MSDP50 Glass Passivated Three Phase Bridge Rectifiers VRRM 800 to 1600V IFAV 50Amp + Features y High thermal conductivity packge,electrically insulated case y Glass passivated chips y High IFSM y Epoxy compound has classification UL94V-0 - Applications y Big power supplier y Field supply for DC motor Circuit ~ ~ ~ Module Type TYPE MSDP50-08 MSDP50-12 MSDP50-16 Maximum Ratings Symbol Item Average forward current IF(AV) Forward surge current, max. IFSM 2 Value for fusing it Visol VRRM VRSM 800V 1200V 1600V 900V 1300V 1700V Conditions Values Tc=50℃ t=10mS Tvj =45℃ Isolation Breakdown Voltage(R.M.S) a.c.50HZ;r.m.s.;1min Units 50 A 500 A 1250 A2s 2500 V Operating Junction Temperature -40 to +150 ℃ Tstg Storage Temperature -40 to +150 Weight Approximate Weight 20 ℃ g Values Units 0.65 ℃/W Tvj Thermal Characteristics Symbol Item Rth(j-c) Thermal Impedance, max. Conditions Junction to Case Electrical Characteristics Symbol Item Conditions VFM Forward Voltage Drop, max. T=25℃ IF=25A IRRM Repetitive Peak Reverse Current, max. Tvj =25℃ VRD=VRRM Tvj =150℃ VRD=VRRM Document Number: MSDP50 Jan.28, 2011 Values Min. Typ. 1.00 Max. 1.20 5 3 Units V µA mA www.smsemi.com 1 MSDP50 Performance Curves 100 A 50 A 80 40 60 30 typ. 40 20 20 10 IF ID 0 0 0 Tc 50 0 ℃ 150 100 Fig1.Forward Current Derating Curve VF 0.5 1.0 1.5 V 2.0 Fig2. Forward Characteristics 1000 A 1.0 ℃/ W 50HZ Zth(j-C) 0.5 500 0 0 0.001 0.01 0.1 1 10 S 100 1 cycles 100 Fig4. Max Non-Repetitive Forward Surge Current Fig3. Transient thermal impedance Document Number: MSDP50 Jan.28, 2011 10 www.smsemi.com 2 MSDP50 Package Outline Information CASE：P1 Dimensions in mm Document Number: MSDP50 Jan.28, 2011 www.smsemi.com 3