Material Content Data Sheet Sales Product Name ITS724G Issued MA# MA001368818 Package PG-DSO-20-32 22. May 2015 Weight* 479.05 mg Construction Element Material Group Substances CAS# if applicable Weight [mg] Average Mass [%] chip leadframe inorganic material inorganic material non noble metal non noble metal non noble metal non noble metal organic material plastics inorganic material non noble metal noble metal plastics noble metal < 10% silicon phosphorus zinc iron copper aluminium carbon black epoxy resin silicondioxide tin silver epoxy resin silver 7440-21-3 7723-14-0 7440-66-6 7439-89-6 7440-50-8 7429-90-5 1333-86-4 60676-86-0 7440-31-5 7440-22-4 7440-22-4 9.466 1.98 0.036 0.01 0.143 0.03 299 2.862 0.60 5974 116.197 24.26 24.90 242556 248904 0.418 0.09 0.09 872 872 0.687 0.14 wire encapsulation leadfinish plating glue *deviation Sum [%] Average Mass [ppm] Sum [ppm] 1.98 19761 19761 75 1434 31.601 6.60 311.205 64.94 71.68 649629 717030 2.780 0.58 0.58 5804 5804 1.177 0.25 0.25 2456 2456 0.434 0.09 2.045 0.43 65967 905 0.52 Sum in total: 100.00 Important Remarks: 1. 2. 3. Infineon Technologies AG provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. This product is in compliance with EU Directive 2011/65/EU (RoHS) and does not use any exemption. Company Infineon Technologies AG Address 81726 München Internet www.infineon.com 4268 5173 1000000