P1 Chip Inductors – L3 Series 1. Part No. Expression: L 3 – 4 7 N K - □□ (a) (b) (c) (d) (a) Series Code (c) Tolerance Code (b) Inductance Code (f) 10: Standard Code 2. Configuration & Dimensions : Unit: mm A B 2.00 ± 0.20 1.25 ± 0.20 C See Table Below D G H L 0.50 ± 0.30 1.00 Ref. 1.45 Ref. 3.10 Ref. 3. Schematic 4. Material List NOTE: Specifications subject to change without notice. Please check our website for latest information. Proprietary and Confidential Document of Superworld 14/08/2017 P2 Chip Inductors – L3 Series 5. General Specification a) Operating Temperature: - 40°C to +105°C (including self-temperature rise) b) Storage Condition (component in its packaging) i) Temperature: Less than 40°C ii) Humidity: 60% RH 6. Electrical Characteristics Inductance (uH) Dimension C Test Part No. (mm) Q Tolerance Frequency Min. Test Frequency (MHz) (Hz) Rated Current (mA) Max. DCR (Ω) Max. SRF (MHz) Min. L3-47N□-10 0.85±0.20 0.047 60mV / 50M 15 50 300 0.20 320 L3-68N□-10 0.85±0.20 0.068 60mV / 50M 15 50 300 0.20 280 L3-82N□-10 0.85±0.20 0.082 60mV / 50M 15 50 300 0.20 255 L3-R10□-10 0.85±0.20 0.10 60mV / 25M 20 25 250 0.30 235 L3-R12□-10 0.85±0.20 0.12 60mV / 25M 20 25 250 0.30 220 L3-R15□-10 0.85±0.20 0.15 60mV / 25M 20 25 250 0.40 200 L3-R18□-10 0.85±0.20 0.18 60mV / 25M 20 25 250 0.40 185 L3-R22□-10 0.85±0.20 0.22 60mV / 25M 20 25 250 0.50 170 L3-R27□-10 0.85±0.20 0.27 60mV / 25M 20 25 250 0.50 150 L3-R33□-10 0.85±0.20 0.33 60mV / 25M 20 25 250 0.55 145 L3-R39□-10 0.85±0.20 0.39 60mV / 25M 25 25 200 0.65 135 L3-R47□-10 1.25±0.20 0.47 60mV / 25M 25 25 200 0.65 125 L3-R56□-10 1.25±0.20 0.56 60mV / 25M 25 25 150 0.75 115 L3-R68□-10 1.25±0.20 0.68 60mV / 25M 25 25 150 0.80 105 L3-1R0□-10 0.85±0.20 1.0 60mV / 10M 45 10 50 0.40 75 L3-1R5□-10 0.85±0.20 1.5 60mV / 10M 45 10 50 0.50 60 L3-1R8□-10 0.85±0.20 1.8 60mV / 10M 45 10 50 0.60 55 L3-2R2□-10 0.85±0.20 2.2 60mV / 10M 45 10 30 0.65 50 L3-2R7□-10 1.25±0.20 2.7 60mV / 10M 45 10 30 0.75 45 L3-3R3□-10 1.25±0.20 3.3 60mV / 10M 45 10 30 0.80 41 L3-4R7□-10 1.25±0.20 4.7 60mV / 10M 45 10 30 1.00 35 L3-100□-10 1.25±0.20 10.0 60mV / 2M 45 2 15 1.15 24 Note: □ Tolerance: K=±10%, L=±15%, M=±20% NOTE: Specifications subject to change without notice. Please check our website for latest information. Proprietary and Confidential Document of Superworld 14/08/2017 Chip Inductors – L3 Series P3 7. Characteristics Curves L vs IDC Q vs Freq. NOTE: Specifications subject to change without notice. Please check our website for latest information. Proprietary and Confidential Document of Superworld 14/08/2017 P4 Chip Inductors – L3 Series 8. Soldering Mildly activated rosin fluxes are preferred. The terminations are suitable for re-flow soldering systems. If hand soldering cannot be avoided, the preferred technique is the utilization of hot air soldering tools. Note: If wave soldering is used, there will be some risk. Re-flow soldering temperatures below 240°C, there will be non-wetting risk 8-1 Solder Re-flow: Recommended temperature profiles for lead free re-flow soldering in Figure 1. 8-2 Soldering Iron (Figure 2): Products attachment with soldering iron is discouraged due to the inherent process control limitations. In the event that a soldering iron must be employed the following precautions are recommended. Note: a) Preheat circuit and products to 150°C. b) 350°C tip temperature (Max.) c) Never contact the ceramic with the iron tip d) 1.0mm tip diameter (Max.) e) Use a 20 watt soldering iron with tip diameter of 1.0mm f) Limit soldering time to 4~5 secs. 8-3 Soldering Volume: Accordingly increasing the solder volume, the mechanical stress to product is also increased. Exceeding solder volume may cause the failure of mechanical or electrical performance. Solder shall be used not to be exceeding as shown in the Figure 3. Minimum fillet height = soldering thickness + 25% product height. NOTE: Specifications subject to change without notice. Please check our website for latest information. Proprietary and Confidential Document of Superworld 14/08/2017 P5 Chip Inductors – L3 Series 9. Packaging Information 9-1 Reel Dimension Type A (mm) B (mm) C (mm) D (mm) 7” x 8mm 9.0 ± 0.5 60.0 ± 2.0 13.5 ± 0.5 178.0± 2.0 9-2 Tape Dimension Material of taping is paper Size Bo(mm) Ao(mm) Ko(mm) P(mm) t(mm) 201209 2.10±0.05 1.30±0.05 0.95±0.05 4.0±0.10 0.95±0.05 NOTE: Specifications subject to change without notice. Please check our website for latest information. Proprietary and Confidential Document of Superworld 14/08/2017 P6 Chip Inductors – L3 Series Material of taping is plastic Size Bo(mm) Ao(mm) Ko(mm) P(mm) t(mm) D1(mm) 201212 2.10±0.10 1.28±0.10 1.28±0.10 4.0±0.10 0.22±0.05 1.0±0.10 9-3. Packaging Quantity Size 201209 201212 Chip/ Reel 4000 2000 Inner Box 20000 10000 Middle Box 100000 50000 Carton 200000 100000 9-4. Tearing Off Force The force for tearing off cover tape is 15 to 60 grams in the arrow direction under the following conditions. Room Temp (°C) Room Humidity (%) Room atm (hPa) Tearing Speed (mm/min) 5 - 35 45 - 85 860 - 1060 300 NOTE: Specifications subject to change without notice. Please check our website for latest information. Proprietary and Confidential Document of Superworld 14/08/2017 P7 Chip Inductors – L3 Series Application Notice: 1. Storage Conditions: To maintain the solderabililty of terminal electrodes: a) Recommended products should be used within 12 months from the time of delivery. b) The packaging material should be kept where no chlorine or sulfur exists in the air. 2. Transportation: a) Products should be handled with care to avoid damage or contamination from perspiration and skin oils. b) Vacuum pick up is strongly recommended for individual components. c) Bulk handling should ensure that abrasion and mechanical shock are minimized. NOTE: Specifications subject to change without notice. Please check our website for latest information. Proprietary and Confidential Document of Superworld 14/08/2017