΔVOD2 Balance of VOD2 |VOD2 − VOD2*| RL = 27Ω or 50Ω See VOD3 Differential Output Voltage (Full Load) R1 = 54Ω, R2 = 375Ω VTEST = −7V to +12V See Figure 3 VOC Driver Common Mode Output Voltage RL = 27Ω (485) RL = 50Ω (422) ΔVOC Balance of VOC |VOC − VOC*| RL = 27Ω or RL = 50Ω See (3) (422, 485) IOSD Driver Output Short-Circuit Current VO = +12V (485) See Figure 5 200 +250 mA VO = −7V (485) −190 −250 mA +0.035 +0.2 V See Figure 2 RECEIVER CHARACTERISTICS Differential Input High Threshold Voltage VO = VOH, IO = −0.4 mA −7V ≤ VCM ≤ +12V VTL Differential Input Low Threshold Voltage VO = VOL, IO = 0.4 mA −7V ≤ VCM ≤ +12V VHST Hysteresis VCM = 0V RIN Input Resistance −7V ≤ VCM ≤ +12V VTH IIN Line Input Current See (6) IING Line Input Current Glitch See (6) −0.035 V 70 mV DS36C279T 24 68 kΩ DS36C279 48 68 kΩ DS36C279 VIN = +12V 0 0.19 0.25 mA VIN = −7V 0 −0.1 −0.2 mA DS36C279T VIN = +12V 0 0.19 0.5 mA VIN = −7V 0 −0.1 −0.4 mA Other Input = 0V, DE = VIL, RE* = VIL, DS36C279 VIN = +12V 0 0.19 0.25 mA VIN = −7V 0 −0.1 −0.2 mA VCC = +3.0V or 0V, TA = 25°C DS36C279T VIN = +12V 0 0.19 0.5 mA VIN = −7V 0 −0.1 −0.4 mA ±400 mV Input Balance Test RS = 500Ω VOH High Level Output Voltage IOH = −4 mA, VID = +0.2V VOL Low Level Output Voltage IOL = +4 mA, VID = −0.2V IOSR Short Circuit Current VO = GND IOZR TRI-STATE Leakage Current VO = 0.4V to 2.4V (2) (3) (4) (5) (6) (7) −0.2 See (5) Other Input = 0V, DE = VIL, RE* = VIL, VCC = 4.75 to 5.25 or 0V IB (1) See (4) (422, 485) (422) See (7) RO See Figure 12 3.5 RO 7 4.6 V 0.3 0.5 V 35 85 mA ±1 μA Current into device pins is defined as positive. Current out of device pins is defined as negative. All voltages are referenced to ground except VOD1 and VOD2. All typicals are given for: VCC = +5.0V, TA = + 25°C. Delta |VOD2| and Delta |V OC| are changes in magnitude of VOD2 and VOC , respectively, that occur when input changes state. Threshold parameter limits specified as an algebraic value rather than by magnitude. Hysteresis defined as VHST = VTH − VTL. IIN includes the receiver input current and driver TRI-STATE leakage current. For complete details of test, see RS-485. Submit Documentation Feedback Copyright © 2000–2013, Texas Instruments Incorporated Product Folder Links: DS36C279 3 DS36C279 SNLS098B – JULY 2000 – REVISED APRIL 2013 www.ti.com ELECTRICAL CHARACTERISTICS(1)(2) (continued) Over Supply Voltage and Operating Temperature ranges, unless otherwise specified Symbol Parameter Conditions Reference Min Typ Max Unit s 2.0 VCC V GND 0.8 V DEVICE CHARACTERISTICS VIH High Level Input Voltage VIL Low Level Input Voltage DE, RE*, DI IIH High Level Input Current VIH = VCC IIL Low Level Input Current VCC = 5V VIL = 0V VCC = +3.0V ICC ICCR Power Supply Current (No Load) μA μA −2 μA Driver and Receiver ON 200 500 μA Driver OFF, Receiver ON 200 500 μA 200 500 μA 0.2 10 μA ICCD Driver ON, Receiver OFF ICCX Sleep Mode 4 2 −2 Submit Documentation Feedback VCC Copyright © 2000–2013, Texas Instruments Incorporated Product Folder Links: DS36C279 DS36C279 www.ti.com SNLS098B – JULY 2000 – REVISED APRIL 2013 SWITCHING CHARACTERISTICS (1) (2) Over Supply Voltage and Operating Temperature ranges, unless otherwise specified Symbol Parameter Conditions Reference Min Typ Max Units 10 39 80 ns 10 40 80 ns 0 1 10 ns 3 25 50 ns 3 DRIVER CHARACTERISTICS tPHLD Differential Propagation Delay High to Low RL = 54Ω, CL = 100 pF tPLHD Differential Propagation Delay Low to High tSKD Differential Skew |tPHLD − tPLHD| tr Rise Time tf Fall Time tPHZ Disable Time High to Z tPLZ Disable Time Low to Z tPZH Enable Time Z to High tPZL Enable Time Z to Low tPSH Driver Enable from Sleep Mode to Output High CL = 100 pF See (3) See Figure 8 and Figure 9 tPSL Driver Enble from Sleep Mode to Output Low CL = 100 pF See (3) See Figure 10 and Figure 11 See Figure 6 and Figure 7 CL = 15 pF RE* = L CL = 100 pF RE* = L 25 50 ns See Figure 8 and Figure 9 80 200 ns See Figure 10 and Figure 11 80 200 ns See Figure 8 and Figure 9 50 200 ns See Figure 10 and Figure 11 65 200 ns 70 98 250 ns 70 98 250 ns 30 210 400 ns 30 190 400 ns 0 20 50 ns 50 150 ns 55 150 ns 40 150 ns 45 150 ns RECEIVER CHARACTERISTICS tPHL Propagation Delay High to Low tPLH Propagation Delay Low to High tSK Skew, |tPHL − tPLH| tPLZ Output Disable Time CL = 15 pF See Figure 13 and Figure 14 CL = 15 pF DE = H See Figure 15, Figure 16 and Figure 17 tPHZ tPZL Output Enable Time tPZH tPSH Receiver Enable from Sleep Mode to Output High CL = 15 pF See (3) See Figure 15 and Figure 17 70 97 250 ns tPSL Receiver Enable from Sleep Mode to Output Low CL = 15 pF See (3) See Figure 15 and Figure 16 70 95 250 ns (1) (2) (3) All typicals are given for: VCC = +5.0V, TA = + 25°C. CL includes probe and jig capacitance. For enable from sleep mode delays DE = L and RE* = H for greater than 600 ns prior to test (device is in sleep mode). Submit Documentation Feedback Copyright © 2000–2013, Texas Instruments Incorporated Product Folder Links: DS36C279 5 DS36C279 SNLS098B – JULY 2000 – REVISED APRIL 2013 www.ti.com PARAMETER MEASUREMENT INFORMATION Figure 2. Driver VOD2 and VOC Figure 3. Driver VOD3 Vtest = −7V to +12V Figure 4. Driver VOH and VOL Figure 5. Driver IOSD Figure 6. Driver Differential Propagation Delay Test Circuit Figure 7. Driver Differential Propagation Delays and Differential Rise and Fall Times 6 Submit Documentation Feedback Copyright © 2000–2013, Texas Instruments Incorporated Product Folder Links: DS36C279 DS36C279 www.ti.com SNLS098B – JULY 2000 – REVISED APRIL 2013 Figure 8. TRI-STATE and Sleep Mode Test Circuit (tPZH, (tPSH), tPHZ) Figure 9. TRI-STATE and Sleep Mode Waveforms (tPZH, (tPSH), tPHZ) Figure 10. TRI-STATE and Sleep Mode Test Circuit (tPZL, (tPSL), tPLZ) Figure 11. TRI-STATE and Sleep Mode Waveforms (tPZL, (tPSL), tPLZ) Figure 12. Receiver VOH and VOL Figure 13. Receiver Differential Propagation Delay Test Circuit Submit Documentation Feedback Copyright © 2000–2013, Texas Instruments Incorporated Product Folder Links: DS36C279 7 DS36C279 SNLS098B – JULY 2000 – REVISED APRIL 2013 www.ti.com Figure 14. Receiver Differential Propagation Delay Waveforms Figure 15. Receiver TRI-STATE and Sleep Mode Test Circuit Figure 16. Receiver Enable and Disable Waveforms (tPLZ, tPZL, (tPSL)) 8 Submit Documentation Feedback Copyright © 2000–2013, Texas Instruments Incorporated Product Folder Links: DS36C279 DS36C279 www.ti.com SNLS098B – JULY 2000 – REVISED APRIL 2013 Figure 17. Receiver Enable and Disable Waveforms (tPHZ, tPZH, (tPSH)) Figure 18. Entering Sleep Mode Conditions Submit Documentation Feedback Copyright © 2000–2013, Texas Instruments Incorporated Product Folder Links: DS36C279 9 DS36C279 SNLS098B – JULY 2000 – REVISED APRIL 2013 www.ti.com TYPICAL APPLICATION INFORMATION Figure 19. Typical RS-485 Bus Interface Table 1. DEVICE PIN DESCRIPTIONS Pin No. Name Description 1 RO Receiver Output: When RE (Receiver Enable) is LOW, the receiver is enabled (ON), if DO/RI ≥ DO*/RI* by 200 mV, RO will be HIGH. If DO/RI ≤ DO*/RI* by 200 mV, RO will be LOW. Additionally RO will be HIGH for OPEN (Nonterminated) Inputs. 2 RE* Receiver Output Enable: When RE* is LOW the receiver output is enabled. When RE* is HIGH, the receiver output is in TRI-STATE (OFF). When RE* is HIGH and DE is LOW, the device will enter a low-current sleep mode after 600 ns. 3 DE Driver Output Enable: When DE is HIGH, the driver outputs are enabled. When DE is LOW, the driver outputs are in TRI-STATE (OFF). When RE* is HIGH and DE is LOW, the device will enter a low-current sleep mode after 600 ns. 4 DI Driver Input: When DE (Driver Enable) is HIGH, the driver is enabled, if DI is LOW, then DO/RI will be LOW and DO*/RI* will be HIGH. If DI is HIGH, then DO/RI is HIGH and DO*/RI* is LOW. 5 GND Ground Connection. 6 DO/RI Driver Output/Receiver Input, 485 Bus Pin. 7 DO*/RI* Driver Output/Receiver Input, 485 Bus Pin. 8 VCC Positive Power Supply Connection: Recommended operating range for VCC is +4.75V to +5.25V. UNIT LOAD A unit load for an RS-485 receiver is defined by the input current versus the input voltage curve. The gray shaded region is the defined operating range from −7V to +12V. The top border extending from −3V at 0 mA to +12V at +1 mA is defined as one unit load. Likewise, the bottom border extending from +5V at 0 mA to −7V at −0.8 mA is also defined as one unit load (see Figure 20). An RS-485 driver is capable of driving up to 32 unit loads. This allows up to 32 nodes on a single bus. Although sufficient for many applications, it is sometimes desirable to have even more nodes. For example, an aircraft that has 32 rows with 4 seats per row would benefit from having 128 nodes on one bus. This would allow signals to be transferred to and from each individual seat to 1 main station. Usually there is one or two less seats in the last row of the aircraft near the restrooms and food storage area. This frees the node for the main station. The DS36C278, the DS36C279, and the DS36C280 all have ½ unit load and ¼ unit load (UL) options available. These devices will allow up to 64 nodes or 128 nodes specified over temperature depending upon which option is selected. The ½ UL option is available in industrial temperature and the ¼ UL is available in commercial temperature. First, for a ½ UL device the top and bottom borders shown in Figure 20 are scaled. Both 0 mA reference points at +5V and −3V stay the same. The other reference points are +12V at +0.5 mA for the top border and −7V at −0.4 mA for the bottom border (see Figure 20). Second, for a ¼ UL device the top and bottom borders shown in Figure 20 are scaled also. Again, both 0 mA reference points at +5V and −3V stay the same. The other reference points are +12V at +0.25 mA for the top border and −7V at −0.2 mA for the bottom border (see Figure 20). 10 Submit Documentation Feedback Copyright © 2000–2013, Texas Instruments Incorporated Product Folder Links: DS36C279 DS36C279 www.ti.com SNLS098B – JULY 2000 – REVISED APRIL 2013 The advantage of the ½ UL and ¼ UL devices is the increased number of nodes on one bus. In a single master multi-slave type of application where the number of slaves exceeds 32, the DS36C278/279/280 may save in the cost of extra devices like repeaters, extra media like cable, and/or extra components like resistors. Figure 20. Input Current vs Input Voltage Operating Range The DS36C279 and DS36C280 have an additional feature which offers more advantages. The DS36C279 has an automatic sleep mode function for power conscious applications. The DS36C280 has a slew rate control for EMI conscious applications. Refer to the sleep mode and slew rate control portion of the application information section in the corresponding datasheet for more information on these features. SLEEP MODE The DS36C279 features an automatic shutdown mode that allows the device to save power when not transmitting data. Since the shutdown mode is automatic, no external components are required. It may be used as little or as much as the application requires. The more the feature is utilized, the more power it saves. The sleep mode is automatically entered when both the driver and receiver are disabled. This occurs when both the DE pin is asserted to a logic low and the RE* pin is asserted to a logic high. Once both pins are asserted the device will enter sleep mode typically in 50 ns. The DS36C279 is ensured to go into sleep mode within 600 ns after both pins are asserted. The device wakes up (comes out of sleep mode) when either the DE pin is asserted to a logic high and/or the RE* pin is asserted to a logic low. After the device enters sleep mode it will take longer for the device to wake up than it does for the device to enable from TRI-STATE. Refer to data specifications tPSL and tPSH and compare with tPZL and tPZH for timing differences. The benefit of the DS36C279 is definitely its power savings. When active the device has a maximum ICC of 500 μA. When in sleep mode the device has a maximum ICC of only 10 μA, which is 50 times less power than when active. The ICC when the device is active is already very low but when in sleep mode the ICC is ultra low. Submit Documentation Feedback Copyright © 2000–2013, Texas Instruments Incorporated Product Folder Links: DS36C279 11 DS36C279 SNLS098B – JULY 2000 – REVISED APRIL 2013 www.ti.com REVISION HISTORY Changes from Revision A (April 2013) to Revision B • 12 Page Changed layout of National Data Sheet to TI format .......................................................................................................... 11 Submit Documentation Feedback Copyright © 2000–2013, Texas Instruments Incorporated Product Folder Links: DS36C279 PACKAGE OPTION ADDENDUM www.ti.com 12-Jul-2014 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) DS36C279M/NOPB ACTIVE SOIC D 8 95 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 36C27 9M DS36C279MX/NOPB ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 36C27 9M (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. 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Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 11-Oct-2013 TAPE AND REEL INFORMATION *All dimensions are nominal Device DS36C279MX/NOPB Package Package Pins Type Drawing SOIC D 8 SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) 2500 330.0 12.4 Pack Materials-Page 1 6.5 B0 (mm) K0 (mm) P1 (mm) 5.4 2.0 8.0 W Pin1 (mm) Quadrant 12.0 Q1 PACKAGE MATERIALS INFORMATION www.ti.com 11-Oct-2013 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) DS36C279MX/NOPB SOIC D 8 2500 367.0 367.0 35.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. 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