DATA SHEET ANTI-SULFURATED CHIP RESISTORS AF122 (4Pin/2R) / AF124 (8Pin/4R) / AF162 (4Pin/ 2R)/ AF164 (8Pin/ 4R) 5%, 1% sizes 2 × 0402, 4 x 0402, 2 x 0603, 4 x 0603 Product specification –March 20, 2017 V.5 RoHS compliant Product specification Chip Resistor Surface Mount AF 2 8 122/124/162/164 (RoHS Compliant) SERIES SCOPE ORDERING INFORMATION - GLOBAL PART NUMBER & 12NC This specification describes AF122/AF124/AF162/AF164 (convex)series chip resistor arrays with lead-free terminations made by thick film process. Both part numbers are identified by the series, size, tolerance, packing type, temperature coefficient, taping reel and resistance value. YAGEO BRAND ordering code GLOBAL PART NUMBER (PREFERRED ) AF XX X - X X X XX XXXX L APPLICATIONS Terminal for SDRAM and DDRAM (1) (2) 12 = 0402 x 2 (0404) 12 = 0402 x 4 (0408) 16 = 0603 x 2 (0606) 16 = 0603 x 4 (0612) (2) NUMBER OF RESISTORS 2 = 2 resistors Mobile phone, telecom… FEATURES AEC-Q200 qualified 4 = 4 resistors (3) TOLERANCE F = ± 1% J = ± 5% (for Jumper ordering, use code of J) RoHS compliant Reducing environmentally hazardous wastes High component and equipment reliability (4) PACKAGING TYPE R = Paper taping reel (5) TEMPERATURE COEFFICIENT OF RESISTANCE – = Base on spec Saving of PCB space None forbidden-materials used in products/production (6) TAPING REEL 07 = 7 inch dia. Reel 13 = 13 inch dia. Reel Halogen Free Epoxy Moisture sensitivity level: MSL 1 (7) (1) SIZE High-end Computer & Multimedia Electronics in high sulfur environment Consume electronic equipments: PDAs, PNDs (3) (4) (5) (6) (7) RESISTANCE VALUE There are 2~4 digits indicated the resistor value. Letter R/K/M is decimal point, no need to mention the last zero after R/K/M, e.g.1K2, not 1K20. Detailed resistance rules show in table of “Resistance rule of global part number”. (8) DEFAULT Resistance CODE rule of global part O RDERING EXAMPLE (Note) number Letter L is the system default code for ordering Theonly. ordering code of a AF122 Resistance code rule Example 0R 0R = Jumper XRXX (1 to 9.76 Ω) 1R = 1 Ω 1R5 = 1.5 Ω 9R76 = 9.76 Ω XXRX (10 to 97.6 Ω) 10R = 10 Ω 97R6 = 97.6 Ω XXXR (100 to 976 Ω) 100R = 100 Ω XKXX (1 to 9.76 KΩ) 1K = 1,000 Ω 9K76 = 9760 Ω XM (1 MΩ) convex chip resistor array, value 1,000Ω with ± 5% tolerance, supplied in 7-inch tape reel is: AF122-JR-071KL. NOTE 1. All our R-Chip products meet RoHS compliant. "LFP" of the internal 2D reel label mentions "Lead Free Process" 2. On customized label, "LFP" or specific symbol printed and the optional "L" at the end of GLOBAL PART NUMBER 1M = 1,000,000 Ω www.yageo.com Mar. 20, 2017 V.5 Product specification Chip Resistor Surface Mount AF SERIES 3 8 122/124/162/164 (RoHS Compliant) MARKING AF122 / 162 No marking Fig. 1 AF124 / 164 0 I-Digit marking Fig. 2 Value = 0Ω 3 60 1% E-24/E-96: R≧ 100Ω 4digits First three digits for significant figure and 4th digit for number of zeros Fig. 3 Value = 316KΩ 5% E-24: R≧ 10Ω First two digits for significant figure and 3rd digit for number of zeros Fig. 3 Value = 240KΩ For further marking information, please refer to data sheet “Chip resistors marking”. CONSTRUCTION The resistor is constructed on top of a high-grade ceramic body. Internal metal electrodes are added on each end to make the contacts to the thick film resistive element. The composition of the resistive element is a noble metal embedded into a glass and covered by a glass. The resistor is laser trimmed to the rated resistance value. The resistor is covered with a protective epoxy coat, finally the external terminations (matte tin on Nibarrier) are added as shown in Fig.4. OUTLINES Fig. 4 Chip resistor outlines DIMENSIONS Table 1 TYPE AF122 AF124 AF162 AF164 B (mm) 0.24± 0.10 0.25± 0.15 0.35±0.10 0.35± 0.15 H (mm) 0.30+0.10/-0.05 0.45± 0.05 0.30±0.10 0.65± 0.05 --- 0.30± 0.05 -- 0.50± 0.15 P (mm) 0.67± 0.05 0.50± 0.05 0.80±0.05 0.80± 0.05 L (mm) 1.00± 0.10 2.00± 0.10 1.60±0.10 3.20± 0.15 T (mm) 0.30± 0.10 0.45± 0.10 0.40±0.10 0.60± 0.10 W1 (mm) 0.25± 0.10 0.30± 0.15 0.30±0.10 0.30± 0.15 W2 (mm) 1.00± 0.10 1.00± 0.10 1.60±0.10 1.60± 0.15 H1 (mm) For dimension, please refer to Table 1 AF122 / 162 AF124 / 164 Fig. 5 AF122/124/162/164 series chip resistors dimension www.yageo.com Mar. 20, 2017 V.5 Product specification Chip Resistor Surface Mount AF SERIES 122/124/162/164 (RoHS Compliant) 4 8 SCHEMATIC For dimension, please refer to Fig. 5 and Table 1 Fig. 6 Equivalent circuit diagram ELECTRICAL CHARACTERISTICS Table 2 AF122 AF124 AF162 AF164 –55 °C to +155 °C –55 °C to +155 °C –55 °C to +155 °C –55 °C to +155 °C 1/16 W 1/16 W 1/16W 1/16W Maximum Working Voltage 50 V 25 V 50V 50V Maximum Overload Voltage 100 V 50 V 100V 100V Dielectric Withstanding Voltage Resistance Range 100 V 100 V 100V 100V 5% (E24) 1 Ω to 1 MΩ 1% (E24/E96) 10 Ω to 1 MΩ Jumper < 50 mΩ 5% (E24) 1 Ω to 1 MΩ 1% (E24/E96) 1 Ω to 1 MΩ Jumper < 50 mΩ CHARACTERISTICS Operating Temperature Range Rated Power 1 Ω ≤ R ≤ 10 Ω ± 250 ppm/°C Temperature Coefficient Jumper Criteria 5% (E24) 1 Ω to 1 MΩ 5% (E24) 1 Ω to 1 MΩ 1% (E24/E96) 1 Ω to 1 MΩ 1% (E24/E96) 1 Ω to 1 MΩ Jumper < 50 mΩ Jumper < 50 mΩ ± 250 ppm/°C 10 Ω ≤ R ≤ 1 MΩ ± 200 ppm/°C Rated Current 0.5 A Rated Current 1.0 A Rated Current 1.0 A Rated Current 1.0A Maximum Current 1.0 A Maximum Current 2.0 A Maximum Current 2.0 A Maximum Current 2.0A FOOTPRINT AND SOLDERING PROFILES For recommended footprint and soldering profiles, please refer to data sheet “Chip resistors mounting”. PACKING STYLE AND PACKAGING QUANTITY Table 3 Packing style and packaging quantity PACKING STYLE Paper Taping Reel (R) REEL DIMENSION AF122 AF124 AF162 AF164 7" (178 mm) 10,000 units 10,000 units 5,000 units 5,000 units 13" (330 mm) 50,000 units 40,000 units --- 20,000 units NOTE 1. For paper tape and reel specification/dimensions, please refer to data sheet “Chip resistors packing”. www.yageo.com Mar. 20, 2017 V.5 Product specification Chip Resistor Surface Mount AF SERIES 122/124/162/164 (RoHS Compliant) 5 8 FUNCTIONAL DESCRIPTION POWER RATING AF122 / AF124 / AF162 / AF164 rated power at 70 °C is 1/16 W R ATED VOLTAGE The DC or AC (rms) continuous working voltage corresponding to the rated power is determined by the following formula: V= (P X R) or max. working voltage whichever is less Where Fig. 7 Maximum dissipation (P) in percentage of rated power as a function of the operating ambient temperature (T amb ) V=Continuous rated DC or AC (rms) working voltage (V) P=Rated power (W) R=Resistance value (Ω) www.yageo.com Mar. 20, 2017 V.5 Product specification Chip Resistor Surface Mount AF SERIES 6 8 122/124/162/164 (RoHS Compliant) TESTS AND REQUIREMENTS Table 4 Test condition, procedure and requirements TEST TEST METHOD PROCEDURE REQUIREMENTS Life/ Endurance MIL-STD-202-method 108 1,000 hours at 70± 2 °C applied RCWV 1.5 hours on, 0.5 hour off, still air required ± (2%+0.05 Ω ) High Temperature Exposure MIL-STD-202-method 108 1,000 hours at maximum operating temperature depending on specification, unpowered ± (1%+0.05 Ω) <50 mΩ for Jumper IEC 60115-1 4.25 <100 mΩ for Jumper Tolerances: 155± 3 °C Moisture Resistance MIL-STD-202-method 106 Each temperature / humidity cycle is defined at 8 hours (method 106G), 3 cycles / 24 hours for 10d with 25 °C / 65 °C 95% R.H, without steps 7a & 7b, unpowered ± (2%+0.05 Ω) <100 mΩ for Jumper Parts mounted on test-boards, without condensation on parts Measurement at 24± 2 hours after test conclusion Thermal Shock MIL-STD-202-method 107 -55/+125 °C ± (1%+0.05 Ω) Note: Number of cycles required is 300. Devices mounted <50 mΩ for Jumper Maximum transfer time is 20 seconds. Dwell time is 15 minutes. Air – Air Short Time Overload Board Flex/ Bending IEC60115-1 4.13 IEC60115-1 4.33 2.5 times RCWV or maximum overload voltage whichever is less for 5 sec at room temperature ± (2%+0.05 Ω) Device mounted on PCB test board as described, only 1 board bending required ± (1%+0.05 Ω) 3 mm bending No visible damage <50 mΩ for Jumper No visible damage <50 mΩ for Jumper Bending time: 60± 5 seconds Ohmic value checked during bending www.yageo.com Mar. 20, 2017 V.5 Product specification Chip Resistor Surface Mount AF SERIES 7 8 122/124/162/164 (RoHS Compliant) TEST TEST METHOD PROCEDURE REQUIREMENTS Solderability - Wetting J-STD-002 test B Electrical Test not required Well tinned (≥95% covered) No visible damage Magnification 50X SMD conditions: 1st step: method B, aging 4 hours at 155 °C dry heat 2nd step: leadfree solder bath at 245± 3 °C Dipping time: 3± 0.5 seconds - Leaching J-STD-002 test D Leadfree solder, 260 °C, 30 seconds immersion time No visible damage - Resistance to Soldering Heat IEC 60115-1 4.18 Condition B, no pre-heat of samples ± (1%+0.05Ω) MIL-STD-202 Method 215 Leadfree solder, 260 °C, 10 seconds immersion time <50 mΩ for Jumper No visible damage Procedure 2 for SMD: devices fluxed and cleaned with isopropanol FOS ASTM-B-809-95* *Modified Sulfur 750 hours, 105℃, unpowered ± (4.0%+0.05Ω) <100mΩ for Jumper www.yageo.com Mar. 20, 2017 V.5 Product specification Chip Resistor Surface Mount AF SERIES 122/124/162/164 (RoHS Compliant) 8 8 REVISION HISTORY REVISION DATE CHANGE NOTIFICATION DESCRIPTION Version 5 Mar. 20, 2017 - - Modify AF124/164 Equivalent Circuit Diagram Version 4 Jun. 23, 2016 - - AEC-Q200 qualified Version 3 Nov. 17, 2015 - - Add in AF162 Version 2 May 29,2015 - - Add in AF164 Version 1 Aug. 15, 2014 - - Update AF124 dimensions Version 0 Oct. 02, 2013 - - First issue of this specification “ Yageo reserves all the rights for revising the content of this datasheet without further notification, as long as the products itself are unchanged. Any product change will be announced by PCN.” www.yageo.com Mar. 20, 2017 V.5