LD6836 series Ultra low dropout regulators, low noise, 300 mA Rev. 2 — 5 October 2012 Product data sheet 1. Product profile 1.1 General description The LD6836 series is a small-size Low DropOut regulator (LDO) family with a typical voltage drop of 90 mV at 300 mA current rating. Operating input voltages can range from 2.3 V to 5.5 V. The devices are available with fixed output voltages between 1.2 V and 3.6 V. In disabled mode the LD6836x/xxH devices show a high-ohmic state at the output pin while the LD6836x/xxP devices contain a pull-down switching transistor to provide a low-ohmic output state (auto discharge function). The LD6836CX4 and LD6836CX4/C devices are in a 0.4 mm pitch Wafer-Level Chip-Scale Package (WLCSP) making them ideal for use in portable applications requiring component miniaturization. The LD6836TD devices are in a small SOT753 Surface-Mounted Device (SMD) plastic package. All devices are manufactured in monolithic silicon technology. 1.2 Features and benefits 300 mA output current rating Input voltage range 2.3 V to 5.5 V Fixed output voltage between 1.2 V and 3.6 V Dropout voltage 90 mV at 300 mA output rating Low quiescent current in shutdown mode (typical 0.1 A) 30 V RMS output noise voltage (typical value) at 10 Hz to 100 kHz Turn-on time 150 s 55 dB Power Supply Rejection Ratio (PSRR) at 1 kHz Over-temperature protection Output current limiter LD6836x/xxH: high-ohmic (3-state) output state when disabled LD6836x/xxP: low-ohmic output state when disabled (auto discharge function) Integrated ElectroStatic Discharge (ESD) protection up to 10 kV Human Body Model (HBM) WLCSP with 0.4 mm pitch and package size of 0.76 mm 0.76 mm 0.47 mm Small SOT753 SMD plastic package (SOT23-5 compatible) Pb-free, Restriction of Hazardous Substances (RoHS) compliant and free of halogen and antimony (dark green compliant) LD6836 series NXP Semiconductors Ultra low dropout regulators, low noise, 300 mA 1.3 Applications Analog and digital interfaces requiring lower than standard supply voltages in mobile appliances such as smartphones, mobile phone handsets and cordless telephones. Other typical applications are digital still cameras, mobile internet devices, personal navigation devices and portable media players. 2. Pinning information 2.1 Pinning bump A1 index area 1 2 A 5 4 B 001aao107 1 Fig 1. 2 transparent top view, solder balls facing down 3 Pin configuration for SOT753 Fig 2. Pin configuration for WLCSP4 2.2 Pin description Table 1. Symbol Pin Description IN 1 regulator input voltage GND 2 supply ground EN 3 device enable input; active HIGH n.c. 4 not connected OUT 5 regulator output voltage Table 2. LD6836_SER Product data sheet Pin description for SOT753 Pin description for WLCSP4 Symbol Pin Description GND A1 supply ground EN A2 device enable input; active HIGH OUT B1 regulator output voltage IN B2 regulator input voltage All information provided in this document is subject to legal disclaimers. Rev. 2 — 5 October 2012 © NXP B.V. 2012. All rights reserved. 2 of 28 LD6836 series NXP Semiconductors Ultra low dropout regulators, low noise, 300 mA 3. Ordering information Table 3. Ordering information Type number Package Name Description LD6836CX4 WLCSP4 wafer-level chip-scale package; 4 bumps (2 2) LD6836CX4/C WLCSP4 wafer-level chip-scale package with backside coating; 4 bumps (2 2) [1] - LD6836TD - plastic surface-mounted package; 5 leads SOT753 [1] Version [1] - Size 0.76 mm 0.76 mm. 3.1 Ordering options Further information on output voltage is available on request; see Section 18 “Contact information”. Table 4. Type number Nominal output voltage Type number Nominal output voltage LD6836CX4/12H 1.2 V LD6836CX4/25H 2.5 V LD6836CX4/13H 1.3 V LD6836CX4/27H 2.7 V LD6836CX4/14H 1.4 V LD6836CX4/28H 2.8 V LD6836CX4/16H 1.6 V LD6836CX4/29H 2.9 V LD6836CX4/18H 1.8 V LD6836CX4/30H 3.0 V LD6836CX4/20H 2.0 V LD6836CX4/33H 3.3 V LD6836CX4/22H 2.2 V LD6836CX4/36H 3.6 V LD6836CX4/23H 2.3 V - - Table 5. LD6836_SER Product data sheet Type number extension of high-ohmic output in WLCSP4 Type number extension of pull-down output in WLCSP4 Type number Nominal output voltage Type number Nominal output voltage LD6836CX4/12P 1.2 V LD6836CX4/23P 2.3 V LD6836CX4/13P 1.3 V LD6836CX4/25P 2.5 V LD6836CX4/14P 1.4 V LD6836CX4/27P 2.7 V LD6836CX4/16P 1.6 V LD6836CX4/28P 2.8 V LD6836CX4/18P 1.8 V LD6836CX4/29P 2.9 V LD6836CX4/20P 2.0 V LD6836CX4/30P 3.0 V LD6836CX4/21P 2.1 V LD6836CX4/33P 3.3 V LD6836CX4/22P 2.2 V LD6836CX4/36P 3.6 V All information provided in this document is subject to legal disclaimers. Rev. 2 — 5 October 2012 © NXP B.V. 2012. All rights reserved. 3 of 28 LD6836 series NXP Semiconductors Ultra low dropout regulators, low noise, 300 mA Table 6. Type number Nominal output voltage Type number Nominal output voltage LD6836CX4/C12P 1.2 V LD6836CX4/C23P 2.3 V LD6836CX4/C13P 1.3 V LD6836CX4/C25P 2.5 V LD6836CX4/C14P 1.4 V LD6836CX4/C27P 2.7 V LD6836CX4/C16P 1.6 V LD6836CX4/C28P 2.8 V LD6836CX4/C18P 1.8 V LD6836CX4/C29P 2.9 V LD6836CX4/C20P 2.0 V LD6836CX4/C30P 3.0 V LD6836CX4/C21P 2.1 V LD6836CX4/C33P 3.3 V LD6836CX4/C22P 2.2 V LD6836CX4/C36P 3.6 V Table 7. Product data sheet Type number extension of high-ohmic output in SOT753 Type number Nominal output voltage Type number Nominal output voltage LD6836TD/12H 1.2 V LD6836TD/23H 2.3 V LD6836TD/13H 1.3 V LD6836TD/27H 2.7 V LD6836TD/14H 1.4 V LD6836TD/28H 2.8 V LD6836TD/16H 1.6 V LD6836TD/29H 2.9 V LD6836TD/18H 1.8 V LD6836TD/30H 3.0 V LD6836TD/20H 2.0 V LD6836TD/33H 3.3 V LD6836TD/22H 2.2 V LD6836TD/36H 3.6 V Table 8. LD6836_SER Type number extension of pull-down output in WLCSP4 with backside coating Type number extension of pull-down output in SOT753 Type number Nominal output voltage Type number Nominal output voltage LD6836TD/12P 1.2 V LD6836TD/23P 2.3 V LD6836TD/13P 1.3 V LD6836TD/25P 2.5 V LD6836TD/14P 1.4 V LD6836TD/27P 2.7 V LD6836TD/16P 1.6 V LD6836TD/28P 2.8 V LD6836TD/18P 1.8 V LD6836TD/29P 2.9 V LD6836TD/20P 2.0 V LD6836TD/30P 3.0 V LD6836TD/21P 2.1 V LD6836TD/33P 3.3 V LD6836TD/22P 2.2 V LD6836TD/36P 3.6 V All information provided in this document is subject to legal disclaimers. Rev. 2 — 5 October 2012 © NXP B.V. 2012. All rights reserved. 4 of 28 LD6836 series NXP Semiconductors Ultra low dropout regulators, low noise, 300 mA 4. Block diagram VIN VOUT R1 VEN Vreference GENERATOR THERMAL PROTECTION R2 OVERCURRENT PROTECTION GND 001aan756 Fig 3. Block diagram of LD6836x/xxH VIN VOUT R1 VEN Vreference GENERATOR THERMAL PROTECTION R2 OVER CURRENT PROTECTION GND Fig 4. LD6836_SER Product data sheet 001aan299 Block diagram of LD6836x/xxP (auto discharge function) All information provided in this document is subject to legal disclaimers. Rev. 2 — 5 October 2012 © NXP B.V. 2012. All rights reserved. 5 of 28 LD6836 series NXP Semiconductors Ultra low dropout regulators, low noise, 300 mA 5. Limiting values Table 9. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V). Symbol Parameter Conditions VIN voltage on pin IN 4 ms transient total power dissipation Ptot Min Max Unit 0.5 +6.0 V LD6836CX4, LD6836CX4/C [1] - 770 mW LD6836TD [1] - 800 mW Tstg storage temperature 55 +150 C Tj junction temperature 40 +125 C Tamb ambient temperature VESD electrostatic discharge voltage 40 +85 C human body model level 6 [2] - 10 kV machine model class 3 [3] - 400 V [1] The (absolute) maximum power dissipation depends on the junction temperature Tj. Higher power dissipation is allowed with lower ambient temperatures. The conditions to determine the specified values are Tamb = 25 C and the use of a two layer Printed-Circuit Board (PCB). [2] According to IEC 61340-3-1. [3] According to JESD22-A115C. 6. Recommended operating conditions Table 10. Operating conditions Voltages are referenced to GND (ground = 0 V). Symbol Parameter Tamb Tj Conditions Min Typ Max Unit ambient temperature 40 - +85 C junction temperature - - +125 C voltage on pin IN 2.3 - 5.5 V voltage on pin EN 0 - VIN V 0.7 1.0 - F Pin IN VIN Pin EN VEN Pin OUT CL(ext) [1] [1] external load capacitance See Section 10.1 “Capacitor values”. LD6836_SER Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 5 October 2012 © NXP B.V. 2012. All rights reserved. 6 of 28 LD6836 series NXP Semiconductors Ultra low dropout regulators, low noise, 300 mA 7. Thermal characteristics Table 11. Symbol Rth(j-a) Thermal characteristics Parameter Conditions thermal resistance from junction to ambient LD6836CX4, LD6836CX4/C LD6836TD Typ Unit [1][2] 130 K/W [1][2] 125 K/W [1] The overall Rth(j-a) can vary depending on the board layout. To minimize the effective Rth(j-a), all pins must have a solid connection to larger Cu layer areas for example to the power and ground layer. In multi-layer PCB applications, the second layer is used to create a large heat spreader area directly below the LDO. If this layer is either ground or power, it is connected with several vias to the top layer connecting to the device ground or supply. Avoid the use of solder-stop varnish under the chip. [2] Use the measurement data given for a rough estimation of the Rth(j-a) in your application. The actual Rth(j-a) value can vary in applications using different layer stacks and layouts. 8. Characteristics Table 12. Electrical characteristics At recommended input voltages and Tamb = 40 C to +85 C; voltages are referenced to GND (ground = 0 V); unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit dropout voltage IOUT = 300 mA; VIN < VO(nom) LD6836CX4, LD6836CX4/C - 90 160 mV LD6836TD - 100 200 mV Tamb = +25 C 3 0.5 +3 % 30 C Tamb +85 C 4 - +4 % Output voltage Vdo VO output voltage variation [1] VOUT < 1.8 V; IOUT = 1 mA VOUT 1.8 V; IOUT = 1 mA Tamb = +25 C 2 0.5 +2 % 30 C Tamb +85 C 3 - +3 % 0.1 - +0.1 %/V - 0.0025 0.01 %/mA - - 300 mA 350 - - mA 350 - - mA - 600 - mA Line regulation error VO/(VOxVI) relative output voltage variation with input voltage VIN = (VO(nom) + 0.2 V) to 5.5 V [1] Load regulation error VO/(VOxIO) relative output voltage variation with output current 1 mA IOUT 300 mA Output current IOUT IOM current on pin OUT peak output current VIN = (VO(nom) + 0.2 V) to 5.5 V VO(nom) > 1.8V; [1] VOUT = 0.95 VO(nom) VO(nom) < 1.8 V; VOUT = 0.9 VO(nom) Isc short-circuit current LD6836_SER Product data sheet pin OUT All information provided in this document is subject to legal disclaimers. Rev. 2 — 5 October 2012 © NXP B.V. 2012. All rights reserved. 7 of 28 LD6836 series NXP Semiconductors Ultra low dropout regulators, low noise, 300 mA Table 12. Electrical characteristics …continued At recommended input voltages and Tamb = 40 C to +85 C; voltages are referenced to GND (ground = 0 V); unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit Regulator quiescent current quiescent current Iq VEN = 1.4 V; IOUT = 0 mA - 70 100 A VEN = 1.4 V; 1 mA IOUT 300 mA - 155 250 A VEN 0.4 V - 0.1 1 A - 55 - dB Ripple rejection and output noise [1] PSRR power supply rejection ratio VIN = VO(nom) + 1.0 V; IOUT = 30 mA; fripple = 1 kHz Vn(o)(RMS) RMS output noise voltage fripple = 10 Hz to 100 kHz; CL(ext) = 1 F - 30 - V 0 - 0.4 V 1.1 - 5.5 V - 150 - s - 300 - s - 100 - Enable input and timing VIL LOW-level input voltage pin EN VIH HIGH-level input voltage pin EN regulator start-up time VIN = 5.5 V; VOUT = 0.95 VO(nom); IOUT = 300 mA; CL(ext) = 1 F tstartup(reg) [1] LD6836x/xxP; auto discharge function tsd(reg) regulator shutdown time Rpd pull-down resistance VIN = 5.5 V; VOUT = 0.05 VO(nom); CL(ext) = 1 F Over-temperature protection Tsd shutdown temperature - 160 - C Tsd(hys) shutdown temperature hysteresis - 20 - K [1] VO(nom) = nominal output voltage (device specific). LD6836_SER Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 5 October 2012 © NXP B.V. 2012. All rights reserved. 8 of 28 LD6836 series NXP Semiconductors Ultra low dropout regulators, low noise, 300 mA 9. Dynamic behavior 9.1 Power Supply Rejection Ratio (PSRR) PSRR stands for the capability of the regulator to suppress unwanted signals on the input voltage like noise or ripples. V out ripple for all frequencies PSRR dB = 20 log -------------------------V in ripple 3655 G% ,287 ,287 ,287 ,287 ,287 ,287 P$ P$ P$ P$ P$ P$ 3655 G% DDD ,287 ,287 ,287 ,287 ,287 ,287 P$ P$ P$ P$ P$ P$ IUHTXHQF\ +] VIN = 4.6 V; VOUT = 3.6 V; CL(ext) = 1 F Fig 5. IUHTXHQF\ +] VIN = 3.5 V; VOUT = 2.5 V; CL(ext) = 1 F PSRR for LD6836CX4/36H Fig 6. 3655 G% PSRR of LD6836TD/25H DDD ,287 ,287 ,287 ,287 ,287 ,287 P$ P$ P$ P$ P$ P$ IUHTXHQF\ +] VIN = 2.2 V; VOUT = 1.2 V; CL(ext) = 1 F Fig 7. PSRR of LD6836CX4/12H LD6836_SER Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 5 October 2012 © NXP B.V. 2012. All rights reserved. 9 of 28 LD6836 series NXP Semiconductors Ultra low dropout regulators, low noise, 300 mA 9.2 Dropout The dropout voltage is defined as the smallest input to output voltage difference at a specified load current when the regulator operates within its linear region. This means that the input voltage is below the nominal output voltage value and the pass transistor works as a plain resistor. A small dropout voltage guarantees lower power consumption and efficiency maximization. DDD 9GR P9 Fig 8. 7DPE & 7DPE & 7DPE & DDD 9GR P9 ,287 P$ Dropout voltage as a function of output current for LD6836CX4/25x Fig 9. 7DPE & 7DPE & 7DPE & ,287 P$ Dropout voltage as a function of output current for LD6836TD/36x 9.3 Accuracy The LD6836 series guarantees high accuracy of the nominal output voltage. DDD ,287 P$ 9287 9 ,287 P$ ,287 P$ ,287 P$ ,287 P$ 9,1 9 Fig 10. Working voltage tolerance for LD6836CX4/25x LD6836_SER Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 5 October 2012 © NXP B.V. 2012. All rights reserved. 10 of 28 LD6836 series NXP Semiconductors Ultra low dropout regulators, low noise, 300 mA 9.4 Quiescent current Quiescent (or ground) current is the difference between input and output current of the regulator. DDD ,*1' 7DPE & IOUT = 0 mA Fig 11. Quiescent current for LD6836CX4/25H 9.5 Noise Output noise voltage of an LDO circuit is given as noise density or RMS output noise voltage over a defined frequency spectrum (10 Hz to 100 kHz). Permanent conditions are a constant output current and a ripple-free input voltage. The output noise voltage is generated by the LDO regulator. DDD QRLVH ȝ9Y+] ,287 ,287 ,287 ,287 ,287 ,287 P$ P$ P$ P$ P$ P$ IUHTXHQF\ +] Fig 12. Noise density for LD6836x/25x LD6836_SER Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 5 October 2012 © NXP B.V. 2012. All rights reserved. 11 of 28 LD6836 series NXP Semiconductors Ultra low dropout regulators, low noise, 300 mA 9.6 Line Regulation Line regulation is the capability of the circuit to maintain the nominal output voltage while varying the input voltage. DDD 9,1 9 9287 9 9287 DDD 9287 9,1 9 9287 9 9,1 WLPH PV 9,1 IOUT = 300 mA WLPH PV IOUT = 300 mA Fig 13. Line regulation for LD6836CX4/33P Fig 14. Line regulation for LD6836CX4/25P 9.7 Load Regulation Load regulation is the capability of the circuit to maintain the nominal output voltage while varying the output current. DDD ,287 $ 9287 9 9287 DDD ,287 $ 9287 9 9287 ,287 ,287 WLPH PV VIN = 5.5 V Product data sheet WLPH PV VIN = 5.5 V Fig 15. Load regulation for LD6836CX4/33P LD6836_SER Fig 16. Load regulation for LD6836CX4/25P All information provided in this document is subject to legal disclaimers. Rev. 2 — 5 October 2012 © NXP B.V. 2012. All rights reserved. 12 of 28 LD6836 series NXP Semiconductors Ultra low dropout regulators, low noise, 300 mA 9.8 Start-up and shutdown Start-up time defines the time needed for the LDO to achieve 95 % of its typical output voltage level after activation via the enable pin. Shutdown time defines the time needed for the LDO to pull-down the output voltage to 10 % of its nominal output voltage after deactivation via the enable pin. DDD 9HQDEOH 9 9287 9(1 DDD 9HQDEOH 9 9287 9 9287 9 9(1 9287 WLPH PV Fig 17. Start-up for LD6836x/33P WLPH PV Fig 18. Shutdown for LD6836x/25P 9.9 Enable threshold voltage An active HIGH signal enables the LDO when the signal exceeds the minimum input HIGH voltage threshold. The LDO is in Off state as long the signal is below the maximum LOW threshold. The input voltage threshold is independent from the LDO input voltage. DDD 9287 9 +,*+WR/2: /2:WR+,*+ 9(1 9 Fig 19. Enable threshold voltage LD6836_SER Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 5 October 2012 © NXP B.V. 2012. All rights reserved. 13 of 28 LD6836 series NXP Semiconductors Ultra low dropout regulators, low noise, 300 mA 10. Application information 10.1 Capacitor values The LD6836 series require external capacitors at the output to guarantee a stable regulator behavior. Do not under-run the specified minimum Equivalent Series Resistance (ESR). The absolute value of the total capacitance attached to the output pin OUT influences the shutdown time (tsd(reg)) of the LD6836 series. Also an input capacitor is recommended to keep the input voltage stable. Table 13. External load capacitor Symbol Parameter Conditions Ci(ext) external input capacitance [1] CL(ext) external load capacitance [1] ESR equivalent series resistance [1] Min Typ Max Unit 0.7 1.0 0.7 1.0 - F 5 - 500 m F The minimum value of capacitance for stability and correct operation is 0.7 F. The specified capacitor tolerance is 30 % or better over the temperature and operating conditions range. The recommended capacitor type is X7R to meet the full device temperature specification of 40 C to +125 C. IN IN OUT EN GND 1μF OUT 1μF 001aan647 Fig 20. Application diagram LD6836_SER Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 5 October 2012 © NXP B.V. 2012. All rights reserved. 14 of 28 LD6836 series NXP Semiconductors Ultra low dropout regulators, low noise, 300 mA 11. Test information 11.1 Quality information This product has been qualified in accordance with NX1-00023 NXP Semiconductors Quality and Reliability Specification and is suitable for use in consumer applications. 12. Marking 12.1 WLCSP4 WLCSP dies are laser marked with the following information (see Table 14 to 16 and Figure 21): 1. Shaded area: marking of pin A1 2. The character N gives the version code and describes the output mode of the LDO. If the code is legible, the LDO has an integrated pull down transistor (“P“ version). If the character N is rotated counterclockwise by 90°, the LDO is a “H“ version. 3. “YYY” symbolizes a placeholder for some characters of the lot ID 7UDQVSDUHQWWRSYLHZ DDD Fig 21. Marking WLCSP4 Table 14. LD6836_SER Product data sheet Marking code of high-ohmic output Type number Nominal output voltage Marking code LD6836CX4/12H 1.2 V A LD6836CX4/27H 2.7 V P All information provided in this document is subject to legal disclaimers. Rev. 2 — 5 October 2012 © NXP B.V. 2012. All rights reserved. 15 of 28 LD6836 series NXP Semiconductors Ultra low dropout regulators, low noise, 300 mA Table 15. Marking of pull-down output Type number Nominal Marking output voltage code Type number Nominal Marking output voltage code LD6836CX4/12P 1.2 V A LD6836CX4/23P 2.3 V L LD6836CX4/13P 1.3 V B LD6836CX4/25P 2.5 V N LD6836CX4/14P 1.4 V C LD6836CX4/27P 2.7 V P LD6836CX4/16P 1.6 V E LD6836CX4/28P 2.8 V Q LD6836CX4/18P 1.8 V G LD6836CX4/29P 2.9 V R LD6836CX4/20P 2.0 V I LD6836CX4/30P 3.0 V S LD6836CX4/21P 2.1 V J LD6836CX4/33P 3.3 V V LD6836CX4/22P 2.2 V K LD6836CX4/36P 3.6 V Y Table 16. Marking code of pull-down output with backside coating Type number Nominal Marking output voltage code Type number Nominal Marking output voltage code LD6836CX4/C12P 1.2 V A LD6836CX4/C23P 2.3 V L LD6836CX4/C13P 1.3 V B LD6836CX4/C25P 2.5 V N LD6836CX4/C14P 1.4 V C LD6836CX4/C27P 2.7 V P LD6836CX4/C16P 1.6 V E LD6836CX4/C28P 2.8 V Q LD6836CX4/C18P 1.8 V G LD6836CX4/C29P 2.9 V R LD6836CX4/C20P 2.0 V I LD6836CX4/C30P 3.0 V S LD6836CX4/C21P 2.1 V J LD6836CX4/C33P 3.3 V V LD6836CX4/C22P 2.2 V K LD6836CX4/C36P 3.6 V Y 12.2 SOT753 ;<= [[ [[[[ WUDQVSDUHQWWRSYLHZ DDD Circle (bottom left) = marking of pin 1 XYZ = version; for marking code corresponding to type number see Table 17 and 18 All other characters = lot ID information Fig 22. Marking SOT753 LD6836_SER Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 5 October 2012 © NXP B.V. 2012. All rights reserved. 16 of 28 LD6836 series NXP Semiconductors Ultra low dropout regulators, low noise, 300 mA Table 17. Marking code of high-ohmic output Type number Nominal Marking output voltage code 9AH LD6836TD/23H 2.3 V 9LH LD6836TD/13H 1.3 V 9BH LD6836TD/27H 2.7 V 9PH LD6836TD/14H 1.4 V 9CH LD6836TD/28H 2.8 V 9QH LD6836TD/16H 1.6 V 9EH LD6836TD/29H 2.9 V 9RH LD6836TD/18H 1.8 V 9GH LD6836TD/30H 3.0 V 9SH LD6836TD/20H 2.0 V 9JH LD6836TD/33H 3.3 V 9VH LD6836TD/22H 2.2 V 9KH LD6836TD/36H 3.6 V 9YH Marking of pull-down output Type number Product data sheet Type number LD6836TD/12H 1.2 V Table 18. LD6836_SER Nominal Marking output voltage code Nominal Marking output voltage code Type number Nominal Marking output voltage code LD6836TD/12P 1.2 V 9AP LD6836TD/23P 2.3 V 9LP LD6836TD/13P 1.3 V 9BP LD6836TD/25P 2.5 V 9NP LD6836TD/14P 1.4 V 9CP LD6836TD/27P 2.7 V 9PP LD6836TD/16P 1.6 V 9EP LD6836TD/28P 2.8 V 9QP LD6836TD/18P 1.8 V 9GP LD6836TD/29P 2.9 V 9RP LD6836TD/20P 2.0 V 9JP LD6836TD/30P 3.0 V 9SP LD6836TD/21P 2.1 V 9ZP LD6836TD/33P 3.3 V 9VP LD6836TD/22P 2.2 V 9KP LD6836TD/36P 3.6 V 9YP All information provided in this document is subject to legal disclaimers. Rev. 2 — 5 October 2012 © NXP B.V. 2012. All rights reserved. 17 of 28 LD6836 series NXP Semiconductors Ultra low dropout regulators, low noise, 300 mA 13. Package outline WLCSP4: wafer level chip-size package; 4 bumps (2 x 2) D bump A1 index area A2 A E A1 detail X e b B e A 1 2 X European projection wlcsp4_2x2_po Fig 23. Package outline LD6836CX4 (WLCSP4) Table 19. Dimensions for Figure 23 Symbol Min Typ Max Unit A 0.44 0.47 0.50 mm A1 0.18 0.20 0.22 mm A2 0.26 0.27 0.28 mm b 0.21 0.26 0.31 mm D 0.71 0.76 0.81 mm E 0.71 0.76 0.81 mm e - 0.4 - mm LD6836_SER Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 5 October 2012 © NXP B.V. 2012. All rights reserved. 18 of 28 LD6836 series NXP Semiconductors Ultra low dropout regulators, low noise, 300 mA :/&63ZDIHUOHYHOFKLSVL]HSDFNDJHZLWKEDFNVLGHFRDWLQJEXPSV [ ' $ EXPS$ LQGH[DUHD $ $ ( $ GHWDLO; H E % H $ ; (XURSHDQ SURMHFWLRQ ZOFVSB[BFBSR Fig 24. Package outline LD6836CX4/C (WLCSP4 with backside coating) Table 20. Dimensions for Figure 24 Symbol Min Typ Max Unit A 0.47 0.51 0.55 mm A1 0.18 0.20 0.22 mm A2 0.26 0.27 0.28 mm A3 0.03 0.04 0.05 mm b 0.21 0.26 0.31 mm D 0.71 0.76 0.81 mm E 0.71 0.76 0.81 mm e - 0.4 - mm LD6836_SER Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 5 October 2012 © NXP B.V. 2012. All rights reserved. 19 of 28 LD6836 series NXP Semiconductors Ultra low dropout regulators, low noise, 300 mA Plastic surface-mounted package; 5 leads SOT753 D E B y A X HE 5 v M A 4 Q A A1 c 1 2 3 Lp detail X bp e w M B 0 1 2 mm scale DIMENSIONS (mm are the original dimensions) UNIT A A1 bp c D E e HE Lp Q v w y mm 1.1 0.9 0.100 0.013 0.40 0.25 0.26 0.10 3.1 2.7 1.7 1.3 0.95 3.0 2.5 0.6 0.2 0.33 0.23 0.2 0.2 0.1 OUTLINE VERSION REFERENCES IEC JEDEC JEITA SOT753 SC-74A EUROPEAN PROJECTION ISSUE DATE 02-04-16 06-03-16 Fig 25. Package outline LD6836 series (SOT753) LD6836_SER Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 5 October 2012 © NXP B.V. 2012. All rights reserved. 20 of 28 LD6836 series NXP Semiconductors Ultra low dropout regulators, low noise, 300 mA 14. Soldering D e c (4×) e solder resist E solder paste = solderland f (4×) occupied area Dimensions in mm wlcsp4_2x2_fr a. LD6836CX4 (WLCSP4) ' H F î H VROGHUUHVLVW ( VROGHUSDVWH VROGHUODQG I î RFFXSLHGDUHD 'LPHQVLRQVLQPP ZOFVSB[BFBIU b. LD6836CX4/C (WLCSP4 with backside coating) Fig 26. Reflow soldering footprint WLCSP4 Table 21. LD6836_SER Product data sheet Dimensions for Figure 26 Symbol Min Typ Max Unit c - 0.25 - mm D 0.71 0.76 0.81 mm E 0.71 0.76 0.81 mm e - 0.4 - mm f - 0.325 - mm All information provided in this document is subject to legal disclaimers. Rev. 2 — 5 October 2012 © NXP B.V. 2012. All rights reserved. 21 of 28 LD6836 series NXP Semiconductors Ultra low dropout regulators, low noise, 300 mA 3.45 1.95 0.45 0.55 (5×) (5×) 0.95 3.3 2.825 solder lands solder resist 0.95 solder paste occupied area 2.4 Dimensions in mm 0.7 (5×) 0.8 (5×) sot753_fr Fig 27. Reflow soldering footprint SOT753 15. Soldering of SMD packages This text provides a very brief insight into a complex technology. A more in-depth account of soldering ICs can be found in Application Note AN10365 “Surface mount reflow soldering description”. 15.1 Introduction to soldering Soldering is one of the most common methods through which packages are attached to Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both the mechanical and the electrical connection. There is no single soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not suitable for fine pitch SMDs. Reflow soldering is ideal for the small pitches and high densities that come with increased miniaturization. 15.2 Wave and reflow soldering Wave soldering is a joining technology in which the joints are made by solder coming from a standing wave of liquid solder. The wave soldering process is suitable for the following: • Through-hole components • Leaded or leadless SMDs, which are glued to the surface of the printed circuit board Not all SMDs can be wave soldered. Packages with solder balls, and some leadless packages which have solder lands underneath the body, cannot be wave soldered. Also, leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered, due to an increased probability of bridging. The reflow soldering process involves applying solder paste to a board, followed by component placement and exposure to a temperature profile. Leaded packages, packages with solder balls, and leadless packages are all reflow solderable. LD6836_SER Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 5 October 2012 © NXP B.V. 2012. All rights reserved. 22 of 28 LD6836 series NXP Semiconductors Ultra low dropout regulators, low noise, 300 mA Key characteristics in both wave and reflow soldering are: • • • • • • Board specifications, including the board finish, solder masks and vias Package footprints, including solder thieves and orientation The moisture sensitivity level of the packages Package placement Inspection and repair Lead-free soldering versus SnPb soldering 15.3 Wave soldering Key characteristics in wave soldering are: • Process issues, such as application of adhesive and flux, clinching of leads, board transport, the solder wave parameters, and the time during which components are exposed to the wave • Solder bath specifications, including temperature and impurities 15.4 Reflow soldering Key characteristics in reflow soldering are: • Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to higher minimum peak temperatures (see Figure 28) than a SnPb process, thus reducing the process window • Solder paste printing issues including smearing, release, and adjusting the process window for a mix of large and small components on one board • Reflow temperature profile; this profile includes preheat, reflow (in which the board is heated to the peak temperature) and cooling down. It is imperative that the peak temperature is high enough for the solder to make reliable solder joints (a solder paste characteristic). In addition, the peak temperature must be low enough that the packages and/or boards are not damaged. The peak temperature of the package depends on package thickness and volume and is classified in accordance with Table 22 and 23 Table 22. SnPb eutectic process (from J-STD-020C) Package thickness (mm) Package reflow temperature (C) Volume (mm3) LD6836_SER Product data sheet < 350 350 < 2.5 235 220 2.5 220 220 All information provided in this document is subject to legal disclaimers. Rev. 2 — 5 October 2012 © NXP B.V. 2012. All rights reserved. 23 of 28 LD6836 series NXP Semiconductors Ultra low dropout regulators, low noise, 300 mA Table 23. Lead-free process (from J-STD-020C) Package thickness (mm) Package reflow temperature (C) Volume (mm3) < 350 350 to 2000 > 2000 < 1.6 260 260 260 1.6 to 2.5 260 250 245 > 2.5 250 245 245 Moisture sensitivity precautions, as indicated on the packing, must be respected at all times. Studies have shown that small packages reach higher temperatures during reflow soldering, see Figure 28. temperature maximum peak temperature = MSL limit, damage level minimum peak temperature = minimum soldering temperature peak temperature time 001aac844 MSL: Moisture Sensitivity Level Fig 28. Temperature profiles for large and small components For further information on temperature profiles, refer to Application Note AN10365 “Surface mount reflow soldering description”. LD6836_SER Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 5 October 2012 © NXP B.V. 2012. All rights reserved. 24 of 28 LD6836 series NXP Semiconductors Ultra low dropout regulators, low noise, 300 mA 16. Revision history Table 24. Revision history Document ID Release date Data sheet status Change notice Supersedes LD6836_SER v.2 20121005 Product data sheet - LD6836_SER v.1 - - Modifications: LD6836_SER v.1 LD6836_SER Product data sheet • Section 9.2 “Dropout”: corrected 20121004 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 5 October 2012 © NXP B.V. 2012. All rights reserved. 25 of 28 LD6836 series NXP Semiconductors Ultra low dropout regulators, low noise, 300 mA 17. Legal information 17.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 17.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. Product specification — The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet. 17.3 Disclaimers Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP Semiconductors takes no responsibility for the content in this document if provided by an information source outside of NXP Semiconductors. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. LD6836_SER Product data sheet Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors and its suppliers accept no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. All information provided in this document is subject to legal disclaimers. Rev. 2 — 5 October 2012 © NXP B.V. 2012. All rights reserved. 26 of 28 LD6836 series NXP Semiconductors Ultra low dropout regulators, low noise, 300 mA Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from competent authorities. Quick reference data — The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. Non-automotive qualified products — Unless this data sheet expressly states that this specific NXP Semiconductors product is automotive qualified, the product is not suitable for automotive use. It is neither qualified nor tested in accordance with automotive testing or application requirements. NXP Semiconductors accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without NXP Semiconductors’ warranty of the product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ standard warranty and NXP Semiconductors’ product specifications. 17.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 18. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] LD6836_SER Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 5 October 2012 © NXP B.V. 2012. All rights reserved. 27 of 28 LD6836 series NXP Semiconductors Ultra low dropout regulators, low noise, 300 mA 19. Contents 1 1.1 1.2 1.3 2 2.1 2.2 3 3.1 4 5 6 7 8 9 9.1 9.2 9.3 9.4 9.5 9.6 9.7 9.8 9.9 10 10.1 11 11.1 12 12.1 12.2 13 14 15 15.1 15.2 15.3 15.4 16 17 17.1 17.2 17.3 17.4 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 General description . . . . . . . . . . . . . . . . . . . . . 1 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 2 Ordering information . . . . . . . . . . . . . . . . . . . . . 3 Ordering options . . . . . . . . . . . . . . . . . . . . . . . . 3 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 6 Recommended operating conditions. . . . . . . . 6 Thermal characteristics . . . . . . . . . . . . . . . . . . 7 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Dynamic behavior . . . . . . . . . . . . . . . . . . . . . . . 9 Power Supply Rejection Ratio (PSRR). . . . . . . 9 Dropout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Accuracy . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Quiescent current . . . . . . . . . . . . . . . . . . . . . . 11 Noise . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Line Regulation. . . . . . . . . . . . . . . . . . . . . . . . 12 Load Regulation . . . . . . . . . . . . . . . . . . . . . . . 12 Start-up and shutdown . . . . . . . . . . . . . . . . . . 13 Enable threshold voltage . . . . . . . . . . . . . . . . 13 Application information. . . . . . . . . . . . . . . . . . 14 Capacitor values . . . . . . . . . . . . . . . . . . . . . . . 14 Test information . . . . . . . . . . . . . . . . . . . . . . . . 15 Quality information . . . . . . . . . . . . . . . . . . . . . 15 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 WLCSP4 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 SOT753 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 18 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 Soldering of SMD packages . . . . . . . . . . . . . . 22 Introduction to soldering . . . . . . . . . . . . . . . . . 22 Wave and reflow soldering . . . . . . . . . . . . . . . 22 Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 23 Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 23 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 25 Legal information. . . . . . . . . . . . . . . . . . . . . . . 26 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 26 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 27 18 19 Contact information . . . . . . . . . . . . . . . . . . . . 27 Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2012. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] Date of release: 5 October 2012 Document identifier: LD6836_SER