ILSI I416-91A2F-10.000 Leaded oscillator, ocxo metal package, 25.7 mm x 25.7 mm Datasheet

Leaded Oscillator, OCXO
Metal Package, 25.7 mm X 25.7 mm
I416 Series
Product Features:
Applications:
Low Phase Noise
Low Power Consumption
Voltage Control
High Stability
Telecommunications
Data Communications
Instrumentation
Test and Measurement
Frequency
10.000 MHz- 30.000 MHz
Output Level
Sine
+7dBm Min., 9dBm Max.
Output Load
50 ohms
Harmonics
-50 dBc
Spurious
-80 dBC
Frequency Stability
See Frequency Stability Table
Supply Voltage
See Voltage Table (±5%)
Current (Warm Up)
Current @ 25  C (Steady State)
125 mA Max.
50 mA
Voltage Control
Voltage Range
Pullability
Deviation Slope (Positive)
Hysteresis (retrace after 30min.)
0.0 VDC Min., 10.0 VDC Max. *
±3.0PPM*
10%
± 20.0 ppb
Allan Variance (1s)
2.00E-11
Phase Noise
- 90 dBc/Hz @ 1Hz
-120 dBc/Hz @ 10Hz
-145 dBc/Hz @ 100Hz
-155 dBc/Hz @ 1kHz
-165 dBc/Hz @ 10kHz
-165 dBc/Hz @ 100kHz
Operating
See Operating Temperature Table in Part
Number Guide
Storage
-40 C to +85 C
Part Number Guide
Package
I416 -
Sample Part Number:
I416-5AA3V-10.000 MHz
Input
Voltage
Operating
Temperature
Output
Frequency
Stability
(in ppm)
Voltage
Control
5 = 5.0V
7 = 0 C to +50 C
A = Sine
Y = 0.5
V = Controled
9 = 12.0V
1 = 0 C to +70 C
1 = 0.25
F = Fixed
6 = -10 C to +75 C
2 = 0.1
3 = -20 C to +70 C
3 = 0.05
Frequency
-10.000 MHz
A= -30 C to +70 C
*Input voltage dependant.
ILSI America Phone: 775-851-8880 • Fax: 775-851-8882• e-mail: [email protected] • www.ilsiamerica.com
5/11
Specifications subject to change without notice
Page 1
Leaded Oscillator, OCXO
Metal Package, 25.7 mm X 25.7 mm
I416 Series
Pb Free Solder Reflow Profile:
Typical Application:
*Units are backward compatible with 240C reflow processes
Package Information:
MSL = N.A. (package does not contain plastic, storage life is
unlimited under normal room conditions).
Termination = e1 (Sn / Cu / Ag over Ni over Kovar base metal).
Environmental Specifications
Thermal Shock
Moisture Resistance
Mechanical Shock
Mechanical Vibration
Resistance to Soldering Heat
Hazardous Substance
Solderability
Terminal Strength
Gross Leak
Fine Leak
Solvent Resistance
MIL-STD-883, Method 1011, Condition A
MIL-STD-883, Method 1004
MIL-STD-883, Method 2002, Condition B
MIL-STD-883, Method 2007, Condition A
J-STD-020C, Table 5-2 Pb-free devices (except 2 cycles max)
Pb-Free / RoHS / Green Compliant
JESD22-B102-D Method 2 (Preconditioning E)
MIL-STD-883, Method 2004, Test Condition D
MIL-STD-883, Method 1014, Condition C
MIL-STD-883, Method 1014, Condition A2, R1=2x10-8 atm cc/s
MIL-STD-202, Method 215
Marking
Line 1: ILSI and Date Code
Line 2: XXXXXX (Part Number detail = I416-XXXXXX-Freq.)
Line 2: Frequency
ILSI America Phone: 775-851-8880 • Fax: 775-851-8882• e-mail: [email protected] • www.ilsiamerica.com
5/11
Specifications subject to change without notice
Page 2
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