LM6171 www.ti.com SNOS745C – MAY 1998 – REVISED MARCH 2013 LM6171 High Speed Low Power Low Distortion Voltage Feedback Amplifier Check for Samples: LM6171 FEATURES DESCRIPTION • • • • • • • • • The LM6171 is a high speed unity-gain stable voltage feedback amplifier. It offers a high slew rate of 3600V/μs and a unity-gain bandwidth of 100 MHz while consuming only 2.5 mA of supply current. The LM6171 has very impressive AC and DC performance which is a great benefit for high speed signal processing and video applications. 1 23 (Typical Unless Otherwise Noted) Easy-To-Use Voltage Feedback Topology Very High Slew Rate: 3600V/μs Wide Unity-Gain-Bandwidth Product: 100 MHz −3dB Frequency @ AV = +2: 62 MHz Low Supply Current: 2.5 mA High CMRR: 110 dB High Open Loop Gain: 90 dB Specified for ±15V and ±5V Operation APPLICATIONS • • • • • • • • • Multimedia Broadcast Systems Line Drivers, Switchers Video Amplifiers NTSC, PAL® and SECAM Systems ADC/DAC Buffers HDTV Amplifiers Pulse Amplifiers and Peak Detectors Instrumentation Amplifier Active Filters The ±15V power supplies allow for large signal swings and give greater dynamic range and signal-tonoise ratio. The LM6171 has high output current drive, low SFDR and THD, ideal for ADC/DAC systems. The LM6171 is specified for ±5V operation for portable applications. The LM6171 is built on TI's advanced VIP III (Vertically Integrated PNP) complementary bipolar process. CONNECTION DIAGRAM Figure 1. Top View 8-Pin SOIC/PDIP See Package Number D (SOIC) or See Package Number P (PDIP) These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. 1 2 3 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PAL is a registered trademark of and used under lisence from Advanced Micro Devices, Inc.. All other trademarks are the property of their respective owners. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 1998–2013, Texas Instruments Incorporated LM6171 SNOS745C – MAY 1998 – REVISED MARCH 2013 www.ti.com Absolute Maximum Ratings (1) (2) ESD Tolerance (3) 2.5 kV Supply Voltage (V+–V−) 36V Differential Input Voltage ±10V V++0.3V to V− −0.3V Common-Mode Voltage Range Input Current ±10mA Output Short Circuit to Ground (4) Continuous −65°C to +150°C Storage Temperature Range Maximum Junction Temperature (5) Soldering Information (1) (2) (3) (4) (5) 150°C Infrared or Convection Reflow (20 sec.) 235°C Wave Soldering Lead Temp (10 sec.) 260°C If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and specifications. Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is intended to be functional, but specific performance is not guaranteed. For guaranteed specifications and the test conditions, see the Electrical Characteristics. Human body model, 1.5 kΩ in series with 100 pF. Continuous short circuit operation at elevated ambient temperature can result in exceeding the maximum allowed junction temperature of 150°C. The maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any ambient temperature is PD = (TJ(max) − TA)/θJA. All numbers apply for packages soldered directly into a PC board. Operating Ratings (1) 5.5V ≤ VS ≤ 34V Supply Voltage −40°C to +85°C Operating Temperature Range LM6171AI, LM6171BI Thermal Resistance (θJA) P Package, 8-Pin PDIP 108°C/W D Package, 8-Pin SOIC 172°C/W (1) 2 Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is intended to be functional, but specific performance is not guaranteed. For guaranteed specifications and the test conditions, see the Electrical Characteristics. Submit Documentation Feedback Copyright © 1998–2013, Texas Instruments Incorporated Product Folder Links: LM6171 LM6171 www.ti.com SNOS745C – MAY 1998 – REVISED MARCH 2013 ±15V DC Electrical Characteristics Unless otherwise specified, all limits guaranteed for TJ = 25°C, V+ = +15V, V− = −15V, VCM = 0V, and RL = 1 kΩ. Boldface limits apply at the temperature extremes Symbol Parameter Conditions Typ (1) LM6171AI Limit LM6171BI Limit 3 6 mV 5 8 max (2) VOS Input Offset Voltage 1.5 TC VOS Input Offset Voltage Average Drift 6 IB Input Bias Current 1 IOS Input Offset Current RIN Input Resistance RO Open Loop Output Resistance CMRR Common Mode Rejection Ratio 0.03 Common Mode 40 Differential Mode 4.9 VCM = ±10V 110 max 2 2 μA 3 3 max MΩ Ω dB min 85 80 dB 80 75 min 80 80 dB 70 70 min 70 70 dB 60 60 min 13.3 12.5 12.5 V 12 12 min −13.3 −12.5 −12.5 V −12 −12 max CMRR ≥ 60 dB AV Large Signal Voltage Gain (3) RL = 1 kΩ 90 RL = 100Ω 83 RL = 1 kΩ RL = 100Ω 95 ±13.5 11.6 −10.5 Continuous Output Current (Open Loop) (4) Sourcing, RL = 100Ω (4) μA 4 70 Input Common-Mode Voltage Range (1) (2) (3) 3 4 75 VCM IS 3 75 VS = ±15V to ±5V ISC μV/°C 80 Power Supply Rejection Ratio Output Swing (2) 14 PSRR VO Units 116 V 9 9 V 8.5 8.5 min −9 −9 V −8.5 −8.5 max 90 90 mA 85 85 min 90 90 mA 85 85 max Sinking, RL = 100Ω 105 Continuous Output Current (in Linear Region) Sourcing, RL = 10Ω 100 mA Sinking, RL = 10Ω 80 mA Output Short Circuit Current Sourcing 135 mA Sinking 135 Supply Current 2.5 mA 4 4 mA 4.5 4.5 max Typical Values represent the most likely parametric norm. All limits are guaranteed by testing or statistical analysis. Large signal voltage gain is the total output swing divided by the input signal required to produce that swing. For VS = ±15V, VOUT = ±5V. For VS = +5V, VOUT = ±1V. The open loop output current is the output swing with the 100Ω load resistor divided by that resistor. Submit Documentation Feedback Copyright © 1998–2013, Texas Instruments Incorporated Product Folder Links: LM6171 3 LM6171 SNOS745C – MAY 1998 – REVISED MARCH 2013 www.ti.com ±15V AC Electrical Characteristics Unless otherwise specified, all limits guaranteed for TJ = 25°C, V+ = +15V, V− = −15V, VCM = 0V, and RL = 1 kΩ. Boldface limits apply at the temperature extremes Symbol Parameter Conditions Typ (1) LM6171AI Limit (2) SR Slew Rate GBW (3) AV = +2, VIN = 13 VPP 3600 AV = +2, VIN = 10 VPP 3000 Unity Gain-Bandwidth Product −3 dB Frequency LM6171BI Limit Units (2) V/μs 100 MHz AV = +1 160 MHz AV = +2 62 MHz 40 deg φm Phase Margin ts Settling Time (0.1%) AV = −1, VOUT = ±5V RL = 500Ω 48 ns Propagation Delay VIN = ±5V, RL = 500Ω, AV = −2 6 ns AD Differential Gain (4) 0.03 % φD Differential Phase (4) 0.5 deg en Input-Referred Voltage Noise f = 1 kHz 12 nV/√Hz in Input-Referred Current Noise f = 1 kHz 1 pA/√Hz (1) (2) (3) (4) 4 Typical Values represent the most likely parametric norm. All limits are guaranteed by testing or statistical analysis. Slew rate is the average of the rising and falling slew rates. Differential gain and phase are measured with AV = +2, VIN = 1 VPP at 3.58 MHz and both input and output 75Ω terminated. Submit Documentation Feedback Copyright © 1998–2013, Texas Instruments Incorporated Product Folder Links: LM6171 LM6171 www.ti.com SNOS745C – MAY 1998 – REVISED MARCH 2013 ±5V DC Electrical Characteristics Unless otherwise specified, all limits guaranteed for TJ = 25°C, V+ = +5V, V− = −5V, VCM = 0V, and RL = 1 kΩ. Boldface limits apply at the temperature extremes Symbol Parameter Conditions Typ (1) LM6171AI Limit LM6171BI Limit 3 6 mV 5 8 max (2) VOS Input Offset Voltage 1.2 TC VOS Input Offset Voltage Average Drift 4 IB Input Bias Current 1 IOS Input Offset Current RIN Input Resistance RO Open Loop Output Resistance CMRR Common Mode Rejection Ratio 0.03 Common Mode 40 Differential Mode 4.9 VCM = ±2.5V Power Supply Rejection Ratio VS = ±15V to ±5V VCM Input Common-Mode Voltage Range CMRR ≥ 60 dB AV Large Signal Voltage Gain (3) RL = 1 kΩ RL = 100Ω Output Swing RL = 1 kΩ RL = 100Ω 105 95 Sourcing, RL = 100Ω Sinking, RL = 100Ω ISC Output Short Circuit Current IS Supply Current (1) (2) (3) (4) μV/°C 2.5 2.5 μA 3.5 3.5 max 1.5 1.5 μA 2.2 2.2 max MΩ Ω 80 75 dB 75 70 min 85 80 dB 80 75 min ±3.7 84 V 75 75 dB 65 65 min 70 70 dB 60 60 min 3.2 3.2 V 3 3 min −3.4 −3.2 −3.2 V −3 −3 max 3.2 2.8 2.8 V 2.5 2.5 min −2.8 −2.8 V −2.5 −2.5 max 28 28 mA 25 25 min 28 28 mA 25 25 max 80 3.5 −3.0 Continuous Output Current (Open Loop) (4) (2) 14 PSRR VO Units 32 30 Sourcing 130 Sinking 100 2.3 mA mA 3 3 mA 3.5 3.5 max Typical Values represent the most likely parametric norm. All limits are guaranteed by testing or statistical analysis. Large signal voltage gain is the total output swing divided by the input signal required to produce that swing. For VS = ±15V, VOUT = ±5V. For VS = +5V, VOUT = ±1V. The open loop output current is the output swing with the 100Ω load resistor divided by that resistor. Submit Documentation Feedback Copyright © 1998–2013, Texas Instruments Incorporated Product Folder Links: LM6171 5 LM6171 SNOS745C – MAY 1998 – REVISED MARCH 2013 www.ti.com ±5V AC Electrical Characteristics Unless otherwise specified, all limits guaranteed for TJ = 25°C, V+ = +5V, V− = −5V, VCM = 0V, and RL = 1 kΩ. Boldface limits apply at the temperature extremes Symbol Parameter Conditions Typ (1) LM6171AI Limit (2) (3) SR Slew Rate GBW Unity Gain-Bandwidth Product AV = +2, VIN = 3.5 VPP −3 dB Frequency LM6171BI Limit Units (2) 750 V/μs 70 MHz AV = +1 130 MHz AV = +2 45 φm Phase Margin 57 deg ts Settling Time (0.1%) AV = −1, VOUT = +1V, RL = 500Ω 60 ns Propagation Delay VIN = ±1V, RL = 500Ω, AV = −2 8 ns 0.04 % AD Differential Gain (4) (4) φD Differential Phase 0.7 deg en Input-Referred Voltage Noise f = 1 kHz 11 nV/√Hz in Input-Referred Current Noise f = 1 kHz 1 pA/√Hz (1) (2) (3) (4) 6 Typical Values represent the most likely parametric norm. All limits are guaranteed by testing or statistical analysis. Slew rate is the average of the rising and falling slew rates. Differential gain and phase are measured with AV = +2, VIN = 1 VPP at 3.58 MHz and both input and output 75Ω terminated. Submit Documentation Feedback Copyright © 1998–2013, Texas Instruments Incorporated Product Folder Links: LM6171 LM6171 www.ti.com SNOS745C – MAY 1998 – REVISED MARCH 2013 Typical Performance Characteristics Unless otherwise noted, TA = 25°C Supply Current vs. Supply Voltage Supply Current vs. Temperature Figure 2. Figure 3. Input Offset Voltage vs. Temperature Input Bias Current vs. Temperature Figure 4. Figure 5. Input Offset Voltage vs. Common Mode Voltage Short Circuit Current vs. Temperature (Sourcing) Figure 6. Figure 7. Submit Documentation Feedback Copyright © 1998–2013, Texas Instruments Incorporated Product Folder Links: LM6171 7 LM6171 SNOS745C – MAY 1998 – REVISED MARCH 2013 www.ti.com Typical Performance Characteristics (continued) Unless otherwise noted, TA = 25°C 8 Short Circuit Current vs. Temperature (Sinking) Output Voltage vs. Output Current Figure 8. Figure 9. Output Voltage vs. Output Current CMRR vs. Frequency Figure 10. Figure 11. PSRR vs. Frequency PSRR vs. Frequency Figure 12. Figure 13. Submit Documentation Feedback Copyright © 1998–2013, Texas Instruments Incorporated Product Folder Links: LM6171 LM6171 www.ti.com SNOS745C – MAY 1998 – REVISED MARCH 2013 Typical Performance Characteristics (continued) Unless otherwise noted, TA = 25°C Open Loop Frequency Response Open Loop Frequency Response Figure 14. Figure 15. Gain Bandwidth Product vs. Supply Voltage Gain Bandwidth Product vs. Load Capacitance Figure 16. Figure 17. Large Signal Voltage Gain vs. Load Large Signal Voltage Gain vs. Load Figure 18. Figure 19. Submit Documentation Feedback Copyright © 1998–2013, Texas Instruments Incorporated Product Folder Links: LM6171 9 LM6171 SNOS745C – MAY 1998 – REVISED MARCH 2013 www.ti.com Typical Performance Characteristics (continued) Unless otherwise noted, TA = 25°C 10 Input Voltage Noise vs. Frequency Input Voltage Noise vs. Frequency Figure 20. Figure 21. Input Current Noise vs. Frequency Input Current Noise vs. Frequency Figure 22. Figure 23. Slew Rate vs. Supply Voltage Slew Rate vs. Input Voltage Figure 24. Figure 25. Submit Documentation Feedback Copyright © 1998–2013, Texas Instruments Incorporated Product Folder Links: LM6171 LM6171 www.ti.com SNOS745C – MAY 1998 – REVISED MARCH 2013 Typical Performance Characteristics (continued) Unless otherwise noted, TA = 25°C Slew Rate vs. Load Capacitance Open Loop Output Impedance vs. Frequency Figure 26. Figure 27. Open Loop Output Impedance vs. Frequency Large Signal Pulse Response AV = −1, VS = ±15V Figure 28. Figure 29. Large Signal Pulse Response AV = −1, VS = ±5V Large Signal Pulse Response AV = +1, VS = ±15V Figure 30. Figure 31. Submit Documentation Feedback Copyright © 1998–2013, Texas Instruments Incorporated Product Folder Links: LM6171 11 LM6171 SNOS745C – MAY 1998 – REVISED MARCH 2013 www.ti.com Typical Performance Characteristics (continued) Unless otherwise noted, TA = 25°C 12 Large Signal Pulse Response AV = +1, VS = ±5V Large Signal Pulse Response AV = +2, VS = ±15V Figure 32. Figure 33. Large Signal Pulse Response AV = +2, VS = ±5V Small Signal Pulse Response AV = −1, VS = ±15V Figure 34. Figure 35. Small Signal Pulse Response AV = −1, VS = ±5V Small Signal Pulse Response AV = +1, VS = ±15V Figure 36. Figure 37. Submit Documentation Feedback Copyright © 1998–2013, Texas Instruments Incorporated Product Folder Links: LM6171 LM6171 www.ti.com SNOS745C – MAY 1998 – REVISED MARCH 2013 Typical Performance Characteristics (continued) Unless otherwise noted, TA = 25°C Small Signal Pulse Response AV = +1, VS = ±5V Small Signal Pulse Response AV = +2, VS = ±15V Figure 38. Figure 39. Small Signal Pulse Response AV = +2, VS = ±5V Closed Loop Frequency Response vs. SupplyVoltage (AV = +1) Figure 40. Figure 41. Closed Loop Frequency Response vs. Supply Voltage (AV = +2) Closed Loop Frequency Response vs. Capacitive Load (AV = +1) Figure 42. Figure 43. Submit Documentation Feedback Copyright © 1998–2013, Texas Instruments Incorporated Product Folder Links: LM6171 13 LM6171 SNOS745C – MAY 1998 – REVISED MARCH 2013 www.ti.com Typical Performance Characteristics (continued) Unless otherwise noted, TA = 25°C 14 Closed Loop Frequency Response vs. Capacitive Load (AV = +1) Closed Loop Frequency Response vs. Capacitive Load (AV = +2) Figure 44. Figure 45. Closed Loop Frequency Response vs. Capacitive Load (AV = +2) Total Harmonic Distortion vs. Frequency Figure 46. Figure 47. Total Harmonic Distortion vs. Frequency Total Harmonic Distortion vs. Frequency Figure 48. Figure 49. Submit Documentation Feedback Copyright © 1998–2013, Texas Instruments Incorporated Product Folder Links: LM6171 LM6171 www.ti.com SNOS745C – MAY 1998 – REVISED MARCH 2013 Typical Performance Characteristics (continued) Unless otherwise noted, TA = 25°C Total Harmonic Distortion vs. Frequency Undistorted Output Swing vs. Frequency Figure 50. Figure 51. Undistorted Output Swing vs. Frequency Undistorted Output Swing vs. Frequency Figure 52. Figure 53. Undistorted Output Swing vs. Frequency Total Power Dissipation vs. Ambient Temperature Figure 54. Figure 55. Submit Documentation Feedback Copyright © 1998–2013, Texas Instruments Incorporated Product Folder Links: LM6171 15 LM6171 SNOS745C – MAY 1998 – REVISED MARCH 2013 www.ti.com LM6171 SIMPLIFIED SCHEMATIC Figure 56. 16 Submit Documentation Feedback Copyright © 1998–2013, Texas Instruments Incorporated Product Folder Links: LM6171 LM6171 www.ti.com SNOS745C – MAY 1998 – REVISED MARCH 2013 APPLICATION INFORMATION LM6171 PERFORMANCE DISCUSSION The LM6171 is a high speed, unity-gain stable voltage feedback amplifier. It consumes only 2.5 mA supply current while providing a gain-bandwidth product of 100 MHz and a slew rate of 3600V/μs. It also has other great features such as low differential gain and phase and high output current. The LM6171 is a good choice in high speed circuits. The LM6171 is a true voltage feedback amplifier. Unlike current feedback amplifiers (CFAs) with a low inverting input impedance and a high non-inverting input impedance, both inputs of voltage feedback amplifiers (VFAs) have high impedance nodes. The low impedance inverting input in CFAs will couple with feedback capacitor and cause oscillation. As a result, CFAs cannot be used in traditional op amp circuits such as photodiode amplifiers, I-to-V converters and integrators. LM6171 CIRCUIT OPERATION The class AB input stage in LM6171 is fully symmetrical and has a similar slewing characteristic to the current feedback amplifiers. In LM6171 Figure 56, Q1 through Q4 form the equivalent of the current feedback input buffer, RE the equivalent of the feedback resistor, and stage A buffers the inverting input. The triple-buffered output stage isolates the gain stage from the load to provide low output impedance. LM6171 SLEW RATE CHARACTERISTIC The slew rate of LM6171 is determined by the current available to charge and discharge an internal high impedance node capacitor. The current is the differential input voltage divided by the total degeneration resistor RE. Therefore, the slew rate is proportional to the input voltage level, and the higher slew rates are achievable in the lower gain configurations. When a very fast large signal pulse is applied to the input of an amplifier, some overshoot or undershoot occurs. By placing an external series resistor such as 1 kΩ to the input of LM6171, the bandwidth is reduced to help lower the overshoot. LAYOUT CONSIDERATION Printed Circuit Boards and High Speed Op Amps There are many things to consider when designing PC boards for high speed op amps. Without proper caution, it is very easy and frustrating to have excessive ringing, oscillation and other degraded AC performance in high speed circuits. As a rule, the signal traces should be short and wide to provide low inductance and low impedance paths. Any unused board space needs to be grounded to reduce stray signal pickup. Critical components should also be grounded at a common point to eliminate voltage drop. Sockets add capacitance to the board and can affect frequency performance. It is better to solder the amplifier directly into the PC board without using any socket. Using Probes Active (FET) probes are ideal for taking high frequency measurements because they have wide bandwidth, high input impedance and low input capacitance. However, the probe ground leads provide a long ground loop that will produce errors in measurement. Instead, the probes can be grounded directly by removing the ground leads and probe jackets and using scope probe jacks. Components Selection And Feedback Resistor It is important in high speed applications to keep all component leads short because wires are inductive at high frequency. For discrete components, choose carbon composition-type resistors and mica-type capacitors. Surface mount components are preferred over discrete components for minimum inductive effect. Large values of feedback resistors can couple with parasitic capacitance and cause undesirable effects such as ringing or oscillation in high speed amplifiers. For LM6171, a feedback resistor of 510Ω gives optimal performance. Submit Documentation Feedback Copyright © 1998–2013, Texas Instruments Incorporated Product Folder Links: LM6171 17 LM6171 SNOS745C – MAY 1998 – REVISED MARCH 2013 www.ti.com COMPENSATION FOR INPUT CAPACITANCE The combination of an amplifier's input capacitance with the gain setting resistors adds a pole that can cause peaking or oscillation. To solve this problem, a feedback capacitor with a value CF > (RG × CIN)/RF (1) can be used to cancel that pole. For LM6171, a feedback capacitor of 2 pF is recommended. Figure 57 illustrates the compensation circuit. Figure 57. Compensating for Input Capacitance POWER SUPPLY BYPASSING Bypassing the power supply is necessary to maintain low power supply impedance across frequency. Both positive and negative power supplies should be bypassed individually by placing 0.01 μF ceramic capacitors directly to power supply pins and 2.2 μF tantalum capacitors close to the power supply pins. Figure 58. Power Supply Bypassing TERMINATION In high frequency applications, reflections occur if signals are not properly terminated. Figure 59 shows a properly terminated signal while Figure 60 shows an improperly terminated signal. 18 Submit Documentation Feedback Copyright © 1998–2013, Texas Instruments Incorporated Product Folder Links: LM6171 LM6171 www.ti.com SNOS745C – MAY 1998 – REVISED MARCH 2013 Figure 59. Properly Terminated Signal Figure 60. Improperly Terminated Signal To minimize reflection, coaxial cable with matching characteristic impedance to the signal source should be used. The other end of the cable should be terminated with the same value terminator or resistor. For the commonly used cables, RG59 has 75Ω characteristic impedance, and RG58 has 50Ω characteristic impedance. Submit Documentation Feedback Copyright © 1998–2013, Texas Instruments Incorporated Product Folder Links: LM6171 19 LM6171 SNOS745C – MAY 1998 – REVISED MARCH 2013 www.ti.com DRIVING CAPACITIVE LOADS Amplifiers driving capacitive loads can oscillate or have ringing at the output. To eliminate oscillation or reduce ringing, an isolation resistor can be placed as shown below in Figure 61. The combination of the isolation resistor and the load capacitor forms a pole to increase stablility by adding more phase margin to the overall system. The desired performance depends on the value of the isolation resistor; the bigger the isolation resistor, the more damped the pulse response becomes. For LM6171, a 50Ω isolation resistor is recommended for initial evaluation. Figure 62 shows the LM6171 driving a 200 pF load with the 50Ω isolation resistor. Figure 61. Isolation Resistor Used to Drive Capacitive Load Figure 62. The LM6171 Driving a 200 pF Load with a 50Ω Isolation Resistor POWER DISSIPATION The maximum power allowed to dissipate in a device is defined as: PD = (TJ(max) − TA)/θJA where • • • • PD is the power dissipation in a device TJ(max) is the maximum junction temperature TA is the ambient temperature θJA is the thermal resistance of a particular package (2) For example, for the LM6171 in a SOIC-8 package, the maximum power dissipation at 25°C ambient temperature is 730 mW. 20 Submit Documentation Feedback Copyright © 1998–2013, Texas Instruments Incorporated Product Folder Links: LM6171 LM6171 www.ti.com SNOS745C – MAY 1998 – REVISED MARCH 2013 Thermal resistance, θJA, depends on parameters such as die size, package size and package material. The smaller the die size and package, the higher θJA becomes. The 8-pin PDIP package has a lower thermal resistance (108°C/W) than that of 8-pin SOIC-8 (172°C/W). Therefore, for higher dissipation capability, use an 8pin PDIP package. The total power dissipated in a device can be calculated as: PD = PQ + PL (3) PQ is the quiescent power dissipated in a device with no load connected at the output. PL is the power dissipated in the device with a load connected at the output; it is not the power dissipated by the load. Furthermore, PQ = supply current × total supply voltage with no load PL = output current × (voltage difference between supply voltage and output voltage of the same supply) For example, the total power dissipated by the LM6171 with VS = ±15V and output voltage of 10V into 1 kΩ load resistor (one end tied to ground) is PD = PQ + PL = (2.5 mA) × (30V) + (10 mA) × (15V − 10V) = 75 mW + 50 mW = 125 mW APPLICATION CIRCUITS Figure 63. Fast Instrumentation Amplifier Submit Documentation Feedback Copyright © 1998–2013, Texas Instruments Incorporated Product Folder Links: LM6171 21 LM6171 SNOS745C – MAY 1998 – REVISED MARCH 2013 Figure 64. Multivibrator 22 www.ti.com Figure 65. Pulse Width Modulator Submit Documentation Feedback Copyright © 1998–2013, Texas Instruments Incorporated Product Folder Links: LM6171 LM6171 www.ti.com SNOS745C – MAY 1998 – REVISED MARCH 2013 REVISION HISTORY Changes from Revision B (March 2013) to Revision C • Page Changed layout of National Data Sheet to TI format .......................................................................................................... 21 Submit Documentation Feedback Copyright © 1998–2013, Texas Instruments Incorporated Product Folder Links: LM6171 23 PACKAGE OPTION ADDENDUM www.ti.com 1-Nov-2013 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) LM6171AIM NRND SOIC D 8 95 TBD Call TI Call TI -40 to 85 LM61 71AIM LM6171AIM/NOPB ACTIVE SOIC D 8 95 Green (RoHS & no Sb/Br) SN | CU SN Level-1-260C-UNLIM -40 to 85 LM61 71AIM LM6171AIMX NRND SOIC D 8 2500 TBD Call TI Call TI -40 to 85 LM61 71AIM LM6171AIMX/NOPB ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) SN | CU SN Level-1-260C-UNLIM -40 to 85 LM61 71AIM LM6171BIM NRND SOIC D 8 95 TBD Call TI Call TI -40 to 85 LM61 71BIM LM6171BIM/NOPB ACTIVE SOIC D 8 95 Green (RoHS & no Sb/Br) SN | CU SN Level-1-260C-UNLIM -40 to 85 LM61 71BIM LM6171BIMX NRND SOIC D 8 2500 TBD Call TI Call TI -40 to 85 LM61 71BIM LM6171BIMX/NOPB ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) SN | CU SN Level-1-260C-UNLIM -40 to 85 LM61 71BIM LM6171BIN NRND PDIP P 8 40 TBD Call TI Call TI -40 to 85 LM6171 BIN LM6171BIN/NOPB ACTIVE PDIP P 8 40 Green (RoHS & no Sb/Br) CU SN Level-1-NA-UNLIM -40 to 85 LM6171 BIN (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 1-Nov-2013 (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 21-Mar-2013 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant LM6171AIMX SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1 LM6171AIMX/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1 LM6171BIMX SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1 LM6171BIMX/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 21-Mar-2013 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) LM6171AIMX SOIC D 8 2500 367.0 367.0 35.0 LM6171AIMX/NOPB SOIC D 8 2500 367.0 367.0 35.0 LM6171BIMX SOIC D 8 2500 367.0 367.0 35.0 LM6171BIMX/NOPB SOIC D 8 2500 367.0 367.0 35.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily performed. TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use of any TI components in safety-critical applications. In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and requirements. Nonetheless, such components are subject to these terms. No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties have executed a special agreement specifically governing such use. Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of non-designated products, TI will not be responsible for any failure to meet ISO/TS16949. Products Applications Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers DLP® Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps DSP dsp.ti.com Energy and Lighting www.ti.com/energy Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial Interface interface.ti.com Medical www.ti.com/medical Logic logic.ti.com Security www.ti.com/security Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video RFID www.ti-rfid.com OMAP Applications Processors www.ti.com/omap TI E2E Community e2e.ti.com Wireless Connectivity www.ti.com/wirelessconnectivity Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2013, Texas Instruments Incorporated