TI1 LM4050CIM3-4.1/NOPB Lm4050-n/lm4050-n-q1 precision micropower shunt voltage reference Datasheet

LM4050-N, LM4050-N-Q1
www.ti.com
SNOS455E – MAY 2000 – REVISED APRIL 2013
LM4050-N/LM4050-N-Q1 Precision Micropower Shunt Voltage Reference
Check for Samples: LM4050-N, LM4050-N-Q1
FEATURES
DESCRIPTION
•
•
•
•
Ideal for space critical applications, the LM4050-N
precision voltage reference is available in the subminiature (3 mm x 1.3 mm) SOT-23 surface-mount
package. The LM4050-N design eliminates the need
for an external stabilizing capacitor while ensuring
stability with any capacitive load, thus making the
LM4050-N easy to use. Further reducing design effort
is the availability of several fixed reverse breakdown
voltages: 2.048V, 2.500V, 4.096V, 5.000V, 8.192V,
and 10.000V. The minimum operating current
increases from 60 μA for the LM4050-N-2.0 to 100
μA for the LM4050-N-10.0. All versions have a
maximum operating current of 15 mA.
1
2
Small Package: SOT-23
No Output Capacitor Required
Tolerates Capacitive Loads
Fixed Reverse Breakdown Voltages of 2.048V,
2.500V, 4.096V, 5.000V, 8.192V, and 10.000V
APPLICATIONS
•
•
•
•
•
•
•
•
Portable, Battery-Powered Equipment
Data Acquisition Systems
Instrumentation
Process Control
Energy Management
Product Testing
Automotive
Precision Audio Components
KEY SPECIFICATIONS (LM4050-N-2.5)
•
•
•
•
•
•
•
Output Voltage Tolerance (A grade, 25°C)
±0.1% (max)
Low Output Noise (10 Hz to 10 kHz) 41
μVrms(typ)
Wide Operating Current Range 60 μA to 15 mA
Industrial Temperature Range −40°C to +85°C
Extended Temperature Range −40°C to +125°C
Low Temperature Coefficient 50 ppm/°C (max)
LM4050-N-Q1A/-Q1B/-1QC are AECQ100 Grade
1 Qualified and are Manufactured on an
Automotive Grade Flow
The LM4050-N utilizes fuse and zener-zap reverse
breakdown voltage trim during wafer sort to ensure
that the prime parts have an accuracy of better than
±0.1% (A grade) at 25°C. Bandgap reference
temperature drift curvature correction and low
dynamic
impedance
ensure
stable
reverse
breakdown voltage accuracy over a wide range of
operating temperatures and currents.
All grades and voltage options of the LM4050-N are
available in both an industrial temperature range
(−40°C and +85°C) and an extended temperature
range (−40°C and +125°C).
CONNECTION DIAGRAM
*This pin must be left floating or connected
to pin 2.
Figure 1. SOT-23, Top View
1
2
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2000–2013, Texas Instruments Incorporated
LM4050-N, LM4050-N-Q1
SNOS455E – MAY 2000 – REVISED APRIL 2013
www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Absolute Maximum Ratings (1) (2)
Reverse Current
20 mA
Forward Current
10 mA
Power Dissipation (TA = 25°C) (3)
DBZ Package
280 mW
−65°C to +150°C
Storage Temperature
Lead Temperature
DBZ Package
Vapor phase (60 seconds)
+215°C
Infrared (15 seconds)
+220°C
Human Body Model
ESD Susceptibility
(4)
2 kV
Machine Model (4)
200V
See AN-450 “Surface Mounting Methods and Their Effect on Product Reliability” for other methods of soldering surface mount devices.
(1)
(2)
(3)
(4)
Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is functional, but do not guarantee specific performance limits. For guaranteed specifications and test conditions, see
the Electrical Characteristics. The guaranteed specifications apply only for the test conditions listed. Some performance characteristics
may degrade when the device is not operated under the listed test conditions.
If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and
specifications.
The maximum power dissipation must be derated at elevated temperatures and is dictated by TJmax (maximum junction temperature),
θJA (junction to ambient thermal resistance), and TA (ambient temperature). The maximum allowable power dissipation at any
temperature is PDmax = (TJmax − TA)/θJA or the number given in the Absolute Maximum Ratings, whichever is lower. For the LM4050-N,
TJmax = 125°C, and the typical thermal resistance (θJA), when board mounted, is 326°C/W for the SOT-23 package.
The human body model is a 100 pF capacitor discharged through a 1.5 kΩ resistor into each pin. The machine model is a 200 pF
capacitor discharged directly into each pin.
Operating Ratings (1)
(Tmin ≤ TA ≤ Tmax)
Temperature Range
−40°C ≤ TA ≤ +85°C
Industrial Temperature Range
−40°C ≤ TA ≤ +125°C
Extended temperature Range
Reverse Current
(1)
2
LM4050-N-2.0,
60 μA to 15 mA
LM4050-N-2.5
60 μA to 15 mA
LM4050-N-4.1
68 μA to 15 mA
LM4050-N-5.0
74 μA to 15 mA
LM4050-N-8.2
91 μA to 15 mA
LM4050-N-10.0
100 μA to 15 mA
The maximum power dissipation must be derated at elevated temperatures and is dictated by TJmax (maximum junction temperature),
θJA (junction to ambient thermal resistance), and TA (ambient temperature). The maximum allowable power dissipation at any
temperature is PDmax = (TJmax − TA)/θJA or the number given in the Absolute Maximum Ratings, whichever is lower. For the LM4050-N,
TJmax = 125°C, and the typical thermal resistance (θJA), when board mounted, is 326°C/W for the SOT-23 package.
Submit Documentation Feedback
Copyright © 2000–2013, Texas Instruments Incorporated
Product Folder Links: LM4050-N LM4050-N-Q1
LM4050-N, LM4050-N-Q1
www.ti.com
SNOS455E – MAY 2000 – REVISED APRIL 2013
LM4050-N-2.0
Electrical Characteristics
Boldface limits apply for TA = TJ = TMIN to TMAX; all other limits TA = TJ = 25°C. The grades A, B and C designate initial
Reverse Breakdown Voltage tolerances of ±0.1%, ±0.2%, and 0.5% respectively.
Symbol
VR
IRMIN
Parameter
Conditions
ΔVR/ΔIR
IR = 100 μA
IR = 100 μA
±2.048
±4.096
±10.24
mV (max)
Industrial Temp. Range
±9.0112
±11.4688
±14.7456
mV (max)
Extended Temp. Range
±12.288
±14.7456
±17.2032
mV (max)
60
60
60
μA (max)
65
65
65
μA (max)
Average Reverse Breakdown
Voltage Temperature
Coefficient (3)
Reverse Breakdown Voltage
Change with Operating Current
Change (4)
2.048
±20
ppm/°C
IR = 1 mA
±15
ppm/°C
IR = 100 μA
±15
IRMIN ≤ IR ≤ 1 mA
0.3
0.3
eN
Wideband Noise
IR = 100 μA
10 Hz ≤ f ≤ 10 kHz
34
ΔVR
Reverse Breakdown Voltage
Long Term Stability
t = 1000 hrs
T = 25°C ±0.1°C
IR = 100 μA
120
Thermal Hysteresis
ΔT = −40°C to 125°C
0.7
(5)
±50
±50
±50
ppm/°C
(max)
0.8
0.8
0.8
mV (max)
1.2
1.2
1.2
mV (max)
6.0
6.0
6.0
mV (max)
8.0
8.0
8.0
mV (max)
mV
2.3
IR = 1 mA, f = 120 Hz, IAC
= 0.1 IR
(4)
μA
IR = 10 mA
Reverse Dynamic Impedance
(3)
V
41
ZR
(1)
(2)
Units
(Limit)
Reverse Breakdown Voltage
Tolerance (3)
1 mA ≤ IR ≤ 15 mA
VHYST
LM4050-NAIM3 LM4050-NBIM3 LM4050-NCIM3
LM4050LM4050LM4050NAEM3
NBEM3
NCEM3
Limits (2)
Limits (2)
Limits (2)
Reverse Breakdown Voltage
Minimum Operating Current
ΔVR/ΔT
Typical (1)
mV
Ω
μVrms
ppm
mV
(5)
Typicals are at TJ = 25°C and represent most likely parametric norm.
Limits are 100% production tested at 25°C. Limits over temperature are guaranteed through correlation using Statistical Quality Control
(SQC) methods. The limits are used to calculate National's AOQL.
The boldface (over-temperature) limit for Reverse Breakdown Voltage Tolerance is defined as the room temperature Reverse
Breakdown Voltage Tolerance ±[(ΔV R/ΔT)(maxΔT)(VR)]. Where, ΔVR/ΔT is the VR temperature coefficient, maxΔT is the maximum
difference in temperature from the reference point of 25°C to T MIN or TMAX, and VR is the reverse breakdown voltage. The total overtemperature tolerance for the different grades in the industrial temperature range where maxΔT = 65°C is shown below:
A-grade:
±0.425% = ±0.1% ±50 ppm/°C × 65°C
B-grade: ±0.525% = ±0.2% ±50 ppm/°C × 65°C
C-grade: ±0.825% = ±0.5% ±50 ppm/°C ×
65°CTherefore, as an example, the A-grade LM4050-N-2.5 has an over-temperature Reverse Breakdown Voltage tolerance of ±2.5V ×
0.425% = ±11 mV.
Load regulation is measured on pulse basis from no load to the specified load current. Output changes due to die temperature change
must be taken into account separately.
Thermal hysteresis is defined as the difference in voltage measured at +25°C after cycling to temperature -40°C and the 25°C
measurement after cycling to temperature +125°C.
Copyright © 2000–2013, Texas Instruments Incorporated
Product Folder Links: LM4050-N LM4050-N-Q1
Submit Documentation Feedback
3
LM4050-N, LM4050-N-Q1
SNOS455E – MAY 2000 – REVISED APRIL 2013
www.ti.com
LM4050-N-2.5
Electrical Characteristics
Boldface limits apply for TA = TJ = TMIN to TMAX; all other limits TA = TJ = 25°C. The grades A, B and C designate initial
Reverse Breakdown Voltage tolerances of ±0.1%, ±0.2%, and 0.5% respectively.
Symbol
VR
IRMIN
Parameter
Conditions
ΔVR/ΔIR
IR = 100 μA
±2.5
±5.0
±13
mV (max)
Industrial Temp. Range
±11
±14
±21
mV (max)
Extended Temp. Range
±15
±18
±25
mV (max)
60
60
60
μA (max)
65
65
65
μA (max)
Average Reverse Breakdown
Voltage Temperature Coefficient (3)
Reverse Breakdown Voltage
Change with Operating Current
Change (4)
2.500
IR = 10 mA
±20
IR = 1 mA
±15
IR = 100 μA
±15
IRMIN ≤ IR ≤ 1 mA
0.3
0.3
eN
Wideband Noise
IR = 100 μA
10 Hz ≤ f ≤ 10 kHz
41
ΔVR
Reverse Breakdown Voltage Long
Term Stability
t = 1000 hrs
T = 25°C ±0.1°C
IR = 100 μA
120
Thermal Hysteresis
ΔT = −40°C to 125°C
0.7
(5)
4
μA
ppm/°C
ppm/°C
±50
±50
±50
ppm/°C (max)
0.8
0.8
0.8
mV (max)
1.2
1.2
1.2
mV (max)
6.0
6.0
6.0
mV (max)
8.0
8.0
8.0
mV (max)
mV
2.3
IR = 1 mA, f = 120 Hz, IAC =
0.1 IR
(4)
V
41
Reverse Dynamic Impedance
(3)
Units
(Limit)
IR = 100 μA
ZR
(1)
(2)
LM4050NCIM3
LM4050NCEM3
Limits (2)
Reverse Breakdown Voltage
Tolerance (3)
1 mA ≤ IR ≤ 15 mA
VHYST
LM4050NBIM3
LM4050NBEM3
Limits (2)
Reverse Breakdown Voltage
Minimum Operating Current
ΔVR/ΔT
Typical (1)
LM4050NAIM3
LM4050NAEM3
Limits (2)
mV
Ω
μVrms
ppm
mV
(5)
Typicals are at TJ = 25°C and represent most likely parametric norm.
Limits are 100% production tested at 25°C. Limits over temperature are guaranteed through correlation using Statistical Quality Control
(SQC) methods. The limits are used to calculate National's AOQL.
The boldface (over-temperature) limit for Reverse Breakdown Voltage Tolerance is defined as the room temperature Reverse
Breakdown Voltage Tolerance ±[(ΔV R/ΔT)(maxΔT)(VR)]. Where, ΔVR/ΔT is the VR temperature coefficient, maxΔT is the maximum
difference in temperature from the reference point of 25°C to T MIN or TMAX, and VR is the reverse breakdown voltage. The total overtemperature tolerance for the different grades in the industrial temperature range where maxΔT = 65°C is shown below:
A-grade:
±0.425% = ±0.1% ±50 ppm/°C × 65°C
B-grade: ±0.525% = ±0.2% ±50 ppm/°C × 65°C
C-grade: ±0.825% = ±0.5% ±50 ppm/°C ×
65°CTherefore, as an example, the A-grade LM4050-N-2.5 has an over-temperature Reverse Breakdown Voltage tolerance of ±2.5V ×
0.425% = ±11 mV.
Load regulation is measured on pulse basis from no load to the specified load current. Output changes due to die temperature change
must be taken into account separately.
Thermal hysteresis is defined as the difference in voltage measured at +25°C after cycling to temperature -40°C and the 25°C
measurement after cycling to temperature +125°C.
Submit Documentation Feedback
Copyright © 2000–2013, Texas Instruments Incorporated
Product Folder Links: LM4050-N LM4050-N-Q1
LM4050-N, LM4050-N-Q1
www.ti.com
SNOS455E – MAY 2000 – REVISED APRIL 2013
LM4050-N-4.1
Electrical Characteristics
Boldface limits apply for TA = TJ = TMIN to TMAX; all other limits TA = TJ = 25°C. The grades A, B and C designate initial
Reverse Breakdown Voltage tolerances of ±0.1%, ±0.2%, and 0.5% respectively.
Symbol
VR
IRMIN
Parameter
Conditions
ΔVR/ΔIR
IR = 100 μA
±4.1
±8.2
±21
mV (max)
Industrial Temp. Range
±18
±22
±34
mV (max)
Extended Temp. Range
±25
±29
±41
mV (max)
68
68
68
μA (max)
Industrial Temp. Range
73
73
73
μA (max)
Extended Temp. Range
78
78
78
μA (max)
Average Reverse Breakdown
Voltage Temperature Coefficient (3)
Reverse Breakdown Voltage
Change with Operating Current
Change (4)
4.096
IR = 10 mA
±30
IR = 1 mA
±20
IR = 100 μA
±20
IRMIN ≤ IR ≤ 1 mA
0.2
0.5
eN
Wideband Noise
IR = 100 μA
10 Hz ≤ f ≤ 10 kHz
93
ΔVR
Reverse Breakdown Voltage Long
Term Stability
t = 1000 hrs
T = 25°C ±0.1°C
IR = 100 μA
120
Thermal Hysteresis (5)
ΔT = −40°C to 125°C
(5)
μA
ppm/°C
ppm/°C
±50
±50
±50
ppm/°C (max)
0.9
0.9
0.9
mV (max)
1.2
1.2
1.2
mV (max)
7.0
7.0
7.0
mV (max)
10.0
10.0
10.0
mV (max)
mV
2.0
IR = 1 mA, f = 120 Hz,
IAC = 0.1 IR
(4)
V
52
Reverse Dynamic Impedance
(3)
Units
(Limit)
IR = 100 μA
ZR
(1)
(2)
LM4050NCIM3
LM4050NCEM3
Limits (2)
Reverse Breakdown Voltage
Tolerance (3)
1 mA ≤ IR ≤ 15 mA
VHYST
LM4050NBIM3
LM4050NBEM3
Limits (2)
Reverse Breakdown Voltage
Minimum Operating Current
ΔVR/ΔT
Typical (1)
LM4050NAIM3
LM4050NAEM3
Limits (2)
mV
Ω
μVrms
ppm
1.148
mV
Typicals are at TJ = 25°C and represent most likely parametric norm.
Limits are 100% production tested at 25°C. Limits over temperature are guaranteed through correlation using Statistical Quality Control
(SQC) methods. The limits are used to calculate National's AOQL.
The boldface (over-temperature) limit for Reverse Breakdown Voltage Tolerance is defined as the room temperature Reverse
Breakdown Voltage Tolerance ±[(ΔV R/ΔT)(maxΔT)(VR)]. Where, ΔVR/ΔT is the VR temperature coefficient, maxΔT is the maximum
difference in temperature from the reference point of 25°C to T MIN or TMAX, and VR is the reverse breakdown voltage. The total overtemperature tolerance for the different grades in the industrial temperature range where maxΔT = 65°C is shown below:
A-grade:
±0.425% = ±0.1% ±50 ppm/°C × 65°C
B-grade: ±0.525% = ±0.2% ±50 ppm/°C × 65°C
C-grade: ±0.825% = ±0.5% ±50 ppm/°C ×
65°CTherefore, as an example, the A-grade LM4050-N-2.5 has an over-temperature Reverse Breakdown Voltage tolerance of ±2.5V ×
0.425% = ±11 mV.
Load regulation is measured on pulse basis from no load to the specified load current. Output changes due to die temperature change
must be taken into account separately.
Thermal hysteresis is defined as the difference in voltage measured at +25°C after cycling to temperature -40°C and the 25°C
measurement after cycling to temperature +125°C.
Copyright © 2000–2013, Texas Instruments Incorporated
Product Folder Links: LM4050-N LM4050-N-Q1
Submit Documentation Feedback
5
LM4050-N, LM4050-N-Q1
SNOS455E – MAY 2000 – REVISED APRIL 2013
www.ti.com
LM4050-N-5.0
Electrical Characteristics
Boldface limits apply for TA = TJ = TMIN to TMAX; all other limits TA = TJ = 25°C. The grades A, B and C designate initial
Reverse Breakdown Voltage tolerances of ±0.1%, ±0.2% and 0.5% respectively.
Symbol
VR
IRMIN
Parameter
Conditions
ΔVR/ΔIR
LM4050NCIM3
LM4050NCEM3
Limits (2)
Units
(Limit)
IR = 100 μA
Reverse Breakdown Voltage
Tolerance (3)
IR = 100 μA
±5.0
±10
±25
mV (max)
Industrial Temp. Range
±22
±27
±42
mV (max)
Extended Temp. Range
±30
±35
±50
mV (max)
74
74
74
μA (max)
Industrial Temp. Range
80
80
80
μA (max)
Extended Temp. Range
90
90
90
μA (max)
Average Reverse Breakdown
Voltage Temperature Coefficient (3)
Reverse Breakdown Voltage
Change with Operating Current
Change (4)
Reverse Dynamic Impedance
5.000
V
μA
56
IR = 10 mA
±30
IR = 1 mA
±20
IR = 100 μA
±20
IRMIN ≤ IR ≤ 1 mA
0.2
1 mA ≤ IR ≤ 15 mA
ZR
LM4050NBIM3
LM4050NBEM3
Limits (2)
Reverse Breakdown Voltage
Minimum Operating Current
ΔVR/ΔT
Typical (1)
LM4050NAIM3
LM4050NAEM3
Limits (2)
IR = 1 mA, f = 120 Hz,
ppm/°C
ppm/°C
±50
±50
±50
ppm/°C (max)
1.0
1.0
1.0
mV (max)
1.4
1.4
1.4
mV (max)
8.0
8.0
8.0
mV (max)
12.0
12.0
12.0
mV (max)
mV
2.0
mV
Ω
0.5
Ω (max)
IAC = 0.1 IR
eN
Wideband Noise
IR = 100 μA
10 Hz ≤ f ≤ 10 kHz
93
ΔVR
Reverse Breakdown Voltage Long
Term Stability
t = 1000 hrs
T = 25°C ±0.1°C
IR = 100 μA
120
Thermal Hysteresis (5)
ΔT = −40°C to 125°C
1.4
VHYST
(1)
(2)
(3)
(4)
(5)
6
μVrms
ppm
mV
Typicals are at TJ = 25°C and represent most likely parametric norm.
Limits are 100% production tested at 25°C. Limits over temperature are guaranteed through correlation using Statistical Quality Control
(SQC) methods. The limits are used to calculate National's AOQL.
The boldface (over-temperature) limit for Reverse Breakdown Voltage Tolerance is defined as the room temperature Reverse
Breakdown Voltage Tolerance ±[(ΔV R/ΔT)(maxΔT)(VR)]. Where, ΔVR/ΔT is the VR temperature coefficient, maxΔT is the maximum
difference in temperature from the reference point of 25°C to T MIN or TMAX, and VR is the reverse breakdown voltage. The total overtemperature tolerance for the different grades in the industrial temperature range where maxΔT = 65°C is shown below:
A-grade:
±0.425% = ±0.1% ±50 ppm/°C × 65°C
B-grade: ±0.525% = ±0.2% ±50 ppm/°C × 65°C
C-grade: ±0.825% = ±0.5% ±50 ppm/°C ×
65°CTherefore, as an example, the A-grade LM4050-N-2.5 has an over-temperature Reverse Breakdown Voltage tolerance of ±2.5V ×
0.425% = ±11 mV.
Load regulation is measured on pulse basis from no load to the specified load current. Output changes due to die temperature change
must be taken into account separately.
Thermal hysteresis is defined as the difference in voltage measured at +25°C after cycling to temperature -40°C and the 25°C
measurement after cycling to temperature +125°C.
Submit Documentation Feedback
Copyright © 2000–2013, Texas Instruments Incorporated
Product Folder Links: LM4050-N LM4050-N-Q1
LM4050-N, LM4050-N-Q1
www.ti.com
SNOS455E – MAY 2000 – REVISED APRIL 2013
LM4050-N-8.2
Electrical Characteristics
Boldface limits apply for TA = TJ = TMIN to TMAX; all other limits TA = TJ = 25°C. The grades A, B and C designate initial
Reverse Breakdown Voltage tolerances of ±0.1% and ±0.2% and 0.5% respectively.
Symbol
VR
IRMIN
Parameter
Conditions
ΔVR/ΔIR
IR = 150 μA
±8.2
±16
±41
mV (max)
Industrial Temp. Range
±35
±43
±68
mV (max)
Extended Temp. Range
±49
±57
±82
mV (max)
91
91
91
μA (max)
Average Reverse Breakdown
Voltage Temperature Coefficient
8.192
(3)
Reverse Breakdown Voltage
Change with Operating Current
Change (4)
95
95
95
μA (max)
Extended Temp. Range
100
100
100
μA (max)
IR = 10 mA
±40
IR = 1 mA
±20
IR = 150 μA
±20
IRMIN ≤ IR ≤ 1 mA
0.6
ppm/°C
ppm/°C
±50
±50
±50
ppm/°C (max)
1.3
1.3
1.3
mV (max)
2.5
2.5
2.5
mV (max)
10.0
10.0
10.0
mV (max)
18.0
18.0
18.0
mV (max)
mV
7.0
0.6
eN
Wideband Noise
IR = 150 μA
10 Hz ≤ f ≤ 10 kHz
150
ΔVR
Reverse Breakdown Voltage Long
Term Stability
t = 1000 hrs
T = 25°C ±0.1°C
IR = 150 μA
120
Thermal Hysteresis
ΔT = −40°C to 125°C
2.3
(5)
μA
Industrial Temp. Range
IR = 1 mA, f = 120 Hz,
IAC = 0.1 IR
(4)
V
74
Reverse Dynamic Impedance
(3)
Units
(Limit)
IR = 150 μA
ZR
(1)
(2)
LM4050NCIM3
LM4050NCEM3
Limits (2)
Reverse Breakdown Voltage
Tolerance (3)
1 mA ≤ IR ≤ 15 mA
VHYST
LM4050NBIM3
LM4050NBEM3
Limits (2)
Reverse Breakdown Voltage
Minimum Operating Current
ΔVR/ΔT
Typical (1)
LM4050NAIM3
LM4050NAEM3
Limits (2)
mV
Ω
μVrms
ppm
(5)
mV
Typicals are at TJ = 25°C and represent most likely parametric norm.
Limits are 100% production tested at 25°C. Limits over temperature are guaranteed through correlation using Statistical Quality Control
(SQC) methods. The limits are used to calculate National's AOQL.
The boldface (over-temperature) limit for Reverse Breakdown Voltage Tolerance is defined as the room temperature Reverse
Breakdown Voltage Tolerance ±[(ΔV R/ΔT)(maxΔT)(VR)]. Where, ΔVR/ΔT is the VR temperature coefficient, maxΔT is the maximum
difference in temperature from the reference point of 25°C to T MIN or TMAX, and VR is the reverse breakdown voltage. The total overtemperature tolerance for the different grades in the industrial temperature range where maxΔT = 65°C is shown below:
A-grade:
±0.425% = ±0.1% ±50 ppm/°C × 65°C
B-grade: ±0.525% = ±0.2% ±50 ppm/°C × 65°C
C-grade: ±0.825% = ±0.5% ±50 ppm/°C ×
65°CTherefore, as an example, the A-grade LM4050-N-2.5 has an over-temperature Reverse Breakdown Voltage tolerance of ±2.5V ×
0.425% = ±11 mV.
Load regulation is measured on pulse basis from no load to the specified load current. Output changes due to die temperature change
must be taken into account separately.
Thermal hysteresis is defined as the difference in voltage measured at +25°C after cycling to temperature -40°C and the 25°C
measurement after cycling to temperature +125°C.
Copyright © 2000–2013, Texas Instruments Incorporated
Product Folder Links: LM4050-N LM4050-N-Q1
Submit Documentation Feedback
7
LM4050-N, LM4050-N-Q1
SNOS455E – MAY 2000 – REVISED APRIL 2013
www.ti.com
LM4050-N-10.0
Electrical Characteristics
Boldface limits apply for TA = TJ = TMIN to TMAX; all other limits TA = TJ = 25°C. The grades A, B and C designate initial
Reverse Breakdown Voltage tolerances of ±0.1% and ±0.2% and 0.5% respectively.
Typical
(1)
Symbol
VR
IRMIN
Parameter
Conditions
ΔVR/ΔIR
mV (max)
±20
Industrial Temp. Range
±43
±53
±83
mV (max)
Extended Temp. Range
±60
±70
±100
mV (max)
100
100
100
μA (max)
Industrial Temp. Range
103
103
103
μA (max)
Extended Temp. Range
110
110
110
μA (max)
Average Reverse Breakdown
Voltage Temperature Coefficient
V
μA
80
(3)
Reverse Breakdown Voltage
Change with Operating Current
Change (4)
IR = 10 mA
±40
IR = 1 mA
±20
IR = 150 μA
±20
IRMIN ≤ IR ≤ 1 mA
0.8
ppm/°C
ppm/°C
±50
±50
±50
ppm/°C (max)
1.5
1.5
1.5
mV (max)
3.5
3.5
3.5
mV (max)
12.0
12.0
12.0
mV (max)
23.0
23.0
23.0
mV (max)
mV
8.0
eN
Wideband Noise
IR = 150 μA
10 Hz ≤ f ≤ 10 kHz
150
ΔVR
Reverse Breakdown Voltage Long
Term Stability
t = 1000 hrs
T = 25°C ±0.1°C
IR = 150 μA
120
Thermal Hysteresis
ΔT = −40°C to 125°C
2.8
8
±50
±10
0.7
(5)
(2)
10.00
IR = 1 mA, f = 120 Hz,
IAC = 0.1 IR
(4)
(2)
IR = 150 μA
Reverse Dynamic Impedance
(3)
(2)
Units
(Limit)
IR = 150 μA
ZR
(1)
(2)
LM4050NCIM3
LM4050NCEM3
Limits
Reverse Breakdown Voltage
Tolerance (3)
1 mA ≤ IR ≤ 15 mA
VHYST
LM4050NBIM3
LM4050NBEM3
Limits
Reverse Breakdown Voltage
Minimum Operating Current
ΔVR/ΔT
LM4050NAIM3
LM4050NAEM3
Limits
mV
Ω
μVrms
ppm
mV
(5)
Typicals are at TJ = 25°C and represent most likely parametric norm.
Limits are 100% production tested at 25°C. Limits over temperature are guaranteed through correlation using Statistical Quality Control
(SQC) methods. The limits are used to calculate National's AOQL.
The boldface (over-temperature) limit for Reverse Breakdown Voltage Tolerance is defined as the room temperature Reverse
Breakdown Voltage Tolerance ±[(ΔV R/ΔT)(maxΔT)(VR)]. Where, ΔVR/ΔT is the VR temperature coefficient, maxΔT is the maximum
difference in temperature from the reference point of 25°C to T MIN or TMAX, and VR is the reverse breakdown voltage. The total overtemperature tolerance for the different grades in the industrial temperature range where maxΔT = 65°C is shown below:
A-grade:
±0.425% = ±0.1% ±50 ppm/°C × 65°C
B-grade: ±0.525% = ±0.2% ±50 ppm/°C × 65°C
C-grade: ±0.825% = ±0.5% ±50 ppm/°C ×
65°CTherefore, as an example, the A-grade LM4050-N-2.5 has an over-temperature Reverse Breakdown Voltage tolerance of ±2.5V ×
0.425% = ±11 mV.
Load regulation is measured on pulse basis from no load to the specified load current. Output changes due to die temperature change
must be taken into account separately.
Thermal hysteresis is defined as the difference in voltage measured at +25°C after cycling to temperature -40°C and the 25°C
measurement after cycling to temperature +125°C.
Submit Documentation Feedback
Copyright © 2000–2013, Texas Instruments Incorporated
Product Folder Links: LM4050-N LM4050-N-Q1
LM4050-N, LM4050-N-Q1
www.ti.com
SNOS455E – MAY 2000 – REVISED APRIL 2013
Typical Performance Characteristics
Output Impedance
vs
Frequency
Output Impedance
vs
Frequency
Figure 2.
Figure 3.
Reverse Characteristics and
Minimum Operating Current
Noise Voltage
vs
Frequency
Figure 4.
Figure 5.
Thermal Hysteresis
Figure 6.
Copyright © 2000–2013, Texas Instruments Incorporated
Product Folder Links: LM4050-N LM4050-N-Q1
Submit Documentation Feedback
9
LM4050-N, LM4050-N-Q1
SNOS455E – MAY 2000 – REVISED APRIL 2013
www.ti.com
Start-Up Characteristics
LM4050-N-2.5
Figure 7. Test Circuit
LM4050-N-5.0
RS = 30k
Figure 8.
RS = 30k
LM4050-N-10.0
Figure 9.
RS = 30k
Figure 10.
Functional Block Diagram
Figure 11. Functional Block Diagram
10
Submit Documentation Feedback
Copyright © 2000–2013, Texas Instruments Incorporated
Product Folder Links: LM4050-N LM4050-N-Q1
LM4050-N, LM4050-N-Q1
www.ti.com
SNOS455E – MAY 2000 – REVISED APRIL 2013
APPLICATIONS INFORMATION
The LM4050-N is a precision micro-power curvature-corrected bandgap shunt voltage reference. For space
critical applications, the LM4050-N is available in the sub-miniature SOT-23 surface-mount package. The
LM4050-N has been designed for stable operation without the need of an external capacitor connected between
the “+” pin and the “−” pin. If, however, a bypass capacitor is used, the LM4050-N remains stable. Reducing
design effort is the availability of several fixed reverse breakdown voltages: 2.048V, 2.500V, 4.096V, 5.000V,
8.192V, and 10.000V. The minimum operating current increases from 60 μA for the LM4050-N-2.0 to 100 μA for
the LM4050-N-10.0. All versions have a maximum operating current of 15 mA.
LM4050-Ns in the SOT-23 packages have a parasitic Schottky diode between pin 2 (−) and pin 3 (Die attach
interface contact). Therefore, pin 3 of the SOT-23 package must be left floating or connected to pin 2.
The 4.096V version allows single +5V 12-bit ADCs or DACs to operate with an LSB equal to 1 mV. For 12-bit
ADCs or DACs that operate on supplies of 10V or greater, the 8.192V version gives 2 mV per LSB.
The typical thermal hysteresis specification is defined as the change in +25°C voltage measured after thermal
cycling. The device is thermal cycled to temperature -40°C and then measured at 25°C. Next the device is
thermal cycled to temperature +125°C and again measured at 25°C. The resulting VOUT delta shift between the
25°C measurements is thermal hysteresis. Thermal hysteresis is common in precision references and is induced
by thermal-mechanical package stress. Changes in environmental storage temperature, operating temperature
and board mounting temperature are all factors that can contribute to thermal hysteresis.
In a conventional shunt regulator application (Figure 12) , an external series resistor (RS) is connected between
the supply voltage and the LM4050-N. RS determines the current that flows through the load (IL) and the
LM4050-N (IQ). Since load current and supply voltage may vary, RS should be small enough to supply at least
the maximum guaranteed IRMIN (spec. table) to the LM4050-N even when the supply voltage is at its minimum
and the load current is at its maximum value. When the supply voltage is at its maximum and IL is at its
minimum, RS should be large enough so that the current flowing through the LM4050-N is less than 15 mA.
RS is determined by the supply voltage, (VS), the load and operating current, (IL and IQ), and the LM4050-N's
reverse breakdown voltage, VR.
(1)
Typical Applications
Figure 12. Shunt Regulator
Copyright © 2000–2013, Texas Instruments Incorporated
Product Folder Links: LM4050-N LM4050-N-Q1
Submit Documentation Feedback
11
LM4050-N, LM4050-N-Q1
SNOS455E – MAY 2000 – REVISED APRIL 2013
www.ti.com
**Ceramic monolithic
*Tantalum
Figure 13. LM4050-N-4.1's Nominal 4.096 breakdown voltage gives ADC12451 1 mV/LSB
12
Submit Documentation Feedback
Copyright © 2000–2013, Texas Instruments Incorporated
Product Folder Links: LM4050-N LM4050-N-Q1
LM4050-N, LM4050-N-Q1
www.ti.com
A.
SNOS455E – MAY 2000 – REVISED APRIL 2013
Bounded amplifier reduces saturation-induced delays and can prevent succeeding stage damage. Nominal clamping
voltage is ±11.5V (LM4050-N's reverse breakdown voltage +2 diode VF).
Figure 14. Bounded Amplifier
A.
The bounding voltage is ±4V with the LM4050-N-2.5 (LM4050-N's reverse breakdown voltage + 3 diode VF).
Figure 15. Protecting Op Amp Input
Copyright © 2000–2013, Texas Instruments Incorporated
Product Folder Links: LM4050-N LM4050-N-Q1
Submit Documentation Feedback
13
LM4050-N, LM4050-N-Q1
SNOS455E – MAY 2000 – REVISED APRIL 2013
www.ti.com
Figure 16. Precision ±4.096V Reference
*IOUT -
2.5V
R2
Figure 17. Precision 1 μA to 1 mA Current Sources
14
Submit Documentation Feedback
Copyright © 2000–2013, Texas Instruments Incorporated
Product Folder Links: LM4050-N LM4050-N-Q1
LM4050-N, LM4050-N-Q1
www.ti.com
SNOS455E – MAY 2000 – REVISED APRIL 2013
REVISION HISTORY
Changes from Revision D (April 2013) to Revision E
•
Page
Changed layout of National Data Sheet to TI format .......................................................................................................... 14
Copyright © 2000–2013, Texas Instruments Incorporated
Product Folder Links: LM4050-N LM4050-N-Q1
Submit Documentation Feedback
15
PACKAGE OPTION ADDENDUM
www.ti.com
1-Nov-2013
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
LM4050AEM3-10
ACTIVE
SOT-23
DBZ
3
LM4050AEM3-10/NOPB
ACTIVE
SOT-23
DBZ
3
1000
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
TBD
Call TI
Call TI
RGA
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
RGA
(4/5)
LM4050AEM3-2.0
NRND
SOT-23
DBZ
3
1000
TBD
Call TI
Call TI
RNA
LM4050AEM3-2.0/NOPB
ACTIVE
SOT-23
DBZ
3
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
RNA
LM4050AEM3-2.5
NRND
SOT-23
DBZ
3
1000
TBD
Call TI
Call TI
RCA
LM4050AEM3-2.5/NOPB
ACTIVE
SOT-23
DBZ
3
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
RCA
LM4050AEM3-5.0
NRND
SOT-23
DBZ
3
1000
TBD
Call TI
Call TI
REA
LM4050AEM3-5.0/NOPB
ACTIVE
SOT-23
DBZ
3
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
REA
LM4050AEM3-8.2
NRND
SOT-23
DBZ
3
1000
TBD
Call TI
Call TI
RFA
LM4050AEM3-8.2/NOPB
ACTIVE
SOT-23
DBZ
3
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
RFA
LM4050AEM3X-10
NRND
SOT-23
DBZ
3
3000
TBD
Call TI
Call TI
RGA
LM4050AEM3X-10/NOPB
ACTIVE
SOT-23
DBZ
3
3000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
RGA
LM4050AEM3X-2.5/NOPB
ACTIVE
SOT-23
DBZ
3
3000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
RCA
LM4050AEM3X-5.0/NOPB
ACTIVE
SOT-23
DBZ
3
3000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
REA
LM4050AIM3-10
NRND
SOT-23
DBZ
3
1000
TBD
Call TI
Call TI
-40 to 85
RGA
LM4050AIM3-10/NOPB
ACTIVE
SOT-23
DBZ
3
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 85
RGA
LM4050AIM3-2.5
NRND
SOT-23
DBZ
3
1000
TBD
Call TI
Call TI
-40 to 85
RCA
LM4050AIM3-2.5/NOPB
ACTIVE
SOT-23
DBZ
3
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 85
RCA
LM4050AIM3-4.1
NRND
SOT-23
DBZ
3
1000
TBD
Call TI
Call TI
-40 to 85
RDA
LM4050AIM3-4.1/NOPB
ACTIVE
SOT-23
DBZ
3
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 85
RDA
LM4050AIM3-5.0
NRND
SOT-23
DBZ
3
1000
TBD
Call TI
Call TI
-40 to 85
REA
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
Orderable Device
1-Nov-2013
Status
(1)
LM4050AIM3-5.0/NOPB
Package Type Package Pins Package
Drawing
Qty
ACTIVE
SOT-23
DBZ
3
1000
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 85
REA
(4/5)
LM4050AIM3X-2.5
NRND
SOT-23
DBZ
3
3000
TBD
Call TI
Call TI
-40 to 85
RCA
LM4050AIM3X-2.5/NOPB
ACTIVE
SOT-23
DBZ
3
3000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 85
RCA
LM4050AIM3X-4.1/NOPB
ACTIVE
SOT-23
DBZ
3
3000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 85
RDA
LM4050AIM3X-5.0
NRND
SOT-23
DBZ
3
3000
TBD
Call TI
Call TI
-40 to 85
REA
LM4050AIM3X-5.0/NOPB
ACTIVE
SOT-23
DBZ
3
3000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 85
REA
LM4050BEM3-10/NOPB
ACTIVE
SOT-23
DBZ
3
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
RGB
LM4050BEM3-2.5
NRND
SOT-23
DBZ
3
1000
TBD
Call TI
Call TI
RCB
LM4050BEM3-2.5/NOPB
ACTIVE
SOT-23
DBZ
3
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
RCB
LM4050BEM3-4.1/NOPB
ACTIVE
SOT-23
DBZ
3
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
RDB
LM4050BEM3-5.0
NRND
SOT-23
DBZ
3
1000
TBD
Call TI
Call TI
REB
LM4050BEM3-5.0/NOPB
ACTIVE
SOT-23
DBZ
3
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
REB
LM4050BEM3-8.2/NOPB
ACTIVE
SOT-23
DBZ
3
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
RFB
LM4050BEM3X-10/NOPB
ACTIVE
SOT-23
DBZ
3
3000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
RGB
LM4050BEM3X-2.5/NOPB
ACTIVE
SOT-23
DBZ
3
3000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
RCB
LM4050BEM3X-5.0/NOPB
ACTIVE
SOT-23
DBZ
3
3000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
REB
LM4050BIM3-10/NOPB
ACTIVE
SOT-23
DBZ
3
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 85
RGB
LM4050BIM3-2.5
NRND
SOT-23
DBZ
3
1000
TBD
Call TI
Call TI
-40 to 85
RCB
LM4050BIM3-2.5/NOPB
ACTIVE
SOT-23
DBZ
3
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 85
RCB
LM4050BIM3-4.1/NOPB
ACTIVE
SOT-23
DBZ
3
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 85
RDB
Addendum-Page 2
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
Orderable Device
1-Nov-2013
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
LM4050BIM3-5.0
NRND
SOT-23
DBZ
3
1000
TBD
Call TI
Call TI
-40 to 85
REB
LM4050BIM3-5.0/NOPB
ACTIVE
SOT-23
DBZ
3
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 85
REB
LM4050BIM3X-2.0/NOPB
ACTIVE
SOT-23
DBZ
3
3000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
LM4050BIM3X-2.5/NOPB
ACTIVE
SOT-23
DBZ
3
3000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 85
RCB
LM4050BIM3X-4.1/NOPB
ACTIVE
SOT-23
DBZ
3
3000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 85
RDB
LM4050BIM3X-5.0/NOPB
ACTIVE
SOT-23
DBZ
3
3000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 85
REB
LM4050CEM3-10/NOPB
ACTIVE
SOT-23
DBZ
3
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
LM4050CEM3-2.5
NRND
SOT-23
DBZ
3
1000
TBD
Call TI
Call TI
-40 to 125
RCC
LM4050CEM3-2.5/NOPB
ACTIVE
SOT-23
DBZ
3
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
RCC
RNB
RGC
LM4050CEM3-5.0
NRND
SOT-23
DBZ
3
1000
TBD
Call TI
Call TI
REC
LM4050CEM3-5.0/NOPB
ACTIVE
SOT-23
DBZ
3
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
REC
LM4050CEM3X-2.5/NOPB
ACTIVE
SOT-23
DBZ
3
3000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
LM4050CEM3X-5.0/NOPB
ACTIVE
SOT-23
DBZ
3
3000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
LM4050CIM3-10/NOPB
ACTIVE
SOT-23
DBZ
3
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 85
RGC
LM4050CIM3-2.5
NRND
SOT-23
DBZ
3
1000
TBD
Call TI
Call TI
-40 to 85
RCC
LM4050CIM3-2.5/NOPB
ACTIVE
SOT-23
DBZ
3
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 85
RCC
LM4050CIM3-4.1
NRND
SOT-23
DBZ
3
1000
TBD
Call TI
Call TI
-40 to 85
RDC
LM4050CIM3-4.1/NOPB
ACTIVE
SOT-23
DBZ
3
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 85
RDC
LM4050CIM3-5.0
NRND
SOT-23
DBZ
3
1000
TBD
Call TI
Call TI
-40 to 85
REC
LM4050CIM3-5.0/NOPB
ACTIVE
SOT-23
DBZ
3
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 85
REC
Addendum-Page 3
-40 to 125
RCC
REC
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
Orderable Device
1-Nov-2013
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
LM4050CIM3X-2.0/NOPB
ACTIVE
SOT-23
DBZ
3
3000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
LM4050CIM3X-2.5/NOPB
ACTIVE
SOT-23
DBZ
3
3000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 85
RCC
LM4050CIM3X-4.1/NOPB
ACTIVE
SOT-23
DBZ
3
3000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 85
RDC
LM4050CIM3X-5.0/NOPB
ACTIVE
SOT-23
DBZ
3
3000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 85
REC
LM4050QAEM3-10/NOPB
ACTIVE
SOT-23
DBZ
3
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
RYA
LM4050QAEM3-2.0/NOPB
ACTIVE
SOT-23
DBZ
3
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
RSA
LM4050QAEM3-2.5/NOPB
ACTIVE
SOT-23
DBZ
3
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
RTA
LM4050QAEM3-4.1/NOPB
ACTIVE
SOT-23
DBZ
3
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
RUA
LM4050QAEM3-5.0/NOPB
ACTIVE
SOT-23
DBZ
3
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
RVA
LM4050QAEM3-8.2/NOPB
ACTIVE
SOT-23
DBZ
3
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
RXA
LM4050QAEM3X10/NOPB
ACTIVE
SOT-23
DBZ
3
3000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
RYA
LM4050QAEM3X2.0/NOPB
ACTIVE
SOT-23
DBZ
3
3000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
RSA
LM4050QAEM3X2.5/NOPB
ACTIVE
SOT-23
DBZ
3
3000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
RTA
LM4050QAEM3X4.1/NOPB
ACTIVE
SOT-23
DBZ
3
3000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
RUA
LM4050QAEM3X5.0/NOPB
ACTIVE
SOT-23
DBZ
3
3000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
RVA
LM4050QAEM3X8.2/NOPB
ACTIVE
SOT-23
DBZ
3
3000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
RXA
LM4050QAIM3-10/NOPB
ACTIVE
SOT-23
DBZ
3
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
RYA
LM4050QAIM3-2.0/NOPB
ACTIVE
SOT-23
DBZ
3
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
RSA
Addendum-Page 4
RNC
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
Orderable Device
1-Nov-2013
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
LM4050QAIM3-2.5/NOPB
ACTIVE
SOT-23
DBZ
3
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
RTA
LM4050QAIM3-4.1/NOPB
ACTIVE
SOT-23
DBZ
3
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
RUA
LM4050QAIM3-5.0/NOPB
ACTIVE
SOT-23
DBZ
3
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
RVA
LM4050QAIM3-8.2/NOPB
ACTIVE
SOT-23
DBZ
3
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
RXA
LM4050QAIM3X10/NOPB
ACTIVE
SOT-23
DBZ
3
3000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
RYA
LM4050QAIM3X2.0/NOPB
ACTIVE
SOT-23
DBZ
3
3000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
RSA
LM4050QAIM3X2.5/NOPB
ACTIVE
SOT-23
DBZ
3
3000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
RTA
LM4050QAIM3X4.1/NOPB
ACTIVE
SOT-23
DBZ
3
3000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
RUA
LM4050QAIM3X5.0/NOPB
ACTIVE
SOT-23
DBZ
3
3000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
RVA
LM4050QAIM3X8.2/NOPB
ACTIVE
SOT-23
DBZ
3
3000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
RXA
LM4050QBEM3-10/NOPB
ACTIVE
SOT-23
DBZ
3
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
RYB
LM4050QBEM3-2.0/NOPB
ACTIVE
SOT-23
DBZ
3
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
RSB
LM4050QBEM3-2.5/NOPB
ACTIVE
SOT-23
DBZ
3
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
RTB
LM4050QBEM3-4.1/NOPB
ACTIVE
SOT-23
DBZ
3
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
RUB
LM4050QBEM3-5.0/NOPB
ACTIVE
SOT-23
DBZ
3
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
RVB
LM4050QBEM3-8.2/NOPB
ACTIVE
SOT-23
DBZ
3
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
RXB
LM4050QBEM3X10/NOPB
ACTIVE
SOT-23
DBZ
3
3000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
RYB
LM4050QBEM3X2.0/NOPB
ACTIVE
SOT-23
DBZ
3
3000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
RSB
Addendum-Page 5
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
Orderable Device
1-Nov-2013
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
LM4050QBEM3X2.5/NOPB
ACTIVE
SOT-23
DBZ
3
3000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
RTB
LM4050QBEM3X4.1/NOPB
ACTIVE
SOT-23
DBZ
3
3000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
RUB
LM4050QBEM3X5.0/NOPB
ACTIVE
SOT-23
DBZ
3
3000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
RVB
LM4050QBEM3X8.2/NOPB
ACTIVE
SOT-23
DBZ
3
3000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
RXB
LM4050QBIM3-10/NOPB
ACTIVE
SOT-23
DBZ
3
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
RYB
LM4050QBIM3-2.0/NOPB
ACTIVE
SOT-23
DBZ
3
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
RSB
LM4050QBIM3-2.5/NOPB
ACTIVE
SOT-23
DBZ
3
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
RTB
LM4050QBIM3-4.1/NOPB
ACTIVE
SOT-23
DBZ
3
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
RUB
LM4050QBIM3-5.0/NOPB
ACTIVE
SOT-23
DBZ
3
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
RVB
LM4050QBIM3-8.2/NOPB
ACTIVE
SOT-23
DBZ
3
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
RXB
LM4050QBIM3X10/NOPB
ACTIVE
SOT-23
DBZ
3
3000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
RYB
LM4050QBIM3X2.0/NOPB
ACTIVE
SOT-23
DBZ
3
3000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
RSB
LM4050QBIM3X2.5/NOPB
ACTIVE
SOT-23
DBZ
3
3000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
RTB
LM4050QBIM3X4.1/NOPB
ACTIVE
SOT-23
DBZ
3
3000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
RUB
LM4050QBIM3X5.0/NOPB
ACTIVE
SOT-23
DBZ
3
3000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
RVB
LM4050QBIM3X8.2/NOPB
ACTIVE
SOT-23
DBZ
3
3000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
RXB
LM4050QCEM3-10/NOPB
ACTIVE
SOT-23
DBZ
3
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
RYC
LM4050QCEM3-2.0/NOPB
ACTIVE
SOT-23
DBZ
3
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
RSC
Addendum-Page 6
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
Orderable Device
1-Nov-2013
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
LM4050QCEM3-2.5/NOPB
ACTIVE
SOT-23
DBZ
3
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
RTC
LM4050QCEM3-4.1/NOPB
ACTIVE
SOT-23
DBZ
3
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
RUC
LM4050QCEM3-5.0/NOPB
ACTIVE
SOT-23
DBZ
3
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
RVC
LM4050QCEM3-8.2/NOPB
ACTIVE
SOT-23
DBZ
3
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
RXC
LM4050QCEM3X10/NOPB
ACTIVE
SOT-23
DBZ
3
3000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
RYC
LM4050QCEM3X2.0/NOPB
ACTIVE
SOT-23
DBZ
3
3000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
RSC
LM4050QCEM3X2.5/NOPB
ACTIVE
SOT-23
DBZ
3
3000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
RTC
LM4050QCEM3X4.1/NOPB
ACTIVE
SOT-23
DBZ
3
3000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
RUC
LM4050QCEM3X5.0/NOPB
ACTIVE
SOT-23
DBZ
3
3000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
RVC
LM4050QCEM3X8.2/NOPB
ACTIVE
SOT-23
DBZ
3
3000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
RXC
LM4050QCIM3-10/NOPB
ACTIVE
SOT-23
DBZ
3
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
RYC
LM4050QCIM3-2.0/NOPB
ACTIVE
SOT-23
DBZ
3
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
RSC
LM4050QCIM3-2.5/NOPB
ACTIVE
SOT-23
DBZ
3
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
RTC
LM4050QCIM3-4.1/NOPB
ACTIVE
SOT-23
DBZ
3
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
RUC
LM4050QCIM3-5.0/NOPB
ACTIVE
SOT-23
DBZ
3
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
RVC
LM4050QCIM3-8.2/NOPB
ACTIVE
SOT-23
DBZ
3
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
RXC
LM4050QCIM3X10/NOPB
ACTIVE
SOT-23
DBZ
3
3000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
RYC
LM4050QCIM3X2.0/NOPB
ACTIVE
SOT-23
DBZ
3
3000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
RSC
Addendum-Page 7
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
Orderable Device
1-Nov-2013
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
LM4050QCIM3X2.5/NOPB
ACTIVE
SOT-23
DBZ
3
3000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
RTC
LM4050QCIM3X4.1/NOPB
ACTIVE
SOT-23
DBZ
3
3000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
RUC
LM4050QCIM3X5.0/NOPB
ACTIVE
SOT-23
DBZ
3
3000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
RVC
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
Addendum-Page 8
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
1-Nov-2013
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF LM4050-N, LM4050-N-Q1 :
• Catalog: LM4050-N
• Automotive: LM4050-N-Q1
NOTE: Qualified Version Definitions:
• Catalog - TI's standard catalog product
• Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects
Addendum-Page 9
PACKAGE MATERIALS INFORMATION
www.ti.com
23-Sep-2013
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
LM4050AEM3-10
SOT-23
DBZ
3
0
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM4050AEM3-10/NOPB
SOT-23
DBZ
3
1000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM4050AEM3-2.0
SOT-23
DBZ
3
1000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM4050AEM3-2.0/NOPB SOT-23
DBZ
3
1000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
SOT-23
DBZ
3
1000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM4050AEM3-2.5/NOPB SOT-23
LM4050AEM3-2.5
DBZ
3
1000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
SOT-23
DBZ
3
1000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM4050AEM3-5.0/NOPB SOT-23
DBZ
3
1000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
SOT-23
DBZ
3
1000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM4050AEM3-8.2/NOPB SOT-23
DBZ
3
1000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
SOT-23
DBZ
3
3000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM4050AEM3-5.0
LM4050AEM3-8.2
LM4050AEM3X-10
LM4050AEM3X-10/NOPB SOT-23
DBZ
3
3000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM4050AEM3X-2.5/NOPB SOT-23
DBZ
3
3000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM4050AEM3X-5.0/NOPB SOT-23
DBZ
3
3000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM4050AIM3-10
SOT-23
DBZ
3
1000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM4050AIM3-10/NOPB
SOT-23
DBZ
3
1000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM4050AIM3-2.5
SOT-23
DBZ
3
1000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM4050AIM3-2.5/NOPB
SOT-23
DBZ
3
1000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
23-Sep-2013
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
LM4050AIM3-4.1
SOT-23
DBZ
3
1000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM4050AIM3-4.1/NOPB
SOT-23
DBZ
3
1000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM4050AIM3-5.0
SOT-23
DBZ
3
1000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM4050AIM3-5.0/NOPB
SOT-23
DBZ
3
1000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM4050AIM3X-2.5
SOT-23
DBZ
3
3000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM4050AIM3X-2.5/NOPB SOT-23
DBZ
3
3000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM4050AIM3X-4.1/NOPB SOT-23
DBZ
3
3000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
SOT-23
DBZ
3
3000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM4050AIM3X-5.0/NOPB SOT-23
DBZ
3
3000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM4050BEM3-10/NOPB
SOT-23
DBZ
3
1000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM4050BEM3-2.5
SOT-23
DBZ
3
1000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM4050BEM3-2.5/NOPB SOT-23
DBZ
3
1000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM4050BEM3-4.1/NOPB SOT-23
DBZ
3
1000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
SOT-23
DBZ
3
1000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM4050BEM3-5.0/NOPB SOT-23
DBZ
3
1000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM4050BEM3-8.2/NOPB SOT-23
DBZ
3
1000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM4050BEM3X-10/NOPB SOT-23
DBZ
3
3000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM4050BEM3X-2.5/NOPB SOT-23
DBZ
3
3000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM4050BEM3X-5.0/NOPB SOT-23
DBZ
3
3000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM4050AIM3X-5.0
LM4050BEM3-5.0
LM4050BIM3-10/NOPB
SOT-23
DBZ
3
1000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM4050BIM3-2.5
SOT-23
DBZ
3
1000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM4050BIM3-2.5/NOPB
SOT-23
DBZ
3
1000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM4050BIM3-4.1/NOPB
SOT-23
DBZ
3
1000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM4050BIM3-5.0
SOT-23
DBZ
3
1000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM4050BIM3-5.0/NOPB
SOT-23
DBZ
3
1000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM4050BIM3X-2.0/NOPB SOT-23
DBZ
3
3000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM4050BIM3X-2.5/NOPB SOT-23
DBZ
3
3000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM4050BIM3X-4.1/NOPB SOT-23
DBZ
3
3000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM4050BIM3X-5.0/NOPB SOT-23
DBZ
3
3000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM4050CEM3-10/NOPB
SOT-23
DBZ
3
1000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM4050CEM3-2.5
SOT-23
DBZ
3
1000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM4050CEM3-2.5/NOPB SOT-23
DBZ
3
1000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
SOT-23
DBZ
3
1000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM4050CEM3-5.0
LM4050CEM3-5.0/NOPB SOT-23
DBZ
3
1000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM4050CEM3X-2.5/NOPB SOT-23
DBZ
3
3000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM4050CEM3X-5.0/NOPB SOT-23
DBZ
3
3000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM4050CIM3-10/NOPB
SOT-23
DBZ
3
1000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM4050CIM3-2.5
SOT-23
DBZ
3
1000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM4050CIM3-2.5/NOPB
SOT-23
DBZ
3
1000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM4050CIM3-4.1
SOT-23
DBZ
3
1000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM4050CIM3-4.1/NOPB
SOT-23
DBZ
3
1000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM4050CIM3-5.0
SOT-23
DBZ
3
1000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM4050CIM3-5.0/NOPB
SOT-23
DBZ
3
1000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
Pack Materials-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
23-Sep-2013
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
LM4050CIM3X-2.0/NOPB SOT-23
DBZ
3
3000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM4050CIM3X-2.5/NOPB SOT-23
DBZ
3
3000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM4050CIM3X-4.1/NOPB SOT-23
DBZ
3
3000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM4050CIM3X-5.0/NOPB SOT-23
DBZ
3
3000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM4050QAEM3-10/NOPB SOT-23
DBZ
3
1000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM4050QAEM3-2.0/NOP
B
SOT-23
DBZ
3
1000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM4050QAEM3-2.5/NOP
B
SOT-23
DBZ
3
1000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM4050QAEM3-4.1/NOP
B
SOT-23
DBZ
3
1000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM4050QAEM3-5.0/NOP
B
SOT-23
DBZ
3
1000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM4050QAEM3-8.2/NOP
B
SOT-23
DBZ
3
1000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM4050QAEM3X10/NOP
B
SOT-23
DBZ
3
3000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM4050QAEM3X2.0/NOP
B
SOT-23
DBZ
3
3000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM4050QAEM3X2.5/NOP
B
SOT-23
DBZ
3
3000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM4050QAEM3X4.1/NOP
B
SOT-23
DBZ
3
3000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM4050QAEM3X5.0/NOP
B
SOT-23
DBZ
3
3000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM4050QAEM3X8.2/NOP
B
SOT-23
DBZ
3
3000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM4050QAIM3-10/NOPB SOT-23
DBZ
3
1000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM4050QAIM3-2.0/NOPB SOT-23
DBZ
3
1000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM4050QAIM3-2.5/NOPB SOT-23
DBZ
3
1000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM4050QAIM3-4.1/NOPB SOT-23
DBZ
3
1000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM4050QAIM3-5.0/NOPB SOT-23
DBZ
3
1000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM4050QAIM3-8.2/NOPB SOT-23
DBZ
3
1000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM4050QAIM3X10/NOPB SOT-23
DBZ
3
3000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM4050QAIM3X2.0/NOPB SOT-23
DBZ
3
3000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM4050QAIM3X2.5/NOPB SOT-23
DBZ
3
3000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM4050QAIM3X4.1/NOPB SOT-23
DBZ
3
3000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM4050QAIM3X5.0/NOPB SOT-23
DBZ
3
3000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM4050QAIM3X8.2/NOPB SOT-23
DBZ
3
3000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM4050QBEM3-10/NOPB SOT-23
DBZ
3
1000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM4050QBEM3-2.0/NOP
B
SOT-23
DBZ
3
1000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM4050QBEM3-2.5/NOP
B
SOT-23
DBZ
3
1000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM4050QBEM3-4.1/NOP
B
SOT-23
DBZ
3
1000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM4050QBEM3-5.0/NOP
SOT-23
DBZ
3
1000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
Pack Materials-Page 3
PACKAGE MATERIALS INFORMATION
www.ti.com
23-Sep-2013
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
LM4050QBEM3-8.2/NOP
B
SOT-23
DBZ
3
1000
178.0
8.4
LM4050QBEM3X10/NOP
B
SOT-23
DBZ
3
3000
178.0
LM4050QBEM3X2.0/NOP
B
SOT-23
DBZ
3
3000
LM4050QBEM3X2.5/NOP
B
SOT-23
DBZ
3
LM4050QBEM3X4.1/NOP
B
SOT-23
DBZ
LM4050QBEM3X5.0/NOP
B
SOT-23
LM4050QBEM3X8.2/NOP
B
W
Pin1
(mm) Quadrant
3.3
2.9
1.22
4.0
8.0
Q3
8.4
3.3
2.9
1.22
4.0
8.0
Q3
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
3000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
3
3000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
DBZ
3
3000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
SOT-23
DBZ
3
3000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
B
LM4050QBIM3-10/NOPB SOT-23
DBZ
3
1000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM4050QBIM3-2.0/NOPB SOT-23
DBZ
3
1000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM4050QBIM3-2.5/NOPB SOT-23
DBZ
3
1000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM4050QBIM3-4.1/NOPB SOT-23
DBZ
3
1000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM4050QBIM3-5.0/NOPB SOT-23
DBZ
3
1000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM4050QBIM3-8.2/NOPB SOT-23
DBZ
3
1000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM4050QBIM3X10/NOPB SOT-23
DBZ
3
3000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM4050QBIM3X2.0/NOPB SOT-23
DBZ
3
3000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM4050QBIM3X2.5/NOPB SOT-23
DBZ
3
3000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM4050QBIM3X4.1/NOPB SOT-23
DBZ
3
3000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM4050QBIM3X5.0/NOPB SOT-23
DBZ
3
3000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM4050QBIM3X8.2/NOPB SOT-23
DBZ
3
3000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM4050QCEM3-10/NOPB SOT-23
DBZ
3
1000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM4050QCEM3-2.0/NOP
B
SOT-23
DBZ
3
1000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM4050QCEM3-2.5/NOP
B
SOT-23
DBZ
3
1000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM4050QCEM3-4.1/NOP
B
SOT-23
DBZ
3
1000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM4050QCEM3-5.0/NOP
B
SOT-23
DBZ
3
1000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM4050QCEM3-8.2/NOP
B
SOT-23
DBZ
3
1000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM4050QCEM3X10/NOP
B
SOT-23
DBZ
3
3000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM4050QCEM3X2.0/NOP
B
SOT-23
DBZ
3
3000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM4050QCEM3X2.5/NOP
B
SOT-23
DBZ
3
3000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM4050QCEM3X4.1/NOP
B
SOT-23
DBZ
3
3000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM4050QCEM3X5.0/NOP
B
SOT-23
DBZ
3
3000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
Pack Materials-Page 4
PACKAGE MATERIALS INFORMATION
www.ti.com
23-Sep-2013
Device
LM4050QCEM3X8.2/NOP
B
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
SOT-23
DBZ
3
3000
178.0
8.4
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
3.3
2.9
1.22
4.0
8.0
Q3
LM4050QCIM3-10/NOPB SOT-23
DBZ
3
1000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM4050QCIM3-2.0/NOPB SOT-23
DBZ
3
1000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM4050QCIM3-2.5/NOPB SOT-23
DBZ
3
1000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM4050QCIM3-4.1/NOPB SOT-23
DBZ
3
1000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM4050QCIM3-5.0/NOPB SOT-23
DBZ
3
1000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM4050QCIM3-8.2/NOPB SOT-23
DBZ
3
1000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM4050QCIM3X10/NOPB SOT-23
DBZ
3
3000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM4050QCIM3X2.0/NOP
B
SOT-23
DBZ
3
3000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM4050QCIM3X2.5/NOP
B
SOT-23
DBZ
3
3000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM4050QCIM3X4.1/NOP
B
SOT-23
DBZ
3
3000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM4050QCIM3X5.0/NOP
B
SOT-23
DBZ
3
3000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
LM4050AEM3-10
SOT-23
DBZ
3
0
210.0
185.0
35.0
Pack Materials-Page 5
PACKAGE MATERIALS INFORMATION
www.ti.com
23-Sep-2013
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
LM4050AEM3-10/NOPB
SOT-23
DBZ
3
1000
210.0
185.0
35.0
LM4050AEM3-2.0
SOT-23
DBZ
3
1000
210.0
185.0
35.0
LM4050AEM3-2.0/NOPB
SOT-23
DBZ
3
1000
210.0
185.0
35.0
LM4050AEM3-2.5
SOT-23
DBZ
3
1000
210.0
185.0
35.0
LM4050AEM3-2.5/NOPB
SOT-23
DBZ
3
1000
210.0
185.0
35.0
LM4050AEM3-5.0
SOT-23
DBZ
3
1000
210.0
185.0
35.0
LM4050AEM3-5.0/NOPB
SOT-23
DBZ
3
1000
210.0
185.0
35.0
LM4050AEM3-8.2
SOT-23
DBZ
3
1000
210.0
185.0
35.0
LM4050AEM3-8.2/NOPB
SOT-23
DBZ
3
1000
210.0
185.0
35.0
LM4050AEM3X-10
SOT-23
DBZ
3
3000
210.0
185.0
35.0
LM4050AEM3X-10/NOPB
SOT-23
DBZ
3
3000
210.0
185.0
35.0
LM4050AEM3X-2.5/NOPB
SOT-23
DBZ
3
3000
210.0
185.0
35.0
LM4050AEM3X-5.0/NOPB
SOT-23
DBZ
3
3000
210.0
185.0
35.0
LM4050AIM3-10
SOT-23
DBZ
3
1000
210.0
185.0
35.0
LM4050AIM3-10/NOPB
SOT-23
DBZ
3
1000
210.0
185.0
35.0
LM4050AIM3-2.5
SOT-23
DBZ
3
1000
210.0
185.0
35.0
LM4050AIM3-2.5/NOPB
SOT-23
DBZ
3
1000
210.0
185.0
35.0
LM4050AIM3-4.1
SOT-23
DBZ
3
1000
210.0
185.0
35.0
LM4050AIM3-4.1/NOPB
SOT-23
DBZ
3
1000
210.0
185.0
35.0
LM4050AIM3-5.0
SOT-23
DBZ
3
1000
210.0
185.0
35.0
LM4050AIM3-5.0/NOPB
SOT-23
DBZ
3
1000
210.0
185.0
35.0
LM4050AIM3X-2.5
SOT-23
DBZ
3
3000
210.0
185.0
35.0
LM4050AIM3X-2.5/NOPB
SOT-23
DBZ
3
3000
210.0
185.0
35.0
LM4050AIM3X-4.1/NOPB
SOT-23
DBZ
3
3000
210.0
185.0
35.0
LM4050AIM3X-5.0
SOT-23
DBZ
3
3000
210.0
185.0
35.0
LM4050AIM3X-5.0/NOPB
SOT-23
DBZ
3
3000
210.0
185.0
35.0
LM4050BEM3-10/NOPB
SOT-23
DBZ
3
1000
210.0
185.0
35.0
LM4050BEM3-2.5
SOT-23
DBZ
3
1000
210.0
185.0
35.0
LM4050BEM3-2.5/NOPB
SOT-23
DBZ
3
1000
210.0
185.0
35.0
LM4050BEM3-4.1/NOPB
SOT-23
DBZ
3
1000
210.0
185.0
35.0
LM4050BEM3-5.0
SOT-23
DBZ
3
1000
210.0
185.0
35.0
LM4050BEM3-5.0/NOPB
SOT-23
DBZ
3
1000
210.0
185.0
35.0
LM4050BEM3-8.2/NOPB
SOT-23
DBZ
3
1000
210.0
185.0
35.0
LM4050BEM3X-10/NOPB
SOT-23
DBZ
3
3000
210.0
185.0
35.0
LM4050BEM3X-2.5/NOPB
SOT-23
DBZ
3
3000
210.0
185.0
35.0
LM4050BEM3X-5.0/NOPB
SOT-23
DBZ
3
3000
210.0
185.0
35.0
LM4050BIM3-10/NOPB
SOT-23
DBZ
3
1000
210.0
185.0
35.0
LM4050BIM3-2.5
SOT-23
DBZ
3
1000
210.0
185.0
35.0
LM4050BIM3-2.5/NOPB
SOT-23
DBZ
3
1000
210.0
185.0
35.0
LM4050BIM3-4.1/NOPB
SOT-23
DBZ
3
1000
210.0
185.0
35.0
LM4050BIM3-5.0
SOT-23
DBZ
3
1000
210.0
185.0
35.0
LM4050BIM3-5.0/NOPB
SOT-23
DBZ
3
1000
210.0
185.0
35.0
LM4050BIM3X-2.0/NOPB
SOT-23
DBZ
3
3000
210.0
185.0
35.0
LM4050BIM3X-2.5/NOPB
SOT-23
DBZ
3
3000
210.0
185.0
35.0
Pack Materials-Page 6
PACKAGE MATERIALS INFORMATION
www.ti.com
23-Sep-2013
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
LM4050BIM3X-4.1/NOPB
SOT-23
DBZ
3
3000
210.0
185.0
35.0
LM4050BIM3X-5.0/NOPB
SOT-23
DBZ
3
3000
210.0
185.0
35.0
LM4050CEM3-10/NOPB
SOT-23
DBZ
3
1000
210.0
185.0
35.0
LM4050CEM3-2.5
SOT-23
DBZ
3
1000
210.0
185.0
35.0
LM4050CEM3-2.5/NOPB
SOT-23
DBZ
3
1000
210.0
185.0
35.0
LM4050CEM3-5.0
SOT-23
DBZ
3
1000
210.0
185.0
35.0
LM4050CEM3-5.0/NOPB
SOT-23
DBZ
3
1000
210.0
185.0
35.0
LM4050CEM3X-2.5/NOPB
SOT-23
DBZ
3
3000
210.0
185.0
35.0
LM4050CEM3X-5.0/NOPB
SOT-23
DBZ
3
3000
210.0
185.0
35.0
LM4050CIM3-10/NOPB
SOT-23
DBZ
3
1000
210.0
185.0
35.0
LM4050CIM3-2.5
SOT-23
DBZ
3
1000
210.0
185.0
35.0
LM4050CIM3-2.5/NOPB
SOT-23
DBZ
3
1000
210.0
185.0
35.0
LM4050CIM3-4.1
SOT-23
DBZ
3
1000
210.0
185.0
35.0
LM4050CIM3-4.1/NOPB
SOT-23
DBZ
3
1000
210.0
185.0
35.0
LM4050CIM3-5.0
SOT-23
DBZ
3
1000
210.0
185.0
35.0
LM4050CIM3-5.0/NOPB
SOT-23
DBZ
3
1000
210.0
185.0
35.0
LM4050CIM3X-2.0/NOPB
SOT-23
DBZ
3
3000
210.0
185.0
35.0
LM4050CIM3X-2.5/NOPB
SOT-23
DBZ
3
3000
210.0
185.0
35.0
LM4050CIM3X-4.1/NOPB
SOT-23
DBZ
3
3000
210.0
185.0
35.0
LM4050CIM3X-5.0/NOPB
SOT-23
DBZ
3
3000
210.0
185.0
35.0
LM4050QAEM3-10/NOPB
SOT-23
DBZ
3
1000
210.0
185.0
35.0
LM4050QAEM3-2.0/NOPB
SOT-23
DBZ
3
1000
210.0
185.0
35.0
LM4050QAEM3-2.5/NOPB
SOT-23
DBZ
3
1000
210.0
185.0
35.0
LM4050QAEM3-4.1/NOPB
SOT-23
DBZ
3
1000
210.0
185.0
35.0
LM4050QAEM3-5.0/NOPB
SOT-23
DBZ
3
1000
210.0
185.0
35.0
LM4050QAEM3-8.2/NOPB
SOT-23
DBZ
3
1000
210.0
185.0
35.0
LM4050QAEM3X10/NOPB
SOT-23
DBZ
3
3000
210.0
185.0
35.0
LM4050QAEM3X2.0/NOP
B
SOT-23
DBZ
3
3000
210.0
185.0
35.0
LM4050QAEM3X2.5/NOP
B
SOT-23
DBZ
3
3000
210.0
185.0
35.0
LM4050QAEM3X4.1/NOP
B
SOT-23
DBZ
3
3000
210.0
185.0
35.0
LM4050QAEM3X5.0/NOP
B
SOT-23
DBZ
3
3000
210.0
185.0
35.0
LM4050QAEM3X8.2/NOP
B
SOT-23
DBZ
3
3000
210.0
185.0
35.0
LM4050QAIM3-10/NOPB
SOT-23
DBZ
3
1000
210.0
185.0
35.0
LM4050QAIM3-2.0/NOPB
SOT-23
DBZ
3
1000
210.0
185.0
35.0
LM4050QAIM3-2.5/NOPB
SOT-23
DBZ
3
1000
210.0
185.0
35.0
LM4050QAIM3-4.1/NOPB
SOT-23
DBZ
3
1000
210.0
185.0
35.0
LM4050QAIM3-5.0/NOPB
SOT-23
DBZ
3
1000
210.0
185.0
35.0
LM4050QAIM3-8.2/NOPB
SOT-23
DBZ
3
1000
210.0
185.0
35.0
LM4050QAIM3X10/NOPB
SOT-23
DBZ
3
3000
210.0
185.0
35.0
LM4050QAIM3X2.0/NOPB
SOT-23
DBZ
3
3000
210.0
185.0
35.0
Pack Materials-Page 7
PACKAGE MATERIALS INFORMATION
www.ti.com
23-Sep-2013
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
LM4050QAIM3X2.5/NOPB
SOT-23
DBZ
3
3000
210.0
185.0
35.0
LM4050QAIM3X4.1/NOPB
SOT-23
DBZ
3
3000
210.0
185.0
35.0
LM4050QAIM3X5.0/NOPB
SOT-23
DBZ
3
3000
210.0
185.0
35.0
LM4050QAIM3X8.2/NOPB
SOT-23
DBZ
3
3000
210.0
185.0
35.0
LM4050QBEM3-10/NOPB
SOT-23
DBZ
3
1000
210.0
185.0
35.0
LM4050QBEM3-2.0/NOPB
SOT-23
DBZ
3
1000
210.0
185.0
35.0
LM4050QBEM3-2.5/NOPB
SOT-23
DBZ
3
1000
210.0
185.0
35.0
LM4050QBEM3-4.1/NOPB
SOT-23
DBZ
3
1000
210.0
185.0
35.0
LM4050QBEM3-5.0/NOPB
SOT-23
DBZ
3
1000
210.0
185.0
35.0
LM4050QBEM3-8.2/NOPB
SOT-23
DBZ
3
1000
210.0
185.0
35.0
LM4050QBEM3X10/NOPB
SOT-23
DBZ
3
3000
210.0
185.0
35.0
LM4050QBEM3X2.0/NOP
B
SOT-23
DBZ
3
3000
210.0
185.0
35.0
LM4050QBEM3X2.5/NOP
B
SOT-23
DBZ
3
3000
210.0
185.0
35.0
LM4050QBEM3X4.1/NOP
B
SOT-23
DBZ
3
3000
210.0
185.0
35.0
LM4050QBEM3X5.0/NOP
B
SOT-23
DBZ
3
3000
210.0
185.0
35.0
LM4050QBEM3X8.2/NOP
B
SOT-23
DBZ
3
3000
210.0
185.0
35.0
LM4050QBIM3-10/NOPB
SOT-23
DBZ
3
1000
210.0
185.0
35.0
LM4050QBIM3-2.0/NOPB
SOT-23
DBZ
3
1000
210.0
185.0
35.0
LM4050QBIM3-2.5/NOPB
SOT-23
DBZ
3
1000
210.0
185.0
35.0
LM4050QBIM3-4.1/NOPB
SOT-23
DBZ
3
1000
210.0
185.0
35.0
LM4050QBIM3-5.0/NOPB
SOT-23
DBZ
3
1000
210.0
185.0
35.0
LM4050QBIM3-8.2/NOPB
SOT-23
DBZ
3
1000
210.0
185.0
35.0
LM4050QBIM3X10/NOPB
SOT-23
DBZ
3
3000
210.0
185.0
35.0
LM4050QBIM3X2.0/NOPB
SOT-23
DBZ
3
3000
210.0
185.0
35.0
LM4050QBIM3X2.5/NOPB
SOT-23
DBZ
3
3000
210.0
185.0
35.0
LM4050QBIM3X4.1/NOPB
SOT-23
DBZ
3
3000
210.0
185.0
35.0
LM4050QBIM3X5.0/NOPB
SOT-23
DBZ
3
3000
210.0
185.0
35.0
LM4050QBIM3X8.2/NOPB
SOT-23
DBZ
3
3000
210.0
185.0
35.0
LM4050QCEM3-10/NOPB
SOT-23
DBZ
3
1000
210.0
185.0
35.0
LM4050QCEM3-2.0/NOPB
SOT-23
DBZ
3
1000
210.0
185.0
35.0
LM4050QCEM3-2.5/NOPB
SOT-23
DBZ
3
1000
210.0
185.0
35.0
LM4050QCEM3-4.1/NOPB
SOT-23
DBZ
3
1000
210.0
185.0
35.0
LM4050QCEM3-5.0/NOPB
SOT-23
DBZ
3
1000
210.0
185.0
35.0
LM4050QCEM3-8.2/NOPB
SOT-23
DBZ
3
1000
210.0
185.0
35.0
LM4050QCEM3X10/NOPB
SOT-23
DBZ
3
3000
210.0
185.0
35.0
LM4050QCEM3X2.0/NOP
B
SOT-23
DBZ
3
3000
210.0
185.0
35.0
LM4050QCEM3X2.5/NOP
B
SOT-23
DBZ
3
3000
210.0
185.0
35.0
LM4050QCEM3X4.1/NOP
B
SOT-23
DBZ
3
3000
210.0
185.0
35.0
Pack Materials-Page 8
PACKAGE MATERIALS INFORMATION
www.ti.com
23-Sep-2013
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
LM4050QCEM3X5.0/NOP
B
Device
SOT-23
DBZ
3
3000
210.0
185.0
35.0
LM4050QCEM3X8.2/NOP
B
SOT-23
DBZ
3
3000
210.0
185.0
35.0
LM4050QCIM3-10/NOPB
SOT-23
DBZ
3
1000
210.0
185.0
35.0
LM4050QCIM3-2.0/NOPB
SOT-23
DBZ
3
1000
210.0
185.0
35.0
LM4050QCIM3-2.5/NOPB
SOT-23
DBZ
3
1000
210.0
185.0
35.0
LM4050QCIM3-4.1/NOPB
SOT-23
DBZ
3
1000
210.0
185.0
35.0
LM4050QCIM3-5.0/NOPB
SOT-23
DBZ
3
1000
210.0
185.0
35.0
LM4050QCIM3-8.2/NOPB
SOT-23
DBZ
3
1000
210.0
185.0
35.0
LM4050QCIM3X10/NOPB
SOT-23
DBZ
3
3000
210.0
185.0
35.0
LM4050QCIM3X2.0/NOPB
SOT-23
DBZ
3
3000
210.0
185.0
35.0
LM4050QCIM3X2.5/NOPB
SOT-23
DBZ
3
3000
210.0
185.0
35.0
LM4050QCIM3X4.1/NOPB
SOT-23
DBZ
3
3000
210.0
185.0
35.0
LM4050QCIM3X5.0/NOPB
SOT-23
DBZ
3
3000
210.0
185.0
35.0
Pack Materials-Page 9
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of
non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.
Products
Applications
Audio
www.ti.com/audio
Automotive and Transportation
www.ti.com/automotive
Amplifiers
amplifier.ti.com
Communications and Telecom
www.ti.com/communications
Data Converters
dataconverter.ti.com
Computers and Peripherals
www.ti.com/computers
DLP® Products
www.dlp.com
Consumer Electronics
www.ti.com/consumer-apps
DSP
dsp.ti.com
Energy and Lighting
www.ti.com/energy
Clocks and Timers
www.ti.com/clocks
Industrial
www.ti.com/industrial
Interface
interface.ti.com
Medical
www.ti.com/medical
Logic
logic.ti.com
Security
www.ti.com/security
Power Mgmt
power.ti.com
Space, Avionics and Defense
www.ti.com/space-avionics-defense
Microcontrollers
microcontroller.ti.com
Video and Imaging
www.ti.com/video
RFID
www.ti-rfid.com
OMAP Applications Processors
www.ti.com/omap
TI E2E Community
e2e.ti.com
Wireless Connectivity
www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2013, Texas Instruments Incorporated