Sample & Buy Product Folder Support & Community Tools & Software Technical Documents AFE5816 SBAS688C – APRIL 2015 – REVISED AUGUST 2015 AFE5816 16-Channel Ultrasound AFE with 90-mW/Channel Power, 1-nV/√Hz Noise, 14-Bit, 65-MSPS or 12-Bit, 80-MSPS ADC and Passive CW Mixer 1 1 Features • • • • • • • • • 16-Channel, AFE for Ultrasound Applications: – Input Attenuator, LNA, LPF, ADC, and CW Mixer – Digital Time Gain Compensation (DTGC) – Total Gain Range: 6 dB to 45 dB – Linear Input Range: 1 VPP Input Attenuator with DTGC: – 8-dB to 0-dB Attenuation with 0.125-dB Step – Supports Matched Impedance for: – 50-Ω to 800-Ω Source Impedance Low-Noise Amplifier (LNA) with DTGC: – 14-dB to 45-dB Gain with 0.125-dB Step – Low Input Current Noise: 1.2 pA/√Hz 3rd-Order, Linear-Phase, Low-Pass Filter (LPF): – 10 MHz, 15 MHz, 20 MHz, and 25 MHz Analog-to-Digital Converter (ADC): – 14-Bit ADC: 75-dBFS SNR at 65 MSPS – 12-Bit ADC: 72-dBFS SNR at 80 MSPS LVDS Interface with a Maximum Speed Up to 1 GBPS Optimized for Noise and Power: – 90 mW/Ch at 1 nV/√Hz, 65 MSPS – 55 mW/Ch at 1.45 nV/√Hz, 40 MSPS – 59 mW/Ch in CW Mode Excellent Device-to-Device Gain Matching: – ±0.5 dB (Typical) Low Harmonic Distortion: –60-dBc Level • • Fast and Consistent Overload Recovery Continuous Wave (CW) Path with: – Low Close-In Phase Noise of –148 dBc/Hz at 1-kHz frequency – Phase Resolution: λ / 16 – Supports 16X, 8X, 4X, and 1X CW Clocks Small Package: 15-mm × 15-mm NFBGA-289 • 2 Applications • • • • Medical Ultrasound Imaging Nondestructive Evaluation Equipment Sonar Imaging Equipment Multichannel, High-Speed Data Acquisition 3 Description The AFE5816 is a highly-integrated, analog front-end (AFE) solution specifically designed for ultrasound systems where high performance, low power, and small size are required. Device Information(1) PART NUMBER AFE5816 OUTPUT INTERFACE LVDS only DIGITAL I/Q DEMODULATOR Not supported (1) For all available packages, see the package option addendum at the end of the datasheet. Simplified Block Diagram SPI IN SPI Logic INP ATTEN ±8 dB to 0 dB 3rd-Order LPF with 10 MHz, 15 MHz, 20 MHz, and 25 MHz LNA 14 dB to 45 dB 12- or 14-Bit ADC LVDS Digital Processing INM 1 of 16 Channels 16 x 16 Cross-Point Switch TGC Control Signals CW Mixer Reference DTGC Engine 16-Phase Generator CW Clocks CW Current Outputs 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. AFE5816 SBAS688C – APRIL 2015 – REVISED AUGUST 2015 www.ti.com Table of Contents 1 2 3 4 5 6 Features .................................................................. Applications ........................................................... Description ............................................................. Revision History..................................................... Description (continued)......................................... Functional Block Diagram .................................... 1 1 1 2 3 4 7 Device and Documentation Support.................... 5 7.1 7.2 7.3 7.4 8 Documentation Support ........................................... Trademarks ............................................................... Electrostatic Discharge Caution ................................ Glossary .................................................................... 5 5 5 5 Mechanical, Packaging, and Orderable Information ............................................................. 5 4 Revision History NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from Revision B (June 2015) to Revision C Page • Removed AFE58JD16 from document .................................................................................................................................. 1 • Changed Functional Block Diagram: removed references to AFE58JD16 ........................................................................... 4 Changes from Revision A (April 2015) to Revision B • 2 Page Changed from product preview to production data ................................................................................................................ 1 Submit Documentation Feedback Copyright © 2015, Texas Instruments Incorporated Product Folder Links: AFE5816 AFE5816 www.ti.com SBAS688C – APRIL 2015 – REVISED AUGUST 2015 5 Description (continued) The AFE5816 is an integrated analog front-end (AFE) optimized for medical ultrasound application. The AFE5816 is a multichip module (MCM) device with two dies: VCA and ADC_CONV. Each die has total of 16 channels. Each channel in the VCA die can be configured in two modes: time gain compensation (TGC) mode and continuous wave (CW) mode. In TGC mode, each channel includes an input attenuator (ATTEN), a low-noise amplifier (LNA) with variable-gain, and a third-order, low-pass filter (LPF). The attenuator supports an attenuation range of 8 dB to 0 dB, and the LNA supports gain ranges from 14 dB to 45 dB. The LPF cutoff frequency can be configured at 10 MHz, 15 MHz, 20 MHz, or 25 MHz to support ultrasound applications with different frequencies. In CW mode, each channel includes an LNA with a fixed gain of 18 dB, and a low-power passive mixer with 16 selectable phase delays. Different phase delays can be applied to each analog input signal to perform an on-chip beamforming operation. A harmonic filter in the CW mixer suppresses the third and fifth harmonic to enhance the sensitivity of the CW Doppler measurement. CW mode supports three clock modes: 16X, 8X, and 4X. Each channel of the ADC_CONV die has a high-performance analog-to-digital converter (ADC) with a programmable resolution of 14 bits or 12 bits. The ADC achieves 75-dBFS signal-to-noise ratio (SNR) in 14-bit mode, and 72-dBFS SNR in 12-bit mode. This ADC provides excellent SNR at low-channel gain. The devices operate at maximum speeds of 65 MSPS and 80 MSPS, providing 14-bit and 12-bit output, respectively. The ADC is designed to scale power with sampling rate. The output interface of the ADC is a low-voltage differential signaling (LVDS) interface that can easily interface with low-cost field-programmable gate arrays (FPGAs). The AFE5816 also allows various power and noise combinations to be selected for optimizing system performance. Therefore, these devices are suitable ultrasound AFE solutions for systems with strict battery-life requirements. The AFE5816 is available in a 15-mm × 15-mm NFBGA-289 package (ZAV package, S-PBGAN289) and is specified for operation from –40°C to +85°C. The device pinout is also similar to the AFE5818 family. For the full data sheet, email the AFE5816 support at [email protected], or contact your local TI sales representative. Submit Documentation Feedback Copyright © 2015, Texas Instruments Incorporated Product Folder Links: AFE5816 3 AFE5816 SBAS688C – APRIL 2015 – REVISED AUGUST 2015 www.ti.com DVDD_1P8 DVDD_1P2 AVDD_1P8 AVDD_3 AVDD_1P9 6 Functional Block Diagram VCM BIAS_2P5 Reference Voltage/ Current Generator BAND_GAP LNA_INCM SRC_BIAS ATTENUATOR LPF 10, 15, 20, 25 MHz LNA with HPF INM1 CW Mixer 10nF CW_CLOCK ANALOG INPUTS + ± TGC CONTROL LVDS CW_CH1 16X16 Cross point SW INP2 INP_SOURCE ADC 1 TR_EN<1> ATTENUATOR LPF 10, 15, 20, 25 MHz LNA with HPF 10nF INM2 CW Mixer 10nF CW_CLOCK ADC 2 TGC CONTROL CW_CH2 DOUTP1 DOUTM1 DOUTP2 DOUTM2 DOUTP16 DOUTM16 16X16 Cross point SW LVDS OUTPUTS 10nF LVDS SERIALIZER + ± TR_EN<1> INP1 Digital Processing (Optional) INP_SOURCE FCLKP FCLKM DCLKP DCLKM INP_SOURCE TR_EN<4> INP16 ATTENUATOR LPF 10, 15, 20, 25 MHz LNA with HPF 10nF INM16 CW Mixer 10nF CW_CLOCK TR_EN<1> TR_EN<2> TR_EN<3> TR_EN<4> ADC 16 TGC CONTROL CW_CH16 CONVERSION CLOCK + ± 16X16 Cross point SW TR_EN<1> TR_EN<2> TR_EN<3> TR_EN<4> TGC CONTROL CW CLOCK CLKP_16x CLKM_16x CW_CH15 CW_CH16 CW_CH1 CW_CH2 CW_CLOCK TGC Control Engine Clock Generator SYNC GEN SERIAL INTERFACE SDOUT 16 Phase Generator CLKP_1x SCLK SEN PDN_FAST PDN_GBL RESET SDIN TX_TRIG ADC_CLKP ADC_CLKM TGC_UP_DN ADC CLOCK or SYSTEM CLOCK TGC_SLOPE TGC_PROF<2> CW_IP/QP_OUTP/M TGC_PROF<1> DVSS AVSS CLKM_1x 4 Submit Documentation Feedback Copyright © 2015, Texas Instruments Incorporated Product Folder Links: AFE5816 AFE5816 www.ti.com SBAS688C – APRIL 2015 – REVISED AUGUST 2015 7 Device and Documentation Support 7.1 Documentation Support 7.1.1 Related Documentation AFE5818 Data Sheet, SBAS687 ADS8413 Data Sheet, SLAS490 ADS8472 Data Sheet, SLAS514 CDCE72010 Data Sheet, SCAS858 CDCM7005 Data Sheet, SCAS793 ISO7240 Data Sheet, SLLS868 LMK04803 Data Sheet, SNAS489 OPA1632 Data Sheet, SBOS286 OPA2211 Data Sheet, SBOS377 SN74AUP1T04 Data Sheet, SCES800 THS4130 Data Sheet, SLOS318 MicroStar BGA Packaging Reference Guide, SSYZ015 WEBENCH® Filter Designer 7.2 Trademarks All trademarks are the property of their respective owners. 7.3 Electrostatic Discharge Caution These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. 7.4 Glossary SLYZ022 — TI Glossary. This glossary lists and explains terms, acronyms, and definitions. 8 Mechanical, Packaging, and Orderable Information The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. Submit Documentation Feedback Copyright © 2015, Texas Instruments Incorporated Product Folder Links: AFE5816 5 PACKAGE OPTION ADDENDUM www.ti.com 19-Aug-2015 PACKAGING INFORMATION Orderable Device Status (1) AFE5816ZAV ACTIVE Package Type Package Pins Package Drawing Qty NFBGA ZAV 289 126 Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Green (RoHS & no Sb/Br) SNAGCU Level-3-260C-168 HR Op Temp (°C) Device Marking (4/5) -40 to 85 AFE5816 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. 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