Kemet C1808H393FGGALTU Surface mount multilayer ceramic chip capacitor Datasheet

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
HV-HT Series, High Voltage, High Temperature 200°C,
C0G Dielectric, 500 – 2,000 VDC (Industrial Grade)
Overview
KEMET’s High Voltage-High Temperature (HV-HT) series
surface mount C0G Multilayer Ceramic Capacitors (MLCCs) are
constructed of a robust and proprietary base metal electrode
(BME) dielectric system that offers industry-leading performance
at extreme temperatures. These surface mountable devices
feature a 200ºC maximum operating temperature and are
specifically designed to withstand the demands of harsh
industrial environments such as oil exploration and automotive/
avionics engine compartment circuitry. They also offer
higher and more uniform breakdown voltage performance
than competitive products, resulting in increased yields in
customer field applications. When dealing with expensive high
temperature circuitry and systems, higher yields can quickly
result in significant cost savings.
reference to ambient temperature. Capacitance change is limited
to ±30ppm/ºC from −55°C to +200°C. In addition, these capacitors
exhibit high insulation resistance with low dissipation factor at
elevated temperatures up to 200°C. They also exhibit low ESR
at high frequencies and offer superior volumetric efficiency over
competitive high temperature precious metal electrode (PME) and
base metal electrode (BME) dielectric system devices.
These devices are Lead (Pb)-Free, RoHS and REACH compliant
without the need of any exemptions.
KEMET’s HV-HT series MLCCs are temperature compensating
and are suited for resonant circuit applications or those where
Q and stability of capacitance characteristics are required.
They exhibit no change in capacitance with respect to time
and voltage and boast a negligible change in capacitance with
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Ordering Information
C
2225
H
Case Size Specification/
Ceramic
(L" x W")
Series
0805
1206
1210
1808
1812
1825
2220
2225
2824
3040
3640
4540
1
2
H = High
Temperature
(200°C)
393
J
Capacitance
Code (pF)
Capacitance
Tolerance1
Two significant
digits +
number of zeros.
B = ±0.10 pF
C = ±0.25 pF
D = ±0.5 pF
F = ±1%
G = ±2%
J = ±5%
K = ±10%
M = ±20%
C
G
A
Rated Voltage
Failure Rate/
Dielectric
(VDC)
Design
C = 500
B = 630
D = 1,000
F = 1,500
G = 2,000
G = C0G
A = N/A
C
TU
Termination Finish2
Packaging/Grade
(C-Spec)
C = 100% Matte Sn
L = SnPb (5% Pb min.)
E = Gold (Au) 1.97 – 11.8 µin
F = Gold (Au) 30 – 50 µin
G = Gold (Au) 100 µin min.
See “Packaging
C-Spec Ordering
Options Table”
below
Additional capacitance tolerance offerings may be available. Contact KEMET for details.
Gold(Au) termination finish options are not available on 2824, 3040, 3640 and 4540 case sizes.
One world. One KEMET
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1069_C0G_HV_HT_200C • 3/24/2016 1
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
HV-HT Series, High Voltage, High Temperature 200°C, C0G Dielectric, 500 – 2,000 VDC (Industrial Grade)
Packaging C-Spec Ordering Options Table
Termination Finish Options
Packaging Type/Options
Packaging
Ordering Code (C-Spec)
Standard Packaging – Unmarked3
Bulk Bag
Waffle Tray2
7" Tape & Reel
C = 100% Matte Sn
L = SnPb (5% Pb min.)
F = Gold (Au) 30 – 50 µin
G = Gold (Au) 100 µin min.
13" Reel
7” Tape & Reel/2 mm pitch4
7" Tape & Reel – 50 pcs
7" Tape & Reel – 100 pcs
7" Tape & Reel – 250 pcs
7" Tape & Reel – 500 pcs
7" Tape & Reel – 1,000 pcs
Blank1
7292
TU
7411 (EIA 0603 and smaller case sizes)
7210 (EIA 0805 and larger case sizes)
7081
T050
T100
T250
T500
T1K0
Moisture Sensitive Packaging5 – Unmarked3
E = Gold (Au) 1.97 – 11.8 µin
F = Gold (Au) 30 – 50 µin
G = Gold (Au) 100 µin min.
Waffle Tray2
7" Tape & Reel
7" Tape & Reel – 50 pcs
7" Tape & Reel – 100 pcs
7" Tape & Reel – 250 pcs
7" Tape & Reel – 500 pcs
7" Tape & Reel – 1,000 pcs
7282
7130
Contact KEMET6
Default packaging is “Bulk Bag”. An ordering code C-Spec is not required for “Bulk Bag” packaging.
“Bulk Bag” packaging option is not available for Gold (Au) termination finish options and case sizes larger than 2225 (5664 Metric).
2
“Waffle Tray” packaging option is not available for case sizes larger than 2225 (5664 Metric).
3
The terms “Marked” and “Unmarked” pertain to laser marking option of components. All packaging options labeled as “Unmarked” will contain capacitors that
have not been laser marked. The option to laser mark is not available on these devices.
3
Reeling quantities are dependent upon chip size and thickness dimension. When ordering using the “T1K0” packaging option, 1812 thru 2225 case size devices
with chip thickness of ≥ 1.9mm (nominal) may be shipped on multiple 7” reels or a single 13” reel. Additional reeling or packaging options may be available.
Contact KEMET for details.
4
The 2 mm pitch option allows for double the packaging quantity of capacitors on a given reel size. This option is limited to EIA 0603 (1608 metric) case size
devices. For more information regarding 2 mm pitch option see “Tape & Reel Packaging Information”.
5
Moisture sensitive packaging is required for Gold (Au) termination option “E” (1.97 – 11.8 µin)
6
Additional reeling or packaging options may be available. Contact KEMET for details.
1
1
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1069_C0G_HV_HT_200C • 3/24/2016 2
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
HV-HT Series, High Voltage, High Temperature 200°C, C0G Dielectric, 500 – 2,000 VDC (Industrial Grade)
Benefits
• Operating temperature range of −55°C to +200°C
• Lead (Pb)-Free, RoHS, and REACH compliant
• EIA 0805, 1206, 1210, 1808, 1812, 1825, 2220, 2225, 2824,
3040, 3640 and 4540 case sizes
• DC voltage ratings of 500 V, 630 V, 1 KV, 1.5 KV, and 2 KV
• Capacitance offerings ranging from 1 pF to 0.150 μF
• Available capacitance tolerances of ±0.10 pF, ±0.25 pF,
±0.5 pF, ±1%, ±2%, ±5%, ±10%, and ±20%
• No piezoelectric noise
• Extremely low ESR & ESL
• High thermal stability
• High ripple current capability
• No capacitance change with respect to applied rated
DC voltage
• Negligible capacitance change with respect to temperature
from −55°C to +125°C
• No capacitance decay with time
• Non-polar device, minimizing installation concerns
• 100% pure matte tin-plated termination finish allowing for
excellent solderability
• SnPb plated termination finish option available upon request
(5% Pb minimum)
• Gold (Au), Tin/Lead (Sn/Pb) and 100% pure matte Tin (Sn)
termination finishes available
Applications
Typical applications include critical timing, tuning, circuits requiring low loss, circuits with pulse, high current, switch mode power
supplies (input filters, resonators, tank circuits, snubbed circuits, output filters), high voltage coupling, DC blocking and voltage
multiplier circuits in extreme environments such as down-hole exploration, aerospace engine compartments and geophysical probes.
Markets include power supply, HID lighting, industrial equipment/control, automotive, aerospace, and munitions.
Qualification/Certification
High temperature (200ºC) Industrial grade products meet or exceed the requirements outlined in Table 4, Performance & Reliability.
Qualification packages are available for review and download on our website at www.kemet.com/hightemp
Environmental Compliance
Lead (Pb)-Free, RoHS, and REACH compliant without exemptions (excluding SnPb termination finish option).
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1069_C0G_HV_HT_200C • 3/24/2016 3
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
HV-HT Series, High Voltage, High Temperature 200°C, C0G Dielectric, 500 – 2,000 VDC (Industrial Grade)
Dimensions – Millimeters (Inches)
L
W
B
T
S
EIA
Size
Code
Metric
Size
Code
B
Bandwidth
S
Separation
Minimum
0805
2012
2.00 (.079) ± 0.20 (.008) 1.25 (.049) ± 0.20 (.008)
0.50 (0.02) ± 0.25 (.010)
0.75 (.030)
1206
3216
3.20 (.126) ± 0.20 (.008) 1.60 (.063) ± 0.20 (.008)
0.50 (0.02) ± 0.25 (.010)
1210
3225
3.20 (.126) ± 0.20 (.008) 2.50 (.098) ± 0.20 (.008)
0.50 (0.02) ± 0.25 (.010)
1808
4520
4.70 (.185) ± 0.50 (.020) 2.00 (.079) ± 0.20 (.008)
0.60 (.024) ± 0.35 (.014)
1812
4532
4.50 (.177) ± 0.30 (.012)
0.60 (.024) ± 0.35 (.014)
1825
4564
2220
5650
4.50 (.177) ± 0.30 (.012) 6.40 (.252) ± 0.40 (.016) See Table 2 for 0.60 (.024) ± 0.35 (.014)
Thickness
5.70 (.224) ± 0.40 (.016) 5.00 (.197) ± 0.40 (.016)
0.60 (.024) ± 0.35 (.014)
2225
5664
5.60 (.220) ± 0.40 (.016) 6.40 (.248) ± 0.40 (.016)
0.60 (.024) ± 0.35 (.014)
2824
7260
7.10 (.280) ± 0.40 (.016)
6.10 (.240) ± 0.40 (.016)
1.27 (.050) ± 0.40 (.016)
3040
7610
7.60 (.300) ± 0.40 (.016) 10.20 (.402) ± 0.40 (.016)
1.27 (.050) ± 0.40 (.016)
3640
9210
9.10 (.358) ± 0.40 (.016) 10.20 (.402) ± 0.40 (.016)
1.27 (.050) ± 0.40 (.016)
4540
-
11.40 (.449) ± 0.40 (.016) 10.20 (.402) ± 0.40 (.016)
1.27 (.050) ± 0.40 (.016)
L
Length
W
Width
3.20 (.126) ± 0.30 (.012)
T
Thickness
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
N/A
Mounting
Technique
"Solder Wave or
Solder Reflow"
Solder Reflow Only
C1069_C0G_HV_HT_200C • 3/24/2016 4
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
HV-HT Series, High Voltage, High Temperature 200°C, C0G Dielectric, 500 – 2,000 VDC (Industrial Grade)
Electrical Parameters/Characteristics
Item
Parameters/Characteristics
Operating Temperature Range
Capacitance Change with Reference to +25°C and 0 VDC Applied (TCC)
Aging Rate (Maximum % Capacitance Loss/Decade Hour)
Dielectric Withstanding Voltage (DWV)
1
2
3
Dissipation Factor (DF) Maximum Limit @ 25ºC
Insulation Resistance (IR) Minimum Limit @ 25°C
−55°C to +200°C
±30 ppm/ºC (up to +200ºC)
0%
150% of rated voltage for voltage rating of < 1000 V
120% of rated voltage for voltage rating of ≥ 1000 V
(5 ±1 seconds and charge/discharge not exceeding 50 mA)
0.1%
1000 megohm microfarads or 100 GΩ
(500 VDC applied for 120 ±5 secs @ 25°C)
DWV is the voltage a capacitor can withstand (survive) for a short period of time. It exceeds the nominal and continuous working voltage of the capacitor.
Capacitance and dissipation factor (DF) measured under the following conditions:
1 MHz ±100 kHz and 1.0 Vrms ±0.2 V if capacitance ≤ 1,000 pF
1 kHz ± 50 Hz and 1.0 Vrms ±0.2 V if capacitance > 1,000 pF
3
To obtain IR limit, divide MΩ-µF value by the capacitance and compare to GΩ limit. Select the lower of the two limits.
Note: When measuring capacitance it is important to ensure the set voltage level is held constant. The HP4284 and Agilent E4980 have a feature known as
Automatic Level Control (ALC). The ALC feature should be switched to "ON."
1
2
Post Environmental Limits
High Temperature Life, Biased Humidity, Moisture Resistance
Dielectric
Rated DC
Voltage
Capacitance
Value
Dissipation Factor
(Maximum %)
C0G
All
All
0.5
Capacitance
Shift
Insulation
Resistance
0.3% or ±0.25 pF 10% of Initial Limit
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1069_C0G_HV_HT_200C • 3/24/2016 5
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
HV-HT Series, High Voltage, High Temperature 200°C, C0G Dielectric, 500 – 2,000 VDC (Industrial Grade)
Table 1A – Capacitance Range/Selection Waterfall (0805 – 1808 Case Sizes)
*Capacitance range Includes E24 decade values only. (i.e., 10, 11, 12, 13, 15, 16, 18, 20, 22, 24, 27, 30, 33, 36, 39, 43, 47, 51, 56, 62, 68, 75, 82 and 91)
KEMET reserves the right to substitute product with an improved temperature characteristic, tighter capacitance tolerance and/or higher voltage capability within
the same form factor (configuration and dimensions).
These products are protected under US Patents 7,172,985 and 7,670,981, other patents pending, and any foreign counterparts..
Case Size/Series
1500
2000
LB
LB
LB
LB
LB
LB
LB
LB
LB
LB
LB
LA
LA
LA
LA
LA
LA
LA
LA
LA
LA
LA
LA
LA
LB
LB
LB
LB
LB
LB
LB
LB
LB
LB
LC
LC
LC
LC
LC
LC
LB
LB
LB
LC
LB
LB
LB
LB
LB
LB
LB
LB
LB
LB
LB
LA
LA
LA
LA
LA
LA
LA
LB
LB
LB
LB
LB
LB
LC
LC
LC
LC
LA
LA
LA
LA
LA
LB
LB
LC
LC
LC
LB
LB
LB
LB
LB
LB
LB
LB
LB
LB
LB
LB
LB
LB
LC
LC
LC
LC
LC
LC
LC
LC
LA
LA
LA
LA
LB
LB
LC
LC
2000
500
LB
LB
LB
LB
LB
LB
LB
LB
LB
LB
LB
LA
LA
LA
LA
LA
LA
LA
LA
LA
LA
LA
LA
LA
LB
LB
LB
LB
LB
LB
LB
LB
LB
LB
LC
LC
LC
LC
LC
LC
LA
LA
LA
LA
LA
LA
LB
LB
LC
LC
1500
2000
1000
1500
LB
LB
LB
LB
LB
LB
LB
LB
LB
LB
LB
LA
LA
LA
LA
LA
LA
LA
LA
LA
LA
LA
LA
LA
LA
LA
LA
LA
LA
LB
LB
LB
LB
LB
LC
LC
LC
LC
LC
LC
LC
LC
LC
LC
LA
LA
LA
LA
LA
LA
1000
1000
630
G
630
F
500
D
2000
B
G
C
B
D
F
G
ED
ED
ED
ED
ED
ED
ED
ED
ED
ED
ED
ED
ED
ED
ED
ED
ED
ED
ED
ED
ED
ED
ED
ED
ED
ED
ED
ED
ED
ED
ED
ED
ED
EF
EF
EF
EF
EF
EF
EG
EG
EG
EG
ED
ED
ED
ED
ED
ED
ED
ED
ED
ED
ED
ED
ED
ED
ED
ED
ED
ED
ED
ED
ED
ED
ED
ED
ED
ED
ED
ED
ED
EF
EF
EF
EF
EG
EG
EG
EG
EG
EG
ED
ED
ED
ED
ED
ED
ED
ED
ED
ED
ED
ED
ED
ED
ED
ED
ED
ED
ED
EF
EF
EF
EF
EF
EG
EG
EG
EG
EG
EG
EG
EG
EG
ED
ED
ED
ED
ED
ED
ED
ED
ED
ED
ED
ED
EF
EF
EF
EF
EG
EG
EG
EG
EG
EG
EG
EG
EG
EG
EG
ED
ED
ED
ED
ED
EF
EF
EF
EF
EG
EG
EG
EG
EG
EG
EG
EG
EG
EG
FM
FM
FM
FM
FM
FM
FM
FM
FM
FM
FG
FG
FG
FG
FG
FG
FG
FG
FG
FG
FG
FG
FG
FG
FG
FG
FG
FG
FG
FG
FG
FM
FM
FM
FM
FM
FK
FK
FK
FK
FK
FS
FS
FS
FS
FL
FL
FM
FM
FM
FM
FM
FM
FM
FM
FM
FM
FM
FM
FG
FG
FG
FG
FG
FG
FG
FG
FG
FG
FG
FG
FG
FM
FM
FM
FM
FM
FM
FM
FM
FM
FM
FK
FK
FS
FS
FS
FS
FL
FL
FL
FL
FL
FM
FM
FY
FY
FY
FM
FM
FM
FM
FM
FM
FM
FM
FM
FM
FG
FG
FG
FG
FG
FG
FG
FG
FG
FG
FG
FG
FG
FM
FM
FM
FM
FM
FM
FM
FM
FM
FM
FK
FK
FS
FS
FS
FS
FS
FS
FS
FS
FM
FM
FM
FM
FM
FM
FM
FM
FM
FM
FM
FM
FM
FM
FM
FM
FM
FM
FK
FK
FK
FK
FK
FS
FS
FS
FS
FS
FS
FM
FM
FY
FY
FS
FS
FM
FM
FM
FM
FM
FM
FM
FM
FM
FM
FM
FM
FM
FM
FM
FM
FM
FM
FK
FK
FK
FS
FS
FS
FS
FS
FS
FS
FS
1500
Product Availability and Chip Thickness Codes
See Table 2 for Chip Thickness Dimensions
1000
B
C
630
C
G
500
Voltage Code
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
F
2000
Rated Voltage (VDC)
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
D
1500
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
B
1000
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
C
630
500
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
G
500
1000
D
F
2000
630
C
Capacitance
Tolerance
D
1500
Rated Voltage (VDC)
B
1000
C
630
D
630
Capacitance
Cap
Code
B
B
C1808H
500
109 - 919*
100 - 470*
510
560
620
680
750
820
910
101
111
121
131
151
161
181
201
221
241
271
301
331
361
391
431
471
511
561
621
681
751
821
911
102
112
122
132
152
162
182
202
222
242
272
302
332
362
392
432
472
C
C1210H
1000
1.0 - 9.1 pF*
10 pF - 47pF*
51 pF
56 pF
62 pF
68 pF
75 pF
82 pF
91 pF
100 pF
110 pF
120 pF
130 pF
150 pF
160 pF
180 pF
200 pF
220 pF
240 pF
270 pF
300 pF
330 pF
360 pF
390 pF
430 pF
470 pF
510 pF
560 pF
620 pF
680 pF
750 pF
820 pF
910 pF
1,000 pF
1,100 pF
1,200 pF
1,300 pF
1,500 pF
1,600 pF
1,800 pF
2,000 pF
2,200 pF
2,400 pF
2,700 pF
3,000 pF
3,300 pF
3,600 pF
3,900 pF
4,300 pF
4,700 pF
C1206H
Voltage Code
630
Cap
Code
500
Capacitance
C0805H
500
Case Size/Series
D
C
B
D
F
G
C
B
D
F
C0805H
C1206H
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1210H
C1808H
C1069_C0G_HV_HT_200C • 3/24/2016 6
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
HV-HT Series, High Voltage, High Temperature 200°C, C0G Dielectric, 500 – 2,000 VDC (Industrial Grade)
Table 1A – Capacitance Range/Selection Waterfall (0805 – 1808 Case Sizes) cont’d
1500
2000
500
2000
1000
2000
630
1500
500
Rated Voltage (VDC)
1500
2000
1000
G
1000
F
630
D
630
B
500
C
2000
G
1500
F
1000
D
630
B
500
C
2000
500
G
1500
1000
F
1500
630
D
1000
Rated Voltage (VDC)
B
1000
C
630
D
630
Capacitance
Cap
Code
B
500
512
562
622
682
752
822
C
C1808H
1000
5,100 pF
5,600 pF
6,200pF
6,800pF
7,500pF
8,200 pF
Voltage Code
C1210H
630
Cap
Code
C1206H
500
Capacitance
C0805H
500
Case Size/Series
Voltage Code
C
B
D
C
B
D
F
G
C
B
D
F
G
C
B
D
F
G
Capacitance
Tolerance
F
F
F
F
F
F
G
G
G
G
G
G
J
J
J
J
J
J
K
K
K
K
K
K
Case Size/Series
Product Availability and Chip Thickness Codes
See Table 2 for Chip Thickness Dimensions
M
M
M
M
M
M
C0805H
C1206H
FY
FY
FY
FY
FS
FS
FS
FS
LA
LB
LC
LC
C1210H
C1808H
*Capacitance range Includes E24 decade values only. (i.e., 10, 11, 12, 13, 15, 16, 18, 20, 22, 24, 27, 30, 33, 36, 39, 43, 47, 51, 56, 62, 68, 75, 82 and 91)
KEMET reserves the right to substitute product with an improved temperature characteristic, tighter capacitance tolerance and/or higher voltage capability within
the same form factor (configuration and dimensions).
These products are protected under US Patents 7,172,985 and 7,670,981, other patents pending, and any foreign counterparts..
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1069_C0G_HV_HT_200C • 3/24/2016 7
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
HV-HT Series, High Voltage, High Temperature 200°C, C0G Dielectric, 500 – 2,000 VDC (Industrial Grade)
Table 1B – Capacitance Range/Selection Waterfall (1812 – 2225 Case Sizes)
2000
500
2000
1500
GK
GK
GK
GK
GK
GK
GK
GK
GK
GK
GK
GK
GK
GK
GK
GH
GH
GH
GH
GH
GH
GK
GK
GK
GK
GH
GH
GH
GH
GH
GH
GH
GH
GK
GK
GK
GK
GK
GK
GK
GK
GK
GK
GK
GK
GM
GM
GO
GO
GK
GK
GK
GK
GK
GK
GK
GK
GK
GK
GK
GK
GK
GK
GK
GH
GH
GH
GH
GH
GH
GK
GK
GK
GK
GK
GK
GK
GK
GK
GK
GH
GH
GH
GH
GH
GK
GK
GM
GM
GO
GO
GO
GK
GK
GK
GK
GK
GK
GK
GK
GK
GK
GK
GK
GK
GK
GK
GH
GH
GH
GH
GH
GH
GH
GK
GK
GK
GH
GH
GH
GH
GK
GK
GM
GM
GO
GO
GO
GO
HG
HG
HG
HG
HG
HG
HG
HG
HG
HG
HG
HG
HG
HG
HG
HE
HE
HE
HE
HE
HE
HE
HE
HE
HE
HE
HE
HE
HE
HE
HE
HE
HE
HE
HE
HE
HE
HE
HE
HE
HE
HE
HE
HG
HG
HG
HG
HG
HG
HG
HG
HG
HG
HG
HG
HG
HG
HG
HG
HG
HG
HG
HG
HG
HE
HE
HE
HE
HE
HE
HE
HE
HE
HE
HE
HE
HE
HE
HE
HE
HE
HE
HE
HE
HE
HE
HG
HG
HG
HG
HG
HG
HG
HG
HG
HG
HG
HG
HG
HG
HG
HG
HG
HG
HG
HG
HG
HG
HG
HG
HG
HG
HG
HE
HE
HE
HE
HE
HE
HE
HE
HE
HE
HE
HE
HE
HE
HE
HE
HE
HE
HE
HE
HE
HE
HG
HG
HG
HG
HG
HG
HG
HG
HG
HG
HG
HG
HG
HG
HG
HG
HG
HG
HG
HG
HG
HG
HG
HG
HG
HG
HG
HE
HE
HE
HE
HE
HE
HE
HE
HE
HE
HE
HE
HE
HE
HG
HG
HG
HG
HG
HG
HG
HG
HG
HG
HE
HE
HE
HE
HE
HG
HG
HJ
HJ
HJ
HG
HG
HG
HG
HG
HG
HG
HG
HG
HG
HG
HG
HG
HG
HG
HE
HE
HE
HE
HE
HE
HE
HE
HE
HE
HE
HG
HG
HG
HG
HG
HG
HG
HG
HG
HE
HE
HG
HG
HJ
HJ
HJ
HK
HK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JE
JE
JE
JE
JE
JK
JK
JK
JE
JE
JE
JE
JE
JE
JE
JE
JE
JE
JE
JE
JE
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JE
JE
JE
JE
JE
JK
JK
JK
JE
JE
JE
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JE
JE
JE
JE
JE
JK
JK
JK
JE
JE
JE
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JE
JE
JE
JE
JE
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JE
JE
JE
JE
JE
JK
JK
JK
JK
JL
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JE
JE
JE
JE
JE
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JE
JE
JE
JE
JK
JK
JL
JL
JL
JN
JN
JN
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KE
KE
KE
KE
KE
KE
KE
KF
KF
KF
KF
KF
KE
KE
KE
KE
KE
KE
KE
KE
KE
KE
KE
KE
KE
KE
KE
KE
KE
KE
KE
KE
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KE
KE
KE
KE
KE
KE
KE
KF
KF
KF
KF
KF
KE
KE
KE
KE
KE
KE
KE
KE
KE
KE
KE
KE
KE
KE
KE
KE
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KE
KE
KE
KE
KE
KE
KE
KF
KF
KF
KF
KF
KE
KE
KE
KE
KE
KE
KE
KE
KE
KE
KE
KE
KE
KE
KE
KE
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KE
KE
KE
KE
KE
KE
KE
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KE
KE
KE
KE
KF
KF
KF
KH
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KE
KE
KE
KE
KE
KE
KE
KE
KE
KE
KE
KE
KE
KE
KE
KE
KF
KF
KF
KF
KE
KE
KE
KF
KH
KH
KH
KJ
KJ
KJ
Rated Voltage (VDC)
2000
1000
1500
630
GK
GK
GK
GK
GK
GK
GK
GK
GK
GK
GK
GK
GK
GK
GK
GH
GH
GH
GH
GH
GH
GK
GK
GK
GK
GH
GH
GH
GH
GH
GH
GH
GH
GK
GK
GK
GK
GK
GK
GK
GK
GH
GH
GH
GH
GH
GH
GH
GH
1500
500
1000
2000
GK
GK
GK
GK
GK
GK
GK
GK
GK
GK
GK
GK
GK
GK
GK
GH
GH
GH
GH
GH
GH
GK
GK
GK
GK
GH
GH
GH
GH
GH
GH
GH
GH
GH
GH
GH
GK
GK
GK
GK
GK
GK
GK
GK
GK
GK
GK
GH
GH
1000
G
630
F
630
D
500
B
2000
C
1500
G
1000
F
630
D
500
B
2000
C
1500
2000
G
1500
1500
F
1000
1000
D
1000
630
B
630
Rated Voltage (VDC)
C
630
G
500
F
500
Cap
Code
D
2000
Capacitance
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
B
1500
100 - 470*
510
560
620
680
750
820
910
101
111
121
131
151
161
181
201
221
241
271
301
331
361
391
431
471
511
561
621
681
751
821
911
102
112
122
132
152
162
182
202
222
242
272
302
332
362
392
432
472
C
C2225H
1000
10 pF - 47pF*
51 pF
56 pF
62 pF
68 pF
75 pF
82 pF
91 pF
100 pF
110 pF
120 pF
130 pF
150 pF
160 pF
180 pF
200 pF
220 pF
240 pF
270 pF
300 pF
330 pF
360 pF
390 pF
430 pF
470 pF
510 pF
560 pF
620 pF
680 pF
750 pF
820 pF
910 pF
1,000 pF
1,100 pF
1,200 pF
1,300 pF
1,500 pF
1,600 pF
1,800 pF
2,000 pF
2,200 pF
2,400 pF
2,700 pF
3,000 pF
3,300 pF
3,600 pF
3,900 pF
4,300 pF
4,700 pF
Voltage Code
C2220H
630
Cap
Code
C1825H
500
Capacitance
C1812H
500
Case Size/Series
Voltage Code
C
B
D
F
G
C
B
D
F
G
C
B
D
F
G
C
B
D
F
G
Capacitance
Tolerance
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
Case Size/Series
C1812H
Product Availability and Chip Thickness Codes
See Table 2 for Chip Thickness Dimensions
C1825H
C2220H
C2225H
*Capacitance range Includes E24 decade values only. (i.e., 10, 11, 12, 13, 15, 16, 18, 20, 22, 24, 27, 30, 33, 36, 39, 43, 47, 51, 56, 62, 68, 75, 82 and 91)
KEMET reserves the right to substitute product with an improved temperature characteristic, tighter capacitance tolerance and/or higher voltage capability within
the same form factor (configuration and dimensions).
These products are protected under US Patents 7,172,985 and 7,670,981, other patents pending, and any foreign counterparts..
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1069_C0G_HV_HT_200C • 3/24/2016 8
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
HV-HT Series, High Voltage, High Temperature 200°C, C0G Dielectric, 500 – 2,000 VDC (Industrial Grade)
Table 1B – Capacitance Range/Selection Waterfall (1812 – 2225 Case Sizes) cont’d
1500
2000
500
G
C
B
D
F
JK
JK
JE
JK
JK
JL
JL
JL
JN
JL
JN
JN
JN
G
C
B
D
F
C1825H
C2220H
2000
1000
KE
KE
KE
KE
KF
KF
KF
KF
KE
KE
KE
KF
KF
KH
KJ
KF
KF
KF
KF
KE
KE
KE
KE
KE
KF
KH
KJ
KJ
KF
KF
KF
KF
KF
KF
KH
KH
KH
KJ
KH
KH
KJ
KJ
2000
F
JK
JK
JE
JE
JE
JE
JE
JE
JK
JL
JL
JN
JN
1500
D
C1812H
JK
JK
JK
JK
JK
JK
JE
JE
JE
JE
JE
JK
JL
JN
1000
B
HK
HK
630
C
HG
HG
HG
HJ
HJ
HJ
HK
HK
500
Voltage Code
HE
HE
HE
HE
HE
HE
HG
HG
HG
HJ
HK
2000
Rated Voltage (VDC)
HG
HG
HG
HG
HG
HG
HE
HE
HE
HE
HG
HJ
HJ
HK
1500
GO
GO
1000
GK
GK
GK
GM
GM
GO
GO
GO
G
1500
F
1500
D
1000
B
1000
C
630
G
630
F
500
D
2000
B
G
C
B
D
F
G
Product Availability and Chip Thickness Codes
See Table 2 for Chip Thickness Dimensions
GH
GH
GH
GH
GH
GK
GM
GM
GO
GO
Case Size/Series
C
630
M
M
M
M
M
M
G
630
2000
K
K
K
K
K
K
F
500
1500
J
J
J
J
J
J
D
2000
1000
G
G
G
G
G
G
B
1500
630
Capacitance
Tolerance
C
1000
Rated Voltage (VDC)
C2225H
630
G
C2220H
500
F
500
Cap
Code
D
2000
Capacitance
F
F
F
F
F
F
B
1500
512
562
622
682
752
822
912
103
123
153
183
223
273
333
393
C
1000
5,100 pF
5,600 pF
6,200pF
6,800pF
7,500pF
8,200 pF
9,100 pF
10,000 pF
12,000 pF
15,000 pF
18,000 pF
22,000 pF
27,000 pF
33,000 pF
39,000 pF
C1825H
Voltage Code
630
Cap
Code
500
Capacitance
C1812H
500
Case Size/Series
C2225H
*Capacitance range Includes E24 decade values only. (i.e., 10, 11, 12, 13, 15, 16, 18, 20, 22, 24, 27, 30, 33, 36, 39, 43, 47, 51, 56, 62, 68, 75, 82 and 91)
KEMET reserves the right to substitute product with an improved temperature characteristic, tighter capacitance tolerance and/or higher voltage capability within
the same form factor (configuration and dimensions).
These products are protected under US Patents 7,172,985 and 7,670,981, other patents pending, and any foreign counterparts..
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1069_C0G_HV_HT_200C • 3/24/2016 9
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
HV-HT Series, High Voltage, High Temperature 200°C, C0G Dielectric, 500 – 2,000 VDC (Industrial Grade)
Table 1C – Capacitance Range/Selection Waterfall (2824 – 4540 Case Sizes)
1500
2000
TA
TA
TA
TA
TA
TA
TA
TA
TA
TA
TA
TA
TA
QB
QB
QB
QB
QB
TA
TA
TA
TA
TB
QB
QB
QB
QB
QB
MA
MA
MA
MA
MA
TA
TA
TA
TB
TB
QB
QB
QB
QB
QB
MA
MA
MA
MA
MA
SA
SA
SA
SA
SA
TA
TA
TA
TB
TC
QB
QB
QB
QB
QB
MA
MA
MA
MA
MA
SA
SA
SA
SA
SA
TA
TA
TA
TB
QB
QB
QB
QB
QC
MA
MA
MA
MA
MA
SA
SA
SA
SA
SA
TA
TA
TA
TC
QB
QB
QB
QC
QC
MA
MA
MA
MA
MB
SA
SA
SA
SA
SA
TA
TA
TA
TA
TA
TA
TB
TB
TB
TC
TA
TA
TA
TA
TB
TB
TB
TC
TA
TA
TB
TB
TC
QB
QB
QB
QB
QB
QB
QB
QB
QB
QC
QC
QC
QD
QB
QB
QB
QB
QB
QB
QC
QC
QC
QD
QD
QB
QB
QB
QB
QC
QC
QC
QD
QC
QD
QD
QD
MA
MA
MA
MA
MA
MA
MA
MA
MA
MA
MB
MB
MC
MC
MA
MA
MA
MA
MA
MA
MA
MA
MB
MB
MC
MA
MA
MA
MA
MA
MA
MB
MB
MC
MA
MB
MB
MC
MB
MB
MC
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SB
SB
SC
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SB
SB
SC
SA
SA
SA
SA
SA
SA
SA
SB
SB
SB
SC
SA
SA
SB
SB
SB
SC
SB
SB
SB
SC
Rated Voltage (VDC)
2000
2000
TA
1500
1500
1000
1000
TA
1000
630
630
G
630
F
500
D
500
B
2000
C
1500
G
1000
F
630
D
500
2000
B
500
1500
C
2000
G
1500
2000
F
1000
1500
D
1000
1000
B
630
630
C
630
G
500
F
500
D
2000
B
1500
Capacitance
Cap
Code
C
C4540H
1000
100 - 202
222
242
272
302
332
362
392
432
472
512
562
622
682
752
822
912
103
123
153
183
223
273
333
393
473
563
683
823
104
124
154
Rated
Voltage (VDC)
Capacitance
Tolerance
K
M
K
M
K
M
K
M
K
M
K
M
K
M
K
M
K
M
K
M
K
M
K
M
K
M
K
M
K
M
K
M
K
M
K
M
K
M
K
M
K
M
K
M
K
M
K
M
K
M
K
M
K
M
K
M
K
M
K
M
K
M
K
M
C3640H
630
10 - 2,000 pF
2,200 pF
2,400 pF
2,700 pF
3,000 pF
3,300 pF
3,600 pF
3,900 pF
4,300 pF
4,700 pF
5,100 pF
5,600 pF
6,200 pF
6,800 pF
7,500 pF
8,200 pF
9,100 pF
10,000 pF
12,000 pF
15,000 pF
18,000 pF
22,000 pF
27,000 pF
33,000 pF
39,000 pF
47,000 pF
56,000 pF
68,000 pF
82,000 pF
0.1 µF
0.12 µF
0.15 µF
Voltage Code
C3040H
500
Cap
Code
C2824H
500
Capacitance
Case Size/
Series
Voltage Code
C
B
D
F
G
C
B
D
F
G
C
B
D
F
G
C
B
D
F
G
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
Case Size/Series
Product Availability and Chip Thickness Codes
See Table 2 for Chip Thickness Dimensions
C2824H
C3040H
C3640H
C4540H
*Capacitance range Includes E24 decade values only. (i.e., 10, 11, 12, 13, 15, 16, 18, 20, 22, 24, 27, 30, 33, 36, 39, 43, 47, 51, 56, 62, 68, 75, 82 and 91)
KEMET reserves the right to substitute product with an improved temperature characteristic, tighter capacitance tolerance and/or higher voltage capability within
the same form factor (configuration and dimensions).
These products are protected under US Patents 7,172,985 and 7,670,981, other patents pending, and any foreign counterparts.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1069_C0G_HV_HT_200C • 3/24/2016 10
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
HV-HT Series, High Voltage, High Temperature 200°C, C0G Dielectric, 500 – 2,000 VDC (Industrial Grade)
Table 2A – Chip Thickness/Tape & Reel Packaging Quantities
Paper Quantity
Plastic Quantity
Thickness
Code
Case
Size
Thickness ±
Range (mm)
7" Reel
13" Reel
7" Reel
13" Reel
DG
ED
EF
EG
FG
FL
FM
FY
FK
FS
LA
LB
LC
GH
GK
GM
GO
HE
HG
HJ
HK
JE
JK
JL
JN
KE
KF
KH
KJ
TA
TB
TC
QB
QC
QD
MA
MB
MC
SA
SB
SC
0805
1206
1206
1206
1210
1210
1210
1210
1210
1210
1808
1808
1808
1812
1812
1812
1812
1825
1825
1825
1825
2220
2220
2220
2220
2225
2225
2225
2225
2824
2824
2824
3040
3040
3040
3640
3640
3640
4540
4540
4540
1.25 ± 0.15
1.00 ± 0.10
1.20 ± 0.15
1.60 ± 0.15
1.25 ± 0.15
1.40 ± 0.15
1.70 ± 0.20
2.00 ± 0.20
2.10 ± 0.20
2.50 ± 0.30
1.40 ± 0.15
1.60 ± 0.15
2.00 ± 0.15
1.40 ± 0.15
1.60 ± 0.20
2.00 ± 0.20
2.50 ± 0.20
1.40 ± 0.15
1.60 ± 0.20
2.00 ± 0.20
2.50 ± 0.20
1.40 ± 0.15
1.60 ± 0.20
2.00 ± 0.20
2.50 ± 0.20
1.40 ± 0.15
1.60 ± 0.20
2.00 ± 0.20
2.50 ± 0.20
1.40 ± 0.15
2.00 ± 0.20
2.50 ± 0.20
1.40 ± 0.15
2.00 ± 0.20
2.50 ± 0.20
1.40 ± 0.15
2.00 ± 0.20
2.50 ± 0.20
1.40 ± 0.15
2.00 ± 0.20
2.50 ± 0.20
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
2,500
2,500
2,500
2,000
2,500
2,000
2,000
2,000
2,000
1,000
1,000
1,000
1,000
1,000
1,000
500
500
1,000
1,000
500
500
1,000
1,000
500
500
1,000
1,000
500
500
750
300
300
500
500
350
250
250
250
200
200
200
10,000
10,000
10,000
8,000
10,000
8,000
8,000
8,000
8,000
4,000
4,000
4,000
4,000
4,000
4,000
2,000
2,000
4,000
4,000
2,000
2,000
4,000
4,000
2,000
2,000
4,000
4,000
2,000
2,000
2,500
2,000
2,000
1,650
1,650
1,400
1,550
1,550
1,550
1,500
1,500
1,500
Thickness
Code
Case
Size
Thickness ±
Range (mm)
7" Reel
13" Reel
7" Reel
13" Reel
Paper Quantity
Plastic Quantity
Package quantity based on finished chip thickness specifications.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1069_C0G_HV_HT_200C • 3/24/2016 11
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
HV-HT Series, High Voltage, High Temperature 200°C, C0G Dielectric, 500 – 2,000 VDC (Industrial Grade)
Table 2B – Bulk Packaging Quantities
Packaging Type
Loose Packaging
Secure Packaging
Bulk Bag (default)
2” x 2” Waffle Pack/Tray3
N/A 2
7282 / 7292
Packaging C-Spec1
Case Size
EIA (in)
0402
0603
0805
1206
1206
1210
1808
1812
1825
2220
2225
Chip Thickness
(mm)
Metric (mm)
1005
1608
2012
3216
3216
3225
4520
4532
4564
5650
5664
Packaging Quantities (pieces/unit packaging)
Minimum
Maximum
Minimum
Maximum
1
368
368
100
126
50
80
50
42
20
20
20
All
50,000
≤ 1.25 (nominal)
> 1.25 (nominal)
1
All
20,000
The "Packaging C-Spec" is a 4-digit code which identifies the packaging type. When ordering, the proper code must be included in the 15th through 18th
character positions of the ordering code. See "Ordering Information" section of this document for further details. Product ordered without a packaging C-Spec will
default to our standard " bulk bag" packaging.
2
A packaging C-Spec (see note 1 above) is not required For "bulk bag" packaging (excluding Anti-Static Bulk Bag). The 15th through 18th character positions of
the ordering code should be left blank. All product ordered without a packaging C-Spec will default to out standard "bulk bag" packaging.
3
Also commonly referred to as “Chip Carrier” or “Molded Tray”. All tray packaging options offer static protection.
1
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1069_C0G_HV_HT_200C • 3/24/2016 12
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
HV-HT Series, High Voltage, High Temperature 200°C, C0G Dielectric, 500 – 2,000 VDC (Industrial Grade)
Table 3 – Chip Capacitor Land Pattern Design Recommendations per IPC–7351
EIA
Size
Code
Metric
Size
Code
0805
Density Level A:
Maximum (Most)
Land Protrusion (mm)
Density Level B:
Median (Nominal)
Land Protrusion (mm)
Density Level C:
Minimum (Least)
Land Protrusion (mm)
C
Y
X
V1
V2
C
Y
X
V1
V2
C
Y
X
V1
V2
2012
1.00
1.35
1.55
4.40
2.60
0.90
1.15
1.45
3.50
2.00
0.75
0.95
1.35
2.80
1.70
1206
3216
1.60
1.35
1.90
5.60
2.90
1.50
1.15
1.80
4.70
2.30
1.40
0.95
1.70
4.00
2.00
1210
3225
1.60
1.35
2.80
5.65
3.80
1.50
1.15
2.70
4.70
3.20
1.40
0.95
2.60
4.00
2.90
1808
4520
2.30
1.75
2.30
7.40
3.30
2.20
1.55
2.20
6.50
2.70
2.10
1.35
2.10
5.80
2.40
1812
4532
2.15
1.60
3.60
6.90
4.60
2.05
1.40
3.50
6.00
4.00
1.95
1.20
3.40
5.30
3.70
1825
4564
2.15
1.60
6.90
6.90
7.90
2.05
1.40
6.80
6.00
7.30
1.95
1.20
6.70
5.30
7.00
2220
5650
2.75
1.70
5.50
8.20
6.50
2.65
1.50
5.40
7.30
5.90
2.55
1.30
5.30
6.60
5.60
2225
5664
2.70
1.70
6.90
8.10
7.90
2.60
1.50
6.80
7.20
7.30
2.50
1.30
6.70
6.50
7.00
2824
7260
3.45
1.70
6.60
9.60
7.60
3.35
1.50
6.50
8.70
7.00
3.25
1.30
6.40
8.00
6.70
3040
7610
3.70
1.70
10.70
10.10
11.70
3.60
1.50
10.60
9.20
11.10
3.50
1.30
10.50
8.50
10.80
3640
9210
4.45
1.70
10.70
11.60
11.70
4.35
1.50
10.60
10.70
11.10
4.25
1.30
10.50
10.00
10.80
4540
-
5.60
1.70
10.70
13.90
11.70
5.50
1.50
10.60
13.00
11.10
5.40
1.30
10.50
12.30
10.80
Density Level A: For low-density product applications. Recommended for wave solder applications and provides a wider process window for reflow solder
processes. KEMET only recommends wave soldering of EIA 0603, 0805 and 1206 case sizes.
Density Level B: For products with a moderate level of component density. Provides a robust solder attachment condition for reflow solder processes.
Density Level C: For high component density product applications. Before adapting the minimum land pattern variations the user should perform qualification
testing based on the conditions outlined in IPC Standard 7351 (IPC–7351).
Image below based on Density Level B for an EIA 1210 case size.
V1
Y
Y
X
X
C
C
V2
Grid Placement Courtyard
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1069_C0G_HV_HT_200C • 3/24/2016 13
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
HV-HT Series, High Voltage, High Temperature 200°C, C0G Dielectric, 500 – 2,000 VDC (Industrial Grade)
Soldering Process
Recommended Soldering Technique:
• Solder wave or solder reflow for EIA case sizes 0603, 0805 and 1206
• All other EIA case sizes are limited to solder reflow only
Recommended Reflow Soldering Profile:
KEMET’s families of surface mount multilayer ceramic capacitors (SMD MLCCs) are compatible with wave (single or dual), convection,
IR or vapor phase reflow techniques. Preheating of these components is recommended to avoid extreme thermal stress. KEMET’s
recommended profile conditions for convection and IR reflow reflect the profile conditions of the IPC/J-STD-020 standard for moisture
sensitivity testing. These devices can safely withstand a maximum of three reflow passes at these conditions.
Preheat/Soak
Temperature Minimum (TSmin)
Temperature Maximum (TSmax)
Time (tS) from TSmin to TSmax
Ramp-Up Rate (TL to TP)
Termination Finish
SnPb
100% Matte Sn
100°C
150°C
60 – 120 seconds
150°C
200°C
60 – 120 seconds
183°C
217°C
Time Above Liquidous (tL)
60 – 150 seconds
60 – 150 seconds
Peak Temperature (TP)
235°C
260°C
Time Within 5°C of Maximum
Peak Temperature (tP)
20 seconds maximum
30 seconds maximum
Time 25°C to Peak
Temperature
TL
tP
Maximum Ramp Up Rate = 3°C/sec
Maximum Ramp Down Rate = 6°C/sec
tL
Tsmax
Tsmin
tS
3°C/second maximum 3°C/second maximum
Liquidous Temperature (TL)
Ramp-Down Rate (TP to TL)
TP
Temperature
Profile Feature
25
25° C to Peak
Time
6°C/second maximum 6°C/second maximum
6 minutes maximum
8 minutes maximum
Note 1: All temperatures refer to the center of the package, measured on the
capacitor body surface that is facing up during assembly reflow.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1069_C0G_HV_HT_200C • 3/24/2016 14
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
HV-HT Series, High Voltage, High Temperature 200°C, C0G Dielectric, 500 – 2,000 VDC (Industrial Grade)
Table 4 – Performance & Reliability: Test Methods and Conditions
Product Qualification Test Plan
Reliability/Environmental Tests per MIL–STD–202//JESD22
Load Humidity
Low Voltage Humidity
Temperature Cycling
Thermal Shock
Moisture Resistance
85°C/85%RH and 200 VDC maximum, 1,000 Hours
85°C/85%RH, 1.5V, 1,000 Hours
−55°C to +200°C, 50 Cycles
−55°C to +150°C, 20 seconds transfer, 15 minute dwell, 300 Cycles
Cycled Temp/RH 0 V, 10 cycles @ 24 hours each
Physical, Mechanical & Process Tests per MIL–STD 202/JIS–C–6429
Resistance to Solvents
Mechanical Shock and Vibration
Resistance to Soldering Heat
Terminal Strength
Board Flex
Include Aqueous wash chemical – OKEM Clean or equivalent
Method 213: Figure 1, Condition F Method 204: 5 gs for 20 minutes, 12 cycles
Condition B, no per-heat of samples, Single Wave Solder
Force of 1.8 kg for 60 seconds
Appendix 2, Note: 3.0 mm (minimum)
Storage and Handling
Ceramic chip capacitors should be stored in normal working environments. While the chips themselves are quite robust in other
environments, solderability will be degraded by exposure to high temperatures, high humidity, corrosive atmospheres, and long term
storage. In addition, packaging materials will be degraded by high temperature– reels may soften or warp and tape peel force may
increase. KEMET recommends that maximum storage temperature not exceed 40°C and maximum storage humidity not exceed 70%
relative humidity. In addition, temperature fluctuations should be minimized to avoid condensation on the parts and atmospheres should
be free of chlorine and sulfur bearing compounds. For optimized solderability chip stock should be used promptly, preferably within the
time frame outlined in the table below:
1
Termination Finish
Termination Finish Ordering Code1
Storage Life
100% Matte Tin (Sn)
C
1.5 years upon receipt
SnPb (5% Pb min.)
L
1.5 years upon receipt
Gold (Au) 1.97 – 11.8 µin2
E
6 months upon receipt 2
Gold (Au) 30 – 50 µin
F
1.5 years upon receipt
Gold (Au) 100 µin min.
G
1.5 years upon receipt
The fourteenth (14th) character position of the KEMET part number is assigned to identify and/or define the termination
finish. For more information, see “Ordering Information” section of this document.
2
Gold plating option “E” devices should remain in its factory sealed moisture sensitive packaging during storage. If the factory sealed packaging is disturbed please
store any remaining packaged components in a dry box container to prevent oxidation of the termination finish.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1069_C0G_HV_HT_200C • 3/24/2016 15
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
HV-HT Series, High Voltage, High Temperature 200°C, C0G Dielectric, 500 – 2,000 VDC (Industrial Grade)
Construction (Typical)
Detailed Cross Section
Termination Finish:
C = 100% Matte Sn
L = SnPb - 5% Pb min
E = Gold (Au) 1.97 - 11.8 µin
F = Gold (Au) 30 - 50 µin
G = Gold (Au) 100 µin min
Barrier Layer
(Ni)
Dielectric Material
(CaZrO3)
Dielectric Material
(CaZrO3)
End Termination/
External Electrode
(Cu)
Inner Electrodes
(Ni)
End Termination/
External Electrode
(Cu)
Barrier Layer
(Ni)
Termination Finish
(See options at left)
Inner Electrodes
(Ni)
Capacitor Marking (Optional):
Laser marking option is not available on:
•
•
•
•
C0G, Ultra Stable X8R and Y5V dielectric devices
EIA 0402 case size devices
EIA 0603 case size devices with Flexible Termination option.
KPS Commercial and Automotive grade stacked devices.
These capacitors are supplied unmarked only.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1069_C0G_HV_HT_200C • 3/24/2016 16
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
HV-HT Series, High Voltage, High Temperature 200°C, C0G Dielectric, 500 – 2,000 VDC (Industrial Grade)
Tape & Reel Packaging Information
KEMET offers multilayer ceramic chip capacitors packaged in 8, 12, 16 and 24 mm tape on 7" and 13" reels in accordance with EIA
Standard 481. This packaging system is compatible with all tape-fed automatic pick and place systems. See Table 2 for details on
reeling quantities for commercial chips.
Bar Code Label
Anti-Static Reel
®
Embossed Plastic* or
Punched Paper Carrier.
ET
KEM
Chip and KPS Orientation in Pocket
(except 1825 Commercial, and 1825 and 2225 Military)
Sprocket Holes
Embossment or Punched Cavity
8 mm, 12 mm
or 16 mm Carrier Tape
178 mm (7.00")
or
330 mm (13.00")
Anti-Static Cover Tape
(.10 mm (.004") Maximum Thickness)
*EIA 01005, 0201, 0402 and 0603 case sizes available on punched paper carrier only.
Table 5 – Carrier Tape Configuration, Embossed Plastic & Punched Paper (mm)
EIA Case Size
Tape
Size
(W)*
Embossed Plastic
7" Reel
13" Reel
Punched Paper
7" Reel
Pitch (P1)*
13" Reel
Pitch (P1)*
01005 – 0402
8
2
2
0603
8
2/4
2/4
0805
8
4
4
4
4
1206 – 1210
8
4
4
4
4
1805 – 1808
12
4
4
≥ 1812
12
8
8
2824
16
12
12
3040 – 4540
24
16
16
KPS 1210
12
8
8
KPS 1812 & 2220
16
12
12
Array 0508 & 0612
8
4
4
*Refer to Figures 1 & 2 for W and P1 carrier tape reference locations.
*Refer to Tables 6 & 7 for tolerance specifications.
New 2 mm Pitch Reel Options*
Packaging
Ordering Code
(C-Spec)
C-3190
C-3191
C-7081
C-7082
Packaging Type/Options
Automotive grade 7" reel unmarked
Automotive grade 13" reel unmarked
Commercial grade 7" reel unmarked
Commercial grade 13" reel unmarked
* 2 mm pitch reel only available for 0603 EIA case size.
2 mm pitch reel for 0805 EIA case size under development.
Benefits of Changing from 4 mm to 2 mm Pitching Spacing
• Lower placement costs
• Double the parts on each reel results in fewer reel
changes and increased efficiency
• Fewer reels result in lower packaging, shipping and
storage costs, reducing waste
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1069_C0G_HV_HT_200C • 3/24/2016 17
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
HV-HT Series, High Voltage, High Temperature 200°C, C0G Dielectric, 500 – 2,000 VDC (Industrial Grade)
Figure 1 – Embossed (Plastic) Carrier Tape Dimensions
P2
T
T2
Po
ØDo
[10 pitches cumulative
tolerance on tape ± 0.2 mm]
E1
Ao
F
Ko
B1
S1
W
E2
Bo
P1
T1
Center Lines of Cavity
ØD 1
Cover Tape
B 1 is for tape feeder reference only,
including draft concentric about B o.
Embossment
For cavity size,
see Note 1 Table 4
User Direction of Unreeling
Table 6 – Embossed (Plastic) Carrier Tape Dimensions
Metric will govern
Constant Dimensions — Millimeters (Inches)
Tape Size
D0
E1
P0
P2
1.5 +0.10/−0.0
(0.059 +0.004/−0.0)
1.75 ± 0.10
(0.069 ± 0.004)
4.0 ± 0.10
(0.157 ± 0.004)
2.0 ± 0.05
(0.079 ± 0.002)
1.5 +0.10/−0.0
(0.059 +0.004/−0.0)
1.75 ± 0.10
(0.069 ± 0.004)
4.0 ± 0.10
(0.157 ± 0.004)
2.0 ± 0.10
(0.078 ± 0.003)
8 mm
12 mm
16 mm
24 mm
R Reference
Note 2
25.0
(0.984)
30
(1.181)
30
(1.181)
Variable Dimensions — Millimeters (Inches)
Tape Size
Pitch
8 mm
Single (4 mm)
12 mm
Single (4 mm) &
Double (8 mm)
16 mm
Triple (12 mm)
24 mm
16 mm
E2
Minimum
6.25
(0.246)
10.25
(0.404)
14.25
(0.561)
22.25
(0.875)
F
P1
3.5 ± 0.05
(0.138 ± 0.002)
5.5 ± 0.05
(0.217 ± 0.002)
7.5 ± 0.05
(0.138 ± 0.002)
11.5 ± 0.10
(0.452 ± 0.003)
4.0 ± 0.10
(0.157 ± 0.004)
8.0 ± 0.10
(0.315 ± 0.004)
12.0 ± 0.10
(0.157 ± 0.004)
16.0 ± 0.10
(0.629 ± 0.004)
T2
Maximum
2.5
(0.098)
4.6
(0.181)
4.6
(0.181)
3
(0.118)
S1 Minimum
Note 3
T
Maximum
T1
Maximum
0.600
(0.024)
0.600
(0.024)
0.100
(0.004)
5
(0.196)
0.250
(0.009)
0.350
(0.013)
W
Maximum
8.3
(0.327)
12.3
(0.484)
16.3
(0.642)
24.3
(0.956)
A0,B0 & K0
Note 5
1. The embossment hole location shall be measured from the sprocket hole controlling the location of the embossment. Dimensions of embossment location and
hole location shall be applied independent of each other.
2. The tape with or without components shall pass around R without damage (see Figure 6).
3. If S1 < 1.0 mm, there may not be enough area for cover tape to be properly applied (see EIA Standard 481 paragraph 4.3 section b).
4. B1 dimension is a reference dimension for tape feeder clearance only.
5. The cavity defined by A0, B0 and K0 shall surround the component with sufficient clearance that:
(a) the component does not protrude above the top surface of the carrier tape.
(b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed.
(c) rotation of the component is limited to 20° maximum for 8 and 12 mm tapes and 10° maximum for 16 mm tapes (see Figure 3).
(d) lateral movement of the component is restricted to 0.5 mm maximum for 8 and 12 mm wide tape and to 1.0 mm maximum for 16 mm tape (see Figure 4).
(e) for KPS Series product, A0 and B0 are measured on a plane 0.3 mm above the bottom of the pocket.
(f) see Addendum in EIA Standard 481 for standards relating to more precise taping requirements.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1069_C0G_HV_HT_200C • 3/24/2016 18
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
HV-HT Series, High Voltage, High Temperature 200°C, C0G Dielectric, 500 – 2,000 VDC (Industrial Grade)
Figure 2 – Punched (Paper) Carrier Tape Dimensions
P2
T
Po
ØDo
[10 pitches cumulative
tolerance on tape ± 0.2 mm]
A0
F
P1
T1
T1
Top Cover Tape
W
E2
B0
Bottom Cover Tape
E1
G
Cavity Size,
See
Note 1, Table 7
Center Lines of Cavity
Bottom Cover Tape
User Direction of Unreeling
Table 7 – Punched (Paper) Carrier Tape Dimensions
Metric will govern
Constant Dimensions — Millimeters (Inches)
Tape Size
D0
E1
P0
P2
8 mm
1.5 +0.10/−0.0
(0.059 +0.004/−0.0)
1.75 ±0.10
(0.069 ±0.004)
4.0 ±0.10
(0.157 ±0.004)
2.0 ±0.05
(0.079 ±0.002)
G Minimum
0.10
(0.004)
Maximum
R Reference
Note 2
0.75
(0.030)
25
(0.984)
T Maximum
W Maximum
A0 B 0
1.1
(0.098)
8.3
(0.327)
8.3
(0.327)
T1 Maximum
Variable Dimensions — Millimeters (Inches)
Tape Size
Pitch
8 mm
Half (2 mm)
8 mm
Single (4 mm)
E2 Minimum
6.25
(0.246)
F
3.5 ±0.05
(0.138 ±0.002)
P1
2.0 ±0.05
(0.079 ±0.002)
4.0 ±0.10
(0.157 ±0.004)
Note 1
1. The cavity defined by A0, B0 and T shall surround the component with sufficient clearance that:
a) the component does not protrude beyond either surface of the carrier tape.
b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed.
c) rotation of the component is limited to 20° maximum (see Figure 3).
d) lateral movement of the component is restricted to 0.5 mm maximum (see Figure 4).
e) see Addendum in EIA Standard 481 for standards relating to more precise taping requirements.
2. The tape with or without components shall pass around R without damage (see Figure 6).
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1069_C0G_HV_HT_200C • 3/24/2016 19
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
HV-HT Series, High Voltage, High Temperature 200°C, C0G Dielectric, 500 – 2,000 VDC (Industrial Grade)
Packaging Information Performance Notes
1. Cover Tape Break Force: 1.0 Kg minimum.
2. Cover Tape Peel Strength: The total peel strength of the cover tape from the carrier tape shall be:
Tape Width
Peel Strength
8 mm
0.1 to 1.0 Newton (10 to 100 gf)
12 and 16 mm
0.1 to 1.3 Newton (10 to 130 gf)
24 mm
0.1 to 1.6 Newton (10 to 160 gf)
The direction of the pull shall be opposite the direction of the carrier tape travel. The pull angle of the carrier tape shall be 165° to 180°
from the plane of the carrier tape. During peeling, the carrier and/or cover tape shall be pulled at a velocity of 300 ±10 mm/minute.
3. Labeling: Bar code labeling (standard or custom) shall be on the side of the reel opposite the sprocket holes. Refer to EIA
Standards 556 and 624.
Figure 3 – Maximum Component Rotation
°
T
Maximum Component Rotation
Top View
Maximum Component Rotation
Side View
Typical Pocket Centerline
Tape
Width (mm)
8,12
16 – 200
Bo
Maximum
Rotation (
20
10
°
T)
Typical Component Centerline
Ao
0.5 mm maximum
0.5 mm maximum
Tape
Maximum
Width (mm) Rotation (
8,12
20
16 – 56
10
72 – 200
5
°
S)
Figure 5 – Bending Radius
Figure 4 – Maximum Lateral Movement
8 mm & 12 mm Tape
°
s
Embossed
Carrier
Punched
Carrier
16 mm Tape
1.0 mm maximum
1.0 mm maximum
R
Bending
Radius
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
R
C1069_C0G_HV_HT_200C • 3/24/2016 20
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
HV-HT Series, High Voltage, High Temperature 200°C, C0G Dielectric, 500 – 2,000 VDC (Industrial Grade)
Figure 6 – Reel Dimensions
Full Radius,
See Note
W3 (Includes
Access Hole at
Slot Location
(Ø 40 mm minimum)
flange distortion
at outer edge)
W2 (Measured at hub)
D
A
(See Note)
N
C
(Arbor hole
diameter)
B
(see Note)
W1 (Measured at hub)
If present,
tape slot in core
for tape start:
2.5 mm minimum width x
10.0 mm minimum depth
Note: Drive spokes optional; if used, dimensions B and D shall apply.
Table 8 – Reel Dimensions
Metric will govern
Constant Dimensions — Millimeters (Inches)
Tape Size
8 mm
12 mm
16 mm
24 mm
A
B Minimum
C
D Minimum
178 ±0.20
(7.008 ±0.008)
or
330 ±0.20
(13.000 ±0.008)
1.5
(0.059)
13.0 +0.5/−0.2
(0.521 +0.02/−0.008)
20.2
(0.795)
1.2
(0.047)
13.0 + −0.2
(0.521 + −0.008)
21
(0.826)
N Minimum
W1
W2 Maximum
W3
50
(1.969)
8.4 +1.5/−0.0
(0.331 +0.059/−0.0)
12.4 +2.0/−0.0
(0.488 +0.078/−0.0)
16.4 +2.0/−0.0
(0.646 +0.078/−0.0)
25 +1.0/−0.0
(0.984 +0.039/−0.0)
14.4
(0.567)
18.4
(0.724)
22.4
(0.882)
27.4 +1.0/−1.0
(1.078+0.039/−0.039)
Shall accommodate tape width
without interference
Variable Dimensions — Millimeters (Inches)
Tape Size
8 mm
12 mm
16 mm
24 mm
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1069_C0G_HV_HT_200C • 3/24/2016 21
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
HV-HT Series, High Voltage, High Temperature 200°C, C0G Dielectric, 500 – 2,000 VDC (Industrial Grade)
Figure 7 – Tape Leader & Trailer Dimensions
Embossed Carrier
Carrier Tape
Punched Carrier
8 mm & 12 mm only
END
Round Sprocket Holes
START
Top Cover Tape
Elongated Sprocket Holes
(32 mm tape and wider)
Trailer
160 mm Minimum
Components
100 mm
Minimum Leader
400 mm Minimum
Top Cover Tape
Figure 8 – Maximum Camber
Elongated sprocket holes
(32 mm & wider tapes)
Carrier Tape
Round Sprocket Holes
1 mm Maximum, either direction
Straight Edge
250 mm
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1069_C0G_HV_HT_200C • 3/24/2016 22
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
HV-HT Series, High Voltage, High Temperature 200°C, C0G Dielectric, 500 – 2,000 VDC (Industrial Grade)
Waffle Tray Packaging Information – 2" x 2" w/ Static Protection
Figure 9 – Waffle Tray Dimensions – Inches (Millimeters)
M
0.10 (2.54) X 45°
M3
M1
Y
M2
X
X
A
Z
0.156 +0.002/-0.003
(3.962 +0.051/-0.076)
0.098
(2.489)
0.086
(2.184)
2.000 ±0.004 SQ
(50.800 ±0.102 SQ)
90°
0.004
(0.102)
1.800 ±0.004 SQ
(45.720 ±0.102 SQ)
1.812 ±0.004 SQ
(46.025 ±0.102 SQ)
STANDARD RIB MATRIX
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1069_C0G_HV_HT_200C • 3/24/2016 23
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
HV-HT Series, High Voltage, High Temperature 200°C, C0G Dielectric, 500 – 2,000 VDC (Industrial Grade)
Table 9A – Waffle Tray Dimensions – Inches
Case Size
EIA (in)
0402
0504
0603
0805
1005
12061,2
12061,3
1210
1808
1812
1825
2220
2225
Metric (mm)
1005
1210
1608
2012
2512
3216
3216
3225
4520
4532
4564
5650
5664
M
±0.003
0.175
0.235
0.175
0.232
0.230
0.194
0.250
0.217
0.271
0.271
0.318
0.318
0.318
M1
±0.003
0.153
0.226
0.153
0.186
0.240
0.228
0.250
0.244
0.285
0.285
0.362
0.362
0.362
2" x 2" Waffle Tray Dimensions – Inches
M2
±0.002
0.077
0.172
0.077
0.181
0.190
0.193
0.375
0.215
0.286
0.286
0.424
0.424
0.424
M3
±0.002
0.110
0.170
0.110
0.171
0.140
0.124
0.167
0.174
0.243
0.243
0.34
0.34
0.34
X
±0.002
0.073
0.080
0.073
0.062
0.060
0.067
0.100
0.110
0.150
0.150
0.24
0.24
0.24
Y
±0.002
0.042
0.090
0.042
0.092
0.110
0.130
0.200
0.145
0.200
0.200
0.32
0.32
0.32
Z
±0.003
0.041
0.055
0.041
0.036
0.075
0.065
0.070
0.080
0.075
0.075
0.032
0.032
0.032
A°
± 1/2°
7
5
7
10
5
5
5
5
5
5
5
5
5
MATRIX
(X x Y)
16 X 23
10 X 10
16 X 23
10 X 10
12 X 9
14 X 9
10 X 5
10 X 8
7X6
7X6
5X4
5X4
5X4
Packaging Quantity
(pcs/unit packaging)
368
100
368
100
108
126
50
80
42
42
20
20
20
Packaging of 1206 (3216 metric) case size capacitors is dependent upon the nominal chip thickness of the device. See "Capacitance Range/Selection Waterfall"
and "Chip Thickness/Tape & Reel Packaging Quantities" to identify the nominal chip thickness of the capacitor.
2
Assigned to 1206 (3216 metric) case size capacitors with nominal thickness of ≤ 1.25mm (0.049 inches).
3
Assigned to 1206 (3216 metric) case size capacitors with nominal thickness of > 1.25mm (0.049 inches).
1
Table 9B – Waffle Tray Dimensions – Millimeters
Case Size
EIA (in)
0402
0504
0603
0805
1005
12061,2
12061,3
1210
1808
1812
1825
2220
2225
Metric (mm)
1005
1210
1608
2012
2512
3216
3216
3225
4520
4532
4564
5650
5664
M
±0.08
4.45
5.97
4.45
5.89
5.84
4.93
6.35
5.51
6.88
6.88
8.08
8.08
8.08
M1
±0.08
3.89
5.74
3.89
4.72
6.10
5.79
6.35
6.20
7.24
7.24
9.19
9.19
9.19
2" x 2" Waffle Tray Dimensions – Millimeters
M2
±0.05
1.96
4.37
1.96
4.60
4.83
4.90
9.53
5.46
7.26
7.26
10.77
10.77
10.77
M3
±0.05
2.79
4.32
2.79
4.34
3.56
3.15
4.24
4.42
6.17
6.17
8.64
8.64
8.64
X
±0.05
1.85
2.03
1.85
1.57
1.52
1.70
2.54
2.79
3.81
3.81
6.10
6.10
6.10
Y
±0.05
1.07
2.29
1.07
2.34
2.79
3.30
5.08
3.68
5.08
5.08
8.13
8.13
8.13
Z
±0.08
1.04
1.40
1.04
0.91
1.91
1.65
1.78
2.03
1.91
1.91
0.81
0.81
0.81
A°
± 1/2°
7
5
7
10
5
5
5
5
5
5
5
5
5
MATRIX
(X x Y)
16 X 23
10 X 10
16 X 23
10 X 10
12 X 9
14 X 9
10 X 5
10 X 8
7X6
7X6
5X4
5X4
5X4
Packaging Quantity
(pcs/unit packaging)
368
100
368
100
108
126
50
80
42
42
20
20
20
Packaging of 1206 (3216 metric) case size capacitors is dependent upon the nominal chip thickness of the device. See "Capacitance Range/Selection Waterfall"
and "Chip Thickness/Tape & Reel Packaging Quantities" to identify the nominal chip thickness of the capacitor.
2
Assigned to 1206 (3216 metric) case size capacitors with nominal thickness of ≤ 1.25mm (0.049 inches).
3
Assigned to 1206 (3216 metric) case size capacitors with nominal thickness of > 1.25mm (0.049 inches).
1
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C1069_C0G_HV_HT_200C • 3/24/2016 24
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
HV-HT Series, High Voltage, High Temperature 200°C, C0G Dielectric, 500 – 2,000 VDC (Industrial Grade)
KEMET Corporation
World Headquarters
Europe
Asia
Southern Europe
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Tel: 39-051-939111
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Mailing Address:
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Note: KEMET reserves the right to modify minor details of internal and external construction at any time in the interest of product improvement. KEMET does not
assume any responsibility for infringement that might result from the use of KEMET Capacitors in potential circuit designs. KEMET is a registered trademark of
KEMET Electronics Corporation.
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C1069_C0G_HV_HT_200C • 3/24/2016 25
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
HV-HT Series, High Voltage, High Temperature 200°C, C0G Dielectric, 500 – 2,000 VDC (Industrial Grade)
Disclaimer
All product specifications, statements, information and data (collectively, the “Information”) in this datasheet are subject to change. The customer is responsible for checking and
verifying the extent to which the Information contained in this publication is applicable to an order at the time the order is placed.
All Information given herein is believed to be accurate and reliable, but it is presented without guarantee, warranty, or responsibility of any kind, expressed or implied.
Statements of suitability for certain applications are based on KEMET Electronics Corporation’s (“KEMET”) knowledge of typical operating conditions for such applications, but are
not intended to constitute – and KEMET specifically disclaims – any warranty concerning suitability for a specific customer application or use. The Information is intended for use only
by customers who have the requisite experience and capability to determine the correct products for their application. Any technical advice inferred from this Information or otherwise
provided by KEMET with reference to the use of KEMET’s products is given gratis, and KEMET assumes no obligation or liability for the advice given or results obtained.
Although KEMET designs and manufactures its products to the most stringent quality and safety standards, given the current state of the art, isolated component failures may still
occur. Accordingly, customer applications which require a high degree of reliability or safety should employ suitable designs or other safeguards (such as installation of protective
circuitry or redundancies) in order to ensure that the failure of an electrical component does not result in a risk of personal injury or property damage.
Although all product–related warnings, cautions and notes must be observed, the customer should not assume that all safety measures are indicted or that other measures may not
be required.
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C1069_C0G_HV_HT_200C • 3/24/2016 26