MADP-000208-13180W SURMOUNT TM 8m PIN Diode Pair RoHS Compliant Rev. V2 Outline Drawing Features M/A-COM Products Surface Mount Device 8 µm I-Region Length Devices Two PIN diodes in Flexible Configuration No Wire bonds Required Rugged Silicon-Glass Construction Silicon Nitride Passivation Polymer Scratch Protection Low Parasitic Capacitance and Inductance Description The MADP-000208-13180W is a pair of silicon glass PIN diodes incorporated onto one chip and is fabricated using M/A-COM Technology Solutions patented HMICTM process. The device features three silicon pedestals embedded in low loss, low dispersion glass (k=4.1, Tanδ=0.002). The diodes are formed on the top of pedestals and connections to the backside of the device are made via electrically conductive sidewalls. Selective backside metallization is applied to produce a surface mount device. This vertical topology provides for exceptional heat transfer and also allows the topside to be fully encapsulated with silicon nitride. An additional polymer layer is also added to provide scratch and impact protection. These protective coatings prevent damage to the junction and the anode airbridge during handling and assembly. Bottom Side Contacts (Circuit Side) Dim. Inches Millimeter min max min max A 0.0440 0.0460 1.118 1.168 Applications B 0.0140 0.0160 0.355 0.406 The MADP-000208-13180W packageless devices are suitable for usage in high incident power, 44.8 dBm C.W at 2 GHz., series, shunt, or series-shunt switches. The low parasitic inductance, < 0.12 nH, and excellent RC constant, make these devices an attractive alternative for high frequency switch elements when compared to their plastic device counterparts. C 0.0045 0.0055 0.114 0.140 D 0.0115 0.0125 0.292 0.318 E 0.0055 0.0065 0.140 0.165 F 0.0055 0.0065 0.140 0.165 G 0.0115 0.0125 0.292 0.318 Ordering Information Part Number Package MADP-000208-13180W 200 pieces per tray 1 ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions • North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400 is considering for development. Performance is based on target specifications, simulated results, • India Tel: +91.80.43537383 • China Tel: +86.21.2407.1588 and/or prototype measurements. Commitment to develop is not guaranteed. Visit www.macomtech.com for additional data sheets and product information. PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make Commitment to produce in volume is not guaranteed. changes to the product(s) or information contained herein without notice. MADP-000208-13180W SURMOUNT TM 8m PIN Diode Pair RoHS Compliant M/A-COM Products Rev. V2 Electrical Specifications1,2,3: TA = +25°C D1 - J1 to J3 & D2 - J3 to J4 Parameter Test Conditions Units Min. Typ. Max. Capacitance (CT)4 -10 V, 1 MHz pF — 0.81 0.90 Resistance (RS) +10 mA, 1 GHz +100 mA, 1 GHz Ω — — 0.40 0.30 0.62 0.52 Forward Voltage (VF)4 +5 mA +100 mA V — — 0.78 1.00 0.90 1.1 Reverse Leakage Current (IR)4 | -90V | µA — — 10 °C/W — 58 — µS — 0.5 — C.W. Thermal Resistance (RθJL) Lifetime (TL) 1. 2. 3. 4. +10 mA / -6 mA ( 50% - 90% V ) Total capacitance (CT), is equivalent to the sum of Junction Capacitance (CJ) and Parasitic Capacitance (CPAR) Series resistance (RS) is equivalent to the total diode resistance: RS = RJ (Junction Resistance) + RC (Ohmic Resistance) RS is measured on an HP4291A Impedance Analyzer with die mounted in an ODS-186 package using Sn60/Pb40 solder. On wafer measurement. Application Schematic Absolute Maximum Ratings Parameter Absolute Maximum Forward Current 500 mA Reverse Voltage - 90 V Operating Temperature -55 °C to +125°C Storage Temperature -55 °C to +150°C Junction Temperature +175°C C.W. Incident Power 44.8 dBm @ 2 GHz Mounting Temperature for RoHS Solders +260 °C for 10 seconds D2 J4 D1 J3 J1 2 ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions • North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400 is considering for development. Performance is based on target specifications, simulated results, • India Tel: +91.80.43537383 • China Tel: +86.21.2407.1588 and/or prototype measurements. Commitment to develop is not guaranteed. Visit www.macomtech.com for additional data sheets and product information. PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make Commitment to produce in volume is not guaranteed. changes to the product(s) or information contained herein without notice. MADP-000208-13180W SURMOUNT TM 8m PIN Diode Pair RoHS Compliant M/A-COM Products Rev. V2 Typical Performance Curves @ 25°C Resistance vs. Frequency @ 5, 10 & 20 mA Resistance vs. Forward Current @ 30, 500, 1000 MHz 0.7 0.8 0.7 5 mA 10 mA 20 mA 0.6 30 MHz 500 MHz 1000 MHz 0.6 0.5 0.5 0.4 0.4 0.3 0.3 0.2 0.0 0.5 1.0 1.5 2.0 0.2 0.0 20.0 Capacitance vs. Frequency @ 10 & 40 V 0.90 0.85 0.85 0.80 0.80 0.70 0.0 10 Volts 40 Volts 0.2 0.4 0.6 0.8 1.0 1.2 60.0 80.0 100.0 Capacitance vs. Voltage @ 30, 500, 1000 MHz 0.90 0.75 40.0 Current (mA) Frequency (GHz) 1.4 0.75 1.6 1.8 0.70 30 MHz 500 MHz 1000 MHz 0 8 16 24 32 40 Voltage (V) Frequency (GHz) Series Inductance vs. Frequency @ 5, 10 & 20 mA Series Inductance vs. Forward Current @ 500 & 1000 MHz 0.12 0.12 0.10 0.11 0.08 0.10 0.06 5 mA 10 mA 20 mA 0.04 500 MHz 1000 MHz 0.09 0.02 0.00 0.0 3 0.08 0.2 0.4 0.6 0.8 1.0 1.2 Frequency (GHz) 1.4 1.6 1.8 0 20 40 60 80 100 I (mA) ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions • North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400 is considering for development. Performance is based on target specifications, simulated results, • India Tel: +91.80.43537383 • China Tel: +86.21.2407.1588 and/or prototype measurements. Commitment to develop is not guaranteed. Visit www.macomtech.com for additional data sheets and product information. PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make Commitment to produce in volume is not guaranteed. changes to the product(s) or information contained herein without notice. MADP-000208-13180W SURMOUNT TM 8m PIN Diode Pair RoHS Compliant M/A-COM Products Rev. V2 Die Handling and Mounting Information Handling: All semiconductor chips should be handled with care to avoid damage or contamination from perspiration, salts, and skin oils. The use of plastic tipped tweezers or vacuum pickups is strongly recommended for individual components. Bulk handling should ensure that abrasion and mechanical shock are minimized. Electro-Static Sensitivity: The MADP-000208-13108W Diode Pair are ESD, Class 1A sensitive (HBM). Proper ESD precautions should be taken. Die Attach Surface: Die can be mounted with an 80Au/Sn20, eutectic solder preform, RoHS compliant solders or electrically conductive silver epoxy. The metal RF and D.C. ground plane mounting surface must be free of contamination and should have a surface flatness of < ±0.002”. Eutectic Die Attachment Using Hot Gas Die Bonder: A work surface temperature of 255oC is recommended. When hot forming gas is applied, the temperature should be approximately 290oC. The chip should not be exposed to temperatures greater than 320oC for more than 10 seconds. Eutectic Die Attachment Using Reflow Oven: Please visit the www.macomtech.com and see Application Note M538, “Surface Mounting Instructions” for the recommended time-temperature profile. Electrically Conductive Epoxy Die Attachment: A controlled amount of electrically conductive, silver epoxy, approximately 1–2 mils in thickness, should be used to minimize ohmic and thermal resistance. A thin epoxy fillet should be visible around the perimeter of the bond pad after placement to ensure full area coverage. Cure conductive epoxy per manufacturer’s schedule. Typically 150°C for 1 hour. 4 ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions • North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400 is considering for development. Performance is based on target specifications, simulated results, • India Tel: +91.80.43537383 • China Tel: +86.21.2407.1588 and/or prototype measurements. Commitment to develop is not guaranteed. Visit www.macomtech.com for additional data sheets and product information. PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make Commitment to produce in volume is not guaranteed. changes to the product(s) or information contained herein without notice.