HSP061-2Y Automotive 2-line ESD protection for high speed lines Datasheet - production data Complies with following standards: • ISO 10605 - C = 150 pF, R = 330 Ω – 30 kV (air discharge) – 15 kV (contact discharge) • ISO 10605 - C = 330 pF, R = 330 Ω – 30 kV (air discharge) – 15 kV (contact discharge) • ISO 7637-3: – Pulse 3a: Vs = -150 V – Pulse 3b: Vs = +100 V HSP061-2P6Y SOT666 Figure 1. Functional diagram (top view) Applications I/O1 1 6 I/O1 GND 2 5 VBUS I/O2 3 4 I/O2 The HSP061-2Y is designed to protect against electrostatic discharge on automotive circuits driving: • APIX • LVDS • HDMI 1.3 and 1.4 • Ethernet HSP061-2P6Y SOT666 • Digital Video Interface • Display Port Features • USB 3.0 • Flow-through routing to keep signal integrity • Serial ATA • Ultralarge bandwidth: 6 GHz • High speed communication buses • Ultralow capacitance: 0.6 pF • HMI • Low leakage current: 100 nA at 25 °C • Extended operating junction temperature range: -40 °C to 150 °C • RoHS compliant • AEC-Q101 qualified Benefits • High ESD robustness of the equipment Description The HSP061-2Y is a 2-channel ESD array with a rail to rail architecture designed specifically for the protection of high speed differential lines. The ultralow variation of the capacitance ensures very low influence on signal-skew. The large bandwidth makes it compatible with 5 Gbps. • Suitable for high density boards November 2014 This is information on a product in full production. DocID024471 Rev 2 1/8 www.st.com 8 Characteristics 1 HSP061-2Y Characteristics Table 1. Absolute maximum ratings Tamb = 25 °C Symbol Parameter Value ISO 10605 - C = 150 pF, R = 330 Ω contact discharge air discharge VPP(1) Unit 15 30 Peak pulse voltage kV ISO 10605 - C = 330 pF, R = 330 Ω contact discharge air discharge Ipp Peak pulse current (8/20 µs) Tj 15 30 3 A Operating junction temperature range -40 to +150 °C Tstg Storage temperature range -65 to +150 °C TL Maximum lead solder temperature (10 s duration) 260 °C 1. For a surge greater than the maximum values, the diode will fail in short-circuit. Table 2. Electrical characteristics Tamb = 25 °C Symbol VBR Parameter Breakdown voltage Test conditions IR = 1 mA Min. Typ. Max. 6 Unit V VR = 5 V 150 VR = 3 V 100 IR Leakage current VCL Clamping voltage ISO 10605 - C = 150 pF, R = 330 Ω +8 kV contact discharge, measured at 30 ns 18 CI/O - GND Capacitance (input/output to ground) VI/O = 0 V, F = 200 to 3000 MHz, VOSC = 30 mV 0.6 0.85 pF ΔCI/O - GND Capacitance variation (input/output to ground) VI/O = 0 V F = 200 to 3000 MHz, VOSC = 30 mV 0.03 0.08 pF Cut-off frequency -3 dB 5.5 fC 2/8 DocID024471 Rev 2 nA V GHz HSP061-2Y Characteristics Figure 2. Leakage current versus junction temperature (typical values) Figure 3. S21 attenuation measurement S21(db) 10.00 0.00 VR = V RM = 3 V IR (nA) - 4.00 1.00 - 8.00 0.10 - 12.00 F(Hz) Tj (°C) 0.01 25 50 75 100 125 150 - 16.00 300.0k 1.0M 3.0M 10.0M 30.0M 100.0M 300.0M 1.0G 3.0G Figure 4. Eye diagram - HDMI mask at 3.4 Gbps per channel 250 mV/div 49 ps/div Figure 5. ESD response to IEC 61000-4-2 (+8 kV contact discharge) 50 V/div 20 ns/div Figure 6. ESD response to IEC 61000-4-2 (-8 kV contact discharge) 50 V/div DocID024471 Rev 2 20 ns/div 3/8 Application information HSP061-2Y Figure 7. Response to ISO 7637-3 Pulse 3a (Us = -150 V) Figure 8. Response to ISO 7637-3 Pulse 3b (Us = +100 V) 5 V/div 5 V/div 50 ns/div 500 mA/div 50 ns/div 500 mA/div 2 Application information More information is available in the STMicroelectronics application note: AN2689, “Protection of automotive electronics from electrical hazards, guidelines for design and component selection”. 4/8 DocID024471 Rev 2 HSP061-2Y 3 Package information Package information • Epoxy meets UL94, V0 • Lead-free packages In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. Figure 9. SOT666 dimension definitions b1 L1 L3 b D E1 A L2 E A3 e DocID024471 Rev 2 5/8 Package information HSP061-2Y Table 3. SOT666 dimension values Dimensions Ref. Millimeters Min. Typ. Inches Max. Min. Typ. Max. A 0.45 0.60 0.018 0.024 A3 0.08 0.18 0.003 0.007 b 0.17 0.34 0.007 0.013 b1 0.19 0.34 0.007 D 1.50 1.70 0.059 0.067 E 1.50 1.70 0.059 0.067 E1 1.10 1.30 0.043 0.051 0.27 0.011 e 0.50 0.020 L1 0.19 0.007 L2 0.10 0.30 L3 0.10 Figure 10. Footprint recommendations dimensions in mm (inches) 0.004 0.013 0.012 0.004 Figure 11. Marking 0.50 (0.019) 0.62 2.60 (0.024) (0.01) RY 0.99 (0.039) 0.30 (0.012) Note: 6/8 Product marking may be rotated by 90° or 180° to differentiate assembly location. In no case should this product marking be used to orient the component for its placement on a PCB. Only pin 1 mark is to be used for this purpose. DocID024471 Rev 2 HSP061-2Y 4 Ordering information Ordering information Figure 12. Ordering information scheme HSP 06 1 - 2 P6 Y High speed line protection Breakdown voltage Version Number of lines Package P6 = SOT-666 Automotive grade Table 4. Ordering information Order code Marking Package Weight Base qty Delivery mode HSP061-2P6Y RY(1) SOT-666 3 mg 3000 Tape and reel 1. The marking can be rotated by 90° or 180° to differentiate assembly location 5 Revision history Table 5. Document revision history Date Revision Changes 17-Oct-2013 1 Initial release. 19-Nov-2014 2 Updated Figure 5, Figure 6 and Table 4. Added Figure 7 and Figure 8. DocID024471 Rev 2 7/8 HSP061-2Y IMPORTANT NOTICE – PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. © 2014 STMicroelectronics – All rights reserved 8/8 DocID024471 Rev 2