Diodes DMN2028UVT-13 N-channel enhancement mode mosfet Datasheet

DMN2028UVT
N-CHANNEL ENHANCEMENT MODE MOSFET
V(BR)DSS
Features and Benefits





ID
RDS(ON) Max
TA = +25°C
24m @ VGS = 4.5V
20V
6.2A
Low Input Capacitance
Low On-Resistance
Fast Switching Speed
Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
Halogen and Antimony Free. “Green” Device (Note 3)
32m @ VGS = 2.5V
Mechanical Data
Description and Applications
This new generation MOSFET is designed to minimize the on-state
resistance (RDS(ON)) and yet maintain superior switching performance,
making it ideal for high efficiency power management applications.



DC-DC Converters
Power Management Functions
Backlighting






Case: TSOT26
Case Material: Molded Plastic, ―Green‖ Molding Compound.
UL Flammability Classification Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020
Terminal Connections: See Diagram
Terminals: Finish – Tin Finish Annealed over Copper Leadframe.
Solderable per MIL-STD-202, Method 208
Weight: 0.013 grams (Approximate)
D
TSOT26
D 1
6
D
D 2
5
D
G 3
4
S
Top View
G
S
Top View
Pin Configuration
Equivalent Circuit
Ordering Information (Note 4)
Part Number
DMN2028UVT-7
DMN2028UVT-13
Notes:
Case
TSOT26
TSOT26
Packaging
3,000/Tape & Reel
10,000/Tape & Reel
1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.
2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green"
and Lead-free.
3. Halogen- and Antimony-free "Green‖ products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and
<1000ppm antimony compounds.
4. For packaging details, go to our website at http://www.diodes.com/products/packages.html.
Marking Information
N2V
Date Code Key
Year
Code
Month
Code
2014
B
Jan
1
2015
C
Feb
2
DMN2028UVT
Document number: DS37128 Rev. 1 - 2
Mar
3
N2V = Product Type Marking Code
YM = Date Code Marking
Y = Year (ex: C = 2015)
M = Month (ex: 9 = September)
YM
ADVANCE INFORMATION
NEW PRODUCT
Product Summary
2016
D
Apr
4
May
5
2017
E
Jun
6
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2018
F
Jul
7
Aug
8
2019
G
Sep
9
Oct
O
2020
H
Nov
N
Dec
D
May 2015
© Diodes Incorporated
DMN2028UVT
ADVANCE INFORMATION
NEW PRODUCT
Maximum Ratings (@TA = +25°C, unless otherwise specified.)
Characteristic
Drain-Source Voltage
Gate-Source Voltage
Continuous Drain Current (Note 6) VGS = 4.5V
Maximum Body Diode Forward Current (Note 6)
Pulsed Drain Current (10μs Pulse, Duty Cycle = 1%)
Steady State
Symbol
VDSS
VGSS
ID
IS
IDM
TA = +25°C
Value
20
±8
6.2
1.5
40
Unit
V
V
A
A
A
Thermal Characteristics (@TA = +25°C, unless otherwise specified.)
Characteristic
Total Power Dissipation (Note 5)
Symbol
PD
TA = +25°C
Steady state
t<10s
TA = +25°C
Steady state
t<10s
Thermal Resistance, Junction to Ambient (Note 5)
Total Power Dissipation (Note 6)
Thermal Resistance, Junction to Ambient (Note 6)
RJA
PD
RJA
Thermal Resistance, Junction to Case (Note 6)
Operating and Storage Temperature Range
RJC
TJ, TSTG
Value
1.2
105
76
1.6
76
50
15
-55 to +150
Unit
W
°C/W
W
°C/W
°C
Electrical Characteristics (@TA = +25°C, unless otherwise specified.)
Characteristic
OFF CHARACTERISTICS (Note 7)
Drain-Source Breakdown Voltage
Zero Gate Voltage Drain Current
Gate-Source Leakage
ON CHARACTERISTICS (Note 7)
Gate Threshold Voltage
Symbol
Min
Typ
Max
Unit
BVDSS
IDSS
IGSS
20






1
100
μA
VGS(TH)
Static Drain-Source On-Resistance
RDS(ON)
VSD
0.4




20
24

1.5
24
32
1.2
Ciss
Coss
Crss
Qg
Qgs
Qgd
tD(ON)
tR
tD(OFF)
tF










856
83
78
8.3
1.3
3.1
13.2
12.6
65
22










Diode Forward Voltage
DYNAMIC CHARACTERISTICS (Note 8)
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Total Gate Charge
Gate-Source Charge
Gate-Drain Charge
Turn-On Delay Time
Turn-On Rise Time
Turn-Off Delay Time
Turn-Off Fall Time
Notes:
V
nA
V
mΩ
V
Test Condition
VGS = 0V, ID = 250μA
VDS = 16V, VGS = 0V
VGS = 8V, VDS = 0V
VDS = VGS, ID = 250μA
VGS = 4.5V, ID = 6.2A
VGS = 2.5V, ID = 5.2A
VGS = 0V, IS = 1.3A
pF
VDS = 10V, VGS = 0V
f = 1.0MHz
nC
VGS = 4.5V, VDS = 10V, ID = 6.2A
ns
VDD = 10V, VGS = 4.5V,
ID = 1A, RG = 6Ω
5. Device mounted on FR-4 PC board, with minimum recommended pad layout, single sided.
6. Device mounted on FR-4 substrate PC board, 2oz copper, with thermal vias to bottom layer 1inch square copper plate.
7. Short duration pulse test used to minimize self-heating effect.
8. Guaranteed by design. Not subject to production testing.
DMN2028UVT
Document number: DS37128 Rev. 1 - 2
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May 2015
© Diodes Incorporated
DMN2028UVT
30
VGS=8.0V
28
24
VGS=2.5V
20
ID, DRAIN CURRENT (A)
ID, DRAIN CURRENT (A)
25
VGS=3.0V
VGS=4.5V
15
VGS=1.5V
10
5
16
12
8
TA=125℃
TA=150℃
0
0
0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8
VDS, DRAIN-SOURCE VOLTAGE (V)
Figure 1. Typical Output Characteristic
2
0.06
0.05
0.04
0.03
VGS=2.5V
0.02
VGS=4.5V
0.01
0
0
0
RDS(ON), DRAIN-SOURCE ON-RESISTANCE (Ω)
RDS(ON), DRAIN-SOURCE ON-RESISTANCE
(Ω)
20
4
0
TA=85℃
TA=25℃
TA=-55℃
0.5
1
1.5
2
2.5
VGS, GATE-SOURCE VOLTAGE (V)
Figure 2. Typical Transfer Characteristic
3
0.05
VGS= 4.5V
0.04
TA=85℃
0.03
TA=125℃
TA=150℃
TA=25℃
0.02
TA=-55℃
0.01
0
0
8
12
16
20
ID, DRAIN CURRENT (A)
Figure 4. Typical On-Resistance vs. Drain Current and
Temperature
5
10
15
20
25
30
ID, DRAIN-SOURCE CURRENT (A)
Figure 3. Typical On-Resistance vs. Drain Current
4
0.05
RDS(ON), DRAIN-SOURCE ON-RESISTANCE
(Ω)
1.7
RDS(ON), DRAIN-SOURCE ON-RESISTANCE
(NORMALIZED)
ADVANCE INFORMATION
NEW PRODUCT
VDS= 5.0V
VGS=2.0V
VGS=2.5V, ID=5.2A
1.5
1.3
VGS=4.5V, ID=6.2A
1.1
0.9
0.7
0.5
-50
-25
0
25
50
75
100 125 150
TJ, JUNCTION TEMPERATURE (℃)
Figure 5. On-Resistance Variation with Temperature
DMN2028UVT
Document number: DS37128 Rev. 1 - 2
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0.04
0.03
VGS=2.5V, ID=5A
0.02
VGS=4.5V, ID=8.2A
0.01
0
-50
-25
0
25
50
75 100 125 150
TJ, JUNCTION TEMPERATURE (℃)
Figure 6. On-Resistance Variation with Temperature
May 2015
© Diodes Incorporated
DMN2028UVT
10
IS, SOURCE CURRENT (A)
VGS(TH), GATE THRESHOLD VOLTAGE (V)
1.2
0.9
ID=1mA
0.6
ID=250μA
0.3
0
TA=25℃
1
0.1
0.01
-50
-25
0
25
50
75
100
125
150
0.4
TJ, JUNCTION TEMPERATURE (℃)
Figure 7. Gate Threshold Variation vs. Temperature
0.5
0.6
0.7
0.8
0.9
VSD, SOURCE-DRAIN VOLTAGE (V)
Figure 8. Diode Forward Voltage vs. Current
1
100
10000
RDS(ON) Limited
ID, DRAIN CURRENT (A)
f=1MHz
CT, JUNCTION CAPACITANCE (pF)
Ciss
1000
Coss
100
Crss
10
5
10
15
VDS, DRAIN-SOURCE VOLTAGE (V)
Figure 9. Typical Junction Capacitance
20
PW =100μs
10
1
PW =10ms
PW =1ms
PW =100ms
0.1
0.01
0
TJ(MAX)=150℃
PW =1s
TA=25℃
PW =10s
Single Pulse
DUT on 1*MRP board
DC
VGS=8V
0.1
1
10
VDS, DRAIN-SOURCE VOLTAGE (V)
Figure 10. SOA, Safe Operation Area
100
1
r(t), TRANSIENT THERMAL RESISTANCE
ADVANCE INFORMATION
NEW PRODUCT
1.5
D=0.5
D=0.9
D=0.3
D=0.7
0.1
D=0.1
D=0.05
D=0.02
0.01
D=0.01
RθJA(t)=r(t) * RθJA
RθJA=101℃/W
Duty Cycle, D=t1 / t2
D=0.005
D=Single Pulse
0.001
1E-05
DMN2028UVT
Document number: DS37128 Rev. 1 - 2
0.0001
0.001
0.01
0.1
1
10
t1, PULSE DURATION TIME (sec)
Figure 11. Transient Thermal Resistance
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100
1000
May 2015
© Diodes Incorporated
DMN2028UVT
Package Outline Dimensions
ADVANCE INFORMATION
NEW PRODUCT
Please see AP02002 at http://www.diodes.com/datasheets/ap02002.pdf for the latest version.
TSOT26
Dim Min Max Typ
A
— 1.00 —
A1 0.01 0.10 —
A2 0.84 0.90 —
D
—
— 2.90
E
—
— 2.80
E1
—
— 1.60
b
0.30 0.45 —
c
0.12 0.20 —
e
—
— 0.95
e1
—
— 1.90
L
0.30 0.50 —
L2
—
— 0.25
θ
0°
8°
4°
θ1
4° 12° —
All Dimensions in mm
D
e1
E
E1
L2
c
4x1
e
L

6x b
A
A2
A1
Suggested Pad Layout
Please see AP02001 at http://www.diodes.com/datasheets/ap02001.pdf for the latest version.
C
C
Dimensions Value (in mm)
C
0.950
X
0.700
Y
1.000
Y1
3.199
Y1
Y (6x)
X (6x)
DMN2028UVT
Document number: DS37128 Rev. 1 - 2
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© Diodes Incorporated
DMN2028UVT
ADVANCE INFORMATION
NEW PRODUCT
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Copyright © 2015, Diodes Incorporated
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DMN2028UVT
Document number: DS37128 Rev. 1 - 2
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