Product Folder Order Now Technical Documents Support & Community Tools & Software LM442-MIL SNOSD59 – JUNE 2017 LF442-MIL Dual Low Power JFET Input Operational Amplifier 1 Features 3 Description • • • • • • • • • • The LF442-MIL dual low power operational amplifiers provide many of the same AC characteristics as the industry standard LM1458 while greatly improving the DC characteristics of the LM1458. The amplifiers have the same bandwidth, slew rate, and gain (10 kΩ load) as the LM1458 and only draw one tenth the supply current of the LM1458. In addition the well matched high voltage JFET input devices of the LF442-MIL reduce the input bias and offset currents by a factor of 10,000 over the LM1458. A combination of careful layout design and internal trimming ensures very low input offset voltage and voltage drift. The LF442-MIL also has a very low equivalent input noise voltage for a low power amplifier. 1 1/10 Supply Current of a LM1458: 400 μA (Max) Low Input Bias Current: 50 pA (Max) Low Input Offset Voltage: 1 mV (Max) Low Input Offset Voltage Drift: 7 μV/°C (Typ) High Gain Bandwidth: 1 MHz High Slew Rate: 1 V/μs Low Noise Voltage for Low Power: 35 nV/√Hz Low Input Noise Current: 0.01 pA/√Hz High Input Impedance: 1012Ω High Gain VO = ±10V, RL = 10k: 50k (Min) 2 Applications • • • High Speed Integrators Fast D/A Converters Sample and Hold Circuits The LF442-MIL is pin compatible with the LM1458 allowing an immediate 10 times reduction in power drain in many applications. The LF442-MIL should be used where low power dissipation and good electrical characteristics are the major considerations. Device Information(1) PART NUMBER PACKAGE BODY SIZE (NOM) LF442-MILACN PDIP (8) 9.59 mm × 6.35 mm LF442-MILAMH TO-99 (8) 8.96 mm Diameter (1) For all available packages, see the orderable addendum at the end of the data sheet. Inverting Amplifier Rf VCC Ri ± + LF442-MIL -VEE Copyright © 2017, Texas Instruments Incorporated 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. LM442-MIL SNOSD59 – JUNE 2017 www.ti.com Table of Contents 1 2 3 4 5 6 7 Features .................................................................. Applications ........................................................... Description ............................................................. Revision History..................................................... Pin Configuration and Functions ......................... Specifications......................................................... 1 1 1 2 3 4 6.1 6.2 6.3 6.4 6.5 6.6 6.7 4 4 4 4 5 5 6 Absolute Maximum Ratings ...................................... Absolute Maximum Ratings ...................................... Recommended Operating Conditions....................... Thermal Information ................................................. DC Electrical Characteristics .................................... AC Electrical Characteristics..................................... Typical Characteristics .............................................. 7.3 Feature Description................................................. 11 7.4 Device Functional Modes........................................ 12 8 Application and Implementation ........................ 13 8.1 Application Information............................................ 13 8.2 Typical Applications ............................................... 13 9 Power Supply Recommendations...................... 19 10 Layout................................................................... 19 10.1 Layout Guidelines ................................................. 19 10.2 Layout Example .................................................... 19 11 Device and Documentation Support ................. 20 11.1 11.2 11.3 11.4 11.5 Detailed Description ............................................ 11 7.1 Overview ................................................................. 11 7.2 Functional Block Diagram ....................................... 11 Receiving Notification of Documentation Updates Community Resources.......................................... Trademarks ........................................................... Electrostatic Discharge Caution ............................ Glossary ................................................................ 20 20 20 20 20 12 Mechanical, Packaging, and Orderable Information ........................................................... 21 4 Revision History NOTE: Page numbers for previous revisions may differ from page numbers in the current version. 2 DATE REVISION NOTES June 2017 * Initial release. Submit Documentation Feedback Copyright © 2017, Texas Instruments Incorporated Product Folder Links: LM442-MIL LM442-MIL www.ti.com SNOSD59 – JUNE 2017 5 Pin Configuration and Functions TO Package 8-Pin LMC Top View Pin 4 connected to case P Package 8-Pin PDIP Top View Pin Functions PIN NAME NO. I/O DESCRIPTION Inverting input A 2 Input Amplifier A inverting input Inverting input B 6 Input Amplifier B inverting input Noninverting input A 3 Input Amplifier A noninverting input Noninverting input B 5 Input Amplifier B noninverting Input Output A 1 Output Amplifier A output Output B 7 Output Amplifier B output V+ 8 Power Positive supply V- 4 Power Negative supply Submit Documentation Feedback Copyright © 2017, Texas Instruments Incorporated Product Folder Links: LM442-MIL 3 LM442-MIL SNOSD59 – JUNE 2017 www.ti.com 6 Specifications 6.1 Absolute Maximum Ratings (1) (2) Supply voltage ±18 V Differential input voltage ±30 V Input voltage range (3) ±15 V Output short circuit duration (4) Continuous Storage temperature, Tstg (1) (2) (3) (4) –65 to 150°C Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. Refer to RETS442X for LF442MH military specifications. Unless otherwise specified the absolute maximum negative input voltage is equal to the negative power supply voltage. Any of the amplifier outputs can be shorted to ground indefinitely, however, more than one should not be simultaneously shorted as the maximum junction temperature will be exceeded. 6.2 Absolute Maximum Ratings (1) (2) LMC0008C Package TJ max 150°C Lead Temperature (2) (3) (4) 115°C See (3) (4) Operating temperature range (1) P0008E Package (Soldering, 10 sec.) See (3) (4) 260°C 260°C Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. Refer to RETS442X for LF442MH military specifications. These devices are available in both the commercial temperature range 0°C ≤ TA ≤ 70°C and the military temperature range −55°C ≤ TA ≤ 125°C. The temperature range is designated by the position just before the package type in the device number. A “C” indicates the commercial temperature range and an “M” indicates the military temperature range. The military temperature range is available in “H” package only. The value given is in static air. 6.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN NOM MAX UNIT ±15 V Supply voltage 6.4 Thermal Information LF442-MIL THERMAL METRIC RθJA (Typical) Junction-to-ambient thermal resistance RθJC (Typical) Junction-to-case thermal resistance (1) 4 (1) LMC (TO) P (PDIP) 8 PINS 8 PINS 400 linear feet/min air flow 65 114 Static air 165 152 21 UNIT °C/W °C/W For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report. Submit Documentation Feedback Copyright © 2017, Texas Instruments Incorporated Product Folder Links: LM442-MIL LM442-MIL www.ti.com SNOSD59 – JUNE 2017 6.5 DC Electrical Characteristics (1) (2) PARAMETER TEST CONDITIONS MIN RS = 10 kΩ, TA = 25°C VOS Input offset voltage ΔVOS/ΔT Average TC of input offset voltage RS = 10 kΩ IOS Input offset voltage VS = ±15 V (1) (3) TYP MAX 1 5 mV 7.5 mV Over temperature 7 TJ = 25°C 5 TJ = 70°C UNIT μV/°C 50 pA 1.5 nA TJ = 125°C nA TJ = 25°C IB Input bias current VS = ±15 V (1) (3) RIN Input resistance TJ = 25°C AVOL Large signal voltage gain VS = ±15 V, VO = ±10 V, RL = 10 kΩ, TA = 25°C VO Output voltage swing 10 TJ = 70°C 100 pA 3 nA TJ = 125°C Over temperature VS = ±15 V, RL = 10 kΩ nA 1012 Ω 25 200 V/mV 15 200 V/mV ±12 ±13 V ±11 14 V VCM Input common-mode voltage range CMRR Common-mode rejection ratio RS ≤ 10 kΩ 70 PSRR Supply voltage rejection ratio See (4) 70 IS Supply current (1) (2) (3) (4) −12 V 95 dB 90 400 dB 500 μA Unless otherwise specified, the specifications apply over the full temperature range of VS = ±15 V for the LF442-MIL. VOS, IB, and IOS are measured at VCM = 0. Refer to RETS442X for LF442-MIL MH military specifications. The input bias currents are junction leakage currents which approximately double for every 10°C increase in the junction temperature, TJ. Due to limited production test time, the input bias currents measured are correlated to junction temperature. In normal operation the junction temperature rises above the ambient temperature as a result of internal power dissipation, PD. TJ = TA + θJAPD where θJA is the thermal resistance from junction to ambient. Use of a heat sink is recommended if input bias current is to be kept to a minimum. Supply voltage rejection ratio is measured for both supply magnitudes increasing or decreasing simultaneously in accordance with common practice from ±15 V to ±5 V for the LF442-MIL. 6.6 AC Electrical Characteristics (1) (2) PARAMETER TEST CONDITIONS MIN TA = 25°C, f = 1 Hz-20 kHz (Input referred) SR Slew rate VS = ±15 V, TA = 25°C 0.6 GBW Gain-bandwidth product VS = ±15 V, TA = 25°C 0.6 en Equivalent input noise voltage TA = 25°C, RS = 100 Ω, f = 1 kHz in Equivalent input noise current TA = 25°C, f = 1 kHz (1) (2) TYP MAX UNIT −120 Amplifier to amplifier coupling 1 dB V/μs 1 MHz 35 nV/√Hz 0.01 pA/√Hz Unless otherwise specified, the specifications apply over the full temperature range and for VS = ±15 V for the LF442-MIL. VOS, IB, and IOS are measured at VCM = 0. Refer to RETS442X for LF442-MIL MH military specifications. Submit Documentation Feedback Copyright © 2017, Texas Instruments Incorporated Product Folder Links: LM442-MIL 5 LM442-MIL SNOSD59 – JUNE 2017 www.ti.com 6.7 Typical Characteristics 6 Figure 1. Input Bias Current Figure 2. Input Bias Current Figure 3. Supply Current Figure 4. Positive Common-Mode Input Voltage Limit Figure 5. Negative Common-Mode Input Voltage Limit Figure 6. Positive Current Limit Submit Documentation Feedback Copyright © 2017, Texas Instruments Incorporated Product Folder Links: LM442-MIL LM442-MIL www.ti.com SNOSD59 – JUNE 2017 Typical Characteristics (continued) Figure 7. Negative Current Limit Figure 8. Output Voltage Swing Figure 9. Output Voltage Swing Figure 10. Gain Bandwidth Figure 11. Bode Plot Figure 12. Slew Rate Submit Documentation Feedback Copyright © 2017, Texas Instruments Incorporated Product Folder Links: LM442-MIL 7 LM442-MIL SNOSD59 – JUNE 2017 www.ti.com Typical Characteristics (continued) 8 Figure 13. Distortion vs Frequency Figure 14. Undistorted Output Voltage Swing Figure 15. Open Loop Frequency Response Figure 16. Common-Mode Rejection Ratio Figure 17. Power Supply Rejection Ratio Figure 18. Equivalent Input Noise Voltage Submit Documentation Feedback Copyright © 2017, Texas Instruments Incorporated Product Folder Links: LM442-MIL LM442-MIL www.ti.com SNOSD59 – JUNE 2017 Typical Characteristics (continued) Figure 19. Open Loop Voltage Gain Figure 20. Output Impedance Figure 21. Inverter Settling Time Submit Documentation Feedback Copyright © 2017, Texas Instruments Incorporated Product Folder Links: LM442-MIL 9 LM442-MIL SNOSD59 – JUNE 2017 www.ti.com 6.7.1 Pulse Response RL = 10 kΩ, CL = 10 pF Figure 22. Small Signal Inverting Figure 23. Small Signal Non-Inverting Figure 24. Large Signal Inverting 10 Submit Documentation Feedback Figure 25. Large Signal Non-Inverting Copyright © 2017, Texas Instruments Incorporated Product Folder Links: LM442-MIL LM442-MIL www.ti.com SNOSD59 – JUNE 2017 7 Detailed Description 7.1 Overview The LF442-MIL dual low power operational amplifiers provide many of the same AC characteristics as the industry standard LM1458 while greatly improving the DC characteristics of the LM1458. The amplifiers have the same bandwidth, slew rate, and gain (10 kΩ load) as the LM1458 and only draw one tenth the supply current of the LM1458. In addition the well matched high voltage JFET input devices of the LF442-MIL reduce the input bias and offset currents by a factor of 10,000 over the LM1458. A combination of careful layout design and internal trimming ensures very low input offset voltage and voltage drift. The LF442-MIL also has a very low equivalent input noise voltage for a low power amplifier. The LF442-MIL is pin compatible with the LM1458 allowing an immediate 10 times reduction in power drain in many applications. The LF442-MIL should be used where low power dissipation and good electrical characteristics are the major considerations. 7.2 Functional Block Diagram Figure 26. Each Amplifier 7.3 Feature Description The amplifier's differential inputs consist of a non-inverting input (+IN) and an inverting input (-IN). The amplifier amplifies only the difference in voltage between the two inputs, which is called the differential input voltage. The output voltage of the op-amp VOUT is given by the equation VOUT = AOL(IN+ - IN-). Submit Documentation Feedback Copyright © 2017, Texas Instruments Incorporated Product Folder Links: LM442-MIL 11 LM442-MIL SNOSD59 – JUNE 2017 www.ti.com 7.4 Device Functional Modes 7.4.1 Input and Output Stage Figure 27. 1/2 Dual LF442-MIL 12 Submit Documentation Feedback Copyright © 2017, Texas Instruments Incorporated Product Folder Links: LM442-MIL LM442-MIL www.ti.com SNOSD59 – JUNE 2017 8 Application and Implementation NOTE Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes. Customers should validate and test their design implementation to confirm system functionality. 8.1 Application Information The LF442-MIL uses a combination of careful layout design and internal trimming to ensure very low input offset voltage and voltage drift. The LF442-MIL also has a very low equivalent input noise voltage for a low power amplifier. The LF442-MIL should be used where low power dissipation and good electrical characteristics are the major considerations. 8.2 Typical Applications 1. 2. 3. 4. 5. Battery Powered Strip Chart Preamplifier "No FET" Low Power V to F Converter High Efficiency Crystal Oven Controller Conventional Log Amplifier Unconvential Log Amplifier 8.2.1 Battery Powered Strip Chart Preamplifier GAIN INPUT (+) 10 k 1 SEC 3+ 5 SEC 10 SEC 50 SEC 100 SEC ½ LF442-MIL 1 2± INPUT (±) 1M 100 pF 1M 250 k 110 k 20.4 k 5M 10 M 50 M 100 M 10 k 9V X1 X5 X10 X50 6 X100 GAIN 8 + 5 ± 1 F 7 ½ LF442-MIL OUTPUT TO STRIP CHART 6 -9V Copyright © 2017, Texas Instruments Incorporated Figure 28. Battery Powered Strip Chart Preamplifier 8.2.1.1 Design Requirements Runs from 9V batteries (±9V supplies). Fully set gain and time constant. Battery powered supply allows direct plug-in interface to strip chart recorder without common-mode problems. Submit Documentation Feedback Copyright © 2017, Texas Instruments Incorporated Product Folder Links: LM442-MIL 13 LM442-MIL SNOSD59 – JUNE 2017 www.ti.com Typical Applications (continued) 8.2.1.2 Detailed Design Procedure This device is a dual low power op amp with internally trimmed input offset voltages and JFET input devices (BIFET II). These JFETs have large reverse breakdown voltages from gate to source and drain eliminating the need for clamps across the inputs. Therefore, large differential input voltages can easily be accommodated without a large increase in input current. The maximum differential input voltage is independent of the supply voltages. However, neither of the input voltages should be allowed to exceed the negative supply as this will cause large currents to flow which can result in a destroyed unit. Exceeding the negative common-mode limit on either input will force the output to a high state, potentially causing a reversal of phase to the output. Exceeding the negative common-mode limit on both inputs will force the amplifier output to a high state. In neither case does a latch occur since raising the input back within the common-mode range again puts the input stage and thus the amplifier in a normal operating mode. Exceeding the positive common-mode limit on a single input will not change the phase of the output; however, if both inputs exceed the limit, the output of the amplifier will be forced to a high state. The amplifiers will operate with a common-mode input voltage equal to the positive supply; however, the gain bandwidth and slew rate may be decreased in this condition. When the negative common-mode voltage swings to within 3V of the negative supply, an increase in input offset voltage may occur. Each amplifier is individually biased to allow normal circuit operation with power supplies of ±3.0V. Supply voltages less than these may degrade the common-mode rejection and restrict the output voltage swing. The amplifiers will drive a 10 kΩ load resistance to ± 10V over the full temperature range. Precautions should be taken to ensure that the power supply for the integrated circuit never becomes reversed in polarity or that the unit is not inadvertently installed backwards in a socket as an unlimited current surge through the resulting forward diode within the IC could cause fusing of the internal conductors and result in a destroyed unit. A feedback pole is created when the feedback around any amplifier is resistive. The parallel resistance and capacitance from the input of the device (usually the inverting input) to AC ground set the frequency of the pole. In many instances the frequency of this pole is much greater than the expected 3 dB frequency of the closed loop gain and consequently there is negligible effect on stability margin. However, if the feedback pole is less than approximately 6 times the expected 3 dB frequency a lead capacitor should be placed from the output to the input of the op amp. The value of the added capacitor should be such that the RC time constant of this capacitor and the resistance it parallels is greater than or equal to the original feedback pole time constant. 8.2.1.3 Application Curves 2 Input Output 1.5 Input/Output (V) 1 0.5 0 -0.5 -1 -1.5 -2 0 2 4 6 8 10 12 14 Time (s) 16 18 D001 Figure 29. Input and Output Waveforms, Gain = 10, Time Constant = 1 Second 14 Submit Documentation Feedback Copyright © 2017, Texas Instruments Incorporated Product Folder Links: LM442-MIL LM442-MIL www.ti.com SNOSD59 – JUNE 2017 Typical Applications (continued) 8.2.2 "No FET" Low Power V to F Converter D3 10 K D2 0.01 2 pF 15 V 1M INPUT 0V to 10 V 2 3 1M + ± 1M 1 ½ LF442-MIL LM185 1.2 V 1M 5 6 + ± -15 V D1 7 OUTPUT 1 Hz to 1kHz ½ LF442-MIL 1M -15 V 15 V Copyright © 2017, Texas Instruments Incorporated Figure 30. "No FET" Low Power V to F Converter 8.2.2.1 Design Requirements 1. Trim 1M pot for 1 kHz full-scale output. 2. 15 mW power drain. 3. No integrator reset FET required. 4. Mount D1 and D2 in close proximity. 5. 1% linearity to 1 kHz. 8.2.2.2 Detailed Design Procedure See Section 8.2.1.2. 8.2.2.3 Application Curves 15 12 9 Input/Output (V) 6 3 0 -3 -6 -9 -12 Input Output -15 0 0.001 0.002 0.003 0.004 0.005 0.006 Time (s) 0.007 0.008 0.009 D001 Figure 31. Input and Output Waveforms Submit Documentation Feedback Copyright © 2017, Texas Instruments Incorporated Product Folder Links: LM442-MIL 15 LM442-MIL SNOSD59 – JUNE 2017 www.ti.com Typical Applications (continued) 8.2.3 High Efficiency Crystal Oven Controller 15 V 15 V 1.2 M 100 k 1N4148 1.2 M 20 k TEMP TRIM 15 V LM185-1.2 390 k* 2 1.2 M* + 8 ½ LF442-MIL 1 3 ± 100 k 6 4 5 10 k + -15 V R LM395 ± 0.1 15 V ½ LF442-MIL 7 100 k 1k LM135 TEMP SENSOR 1k THERMAL FEEDBACK Copyright © 2017, Texas Instruments Incorporated Figure 32. High Efficiency Crystal Oven Controller 8.2.3.1 Design Requirements 1. Tcontrol= 75°C 2. A1's output represents the amplified difference between the LM335 temperature sensor and the crystal oven's temperature. 3. A2, a free running duty cycle modulator, drives the LM395 to complete a servo loop. 4. Switched mode operation yields high efficiency. 5. 1% metal film resistor. 8.2.3.2 Detailed Design Procedure See Section 8.2.1.2. 8.2.4 Conventional Log Amplifier 5k 100 k 15 V 120 k* LM185-1.2 LM394 300 pF 2k 100 pF ± RIN EIN 100 k OFFSET VOLTAGE ADJUST RIN 2 3 ± ½ LF442-MIL 1 15.7 k* ½ LF442-MIL + 15 V 6 5 + 1M T 1k 1k -15 V EOUT Copyright © 2017, Texas Instruments Incorporated Figure 33. Conventional Log Amplifier 16 Submit Documentation Feedback Copyright © 2017, Texas Instruments Incorporated Product Folder Links: LM442-MIL LM442-MIL www.ti.com SNOSD59 – JUNE 2017 Typical Applications (continued) 8.2.4.1 Design Requirements 1. RT = Tel Labs type Q81. 2. Trim 5k for 10 μA through the 5k–120k combination. 3. *1% film resistor 8.2.4.2 Detailed Design Procedure See Section 8.2.1.2. 8.2.5 Unconventional Log Amplifier 15 V 12 V LM340L-12 1k 10 k Q1 10k* LM329 100 k SCALE FACTOR 75 k* ADJUST 8 7 11 4 5 ± 12 21 2k 16 + ½ LF442-MIL 6 10 Q2 9 15 V 1N914 2.2 k* 17 1k 2N2907 ± 27 8 7 + ½ LF442-MIL OUTPUT 0 TO 10 V FOR INPUTS OF 10 nA -15 V to 1 mA 2 k* 14 300 pF 13 Q3 15 10 k 1.4 k 12 V 2 I LOG INPUT 3 E LOG INPUT 15 V ± + 1 ½ LF442-MIL 10 M 50 k ZERO ADJUST - 15 V Copyright © 2017, Texas Instruments Incorporated Figure 34. Unconventional Log Amplifier 8.2.5.1 Design Requirements 1. Q1, Q2, Q3 are included on LM389 amplifier chip which is temperature-stabilized by the LM389 and Q2-Q3, which act as a heater-sensor pair. 2. Q1, the logging transistor, is thus immune to ambient temperature variation and requires no temperature compensation at all. Submit Documentation Feedback Copyright © 2017, Texas Instruments Incorporated Product Folder Links: LM442-MIL 17 LM442-MIL SNOSD59 – JUNE 2017 www.ti.com Typical Applications (continued) 8.2.5.2 Detailed Design Procedure See Section 8.2.1.2. 18 Submit Documentation Feedback Copyright © 2017, Texas Instruments Incorporated Product Folder Links: LM442-MIL LM442-MIL www.ti.com SNOSD59 – JUNE 2017 9 Power Supply Recommendations For proper operation, the power supplies must be properly decoupled. For decoupling the supply lines it is suggested that 0.1µF capacitors be placed as close as possible to the op amp power supply pins. The minimum power supply voltage is ±5V. 10 Layout 10.1 Layout Guidelines As with most amplifiers, care should be taken with lead dress, component placement and supply decoupling in order to ensure stability. For example, resistors from the output to an input should be placed with the body close to the input to minimize “pick-up” and maximize the frequency of the feedback pole by minimizing the capacitance from the input to ground. 10.2 Layout Example Figure 35. LF442-MIL Layout Submit Documentation Feedback Copyright © 2017, Texas Instruments Incorporated Product Folder Links: LM442-MIL 19 LM442-MIL SNOSD59 – JUNE 2017 www.ti.com 11 Device and Documentation Support 11.1 Receiving Notification of Documentation Updates To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper right corner, click on Alert me to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document. 11.2 Community Resources The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use. TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers. Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support. 11.3 Trademarks E2E is a trademark of Texas Instruments. All other trademarks are the property of their respective owners. 11.4 Electrostatic Discharge Caution This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. 11.5 Glossary SLYZ022 — TI Glossary. This glossary lists and explains terms, acronyms, and definitions. 20 Submit Documentation Feedback Copyright © 2017, Texas Instruments Incorporated Product Folder Links: LM442-MIL LM442-MIL www.ti.com SNOSD59 – JUNE 2017 12 Mechanical, Packaging, and Orderable Information The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. Submit Documentation Feedback Copyright © 2017, Texas Instruments Incorporated Product Folder Links: LM442-MIL 21 PACKAGE OPTION ADDENDUM www.ti.com 29-Jun-2017 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) LF442-MWA ACTIVE WAFERSALE YS 0 1 Green (RoHS & no Sb/Br) Call TI Level-1-NA-UNLIM -40 to 85 LF442AMH ACTIVE TO-99 LMC 8 500 TBD Call TI Call TI -55 to 125 ( LF442AMH ~ LF442AMH) LF442AMH/NOPB ACTIVE TO-99 LMC 8 500 Green (RoHS & no Sb/Br) Call TI Level-1-NA-UNLIM -55 to 125 ( LF442AMH ~ LF442AMH) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based flame retardants must also meet the <=1000ppm threshold requirement. (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 29-Jun-2017 In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated (TI) reserves the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. TI’s published terms of sale for semiconductor products (http://www.ti.com/sc/docs/stdterms.htm) apply to the sale of packaged integrated circuit products that TI has qualified and released to market. Additional terms may apply to the use or sale of other types of TI products and services. Reproduction of significant portions of TI information in TI data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such reproduced documentation. Information of third parties may be subject to additional restrictions. Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Buyers and others who are developing systems that incorporate TI products (collectively, “Designers”) understand and agree that Designers remain responsible for using their independent analysis, evaluation and judgment in designing their applications and that Designers have full and exclusive responsibility to assure the safety of Designers' applications and compliance of their applications (and of all TI products used in or for Designers’ applications) with all applicable regulations, laws and other applicable requirements. Designer represents that, with respect to their applications, Designer has all the necessary expertise to create and implement safeguards that (1) anticipate dangerous consequences of failures, (2) monitor failures and their consequences, and (3) lessen the likelihood of failures that might cause harm and take appropriate actions. Designer agrees that prior to using or distributing any applications that include TI products, Designer will thoroughly test such applications and the functionality of such TI products as used in such applications. TI’s provision of technical, application or other design advice, quality characterization, reliability data or other services or information, including, but not limited to, reference designs and materials relating to evaluation modules, (collectively, “TI Resources”) are intended to assist designers who are developing applications that incorporate TI products; by downloading, accessing or using TI Resources in any way, Designer (individually or, if Designer is acting on behalf of a company, Designer’s company) agrees to use any particular TI Resource solely for this purpose and subject to the terms of this Notice. TI’s provision of TI Resources does not expand or otherwise alter TI’s applicable published warranties or warranty disclaimers for TI products, and no additional obligations or liabilities arise from TI providing such TI Resources. TI reserves the right to make corrections, enhancements, improvements and other changes to its TI Resources. TI has not conducted any testing other than that specifically described in the published documentation for a particular TI Resource. Designer is authorized to use, copy and modify any individual TI Resource only in connection with the development of applications that include the TI product(s) identified in such TI Resource. NO OTHER LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE TO ANY OTHER TI INTELLECTUAL PROPERTY RIGHT, AND NO LICENSE TO ANY TECHNOLOGY OR INTELLECTUAL PROPERTY RIGHT OF TI OR ANY THIRD PARTY IS GRANTED HEREIN, including but not limited to any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information regarding or referencing third-party products or services does not constitute a license to use such products or services, or a warranty or endorsement thereof. Use of TI Resources may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. TI RESOURCES ARE PROVIDED “AS IS” AND WITH ALL FAULTS. TI DISCLAIMS ALL OTHER WARRANTIES OR REPRESENTATIONS, EXPRESS OR IMPLIED, REGARDING RESOURCES OR USE THEREOF, INCLUDING BUT NOT LIMITED TO ACCURACY OR COMPLETENESS, TITLE, ANY EPIDEMIC FAILURE WARRANTY AND ANY IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, AND NON-INFRINGEMENT OF ANY THIRD PARTY INTELLECTUAL PROPERTY RIGHTS. TI SHALL NOT BE LIABLE FOR AND SHALL NOT DEFEND OR INDEMNIFY DESIGNER AGAINST ANY CLAIM, INCLUDING BUT NOT LIMITED TO ANY INFRINGEMENT CLAIM THAT RELATES TO OR IS BASED ON ANY COMBINATION OF PRODUCTS EVEN IF DESCRIBED IN TI RESOURCES OR OTHERWISE. IN NO EVENT SHALL TI BE LIABLE FOR ANY ACTUAL, DIRECT, SPECIAL, COLLATERAL, INDIRECT, PUNITIVE, INCIDENTAL, CONSEQUENTIAL OR EXEMPLARY DAMAGES IN CONNECTION WITH OR ARISING OUT OF TI RESOURCES OR USE THEREOF, AND REGARDLESS OF WHETHER TI HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. Unless TI has explicitly designated an individual product as meeting the requirements of a particular industry standard (e.g., ISO/TS 16949 and ISO 26262), TI is not responsible for any failure to meet such industry standard requirements. Where TI specifically promotes products as facilitating functional safety or as compliant with industry functional safety standards, such products are intended to help enable customers to design and create their own applications that meet applicable functional safety standards and requirements. Using products in an application does not by itself establish any safety features in the application. Designers must ensure compliance with safety-related requirements and standards applicable to their applications. Designer may not use any TI products in life-critical medical equipment unless authorized officers of the parties have executed a special contract specifically governing such use. Life-critical medical equipment is medical equipment where failure of such equipment would cause serious bodily injury or death (e.g., life support, pacemakers, defibrillators, heart pumps, neurostimulators, and implantables). Such equipment includes, without limitation, all medical devices identified by the U.S. Food and Drug Administration as Class III devices and equivalent classifications outside the U.S. TI may expressly designate certain products as completing a particular qualification (e.g., Q100, Military Grade, or Enhanced Product). Designers agree that it has the necessary expertise to select the product with the appropriate qualification designation for their applications and that proper product selection is at Designers’ own risk. Designers are solely responsible for compliance with all legal and regulatory requirements in connection with such selection. Designer will fully indemnify TI and its representatives against any damages, costs, losses, and/or liabilities arising out of Designer’s noncompliance with the terms and provisions of this Notice. Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2017, Texas Instruments Incorporated