TI1 LP3991TLX-2.5/NOPB 300-ma ldo for digital application Datasheet

Sample &
Buy
Product
Folder
Support &
Community
Tools &
Software
Technical
Documents
Reference
Design
LP3991
SNVS296J – DECEMBER 2006 – REVISED JUNE 2016
LP3991 300-mA LDO for Digital Applications
1 Features
3 Description
•
•
•
•
•
•
•
•
•
•
Operating from a minimum input voltage of 1.65 V,
the LP3991 LDO has been designed to provide fixed
stable output voltages for load currents up to 300 mA.
This device is suitable where accurate low voltages
are required from low input voltage sources and is
therefore suitable for post regulation of switched
mode regulators. In such applications, significant
improvements in performance and EMI can be
realized, with little reduction in overall efficiency. The
LP3991 provides fixed outputs as low as 1.2 V from a
wide input range from 1.65 V to 4 V Using the enable
(EN) pin, the device may be controlled to provide a
shutdown state, in which negligible supply current is
drawn.
1
Input Voltage From 1.65 V to 4 V
Output Voltage From 0.8 V to 3 V
1% Accuracy at Room Temperature
125-mV Dropout at 300-mA Load
50-µA Quiescent Current at 1-mA Load
Inrush Current Controlled to 600 mA
PSRR 65 dB at 1 kHz
100-µs Start-Up Time for 1.5-V VOUT
Stable With Ceramic Capacitors as Small as 0402
Thermal-Overload and Short-Circuit Protection
2 Applications
•
•
•
The LP3991 is designed to be stable with spacesaving ceramic capacitors as small as 0402 case
size.
Post DC-DC Regulator
Battery Operated Devices
Hand-Held Information Appliances
Performance is specified for a –40°C to +125°C
junction temperature range. For output voltage
options, contact your local Texas Instruments sales
office.
Device Information(1)
PART NUMBER
LP3991
PACKAGE
DSBGA (4)
BODY SIZE (NOM)
1.43 mm × 0.96 mm
(1) For all available packages, see the orderable addendum at
the end of the datasheet.
space
space
space
Typical Application Circuit
LP3991
IN
VIN
B2
CIN
OUT
1 PF
B1
COUT*
4.7 PF
Load
VEN
EN
A2
GND
A1
* For VOUT = 1.3 V or less,
COUT may be reduced to 2.2 PF.
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
LP3991
SNVS296J – DECEMBER 2006 – REVISED JUNE 2016
www.ti.com
Table of Contents
1
2
3
4
5
6
7
Features ..................................................................
Applications ...........................................................
Description .............................................................
Revision History.....................................................
Pin Configuration and Functions .........................
Specifications.........................................................
1
1
1
2
3
4
6.1
6.2
6.3
6.4
6.5
6.6
6.7
4
4
4
4
5
6
7
Absolute Maximum Ratings ......................................
ESD Ratings ............................................................
Recommended Operating Conditions.......................
Thermal Information .................................................
Electrical Characteristics...........................................
Timing Requirements ................................................
Typical Characteristics ..............................................
Detailed Description .............................................. 9
7.1
7.2
7.3
7.4
Overview ................................................................... 9
Functional Block Diagram ......................................... 9
Feature Description................................................... 9
Device Functional Modes........................................ 10
8
Application and Implementation ........................ 11
8.1 Application Information............................................ 11
8.2 Typical Application ................................................. 11
9 Power Supply Recommendations...................... 16
10 Layout................................................................... 16
10.1
10.2
10.3
10.4
Layout Guidelines .................................................
Layout Example ....................................................
DSBGA Mounting..................................................
DSBGA Light Sensitivity .......................................
16
16
17
17
11 Device and Documentation Support ................. 18
11.1
11.2
11.3
11.4
11.5
11.6
Documentation Support ........................................
Receiving Notification of Documentation Updates
Community Resources..........................................
Trademarks ...........................................................
Electrostatic Discharge Caution ............................
Glossary ................................................................
18
18
18
18
18
18
12 Mechanical, Packaging, and Orderable
Information ........................................................... 18
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision I (August 2015) to Revision J
Page
•
Changed "Linear Voltage Regulator" to "LDO" in title ............................................................................................................ 1
•
Changed "regulator" to "LDO" in Description ......................................................................................................................... 1
•
Changed Body Size dimensions from (MAX) to (NOM) in Device Information ..................................................................... 1
•
Added footnote 2 for Thermal Information ............................................................................................................................. 4
•
Added Power Dissipation and Estimating Junction Temperature subsections .................................................................... 14
•
Added Receiving Notification of Documentation Updates ................................................................................................... 18
Changes from Revision H (May 2013) to Revision I
Page
•
Added Device Information and Pin Configuration and Functions sections, ESD Rating table, Feature Description,
Device Functional Modes, Application and Implementation, Power Supply Recommendations, Layout, Device and
Documentation Support , and Mechanical, Packaging, and Orderable Information sections ................................................ 1
•
Changed pin names to TI nomenclature; added icon for Reference Design to Top Navigators ........................................... 1
•
Changed Output voltage range from "1.2 V to 2.8 V" to "0.8 V to 3 V" due to new options available to buy ....................... 1
•
Deleted Lead temp spec from Abs Max table; this info is in POA ........................................................................................ 4
•
Added updated thermal values .............................................................................................................................................. 4
•
Changed values in Table 1 based on updated thermal values ............................................................................................ 10
Changes from Revision G (May 2013) to Revision H
•
2
Page
Changed layout of National Data Sheet to TI format ........................................................................................................... 10
Submit Documentation Feedback
Copyright © 2006–2016, Texas Instruments Incorporated
Product Folder Links: LP3991
LP3991
www.ti.com
SNVS296J – DECEMBER 2006 – REVISED JUNE 2016
5 Pin Configuration and Functions
YZR Package
4-Pin Thin DSBGA, Large Bump
EN
A2
IN
B2
IN
B2
EN
A2
A1
GND
B1
OUT
B1
OUT
A1
GND
Top View
Bottom View
Pin Functions
PIN
NUMBER
NAME
I/O
DESCRIPTION
A1
GND
—
Common ground. Connect to pad.
A2
EN
I
Enable Input; enables the regulator when ≥ 0.95 V.
Disables the regulator when ≤ 0.4 V.
Enable input has an internal 1.2-MΩ pulldown resistor to GND.
B1
OUT
O
Voltage output. A low-ESR ceramic capacitor must be connected from this pin to GND (see
Application and Implementation). Connect this output to the load circuit.
B2
IN
I
Voltage supply input. A 1-µF capacitor must be connected from this pin to GND.
Submit Documentation Feedback
Copyright © 2006–2016, Texas Instruments Incorporated
Product Folder Links: LP3991
3
LP3991
SNVS296J – DECEMBER 2006 – REVISED JUNE 2016
www.ti.com
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted) (1) (2) (3)
MIN
MAX
UNIT
IN, OUT pins, voltage to GND
–0.3
6.5
V
EN pin, voltage to GND
–0.3
(VIN + 0.3) < 6.5
V
150
°C
Junction temperature
Continuous power dissipation (4)
Internally Limited
Storage temperature, Tstg
(1)
(2)
(3)
(4)
–65
150
°C
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
All voltages are with respect to the potential at the GND pin.
If Military/Aerospace specified devices are required, contact the Texas Instruments Sales Office/ Distributors for availability and
specifications.
Internal thermal shutdown circuitry protects the device from permanent damage.
6.2 ESD Ratings
VALUE
Electrostatic
discharge
V(ESD)
(1)
(2)
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001
(1)
UNIT
±2000
Charged-device model (CDM), per JEDEC specification JESD22-C101 (2)
V
±200
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN
Input voltage
NOM
1.65
Recommended load current
MAX
4
UNIT
V
300
mA
Junction temperature
–40
125
°C
Ambient temperature, TA (1)
–40
85
°C
(1)
The maximum ambient temperature (TA-MAX) is a suggested value dependant on the maximum operating junction temperature (TJ-MAXOP) = 125°C); the maximum power dissipation of the device in the application (PD-MAX), and the junction-to-ambient thermal resistance of
the part / package in the application (RθJA), as given by the following equation: TA-MAX = TJ-MAX-OP – (RθJA × PD-MAX).
6.4 Thermal Information
LP3991
THERMAL METRIC (1)
YZR (DSBGA)
UNIT
4 PINS
RθJA (2)
Junction-to-ambient thermal resistance, High K
RθJC(top)
Junction-to-case (top) thermal resistance
RθJB
Junction-to-board thermal resistance
ψJT
Junction-to-top characterization parameter
ψJB
Junction-to-board characterization parameter
(1)
(2)
4
189.7
°C/W
0.5
°C/W
112.9
°C/W
8.7
°C/W
112.8
°C/W
For more information about traditional and new thermal metrics, see Semiconductor and IC Package Thermal Metrics.
Thermal resistance value RθJA is based on the EIA/JEDEC High-K printed circuit board defined by: JESD51-7 - High Effective Thermal
Conductivity Test Board for Leaded Surface Mount Packages.
Submit Documentation Feedback
Copyright © 2006–2016, Texas Instruments Incorporated
Product Folder Links: LP3991
LP3991
www.ti.com
SNVS296J – DECEMBER 2006 – REVISED JUNE 2016
6.5 Electrical Characteristics
Unless otherwise noted, VEN = 950 mV, VIN = VOUT + 0.5 V, or 1.8 V, whichever is higher, CIN = 1 µF, COUT = 4.7 µF, IOUT =
1 mA. Typical values and limits apply for TA = 25°C. Minimum and maximum limits apply over the full junction temperature
range for operation, −40°C to +125°C, unless otherwise specified. (1)
PARAMETER
VIN
Input voltage
TEST CONDITIONS
See
(2)
MIN
1.65
4
TJ = –25°C to 85°C
Line regulation error
VIN = VOUT(NOM) 0.5 V to 3.6 V,
IOUT = 1 mA, 0.8 V ≤ VOUT ≤ 2.8 V
Load regulation error
IOUT = 1 mA to 300 mA
1.8 V ≤ VOUT ≤ 2.5 V
VDO
Dropout voltage (6)
VOUT > 2.5 V
ILOAD
–1%
VIN = VIN(NOM) to 3.6 V
ILOAD = 1 to 300 mA
ΔVOUT
Minimum load current
Quiescent current
3%
–2.5%
2.5%
0.05
1
%/V
µV/mA
60
55
90
IOUT = 300 mA
110
180
IOUT = 150 mA
40
80
75
160
50
100
IOUT = 300 mA
0
VEN = 950 mV, IOUT = 300 mA
VEN = 0.4 V
VIN = 3.6 V (8)
ISC
Short-circuit current limit
IOUT
Maximum output current
PSRR
Power Supply Rejection Ratio (9)
ƒ = 1kHz, IOUT = 1 mA to 300 mA
en
Output noise voltage (9)
TSHUTDOWN
Thermal shutdown
V
1%
10
See (7)
UNIT
–3%
IOUT = 150 mA
VEN = 950 mV, IOUT = 0 mA
IQ
MAX
3.6
See (3) (4) (5)
TJ = 25°C
Output voltage tolerance
TYP
mV
mA
120
225
0.001
1
550
900
300
µA
mA
mA
65
dB
BW = 10 Hz to 100 kHz,
VIN = 4.2 V, COUT = 4.7 µF
280
µVRMS
Temperature
160
Hysteresis
°C
20
ENABLE CONTROL CHARACTERISTICS
VEN = 0 V, VIN = 3.6 V
IEN (10)
Maximum input current at VEN input
VIL
Low input threshold
VIN = 1.65 V to 3.6 V
VIH
High input threshold
VIN = 1.65 V to 3.6 V
0.001
VEN = VIN = 3.6 V
3
5.5
0.4
0.95
µA
V
V
(1)
All limits are ensured. All electrical characteristics having room-temperature limits are tested during production at TJ = 25°C or correlated
using Statistical Quality Control methods. Operation over the temperature specification is ensured by correlating the electrical
characteristics to process and temperature variations and applying statistical process control.
(2) All voltages are with respect to the potential at the GND pin.
(3) VIN(MIN) = VOUT(NOM) + 0.5 V or 1.65 V, whichever is greater. (See Figure 19 in DSBGA Light Sensitivity.)
(4) The device operates with input voltages up to 4 V. However special care must be taken in relation to thermal dissipation and the need to
derate the maximum allowable ambient temperature.
(5) The maximum ambient temperature (TA-MAX) is a suggested value dependant on the maximum operating junction temperature (TJ-MAXOP) = 125°C); the maximum power dissipation of the device in the application (PD-MAX), and the junction-to-ambient thermal resistance of
the part / package in the application (RθJA), as given by the following equation: TA-MAX = TJ-MAX-OP – (RθJA × PD-MAX).
(6) Dropout voltage is voltage difference between input and output at which the output voltage drops to 100 mV below its nominal value.
This parameter is only specified for output voltages above 1.8 V.
(7) The device maintains the regulated output voltage without a load.
(8) Short circuit current is measured with VOUT pulled to 0 V.
(9) This electrical specification is ensured by design.
(10) EN pin has an internal 1.2-MΩ (typical) resistor connected to GND.
Submit Documentation Feedback
Copyright © 2006–2016, Texas Instruments Incorporated
Product Folder Links: LP3991
5
LP3991
SNVS296J – DECEMBER 2006 – REVISED JUNE 2016
www.ti.com
Electrical Characteristics (continued)
Unless otherwise noted, VEN = 950 mV, VIN = VOUT + 0.5 V, or 1.8 V, whichever is higher, CIN = 1 µF, COUT = 4.7 µF, IOUT =
1 mA. Typical values and limits apply for TA = 25°C. Minimum and maximum limits apply over the full junction temperature
range for operation, −40°C to +125°C, unless otherwise specified. (1)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
TIMING CHARACTERISTICS
Line transient response |δVOUT|
Transient
Response
Load transient response |δVOUT|
Trise = Tfall = 30 µs (9)
δVIN = 600 mV
Trise = Tfall = 1 µs (9)
IOUT = 0 mA to 300 mA
140
IOUT = 1 mA to 300 mA
110
IOUT = 300 mA to 1 mA
80
IOUT = 0 mA to 200 mA
110
IOUT = 1 mA to 200 mA
80
IOUT = 200 mA to 1 mA
60
IOUT = 0 mA to 150 mA
100
IOUT = 1 mA to 150 mA
70
IOUT = 150 mA to 1 mA
IIR
mV
(pk - pk)
6
mV
50
Overshoot on start-up
0%
2%
In-rush current (9)
600
1000
mA
OUTPUT CAPACITANCE
COUT
Output capacitor
Capacitance (11)
VOUT ≥ 1.5 V
VOUT < 1.5 V (12)
ESR
2
4.7
1.6
2.2
µF
5
500
mΩ
(11) The capacitor tolerance must be 30% or better over temperature. The full operating conditions for the application must be considered
when selecting a suitable capacitor to ensure that the minimum value of capacitance is always met. Recommended capacitor type is
X7R or X5R. (See External Capacitors in Detailed Design Procedure.)
(12) On lower voltage options, 2.2-µF output capacitor may be used but some degradation in load transient (10 -15%) can be expected,
compared to a 4.7-µF capacitor.
6.6 Timing Requirements
MIN
tON
(1)
6
NOM
Turnon time (1) To 95% Level
VIN(MIN) to 3.6 V, VOUT ≤ 2 V
100
Turnon time (1) To 95% Level
VIN(MIN) to 3.6 V, VOUT ≥ 2 V
140
MAX
UNIT
µs
This electrical specification is ensured by design.
Submit Documentation Feedback
Copyright © 2006–2016, Texas Instruments Incorporated
Product Folder Links: LP3991
LP3991
www.ti.com
SNVS296J – DECEMBER 2006 – REVISED JUNE 2016
6.7 Typical Characteristics
Unless otherwise specified, CIN = 1 µF ceramic, COUT = 4.7 µF ceramic, VIN = VOUT(NOM) + 0.5 V or 1.8 V, whichever is greater,
TA = 25°C, VOUT(NOM) = 1.5 V, EN pin is tied to VIN.
Figure 1. Output Voltage Change vs Temperature
Figure 2. Output Voltage vs Minimum Input Voltage
Figure 3. Ground Current vs Load Current
Figure 4. Ground Current vs VIN. ILOAD = 1mA
Figure 5. Dropout Voltage
Figure 6. Dropout Voltage vs Output Voltage
Submit Documentation Feedback
Copyright © 2006–2016, Texas Instruments Incorporated
Product Folder Links: LP3991
7
LP3991
SNVS296J – DECEMBER 2006 – REVISED JUNE 2016
www.ti.com
Typical Characteristics (continued)
Unless otherwise specified, CIN = 1 µF ceramic, COUT = 4.7 µF ceramic, VIN = VOUT(NOM) + 0.5 V or 1.8 V, whichever is greater,
TA = 25°C, VOUT(NOM) = 1.5 V, EN pin is tied to VIN.
Figure 7. Enable Characteristics
Figure 8. Short Circuit Current
Figure 9. Power Supply Rejection Ratio
Figure 10. Power Supply Rejection Ratio
Figure 11. Noise Density
8
Submit Documentation Feedback
Copyright © 2006–2016, Texas Instruments Incorporated
Product Folder Links: LP3991
LP3991
www.ti.com
SNVS296J – DECEMBER 2006 – REVISED JUNE 2016
7 Detailed Description
7.1 Overview
The LP3991 device is a monolithic integrated low-dropout voltage regulator with a low input operating voltage
tolerance. Key protection circuits, including output current limitation and thermal shutdown, are integrated in the
device. Using the EN pin, the device may be controlled to provide a shutdown state, in which negligible supply
current is drawn. The LP3991 is designed to be stable with space-saving ceramic capacitors as small as 0402
case size.
7.2 Functional Block Diagram
IN
OUT
ON
OFF
EN
1.2 M
GND
LP3991
7.3 Feature Description
7.3.1 Post-Buck Regulator
Linear post-regulation can be an effective way to reduce ripple and switching noise from DC-DC convertors while
still maintaining a reasonably high overall efficiency.
The LP3991 is particularly suitable for this role due to its low input voltage requirements. In addition, there is
often no need for a separate input capacitor for the LP3991 as it can share the output cap of the DC-DC
convertor.
Care of PCB layouts involving switching regulators is paramount. In particular, the ground paths for the LDO
must be routed separately from the switcher ground and star connected close to the battery. Routing of the
switch pin of the DC-DC convertor must be kept short to minimize radiated EMI. A low pass filter such as a ferrite
bead or common mode choke on the battery input leads can further reduce radiated EMI.
Figure 19 shows a typical example using an LM3673, 350-mA DC-DC buck regulator with a nominal output of
1.8 V and a 1.5-V LP3991 device. The overall efficiency is greater than 70% over the full Li-Ion battery voltage
range. Maximum efficiency is achieved by minimizing the difference between VIN and VOUT of the LP3991 device.
The LP3991-1.5 remains in regulation down to an input voltage of 1.65 V; thus, in this case, a 1.8-V buck with
5% tolerance is adequate for all conditions of temperature and load.
Submit Documentation Feedback
Copyright © 2006–2016, Texas Instruments Incorporated
Product Folder Links: LP3991
9
LP3991
SNVS296J – DECEMBER 2006 – REVISED JUNE 2016
www.ti.com
Feature Description (continued)
7.3.2 Maximum Supply Voltage and Thermal Considerations
Maximum recommended input voltage is 3.6 V. The device may be operated at 4-V VIN if proper care is given to
the board design in regard to thermal dissipation. As a guide, refer to Table 1 for ambient temperature at two
input voltages and two load currents for the example board types.
Table 1. Example Board Ambient Temperatures
RθJA
VIN
VOUT
3.6 V
2.8 V
4V
2.8 V
189ºC/W
3.6 V
2.8 V
160ºC/W
4V
2.8 V
IOUT
PD
AMBIENT TEMPERATURE
160 mA
0.13 W
100ºC
250 mA
0.20 W
87ºC
160 mA
0.19 W
89ºC
250 mA
0.30 W
68ºC
160 mA
0.13 W
104ºC
250 mA
0.20 W
93ºC
160 mA
0.19 W
94ºC
250 mA
0.30 W
77ºC
7.4 Device Functional Modes
7.4.1 Enable Control
The LP3991 features an active high enable (EN) pin, which turns the device on when pulled high. When not
enabled the regulator output is off and the device typically consumes 2 nA.
If the application does not require the enable switching feature, the EN pin must be tied to VIN to keep the
regulator output permanently on.
To ensure proper operation, the signal source used to drive the EN input must be able to swing above and below
the specified turnon/off voltage thresholds listed in Typical Characteristics under VIL and VIH.
10
Submit Documentation Feedback
Copyright © 2006–2016, Texas Instruments Incorporated
Product Folder Links: LP3991
LP3991
www.ti.com
SNVS296J – DECEMBER 2006 – REVISED JUNE 2016
8 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
8.1 Application Information
The LP3991 can provide 300-mA output current with 1.65-V to 4-V input. It is stable with a 2.2-μF or 4.7-µF
ceramic output capacitor. An optional external bypass capacitor reduces the output noise without slowing down
the load transient response. Typical output noise is 280 μVRMS at frequencies from 10 Hz to 100 kHz. Typical
power supply rejection is 65 dB at 1 kHz.
8.2 Typical Application
LP3991
IN
VIN
B2
CIN
OUT
1 PF
B1
COUT*
4.7 PF
Load
VEN
EN
A2
GND
A1
* For VOUT = 1.3 V or less,
COUT may be reduced to 2.2 PF.
Figure 12. LP3991 Typical Application
8.2.1 Design Requirements
For typical linear voltage regulator applications, use the parameters listed in Table 2.
Table 2. Design Parameters
DESIGN PARAMETER
EXAMPLE VALUE
Input voltage
1.65 V to 4 V
Output voltage
1.2 V to 2.8 V
Output current
300 mA (maximum)
RMS noise, 10 Hz to100 kHz
280 μVRMS
PSRR at 1 kHz
65 dB
8.2.2 Detailed Design Procedure
8.2.2.1 External Capacitors
In common with most regulators, the LP3991 requires external capacitors for regulator stability. The LP3991 is
specifically designed for portable applications requiring minimum board space and smallest components. These
capacitors must be correctly selected for good performance.
Submit Documentation Feedback
Copyright © 2006–2016, Texas Instruments Incorporated
Product Folder Links: LP3991
11
LP3991
SNVS296J – DECEMBER 2006 – REVISED JUNE 2016
www.ti.com
8.2.2.2 Input Capacitor
An input capacitor is required for stability. It is recommended that a 1-µF capacitor be connected between the
LP3991 IN pin and ground (this capacitance value may be increased without limit).
This capacitor must be located a distance of not more than 1 cm from the IN pin and returned to a clean analog
ground. Any good-quality ceramic, tantalum, or film capacitor may be used at the input.
NOTE
Tantalum capacitors can suffer catastrophic failures due to surge current when connected
to a low-impedance source of power (like a battery or a very large capacitor). If a tantalum
capacitor is used at the input, a surge current rating sufficient for the application must be
ensured by the manufacturer.
There are no requirements for the equivalent series resistance (ESR) on the input capacitor, but tolerance,
temperature, and voltage coefficients must be considered when selecting the capacitor to ensure the capacitance
remains ≊ 1 µF over the entire operating temperature range.
8.2.2.3 Output Capacitor
Correct selection of the output capacitor is critical to ensure stable operation in the intended application.
The output capacitor must meet all the requirements specified in the recommended capacitor table over all
conditions in the application. these conditions include DC bias, frequency and temperature. Unstable operation
results if the capacitance drops below the minimum specified value.
The LP3991 is designed specifically to work with very small ceramic output capacitors. For voltage options of 1.5
V and higher, A 4.7-µF ceramic capacitor (dielectric type X7R or X5R) with an ESR between 5 mΩ to 500 mΩ, is
suitable in the LP3991 application circuit. However, on lower VOUT options a 2.2-µF may be employed with only a
small increase in load transient.
Other ceramic types such as Y5V and Z5U are less suitable owing to their inferior temperature characteristics.
(See Capacitor Characteristics.)
It is also recommended that the output capacitor is placed within 1 cm of the OUT pin and returned to a clean,
low impedance, ground connection.
It is possible to use tantalum or film capacitors at the device output, VOUT, but these are not as attractive for
reasons of size and cost. (See Capacitor Characteristics.)
8.2.2.4 No-Load Stability
The LP3991 remains stable and in regulation with no external load. This is an important consideration in some
circuits, for example CMOS RAM keep-alive applications.
8.2.2.5 Capacitor Characteristics
The LP3991 is designed to work with ceramic capacitors on the input and output to take advantage of the
benefits they offer. For capacitance values around 4.7 µF, ceramic capacitors give the circuit designer the best
design options in terms of low cost and minimal area.
For both input and output capacitors, careful interpretation of the capacitor specification is required to ensure
correct device operation. The capacitor value can change greatly dependant on the conditions of operation and
capacitor type.
In particular, to ensure stability, the output capacitor selection must take account of all the capacitor parameters,
to ensure that the specification is met within the application. Capacitance value can vary with DC bias conditions
as well as temperature and frequency of operation. Capacitor values also show some decrease over time due to
aging. The capacitor parameters are also dependant on the particular case size with smaller sizes giving poorer
performance figures in general.
12
Submit Documentation Feedback
Copyright © 2006–2016, Texas Instruments Incorporated
Product Folder Links: LP3991
LP3991
SNVS296J – DECEMBER 2006 – REVISED JUNE 2016
CAP VALUE (% of NOM. 1 uF)
www.ti.com
0603, 10V, X5R
100
80
60
0402, 6.3V, X5R
40
20
0
1.0
2.0
3.0
4.0
5.0
DC BIAS (V)
Figure 13. Effect of DC Bias on Capacitance Value
As an example Figure 13 shows a typical graph showing a comparison of capacitor case sizes in a capacitance
vs. DC Bias plot. As shown in Figure 13, as a result of the DC Bias condition, the capacitance value may drop
below the minimum capacitance value given in the recommended capacitor table. Note that Figure 13 shows the
capacitance out of spec for the 0402 case size capacitor at higher bias voltages. TI therefore recommends that
the capacitor manufacturers' specifications for the nominal value capacitor are consulted for all conditions as
some capacitor sizes (for example, 0402) may not be suitable in the actual application. Ceramic capacitors have
the lowest ESR values, thus making them best for eliminating high frequency noise. The ESR of a typical 4.7-µF
ceramic capacitor is in the range of 20 mΩ to 40 mΩ, which easily meets the ESR requirement for stability for the
LP3991. The temperature performance of ceramic capacitors varies by type. Capacitor type X7R is specified with
a tolerance of ±15% over the temperature range –55°C to +125°C. The X5R has a similar tolerance over the
reduced temperature range of –55°C to +85°C. Some large value ceramic capacitors (4.7 µF) are manufactured
with Z5U or Y5V temperature characteristics, which can result in the capacitance dropping by more than 50% as
the temperature varies from 25°C to +85°C. Therefore, X7R or X5R types are recommended in applications
where the temperature changes significantly above or below 25°C.
Tantalum capacitors are less desirable than ceramic for use as output capacitors because they are more
expensive when comparing equivalent capacitance and voltage ratings in the 1-µF to 4.7-µF range. Another
important consideration is that tantalum capacitors have higher ESR values than equivalent size ceramics. This
means that while it may be possible to find a tantalum capacitor with an ESR value within the stable range, it
would have to be larger in capacitance (which means bigger and more costly) than a ceramic capacitor with the
same ESR value. The ESR of a typical tantalum increases about 2:1 as the temperature goes from 25°C down to
–40°C, so some guard band must be allowed.
8.2.2.6 Power Dissipation
Knowing the device power dissipation and proper sizing of the thermal plane connected to the tab or pad is
critical to ensuring reliable operation. Device power dissipation depends on input voltage, output voltage, and
load conditions and can be calculated with Equation 1.
PD(MAX) = (VIN(MAX) – VOUT) × IOUT
(1)
Power dissipation can be minimized, and greater efficiency can be achieved, by using the lowest available
voltage drop option that would still be greater than the dropout voltage (VDO). However, keep in mind that higher
voltage drops result in better dynamic (that is, PSRR and transient) performance.
On the LP3991 DSBGA (YZR) package, the primary conduction path for heat is through the four bumps to the
PCB. The maximum allowable junction temperature (TJ(MAX)) determines maximum power dissipation allowed
(PD(MAX)) for the device package.
Power dissipation and junction temperature are most often related by the junction-to-ambient thermal resistance
(RθJA) of the combined PCB and device package and the temperature of the ambient air (TA), according to
Equation 2 or Equation 3:
TJ(MAX) = TA(MAX) + ( RθJA × PD(MAX))
PD(MAX) = (TJ(MAX) – TA(MAX)) / RθJA
(2)
(3)
Submit Documentation Feedback
Copyright © 2006–2016, Texas Instruments Incorporated
Product Folder Links: LP3991
13
LP3991
SNVS296J – DECEMBER 2006 – REVISED JUNE 2016
www.ti.com
Unfortunately, this RθJA is highly dependent on the heat-spreading capability of the particular PCB design, and
therefore varies according to the total copper area, copper weight, and location of the planes. The RθJA recorded
in Thermal Information is determined by the specific EIA/JEDEC JESD51-7 standard for PCB and copperspreading area, and is to be used only as a relative measure of package thermal performance. For a welldesigned thermal layout, RθJA is actually the sum of the package junction-to-board thermal resistance (RθJB) plus
the thermal resistance contribution by the PCB copper area acting as a heat sink.
8.2.2.7 Estimating Junction Temperature
The EIA/JEDEC standard recommends the use of psi (Ψ) thermal characteristics to estimate the junction
temperatures of surface mount devices on a typical PCB board application. These characteristics are not true
thermal resistance values, but rather package specific thermal characteristics that offer practical and relative
means of estimating junction temperatures. These psi metrics are determined to be significantly independent of
copper-spreading area. The key thermal characteristics (ΨJT and ΨJB) are given in Thermal Information and are
used in accordance with Equation 4 or Equation 5.
TJ(MAX) = TTOP + (ΨJT × PD(MAX))
where
•
•
PD(MAX) is explained in Equation 1
TTOP is the temperature measured at the center-top of the device package.
TJ(MAX) = TBOARD + (ΨJB × PD(MAX))
(4)
where
•
•
PD(MAX) is explained in Equation 1
TBOARD is the PCB surface temperature measured 1 mm from the device package and centered on the
package edge.
(5)
For more information about the thermal characteristics ΨJT and ΨJB, see Semiconductor and IC Package
Thermal Metrics (SPRA953); for more information about measuring TTOP and TBOARD, see Using New Thermal
Metrics (SBVA025); and for more information about the EIA/JEDEC JESD51 PCB used for validating RθJA, see
the Thermal Characteristics of Linear and Logic Packages Using JEDEC PCB Designs (SZZA017). These
application notes are available at www.ti.com.
14
Submit Documentation Feedback
Copyright © 2006–2016, Texas Instruments Incorporated
Product Folder Links: LP3991
LP3991
www.ti.com
SNVS296J – DECEMBER 2006 – REVISED JUNE 2016
8.2.3 Application Curves
VOUT = 1.5 V
VOUT = 1.2 V
Figure 14. Load Transient
ILOAD = 1 mA
Figure 15. Load Transient
ILOAD = 300 mA
Figure 16. Line Transient
Figure 17. Line Transient
Submit Documentation Feedback
Copyright © 2006–2016, Texas Instruments Incorporated
Product Folder Links: LP3991
15
LP3991
SNVS296J – DECEMBER 2006 – REVISED JUNE 2016
www.ti.com
9 Power Supply Recommendations
The LP3991 is designed to operate from an input voltage supply range from 1.65 V to 4 V.
10 Layout
10.1 Layout Guidelines
The dynamic performance of the LP3991 is dependant on the layout of the PCB. PCB layout practices that are
adequate for typical LDOs may degrade the PSRR or transient performance of the LP3991.
Best performance is achieved by placing all of the components on the same side of the PCB as the LP3991, as
close as is practical to the LP3991 package. All component ground connections must be back to the LP3991
analog ground connection using as wide and as short of a copper trace as is practical.
Connections using long trace lengths, narrow trace widths, and connections through vias must be avoided.
These add parasitic inductances and resistance that results in inferior performance especially during transient
conditions.
A ground plane, either on the opposite side of a two-layer PCB, or embedded in a multi-layer PCB, is strongly
recommended. This ground plane serves two purposes:
1. Provides a circuit reference plane to assure accuracy, and
2. Provides a thermal plane to remove heat from the LP3991 through thermal vias under the package DAP.
10.2 Layout Example
LP3991TL
VIN
B2
VOUT
B1
COUT
CIN
A2
A1
Power Ground
VEN
Figure 18. LP3991 Example Layout
16
Submit Documentation Feedback
Copyright © 2006–2016, Texas Instruments Incorporated
Product Folder Links: LP3991
LP3991
www.ti.com
SNVS296J – DECEMBER 2006 – REVISED JUNE 2016
10.3 DSBGA Mounting
The DSBGA package requires specific mounting techniques which are detailed in AN-1112 DSBGA Wafer Level
Chip Scale Package. Referring to the section Surface Mount Technology (SMT) Assenbly Considerations, the
pad style that must be used with the 4-pin package is a NSMD (non-solder mask defined) type.
For best results during assembly, alignment ordinals on the PCB may be used to facilitate placement of the
DSBGA device.
10.4 DSBGA Light Sensitivity
Exposing the DSBGA device to direct sunlight may cause mis-operation of the device. Light sources such as
halogen lamps can affect the electrical performance if brought near to the device.
The wavelengths that have the most detrimental effect are reds and infra-reds, which means that the fluorescent
lighting used inside most buildings has little effect on performance.
Ferrite
Bead
2.2 PH
VIN
A1
+
C1
4.7 PF
-
Li-Ion
2.7 ± 4.3V
EN
DC/DC
GND
B2
LM3673TL1.8
A3
C1
C3
SW
1.8V
B2
C2
10 PF
FB
VOUT
VIN
GND
EN
LDO
1.5V
B1
LP3991TL1.5
C4
4.7 PF
A1
A2
Figure 19. LP3991 Used as a Post DC-DC Regulator
Submit Documentation Feedback
Copyright © 2006–2016, Texas Instruments Incorporated
Product Folder Links: LP3991
17
LP3991
SNVS296J – DECEMBER 2006 – REVISED JUNE 2016
www.ti.com
11 Device and Documentation Support
11.1 Documentation Support
11.1.1 Related Documentation
For additional information, see the following:
• AN-1112 DSBGA Wafer Level Chip Scale Package (SNVA009)
• Semiconductor and IC Package Thermal Metrics (SPRA953)
• Using New Thermal Metrics (SBVA025)
• Thermal Characteristics of Linear and Logic Packages Using JEDEC PCB Designs (SZZA017)
11.2 Receiving Notification of Documentation Updates
To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper
right corner, click on Alert me to register and receive a weekly digest of any product information that has
changed. For change details, review the revision history included in any revised document.
11.3 Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.
11.4 Trademarks
E2E is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
11.5 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
11.6 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
12 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
18
Submit Documentation Feedback
Copyright © 2006–2016, Texas Instruments Incorporated
Product Folder Links: LP3991
PACKAGE OPTION ADDENDUM
www.ti.com
14-Jun-2016
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
(4/5)
LP3991TL-1.2/NOPB
ACTIVE
DSBGA
YZR
4
250
Green (RoHS
& no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
-40 to 125
LP3991TL-1.3/NOPB
ACTIVE
DSBGA
YZR
4
250
Green (RoHS
& no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
-40 to 125
LP3991TL-1.5/NOPB
ACTIVE
DSBGA
YZR
4
250
Green (RoHS
& no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
-40 to 125
LP3991TL-1.55/NOPB
ACTIVE
DSBGA
YZR
4
250
Green (RoHS
& no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
LP3991TL-1.7/NOPB
ACTIVE
DSBGA
YZR
4
250
Green (RoHS
& no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
LP3991TL-1.8/NOPB
ACTIVE
DSBGA
YZR
4
250
Green (RoHS
& no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
LP3991TL-2.0/NOPB
ACTIVE
DSBGA
YZR
4
250
Green (RoHS
& no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
LP3991TL-2.5/NOPB
ACTIVE
DSBGA
YZR
4
250
Green (RoHS
& no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
LP3991TL-2.8/NOPB
ACTIVE
DSBGA
YZR
4
250
Green (RoHS
& no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
LP3991TL-3.0/NOPB
ACTIVE
DSBGA
YZR
4
250
Green (RoHS
& no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
LP3991TLX-0.8/NOPB
ACTIVE
DSBGA
YZR
4
3000
Green (RoHS
& no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
LP3991TLX-1.2/NOPB
ACTIVE
DSBGA
YZR
4
3000
Green (RoHS
& no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
-40 to 125
LP3991TLX-1.3/NOPB
ACTIVE
DSBGA
YZR
4
3000
Green (RoHS
& no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
-40 to 125
LP3991TLX-1.5/NOPB
ACTIVE
DSBGA
YZR
4
3000
Green (RoHS
& no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
-40 to 125
LP3991TLX-1.55/NOPB
ACTIVE
DSBGA
YZR
4
3000
Green (RoHS
& no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
LP3991TLX-1.7/NOPB
ACTIVE
DSBGA
YZR
4
3000
Green (RoHS
& no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
LP3991TLX-1.8/NOPB
ACTIVE
DSBGA
YZR
4
3000
Green (RoHS
& no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
Addendum-Page 1
Device Marking
-40 to 125
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
Orderable Device
14-Jun-2016
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
LP3991TLX-2.0/NOPB
ACTIVE
DSBGA
YZR
4
3000
Green (RoHS
& no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
LP3991TLX-2.5/NOPB
ACTIVE
DSBGA
YZR
4
3000
Green (RoHS
& no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
LP3991TLX-2.8/NOPB
ACTIVE
DSBGA
YZR
4
3000
Green (RoHS
& no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
LP3991TLX-3.0/NOPB
ACTIVE
DSBGA
YZR
4
3000
Green (RoHS
& no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
Op Temp (°C)
Device Marking
(4/5)
-40 to 125
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
Addendum-Page 2
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
14-Jun-2016
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 3
PACKAGE MATERIALS INFORMATION
www.ti.com
14-Jun-2016
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
LP3991TL-1.2/NOPB
DSBGA
YZR
4
250
178.0
8.4
LP3991TL-1.3/NOPB
DSBGA
YZR
4
250
178.0
LP3991TL-1.5/NOPB
DSBGA
YZR
4
250
178.0
LP3991TL-1.55/NOPB
DSBGA
YZR
4
250
LP3991TL-1.7/NOPB
DSBGA
YZR
4
LP3991TL-1.8/NOPB
DSBGA
YZR
LP3991TL-2.0/NOPB
DSBGA
YZR
LP3991TL-2.5/NOPB
DSBGA
LP3991TL-2.8/NOPB
LP3991TL-3.0/NOPB
1.04
1.55
0.76
4.0
8.0
Q1
8.4
1.04
1.55
0.76
4.0
8.0
Q1
8.4
1.04
1.55
0.76
4.0
8.0
Q1
178.0
8.4
1.04
1.55
0.76
4.0
8.0
Q1
250
178.0
8.4
1.04
1.55
0.76
4.0
8.0
Q1
4
250
178.0
8.4
1.04
1.55
0.76
4.0
8.0
Q1
4
250
178.0
8.4
1.04
1.55
0.76
4.0
8.0
Q1
YZR
4
250
178.0
8.4
1.04
1.55
0.76
4.0
8.0
Q1
DSBGA
YZR
4
250
178.0
8.4
1.04
1.55
0.76
4.0
8.0
Q1
DSBGA
YZR
4
250
178.0
8.4
1.04
1.55
0.76
4.0
8.0
Q1
LP3991TLX-0.8/NOPB
DSBGA
YZR
4
3000
178.0
8.4
1.04
1.55
0.76
4.0
8.0
Q1
LP3991TLX-1.2/NOPB
DSBGA
YZR
4
3000
178.0
8.4
1.04
1.55
0.76
4.0
8.0
Q1
LP3991TLX-1.3/NOPB
DSBGA
YZR
4
3000
178.0
8.4
1.04
1.55
0.76
4.0
8.0
Q1
LP3991TLX-1.5/NOPB
DSBGA
YZR
4
3000
178.0
8.4
1.04
1.55
0.76
4.0
8.0
Q1
LP3991TLX-1.55/NOPB
DSBGA
YZR
4
3000
178.0
8.4
1.04
1.55
0.76
4.0
8.0
Q1
LP3991TLX-1.7/NOPB
DSBGA
YZR
4
3000
178.0
8.4
1.04
1.55
0.76
4.0
8.0
Q1
LP3991TLX-1.8/NOPB
DSBGA
YZR
4
3000
178.0
8.4
1.04
1.55
0.76
4.0
8.0
Q1
LP3991TLX-2.0/NOPB
DSBGA
YZR
4
3000
178.0
8.4
1.04
1.55
0.76
4.0
8.0
Q1
Pack Materials-Page 1
W
Pin1
(mm) Quadrant
PACKAGE MATERIALS INFORMATION
www.ti.com
14-Jun-2016
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
LP3991TLX-2.5/NOPB
DSBGA
YZR
4
3000
178.0
8.4
LP3991TLX-2.8/NOPB
DSBGA
YZR
4
3000
178.0
8.4
LP3991TLX-3.0/NOPB
DSBGA
YZR
4
3000
178.0
8.4
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
1.04
1.55
0.76
4.0
8.0
Q1
1.04
1.55
0.76
4.0
8.0
Q1
1.04
1.55
0.76
4.0
8.0
Q1
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
LP3991TL-1.2/NOPB
DSBGA
YZR
4
250
210.0
185.0
35.0
LP3991TL-1.3/NOPB
DSBGA
YZR
4
250
210.0
185.0
35.0
LP3991TL-1.5/NOPB
DSBGA
YZR
4
250
210.0
185.0
35.0
LP3991TL-1.55/NOPB
DSBGA
YZR
4
250
210.0
185.0
35.0
LP3991TL-1.7/NOPB
DSBGA
YZR
4
250
210.0
185.0
35.0
LP3991TL-1.8/NOPB
DSBGA
YZR
4
250
210.0
185.0
35.0
LP3991TL-2.0/NOPB
DSBGA
YZR
4
250
210.0
185.0
35.0
LP3991TL-2.5/NOPB
DSBGA
YZR
4
250
210.0
185.0
35.0
LP3991TL-2.8/NOPB
DSBGA
YZR
4
250
210.0
185.0
35.0
LP3991TL-3.0/NOPB
DSBGA
YZR
4
250
210.0
185.0
35.0
LP3991TLX-0.8/NOPB
DSBGA
YZR
4
3000
210.0
185.0
35.0
LP3991TLX-1.2/NOPB
DSBGA
YZR
4
3000
210.0
185.0
35.0
LP3991TLX-1.3/NOPB
DSBGA
YZR
4
3000
210.0
185.0
35.0
LP3991TLX-1.5/NOPB
DSBGA
YZR
4
3000
210.0
185.0
35.0
Pack Materials-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
14-Jun-2016
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
LP3991TLX-1.55/NOPB
DSBGA
YZR
4
3000
210.0
185.0
35.0
LP3991TLX-1.7/NOPB
DSBGA
YZR
4
3000
210.0
185.0
35.0
LP3991TLX-1.8/NOPB
DSBGA
YZR
4
3000
210.0
185.0
35.0
LP3991TLX-2.0/NOPB
DSBGA
YZR
4
3000
210.0
185.0
35.0
LP3991TLX-2.5/NOPB
DSBGA
YZR
4
3000
210.0
185.0
35.0
LP3991TLX-2.8/NOPB
DSBGA
YZR
4
3000
210.0
185.0
35.0
LP3991TLX-3.0/NOPB
DSBGA
YZR
4
3000
210.0
185.0
35.0
Pack Materials-Page 3
MECHANICAL DATA
YZR0004xxx
D
0.600±0.075
E
TLA04XXX (Rev D)
D: Max = 1.46 mm, Min = 1.4 mm
E: Max = 0.99 mm, Min = 0.93 mm
4215042/A
NOTES:
A. All linear dimensions are in millimeters. Dimensioning and tolerancing per ASME Y14.5M-1994.
B. This drawing is subject to change without notice.
www.ti.com
12/12
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of
non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.
Products
Applications
Audio
www.ti.com/audio
Automotive and Transportation
www.ti.com/automotive
Amplifiers
amplifier.ti.com
Communications and Telecom
www.ti.com/communications
Data Converters
dataconverter.ti.com
Computers and Peripherals
www.ti.com/computers
DLP® Products
www.dlp.com
Consumer Electronics
www.ti.com/consumer-apps
DSP
dsp.ti.com
Energy and Lighting
www.ti.com/energy
Clocks and Timers
www.ti.com/clocks
Industrial
www.ti.com/industrial
Interface
interface.ti.com
Medical
www.ti.com/medical
Logic
logic.ti.com
Security
www.ti.com/security
Power Mgmt
power.ti.com
Space, Avionics and Defense
www.ti.com/space-avionics-defense
Microcontrollers
microcontroller.ti.com
Video and Imaging
www.ti.com/video
RFID
www.ti-rfid.com
OMAP Applications Processors
www.ti.com/omap
TI E2E Community
e2e.ti.com
Wireless Connectivity
www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2016, Texas Instruments Incorporated
Similar pages