Through Hole Lamp Product Data Sheet LTL-1CHYE-071A Spec No.: DS-20-97-0164 Effective Date: 09/01/2006 Revision: B LITE-ON DCC RELEASE BNS-OD-FC001/A4 LITE-ON Technology Corp. / Optoelectronics No.90,Chien 1 Road, Chung Ho, New Taipei City 23585, Taiwan, R.O.C. Tel: 886-2-2222-6181 Fax: 886-2-2221-1948 / 886-2-2221-0660 http://www.liteon.com/opto LITE-ON TECHNOLOGY CORPORATION Property of Lite-On Only Features * Lead (Pb) free product – RoHS compliant. * Low power consumption. * High efficiency. * Versatile mounting on P.C. board or panel. * I.C. compatible/low current requirement. * 3.1 mm diameter package Package Dimensions Part No. Lens Source Color LTL-1CHYE-071A Yellow Transparent Yellow NOTES: 1. All dimensions are in millimeters (inches). 2. Tolerance is ±0.25mm(.010") unless otherwise noted. 3. Protruded resin under flange is 1.0mm(.04") max. 4. Lead spacing is measured where the leads emerge from the package. 5. Specifications are subject to change without notice Part No. : LTL-1CHYE-071A BNS-OD-C131/A4 Page : 1 of 11 LITE-ON TECHNOLOGY CORPORATION Property of Lite-On Only o Absolute Maximum Ratings at TA=25 C Parameter Power Dissipation Peak Forward Current (1/10 Duty Cycle, 0.1ms Pulse Width) DC Forward Current o Derating Linear From 50℃ 30 C Reverse Voltage Maximum Rating Unit 60 120 mW 60 100 mA 20 30 mA 0.25 0.5 o mA/℃ mA/ C 5 V Note A Operating Temperature Range Electrostatic Discharge Threshold(HBM) -55℃ to + 100℃ 1000 Storage Temperature Range Operating Temperature Range -55℃ -20 C to to ++ 100℃ 80 C o o o Lead Soldering Temperature Storage Temperature Range [1.6mm(.063") From Body] Lead Soldering Temperature V o -30 C to + 100 C 260℃ for 5 Seconds 260℃ for 5 Seconds [1.6mm(.063") From Body] Note A : Product resistance to electrostatic discharge (ESD) according to the HBM is measured by simulating ESD using a rapid avalanche test (RAET). The RAET procedures are designed to approximate the maximum ESD ratings shown. The RAET procedure is performed on each die. The ESD classification of Class II is based on sample testing according to MIL-STD 883E. (From CREE official DS). Part ( FOR AVIX ) Part No. No. :: LTL3H3CGDS8-132A LTL-1CHYE-071A BNS-OD-C131/A4 BNS-OD-C131/A4 Page Page :: o 22 of of 11 11 LITE-ON TECHNOLOGY CORPORATION Property of Lite-On Only o Electrical / Optical Characteristics at TA=25 C Parameter Symbol Min. Typ. IV 12.6 40 mcd 2θ1/2 45 deg Peak Emission Wavelength λP 585 nm Dominant Wavelength λd Spectral Line Half-Width Δλ 35 Forward Voltage VF 2.1 Reverse Current IR Capacitance C Luminous Intensity Viewing Angle 585 590 Max. 595 Unit nm Test Condition IF = 10mA Note 1,4 Note 2 (Fig.6) Measurement @Peak (Fig.1) Note 3 nm 2.6 V 100 μA 15 pF IF = 20mA VR = 5V VF = 0 , f = 1MHz Note: 1. Luminous intensity is measured with a light sensor and filter combination that approximates the CIE (Commission International De L'Eclairage) eye-response curve. 2. θ1/2 is the off-axis angle at which the luminous intensity is half the axial luminous intensity. 3. The dominant wavelength, λd is derived from the CIE chromaticity diagram and represents the single wavelength which defines the color of the device. 4. The Iv guarantee should be added ±15% . Part No. : LTL-1CHYE-071A BNS-OD-C131/A4 Page : 3 of 11 LITE-ON TECHNOLOGY CORPORATION Property of Lite-On Only Typical Electrical / Optical Characteristics Curves o (25 C Ambient Temperature Unless Otherwise Noted) Part No. : LTL-1CHYE-071A BNS-OD-C131/A4 Page : 4 of 11 LITE-ON TECHNOLOGY CORPORATION Property of Lite-On Only Features * Compatible with radial lead automatic insertion equipment. * Most radial lead plastic lead lamps available packaged in tape and folding. * 5mm (0.197") formed lead and 2.54mm (0.1") straight lead spacing available. * Folding packaging simplifies handling and testing. Package Dimensions Specification Item Symbol Minimum Maximum mm inch mm inch Tape Feed Hole Diameter D 3.8 0.149 4.2 0.165 Component Lead Pitch F 4.8 0.188 5.8 0.228 Front to Rear Deflection △H -- -- 2.0 0.078 Height of Seating Plane H 15.5 0.610 16.5 0.649 Feed Hole to Bottom of Component H1 18.5 0.728 20.5 0.807 Feed Hole to Overall Component Height H2 23.5 0.925 26.0 1.024 11.0 0.433 Lead Length After Component Height L Feed Hole Pitch P 12.4 0.488 13.0 0.511 Lead Location P1 3.15 0.124 4.55 0.179 Center of Component Location P2 5.05 0.198 7.65 0.301 Total Taped Thickness T -- -- 0.90 0.035 Feed Hole Location W0 8.5 0.334 9.75 0.384 Adhesive Tape Width W1 14.5 0.571 15.5 0.610 Adhesive Tape Position W2 0 0 3.0 0.118 Tape Width W3 17.5 0.689 19.0 0.748 Part No. : LTL-1CHYE-071A BNS-OD-C131/A4 W0 Page : 5 of 7 LITE-ON TECHNOLOGY CORPORATION Property of Lite-On Only Packing Spec 3000 pcs per inner carton 10 Inner cartons per outer carton total 30000 pcs per outer carton In every shipping lot, only the last pack will be non-full packing Part No. : LTL-1CHYE-071A BNS-OD-C131/A4 Page : 6 of 11 LITE-ON TECHNOLOGY CORPORATION Property of Lite-On Only Bin Code List For Reference Luminous Intensity Unit : mcd @20mA Bin Code Min. Max. O1 60 100 O2 40 60 O3 29 40 O4 19 29 O5 12.6 19 Note: Tolerance of each bin limit is ±15% Dominant Wavelength Unit : nm @20mA Bin Code Min. Max. OY 592.0 595.0 Y 589.0 592.0 PY 587.0 589.0 YY 584.0 587.0 YY1 582.0 584.0 Note: Tolerance of each bin limit is ±1nm Part No. : LTL-1CHYE-071A Page : 7 of 11 LITE-ON TECHNOLOGY CORPORATION Property of Lite-On Only BNS-OD-C131/A4 CAUTIONS 1. Application The LEDs described here are intended to be used for ordinary electronic equipment (such as office equipment, communication equipment and household applications).Consult Liteon’s Sales in advance for information on applications in which exceptional reliability is required, particularly when the failure or malfunction of the LEDs may directly jeopardize life or health (such as in aviation, transportation, traffic control equipment, medical and life support systems and safety devices). 2. Storage The storage ambient for the LEDs should not exceed 30°C temperature or 70% relative humidity. It is recommended that LEDs out of their original packaging are used within three months. For extended storage out of their original packaging, it is recommended that the LEDs be stored in a sealed container with appropriate desiccant or in desiccators with nitrogen ambient. 3. Cleaning Use alcohol-based cleaning solvents such as isopropyl alcohol to clean the LEDs if necessary. 4. Lead Forming & Assembly During lead forming, the leads should be bent at a point at least 3mm from the base of LED lens. Do not use the base of the lead frame as a fulcrum during forming. Lead forming must be done before soldering, at normal temperature. During assembly on PCB, use minimum clinch force possible to avoid excessive mechanical stress. 5. Soldering When soldering, leave a minimum of 2mm clearance from the base of the lens to the soldering point. Dipping the lens into the solder must be avoided. Do not apply any external stress to the lead frame during soldering while the LED is at high temperature. Recommended soldering conditions : Soldering iron Temperature Soldering time 300°C Max. 3 sec. Max. (one time only) Wave soldering Pre-heat Pre-heat time Solder wave Soldering time 100°C Max. 60 sec. Max. 260°C Max. 10 sec. Max. Note: Excessive soldering temperature and/or time might result in deformation of the LED lens or catastrophic failure of the LED. IR reflow is not suitable process for through hole type LED lamp product. Part No. : LTL-1CHYE-071A Page : 8 of 11 LITE-ON TECHNOLOGY CORPORATION Property of Lite-On Only BNS-OD-C131/A4 6. Drive Method An LED is a current-operated device. In order to ensure intensity uniformity on multiple LEDs connected in parallel in an application, it is recommended that a current limiting resistor be incorporated in the drive circuit, in series with each LED as shown in Circuit A below. Circuit model A LED Circuit model B LED (A) Recommended circuit (B) The brightness of each LED might appear different due to the differences in the I-V characteristics of those LEDs 7. ESD (Electrostatic Discharge) Static Electricity or power surge will damage the LED. Suggestions to prevent ESD damage: Use a conductive wrist band or anti- electrostatic glove when handling these LEDs All devices, equipment, and machinery must be properly grounded Work tables, storage racks, etc. should be properly grounded Use ion blower to neutralize the static charge which might have built up on surface of the LEDs plastic lens as a result of friction between LEDs during storage and handing Part No. : LTL-1CHYE-071A BNS-OD-C131/A4 Page : 9 of 11 LITE-ON TECHNOLOGY CORPORATION Property of Lite-On Only Suggested checking list : Training and Certification 1. Everyone working in a static-safe area is ESD-certified? 2. Training records kept and re-certification dates monitored? Static-Safe Workstation & Work Areas 1. Static-safe workstation or work-areas have ESD signs? 2. All surfaces and objects at all static-safe workstation and within 1 ft measure less than 100V? 3. All ionizer activated, positioned towards the units? 4. Each work surface mats grounding is good? Personnel Grounding 1. Every person (including visitors) handling ESD sensitive (ESDS) items wear wrist strap, heel strap or conductive shoes with conductive flooring? 2. If conductive footwear used, conductive flooring also present where operator stand or walk? 3. Garments, hairs or anything closer than 1 ft to ESD items measure less than 100V*? 4. Every wrist strap or heel strap/conductive shoes checked daily and result recorded for all DLs? 5. All wrist strap or heel strap checkers calibration up to date? Note: *50V for Blue LED. Device Handling 1. Every ESDS items identified by EIA-471 labels on item or packaging? 2. All ESDS items completely inside properly closed static-shielding containers when not at static-safe workstation? 3. No static charge generators (e.g. plastics) inside shielding containers with ESDS items? 4. All flexible conductive and dissipative package materials inspected before reuse or recycle? Others 1. Audit result reported to entity ESD control coordinator? 2. Corrective action from previous audits completed? 3. Are audit records complete and on file? Part No. : LTL-1CHYE-071A BNS-OD-C131/A4 Page : 10 of 11 LITE-ON TECHNOLOGY CORPORATION Property of Lite-On Only 8. Reliability Test Classification Test Item Test Condition Room Temp. Operation Life If=50mA DC o Ta= 25 C t= 1000hrs MIL-STD-750D:1026 (1995) MIL-STD-883D:1005 (1991) JIS C 7021:B-1 (1982) High Temperature Operation Life If=30mA DC o Ta= 55 C t= 1000hrs Liteon Request High Temperature High Humidity Life If=10mA DC o Ta= 85 C, 85% t= 1000hrs Liteon Request Endurance Test o High Temperature High Humidity Reverse BIAS Ta= 65±5 C RH= 90 ～ 95% MIL-STD-202: 103B JIS C 7021 : B-11(1982) VR=-5V Test Time = 500hrs o High Temperature Storage Ta= 100 C t= 1000hrs Low Temperature Storage Ta= -55 C t= 1000hrs Thermal Shock 100 ± 5 C ～ -40 C ± 5 C 30mins 5mins 30mins 500 Cycles Thermal Shock (2) 80 ± 5 C ～ -40 C ± 5 C 30mins 2mins 30mins 500 Cycles Solder Resistance T.sol = 260 ± 5 C Dwell Time= 10 ± 1secs 3 times dip. Solder ability T. sol = 230 ± 5 C Dwell Time= 5 ± 1secs MIL-STD-883D:1008 (1991) JIS C 7021:B-10 (1982) o JIS C 7021:B-12 (1982) o o o Environmental Test Reference Standard o o o o MIL-STD-883:1010 o Liteon Request MIL-STD-202F:210A(1980) MIL-STD-750D:2031(1995) JIS C 7021: A-1(1982) MIL-STD-202F:208D(1980) MIL-STD-750D:2026(1995) MIL-STD-883D:2003(1991) JIS C 7021: A-2(1982) 9. Others The appearance and specifications of the product may be modified for improvement, without prior notice. Part No. : LTL-1CHYE-071A BNS-OD-C131/A4 Page : 11 of 11